Cypress Semiconductor CY7C167A-45PC, CY7C167A-35VCT, CY7C167A-35VC, CY7C167A-35PC, CY7C167A-20VCT Datasheet

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16K x 1 Static RAM
7C167A: 12/89 Revisio n: Febr ua ry 3, 2000
CY7C167A
Cypress Semiconductor Corporation
3901 North First Street San Jose CA 95134 408-943-2600 February 3, 2000
• Automat ic power-down when deselected
• CMOS for optimum speed/power
• High speed —15 ns
• Low active power —495 mW
• Low standb y p ow er —220 mW
• TTL-compatibl e inputs and outputs
• Capable of wit hstanding greater than 200 1V electrostat-
ic discharge
•V
IH
of 2.2V
Functional Description
The CY7C167A is a high-performance CMOS static RAM or­ganized as 16,384 words by 1 bit. Easy memory expansion is provided by an active LOW Chip Enable (CE
) and three-state drivers. The CY7C167A has an automatic power-down fea­ture, reducing the power consumption by 67% when deselected.
Writing to the device is accomplished when the Chip Select (CE
) and Write Enab le (WE) input s are both LOW. Data on the input pin (DI) is written into the memory location specified on the address pins (A
0
through A13).
Reading the devi ce is accompl ished by ta king the Chip Enab le (CE
) LOW, while (WE) remains HIGH. Under these condit ions, the contents of the location specified on the address pins will appear on the data output (DO) pi n.
The output pin remains in a high-impedance state when Chip Enable is HIGH, or Write Enable (WE
) is LOW.
A die coat is used to insure alpha immunity.
Logic Block Diagram Pin Configuration
128 x128
ARRAY
C167A-1
Top View
DIP
A
1
A
2
A
3
A
4
A
0
COLUMN
DECODER
ROW DECODER
SENSE AMP
INPUTBUFFER
POWER
DOWN
WE
CE
DO
A
5
DI
A
6
A
9
A
10
A7A
8
A11A12A
13
1 2 3 4 5 6 7 8 9 10
11
12
13
14
18
17 16 15
7C167A
A
1
A
2
A
3
A
4
A
5
DO
CE
GND
WE
V
CC
A
12
A
11
A
10
C167A-2
A
0
A
9
A
8
A
7
DI
A
6
A
13
20 19
Selection Guid e
7C167A-15 7C167A-20 7C167A-25 7C167A-35 7C167A-45
Maximum Access Time (ns) 15 20 25 35 45 Maximum Operating Curr ent (mA) 90 90 90 90 90
CY7C167A
7C167A: 12/89 Revision: February 3, 2000
2
Maximum Ratings
(Above which the useful life may be impa ir ed. For user guide­lines, not tested.)
Storage Temperature
.....................................−65°
C to +150°C
Ambient Temperature with Po wer Applied
..................................................−55°
C to +125°C
Supply Voltage to Ground Potential (Pin 20 to Pin 10)
................................................ −
0.5V to +7.0V
DC V oltage Applied to Outputs in High Z State
.................................................... −
0.5V to +7.0V
DC Input Voltage
.................................................−
3.0V to +7 . 0V
Output Current into Outputs (LOW).............................20 mA
Static Discharge Voltage .......... ............ .....................>2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current .....................................................>200 mA
Operating Range
Range
Ambient
Temperature
[1]
V
CC
Commercial 0°C to +70°C 5V ± 10%
Electrical Characteristics
Over the Operating Range
7C167A-15 7C167A-20 7C167A-25
Parameter Description Te st Condi tions Min. Max. Min. Max. Min. Max. Unit
V
OH
Output High Voltage VCC = Min., IOH = −4.0 mA 2.4 2.4 2.4 V
V
OL
Output Low Voltage VCC = Min.,
I
OL
= 12.0 mA, 8.0 mA Mil
0.4 0.4 0.4 V
V
IH
Input High V oltage 2.2 V
CC
2.2 V
CC
2.2 V
CC
V
V
IL
Input Low Voltage
[2]
0.5
0.8
0.5
0.8
0.5
0.8 V
I
IX
Input Load Current GND < VI < V
CC
10
+10
10
+10
10
+10
µ
A
I
OZ
Output Leakage Current
GND < VO < V
CC
Output Disabled
10
+10
10
+10
10
+10
µ
A
I
OS
Output Short Circuit Current
[3]
VCC = Max., V
OUT
= GND
350
350
350
mA
I
CC
VCC Operating Supply Current
V
CC =
Max., I
OUT
= 0 mA 90 90 90 mA
I
SB
Auto mati c CE Power-Down Current
[4]
Max. VCC, CE > V
IH
40 40 20 mA
7C167A-35 7C167A-45
Parameter Description Te st Condi tions Min. Max. Min. Max. Unit
V
OH
Output High Voltage VCC = Min., IOH = −4.0 mA 2.4 2.4 V
V
OL
Output Low Voltage VCC = Min.,
I
OL
= 12.0 mA, 8.0 mA Mil
0.4 0.4 V
V
IH
Input High V oltage 2.2 V
CC
2.2 V
CC
V
V
IL
Input Low Voltage
[2]
0.5
0.8
0.5
0.8 V
I
IX
Input Load Current GND < VI < V
CC
10
+10
10
+10
µ
A
I
OZ
Output Leakage Current
GND < VO < V
CC
Output Disabled
10
+10
10
+10
µ
A
I
OS
Output Short Circuit Current
[3]
VCC = Max., V
OUT
= GND
350
350
mA
I
CC
VCC Operating Supply Current
V
CC =
Max., I
OUT
= 0 mA 90 90 mA
I
SB
Auto mati c CE Power-Down Current
[4]
Max. VCC, CE > V
IH
20 20 mA
Notes:
1. T
A
is the case temperature.
2. VIL min. = −3.0V for pulse durations less than 30 ns.
3. Duration of the short circuit should not exceed 30 seconds.
4. A pull-up resistor to V
CC
on the CE input is required to keep the device deselected during VCC power-up, otherwise ISB will exceed values given.
CY7C167A
7C167A: 12/89 Revision: February 3, 2000
3
Capacitance
[5]
Parameter Description Test Conditions Max. Unit
C
IN
Input Capacitance TA = 25°C, f = 1 MH z ,
V
CC
= 5.0V
10 pF
C
OUT
Output Capacitance 10 pF
C
CE
Chip Enable Capacitance 6 pF
AC Test Loads and Waveforms
3.0V
5V
OUTPUT
R1 329
R2 202
30pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
<5ns
<5
ns
5V
OUTPUT
C167A-3
R1 329
R2 202
5pF
INCLUDING
JIG AND
SCOPE
C167A-4
(a) (b)
OUTPUT 1.9V
Equivalent to: THÉ VENINEQUIVALENT
ALL INPUT PULSES
125
Switching Characteristics
Over the Operating Range
[6]
7C167A-15 7C167A-20 7C167A-25 7C167A-35 7C167A-45
Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Unit
READ CYCLE
t
RC
Read Cycle Time 15 20 25 30 ns
t
AA
Address to Data Valid 15 20 25 30 ns
t
OHA
Data Hold fr om Address Change 5 5 5 5 5 ns
t
ACE
CE LOW to Data Valid 15 20 25 35 45 ns
t
LZCE
CE LOW to Low Z
[7]
5 5 5 5 5 ns
t
HZCE
CE HIGH to High Z
[7, 8]
8 8 10 15 15 ns
t
PU
CE LOW to Power-Up 0 0 0 0 0 ns
t
PD
CE HIGH to Powe r-Down 15 20 20 20 25 ns
WRITE CYCLE
[9]
t
WC
Write Cycle Time 15 20 20 25 40 ns
t
SCE
CE LOW to Write End 12 15 20 25 30 ns
t
AW
Address Set-Up to Write End 12 15 20 25 30 ns
t
HA
Address Hold from Write End 0 0 0 0 0 ns
t
SA
Address Set-Up to Write Start 0 0 0 0 0 ns
t
PWE
WE Pulse Width 12 15 15 20 20 ns
t
SD
Data Set-Up to Write End 10 10 10 15 15 ns
t
HD
Data Hold from Write End 0 0 0 0 0 ns
t
HZWE
WE LOW to High Z
[7, 8]
7 7 7 10 15 ns
t
LZWE
WE HIGH to Low Z
[7]
5 5 5 5 5 ns
Notes:
5. Tested initially and after any design or process changes that may affect these parameters.
6. Tes t conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V , and output loading of the specified I
OL/IOH
and 30-pF load capacitance.
7. At any given temperature and voltage condition, t
HZ
is less than tLZ for any given device.
8. t
HZCE
and t
HZWE
are tested with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady state voltage.
9. The internal write time of the memory is defined by the overlap of CE
LOW and WE LOW. Both signal must be LOW to initiate a write and either signal can
terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
CY7C167A
7C167A: 12/89 Revision: February 3, 2000
4
Switching Waveforms
Notes:
10. WE
is high for read cycle.
11. Device is continuously selected, CE
= VIL.
12. Address valid prior to or coincident with CE
transition LOW.
C167A-5
50%
PREVIOUS DATA VALID
DATA VALID
t
RC
t
AA
50%
DATA VALID
t
RC
t
ACE
t
LZCE
t
PU
DATA OUT
HIGH IMPEDANCE
IMPEDANCE
I
CC
I
SB
t
HZCE
t
PD
CE
HIGH
C167A-6
V
CC
SUPPLY
CURRENT
t
OHA
Read Cycle No. 1
[10, 11]
Read Cycle No. 2
[10, 12]
ADDRESS
DATA OUT
t
WC
DATA UNDEFINED
HIGH IMPEDANCE
t
SCE
t
AW
t
SA
t
PWE
t
HA
t
HD
t
HZWE
t
LZWE
t
SD
C167A-7
CE
WE
DATA IN
DATA I/O
ADDRESS
DATAINVALID
Write Cycle No. 1 (WE Controlled)
[9]
CY7C167A
7C167A: 12/89 Revision: February 3, 2000
5
Note:
13. If CE
goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.
Switching Waveforms
(continued )
t
WC
DATA UNDEFINED
HIGH IMPEDANCE
t
SCE
t
AW
t
PWE
t
HA
t
HD
t
HZWE
t
SD
ADDRESS
CE
WE
DATA IN
DATA I/O
t
SA
C167A-8
DATAINVALID
Write Cycle No. 2 (CE Controlled)
[9, 13 ]
CY7C167A
7C167A: 12/89 Revision: February 3, 2000
6
T y pical DC and AC Characteris ti cs
1.2
1.4
1.0
0.6
0.4
0.2
4.0 4.5 5.0 5.5 6.0
1.6
1.4
1.2
1.0
0.8
-55 25 125
55 25 125
1.2
1.0
0.8
NORMALIZED t
AA
60
50
40
30
20 10
0 1.0 2.0 3.0 4.0
OUTPUT SOURCE CURRENT (mA)
SUPPLY VOLTAGE (V)
NORMALIZED SUPPLY CURRENT vs. SUPPLY VOLTAGE
NORMALIZED ACCESS TIME vs. AMBIENT TEMPERATURE
AMBIENT TEMPERATURE (°C)
NORMALIZED SUPPLY CURRENT vs. AMBIENT TEMPERATURE
AMBIENT TEMPERATURE (°C)
OUTPUT VOLTAGE (V)
OUTPUT SOURCE CURRENT vs. OUTPUT
VOLTAGE
0.0
0.8
1.4
1.1
1.0
0.9
4.0 4.5 5.0 5.5 6.0
NORMALIZED t
SUPPLY VO LTAG E (V)
NORMALIZED ACCESS TIME vs. SUPPLY
VOLTAGE
150 125
75 50
25
0.0 1.0 2.0 3.0 4.0
OUTPUT SINK CURRENT (mA)
0
100
OUTPUT VOLTAGE (V)
OUTPUT SINK CURRENT vs. OUTPUT VOLTAGE
0.6
0.4
0.2
0.0
NORMA LIZED I , I
CC SB
NORMA LIZED I , I
CC SB
I
SB
VCC= 5.0V V
IN
= 5.0V
I
CC
I
CC
VCC= 5.0V
V
CC
= 5.0V
T
A
= 25°C
I
SB
TA= 25°C
0.6
0.8
0
AA
1.3
1.2
V
CC
= 5.0V
T
A
= 25°C
5.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0 1.0 2.0 3.0 4.0
NORMALIZED I
PO
SUPPLY VOLTAGE (V)
TYPICAL POWER-ON CURRENT vs. SUPPLY
VOLTAGE
30.0
20.0
10.0
0 200 400 600 800
DELTA t (ns)
AA
CAPACITANCE (pF)
TYPICAL ACCESS TIME CHANGE vs. OUTPUT LOADING
1.1
1.0
0.9
10 20 30 40
NORMALIZED I
CC
CYCLE FREQUENCY (MHz)
NORMALIZED I
CC
vs. CYCLE TIME
0.0
5.0
0.0 1000
0.8
V
CC
= 4.5V
T
A
= 25°C
V
CC
= 5.0V
T
A
= 25°C
V
IH
= 0.5V
CY7C167A
7C167A: 12/89 Revision: February 3, 2000
7
Document #: 38-00093-E
Ordering Information
Speed (ns) ICC (mA) Ordering Code Package Name Package Type Operating Range
15 80 CY7C167A-15PC P5 20-Lead (300-Mil) Molded DIP Commercial
CY7C167A-15VC V5 20-Lead Molded SOJ
20 80 CY7C167A-20PC P5 20-Lead (300-Mil) Molded DIP Commercial
CY7C167A-20VC V5 20-Lead Molded SOJ
25 60 CY7C167A-25PC P5 20-Lead (300-Mil) Molded DIP Commercial
CY7C167A-25VC V5 20-Lead Molded SOJ
35 60 CY7C167A-35PC P5 20-Lead (300-Mil) Molded DIP Commercial
CY7C167A-35VC V5 20-Lead Molded SOJ
45 50 CY7C167A-45PC P5 20-Lead (300-Mil) Molded DIP Commercial
CY7C167A-45VC V5 20-Lead Molded SOJ
CY7C167A
7C167A: 12/89 Revision: February 3, 2000
© Cypress Semiconductor Corporation, 2000. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it con vey or imply any license under patent or other rights. Cypress Semiconductor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Package Diagrams
51-85011-A
20-Lead(300-Mil)Molded DIPP5
20-Lead (300-Mil) Molded SOJ V5
51-85029-A
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