The CY7C1020CV33 is a high-performance CMOS static
RAM organized as 32,768 words by 16 bits. This device has
an automatic power-down feature that significantly reduces
power consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
) and Write Enable (WE) inputs LOW. If Byte Low Enable
(CE
Logic Block Diagram
DATA IN DRIVERS
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
ROW DECODER
32K × 16
RAM Array
COLUMN DECODER
9
8
A
A
A10A11A
12
A13A
SENSE AMPS
14
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is
written into the location specified on the address pins (A
through A14). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O
specified on the address pins (A
through I/O16) is written into the location
9
through A14).
0
Reading from the device is accomplished by taking Chip
Enable (CE
Write Enable (WE
) and Output Enable (OE) LOW while forcing the
) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O
LOW , then data from memory will app ear on I/O
the truth table at the back of this data sheet for a complete
to I/O8. If Byte High Enable (BHE) is
1
to I/O16. See
9
description of read and write modes.
The input/output pins (I/O
high-impedance state when the device is deselected (CE
through I/O16) are placed in a
1
HIGH), the outp uts are d isabled (OE HIGH), the BHE and BLE
are disabled (BHE, BL E HIGH), or during a wri te operation (CE
LOW, and WE LOW).
The CY7C1020CV33 is available in standard 44-pin TSOP
Type II packages.
Pin Configuration
TSOP II
Top View
44
I/O
–I/O
1
I/O9–I/O
BHE
WE
CE
OE
BLE
1
NC
A
2
3
3
A
2
4
A
1
5
A
0
6
CE
8
16
I/O
I/O
I/O
I/O
V
V
I/O
I/O
I/O
I/O
WE
A4
A
A
A
NC
CC
SS
7
1
8
2
9
3
10
4
11
12
13
5
14
6
15
7
16
8
17
18
19
14
20
13
21
12
22
A
5
43
A
6
42
A
7
41
OE
40
BHE
39
BLE
38
I/O
16
37
I/O
15
36
I/O
14
35
I/O
13
34
V
SS
33
V
CC
32
I/O
12
31
I/O
11
30
I/O
10
29
I/O
9
28
NC
27
A
8
26
A
9
25
A
10
A
24
11
23
NC
0
Selection Guide
1020CV33-101020CV33-121020CV33-15Unit
Maximum Access Time101215ns
Maximum Operating Curre nt908580mA
Maximum CMOS Standby Current555mA
Cypress Semiconductor Corporation•3901 North First Street•San Jose•CA 95134•408-943-2600
Document #: 38-05133 Rev. *B Revised August 13, 2002
CY7C1020CV33
Maximum Ratings
(Above which the us efu l l ife may be impaired. For us er gui delines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage on V
DC Voltage Applied to Outputs
in High-Z State
[1]
to Relative GND
CC
....................................–0.5V to VCC + 0.5V
[1]
....–0.5V to +4.6V
DC Input Voltage
Current into Outputs (LOW).........................................20 mA
Latch-up Current.....................................................> 200 mA
Operating Range
RangeAmbient TemperatureV
Commercial0°C to +70°C 3.3V ± 10%
[1]
................................–0.5V to VCC + 0.5V
Industrial–40°C to +85°C3.3V ± 10%
Electrical Characteristics Ov er the Op erat ing Range
1020CV33-101020CV33-121020CV33-15
ParameterDescriptionTest Conditions
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
[2]
I
OS
I
CC
I
SB1
I
SB2
Capacitance
ParameterDescriptionTest ConditionsMax.Unit
C
IN
C
OUT
Notes:
1. V
(min.) = –2.0 V fo r pulse durati ons of l ess tha n 20 ns .
IL
2. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
3. Tested initially and after any design or process changes that may affect these parameters.
Output HIGH Voltage VCC = Min.,
I
= –4.0 mA
OH
Output LOW V o lt a ge VCC = Min.,
I
= 8.0 mA
OL
2.4
0.4
Input HIGH Voltage2.0VCC +
0.3
Input LOW Voltage
Input Load CurrentGND < VI < V
Output
Leakage Current
Output Short
Circuit Current
VCC
Operating
Supply Current
Automatic CE
Power-down Current
—TTL Inputs
Automatic CE
Power-down Current
—CMOS Inputs
[3]
[1]
CC
GND < VI < VCC,
Output Disabled
VCC = Max.,
= GND
V
OUT
VCC = Max.,
I
= 0 mA,
OUT
f = f
MAX
= 1/t
RC
Max. VCC,
CE > V
IH
VIN > VIH or
< VIL,
V
IN
f = f
MAX
Max. VCC,
CE > VCC – 0.3V, VIN >
– 0.3V,
V
CC
< 0.3V, f = 0
or V
IN
−0.30.8–0.30.8–0.30.8V
−1+1–1+1–1+1µA
−1+1–1+1–1+1µA
−300
908580mA
151515mA
Input CapacitanceTA = 25°C, f = 1 MHz,
Output Capacitance8pF
VCC = 3.3V
2.42.4V
0.40.4V
2.0VCC +
2.0VCC +
0.3
–300–300mA
5
55mA
8pF
CC
UnitMin.Max.Min.Max.Min.Max.
V
0.3
Document #: 38-05133 Rev. *BPage 2 of 8
CY7C1020CV33
AC Test Loads and Waveforms
3.3V
OUTPUT
30 pF
R 317Ω
(a)
Switching Characteristics Over the Operating Range
[4]
R2
351Ω
3.0V
GND
Rise Time: 1 V/ns
ALL INPUT PULSES
90%
10%
[4]
(b)
High-Z characteristics:
3.3V
OUTPUT
5 pF
(c)
90%
10%
Fall Time: 1 V/ns
R 317Ω
R2
351Ω
1020CV33-101020CV33-121020CV33-15
ParameterDescription
Read Cycle
t
RC
t
AA
t
OHA
t
ACE
t
DOE
t
LZOE
t
HZOE
t
LZCE
t
HZCE
[7]
t
PU
[7]
t
PD
t
DBE
t
LZBE
t
HZBE
Write Cycle
t
WC
t
SCE
t
AW
t
HA
t
SA
t
PWE
t
SD
t
HD
t
LZWE
t
HZWE
t
BW
Notes:
4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V.
5. At any given temperature and voltage condition, t
6. t
7. This parameter is guaranteed by design and is not tested.
8. The internal Write time of the memory is defined by the overlap of CE
, t
HZOE
and the transition o f these signal s can terminate the Write. The input dat a set-up and hold timing shoul d be referenced to the leading edge of the sign al that terminat es the Write.
Read Cycle Time101215ns
Address to Data Valid101215ns
Data Hold from Address Change333ns
CE LOW to Data Valid101215ns
OE LOW to Data Valid567ns
OE LOW to Low-Z
OE HIGH to High-Z
CE LOW to Low-Z
CE HIGH to High-Z
[5]
[5]
[5, 6]
[5, 6]
000ns
567ns
333ns
567ns
CE LOW to Power-up000ns
CE HIGH to Power-down101215ns
Byte Enable to Data Valid567ns
Byte Enable to Low-Z000ns
Byte Disable to High-Z567ns
[8]
Write Cycle Time101215ns
CE LOW to Write End8910ns
Address Set-up to Write End7810ns
Address Hold from Write End000ns
Address Set-up to Write Start000ns
WE Pulse Width7810ns
Data Set-up to Write End568ns
Data Hold from Write End000ns
WE HIGH to Low-Z
WE LOW to High-Z
[5]
[5, 6]
333ns
567ns
Byte Enable to End of Write789ns
HZBE
, t
HZCE
, and t
is less than t
are specified w ith a l oad ca paci tance of 5 pF as in p art ( c) of A C Test Loads. T rans ition i s measur ed ± 500 m V fro m steady- sta te vol tage.
HZWE
HZCE
, t
LZCE
is less than t
HZOE
LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a Write,
LZOE
, and t
HZWE
is less than t
for any given dev ice.
LZWE
UnitMin.Max.Min.Max.Min.Max.
Document #: 38-05133 Rev. *BPage 3 of 8
Switching Waveforms
CY7C1020CV33
Read Cycle No. 1
ADDRESS
DATA OUT
Read Cycle No. 2
ADDRESS
CE
OE
BHE, BLE
DATA OUT
V
CC
SUPPLY
CURRENT
[9, 10]
t
RC
t
t
OHA
AA
PREVIOUS DATA VALIDDATA VALID
LZCE
t
PU
[10, 11]
t
ACE
t
DOE
t
LZOE
t
DBE
t
LZBE
t
RC
t
HZOE
DATA VALID
Controlled)
(OE
HIGH IMPEDANCE
t
50%
t
HZCE
t
HZBE
t
PD
50%
HIGH
IMPEDANCE
I
ICC
CC
I
ISB
SB
Notes:
9. Device is continuously selected. OE
is HIGH for Read cycle.
10. WE
11. Address valid prior to or coincident with CE transition LOW.
, CE, BHE and/or BHE = VIL.
Document #: 38-05133 Rev. *BPage 4 of 8
Switching Waveforms (continued)
CY7C1020CV33
Write Cycle No. 1 (CE Controlled)
[12, 13]
ADDRESS
t
CE
SA
WE
BHE, BLE
DATA I/O
Write Cycle No. 2 (BLE or BHE Controlled)
ADDRESS
t
AW
t
WC
t
WC
t
SCE
t
PWE
t
BW
t
HA
t
SD
t
HD
,BLE
BHE
WE
CE
DATA I/O
Notes:
12. Data I/O is high impedance if OE
13. If CE
goes HIGH simultaneously wit h WE goin g HIGH, the outp ut remai ns in a hig h-impedanc e st ate.
t
SA
or BHE and/or BLE = VIH.
t
AW
t
BW
t
PWE
t
SCE
t
HA
t
SD
t
HD
Document #: 38-05133 Rev. *BPage 5 of 8
Switching Waveforms (continued)
CY7C1020CV33
Write Cycle No. 3
ADDRESS
CE
WE
BHE
,BLE
DATA I/O
(WE
Controlled)
t
SA
t
AW
t
SCE
t
WC
t
BW
t
HZWE
t
PWE
t
HA
t
SD
t
HD
t
LZWE
Truth Table
CEOE WE BLEBHEI/O1–I/O
8
HXXXXHigh-ZHigh-ZPower-downStandby (I
LLHLLData OutData OutRead—All bitsActive (I
LHData OutHigh-ZRead—Lower bits onlyActive (I
HLHigh-ZData OutRead—Upper bits onlyActive (I
LXLLLData InData InWrite—All bitsActive (I
LHData InHigh-ZWrite—Lower bits onlyActive (I
HLHigh-ZData InWrite—Upper bits onlyActive (I
LHH XXHigh-ZHigh-ZSelected, Outputs Disa ble d Active (I
LXXHHHigh-ZHigh-ZSelected, Outpu t s Di sa ble dActive (I
I/O9–I/O
16
ModePower
CC
CC
CC
CC
CC
CC
CC
CC
SB
)
)
)
)
)
)
)
)
)
Ordering Information
Speed
(ns)Ordering Code
10CY7C1020CV33-10ZCZ4444-lead TSOP Type IICommercial
CY7C1020CV33-10ZIZ4444-lead TSOP Type IIIndustrial
12CY7C1020CV33-12ZCZ4444-lead TSOP Type IICommercial
CY7C1020CV33-12ZIZ4444-lead TSOP Type IIIndustrial
15CY7C1020CV33-15ZCZ4444-lead TSOP Type IICommercial
CY7C1020CV33-15ZIZ4444-lead TSOP Type IIIndustrial
Document #: 38-05133 Rev. *BPage 6 of 8
Package
NamePackage TypeOperating Range
ng so indemnifies Cypress Semiconductor against all charges.
Package Diagrams
CY7C1020CV33
44-Pin TSOP II Z44
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