Cypress Semiconductor CY7C038-20AI, CY7C038-20AC, CY7C038-15AI, CY7C028-20AI, CY7C028-20AC Datasheet

...
PRELIMINARY
32K/64K x 16/18
Dual-Port Static RAM
CY7C027/028 CY7C037/038
Cypress Semiconductor Corporation
3901 North First Street San Jose CA 95134 408-943-2600 November 23
1998
1
Features
• T rue Dual-Ported memory cells which allow si m ulta­neous access of the same memory locat ion
• 32K x 16 organization (CY7C027)
• 64K x 16 organization (CY7C028)
• 32K x 18 organization (CY7C037)
• 64K x 18 organization (CY7C038)
• 0.35-micron CMOS for optimum speed/power
• High-speed access: 12
[1]
/15/20 ns
• Low operat i n g power
Active: I
CC
= 180 mA (typical)
—Standby: I
SB3
= 0.05 mA (typical)
• Fully asynchronous operation
• Automatic power-down
• Expandabl e data bus to 32/36 bits or more using Mas­ter/Slave chip sel ect when using more than one device
• On-chip arbitration logic
• Semaphores inc luded to permit software handshak ing between ports
•INT flags f or port-to-port communication
• Separate upper-byte and lower-byte cont rol
• Dual Chip Enables
• Pin select for Master or Slave
• Commercial and industrial temperature ranges
• Available in 100-pin TQFP
• Pin-compatible and functionally equivalent to IDT7027
Notes:
1. See page 6 for Load Conditions.
2. I/O
8
–I/O15 for x16 devices; I/O9–I/O17 for x18 devices.
3. I/O
0
–I/O7 for x16 devices; I/O0–I/O8 for x18 dev ices.
4. A
0–A14
for 32K; A0–A15 for 64K devices.
5. BUSY
is an output in master mode and an input in slave mode.
R/W
L
CE
0L
CE
1L
OE
L
I/O
8/9L
–I/O
15/17L
I/O
Control
Address
Decode
A
0L–A14/15L
CE
L
OE
L
R/W
L
BUSY
L
I/O
Control
CE
L
Interrupt
Semaphore
Arbitration
SEM
L
INT
L
M/S
UB
L
LB
L
I/O0L–I/O
7/8L
R/W
R
CE
0R
CE
1R
OE
R
I/O
8/9L
–I/O
15/17R
CE
R
UB
R
LB
R
I/O0L–I/O
7/8R
UB
L
LB
L
Logic Block Diagram
A0L–A
14/15L
True Dual-Ported
RAM Array
A0R–A
14/15R
CE
R
OE
R
R/W
R
BUSY
R
SEM
R
INT
R
UB
R
LB
R
Address
Decode
A
0R–A14/15R
[2]
[2]
[3]
[3]
[4]
[4]
[5]
[5]
[4] [4]
15/16
8/9
8/9
15/16
8/9
8/9
15/16 15/16
For the most recent information, visit the Cypress web site at www.cypress.com
CY7C027/028
CY7C037/038
PRELIMINARY
2
Functional Description
The CY7C027/028 and CY7C037/038 are low-power CMOS 32K, 64K x 16/18 dual-port static RAMs. Various arbitration schemes are included on the devices to handle situations when multipl e proces sors acc ess t he sam e piece of data. Two ports are provided , pe rmitting i ndep endent, asynchr onous ac­cess for reads and writes to any location in m emory. The de­vices can be utilized as standalone 16/18-bit dual-port static RAMs or multip le devi ces can b e combined in o rder to funct ion as a 32/36-bit or wider master/slave dual-port static RAM. An M/S
pin is provided for implementing 32/36-bit or wider mem­ory applications without the need for separate master and slave devices or additional discrete logic. Application areas include interprocessor/multiprocessor designs, communica­tions status buffering, and dual-port video/graphics memory.
Each port has independent control pins: dual chip enables (CE
0
and CE1), read or write enable (R/W), and output enable
(OE
). Two flags are provided on each port (BUSY and INT). BUSY signals that the port is tryi ng to access the same location currently being accessed by the ot her port. Th e interrupt flag (INT
) permits communication between ports or systems by means of a mail box. The semaphores are used to pass a flag, or token, from one port to the other to indicate that a shared resource is in use. The semaphore logic is comprised of eight shared latches. Only one side can control the latch (semaphore) at any time. Control of a semaphore indicates that a shared resource is in use. An automatic power-down feature is controlled independently on each port by the chip enable pins.
The CY7C027/028 and CY7C03 7/0 38 are a v ail abl e in 100 -pin Thin Quad Plastic Flatpack (TQFP) packages.
Pin Configurations
100- Pin TQ FP (Top View)
Note:
6. This pin is NC for CY7C027.
1
3
2
92 91 90 848587 868889 83 82 81 7678 77798093949596979899100
59
60
61
67 66
64
65
63 62
68
69
70
75
73
74
72 71
A9R A10R A11R A12R A13R A14R
UBR
NC
LBR
CE1R SEMR
OER GND
NC
A15R
GND R/WR
GND I/O15R I/O14R I/O13R I/O12R I/O11R I/O10R
CE0R
58 57 56 55 54 53 52 51
CY7C02 7 (32K x 16)
A9L A10L A11L A12L A13L A14L
UBL
NC
LBL
CE1L
SEML
OEL
GND
NC
A15L
VCC
R/WL
GND I/O15L I/O14L I/O13L I/O12L I/O11L I/O10L
CE0L
17
16
15
9 10
12
11
13 14
8
7
6
4 5
18 19 20 21 22 23 24 25
A8L
A7L
A6L
A5L
A4L
A3L
INTL
A1L
NC
GND
M/S
A0R
A1R
A0L
A2L
BUSYR
INTR
A2R
A3R
A4R
A5R
A6R
A7R
A8R
BUSYL
34 35 36 424139 403837 43 44 45 5048 494746
NC
I/O9R
I/O8R
I/O7R
VCC
I/O6R
I/01R
I/O4R
I/O2R
GND
I/O0L
I/O2L
I/O3L
I/O3R
I/O5R
I/O1L
GND
I/O4L
I/O5L
I/O6L
I/O7L
VCC
I/O8L
I/O9L
I/O0R
3332313029282726
CY7C02 8 (64K x 16)
[Note 6]
[Note 6]
CY7C027/028
CY7C037/038
PRELIMINARY
3
Pin Configurations
(continued)
100- Pin TQ FP (Top View)
Note:
7. This pin is NC for CY7C037.
Selection Guide
CY7C027/028 CY7C037/038
-12
[1]
CY7C027/028 CY7C037/038
-15
CY7C027/028 CY7C037/038
-20
Maximum Access Time (ns) 12 15 20 Typical Operating Current (mA) 195 190 180 Typical Standby Current for I
SB1
(mA) (Both ports TTL lev el) 55 50 45
Typical Standby Curren t for I
SB3
(mA) (Both ports CMOS level) 0.05 0.05 0.05
1
3
2
92 91 90 848587 868889 83 82 81 7678 77798093949596979899100
59
60
61
67 66
64
65
63 62
68
69
70
75
73
74
72 71
A8R A9R A10R A11R A12R A13R
CE0R
A15R
UBR
SEMR R/WR
GND I/O17R
LBR
A14R
GND OER
GND I/O16R I/O15R I/O14R I/O13R I/O12R I/O11R
CE1R
58 57 56 55 54 53 52 51
CY7C03 7 (32K x 18)
A9L A10L A11L A12L A13L A14L
CE1L
LBL
CE0L
R/WL
OEL
I/O17L I/O16L
UBL
A15L
VCC GND
GND I/O15L I/O14L I/O13L I/O12L I/O11L I/O10L
SEML
17
16
15
9 10
12
11
13 14
8
7
6
4 5
18 19 20 21 22 23 24 25
A8L
A7L
A6L
A5L
A4L
A3L
BUSYL
A1L
INTL
GND
VCC
INTR
A0R
A0L
A2L
M/S
BUSYR
A1R
A2R
A3R
A4R
A5R
A6R
A7R
GND
34 35 36 424139 403837 43 44 45 5048 494746
I/O10R
I/O9R
I/O8R
I/O7R
VCC
I/O6R
I/01R
I/O4R
I/O2R
GND
I/O0L
I/O2L
I/O3L
I/O3R
I/O5R
I/O1L
GND
I/O4L
I/O5L
I/O6L
I/O7L
VCC
I/O8L
I/O9L
I/O0R
3332313029282726
CY7C03 8 (64K x 18)
[Note 7]
[Note 7]
CY7C027/028
CY7C037/038
PRELIMINARY
4
Maximum Ratings
(Above which the useful life may be impaired. For user guide­lines, not tested.)
Storage Temperat ure ............ ................. ....–65
°
C to +150°C
Ambient Temperature wit h
Power Applied.............................................–55
°
C to +125°C
Supply Voltage to Ground Potential...............–0. 3V to +7.0V
DC V oltage Applied to Outputs
in High Z State............................................ –0.5V to +7.0DC
Input Voltage
[8]
............................................... –0.5V to +7.0V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage ....................... ................... >1100V
Latch-Up Current............................. ................. ...... >200 mA
Note:
8. Pulse width < 20 ns.
Pin Definitions
Left Port Right Port Description
CE0L, CE
1L
CE0R, CE
1R
Chip Enable (CE is LOW when CE0 VIL and CE1 VIH)
R/W
L
R/W
R
Read/Write Enable
OE
L
OE
R
Output Enable
A0L–A
15L
A0R–A
15R
Address (A0–A14 for 32K ; A0–A15 for 64K devices)
I/O0L–I/O
17L
I/O0R–I/O
17R
Data Bus Input/Output (I/O0–I/O15 for x16 devices; I/O0–I/O17 for x18)
SEML SEM
R
Semaphore Enable
UB
L
UB
R
Upper Byte Select (I/ O8–I/O15 for x1 6 de v ices; I/O9–I/O17 for x18 devi ces)
LB
L
LB
R
Lower Byte Select (I/ O0–I/O7 for x16 devices; I/O0–I/O8 for x18 devices)
INT
L
INT
R
Interrupt Flag
BUSY
L
BUSY
R
Busy Flag M/S Master or Slave Select V
CC
Power GND Ground NC No Connect
Operating Range
Range
Ambient
Temperature
V
CC
Commercial 0°C to +70°C 5V ± 10% Industrial –40°C to +85°C 5V ± 10%
Shaded area contains advance information.
CY7C027/028
CY7C037/038
PRELIMINARY
5
Shaded area contains advance information.
Note:
9. f
MAX
= 1/tRC = All inputs c ycling at f = 1/tRC (except output enab le) . f = 0 mea ns no add ress or contr ol li nes change . T his appl ies only to i nputs at C MOS le v el s tandb y I
SB3
.
Electrical Characteristics
Over the Ope rating Range
Symbol Parameter
CY7C027/028 CY7C037/038
Units
-12
[1]
-15 -20
Min Typ Max Min Typ Max Min Typ Max
V
OH
Output HIGH Voltage (VCC=5V) 2.4 2.4 2.4 V
V
OL
Output LOW Voltage 0.4 0.4 0.4 V
V
IH
Input HIGH Voltage 2. 2 2.2 2.2 V
V
IL
Input LOW Voltage 0.8 0.8 0.8 V
I
OZ
Output Leakage Current –10 10 –10 10 –10 10 µA
I
CC
Operating Curr ent (V
CC
=Max, I
OUT
=0 mA)
Outputs Disabled
Com’l. 195 325 190 280 180 265 mA
Indust. 215 305 305 290 mA
I
SB1
Standby Current (Both Ports TTL Le vel) CE
L
& CER
V
IH
, f=f
MAX
Com’l. 55 75 50 70 45 65 mA
Indust. 65 95 60 80 mA
I
SB2
Standby Current (One Port TTL Lev el) CE
L
| CER ≥ VIH,
f=f
MAX
Com’l. 125 205 120 180 110 160 mA
Indust. 135 205 125 175 mA
I
SB3
Standby Current (Both Ports CMOS Level) CE
L
&
CE
R
V
CC
– 0.2V, f=0
Com’l. 0.05 0.25 0.05 0.25 0.05 0.25 mA
Indust. 0.05 0.25 0.05 0.25 mA
I
SB4
Standby Current (One Port CMOS Level) CE
L
| CER
V
IH
, f=f
MAX
[9]
Com’l. 115 185 110 160 100 140 mA
Indust. 125 175 115 155 mA
CY7C027/028
CY7C037/038
PRELIMINARY
6
AC Test Loads (Applicable to -12 only)
[11]
Notes:
10. Tested initially and after any design or process changes that may affect these parameters.
11. Test Conditions: C = 0 pF.
Capacitance
[10]
Parameter Description Test Conditions Max. Unit
C
IN
Input Capacitance TA = 25°C, f = 1 MHz,
V
CC
= 5.0V
10 pF
C
OUT
Output Capacitance 10 pF
AC Test Loads and Waveforms
3.0V GND
90%
90%
10%
3ns
3
ns
10%
ALL INPUT PULSES
(a) Normal Load( Load 1)
R1= 893
5V
OUTPUT
R2= 347
C= 30
pF
V
TH
=1.4V
OUTPUT
C=
30 pF
(b) Thévenin Equivalent (Load 1)
(c)Three-State Delay(Load 2)
R1= 893
R2= 347
5V
OUTPUT
C= 5pF
R
TH
=250
(Used for t
CKLZ
, t
OLZ
, & t
OHZ
including scope and jig)
VTH=1.4V
OUTPUT
C
(a) Load 1 (-12 only)
R = 50
(b) Load Derating Curve
Capacitance
(pF)
(ns) for al l -12 access times
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
0 5 10 15 20 25 30
Z0 = 50
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