Dallas Semiconductor DS1230WP-150, DS1230WP-100, DS1230W-150, DS1230W-100 Datasheet

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FEATURES
10 years minimum data retention in the
absence of external power
Data is automatically protected during power
loss
Replaces 32k x 8 volatile static RAM,
EEPROM or Flash memory
disconnected to retain freshness until power is applied for the first time
Optional industrial temperature range of
-40°C to +85°C, designated IND
JEDEC standard 28-pin DIP packageNew PowerCap Module (PCM) package
- Directly surface-mountable module
- Replaceable snap-on PowerCap provides
lithium backup battery
- Standardized pinout for all nonvolatile
SRAM products
- Detachment feature on PowerCap allows
easy removal using a regular screwdriver
PIN ASSIGNMENT
PIN DESCRIPTION
A0 - A14 - Address Inputs DQ0 - DQ7 - Data In/Data Out
CE - Chip Enable WE - Write Enable OE - Output Enable
V
CC
- Power (+3.3V) GND - Ground NC - No Connect
DS1230W
3.3V 256k Nonvolatile SRAM
www.dalsemi.com
13
1 2
3 4
5 6
7 8
9 10
11 12
14
27
28-Pin ENCAPSULATED PACKAGE
740-mil EXTENDED
A7
A5
A3 A2 A1 A0
DQ0 DQ1
GND
DQ2
V
CC
WE
A13A
8
A
9
A
11
OE
A
10 CE DQ7 DQ6
DQ5
DQ3
DQ4
28
26 25
24 23
22 21
20 19
18 17
15
16
A12
A6
A4
A14
1
NC
2 3
NC NC NC
V
CC
WE
OE CE
DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0
GND
4 5 6 7 8 9 10 11 12 13 14 15 16 17
NC
A
14
33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18
A13A
12
A11A
10
A9A
8
A7A6A
5
A
4
A
3
A2A
1
A
0
34
NC
GND
V
BAT
34-Pin POWERCAP MODULE (PCM)
(USES DS9034PC POWERCAP)
DS1230W
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DESCRIPTION
The DS1230W 3.3V 256k Nonvolatile SRAM is a 262,144-bit, fully static, nonvolatile SRAM organized as 32,768 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and control circuitry which constantly monitors VCC for an out-of-tolerance condition. When such a condition occurs, the lithium energy source is automatically switched on and write protection is unconditionally enabled to prevent data corruption. DIP-package DS1230W devices can be us ed in place of existing 32k x 8 static RAMs directly conforming to the popular bytewide 28-pin DIP standard. The DIP devices also match the pinout of 28256 EEPROMs, allowing direct substitution while enhancing performance. DS1230W devices in the PowerCap Module package are directly surface mountable and are normally paired with a DS9034PC PowerCap to form a complete Nonvolatile SRAM Module. There is no limit on the number of write cycles that can be executed and no additional support circuitry is required for microprocessor interfacing.
READ MODE
The DS1230W executes a read cycle whenever WE (Write Enable) is inactive (high) and CE (Chip Enable) and OE (Output Enable) are active (low). The unique address specified by the 15 address inputs
(A0 – A14) defines which of the 32,768 bytes of data is to be accessed. Valid data will be available to the eight data output drivers within t
ACC
(Access Time) after the last address input signal is stable, providing that CE and OE (Output Enable) access times are also satisfied. If OE and CE access times are not satisfied, then data access must be measured from the later-occurring signal (CE or OE ) and the limiting parameter is either tCO for CE or tOE for OE rather than address access.
WRITE MODE
The DS1230W executes a write cycle whenever the WE and CE signals are active (low) after addr ess inputs are stable. The later-occurring falling edge of CE or WE will determine the start of the write cycle. The write cycle is terminated by the earlier rising edge of CE or WE . All address inputs must be kept valid throughout the write cycle. WE must return to the high state for a minimum recovery time (tWR) before another cycle can be initiated. The OE control signal should be kept inactive (high) during write cycles to avoid bus contention. However, if the output drivers are enabled ( CE and OE active) then WE
will disable the outputs in t
ODW
from its falling edge.
DATA RETENTION MODE
The DS1230W provides full functional capability for VCC greater than 3.0 volts and write protects by 2.8 volts. Data is maintained in the absence of V
CC
without any additional support circuitry. The nonvolatile static RAMs constantly monitor VCC. Should the supply voltage decay, the NV SRAMs automatically write protect themselves, all inputs become “don’t care,” and all outputs become high-impedance. As V
CC
falls below approximately 2.5 volts, a power switching circuit connects the lithium energy source to RAM to retain data. During power-up, when VCC rises above approximately 2.5 volts, the power switching circuit connects external V
CC
to RAM and disconnects the lithium energy source. Normal
RAM operation can resume after VCC exceeds 3.0 volts.
FRESHNESS SEAL
Each DS1230W device is shipped from Dallas Semiconductor with its lithium energy source disconnected, guaranteeing full energy capacity. When V
CC
is first applied at a level greater than 3.0
volts, the lithium energy source is enabled for battery back-up operation.
DS1230W
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PACKAGES
The DS1230W is available in two packages: 28-pin DIP and 34-pin PowerCap Module (PCM). The 28­pin DIP integrates a lithium battery, an SRAM memory and a nonvolatile control function into a single package with a JEDEC-standard, 600-mil DIP pinout. The 34-pin PowerCap Module integrates SRAM memory and nonvolatile control into a module base along with contacts for connection to the lithium battery in the DS9034PC PowerCap. The PowerCap Module package design allows a DS1230W to be surface mounted without subjecting its lithium backup battery to destructive high-temperature reflow soldering. After a DS1230W module base is reflow soldered, a DS9034PC PowerCap is snapped on top of the base to form a complete Nonvolatile SRAM module. The DS9034PC is keyed to prevent improper attachment. DS1230W module bases and DS9034PC PowerCaps are ordered separately and shipped in separate containers. See the DS9034PC data sheet for further information.
ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Pin Relative to Ground -0.3V to +4.6V Operating Temperature 0°C to 70°C, -40°C to +85°C for IND parts Storage Temperature -40°C to +70°C, -40°C to +85°C for IND parts Soldering Temperature 260°C for 10 seconds
* This is a stress rating only and functional operation of the device at these or any other conditions
above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS (tA: See Note 10)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Power Supply Voltage V
CC
3.0 3.3 3.6 V
Logic 1 V
IH
2.2 V
CC
V
Logic 0 V
IL
0.0 0.4 V
DC ELECTRICAL CHARACTERISTICS (tA: See Note 10) (VCC=3.3V ±=3.0V)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Input Leakage Current I
IL
-1.0 +1.0 V
I/O Leakage Current CE VIH V
CC
I
IO
-1.0 +1.0
µA
Output Current @ 2.2V I
OH
-1.0 mA
Output Current @ 0.4V I
OL
2.0 mA
Standby Current CE =2.2V
I
CCS1
50 250
µA
Standby Current CE =VCC-0.2V
I
CCS2
30 150
µA
Operating Current I
CCO1
50 mA
Write Protection Voltage V
TP
2.8 2.9 3.0 V
DS1230W
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CAPACITANCE (tA=25°C)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Input Capacitance C
IN
510pF
Input/Output Capacitance C
I/O
510pF
AC ELECTRICAL CHARACTERISTICS (tA: See Note 10) (VCC=3.3V ±=3.0V)
DS1230W-150
PARAMETER SYMBOL MIN MAX TYPE UNITS NOTES
Read Cycle Time t
RC
150 ns
Access Time t
ACC
150 ns
OE to Output Valid t
OE
70 ns
CE to Output Valid t
CO
150 ns
OE or CE to Output Active t
COE
5ns5
Output High Z from Deselection t
OD
35 ns 5
Output Hold from Address Change t
OH
5ns
Write Cycle Time t
WC
150 ns
Write Pulse Width t
WP
100 ns 3
Address Setup Time t
AW
0ns
Write Recovery Time
t
WR1
t
WR2
5
20
ns ns
12 13
Output High Z from WE
t
ODW
35 ns 5
Output Active from WE
t
OEW
5ns5
Data Setup Time t
DS
60 ns 4
Data Hold Time t
DH1
t
DH2
0
20
ns ns
12 13
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