Dallas Semiconductor DS18S20Z, DS18S20 Datasheet

1-Wire
r
2
3
4
7
PRELIMINARY
DS18S20
High Precision
®
Digital Thermomete
FEATURES
Unique 1–Wire interface requires only one
port pin for communication
Multidrop capability simplifies distributed
temperature sensing applications
Requires no external componentsCan be powered from data line. Power supply
Zero standby power requiredMeasures temperatures from –55°C to
+125°C. Fahrenheit equivalent is –67°F to +257°F
±0.5°C accuracy from –10°C to +85°CTemperature is read as a 9–bit digital valueConverts temperature to digital word in
750 ms (max.)
User–definable, nonvolatile temperature
alarm settings
Alarm search command identifies and
addresses devices whose temperature is outside of programmed limits (temperature alarm condition)
Functionally compatible with DS1820 1-Wire
digital thermometer
Applications include thermostatic controls,
industrial systems, consumer products, thermometers, or any thermally sensitive system
PIN ASSIGNMENT
DALLAS
DS18S20
1 2 3
NC NC
V
DD
DQ
VDD
GND
DQ
8-Pin SOIC (150 mil)
PIN DESCRIPTION
GND - Ground DQ - Data In/Out V NC - No Connect
- Power Supply Voltage
DD
BOTTOM VIEW
1 2 3
DS18S20 To-92
Package
1
8
6 5
DS18S20Z
NC NC NC GND
DESCRIPTION
The DS18S20 Digital Thermometer provides 9–bit temperature readings which indicate the temperature of the device.
Information is sent to/from the DS18S20 over a 1–Wire interface, so that only one wire (and ground) needs to be connected from a central microprocessor to a DS18S20. Power for reading, writing, and performing temperature conversions can be derived from the data line itself with no need for an ex ternal power source.
Because each DS18S20 contains a unique silicon serial number, multiple DS18S20s can exist on the same 1–Wire bus. This allows for placing temperature sensors in many different places. Applications where this feature is useful include HVAC environmental controls, sensing temperatur es inside buildings, equipment or machinery, and process monitoring and control.
1 of 27 050400
DS18S20
DETAILED PIN DESCRIPTION
PIN
8-PIN SOIC
5 1 GND Ground. 42DQData Input/Output pin. For 1-Wire operation: Open drain.
33VDDOptional VDD pin. See “Parasite Power” section for details of
DS18S20Z (8-pin SOIC): All pins not specified in this table are not to be connected.
PIN
TO92 SYMBOL DESCRIPTION
(See “Parasite Power” section.)
connection. VDD must be grounded for operation in parasite power mode.
OVERVIEW
The block diagram of Figure 1 shows the major components of the DS18S20. The DS18S20 has three main data components: 1) 64–bit lasered ROM, 2) temperature sensor, 3) nonvolatile temperature alarm triggers TH and TL. The device derives its power from the 1–Wire communication line by storing energy on an internal capacitor during periods of time when the signal line is high and continues to operate off this power source during the low times of the 1–Wire line until it returns high to replenish the parasite (capacitor) supply. As an alternative, the DS18S20 may also be powered from an external 3 volt – 5 volt supply.
Communication to the DS18S20 is via a 1–Wire port. With the 1–Wire port, the memory and control functions will not be available before the ROM function protocol has been established. The master must first provide one of five ROM function commands: 1) Read ROM, 2) Match ROM, 3) Search ROM, 4) Skip ROM, or 5) Alarm Search. These commands operate on the 64–bit lasered ROM portion of each device and can single out a specific de vice if many are present on th e 1–Wire line as well as indi cate to the bus master how many and what types of devices are present. After a ROM functi on sequence has been successfully executed, the memory and control functions are accessible and the master may then provide any one of the six memory and control function commands.
One control function command instructs the DS 18S20 t o perform a temperature measurement. The result of this measurement will be placed in the DS18S20’s scratch-pad memory, and may be read by issuing a memory function command which reads the contents of the scratchpad memory. The temperature alarm triggers TH and TL consist of 1-byte EEPROM each. If the alarm search command is not applied to the DS18S20, these registers may be used as general purpose user memory. Writing TH and TL is done using a memory function command. Read access to these registers is through the scratchpad. All data is read and written least significant bit first.
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DS18S20 BLOCK DIAGRAM Figure 1
DQ
DS18S20
MEMORY AND
CONTROL LOGIC
INTERNAL V
POWER
V
DD
SUPPLY
SENSE
64-BIT ROM
AND
1-WIRE PORT
SCRATCHPAD
8-BIT CRC
GENERATOR
TEMPERATURE
SENSOR
HIGH TEMPERATURE
TRIGGER, TH
LOW TEMPER ATUR E
TRIGGER, TH
PARASITE POWER
The block diagram (Figure 1) shows the parasite-powered circuitry. This circuitry “steals” power whenever the DQ or V and voltage requirements are met (see the section titled “1–Wire Bus System”). The advantages of parasite power are twofold: 1) by parasiting off this pin, no local power source is needed for remote sensing of temperature, and 2) the ROM may be read in absence of normal power.
In order for the DS18S20 to be able to perform accurate temperature conv ersions, sufficient power must be provided over the DQ line when a temperature conversion is taking place. Since the operating current of the DS18S20 is up to 1.5 mA, the DQ line will not have sufficient drive due to the 5k pullup resistor. This problem is particularly acute if several DS18S20s are on the same DQ and attempting to convert simultaneously.
pins are high. DQ will provide sufficient power as long as the specified timing
DD
There are two ways to assure that the DS18S20 has sufficient supply current during its active conversion cycle. The first is to provide a strong pullup on the DQ line whenever temperature conversions or copies to the E
2
memory are taking place. This may be accomplished by using a MOSFET to pull the DQ line
directly to the power supply as shown in Figure 2. The DQ line must be switched over to the strong
2
pull-up within 10 µs maximum after issuing any protocol that involves copying to the E
memory or initiates temperature conversions. When using the parasite power mode, the VDD pin must be tied to ground.
Another method of supplying current to the DS18S20 is through the use of an external power suppl y tied to the V
pin, as shown in Figure 3. The advantage to this is that the strong pullup is not required on the
DD
DQ line, and the bus master need not be tied up holding that line high during temperature conversions. This allows other data traffic on the 1–Wire bus during the conversion time. In addition, any number of DS18S20s may be placed on the 1–Wire bus, and if they all use external power, they may all simultaneously perform temperature conversions by issuing the Skip ROM command and then issuing the Convert T command. Note that as long as the external power supply is active, the GND pin may not be floating.
The use of parasite power is not recommended above 100°C, since it may not be able to sustain communications given the higher leakage currents the DS18S20 exhibits at these temperatures. For applications in which such temperatures are likely, it is strongly recommended that V
be applied to the
DD
DS18S20.
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DS18S20
µµµµ
µµµµ
For situations where the bus master does not know whether the DS18S20s on the bus are parasite powered or supplied with external VDD, a provision is made in the DS18S20 to signal the power supply scheme used. The bus master can determine if any DS18S20s are on the bus which require th e strong pullup by sending a Skip ROM protocol, then issuing the read power supply command. After this command is issued, the master then issues read time slots. The DS18S20 will send back “0” on the 1-Wire bus if it is parasite powered; it will send back a “1” if it is powered from the V
pin. If the
DD
master receives a “0,” it knows that it must supply the strong pullup on the DQ line du ring temperature conversions. See “Memory Command Functions” section for more detail on this command protocol.
STRONG PULL-UP FOR SUPPLYING DS18S20 DURING TEMPERATURE CONVERSION Figure 2
+3V - +5V
DS18S20
+3V - +5V
USING V
P
P
TO SUPPLY TEMPERATURE CONVERSION CURRENT Figure 3
DD
+3V - +5V
4.7k
4.7k
DS18S20
GND V
I/O
GND V
I/O
TO OTHER 1-WIRE DEVICES
DD
EXTERNAL +3V - +5V SUPPLY
DD
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DS18S20
OPERATION – MEASURING TEMPERATURE
The core functionality of the DS18S20 is its direct-to-digital temperature sensor. The direct readout of temperature data is 9 bits wide, equating to a resolution of 0.5°C; if higher resolution is desired, an algorithm is described later in this section to achieve that need. Following the issuance of the Convert T [44h] command, a temperature conversion is performed and the thermal data is stored in the scratchpad memory in a 16-bit, sign-extended two’s complement format. The temperature information can be retrieved over the 1-Wire interface b y issuing a Read Scratchpad [BEh] command once the conversion has been performed. The data is transferred over the 1 -W ire bus, LSB first. The MS B of the temp eratur e register contains the “sign” (S) bit, denoting whether the temperature is positive or negative.
Table 2 describes the exact relationship of output data to measured. For Fahrenh eit usage, a lookup table or conversion routine must be used.
Temperature/Data Relationships Table 2
262524232221202-1LSB
MSb
SSSSSSSSMSB
TEMPERATURE DIGITAL OUTPUT
+85°C 0000 0101 0101 0000 0550h*
+125°C 0000 0000 1111 1010 00FAh
+25.0°C 0000 0000 0011 0010 0032h
+0.5°C 0000 0000 0000 0001 0001h
0°C 0000 0000 0000 0000 0000h
-0.5°C 1111 1111 1111 1111 FFFFh
-25.0°C 1111 1111 1100 1110 FFCEh
-55°C 1111 1111 1001 0010 FF92h *The power on reset register value is +85°C
Higher resolutions may be obtained by the following procedure. First, read the temperature, COUNT_REMAIN, and COUNT_PER_C registers from the scratchpad. Truncate the 0.5°C bit (the LSB) from the temperature value. This value is TEMP_READ. The actual temperature may then be calculated by using the following:
(unit = °C)
(Binary)
LSb
DIGITAL
OUTPUT
(Hex)
REMAINCOUNTCPERCOUNT
READTEMPETEMPERATUR
25.0_
+=
___
CPERCOUNT
__
OPERAT ION – AL ARM SIGNALING
After the DS18S20 has performed a temperature conversion, the temperature value is compared to the trigger values stored in TH and TL. Since these registers are 8–bit only, the 0.5°C bit is ignored for comparison. The most significant bit of TH or TL directly corresponds to the sign bit of the 16–bit temperature register. If the result of a temperature measur ement is higher than TH or lower th an TL, an alarm flag inside the device is set. This flag is updated with every temperature measurement. As long as
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DS18S20
the alarm flag is set, the DS18S20 will respond to the alarm search command. This allows many DS18S20s to be connected in parallel doing simultaneous temperature measurements. If somewhere the temperature exceeds the limits, the alarming device(s) can be identified and read immediately without having to read non–alarming devices.
64-BIT LASERED ROM
Each DS18S20 contains a unique ROM code that is 64–bits long. The first 8 bits are a 1–Wire famil y code (DS18S20 code is 10h). The next 48 bits are a unique serial number. The last 8 bits are a CRC of the first 56 bits. (See Figure 4.) The 64–bit ROM and ROM Function Control section allow the DS18S20 to operate as a 1–Wire device and follow the 1–Wire protocol detailed in the section “1–Wire Bus System.” The functions required to control sections of the DS18S20 are not accessible until the ROM function protocol has been satisfied. This protocol is described in the ROM function protocol flowchart (Figure 5). The 1–Wire bus master must first provide one of five ROM function commands: 1) Read ROM, 2) Match ROM, 3) Search ROM, 4) Skip ROM, or 5) Alarm Search. After a ROM functions sequence has been successfully executed, the fun ctions specific to the DS18S20 are accessible and the bus master may then provide one of the six memory and control function commands.
CRC GENERATION
The DS18S20 has an 8–bit CRC stored in the most significant byte of the 64–bit ROM. The bus master can compute a CRC value from the first 56–bits of the 64–bit ROM and compare it to the value stored within the DS18S20 to determine if the ROM data has been received error–free by the bus master. The equivalent polynomial function of this CRC is:
CRC = X8 + X5 + X4 + 1
The DS18S20 also generates an 8–bit CRC value using the same polynomial function shown above and provides this value to the bus master to validate the transfer of data bytes. In each case where a CRC is used for data transfer validation, the bus master must calculate a CRC value using the polynomial function given above and compare the calculated value to either the 8–bit CRC value stored in the 64–bit ROM portion of the DS18S20 (for ROM reads) or the 8–bit CRC value computed within the DS18S20 (which is read as a ninth byte when the scratchpad is read). The comparison of CRC values and decision to continue with an operation are determined entirely by the bus master. There is no circuitry inside the DS18S20 that prevents a command sequence from proceeding if the CRC stored in or calculated by the DS18S20 does not match the value generated by the bus master.
The 1–Wire CRC can be generated using a polynomial generator consisting of a shift register and XOR gates as shown in Figure 6. Additional information about the Dallas 1–Wire Cyclic Redundancy Check is available in Application Note 27 entitled “Understanding and Using Cyclic Redundancy Checks with Dallas Semiconductor Touch Memory Products.”
The shift register bits are initialized to “0”. Then starting with the least significant bit of the family code, one bit at a time is shifted in. After the eighth bit of the family code has been entered, then the serial number is entered. After the 48th bit of the serial number has been entered, the shift register contains the CRC value. Shifting in the 8 bits of CRC should return the shift register to all “0s”.
64-BIT LASERED ROM Figure 4
8-BIT CRC CODE 48-BIT SERIAL NUMBER 8-BIT FAMILY CODE (10h)
MSB MSBLSB LSB LSBMSB
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ROM FUNCTIONS FLOW CHART Figure 5
C
C
DS18S20
33h READ ROM COMMAND
Y
DS18S20 T
FAMILY CODE
1 BYTE
MASTER T
RESET PULSE
DS18S20 T PRESENCE
MASTER TX ROM
FUNCTION COMMAND
NNN
X
55h
MATCH ROM
COMMAND
MASTER T
BIT 0
X
X
PULSE
N
F0h
SEARCH ROM
COMMAND
ECh
ALARM
SEARCH
COMMAND
SKIP ROM
COMMAND
YYY
X
ALARM
CONDITION ?
N
CCh
N
Y
Y
DS18S20 TX BIT 0
DS18S20 TX BIT 0
MASTER TX BIT 0
DS18S20 T
SERIAL NUMBER
6 BYTES
DS18S20 T
CRC BYTE
X
X
BIT 0
MATCH?
Y
MASTER T
BIT 1
BIT 1
MATCH?
Y
MASTER T
BIT 63
BIT 63
H?
MAT
Y
NN
X
NN
DS18S20 TX BIT 63
X
DS18S20 TX BIT 63 MASTER TX BIT 63
NN
BIT 0
MATCH?
Y
DS18S20 TX BIT 1 DS18S20 TX BIT 1
MASTER TX BIT 1
BIT 1
MAT
H?
Y
BIT 63
MATCH?
Y
MASTER TX MEMORY OR CONTROL
FUNCTION COMMAND
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1-WIRE CRC CODE Figure 6
DS18S20
INPUT
XOR XOR
(MSB) (LSB)
XOR
MEMORY
The DS18S20’s memory is organized as shown in Figure 7. The memory consists of a scratchpad RAM and a nonvolatile, electrically erasable (E2) RAM, which stores the high and low temperature triggers, TH and TL. The scratchpad helps insure data integrity when communicating over the 1–Wire bus. Data is first written to the scratchpad where it can be read back. After the data has been verified, a copy scratchpad command will transfer the data to the nonvolatile (E2) RAM. This process insures data integrity when modifying the memory. The DS18S20 EEPROM is rated for a minimum of 50,000 writes and 10 years data retention at T = +55°C.
The scratchpad is organized as 8 bytes of memory. The first 2-bytes contain the measured temperature information. The third and fourth bytes are volatile copies of TH and TL and are refreshed with every power–on reset. The next 2 bytes are not used; upon reading back, however, they will appear as all logic “1s”. The seventh and eighth bytes are count registers, which may be used in obtaining higher temperature resolution (see “Operation–measuring Temperature” section). There is a ninth byte which may be read with a Read Scratchpad command. This byte contains a cyclic redundancy check (CRC) byte which is the CRC over all of the 8 previous bytes. This CRC is implemented in the fashion described in the section titled “CRC Generation."
DS18S20 MEMORY MAP Figure 7
SCRATCHPAD
BYTE
TEMPERATURE LSB
TEMPERATURE MSB
TH/USER BYTE 1
TL/USER BYTE 2
RESERVED
RESERVED
COUNT REMAIN
COUNT PER °C
0
1
2
3
4
5
6
7
2
E
RAM
TH/USER BYTE 1
TL/USER BYTE 2
CRC
8
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DS18S20
OS
1-WIRE BUS SYSTEM
The 1–Wire bus is a system which has a single bus master and one or more slaves. The DS18S20 behaves as a slave. The discussion of this bus system is broken down into three topics: hardware configuration, transaction sequence, and 1–Wire signaling (signal types and timing).
HARDWARE CONFIGURATION
The 1–Wire bus has only a single line by definition; it is important that each devi ce on the bus be able to drive it at the appropriate time. To facilitate this, each device attached to the 1–Wire bus must have open drain or 3–state outputs. The 1–Wire port of the DS18S20 (DQ pin) is open drain with an internal circuit equivalent to that shown in Figure 8. A multidrop bus consists of a 1–Wire bus with multiple slaves attached. The 1–Wire bus requires a pullup resistor of approximately 5 kΩ.
HARDWARE CONFIGURATION Figure 8
+3V - +5V
BUS MASTER
R
X
4.7k
DS18S20 1-WIRE PORT
R
X
5 µA
M
100ΩΩΩ
FET
T
X
Typ.
T
X
RX = RECEIVE T
= TRANSMIT
X
The idle state for the 1–Wire bus is high. If for any reason a transaction needs to be suspended, the bus MUST be left in the idle state if the transaction is to resume. Infinite recovery time can occur between bits so long as the 1–Wire bus is in the inactive (high) state during the recovery period. If this does not occur and the bus is left low for more than 480 µs, all components on the bus will be reset.
TRANSACTION SEQUENCE
The protocol for accessing the DS18S20 via the 1–Wire port is as follows:
Initialization
ROM Function Command
Memory Function Command
Transaction/Data
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