• True dual-ported memory cells which allow
simultaneous reads of the same memory location
• 2K x 16 organizat ion
• 0.65-micron CMOS for optimum sp eed/power
• High-speed access: 25/35/55 ns
• Low op e rating pow er: I
= 150 mA (typ.)
CC
• Fully asy nchronous operation
• Master CY7C133 expands data bus width to 32 bits or
more using slave CY7C143
• BUSY input flag on CY7C133; BUSY output flag on
CY7C143
• Available in 68-pin PLCC
• Pin-compati ble and f unction all y equiva len t to IDT713 3
and IDT7143
Logic Block Diagram
CE
L
R/W
LUB
R/W
LLB
OE
L
Functional Description
The CY7C133 and CY7C143 are high- speed CMOS 2K b y 16
dual-port static RAMs. Tw o ports are provided permitti ng independent access to any locat ion in memory. T he CY7C133 can
be utilized as either a stand-alone 16-bit dual-port static RAM
or as a master dual-port RAM in conjunct ion with the CY7C143
slave dual-port device in systems requiring 32-bit or greater
word widths. It is the solution to applications requiring shared
or buffered data, such as cache memory for DSP, bit-slice, or
multiprocessor designs.
Each port has independent control pins; Chip Enable (CE
Write Enable (R/W
signals that the port is trying to access the sam e location currently being accessed by the other port. An automatic power-down feature is controlled independently on each port by
the Chip Enable (CE
The CY7C133 and CY7C143 are available in 68-pin PLCC.
, R/WLB), and Output Enab le (OE). BUSY
UB
) pin.
CE
R
R/W
RUB
R/W
RLB
OE
R
),
I/O8L– I/O
15L
I/O0L– I/O
7L
[1]
BUSY
L
A
10L
A
0L
Note:
1. CY7C133 (Master): BUSY
is open drain output and requires pull-up resistor. CY7C143 (Slave): BUSY is input.
ADDRESS
DECODER
Cypress Semiconductor Corporation
I/O8R– I/O
I/O0R– I/O
[]
1
BUSY
R
A
10R
A
0R
15R
7R
C133-1
R/W
R/W
CONTROL
CE
L
OE
L
LUB
LLB
I/O
MEMORY
ARRAY
ARBITRATION
LOGIC
(CY7C133ONLY)
I/O
CONTROL
ADDRESS
DECODER
CE
R
OE
R
R/W
RUB
R/W
RLB
•3901 North First Street•San Jose•CA 95134•408-943-2600
October 14, 1999
Pin Configuration
I/O
I/O
I/O
I/O
I/O
I/O
I/O
V
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
10L
11L
12L
13L
14L
15L
CY7C133
CY7C143
68-Pin
LCC/PLCC
Top View
LLB
I/O
I/O
1L
15R
I/O
GND
LUB
0L
CC
V
R/W
L
10L
R/W
OE
R/W
67
R
10R
RLB
RUB
OE
A
R/W
7LA8LA9L
A
A
A
60
6L
A
59
5L
A
58
4L
A
57
3L
A
56
2L
A
55
1L
A
54
0L
BUSY
53
52
51
50
49
48
47
46
45
44
6R
7RA8RA9R
A
A
CE
CE
BUSY
A
0R
A
1R
A
2R
A
3R
A
4R
A
5R
L
L
R
R
C133-2
8L
7L
6L
5L
4L
3L
I/O
I/O
I/O
987 6
9L
10
11
12
13
14
15
16
CC
17
18
0R
19
1R
20
2R
21
3R
22
4R
23
5R
24
6R
25
7R
26
2728 29 30
9R
8R
10R
I/O
I/O
I/O
2L
I/O
I/O
I/O
I/O
5432168 666564636261
7C133
7C143
3132 33 34 35 36 37 38 39 40 41 42 43
14R
13R
12R
11R
I/O
I/O
I/O
I/O
Selection G uide
7C133-25
7C143-25
Maximum Access Time (ns)253555
Typical Operating Current ICC (mA)170160150
Typical Standby Current for I
Maximum Ratings
(Abov e which the useful life m ay be impaired. For user guidelines, not tested.)
Storage Temperature .....................................−65°C to +150°C
Ambient Temperature with
Po wer Applied..................................................−55°C to +125°C
(mA)403020
SB1
DC Input Voltage.................................................−3.5V to +7.0V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage ................................... .. ..... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current............. .......................... ............. >200 mA
Operating Range
Supply Voltage to Ground Potential
(Pin 48 to Pin 24).................................................−0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State.....................................................−0.5V to +7.0V
Range
Commercial0°C to +70°C 5V ± 10%
Industrial
7C133-35
7C143-35
7C133-55
7C143-55
Ambient
TemperatureV
−40°
C to +85°C 5V ± 10%
CC
2
CY7C133
CY7C143
Electrical Characteristics
Over the Operating Range
ParameterDescriptionTest Co ndit ions
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
OS
I
CC
I
SB1
I
SB2
I
SB3
I
SB4
Notes:
2. BUSY
3. Duration of the short circuit should not exceed 30 seconds.
4. Tested initially and after any design or process changes that may affect these parameters.
5. At f=f
MAX
Output HIGH VoltageVCC = Min.,
I
= –4.0 mA
OH
Output LOW VoltageIOL = 4.0 mA0.4V
IOL = 16.0 mA
[2]
Input HIGH Voltage2.2V
Input LOW Voltage0.8V
Input Leakage CurrentGND < VI < V
CC
Output Leakage CurrentGND < VO < VCC, Output Disabled
Output Short Circuit
[3,4]
Current
VCC Operating Supply Cur-
rent
Standby Curr ent Both Ports,
VCC = Max.,
V
= GND
OUT
CE = VIL,
Outputs Open,
f = f
MAX
[5]
CEL and CER > VIH, f = f
TTL Inputs
Standby Current One Port,
TTL Inputs
Standby Curr ent Both Ports,
CMOS Inputs
Standby Current One Port,
CMOS Inputs
pin only .
, address and data inputs are cycling at the maximum frequency of read cycle of 1/tRC and using AC Test Waveforms input levels of GND to 3V.
CEL or CER > VIH, Active Port Outputs Open, f = f
6. T est conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and output loading of the specified
I
OL/IOH,
7. AC Test Conditions use V
8. At any given temperature and voltage condition for any given device, t
9. t
LZCE
voltage.
10. This parameter is guaranteed but not tested.
11. The internal write time of the memory is defined by the overlap of CS
can terminat e a wri te by goi ng HI GH. Th e data i np ut set -up an d hold timing sho ul d be re f ere nc ed to th e risin g edg e of th e si gn al th at te rmin at es the writ e .
Read Cycle Time253555ns
Address to Data Valid
[7]
253555ns
Data Hold from Address Change000ns
CE LOW to Data Va lid
OE LOW to Data Valid
OE LOW to Lo w Z
OE HIGH to High Z
CE LOW to Low Z
CE HIGH to H ig h Z
CE LOW to Po wer-Up
CE HIGH to Power-Down
[11]
[7]
[7]
[8, 9,10]
[8, 9,10]
[8, 9,1 0]
[8, 9,10]
[10]
[10]
253555ns
202530ns
333ns
152025ns
355ns
152020ns
000ns
252525ns
Write Cycle Time253555ns
CE LOW to Write End202540ns
Address Set-Up to Write End202540ns
Address Hold from Write End222ns
Address Set-Up to Write Start000ns
R/W Pulse Wi dth202535ns
Data Se t- U p to Write End152020ns
Data Hold from Write End000ns
and t
[9,10]
[9,10]
are tested with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady state
HZWE
000ns
is less than t
LZCE
LOW and R/W LOW. Both signals m ust be LOW to initiate a write and either signal
152020ns
HZCE
and t
is less than t
LZOE
HZOE
.
R/W LOW to High Z
R/W HIGH to Low Z
and 30-pF load capacitance.
, t
, t
LZWE
HZOE
= 1.6V and VOL = 1.4V.
OH
, t
, t
LZOE
HZCE
5
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