Daewoo DVD-T6300N Service Manual

Component Descriptions

DVD PLAYER

1. Precautions

2. Reference Information

3. Product Specification

4. Operating Instructions

5. Disassembly and Reassembly

6. Troubleshooting

7. Electrical Part List

8. Block Diagram

9. PCB Diagrams

11. Schematic Diagrams

12. Oscillograms

CONTENTS

MANUAL

SERVICE

DVD PLAYER

DVD-T6300N

2

1) Before returning an instrument to the customer,
always make a safety check of the entire
instrument, including, but not limited to, the
following items:

(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(1) Protective shields are provided to protect
both the technician and the customer. Correctly
replace all missing protective shields, including
any remove for servicing convenience.
(2) When reinstalling the chassis and/or other
assembly in the cabinet, be sure to put back in
place all protective devices, including, but not
limited to, nonmetallic control knobs, insulating
fish papers, adjustment and compartment
covers/shields, and isolation resistor/capacitor
networks. Do not operate this instrument or
permit it to be operated without all protective
devices correctly installed and functioning.

(2) Be sure that there are no cabinet openings

through which adults or a hazardous voltage.
Such openings inclu children might be able to
insert their fingers and contact de, but are not
limited to, excessively wide cabinet ventilation
slots, and an improperly fitted and/or inc orrectly
secured cabinet back cover.

(3) Leakage Current Hot Check-With the

instrument completely reassembled, plug the
AC line cord directly into a 120V AC outlet. (Do
not use a isolation transformer during this test.)
Use a leakage current tester or a metering
system that complies with American National
Standards institute (ANSI) C101.1 Leakage

Current for Appliances and Underwriters
Laboratories (UL) 1270 (40.7). With the
instrument’s AC switch first in the ON position

and then in the OFF position, measure from a
known earth ground (metal water pipe, conduit,
etc.) to all exposed metal parts of the
instrument (antennas, handle brackets, metal
cabinets, screwheads, metallic overlays,
control shafts, etc.), especially and exposed
metal parts that offer an electrical return path

to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the
outlet and repeat the test. See Fig. 1-1.
Any measurements not within the limits
specified herein indicate a potential shock
hazard that must be eliminated before returning
the instrument to the customer.

Fig. 1-1 AC Leakage Test

(4) Insulation Resistance Test Cold Check-(1)

Unplug the power supply cord and connect a
jumper wire between the two pr ongs of the plug.
(2) Turn on the power switch of the instrument.
(3) Measure the resistance with an ohmmeter
between the jumpered AC plug and all exposed
metallic cabinet parts on the instrument, such
as screwheads, antenna, control shafts, handle
brackets, etc. When an exposed metallic part
has a return path to the chassis, the reading
should be between 1 and 5.2 megohm. When
there is no return path to the chassis, the
reading must be infinite. If the reading is not

Device

Under

Test

Also test with Plug

reserved (Using AC

adapter Plug as

2-Wire Cord

(Reading

should not

be above

0.5mA)

Test all

exposed Meter

Sufaces

Earth Ground

1. Precautions

1-1 Safety Precautions

3

(5) within the limits specified, there is the possibility

of a shock hazard, and the instrument must be
re-pared and rechecked before it is returned to
the customer. See Fig. 1-2.

Fig. 1-2 Insulation Resistance Test

2) Read and comply with all caution and safety
related notes non or inside the cabinet, or on the
chassis.

3) Design Alteration Warning -Do not alter of add to
the mechanical or electrical design of this
instrument. Design alterations and additions,
including but not limited to, circuit modifications
and the addition of items such as auxiliary audio
output connections, might alter the safety
characteristics of this instrument and create a
hazard to the user. Any design alterations or
additions will make you, the service, responsible
for personal injury or property damage resulting
there from.

4) Observe original lead dress. Take extra care to
assure correct lead dress in the following areas:
(1) near sharp edges, (2) near thermally hot
parts (be sure that leads and components do not
touch thermally hot parts), (3) the AC supply, (4)
high voltage, and (5) antenna wiring. Always
inspect in all areas for pinched, out -of-place, or
frayed wiring, Do not change spacing between a
component and the printed-circuit board. Check

the AC power cord for damage.

5) Components, parts, and/or wiring that appe ar to
have overheated or that are otherwise damaged
should be replaced with components, parts
and/or wiring that meet original specifications.
Additionally determine the cause of overheating
and/or damage and, if necessary, take corrective
action to remove and potential safety hazard.

6) Product Safety Notice-Some electrical and
mechanical parts have special safety-related
characteristics which are often not evident from
evisual inspection, nor can the protection they
give necessarily be obtained by replacing them
with components rated for higher voltage,
wattage, etc. Parts that have special safety
characteristics are identified by shading, an ( )
or a ( ) on schematics and parts lists. Use of a
substitute replacement that does not have the
same saf ety characteristics as the recommended
replacement part might created shock, fire
and/or other hazards. Product safety is under
review continuously and new instructions are
issued whenever appropriate.

Antenna

Terminal

Exposed

Metal Part

ohm

ohmmeter

Safety Precautions

4

CAUTION : Before servicing Instruments covered
by this service manual and its supplements, read
and follow the Safety Precautions section of this
manual.

Note : If unforeseen circument create conflict
between the following servicing precautions and
any of the safety precautions, always follow the
safety precautions. Remember: Safety First.

1-2-1 General Servicing Precautions

(1) a. Always unplug the instrument ’s AC power
cord from the AC power source before (1) re­ moving or reinstalling any component, circuit
board, module or any other instrument
assembly, (2) disconnecting any instrument
electrical plug or other electrical connection,
(3) connecting a test substitute in parallel with
an electrolytic capacitor in the instrument.

b. Do not defeat any plug/socket B+ voltage
interlocks with which instruments covered by
this service manual might be equipped.
c. Do not apply AC power to this instrument
and/or any of its electrical assemblies unless
all solid-state device heat sinks are correctly
installed.
d. Always connect a test instrument ’s ground
lead to the instrument chassis ground before
connecting the test instrument positive lead.
Always remove the test instrument ground lead
last.

Note : Refer to the Safety Precautions section
ground lead last.

(2) The service precautions are indicated or printed
on the cabinet, chassis or components. When
servicing, follow the printed or indicated service
precautions and service materials.

(3) The components used in the unit have a
specified flame resistance and dielectric
strength.
When replacing components, use components
which have the same ratings. Components I­ enti-fied by shading, by ( ) or by ( ) in the
circuit diagram are important for safety or for the
characteristics of the unit. Always replace them
with the exact replacement components.

(4) An insulation tube or tape is sometimes used

and some components are raised above the
printed wiring board for safety. The internal
wiring is sometimes clamped to prevent contact
with heating components. Install such elements
as they were.

(5) After servicing, always check that the removed

screws, components, and wiring have been
installed correctly and that the portion around
the serviced part has not been damaged and so
on. Further, check the insulation between the
blades of the attachment plug and accessible
conductive parts.

1-2-2 Insulation Checking Procedure

Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation
resistance meter (500V) to the blades of the
attachment plug. The insulation resistance between
each blade of the attachment plug and accessible
conductive parts(see note) should be more than 1
Megohm.

Note : Accessible conductive parts include metal
panels, input terminals, earphone jacks, etc.

1-2 Servicing Precautions

5

Electrostatically Sensitive Devices (ESD)

Some semiconductor (solid state) devices can be
damaged easily by static electricity.
Such components commonly are called
Electrostatically Sensitive Devices(ESD). Examples
of typical ESD devices are integrated circuits and
some field-effect transistors and semiconductor
chip components. The following techniques should
be used to help reduce the incidence of component
damage caused by static electricity.

(1) Immediately before handling any semiconductor

components or semiconductor-equipped
assembly, drain off any electrostatic charge on
your body by touching a known earth ground.
Alternatively, obtain and wear a commercially
available discharging wrist strap device, which
should be removed for potential shock reasons
prior to applying power to the unit under test.

(2) After removing an electrical assembly equipped

with ESD devices, place the assembly on a
conductive surface such as aluminum foil, to
prevent electrostatic charge buildup or exposure
of the assembly.

(3) Use only a grounded-tip soldering iron to solder

or unsolder ESD device.

(4) Use only an anti-static solder removal devices.

Some solder removal devices not classified as
“anti-static” can generate electrical charges
sufficient to damage ESD devices.

(5) Do not use freon-propelled chemicals. These

can generate electrical charges sufficient to
damage ESD devices.

(6) Do not remove a replacement ESD device from

its protective package unt il immediately before you

are ready to install it. (Most replacement ESD
devices are packaged with leads electrically
shorted together by conductive foam, aluminum
foil or comparable conductive materials).

(7) Immediately before removing the protective

materials from the leads of a replacement ESD
device touch the protective material to the
chassis or circuit assembly into which the
device will be installed.

CAUTION : Be sure no power is applied to the
chassis or circuit, and observe all other safety
precautions.

(8) Minimize bodily motions when handling

unpackaged replacement ESD devices.
(Otherwise harmless motion such as the
brushing together of your clothes fabric or the
lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage
an ESD device).

1-3 ESD Precautions

6

Recommended Operating Conditions

Item Symbol Min. Typ. Max. Unit
Supply Voltage Vcc 4.75 5.0 5.25 V
High Level Input Voltage VIH 2.0 - Vcc V
Low Level Input Voltage VIL 0 - 0.8 V

*This is an optional output.

2-1-1 Fiber Optic Transmitting Module for Digital Audio Equipments (TOTX178)

2. Reference Information

2-1 Component Descriptions

7

Component Descriptions

2-1-2 NTSC/PAL Digital Video Encoder (ADV7170)

8

Component Descriptions

9

Component Descriptions

10

Features

l Single-chip DVD video decoder in a 208-pin PQFP package
l Supports MPEG-1 system and MPEG-2 program streams
l Programmable multimedia processor architecture
l Compatible with Audio CD, Video CD, VCD 3.0, and Super Video CD(SVCD)
l DVD Navigation 1
l Built-in Content Scrambling System(CSS)

- Audio

l Built-in Karaoke key -shift function
l DolbyTM Digital 2-channel downmix audio output for DolbyTM
l Dolby Pro Logic
l Linear PCM streams for 24 bit / 96KHz
l Concurrent S/PDIF out and 2-channel audio output
l Sensaura Dolby Digital Virtual Surround
l DTS Digital Surround 2-channel downmix stereo output
l S/PDIF output for encoded AC-3, DTS Digital output or Linear PCM

- Peripheral

l Glueless unterface to DVD loaders (ATAPI or A/V bus I/F)
l Bidirectional I2C audio interface
l Direct servo / loader interface
l 8 general-purpose auxiliary ports
l Single 27MHz clock input

- Smart Technology

l SmartZoom

TM

for motion zoom & pan

l SmartScale

TM

for NTSC to PAL conversion and vice versa

l SmartStream

TM

for video error concealment

2-1-3 DVD Processor Chip (Swan-2TM ES4318)

Component Descriptions

11

Functional Description

Component Descriptions

12

Component Descriptions

Pinout Diagram

13

Pin Descriptions

Name Number I/O Definition

VCC

1, 9, 18, 27, 35, 44, 51, 59, 68, 75, 83,

92, 99, 104, 111,

121, 130, 139, 148, 157, 164, 172, 183,

193, 201

I 3.65 V ± 150 mv.

LA[21:0] 23:19,16:10,7:2,207:204 O Device address output.

VSS

8,17,26,34,43,52,60,67,76,84,91,98,103,

112,120,129,1

38,147,156,163,171,177,184,192,200,20

8

I Ground.

RESET# 24 I Reset input, active low.

TDMDX O TDM transmit data

RSEL 25 I

ROM Select

RSEL Selection

0 16-bit ROM

1 8-bit ROM

TDMDR 28 I TDM receive data.

TDMCLK 29 I TDM clock input.

TDMFS 30 I TDM frame synch.

TDMTSC# 31 O TDM output enable, active low.

TWS

SEL_PLL1

32

O

I

Audio transmit frame sync.

Select PLL1.

TSD

SEL_PLL0

33

O

I

Audio transmit serial data port.

Select PLL0.

SEL_PLL2 SEL_PLL0 Clock

Output
0 0 2.5 x DCLK
0 1 3 x DCLK
1 0 3.5 x DCLK
1 1 4 x DCLK

SEL_PLL2 36

Select PLL2. See the table for pin number

33.

MCLK 39 I/O Audio master clock for audio DAC.

TBCK 40 I/O Audio transmit bit clock.

SDIF_DOBM 41 O S/PDIF (IEC958)Format Output.

RSD 45 I Audio receive serial data.

RWS 46 I Audio receive frame synch.

RBCK 47 I Audio receive bit clock.

APLLCAP 48 I Analog PLL Capacitor.

XIN 49 I Crystal input.

XOUT 50 O Crystal output.

DMA[11:0] 66:61, 58:53 O DRAM address bus.

DCAS# 69 O Column address strobe, active low.

DOE#

DSCK_EN

70

O

I

Output enable, active low.

Clock enable, active low.

DWE# 71 O DRAM write enable, active low.

DRAS[2:0]# 74:72 O Row address strobe, active low.

DB[15:0] 96:93, 90:85, 82:77 I/O DRAM data bus.

DCS[1:0]# 97, 100 O SDRAM chip select [1:0], active low.

DQM 101 O Data input / output mask.

DSCK 102 O Clock to SDRAM.

DCLK 105 I Clock Input(27MHz).

YUV[7:0] 115:113, 110:106 O 8-bit YUV output.

PCLK2XSCN 116 I/O 2X pixel clock.

PCLKQSCN 117 I/O Pixel clock.

1. VSY
NC
H#

118 I/O

Vertical synch for screen video interface,
programmable for rising or falling edge,
active low.

Component Descriptions

14

Component Descriptions

Name Number I/O Definition
HSYNCH# 119 I/O

Horizontal synch for screen video
interface, programmable for rising or falling

edge, active low.
HD[15:0] 141:140, 137:131, 128:122 O Host data bus
HCS1FX# 152 O Host select 1.
HCS3FX# 153 O Host select 3.
HIOCS16# 151 I Device 16-bit data transfer.
HA[2:0] 158, 155:154 I/O Host address bus.
VPP 159 I Peripheral protection voltage.
HWR#/DCI_
ACK#

149 I,I

Host write/DCI Interface Acknowledge

Signal, active low.
HRD#DCI_C
LK

150 I,I Host read/DCI Interface Clock.

HD[15:0] 141:140, 137:131, 128:122 I/O Host data bus.
HWRQ# 142 O Host write request.
HRDQ# 143 O Host read request.
HIRQ 144 I/O Host interrupt.
HRST# 145 O Host reset.
HIORDY 146 I Host I/O ready
HWR# 149 O Host write request.
AUX[7:0] 169:165, 162:160 I/O Auxiliary ports.
LOE# 170 O Device output enable, active low.
LCS[3:0]# 176:173 O Chip select[3:0], active low.
LD[15:0] 197:194, 191:185, 182:178 I/O Device data bus.
LWRLL# 198 O Device write enable, active low.
LWRHL# 199 O Device write enable, active low.
NC 37, 38, 42, 203:202 No Connect pins. Leave open

15

Component Descriptions

2-1-4 DIGITAL-TO-ANALOG STEREO AUDIO CONVERTER (CS4391)

16

Component Descriptions

17

Component Descriptions

18

Component Descriptions

19

Features

Fully static design 8-bit CMOS microcontroller
256 bytes of on-chip scratchpad RAM
8 KB electrically erasable/programmable MTP -ROM
64 KB program memory address space
64 KB data memory address space
Four 8-bit bi-directional ports
Three 16-bit timer/counters
One full duplex serial port(UART)
Watchdog Timer
Eight sources, two-level interrupt capability
EMI reduction mode
Built-in power management
Code protection mechanism
Code protection mechanism

Pin Configurations

2-1-5 8-BIT MTP MICROCONTROLLER (W78LE52)

Component Descriptions

20

Component Descriptions

Block Diagram

Absolute Maximum Ratings

PARAMETER SYMBOL MIN. MAX. UNIT
DC Power Supply VDD-VSS -0.3 +7.0 V
Input Voltage VIN VSS -0.3 VDD +0.3 V
Operating
Temperature

TA 0 70 °C

Storage Temperature TST -55 +150 °C

21

Pin Descriptions

SYMBOL DESCRIPTIONS

EA#

EXTERNAL ACCESS ENABLE: This pin forces the processor to execute out of

external ROM. It should be kept high to access internal ROM. The ROM address and

data will not be presented on the bus if EA pin is high and the program counter is

within on-chip ROM area.

PSEN#

PROGRAM STORE ENABLE: PSEN enables the external ROM data onto the Port 0
address/ data bus during fetch and MOVC operations. When internal ROM access is

performed, no PSEN strobe signal outputs from this pin.

ALE

ADDRESS LATCH ENABLE: ALE is used to enable the address latch that separates

the address from the data on Port 0.

RST

RESET: A high on this pin for two machine cycles while the oscillator is running

resets

the device.

XTAL1

CRYSTAL1: This is the crystal oscillator input. This pin may be driven by an external

clock.

XTAL2 CRYSTAL2: This is the crystal oscillator output. It is the inversion of XTAL1.

VSS GROUND: Ground potential
VDD POWER SUPPLY: Supply voltage for operation.

P0.0 - P0.7

PORT 0: Port 0 is a bi-directional I/O port which also provides a multiplexed low

order

address/data bus during accesses to external memory. The pins of Port 0 can be

individually configured to open-drain or standard port with internal pull-ups.

P1.0 - P1.7

PORT 1: Port 1 is a bi-directional I/O port with internal pull-ups. The bits have

alternate

functions which are described below:

T2(P1.0): Timer/Counter 2 external count input

T2EX(P1.1): Timer/Counter 2 Reload/Capture control

P2.0 - P2.7

PORT 2: Port 2 is a bi-directional I/O port with int ernal pull-ups. This port also

provides the upper address bits for accesses to external memory.

P3.0 - P3.7

PORT 3: Port 3 is a bi-directional I/O port with internal pull-ups. All bits have alternate

functions, which are described below:

RXD(P3.0) : Serial Port receiver input

TXD(P3.1) : Serial Port transmitter output

INT0 (P3.2) : External Interrupt 0

INT1(P3.3) : External Interrupt 1
T0(P3.4) : Timer 0 External Input
T1(P3.5) : Timer 1 External Input

WR(P3.6) :External Data Memory Write Strobe

RD(P3.7) : External Data Memory Read Strobe

P4.0 - P4.3

PORT 4: Another bit-addressable bidirectional I/O port P4. P4.3 and P4.2 are

alternative function pins. It can be used as general I/O port or external interrupt input

sources (INT2 / INT3 ).

Component Descriptions

22

Features

• Low-Voltage and Standard-Voltage Operation
– 5.0 (V CC = 4.5V to 5.5V)
– 2.7 (V CC = 2.7V to 5.5V)
– 2.5 (V CC = 2.5V to 5.5V)
– 1.8 (V CC = 1.8V to 5.5V)

• Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),1024 x 8 (8K) or 2048 x 8 (16K)

• 2-Wire Serial Interface

• Schmitt Trigger, Filtered Inputs for Noise Suppression

• Bidirectional Data Transfer Protocol

• 100 kHz (1.8V, 2.5V, 2.7V) and 400 kHz (5V) Compatibility

• Write Protect Pin for Hardware Data Protection

• 8-Byte Page (1K, 2K), 16-Byte Page (4K, 8K, 16K) Write Modes

• Partial Page Writes Are Allowed

• Self-Timed Write Cycle (10 ms max)

• High Reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
– ESD Protection: >3000V

• Automotive Grade and Extended Temperature Devices Available

• 8-Pin and 14-Pin JEDEC SOIC, 8-Pin PDIP, 8-Pin MSOP, and 8-Pin TSSOP Packages

Pin Configurations

Pin Descriptions

Pin Name Function
A0 - A2 Address Inputs
SDA Serial Data
SCL Serial Clock Input
WP Write Protect

NC No Connect

2-1-6 Serial EEPROM, 2K (256 x 8) (AT24C02)

Component Descriptions

23

Component Descriptions

Features

• 5.0V±40% for read and write operations

• Access time –70max

• Current
–20 mA typical active read current
–30 mA typical program/erase current
–1µA typical CMOS Standby

• Flexible sector architecture
– 8 uniform sectors of 64 Kbyte each
– Any combination of sectors can be erased
– Supports full chip erase
– Sector protection

• Embedded Erase Algorithms

• Typical 100,000 program/erase cycles per sector

• Compatible with FEDEC-standards

Pin Configura tions

2-1-7 4-Megabit (512K x 8) FLASH (A29040)

24

Block Diagram

Pin Descriptions

Absolute Maximum Ratings

Ambient Operating Temperature ...................... -55°C to +125°C

Storage Temperature ...................................…. -65°C to +150°C

VOC Ground .……………………………………..-2.0V to +7.0V
Output Voltage…………………………………… -2.0V to +7.0V

Component Descriptions

25

Component Descriptions

2-1-8 256K X 16DYNAMIC RAM(T224162B)

Features

n Industry-standard x 16 pinouts and timing functions.
n Single 5V power supply.
n All device pins are TTL -compatible.
n 512-cycle refresh in 8ms
n Refresh modes: /RAS only, /CAS BEFORE /RAS (CBR) and HIDDEN.
n Extended data-out (EDO) PAGE MODE access cycle.
n BYTE WRITE and BYTE READ access cycles.

Pin Descriptions

PIN NO SYM. TYPE DESCRIPTION

16~19,

22~26

A0-A8 Input Address Input
14 /RAS Input Row Address Strobe
28 /CASH Input Column Address Strobe/Upper Byte Control
29 /CASL Input Column Address Strobe/Lower Byte Control
13 /WE Input Write Enable
27 /OE Input Output Enable

2~5,

6~10,

31~43,

36~39

I/O1 –

I/O6

Input/Output Data Input/ Output

1,6,20 Vcc Supply Power, 5V

21,35,40 Vss Ground Ground

11,12,15,3

0

NC - No Connect

26

Block Diagram

Pin Configurations

Component Descriptions

27

2-1-9 1Mbit(x8) Multi-Purpose Flsh (SST39SF010A)

Features

Pin Configurations

Component Descriptions