DALLAS SEMICONDUCTOR DS21FF44/DS21FT44
101899 5/119
TABLE OF CONTENTS
1. MULTI-CHIP MODULE (MCM) DESCRIPTION.................................... 1
2. MCM LEAD DESCRIPTION................................ ................................ . 7
3. DS21FF44 (FOUR X FOUR) PCB LAND PATTERNS .............................12
4. DS21FT44 (FOUR X THREE) PCB LAND PATTERN ............................ 13
5. DS21Q42 DIE DESCRIPTION ................................ .............................. 14
6. DS21Q44 INTRODUCTION ................................ .................................15
7. DS21Q44 PIN FUNCTION DESCRIPTION ...........................................19
8. DS21Q44 REGISTER MAP.................................................................. 28
9. PARALLEL PORT ................................ ................................ ..............33
10. CONTROL, ID AND TEST REGISTERS ...........................................33
11. STATUS AND INFORMATION REGISTERS .....................................43
12. ERROR COUNT REGISTERS ................................ ........................... 50
13. DS0 MONITORING FUNCTION........................................................ 53
14. SIGNALING OPERATION................................................................56
14.1 PROCESSOR BASED SIGNALING..............................................................................................56
14.2 HARDWARE BASED SIGNALING.............................................................................................59
15. PER–CHANNEL CODE GENERATION AND LOOPBACK ................62
15.1 TRANSMIT SIDE CODE GENERATION....................................................................................62
15.1.1 Simple Idle Code Insertion and Per–Channel Loopback .......................................................62
15.1.2 Per–Channel Code Insertion ...................................................................................................63
15.2 RECEIVE SIDE CODE GENERATION .......................................................................................64
16. CLOCK BLOCKING REGISTERS ................................ .................... 66
17. ELASTIC STORES OPERATION .....................................................68
17.1 RECEIVE SIDE...............................................................................................................................68
17.2 TRANSMIT SIDE...........................................................................................................................69
18. ADDITIONAL (SA) AND INTERNATIONAL (SI) BIT OPERATION ...70
18.1 HARDWARE SCHEME .................................................................................................................70
18.2 INTERNAL REGISTER SCHEME BASED ON DOUBLE–FRAME ..........................................70