Cypress Semiconductor CY7C1324L-80AC, CY7C1324L-50AC, CY7C1324L-117AC, CY7C1324L-100AC, CY7C1324-80AC Datasheet

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3.3V 128K x 18 Synchronous Cache RAM
CY7C1324
Cypress Semiconductor Corporation
3901 North First Street San Jose CA 95134 408-943-2600 August 4, 1999
Features
• Supports 117-MHz m icroprocessor cac he systems with zero wait states
• 128K by 18 common I/O
• Fast clock-to-output times
—7.5 ns (117 MHz)
• T wo-bit wrap-aroun d counter supporti ng either inter­leaved or linear burst sequence
• Separate pro cessor and contro ller address strobe s pro­vides direct interface with the processor and external cache controller
• Synchronous self-timed write
• Asynchr onous output enable
• I/Os capable of 2.5–3.3V operation
• JEDEC-standard pinout
• 100-pin TQFP packag ing
• ZZ “sleep” mode
Functional Description
The CY7C1324 is a 3.3V, 128K by 18 synchronous cache RAM designed to interface with high-speed microprocessors with minimum glue logic. Maximum access delay from clock rise is 7.5 ns (117-MHz version). A 2-bit on-c hip counter cap­tures the first address in a burst and increments the address automatically for the rest of the burst access.
The CY7C1324 allows both interleaved or linear burst se­quences, selected by the MODE input pin. A HIGH input on MODE selects an interleaved burst sequence, while a LOW selects a linear b ur st sequenc e. Burst acc esses can be i ni tiat­ed with the Processor Address Strobe (ADSP
) or the cache
Controller Address Strobe (ADSC
) inputs. Address advance-
ment is controlled by the Address Advancement (ADV
) input.
A synchronous sel f-t imed wri te me chanism i s pro vided to sim ­plify the write interface. A synchronous chip enable input and an asynchronous output enable input provide easy control for bank selection and output three-state control.
Pin
CLK ADV
ADSC
A
[16:0]
GW
BWE
BW
0
CE
1
CE
3
CE
2
OE
ZZ
BURST
COUNTER
ADDRESS
REGISTER
INPUT
REGISTERS
128K X 18
MEMORY
ARRAY
CLK
Q
0
Q
1
Q
D
CE
CE
CLR
SLEEP
CONTROL
DQ
DQ[15:8] BYTEWRITE REGISTERS
DQ[7:0] BYTEWRITE REGISTERS
D Q
ENABLE
REGISTER
D
Q
CE
CLK
18 18
17
15
15
17
(A0,A1)
2
MODE
ADSP
Logic Block Diagram
DQ
[15:0]
BW
1
DP
[1:0]
Selection G uide
7C1324–117 7C1324–100 7C1324–80 7C1324–50
Maximum Access Time (ns) 7.5 8.0 8.5 11.0 Maximum Operat ing Current (mA) 350 325 300 250 Maximum Standb y Curr ent (mA) 1.0 1.0 1.0 1.0 Pentium is a registered trademark of Intel Corporation.
CY7C1324
2
Pin Configuration
100-Lead TQFP
A5A4A3A2A1A
0
DNU
DNU
V
SS
V
DD
DNU
A
11
A12A13A14A
15
NC
A10 NC NC V
DDQ
V
SS
NC DP
0
DQ
7
DQ
6
V
SS
V
DDQ
DQ
5
DQ
4
V
SS
NC V
DD
DQ
3
DQ
2
V
DDQ
V
SS
DQ
1
DQ
0
NC NC V
SS
V
DDQ
NC NC NC
NC
NC NC
V
DDQ
V
SS
NC NC
DQ
8
DQ
9
V
SS
V
DDQ
DQ
10
DQ
11
NC
V
DD
NC V
SS
DQ
12
DQ
13
V
DDQ
V
SS
DQ
14
DQ
15
DP
1
NC
V
SS
V
DDQ
NC NC NC
A6
A7
CE
1CE2
NC
NC
BWS
1
BWS0CE3VDDV
SS
CLKGWBWE
OE
ADSP
A8A
9
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
31323334353637383940414243444546474849
50
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
100
99989796959493929190898887868584838281
BYTE0
BYTE1
A
16
ADV
ADSC
ZZ
MODE
DNU
CY7C1324
CY7C1324
3
Functional Description
(continued)
Single Write Accesses Initiated by ADSP
This access is initiated when the following conditions are sat­isfi ed at clock rise: (1) CE
1
, CE2, and CE3 are all asse rted
active, and (2) ADSP
is asserted LOW. The addresses pre­sented are loaded into the address register and the burst counter/con trol log ic and del iv er ed to th e RAM core. The writ e inputs (GW
, BWE, and BWS
[1:0]
) are ignored during this first clock cycle. If the write inputs are asserted active (see Write Cycle Descriptions table for appropriate states that indicate a write) on the next clock rise, the appropriate data will be latched and written into the device. Byte writes are allowed. During byte writes, BWS
0
controls DQ
[7:0]
and DP0 while
BWS
1
controls DQ
[15:8]
and DP1. All I/Os ar e thr ee-st ate d dur­ing a byte write. Since these are common I/O devices, the asynchronous OE
input signal must be deasser ted and the I/Os must be three-stated prior to the presentation of data to DQ
[15:0]
and DP
[1:0]
. As a safety precaut ion , the data li nes are three-stated once a write cycle is detected, regardless of the state of OE
.
Single Write Accesses Initiated by ADSC
This write access i s ini tiated when the f ol lowi ng condi t ions ar e satisfied at clock rise: (1) CE
1
, CE2, and CE3 are all asserted
active, (2) ADSC
is asserted LOW, (3) ADSP is deasserted
HIGH, and (4) the write input signals (GW
, BWE, and BWS
[1:0]
)
indicate a write acces s. ADSC
is ignored if ADSP is active LOW .
The addresses pr esented are loaded int o the ad dress regist er , burst co unte r/contr ol logic and del iv ere d to t he RAM cor e. Th e information presented to DQ
[15:0]
and DP
[1:0]
will be w ritten into the specified address location. Byte writes are allowed, with BWS
0
controlling DQ
[7:0]
and DP0 while BWS1 controllin g
DQ
[15:8]
and DP1. All I/Os are three-stated when a write is detected, even a byte write. Since these are common I/O de­vices, the asynchronous OE
input signal must be deasserted and the I/Os must be three-stated prior to the presentation of data to DQ
[15:0]
and DP
[1:0]
. As a safety precaution, the data lines are three-stated once a write cycle is detected, regard­less of the state of OE
.
Single Read Accesses
A single re ad access is initiated when the following conditions are satisfied at clock rise: (1) CE
1
, CE2, and CE3 are all as-
serted active, and (2) ADSP
or ADSC is asserted LOW (if the
access is initiated by ADSC
, the write i nputs mus t be de assert­ed during this first cycle). The address presented to the ad­dress inputs is latc hed into the Address Register , burst count er /control logic and presented to the memory core. If the OE
input is asserted LOW, the requested data will be available at the data outputs a maximum to t
CDV
after cl ock r is e. ADSP is
ignored if CE
1
is HIGH.
Burst Sequences
This family of devices provide a 2-bit wrap around burst counter inside t he SRAM. The burst counter is fed by A
[1:0]
, and can follow either a linear or interleaved burst order. The burst order is determined by the state of the MODE input. A LOW on MODE will sele ct a l inear b u rst se quence. A HIG H on MODE will select an interleaved burst order. Leaving MODE unconnected will cause t he device to defaul t to a interleaved burst sequence.
Sleep Mode
The ZZ input pin is an asynchronous inpu t. Asserting a HIGH input on ZZ pl aces the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode . While in th is mode , dat a integ rity is guar an - teed. Accesses pending when entering the “sleep mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the sleep” mode. CE
1
, CE2, CE3, ADSP, and ADSC must re-
main inactive for the duration of t
ZZREC
after the ZZ input re-
turns low
T able 1. Counter Implementation for the Int el Pentium®/80486 Processor’s Sequence
First
Address
Second
Address
Third
Address
Fourth
Address
A
X + 1, Ax
A
X + 1, Ax
A
X + 1, Ax
A
X + 1, Ax
00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00
T able 2. Counter Implementation for a Linear Sequence
First
Address
Second
Address
Third
Address
Fourth
Address
A
X + 1
, A
x
A
X + 1
, A
x
A
X + 1
, A
x
A
X + 1
, A
x
00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10
CY7C1324
4
Cycle Description Table
[1, 2, 3]
Cycle Description
ADD
Used CE1CE3CE2ZZ ADSP ADSP ADV WE OE CLK DQ
Deselected Cycle, Power-down None H X X L X L X X X L-H High-Z Deselected Cycle, Power-down None L X L L L X X X X L-H Hi gh-Z Deselected Cycle, Power-down None L H X L L X X X X L-H High-Z Deselected Cycle, Power-down None L X L L H L X X X L-H High-Z Deselected Cycle, Power-down None X X X L H L X X X L-H High-Z SNOOZE MODE, Power-down None X X X H X X X X X X HIGH-Z READ Cycle, Begin Burst External L L H L L X X X L L-H Q READ Cycle, Begin Burst External L L H L L X X X H L-H High-Z WRITE Cycle, Begin Burst External L L H L H L X L X L-H D READ Cycle, Begin Burst External L L H L H L X H L L-H Q READ Cycle, Begin Burst External L L H L H L X H H L-H High-Z READ Cycle, Continue Burs t Next X X X L H H L H L L-H Q READ Cycle, Continue Burs t Next X X X L H H L H H L-H High-Z READ Cycle, Continue Burs t Next H X X L X H L H L L-H Q READ Cycle, Continue Burs t Next H X X L X H L H H L-H High-Z WRITE Cycle, Continue Burst Next X X X L H H L L X L-H D WRITE Cycle, Continue Burst Next H X X L X H L L X L-H D READ Cycle, Suspend Burst Cur rent X X X L H H H H L L-H Q READ Cycle, Suspend Burst Cur rent X X X L H H H H H L-H High-Z READ Cycle, Suspend Burst Cur rent H X X L X H H H L L-H Q READ Cycle, Suspend Burst Cur rent H X X L X H H H H L-H High-Z WRITE Cycle, Suspend Burst Current X X X L H H H L X L-H D WRITE Cycle, Suspend Burst Current H X X L X H H L X L-H D
Notes:
1. X=Don't Care, 1=Logic HIGH, 0=Logic LOW.
2. The SRAM always initiates a read cycle when ADSP
asserted, regardless of the state of GW, BWE, or BWS
[1:0].
Writes may occur only on subsequent clocks
after the ADSP
or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the write cycle to allow the outputs to three-state. OE
is a Don't Care for the remainder of the write cycle.
3. OE is asynchronous and is not sampled with the clock rise. During a read cycle DQ=High-Z when OE is inactive, and DQ=data when OE is active.
CY7C1324
5
Pin Descriptions
TQFP Pin
Number
Name I/O Description
85 ADSC Input-
Synchronous
Address Strobe from Controller, sam pled on the rising edge of CLK. When asserted LOW, A
[16:0]
is captured in the address registers. A
[1:0]
are also load ed into the burst
counter. When ADSP
and ADSC are both asserted, only ADSP is r e c o gnized.
84 ADSP Input-
Synchronous
Address Strobe f rom Processor, sampled on the rising edge of CLK. When asserted LOW, A
[16:0]
is captured in the address registers. A
[1:0]
are also load ed into the burst
counter . When ADSP
and ADSC are both asserted, onl y ADSP is recogniz ed. ASDP
is ignored when CE
1
is deasserted HIGH.
36, 37 A
[1:0]
Input-
Synchronous
A1, A0 Address Inputs, These i nputs feed the on-chip burst counter as the LSBs as well as being used to access a particular memory location in the memory array.
49–44, 80–82, 99, 100, 32–35
A
[16:2]
Input-
Synchronous
Address Inputs used i n conjunction with A
[1:0]
to select one of the 128K address
locations. Sampled at the rising edge of the CLK, if CE
1
, CE2, and CE3 are sampled
active, and ADSP
or ADSC is active LOW.
94, 93 BWS
[1:0]
Input-
Synchronous
Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes. Sampled on the rising edge . BWS
0
controls DQ
[7:0]
and DP0, BWS1 controls DQ
[15:8]
and DP
1
. See Write Cycle Descriptions table for further details.
83 ADV Input-
Synchronous
Advance Input use d to advance the on-chip address cou nte r . When LO W t he int ernal burst counte r is adv an ced in a bu rst sequ ence . The b urs t sequence is se lected using the MODE input.
87 BWE Input-
Synchronous
Byte Write Enable In put, act iv e LO W. Sampled on the rising edge of CLK. This signal must be asserted LOW to conduct a byte write.
88 GW Input-
Synchronous
Global Write Input, active LO W . Sampled on the rising edge of CLK. Thi s signal is used to conduct a global write, independent of the state of BWE
and BWS
[1:0]
. Global writ es
override b yte writes. 89 CLK Input-Clock Clo ck Input. Used to capture all synchronous inputs to the device. 98 CE
1
Input-
Synchronous
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in con-
junction with CE
2
and CE3, to select/desele ct the device. CE1 gates ADSP.
97 CE
2
Input-
Synchronous
Chip Enable 2 Input, act ive HIGH. Sampled on the rising edge of CLK. Used in con-
junction with CE
1
and CE3 to select/deselect the device.
92 CE
3
Input-
Synchronous
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in con-
junction with CE
1
and CE2 to select/d eselect the de vice.
86 OE Input-
Asynchronous
Output Enabl e, async hronous input, a ctive LOW. Controls the di rection of the I/ O pins .
When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are
three-stated, and act as input data pins. 64 ZZ Input-
Asynchronous
Snooze Input. Active HIGH a synchronous. When HIGH, the de vice enters a low-power
standby mo de in which all other inputs are ignored, but the data i n the memory arra y
is maintained. Leaving ZZ floating or NC will default the device into an active state. 31 MODE - Mode Input. Selects the bur st or der of the device. Tied HIGH selects the interleaved
burst order . Pulled LOW select s the linear burst or der. When left fl oating or NC, defaul ts
to interleaved burst order. 23, 22, 19,
18, 13, 12, 9, 8, 73, 72, 69, 68, 63, 62, 59, 58
DQ
[15:0]
I/O-
Synchronous
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is
triggered by the rising edge of CLK. As output s , the y d elive r t he data co ntaine d in the
memory location specified by A
[17:0]
during the prev ious clock rise of the read cycle.
The direction of the pins is controlled by OE
in conjunction with the internal control
logic. When OE
is asserted LOW, the pins behave as outputs. When HIGH, DQ
[15:0]
and DP
[1:0]
are placed in a three-state condition. The outputs are automatically
three-stated when a WRITE cycle is detected. 74, 24 DP
[1:0]
I/O-
Synchronous
Bidirectional Data Parity lines. These behav e identical to DQ
[15:0]
described above.
These signals can be used as parity bits for bytes 0 and 1 respectively. 15, 41, 65, 91V
DD
Po wer Supply Power supply inputs to the core of t he device. Should be connected to 3.3V power
supply.
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