DALLAS SEMICONDUCTOR DS21FF42/DS21FT42
101899 /1235
17.1 RECEIVE SIDE ...............................................................................72
17.2 TRANSMIT SIDE................................ ................................ ............73
17.3 MINIMUM DELAY SYNCHRONOUS RSYSCLK/TSYSCLK MODE .....73
18. HDLC CONTROLLER......................................................................74
18.1 HDLC FOR DS0S................................ ................................ ...............74
19. FDL/FS EXTRACTION AND INSERTION .........................................75
19.1 HDLC AND BOC CONTROLLER FOR THE FDL...............................75
19.1.1 General Overview ........................................................................75
19.1.2 Status Register for the HDLC ......................................................76
19.1.3 HDLC/BOC Register Description ................................ ..................79
19.2 LEGACY FDL SUPPORT................................ ................................ .86
19.2.1 Overview ....................................................................................86
19.2.2 Receive Section................................................................ ........... 86
19.2.3 Transmit Section................................................................ ........ 87
19.3 D4/SLC–96 OPERATION .................................................................88
20. PROGRAMMABLE IN–BAND CODE GENERATION AND DETECTION
89
21. TRANSMIT TRANSPARENCY ................................ .......................... 93
22. INTERLEAVED PCM BUS OPERATION ..........................................94
23. JTAG-BOUNDARY SCAN ARCHITECTURE AND TEST ACCESS PORT
97
23.1 DESCRIPTION................................ ................................ ....................97
23.2 TAP CONTROLLER STATE MACHINE ................................ .................... 98
23.3 INSTRUCTION REGISTER AND INSTRUCTIONS.........................................101
23.4 TEST REGISTERS .............................................................................104
24. TIMING DIAGRAMS ......................................................................109
25. OPERATING PARAMETERS................................ .......................... 124
26. MCM PACKAGE DIMENSIONS................................ ...................... 144
DOCUMENT REVISION HISTORY
Revision Notes