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Cypress Semiconductor
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User Manual
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Cypress Semiconductor 4008 User Manual

PRELIMINARY
CYBLE-214009-00
EZ-BLE
TM
PSoC® Module

General Description

The Cypress CYBLE-214009-00 is a fully certified and qualified module supporting Bluetooth
Low Energy (BLE) wireless communication. The CYBLE-214009-00 is a turnkey solution and includes onboard crystal oscillators, trace antenna, passive components, and the Cypress PSoC
®
PSoC
4 BLE datasheet for additional details on the capabilities
®
of the PSoC
4 BLE device used on this module.
®
4 BLE. Refer to the
The EZ-BLETM PSoC® module is a scalable and reconfigurable platform architecture. It combines programmable and reconfigurable analog and digital blocks with flexible automatic routing. The CYBLE-214009-00 also includes digital programmable logic, high-performance analog-to-digital conversion (ADC), opamps with comparator mode, and standard communication and timing peripherals.
The CYBLE-214009-00 includes a royalty-free BLE stack compatible with Bluetooth 4.1 and provides up to 25 GPIOs in a small 11 × 11 × 1.80 mm package.
The CYBLE-214009-00 is a complete solution and an ideal fit for applications seeking a highly integrated BLE wireless solution.
CYBLE-214009-00 is drop-in compatible CYBLE-014008-00.

Module Description

n Module size: 11.0 mm × 11.0 mm × 1.80 mm (with shield)
n Bluetooth 4.1 single-mode module
n Industrial temperature range: –40 °C to +85 °C
n 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
n 256-KB flash memory, 32-KB SRAM memory
n Watchdog timer with dedicated internal low-speed oscillator
(ILO)
n Two-pin SWD for programming
n Up to 25 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z analog, HI-Z digial, or strong output
n Certified to FCC, CE, MIC, KC, and IC regulations
n Bluetooth SIG 4.1 qualified

Power Consumption

n TX output power: –18 dbm to +3 dbm
n Received signal strength indicator (RSSI) with 1-dB resolution
n TX current consumption of 15.6 mA (radio only, 0 dbm)
n RX current consumption of 16.4 mA (radio only)
n Low power mode support
p Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on p Hibernate: 150 nA with SRAM retention p Stop: 60 nA with XRES wakeup
Revised October 29, 2015

Programmable Analog

n Four opamps with reconfigurable high-drive external and
high-bandwidth internal drive, comparator modes, and ADC input buffering capability; can operate in Deep-Sleep mode.
n 12-bit, 1-Msps SAR ADC with differential and single-ended
modes; channel sequencer with signal averaging
n Two current DACs (IDACs) for general-purpose or capacitive
sensing applications on any pin
n One low-power comparator that operate in Deep-Sleep mode

Programmable Digital

n Four programmable logic blocks called universal digital blocks,
(UDBs), each with eight macrocells and datapath
n Cypress-provided peripheral Component library, user-defined
state machines, and Verilog input

Capacitive Sensing

n Cypress CapSense Sigma-Delta (CSD) provides best-in-class
SNR (> 5:1) and liquid tolerance
n Cypress-supplied software component makes
capacitive-sensing design easy
n Automatic hardware-tuning algorithm (SmartSense™)

Segment LCD Drive

n LCD drive supported on all GPIOs (common or segment) n Operates in Deep-Sleep mode with four bits per pin memory

Serial Communication

n Two independent runtime reconfigurable serial communication
blocks (SCBs) with I
2
C, SPI, or UART functionality

Timing and Pulse-Width Modulation

n Four 16-bit timer, counter, pulse-width modulator (TCPWM)
blocks
n Center-aligned, Edge, and Pseudo-random modes n Comparator-based triggering of Kill signals for motor drive and
other high-reliability digital logic applications

Up to 25 Programmable GPIOs

n Any GPIO pin can be CapSense, LCD, analog, or digital n Two overvoltage-tolerant (OVT) pins; drive modes, strengths,
and slew rates are programmable
PRELIMINARY
CYBLE-214009-00

Contents

Overview............................................................................ 3
Module Description...................................................... 3
Pad Connection Interface ................................................ 5
Recommended Host PCB Layout ................................... 6
Power Supply Connections and Recommended External
Components.................................................................... 10
Connection Options................................................... 10
External Component Recommendation .................... 10
Critical Components List ........................................... 13
Antenna Design......................................................... 13
Electrical Specification .................................................. 14
GPIO ......................................................................... 16
XRES......................................................................... 17
Analog Peripherals .................................................... 17
Digital Peripherals ..................................................... 21
Serial Communication ............................................... 23
Memory ..................................................................... 24
System Resources .................................................... 24
Environmental Specifications ....................................... 30
Environmental Compliance ....................................... 30
RF Certification.......................................................... 30
Environmental Conditions ......................................... 30
ESD and EMI Protection ........................................... 30
Regulatory Information.................................................. 31
FCC........................................................................... 31
Industry Canada (IC) Certification............................. 32
European R&TTE Declaration of Conformity ............ 32
MIC Japan................................................................. 33
KC Korea................................................................... 33
Ordering Information...................................................... 34
Part Numbering Convention...................................... 34
Acronyms........................................................................ 35
Document Conventions ................................................. 37
Units of Measure ....................................................... 37
Errata ............................................................................... 38
Document History Page................................................. 39
Sales, Solutions, and Legal Information...................... 40
Worldwide Sales and Design Support....................... 40
Products .................................................................... 40
PSoC® Solutions ...................................................... 40
Cypress Developer Community................................. 40
Technical Support ..................................................... 40
Document Number: 002-09714 Rev. ** Page 2 of 40
PRELIMINARY
CYBLE-214009-00

Overview

Module Description

The CYBLE-214009-00 module is a complete module designed to be soldered to the main host board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE module functionality. Such selections will guarantee that all height restrictions of the component area are maintained. Designs should be completed with the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm).
Table 1. Module Design Dimensions
Dimension Item Specification
Module dimensions
Antenna location dimensions
PCB thickness Height (H) 0.80 ± 0.10 mm Shield height Height (H) 1.00 ± 0.10 mm Maximum component height Height (H) 1.00 mm typical (shield) Total module thickness (bottom of module to highest component) Height (H) 1.80 mm typical
See Figure 1 on page 4 for the mechanical reference drawing for CYBLE-214009-00.
Length (X) 11.00 ± 0.15 mm
Width (Y) 11.00 ± 0.15 mm
Length (X) 11.00 ± 0.15 mm
Width (Y) 4.62 ± 0.15 mm
Document Number: 002-09714 Rev. ** Page 3 of 40
PRELIMINARY
CYBLE-214009-00
Figure 1. Module Mechanical Drawing
Top View
Side View
Bottom View
Note
1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see Figure 3 and Figure 4 on page 6.
Document Number: 002-09714 Rev. ** Page 4 of 40
PRELIMINARY
CYBLE-214009-00

Pad Connection Interface

As shown in the bottom view of Figure 1 on page 4, the CYBLE-214009-00 connects to the host board via solder pads on the back of the module. Tab l e 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-214009-00 module.
Table 2. Solder Pad Connection Description
Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch
SP 32 Solder Pads
Pad9/Pad24: 0.74 mm
All Others: 0.79 mm
Figure 2. Solder Pad Dimensions
0.41 mm 0.66 mm
Document Number: 002-09714 Rev. ** Page 5 of 40
PRELIMINARY
CYBLE-214009-00

Recommended Host PCB Layout

Top View (On Host PCB)
Host PCB Keep-Out Area Around Trace Antenna
Figure 3 details the recommended PCB layout pattern for the host PCB. Dimensions are in mm.
Figure 3. Recommended PCB Layout Pattern for CYBLE-214009-00
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress BLE module is in a corner of the host board with the antenna located on the edge of the host board. This placement minimizes the additional recommended keep-out area stated in item 2.
2. It is recommended that the area around the Cypress BLE module trace antenna should contain an additional keep-out area, where no grounding or signal traces are contained. The keep-out area applies to all layers of the host board. The recommended dimensions of the host PCB keep-out area are shown in Figure 4 (dimensions are in mm).
Figure 4. Recommended Host PCB Keep-Out Area Around the CYBLE-214009-00 Trace Antenna
Document Number: 002-09714 Rev. ** Page 6 of 40
PRELIMINARY
CYBLE-214009-00
Ta bl e 3 details the solder pad pitch (center-to-center) for each of the neighboring connections.
Table 3. Module Solder Pad Connection Dimensions
Pad X Pad Y Pad Pitch (Pad X - Pad Y) Comments
Bottom Right Corner 1 4.83 mm Distance from bottom right corner to Pad 1 center
1 2 0.66 mm Distance from Pad 1 center to Pad 2 center 2 3 0.66 mm Distance from Pad 2 center to Pad 3 center 3 4 0.66 mm Distance from Pad 3 center to Pad 4 center 4 5 0.66 mm Distance from Pad 4 center to Pad 5 center 5 6 0.66 mm Distance from Pad 5 center to Pad 6 center 6 7 0.66 mm Distance from Pad 6 center to Pad 7 center 7 8 0.66 mm Distance from Pad 7 center to Pad 8 center 8 9 0.66 mm Distance from Pad 8 center to Pad 9 center
Top Right Corner 10 1.21 mm Distance from Pad 9 center to Pad 10 center
10 11 0.66 mm Distance from Pad 10 center to Pad 11 center 11 12 0.66 mm Distance from Pad 11 center to Pad 12 center 12 13 0.66 mm Distance from Pad 12 center to Pad 13 center 13 14 0.66 mm Distance from Pad 13 center to Pad 14 center 14 15 0.66 mm Distance from Pad 14 center to Pad 15 center 15 16 0.66 mm Distance from Pad 15 center to Pad 16 center 16 17 0.66 mm Distance from Pad 16 center to Pad 17 center 17 18 0.66 mm Distance from Pad 17 center to Pad 18 center 18 19 0.66 mm Distance from Pad 18 center to Pad 19 center 19 20 0.66 mm Distance from Pad 19 center to Pad 20 center 20 21 0.66 mm Distance from Pad 20 center to Pad 21 center 21 22 0.66 mm Distance from Pad 21 center to Pad 22 center 22 23 0.66 mm Distance from Pad 22 center to Pad 23 center
Top Left Corner 24 0.89 mm Distance from Top Left Corner to Pad 24 center
24 25 0.66 mm Distance from Pad 24 center to Pad 25 center 25 26 0.66 mm Distance from Pad 25 center to Pad 26 center 26 27 0.66 mm Distance from Pad 26 center to Pad 27 center 27 28 0.66 mm Distance from Pad 27 center to Pad 28 center 28 29 0.66 mm Distance from Pad 28 center to Pad 29 center 29 30 0.66 mm Distance from Pad 29 center to Pad 30 center 30 31 0.66 mm Distance from Pad 30 center to Pad 31 center 31 32 0.66 mm Distance from Pad 31 center to Pad 32 center 32 Bottom Left Corner 4.83 mm Distance from Pad 32 center to Bottom Left Corner
Document Number: 002-09714 Rev. ** Page 7 of 40
PRELIMINARY
CYBLE-214009-00
Ta bl e 4 and Ta bl e 5 detail the solder pad connection definitions and available functions for each connection pad. Table 4 lists the
Notes
2. TCPWM stands for timer, counter, and PWM. If supported, the pad can be configured to any of these peripheral functions.
3. The main board needs to connect both GND connections (Pad 1 and Pad 32) on the module to the common ground of the system.
solder pads on CYBLE-214009-00, the BLE device port-pin, and denotes whether the digital function shown is available for each solder pad. Tab le 5 denotes whether the analog function shown is available for each solder pad. Each connection is configurable for a single option shown with a
3.
Table 4. Digital Peripheral Capabilities
Pad
Number
Device
Port Pin
1GND 2P1.1 3P1.0 3(TCPWM0) 333 4P1.53(SCB0_TX) 3(SCB0_MISO) 3(SCB0_SCL) 3(TCPWM2) 333 5P0.13(SCB1_TX) 3(SCB1_MISO) 3(SCB1_SCL) 3(TCPWM0) 333 6P0.73(SCB0_CTS) 3(SCB0_SCLK) 3(TCPWM2) 33
7 VDD Digital Power Supply Input (1.71 to 5.5V) 8P1.4
9P0.43(SCB0_RX) 3(SCB0_MOSI) 3(SCB0_SDA) 3(TCPWM1) 333 3 10 P0.5 3(SCB0_TX) 3(SCB0_MISO) 3(SCB0_SCL) 3(TCPWM1) 333 11 P0 .6 3(SCB0_RTS) 3(SCB0_SS0)
12 P1.2 3(SCB1_SS2) 3(TCPWM1) 333 13 V 14 P2.6 15 P1.3 3(SCB1_SS3) 3(TCPWM1) 333 16 P3.0 3(SCB0_RX) 3(SCB0_SDA) 3(TCPWM0) 333 17 P2.1 3(SCB0_SS2) 333 18 P2.2 3(SCB0_SS3) 333 19 P2.3 33 3 3 20 VDDA Analog Power Supply Input (1.71 to 5.5V) 21 P3.4 22 P3.1 3(SCB0_TX) 3(SCB0_SCL) 3(TCPWM0) 333 23 P3.7 3(SCB1_CTS) 3(TCPWM3) 33 3 3 24 P3.5 3(SCB1_TX) 3(SCB1_SCL) 3(TCPWM2) 333 25 P3.3 3(SCB0_CTS) 3(TCPWM1) 333 26 VREF Reference Voltage Input 27 P3.2 28 P3.6 3(SCB1_RTS) 3(TCPWM3) 333 29 XRES External Reset Hardware Connection Input 30 P2.4 31 P2.5 333 32 GND Ground Connection
[3]
DDR
UART SPI I2C TCPWM
Ground Connection
3(SCB1_SS1) 3(TCPWM0) 333
3(SCB0_RX) 3(SCB0_MOSI) 3(SCB0_SDA) 3(TCPWM2) 333
3(TCPWM2) 333
Radio Power Supply (1.9V to 5.5V)
3(SCB1_RX) 3(SCB1_SDA) 3(TCPWM2) 333
3(SCB0_RTS) 3(TCPWM1) 333
Cap-
[2]
Sense
WCO
Out
ECO
LCD SWD GPIO
OUT
(SWDCLK)
3
3
3
(SWDIO)
333
333
Document Number: 002-09714 Rev. ** Page 8 of 40
PRELIMINARY
CYBLE-214009-00
.
Table 5. Analog Peripheral Capabilities
Pad Number Device Port Pin SARMUX OPAMP LPCOMP
1GND 2P1.1 3P1.0 4P1.5 5P0.1 6P0.7 7 VDD Digital Power Supply Input (1.71 to 5.5V) 8P1.4
9P0.4 10 P0.5 11 P0 .6 12 P1.2 13 V 14 P2.6 15 P1.3 16 P3.0 17 P2.1 3(CTBm1_OA0_INN) 18 P2.2 19 P2.3 20 VDDA Analog Power Supply Input (1.71 to 5.5V) 21 P3.4 22 P3.1 3 23 P3.7 3 24 P3.5 3 25 P3.3 3 26 VREF Reference Voltage Input (Optional) 27 P3.2 28 P3.6 3 29 XRES External Reset Hardware Connection Input 30 P2.4 31 P2.5 32 GND Ground Connection
DDR
[3]
Ground Connection
3(CTBm1_OA0_INN) 3(CTBm1_OA0_INP) 3(CTBm1_OA1_INP)
3(COMP0_INN)
3(CTBm1_OA1_INN)
3(COMP1_INP) 3(COMP1_INN)
3(CTBm1_OA0_OUT)
Radio Power Supply (1.9V to 5.5V)
3(CTBm1_OA0_INP)
3(CTBm1_OA1_OUT)
3
3(CTBm1_OA0_OUT) 3(CTBm1_OA1_OUT)
3
3
3(CTBm1_OA1_INN) 3(CTBm1_OA1_INP)
Document Number: 002-09714 Rev. ** Page 9 of 40
PRELIMINARY
CYBLE-214009-00

Power Supply Connections and Recommended External Components

Three Ferrite Bead Option
Single Ferrite Bead Option
Power Connections
The CYBLE-214009-00 contains three power supply connec­tions, VDD, VDDA, and VDDR. The VDD and VDDA connections supply power for the digital and analog device operation respec­tively. VDDR supplies power for the device radio.
VDD and VDDA accept a supply range of 1.71 V to 5.5 V. VDDR accepts a supply range of 1.9 V to 5.5 V. These specifications can be found in Ta b l e 1 0 . The maximum power supply ripple for both power connections on the module is 100 mV, as shown in
Ta bl e 8.
The power supply ramp rate of VDD and VDDA must be equal to or greater than that of VDDR when the radio is used.

Connection Options

Two connection options are available for any application:
1. Single supply: Connect VDD, VDDA, and VDDR to the same supply.
2. Independent supply: Power VDD, VDDA, and VDDR separately.
Figure 5. Recommended Host Schematic Options for a Single Supply Option

External Component Recommendation

In either connection scenario, it is recommended to place an external ferrite bead between the supply and the module connection. The ferrite bead should be positioned as close as possible to the module pin connection.
Figure 5 details the recommended host schematic options for a
single supply scenario. The use of one or two ferrite beads will depend on the specific application and configuration of the CYBLE-214009-00.
Figure 6 details the recommended host schematic for an
independent supply scenario.
The recommended ferrite bead value is 330 Ω, 100 MHz. (Murata BLM21PG331SN1D).
Document Number: 002-09714 Rev. ** Page 10 of 40
PRELIMINARY
CYBLE-214009-00
Figure 6. Recommended Host Schematic for an Independent Supply Option
Document Number: 002-09714 Rev. ** Page 11 of 40
PRELIMINARY
CYBLE-214009-00
The CYBLE-214009-00 schematic is shown in Figure 7.
Figure 7. CYBLE-214009-00 Schematic Diagram
Document Number: 002-09714 Rev. ** Page 12 of 40
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