Datasheet CY7C1020CV33-15ZI, CY7C1020CV33-15ZC, CY7C1020CV33-12ZI, CY7C1020CV33-12ZC, CY7C1020CV33-10ZI Datasheet (Cypress Semiconductor)

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CY7C1020CV33
32K x 16 St atic RAM
Features
• Pin- and function-compatible with CY7C1020V33
• High speed —t
= 10, 12, 15 ns
• CMOS for optimum speed/power
• Low active power —360 mW (max.)
• Automatic power-down when dese lec ted
• Independent control of upper and lower bits
• Available in 44-pin TSOP II
Functional Description
The CY7C1020CV33 is a high-performance CMOS static RAM organized as 32,768 words by 16 bits. This device has an automatic power-down feature that significantly reduces power consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
) and Write Enable (WE) inputs LOW. If Byte Low Enable
(CE
Logic Block Diagram
DATA IN DRIVERS
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
ROW DECODER
32K × 16
RAM Array
COLUMN DECODER
9
8
A
A
A10A11A
12
A13A
SENSE AMPS
14
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is written into the location specified on the address pins (A through A14). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O specified on the address pins (A
through I/O16) is written into the location
9
through A14).
0
Reading from the device is accomplished by taking Chip Enable (CE Write Enable (WE
) and Output Enable (OE) LOW while forcing the
) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins will appear on I/O LOW , then data from memory will app ear on I/O the truth table at the back of this data sheet for a complete
to I/O8. If Byte High Enable (BHE) is
1
to I/O16. See
9
description of read and write modes. The input/output pins (I/O
high-impedance state when the device is deselected (CE
through I/O16) are placed in a
1
HIGH), the outp uts are d isabled (OE HIGH), the BHE and BLE are disabled (BHE, BL E HIGH), or during a wri te operation (CE LOW, and WE LOW).
The CY7C1020CV33 is available in standard 44-pin TSOP Type II packages.
Pin Configuration
TSOP II
Top View
44
I/O
–I/O
1
I/O9–I/O
BHE WE
CE OE
BLE
1
NC A
2
3
3
A
2
4
A
1
5
A
0
6
CE
8
16
I/O I/O
I/O I/O
V
V I/O I/O I/O I/O
WE
A4
A A
A
NC
CC
SS
7
1
8
2
9
3
10
4
11 12 13
5
14
6
15
7
16
8
17 18 19
14
20
13
21
12
22
A
5
43
A
6
42
A
7
41
OE
40
BHE
39
BLE
38
I/O
16
37
I/O
15
36
I/O
14
35
I/O
13
34
V
SS
33
V
CC
32
I/O
12
31
I/O
11
30
I/O
10
29
I/O
9
28
NC
27
A
8
26
A
9
25
A
10
A
24
11
23
NC
0
Selection Guide
1020CV33-10 1020CV33-12 1020CV33-15 Unit
Maximum Access Time 10 12 15 ns Maximum Operating Curre nt 90 85 80 mA Maximum CMOS Standby Current 5 5 5 mA
Cypress Semiconductor Corporation 3901 North First Street San Jose CA 95134 408-943-2600 Document #: 38-05133 Rev. *B Revised August 13, 2002
CY7C1020CV33
Maximum Ratings
(Above which the us efu l l ife may be impaired. For us er gui de­lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage on V DC Voltage Applied to Outputs
in High-Z State
[1]
to Relative GND
CC
....................................–0.5V to VCC + 0.5V
[1]
....–0.5V to +4.6V
DC Input Voltage
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage...........................................> 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.....................................................> 200 mA
Operating Range
Range Ambient Temperature V
Commercial 0°C to +70°C 3.3V ± 10%
[1]
................................–0.5V to VCC + 0.5V
Industrial –40°C to +85°C3.3V ± 10%
Electrical Characteristics Ov er the Op erat ing Range
1020CV33-10 1020CV33-12 1020CV33-15
Parameter Description Test Conditions
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
[2]
I
OS
I
CC
I
SB1
I
SB2
Capacitance
Parameter Description Test Conditions Max. Unit
C
IN
C
OUT
Notes:
1. V
(min.) = –2.0 V fo r pulse durati ons of l ess tha n 20 ns .
IL
2. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
3. Tested initially and after any design or process changes that may affect these parameters.
Output HIGH Voltage VCC = Min.,
I
= –4.0 mA
OH
Output LOW V o lt a ge VCC = Min.,
I
= 8.0 mA
OL
2.4
0.4
Input HIGH Voltage 2.0 VCC +
0.3 Input LOW Voltage Input Load Current GND < VI < V Output
Leakage Current Output Short
Circuit Current VCC
Operating Supply Current
Automatic CE Power-down Current TTL Inputs
Automatic CE Power-down Current CMOS Inputs
[3]
[1]
GND < VI < VCC, Output Disabled
VCC = Max.,
= GND
V
OUT
VCC = Max., I
= 0 mA,
OUT
f = f
MAX
= 1/t
RC
Max. VCC, CE > V
IH
VIN > VIH or
< VIL,
V
IN
f = f
MAX
Max. VCC, CE > VCC – 0.3V, VIN >
– 0.3V,
V
CC
< 0.3V, f = 0
or V
IN
0.3 0.8 0.3 0.8 0.3 0.8 V
1+1–1 +1 1 +1 µA
1+1–1 +1 1 +1 µA
300
90 85 80 mA
15 15 15 mA
Input Capacitance TA = 25°C, f = 1 MHz, Output Capacitance 8 pF
VCC = 3.3V
2.4 2.4 V
0.4 0.4 V
2.0 VCC +
2.0 VCC +
0.3
–300 –300 mA
5
5 5 mA
8 pF
CC
UnitMin. Max. Min. Max. Min. Max.
V
0.3
Document #: 38-05133 Rev. *B Page 2 of 8
CY7C1020CV33
AC Test Loads and Waveforms
3.3V
OUTPUT
30 pF
R 317
(a)
Switching Characteristics Over the Operating Range
[4]
R2
351
3.0V
GND
Rise Time: 1 V/ns
ALL INPUT PULSES
90%
10%
[4]
(b)
High-Z characteristics:
3.3V
OUTPUT
5 pF
(c)
90%
10%
Fall Time: 1 V/ns
R 317
R2
351
1020CV33-10 1020CV33-12 1020CV33-15
Parameter Description
Read Cycle
t
RC
t
AA
t
OHA
t
ACE
t
DOE
t
LZOE
t
HZOE
t
LZCE
t
HZCE
[7]
t
PU
[7]
t
PD
t
DBE
t
LZBE
t
HZBE
Write Cycle
t
WC
t
SCE
t
AW
t
HA
t
SA
t
PWE
t
SD
t
HD
t
LZWE
t
HZWE
t
BW
Notes:
4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V.
5. At any given temperature and voltage condition, t
6. t
7. This parameter is guaranteed by design and is not tested.
8. The internal Write time of the memory is defined by the overlap of CE
, t
HZOE
and the transition o f these signal s can terminate the Write. The input dat a set-up and hold timing shoul d be referenced to the leading edge of the sign al that terminat es the Write.
Read Cycle Time 10 12 15 ns Address to Data Valid 10 12 15 ns Data Hold from Address Change 3 3 3 ns CE LOW to Data Valid 10 12 15 ns OE LOW to Data Valid 5 6 7 ns OE LOW to Low-Z OE HIGH to High-Z CE LOW to Low-Z CE HIGH to High-Z
[5]
[5]
[5, 6]
[5, 6]
0 0 0 ns
5 6 7 ns
3 3 3 ns
5 6 7 ns CE LOW to Power-up 0 0 0 ns CE HIGH to Power-down 10 12 15 ns Byte Enable to Data Valid 5 6 7 ns Byte Enable to Low-Z 0 0 0 ns Byte Disable to High-Z 5 6 7 ns
[8]
Write Cycle Time 10 12 15 ns CE LOW to Write End 8 9 10 ns Address Set-up to Write End 7 8 10 ns Address Hold from Write End 0 0 0 ns Address Set-up to Write Start 0 0 0 ns WE Pulse Width 7 8 10 ns Data Set-up to Write End 5 6 8 ns Data Hold from Write End 0 0 0 ns WE HIGH to Low-Z WE LOW to High-Z
[5] [5, 6]
3 3 3 ns
5 6 7 ns Byte Enable to End of Write 7 8 9 ns
HZBE
, t
HZCE
, and t
is less than t
are specified w ith a l oad ca paci tance of 5 pF as in p art ( c) of A C Test Loads. T rans ition i s measur ed ± 500 m V fro m steady- sta te vol tage.
HZWE
HZCE
, t
LZCE
is less than t
HZOE
LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a Write,
LZOE
, and t
HZWE
is less than t
for any given dev ice.
LZWE
UnitMin. Max. Min. Max. Min. Max.
Document #: 38-05133 Rev. *B Page 3 of 8
Switching Waveforms
CY7C1020CV33
Read Cycle No. 1
ADDRESS
DATA OUT
Read Cycle No. 2
ADDRESS
CE
OE
BHE, BLE
DATA OUT
V
CC
SUPPLY
CURRENT
[9, 10]
t
RC
t
t
OHA
AA
PREVIOUS DATA VALID DATA VALID
LZCE
t
PU
[10, 11]
t
ACE
t
DOE
t
LZOE
t
DBE
t
LZBE
t
RC
t
HZOE
DATA VALID
Controlled)
(OE
HIGH IMPEDANCE
t
50%
t
HZCE
t
HZBE
t
PD
50%
HIGH
IMPEDANCE
I
ICC
CC
I
ISB
SB
Notes:
9. Device is continuously selected. OE is HIGH for Read cycle.
10. WE
11. Address valid prior to or coincident with CE transition LOW.
, CE, BHE and/or BHE = VIL.
Document #: 38-05133 Rev. *B Page 4 of 8
Switching Waveforms (continued)
CY7C1020CV33
Write Cycle No. 1 (CE Controlled)
[12, 13]
ADDRESS
t
CE
SA
WE
BHE, BLE
DATA I/O
Write Cycle No. 2 (BLE or BHE Controlled)
ADDRESS
t
AW
t
WC
t
WC
t
SCE
t
PWE
t
BW
t
HA
t
SD
t
HD
,BLE
BHE
WE
CE
DATA I/O
Notes:
12. Data I/O is high impedance if OE
13. If CE
goes HIGH simultaneously wit h WE goin g HIGH, the outp ut remai ns in a hig h-impedanc e st ate.
t
SA
or BHE and/or BLE = VIH.
t
AW
t
BW
t
PWE
t
SCE
t
HA
t
SD
t
HD
Document #: 38-05133 Rev. *B Page 5 of 8
Switching Waveforms (continued)
CY7C1020CV33
Write Cycle No. 3
ADDRESS
CE
WE
BHE
,BLE
DATA I/O
(WE
Controlled)
t
SA
t
AW
t
SCE
t
WC
t
BW
t
HZWE
t
PWE
t
HA
t
SD
t
HD
t
LZWE
Truth Table
CE OE WE BLE BHE I/O1–I/O
8
H X X X X High-Z High-Z Power-down Standby (I
L L H L L Data Out Data Out ReadAll bits Active (I
L H Data Out High-Z ReadLower bits only Active (I H L High-Z Data Out ReadUpper bits only Active (I
L X L L L Data In Data In WriteAll bits Active (I
L H Data In High-Z WriteLower bits only Active (I
H L High-Z Data In WriteUpper bits only Active (I L H H X X High-Z High-Z Selected, Outputs Disa ble d Active (I L X X H H High-Z High-Z Selected, Outpu t s Di sa ble d Active (I
I/O9–I/O
16
Mode Power
CC CC CC CC CC CC CC CC
SB
) ) ) ) ) ) ) ) )
Ordering Information
Speed
(ns) Ordering Code
10 CY7C1020CV33-10ZC Z44 44-lead TSOP Type II Commercial
CY7C1020CV33-10ZI Z44 44-lead TSOP Type II Industrial
12 CY7C1020CV33-12ZC Z44 44-lead TSOP Type II Commercial
CY7C1020CV33-12ZI Z44 44-lead TSOP Type II Industrial
15 CY7C1020CV33-15ZC Z44 44-lead TSOP Type II Commercial
CY7C1020CV33-15ZI Z44 44-lead TSOP Type II Industrial
Document #: 38-05133 Rev. *B Page 6 of 8
Package
Name Package Type Operating Range
ng so indemnifies Cypress Semiconductor against all charges.
Package Diagrams
CY7C1020CV33
44-Pin TSOP II Z44
All products and company names mentioned in this document may be the trademarks of their respective holders.
51-85087-A
Document #: 38-05133 Rev. *B Page 7 of 8
© Cypress Semiconductor Corporation, 2002. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than cir cuitry embodi ed in a Cypress S emiconductor product . Nor does it convey or imply any license un der patent or other righ ts. Cypre ss Semiconductor does not autho rize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doi
CY7C1020CV33
Document Title: CY7C1020CV33 32K x 16 Static RAM Document Number: 38-05133
REV. ECN NO.
** 109428 12/16/01 HGK New Data Sheet *A 115045 05/30/02 HGK I *B 117615 08/14/02 DFP Pin 1= NC Pin 18 = A4; remove SOJ package option; remove 8ns option.
Issue
Date
Orig. of Change Description of Change
CC
and I
data modified
SB1
Document #: 38-05133 Rev. *B Page 8 of 8
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