Dallas Semiconductor DS3800 Datasheet

www.dalsemi.com

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DS3800

Advanced NV SRAM Battery Cap

FEATURES

PIN ASSIGNMENT

 Houses 400 mAh primary lithium battery
 Snaps directly onto a surface–mounted 40mm

ball–grid array (BGA) Nonvolatile SRAM
module

 Attaches after host BGA module has been

surface–mounted to protect lithium battery
from the high temperatures of reflow
soldering

 Maintains mechanical and electrical

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connection with BGA module even during
severe shock and vibration stresses

 Four attachment flanges latch onto host BGA

module to provide strong, semi–permanent
attachment. Flanges can be broken off for cap
removal

 Industrial temperature range of –40°C to

ABSOLUTE MAXIMUM RATINGS

Operating Temperature
Non-Operating Temperature

-40°C to 85°C

-40°C to 85°C

+85°C

attery Cap

BATTERY CHARACTERISTICS

Nominal Voltage 3 volts
Nominal Capacity 400 mAh
Chemistry Li(CF)x
Data Retention Life

8 Years (25°C)

DESCRIPTION

The DS3800 Battery Cap is a snap–on lithium power source for Dallas Semiconductors 40mm ball–grid
array (BGA) Nonvolatile SRAM modules. After a host BGA module has been soldered in place and
cleaned, the DS3800 Battery Cap is snapped onto the module to serve as the secondary power suppl y.
The Battery Cap is keyed to prevent incorrect attachment and is designed to maintain mechanical and
electrical contact with its host module even during severe shock and vibration. Electrically, the DS3800
battery is connected to the host BGA module with gold–plated round pins in the Battery Cap inserted into
gold–plated receptacles on the BGA. Mechanically, four flanges on the DS3800 tightly grip the BGA
module board to prevent Cap removal, while corner features in the Cap prevent lateral movement of the
Cap while it is attached to its host BGA module.

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DS3800 PACKAGE DIMENSIONS

DS3800

PKG
DIM MIN MAX

A IN. - 1.670
MM - 42.42
B IN. - 1.705
MM - 42.42
C IN. - 0.505
MM - 12.76

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