Cypress Semiconductor CY7C133-35JC, CY7C133-25JI, CY7C133-25JC, CY7C133-55JC, CY7C133-35JI Datasheet

CY7C133 CY7C143
2K x 16 Dual-Port Static RAM
Features
• True dual-ported memory cells which allow simultaneous reads of the same memory location
• 0.65-micron CMOS for optimum sp eed/power
• High-speed access: 25/35/55 ns
• Low op e rating pow er: I
= 150 mA (typ.)
CC
• Fully asy nchronous operation
• Master CY7C133 expands data bus width to 32 bits or more using slave CY7C143
• BUSY input flag on CY7C133; BUSY output flag on CY7C143
• Available in 68-pin PLCC
• Pin-compati ble and f unction all y equiva len t to IDT713 3 and IDT7143
Logic Block Diagram
CE
L
R/W
LUB
R/W
LLB
OE
L
Functional Description
The CY7C133 and CY7C143 are high- speed CMOS 2K b y 16 dual-port static RAMs. Tw o ports are provided permitti ng inde­pendent access to any locat ion in memory. T he CY7C133 can be utilized as either a stand-alone 16-bit dual-port static RAM or as a master dual-port RAM in conjunct ion with the CY7C143 slave dual-port device in systems requiring 32-bit or greater word widths. It is the solution to applications requiring shared or buffered data, such as cache memory for DSP, bit-slice, or multiprocessor designs.
Each port has independent control pins; Chip Enable (CE Write Enable (R/W signals that the port is trying to access the sam e location cur­rently being accessed by the other port. An automatic pow­er-down feature is controlled independently on each port by the Chip Enable (CE
The CY7C133 and CY7C143 are available in 68-pin PLCC.
, R/WLB), and Output Enab le (OE). BUSY
UB
) pin.
CE
R
R/W
RUB
R/W
RLB
OE
R
),
I/O8L– I/O
15L
I/O0L– I/O
7L
[1]
BUSY
L
A
10L
A
0L
Note:
1. CY7C133 (Master): BUSY
is open drain output and requires pull-up resistor. CY7C143 (Slave): BUSY is input.
ADDRESS
DECODER
Cypress Semiconductor Corporation
I/O8R– I/O
I/O0R– I/O
[]
1
BUSY
R
A
10R
A
0R
15R
7R
C133-1
R/W
R/W
CONTROL
CE
L
OE
L
LUB
LLB
I/O
MEMORY
ARRAY
ARBITRATION
LOGIC
(CY7C133ONLY)
I/O
CONTROL
ADDRESS
DECODER
CE
R
OE
R
R/W
RUB
R/W
RLB
3901 North First Street San Jose CA 95134 408-943-2600 October 14, 1999
Pin Configuration
I/O I/O I/O I/O I/O I/O
I/O
V
GND I/O I/O I/O I/O I/O I/O I/O I/O
10L 11L 12L 13L 14L 15L
CY7C133 CY7C143
68-Pin
LCC/PLCC
Top View
LLB
I/O
I/O
1L
15R
I/O
GND
LUB
0L
CC
V
R/W
L
10L
R/W
OE
R/W
67
R
10R
RLB
RUB
OE
A
R/W
7LA8LA9L
A
A
A
60
6L
A
59
5L
A
58
4L
A
57
3L
A
56
2L
A
55
1L
A
54
0L
BUSY
53 52 51 50 49 48
47 46 45 44
6R
7RA8RA9R
A
A
CE
CE
BUSY A
0R
A
1R
A
2R
A
3R
A
4R
A
5R
L
L
R
R
C133-2
8L
7L
6L
5L
4L
3L
I/O
I/O
I/O
987 6
9L
10 11 12 13 14 15 16
CC
17 18
0R
19
1R
20
2R
21
3R
22
4R
23
5R
24
6R
25
7R
26
2728 29 30
9R
8R
10R
I/O
I/O
I/O
2L
I/O
I/O
I/O
I/O
5432168 666564636261
7C133 7C143
3132 33 34 35 36 37 38 39 40 41 42 43
14R
13R
12R
11R
I/O
I/O
I/O
I/O
Selection G uide
7C133-25 7C143-25
Maximum Access Time (ns) 25 35 55 Typical Operating Current ICC (mA) 170 160 150 Typical Standby Current for I
Maximum Ratings
(Abov e which the useful life m ay be impaired. For user guide­lines, not tested.)
Storage Temperature .....................................−65°C to +150°C
Ambient Temperature with
Po wer Applied..................................................−55°C to +125°C
(mA) 40 30 20
SB1
DC Input Voltage.................................................−3.5V to +7.0V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage ................................... .. ..... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current............. .......................... ............. >200 mA
Operating Range
Supply Voltage to Ground Potential
(Pin 48 to Pin 24).................................................−0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State.....................................................−0.5V to +7.0V
Range
Commercial 0°C to +70°C 5V ± 10% Industrial
7C133-35 7C143-35
7C133-55 7C143-55
Ambient
Temperature V
40°
C to +85°C 5V ± 10%
CC
2
CY7C133 CY7C143
Electrical Characteristics
Over the Operating Range
Parameter Description Test Co ndit ions
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
OS
I
CC
I
SB1
I
SB2
I
SB3
I
SB4
Notes:
2. BUSY
3. Duration of the short circuit should not exceed 30 seconds.
4. Tested initially and after any design or process changes that may affect these parameters.
5. At f=f
MAX
Output HIGH Voltage VCC = Min.,
I
= –4.0 mA
OH
Output LOW Voltage IOL = 4.0 mA 0.4 V
IOL = 16.0 mA
[2]
Input HIGH Voltage 2.2 V Input LOW Voltage 0.8 V Input Leakage Current GND < VI < V
CC
Output Leakage Current GND < VO < VCC, Output Disabled Output Short Circuit
[3,4]
Current VCC Operating Supply Cur-
rent
Standby Curr ent Both Ports,
VCC = Max., V
= GND
OUT
CE = VIL, Outputs Open, f = f
MAX
[5]
CEL and CER > VIH, f = f
TTL Inputs Standby Current One Port,
TTL Inputs Standby Curr ent Both Ports,
CMOS Inputs
Standby Current One Port, CMOS Inputs
pin only .
, address and data inputs are cycling at the maximum frequency of read cycle of 1/tRC and using AC Test Waveforms input levels of GND to 3V.
CEL or CER > VIH, Active Port Out­puts Open, f = f
MAX
[5]
Both Ports CEL and CER > VCC –
0.2V , V f = 0
> VCC – 0.2V or VIN < 0.2V ,
IN
One Port CEL or CER > VCC – 0.2V, V
> VCC – 0.2V or
IN
V
< 0.2V, Active P ort Outputs Open,
IN
[5]
f = f
MAX
MAX
7C133-25 7C143-25
2.4 V
5
5
Com’l 170 250 mA Ind. 170 290
[5]
Com’l 40 60 mA Ind. 40 75 Com’l 100 140 mA Ind. 100 160 Com’l 3 15 mA Ind. 3 15
Com’l 90 120 mA
Ind. 90 140
0.5
+5 +5
200
UnitMin. Typ. Max.
µA µA
mA
3
CY7C133 CY7C143
Electrical Characteristics
Over the Operating Range (continued)
Parameter Description Test Conditions
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
Output HIGH Voltage VCC = Min.,
I
= –4.0 mA
OH
Output LOW Voltage IOL = 4.0 mA 0.4 0.4 V
I
= 16.0 mA
OL
[2]
Input HIGH Voltage 2.2 2.2 V Input LOW Voltage 0.8 0.8 V Input Leakage Curr ent GND < VI < V Output Leakage
GND < VO < VCC, Output Disabled −5+5−5 −5 µA
CC
Current
I
OS
I
CC
I
SB1
Output Short Circuit
[3,4]
Current VCC Operating Supply
Current
Standby Current Both
VCC = Max., V
= GND
OUT
CE = VIL, Outputs Open, f = f
MAX
[5]
CEL and CER > VIH, f = f
Ports, TTL I nputs
I
SB2
I
SB3
I
SB4
Standby Current One Port, TTL Inputs
Standby Current Both Ports, CMOS Inputs
Standby Current One Port, CMO S In p ut s
CEL or CER > VIH, Activ e P ort Outputs Open, f = f
MAX
Both Ports CEL and CER > V
- 0.2V, VIN > VCC – 0.2V
CC
or V
< 0.2V, f = 0
IN
One Port CEL or CER > VCC –
0.2V, V V Open, f = f
> VCC – 0.2V or
IN
< 0.2V , A c tive Port O u tp u t s
IN
MAX
[5]
7C133-35 7C143-35
7C133-55 7C143-55
UnitMin. Typ. Max. Min. Typ. Max.
2.4 2.4 V
0.5 0.5
5+55+5µA
200 200 mA
Coml 160 230 150 220 mA Ind. 160 260 150 250
[5]
Coml30502040mA
MAX
Ind. 30 65 20 55 Coml 85 125 75 110 mA
[5]
Ind. 85 140 75 125 Coml315315mA Ind. 3 15 3 15
Coml 80 105 70 90 mA
Ind. 80 120 70 105
Capacitance
[4]
Parameter Description Te st Condi tions Max. Unit
C
IN
C
OUT
Input Capacitance TA = 25°C, f = 1 MHz, VCC = 5.0V 10 pF Output Capacitance 10 pF
AC Test Loads and Waveforms
5V
OUTPUT
30pF
INCLUDING
JIG AND
SCOPE
Equivalent to: TH ÉVENIN
OUTPUT 1.40V
R1893
(a)
R2 347
C133-2
EQUIVALENT
250
5V
OUTPUT
INCLUDING
JIG AND
SCOPE
5pF
R1893
(b)
3.0V
GND
<
3 ns
R2 347
10%
C133-3
ALL INPUT PULSES
90%
BUSY
OR INT
90%
10%
< 3 ns
5V
281
30
pF
BUSY Output Load
(CY7C133ONLY)
C133-4
4
CY7C133 CY7C143
Switching Characteristics
Over the Operati n g Range
Parameter Description
[6]
7C133-25 7C143-25
7C133-35 7C143-35
7C133-55 7C143-55
UnitMin. Max. Min. Max. Min. Max.
READ CYCLE
t
RC
t
AA
t
OHA
t
ACE
t
DOE
t
LZOE
t
HZOE
t
LZCE
t
HZCE
t
PU
t
PD
WRITE CYCLE
t
WC
t
SCE
t
AW
t
HA
t
SA
t
PWE
t
SD
t
HD
t
HZWE
t
LZWE
Notes:
6. T est conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and output loading of the specified I
OL/IOH,
7. AC Test Conditions use V
8. At any given temperature and voltage condition for any given device, t
9. t
LZCE
voltage.
10. This parameter is guaranteed but not tested.
11. The internal write time of the memory is defined by the overlap of CS can terminat e a wri te by goi ng HI GH. Th e data i np ut set -up an d hold timing sho ul d be re f ere nc ed to th e risin g edg e of th e si gn al th at te rmin at es the writ e .
Read Cycle Time 25 35 55 ns Address to Data Valid
[7]
25 35 55 ns Data Hold from Address Change 0 0 0 ns CE LOW to Data Va lid OE LOW to Data Valid OE LOW to Lo w Z OE HIGH to High Z CE LOW to Low Z CE HIGH to H ig h Z CE LOW to Po wer-Up CE HIGH to Power-Down
[11]
[7] [7]
[8, 9,10]
[8, 9,10]
[8, 9,1 0]
[8, 9,10]
[10]
[10]
25 35 55 ns
20 25 30 ns
3 3 3 ns
15 20 25 ns
3 5 5 ns
15 20 20 ns
0 0 0 ns
25 25 25 ns
Write Cycle Time 25 35 55 ns CE LOW to Write End 20 25 40 ns Address Set-Up to Write End 20 25 40 ns Address Hold from Write End 2 2 2 ns Address Set-Up to Write Start 0 0 0 ns R/W Pulse Wi dth 20 25 35 ns Data Se t- U p to Write End 15 20 20 ns Data Hold from Write End 0 0 0 ns
and t
[9,10] [9,10]
are tested with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady state
HZWE
0 0 0 ns
is less than t
LZCE
LOW and R/W LOW. Both signals m ust be LOW to initiate a write and either signal
15 20 20 ns
HZCE
and t
is less than t
LZOE
HZOE
.
R/W LOW to High Z R/W HIGH to Low Z
and 30-pF load capacitance.
, t
, t
LZWE
HZOE
= 1.6V and VOL = 1.4V.
OH
, t
, t
LZOE
HZCE
5
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