dallas semiconductor DS9006 service manual

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FEATURES
Plated through-hole pattern for wire wrap or solder
mount development
Allowance for up to 12 Stik connectors
Hole layout for RJ45, D-SUB, and Eurocard DIN con-
nectors
DS9006
PRELIMINAR
DS9006
SIP Stik Motherboard
Full length buses for distributing power and ground
1700 hole array for 0.1” center ICs and Stiks
DESCRIPTION
The DS9006 SIP Stik Motherboard is a developmental printed circuit board for prototyping circuit designs which utilize Stik prefabs and/or RJ11/45 connector schemes. Many SIP Stiks mate with connectors that have staggered rows of pins. This makes it difficult to prototype these modules since most off-the-shelf wire wrap boards have a grid of 0.1” center holes. The DS9006 contains several rows of holes that are offset to accommodate both SIP Stiks and standard 300 mil and 600 mil DIPs.
Hole patterns for three RJ11/45, one 9-pin D-SUB, and 64/96-pin Eurocard connectors are located on the ends of the PCB in a right angle fashion to enable the finished circuit board assembly to mount in the DS9005 enclo­sure. This allows the designer to have a ”complete” looking unit for presentation while still in the prototyping stage of design.
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