• Low active power
—825 mW (max., 10 ns, “L” version)
• Ver y Low standby pow er
—550 µW (max., “L” version)
• Automatic power-down when deselected
• Independent Control of Upper and Lower bytes
• Available in 44-pin TSOP II and 400-mil SOJ
Functional Description
The CY7C1020 is a high-performance CMOS static RAM organized as 32,768 word s by 16 bits . Thi s de vi ce has an au tomatic power-down feature that significantly reduces power
consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
) and Write Enable (WE) inputs LOW. If Byte Low Enable
(CE
CY7C1020
32K x 16 Static RAM
(BLE
) is LOW, then data from I/O pins (I/O1 through I/O8), is
written into the location specified on the address pins (A
through A14). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O
specified on the address pins (A
Reading from the device is accomplished by taking Chip Enable (CE
) and Output Enable (OE) LOW while f orcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then
data from the memory location specified by the address pins
will appear on I/O
then data from memory will appear on I/O9 to I/O16. See the
truth table at the back of this data sheet for a com plete description of read and write modes.
The input/output pins (I/O
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1020 is available in standard 44-pin TSOP type II
and 400-mil-wide SOJ packages.
through I/O16) is written into the location
9
to I/O8. If Byte High Enable (BHE) is LOW,
1
through A14).
0
through I/O16) are placed in a
1
0
Logic Block Diagram
Pin Configuration
SOJ / TSOP II
DATA IN DRIVERS
A
6
A
5
A
4
A
3
A
2
A
1
A
0
ROW DECODER
32K x 16
RAM Array
SENSE AMPS
– I/O
I/O
1
I/O9 – I/O
8
16
COLUMN DECODER
BHE
9
8
7
A
A
A
A10A11A
12
14
A13A
WE
CE
OE
BLE
1020-1
NC
A
A
A
A
I/O
I/O
I/O
I/O
V
V
I/O
I/O
I/O
I/O
WE
A
NC
13
12
11
CE
CC
SS
10
A
A
A
14
1
2
3
4
5
6
7
8
9
8
7
Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
A
0
43
A
1
42
A
2
41
OE
40
BHE
39
BLE
38
I/O
16
37
I/O
15
36
I/O
14
35
I/O
13
34
V
SS
33
V
CC
32
I/O
12
31
I/O
11
30
I/O
10
29
I/O
9
28
NC
27
A
3
26
A
4
25
A
5
A
24
6
23
NC
Selection Guide
7C1020-107C1020-127C1020-157C1020-20
Maximum Access Time (ns)10121520
Maximum Operating Current (mA)180170160160
L150140130130
Maximum CMOS Standby Current (mA)3333
L0.10.10.10.1
1020-2
Cypress Semiconductor Corporation•3901 North First Street•San Jose•CA 95134•408-943-2600
Document #: 38-05058 Rev. ** Revised August 31, 2001
CY7C1020
Maximum Ratings
(Above which the useful life may be im pai red. For user guidelines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage on V
DC Voltage Applied to Outputs
in High Z State
[1]
DC Input Voltage
to Relative GND
CC
.....................................–0.5V to VCC +0.5V
[1]
.................................–0.5V to VCC +0.5V
[1]
....–0.5V to +7.0V
Electrical Characteristics Ov er the Op erat ing Range
ParameterDescriptionTest Conditions
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC
I
SB1
I
SB2
Notes:
1. V
IL
2. T
is the case temperature.
A
Output HIGH VoltageVCC = Min., IOH = –4.0 mA2.42.42.4V
Output LOW VoltageVCC = Min., IOL = 8.0 mA0.40.40.4V
Input HIGH Voltage2.26.02.26.02.26.0V
Input LOW Voltage
Input Load CurrentGND < VI < V
Output Leakage
Current
VCC Operating
Supply Current
Automatic CE
Power-Down Current
—TTL Inputs
Automatic CE
Power-Down Current
—CMOS Inputs
(min.) = –2.0V for pulse durati ons of l ess than 2 0 ns.
[1]
CC
GND < VI < VCC,
Output Disabled
VCC = Max.,
I
= 0 mA,
OUT
f = f
MAX
= 1/t
RC
Max. VCC, CE > V
VIN > VIH or
VIN < VIL, f = f
MAX
Max. VCC,
> VCC – 0.3V,
CE
> VCC – 0.3V,
V
IN
or VIN < 0.3V, f = 0
Current into Outputs (LOW)........................................20 mA
3. Tested initially and after any design or process changes that may affect these parameters.
Input CapacitanceTA = 25°C, f = 1 MHz,
= 5.0V
V
Output Capacitance8pF
CC
8pF
AC Test Loads and Wavefor ms
(b)
R 481Ω
1.73V
1020-3
R2
255
3.0V
GND
Ω
<3 ns<3 ns
ALL INPUT PULSES
90%
10%
5V
OUTPUT
INCLUDING
JIG AND
SCOPE
Equivalent to:
30 pF
(a)
THÉVENIN
EQUIVALENT
R 481
Ω
R2
Ω
255
OUTPUT
5V
OUTPUT
INCLUDING
JIG AND
SCOPE
5 pF
167Ω
30 pF
90%
10%
1020-4
Document #: 38-05058 Rev. **Page 3 of 10
CY7C1020
Switching Characteristics
[4]
Over the Operating Range
7C1020-107C1020-127C1020-157C1020-20
ParameterDescription
READ CYCLE
t
RC
t
AA
t
OHA
t
ACE
t
DOE
t
LZOE
t
HZOE
t
LZCE
t
HZCE
t
PU
t
PD
t
DBE
t
LZBE
t
HZBE
WRITE CYCLE
t
WC
t
SCE
t
AW
t
HA
t
SA
t
PWE
t
SD
t
HD
t
LZWE
t
HZWE
t
BW
Notes:
4. T est conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and out put lo ading of the sp ecifi ed
I
OL/IOH
5. t
HZOE
6. At any given temperature and voltage condition, t
7. The internal write time of the memory is defined by the overlap of CE
and the transition of these signal s can terminate the write . The input data set-up and hold timing sho uld be referenced to the leadin g edge of th e signal that t erminates th e write.
Read Cycle Time10121520ns
Address to Data Valid10121520ns
Data Hold from Address Change3333ns
CE LOW to D ata Valid10121520ns
OE LOW to Data Valid5579ns
OE LOW to Low Z0000ns
OE HIGH to High Z
CE LOW to Low Z
CE HIGH to High Z
[5, 6]
[6]
[5, 6]
5678ns
3333ns
5678ns
CE LOW to Power-Up0000ns
CE HIGH to Power-Down12121520ns
Byte enable to Data Valid5679ns
Byte enable to Low Z0000ns
Byte disable to High Z5679ns
[7]
Write Cycle Time10121512ns
CE LOW to Write End891012ns
Address Set-Up to Write End781012ns
Address Hold from Write End0000ns
Address Set-Up to Write Start0000ns
WE Pulse Width781012ns
Data Set-Up to Write End561010ns
Data Hold from Write End0000ns
WE HIGH to Low Z
WE LOW to High Z
[6]
[5, 6]
3333ns
5679ns
Byte enable to end of write78912ns
and 30-pF load c apacitan ce.
, t
, t
HZBE
HZCE
, and t
are specified w ith a load ca pacit ance of 5 pF as in part (b ) of AC Test Loads. Transition is meas ured ±500 mV from steady-stat e voltage.
HZWE
HZCE
is less than t
, t
LZCE
is less than t
HZOE
LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a write,
LZOE
, and t
HZWE
is less than t
for any given device.
LZWE
UnitMin.Max.Min.Max.Min.Max.Min. Max.
Document #: 38-05058 Rev. **Page 4 of 10
Switching Waveforms
CY7C1020
Read Cycle No. 1
[8, 9]
ADDRESS
DATA OUT
PREVIOUS DATA VALIDDATA VALID
Read Cycle No. 2(OE Controlled)
ADDRESS
CE
OE
BHE, BLE
DATA OUT
V
CC
SUPPLY
CURRENT
HIGH IMPEDANCE
t
LZCE
t
PU
[9, 10]
t
ACE
t
t
LZOE
t
DBE
t
LZBE
DOE
50%
t
OHA
t
RC
t
AA
1020-5
t
RC
t
HZOE
t
HZCE
t
DATA VALID
HZBE
t
PD
HIGH
IMPEDANCE
I
ICC
CC
50%
I
ISB
SB
1020-6
Notes:
8. Device is continuously selected. OE
9. WE
is HIGH for read cycle .
10. Address valid prior to or coincident with CE
, CE, BHE and/or BHE = VIL.
transition LOW .
Document #: 38-05058 Rev. **Page 5 of 10
Switching Waveforms (continued)
CY7C1020
Write Cycle No. 1 (CE Controlled)
ADDRESS
t
CE
WE
BHE, BLE
DATAI/O
SA
[11, 12]
t
AW
t
WC
t
SCE
t
PWE
t
BW
t
HA
t
SD
t
HD
1020-7
Write Cycle No. 2 (BLEorBHE Controlled)
ADDRESS
t
,BLE
BHE
WE
CE
DATAI/O
Notes:
11. Data I/O is high impedance if OE
12. If CE
goes HIGH simultaneousl y with WE going HIGH, the o utput remains in a hig h-imped ance stat e.