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Thank you for purchasing the MCU board for the F2MC*-8FX family MB95FV100D-102 (model number: MB2146-302A).
The MB2146-302A is a development support tool for developing and evaluating applied products
based on the F
This manual is intended for engineers who use the MB2146-302A (referred to below as the MCU
board) to develop applied products based on Cypress F
ual describes how to handle the MCU board and its functions as well as the setting procedures.
Be sure to read this manual before using the MCU board.
Be sure to read this manual before using the MCU board.
■ Using the product safely
This manual contains important information required for using the MB2146-302A safely. Be sure to
read through the manual before using the product and follow the instructions contained therein to
use it correctly.
In particular, carefully read the “Caution of the products described in this document” at the beginning
of this manual to understand the requirements for safe use of the product before using it.
After reading the manual, keep it handy for future reference.
■ Warranty and liability disclaimers
The specifications of the product are subject to change without notice.
In no event shall Cypress be liable for any loss or damages whatsoever directly or indirectly arising
out of the use of the product.
■ Product operating environment
2
MC-8FX family of microcontrollers manufactured by Cypress.
2
MC-8FX family microcontrollers. The man-
The operating temperature for the product ranges from 5 C to 35 C and the operating relative
humidity from 20% to 80%. Avoid using the product in hot or humid environment and prevent con
densation.
The product is a printed circuit board unit without a chassis such that all of the electronic components are exposed. Therefore, neither put anything on the product nor touch or let an electrically
charged material contact a metal part of it. Once the product has been powered, try to keep those
objects away from it which can short-circuit it or easily catch fire and burn. Use the product as hori
zontal as possible and avoid operating it at a place exposed to strong vibration, dust, or explosive
gas.
Note that using the product not in the above operating environment may unexpectedly cause personal injury to the user (or another person if present near the product) or physical damage to properties around the product.
You should also keep the packaging materials used for shipping the product. They work well as they
are when you transport the product again, for example, if it becomes out of order and needs to be
repaired.
■ Related manuals
Refer to the following manuals for additional information:
■ Caution of the products described in this document
The following precautions apply to the product described in this manual.
CAUTION
Cuts, Damage
Cuts
Damage
Preface
Indicates a potentially hazardous situation which, if not avoided appropriately, may
result in minor or moderate injury and/or damage to the product or the equipment
to which the product is connected, to software resources such as data, or to other
properties.
Before moving the product, be sure to turn off all the power supplies and unplug the
les. Watch your steps when carrying the product. Do not use the product in an
cab
unstable location such as a place exposed to strong vibration or a sloping surface.
Doing so may let the product fall, resulting in an injury or fault.
The product has some sharp-pointed or edged parts inevitably exposed, such as
jumper plugs. Use meticulous care in handling the product not to get injured with
such pointed parts.
Neither put anything on or apply shock to the product. Once the product has been
po
wered, do not carry it.
Doing either may cause a fault due to overloading or shock.
Damage
Damage
Damage
Damage
Damage
Damage
Since the product contains many electronic components, keep it away from direct
sun
light, high temperature, and high humidity to prevent condensation. Do not use
or store the product where it is exposed to much dust or a strong magnetic or electric field for an extended period of time.
An adverse operating or storage environment can cause a fault.
Use the product within the ranges of
its general specifications.
Operating it outside the range of any general specification may cause a fault.
To prevent electrostatic breakdown, do not let your finger or an object touch any
metal part of the connector. Before handling the product, touch a metal object (such
as a door knob) to discharge static electricity from your body.
Before turning the power on, in particular, be sure to finish making all the required
nections. To set up and use the product, follow the instructions given in this doc-
con
ument.
Using the product incorrectly or inappropriately may cause a fault.
Before plugging or unplugging any cable for this product, be sure to turn the power
ply off. When unplugging a cable, remove it while holding the connector without
sup
pulling the cable itself. Pulling the cable itself or bending it may expose or disconnect the cable core, resulting in a fault.
Because the product has no casing, it is recommended that it be stored in the original packaging. Re-transporting the product m
ay damage it to cause a fault. Keep
the packaging materials used for shipment of the product and use them when retransporting it.
The MB2146-302A is the MCU board (model number: MB2146-302A) mounting an evaluation MCU
for the F
consists of a combination of three products: the header board, MCU board, and BGM adapter
(model number: MB2146-09) as shown in Figure 1-1.
Figure 1-1. System configuration
2
MC-8FX Family of Cypress 8-bit microcontrollers. The F2MC-8FX evaluation environment,
*: Be sure to connect the BGM adapter correctly to the BGM adapter connector (CN3) on the MCU board. I
can damage the MCU board if it is accidentally connected to the LVD2 detection voltage selector jumper
plug (S2).
3.1Connecting the MCU board to the header board
Align the MCU board the header board facing each other, then plug their mating connectors
together. Those connectors are provided with incorrect insertion prevention guards located diagonally. Position the two boards so that the incorrect in
each other and plug the connectors together completely (see “Figure 3-1”).
Figure 3-1.
Connection of MCU board and header board
sertion prevention guards do not interfere with
■ Connecting the MCU board to the BGM adapter
Connect the BGM adapter to the MCU board. Plu
pletely into the BGM adapter conn
ector on the MCU board such that the index marks (▼) aligned
1. Be sure to connect the BGM adapter connector (CN3). The BGM adapter connector and the
LVD2 detection voltage selector jumper plug have the same shape (see “Figure 3-3”). The MCU
board may break if the BGM adapter co
voltage selector jumper plug (S2) on the other side of the board.
Connections
nnector is accidentally plugged into the LVD2 detection
Figure 3-3.
Connection direction of BGM adapter
2. To supply a main clock signal and sub clock signa
circuit on the user system so that it supplies the clock signal to the MCU board via a buffer
circuit.
3.3Disconnection
MB2146-09
MB2146-09
PRODUCT SELECT
4
5
3
6
7
2
LVD4
1
8
0
9
LVD3
F
GNDVCC
A
B
E
LVD2
D
OK
NG
ADAPTER
BGM
GNDVCC
SUB CLOCK
C B A
2
MAIN CLOCK
LVD2OFFLVD1
3V5V
LVD0
LVD1
LVD2
LVD3
LVD4
C
LVD1
LVD0
5V
ON ON
1 2 3 4 1 2 3 4
CLK
CLK S.V.
APB8
C
X0
X1
1
X0A
X1A
3V
LVD2OFFLVD1
1 2 3 4 1 2 3 4
ON ON
PRODUCT SELECT
MAIN CLOCK
1
2
C B A
SUB CLOCK
BGM
ADAPTER
X1A
X0A
X1
X0
C
APB8
CLK S.V.
CLK
C
D
B
E
A
F
9
0
8
1
7
2
6
3
5
4
l from the user system, provide an oscillation
a. Remove the BGM adapter from the MCU board. Holding the MCU board firmly, pull the BGM
adapter vertically from the BGM adapter connector on the MCU board.
b. Remove the header board from the MCU board. Remove it with uniform force without applying
■ For information on the crystal oscillator such as its frequency, refer to the data-
sheet for the evaluation MCU.
■ For the capacitance of the capacitor, refer to the datasheet for the crystal oscilla-
tor, etc.
■ Neither the crystal oscillator nor the capacitor is bundled with this product.
Mount a crystal or ceramic oscillator in the crystal oscillator mounting sockets (for the main clock and
sub clock) on the MCU board.
How to Setup
The MCU board has one crystal oscillator mounting socket
for the main clock and the other for the
sub clock. To distinguish them from each other, the board has the “MAIN CLOCK” and “SUB
CLOCK” labels are printed on the board near the main clock socket and sub clock socket. Mount the
crystal or ceramic oscillator along with the capacitors on the MCU board (see “Figure 4-2”).
Figure 4-2.
The example of mount of crystal or ceramic oscillator
4.3Handling notes
1. Data can not be written/erased to lower banks (1000H to 3FFFH) in the software development
Ta bl e 4-4 lists the setting of product selector switch and product type.
Table 4-4. Setting of the product selector switch
Switch settingProduct type
0100-pin package type
180-pin package type
264-pin package type
348-pin, 52-pin package type
432-pin package type
528-pin package type
620-pin package type
7Setting Prohibited
8100-pin package, LCD function integrated type
980-pin package, LCD function integrated type
A64-pin package, LCD function integrated type
B48-pin, 52-pin package, LCD function integrated type
The specifications of a connector and a socket is shown in Tab le 5-4
Table 5-4. Connector and socket specifications
ItemDescription
Header board interface connector Connects the MCU board to the header board.
BGM adapter connectorConnects the MCU board to the BGM adapter.
Main clock mounting socketMounts the main clock crystal oscillator.
Sub clock mounting socketMounts the sub clock crystal oscillator.