Cypress Semiconductor 3058 Users Manual

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

EZ-BT Module

CYBT-223058-02, EZ-BT Module

General Description

The CYBT-2x305x-02 is a dual-mode Bluetooth BR/EDR and Low Energy (BLE) wireless module solution. The CYBT-223058-02
includes an onboard crystal oscillator, passive components, and the Cypress CYW20819 silicon device. The CYBT-253059-02
includes an onboard crystal oscillator, passive components, and the Cypress CYW20820 silicon device.

The CYBT-2x305x-02 supports a number of peripheral functions (ADC, PWM), as well as multiple serial communication protocols
(UART, SPI, I
× 1.70 mm module form-factor.

The CYBT-2x305x-02 includes 256 KB of on-chip flash memory and is designed for standalone operation. The CYBT-2x305x-02 uses
an integrated power amplifier to achieve Class I or Class II output power capability.

The CYBT-2x305x-02 includes an integrated chip antenna, is qualified by Bluetooth SIG, and includes regulatory certification approval
for FCC, ISED, MIC, and CE.

2

C, I2S/PCM). The CYBT-2x305x-02 includes a royalty-free stack compatible with Bluetooth 5.0 in a small 11.0 ×11.00

Module Description

■ Module size: 11.00 mm × 11.00 mm × 1.70 mm

■ Complies with Bluetooth Core Specification version 5.0 and

includes support for BR, EDR 2/3 Mbps, eSCO, BLE, LE
2 Mbps, as well as Bluetooth Mesh.

❐ QDID: TBD
❐ Declaration ID: TBD

■ Certified to FCC, ISED, MIC, and CE standards

■ 256-KB on-chip Flash, 176-KB on-chip RAM

■ Industrial temperature range: –30 °C to +85 °C

■ Integrated Arm

®

Cortex®-M4 microprocessor core with

floating point unit (FPU)

RF Characteristics

■ Maximum TX output power: +4.0 dBm (CYBT-223058-02);

+10.5 dBm (CYBT-253059-02)

■ BLE RX Receive Sensitivity: –94.5 dBm

Power Consumption

■ TX current consumption
❐ BLE silicon: 5.8 mA (radio only, 4 dBm) (CYBT-223058-02);

22 mA (radio only, 10.5 dBm) (CYBT-253059-02)

■ RX current consumption
❐ Bluetooth silicon: 5.9 mA (radio only)

■ Cypress CYW20819/20 silicon low power mode support
❐ PDS: 16.5 µA with 176 KB RAM retention
❐ ePDS: 8.7 µA

❐ HIDOFF (wake on external or timed interrupt): 1.75 µA

Functional Capabilities

■ Up to 22 GPIOs

2

■ I

C, I2S, UART, and PCM interfaces

■ Two Quad-SPI interfaces

■ Auxiliary ADC with up to 15 analog channels

■ Programmable key scan 20 × 8 matrix

■ General-purpose timers and six PWMs

■ Real-time clock (RTC) and watchdog timers (WDT)

■ Bluetooth Basic Rate (BR) and Enhanced Data Rate (EDR)

Support

■ BLE protocol stack supporting generic access profile (GAP)

Central, Peripheral, Observer, or Broadcaster roles

Benefits

CYBT-2x305x-02 is fully integrated and certified solution that
provides all necessary components required to operate
Bluetooth communication standards.

■ Proven hardware design ready to use

■ Ultra-flexible supermux I/O design allows maximum flexibility

for GPIO function assignment

■ Over-the-air update capable for development or field updates

■ Bluetooth SIG qualified.

■ ModusToolbox™ provides an easy-to-use integrated design

environment (IDE) to configure, develop, program, and test
your Bluetooth application

Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600
Document Number: 002-29172 Rev. ** Revised December 11, 2019

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

More Information

Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to
quickly and effectively integrate the module into your design.

References

■ Overview: EZ-BLE/EZ-BT Module Portfolio, Module Roadmap

■ Development Kits:
❐ CYBT-223058-EVAL, CYBT-223058-02 Evaluation Board
❐ CYBT-253059-EVAL, CYBT-253059-02 Evaluation Board

■ Test and Debug Tools:
❐ CYSmart, Bluetooth

❐ CYSmart Mobile, Bluetooth

®

LE Test and Debug Tool (Windows)

®

LE Test and Debug Tool

(Android/iOS Mobile App)

❐ Bluetooth Mesh Helper Applications, Bluetooth Mesh Helper

applications for all key platforms - Android, iOS, and Windows

■ Application Notes
❐ Mesh Application Note, Getting Started with Bluetooth Mesh

■ Knowledge Base Article
❐ KBA97095 - EZ-BLE™ Module Placement

❐ RF Regulatory Certifications for CYBT-2x305x-02 EZ-BT

WICED Modules (TBD)

❐ KBA213976 - FAQ for BLE and Regulatory Certifications with

EZ-BLE modules

❐ KBA210802 - Queries on BLE Qualification and Declaration

Processes

❐ KBA218122 - 3D Model Files for EZ-BLE/EZ-BT Modules
❐ KBA223428 - Programming an EZ-BT WICED Module
❐ KBA225450 - Putting 2073x, 2070x, and 20719 Based

Devices or Modules in HCI Mode

Development Environments

ModusToolbox Integrated Development Environment (IDE)

ModusToolbox simplifies development for IoT designers. It delivers easy-to-use tools and a familiar microcontroller (MCU) integrated

development environment (IDE) for Windows
wireless connectivity libraries, power analysis, application-specific configurators for Bluetooth

®

, macOS®, and Linux®. It provides a sophisticated environment for system setup,

®

Low Energy (BLE), CapSense®, as

well as other peripherals.
In addition, code examples, documentation, technical support and community forums are available to help your IoT development

process along. These tools and features enable an IoT designer to develop innovative IoT applications efficiently and with ease.

Technical Support

■ Cypress Community: Whether you are a customer, partner, or a developer interested in the latest Cypress innovations, the Cypress

Developer Community offers you a place to learn, share, and engage with both Cypress experts and other embedded engineers
around the world.

■ Frequently Asked Questions (FAQs): Learn more about our Bluetooth ecosystem.

■ Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States,

you can talk to our technical support team by calling our toll-free number: [phone]. Select option 2 at the prompt.

Document Number: 002-29172 Rev. ** Page 2 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Contents

Overview ............................................................................4

Functional Block Diagram ...........................................4

Module Description ......................................................4

Pad Connection Interface ................................................6

Recommended Host PCB Layout ...................................7

Module Connections ........................................................9

Connections and Optional External Components ....... 11

Power Connections (VDD) ........................................11

External Reset (XRES) ..............................................11

HCI UART Connections ............................................11

External Component Recommendation .................... 11

Critical Components List ............................................... 13

Antenna Design ..............................................................13

Bluetooth Baseband Core ............................................. 13

Power Management Unit ................................................14

Integrated Radio Transceiver ........................................15

Transmitter Path ........................................................15

Receiver Path ............................................................15

Local Oscillator ..........................................................15

Microcontroller Unit .......................................................16

External Reset ...........................................................16

32-kHz Crystal Oscillator ...........................................16

Power Modes ............................................................17

Firmware ...................................................................17

Watchdog ..................................................................17

Lockout Functionality .................................................17

True Random Number Generator .............................17

Peripherals and Communication Interfaces ................ 18

I2C .............................................................................18

HCI UART Interface ..................................................18

Peripheral UART Interface ........................................18

Serial Peripheral Interface .........................................18

Keyboard Scanner ..................................................... 18

Mouse Quadrature Signal Decoder ...........................18

ADC Port ................................................................... 19

GPIO Port ..................................................................19

PWM .......................................................................... 20

PDM Microphone .......................................................20

I2S Interface ..............................................................21

PCM Interface ...........................................................21

Electrical Characteristics ...............................................22

Current Consumption ................................................23

Silicon Core Buck Regulator ..................................... 23

Digital LDO ................................................................24

RF LDO ..................................................................... 24

PA LDO (CYBT-253059-02 only) .............................. 25

Digital I/O Characteristics ..........................................26

ADC Characteristics .................................................. 26

Chipset RF Specifications .............................................28

Timing and AC Characteristics ..................................... 31

UART Timing ............................................................. 31

SPI Timing ................................................................. 32

I2C Compatible Interface Timing ...............................33

I2S Interface Timing ..................................................34

Environmental Specifications .......................................36

Environmental Compliance .......................................36

RF Certification ..........................................................36

Safety Certification ....................................................36

Environmental Conditions .........................................36

ESD and EMI Protection ........................................... 36

Regulatory Information .................................................. 37

FCC ...........................................................................37

ISED ..........................................................................38

European Declaration of Conformity ......................... 39

MIC Japan .................................................................39

Packaging ........................................................................ 40

Ordering Information ......................................................42

Acronyms ........................................................................43

Document Conventions .................................................43

Units of Measure .......................................................43

Document History Page ................................................. 44

Sales, Solutions, and Legal Information ...................... 45

Worldwide Sales and Design Support ....................... 45

Products .................................................................... 45

PSoC® Solutions ......................................................45

Cypress Developer Community .................................45

Technical Support ..................................................... 45

Document Number: 002-29172 Rev. ** Page 3 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Overview

CYW20819/20

Silicon Device

Functional Block Diagram

Figure 1 illustrates the CYBT-2x305x-02 functional block diagram.

Figure 1. Functional Block Diagram

Note: GPIO pins shown in Figure 1 are configurable to any specified input or output function in the SuperMux table detailed in Tab l e 5 in the Module Connections section.
Note: The total number of GPIOs available on the CYBT-2x305x-02 is 22. Peripheral and/or Serial communication functions are implemented using these 22 GPIOs.

Module Description

The CYBT-2x305x-02 module is a complete module designed to be soldered to the applications main board.

Module Dimensions and Drawing

Cypress reserves the right to select components from various vendors to achieve the Bluetooth module functionality. Such selections
will still guarantee that all mechanical specifications and module certifications are maintained. The CYBT-2x305x-02 will be held within
the physical dimensions shown in the mechanical drawings in Figure 2 on page 5. All dimensions are in millimeters (mm).

Table 1. Module Design Dimensions

Dimension Item Specification

Module dimensions

Antenna location dimensions

PCB thickness Height (H) 0.50 ± 0.10 mm
Shield height Height (H) 1.20 mm typical
Maximum component height Height (H) 0.80 mm typical
Total module thickness (bottom of module to top of shield) Height (H) 1.70 mm typical

See Figure 2 for the mechanical reference drawing for CYBT-2x305x-02.

Length (X) 11.00 ± 0.15 mm

Width (Y) 11.00 ± 0.15 mm

Length (X) 6.58 mm

Width (Y) 2.50 mm

Document Number: 002-29172 Rev. ** Page 4 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Figure 2. Module Mechanical Drawing

Bottom View (Seen from Bottom)

Side View

Top View (Seen from Top)

Note

1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on the
recommended host PCB layout, see “Recommended Host PCB Layout” on page 7.

Document Number: 002-29172 Rev. ** Page 5 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Pad Connection Interface

Solder Pad Connections (Seen from Bottom)

Optional Host PCB Keep Out Area
Around PCB Antenna
(Seen from Bottom)

As shown in the bottom view of Figure 2 on page 5, the CYBT-2x305x-02 has 35 connections to a host board via solder pads (SP).

Ta bl e 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of the CYBT-2x305x-02 module.

Table 2. Connection Description

Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch

SP 35 Solder Pad 1.06 mm 0.41 mm 0.76 mm

Figure 3. Solder Pad Dimensions (Seen from Bottom)

To maximize RF performance, the host layout should follow these recommendations:

1. Antenna Area Keepout: The host board directly below the antenna area of the Cypress module (see Figure 2 on page 5) must
contain no ground or signal traces. This keep out area requirement applies to all layers of the host board.

2. Module Placement: The ideal placement of the Cypress Bluetooth module is in a corner of the host board with the PCB antenna
located at the far corner. This placement minimizes the additional recommended keep out area stated in item 3 below. Refer to

AN96841 for module placement best practices.

3. Optional Keepout: To maximize RF performance, the area immediately around the Cypress Bluetooth module PCB antenna may
contain an additional keep out area, where there are no grounding or signal traces. The keep out area applies to all layers of the
host board. The recommended dimensions of the host PCB keep out area are shown in Figure 4 (dimensions are in mm).

Figure 4. Optional Additional Host PCB Keep Out Area Around the CYBT-2x305x-02 PCB Antenna

Document Number: 002-29172 Rev. ** Page 6 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Recommended Host PCB Layout

Top View (Seen on Host PCB)

Top View (Seen on Host PCB)

Figure 5, Figure 6, Figure 7, and Ta bl e 3 provide details that can be used for the recommended host PCB layout pattern for the

CYBT-2x305x-02. Dimensions are in millimeters unless otherwise noted. Pad length of 1.06 mm (0.53 mm from center of the pad on
either side) shown in Figure 7 is the minimum recommended host pad length. The host PCB layout pattern can be completed using
either Figure 5, Figure 6, or Figure 7. It is not necessary to use all figures to complete the host PCB layout pattern.

Figure 5. CYBT-2x305x-02 Host Layout (Dimensioned) Figure 6. CYBT-2x305x-02 Host Layout (Relative to Origin)

Document Number: 002-29172 Rev. ** Page 7 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Ta bl e 3 provides the center location for each solder pad on the CYBT-2x305x-02. All dimensions are referenced to the center of the

Top View (Seen on Host PCB)

solder pad. Refer to Figure 7 for the location of each module solder pad.

Table 3. Module Solder Pad Location

Solder Pad

(Center of Pad)

1 (0.28, 0.51) (11.02, 20.08)
2 (0.28, 1.27) (11.02, 50.00)
3 (0.28, 2.03) (11.02, 79.92)
4 (0.28, 2.79) (11.02, 109.84)
5 (0.28, 3.56) (11.02, 140.16)
6 (0.28, 4.32) (11.02, 170.08)
7 (0.28, 5.08) (11.02, 200.00)
8 (0.28, 5.84) (11.02, 229.92)

9 (0.28, 6.60) (11.02, 259.84)
10 (0.28, 7.37) (11.02, 290.16)
11 (0.28, 8.13) (11.02, 320.08)
12 (0.28, 8.89) (11.02, 350.00)
13 (0.28, 9.65) (11.02, 379.92)
14 (0.93, 10.72) (36.61, 422.05)
15 (1.69, 10.72) (66.54, 422.05)
16 (2.45, 10.72) (96.46, 422.05)
17 (3.21, 10.72) (126.38, 422.05)
18 (3.98, 10.72) (156.69, 422.05)
19 (4.74, 10.72) (186.61, 422.05)
20 (5.50, 10.72) (216.54, 422.05)
21 (6.26, 10.72) (246.46, 422.05)
22 (7.02, 10.72) (276.38, 422.05)
23 (7.79, 10.72) (306.69, 422.05)
24 (8.55, 10.72) (336.61, 422.05)
25 (9.31, 10.72) (366.53, 422.05)
26 (10.07, 10.72) (396.46, 422.05)
27 (10.72, 9.65) (422.05, 379.92)
28 (10.72, 8.89) (422.05, 350.00)
29 (10.72, 8.13) (422.05, 320.08)
30 (10.72, 7.37) (422.05, 290.16)
31 (10.72, 6.60) (422.05, 259.84)
32 (10.72, 5.84) (422.05, 229.92)
33 (10.72, 5.08) (422.05, 200.00)

Location (X,Y) from

Orign (mm)

Dimension from

Orign (mils)

Table 3. Module Solder Pad Location (continued)

Solder Pad

(Center of Pad)

34 (10.72, 4.32) (422.05, 170.08)
35 (10.72, 3.56) (422.05, 140.16)

Figure 7. Solder Pad Reference Location

Location (X,Y) from

Orign (mm)

Dimension from

Orign (mils)

Document Number: 002-29172 Rev. ** Page 8 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Module Connections

Ta bl e 4 details the solder pad connection definitions and available functions for each connection pad. The GPIO connections available

on the CYBT-2x305x-02 can be configured to any of the input or output functions listed in Tab le 5 . Table 4 specifies any function that
is required to be used on a specific solder pad, and also identifies SuperMux capable GPIOs that can be configured using the
ModusToolbox device configurator.

Table 4. CYBT-2x305x-02 Solder Pad Connection Definitions

Pad Pad Name Silicon Pin Name XTALI/O ADC GPIO SuperMux Capable

1 GND GND Ground

2 VDD VDDIO Power Supply Input (1.71V ~ 3.63V)

3P32 P32 - IN7 ✓✓ see Table 5

4 XRES RST_N External Reset (Active Low)

5P27 P27 - - ✓

6P37 P37 - IN2 ✓

7 P29 P29 - IN10 ✓

8P26 P26 - - ✓

9P0 P0 - IN29 ✓

10 P1 P1 - IN28 ✓

11 P 10 P1 0 - IN 25 ✓

12 P13 P13 - IN22 ✓

13 P12 P12 - IN23 ✓

14 P11 P11 - IN24 ✓

15 P9 P9 - IN26 ✓

16 P14 P14 - IN21 ✓

17 P17 P17 - IN18 ✓

18 P5 P5 - - ✓

19 P2 P2 - - ✓

20 P3 P3 - - ✓

21 XTALI_32K XTALI_32K

22 XTALO_32K XTALO_32K

23 P8 P8 - IN27 ✓

25 P6 P6 - - ✓

26 GND GND Ground

27 P4 P4 - - ✓

28 P28 P28 - IN11 ✓

29 UART_CTS_N UART_CTS_N UART (HCI UART) Clear To Send Input Only

30 UART_RTS_N UART_RTS_N UART (HCI UART) Request To Send Output Only

31 HOST_WAKE HOST_WAKE

32 UART_RXD UART_RXD UART (HCI UART) Receive Data Only

33 UART_TXD UART_TXD UART (HCI UART) Transmit Data Only

34 DEV_WAKE DEV_WAKE A signal from the host to the CYBT-2x305x-02 module indicating that the host requires attention.

35 GND GND Ground

Note

2. The CYBT-2x305x-02 can configure GPIO connections to any Input/Output function described in Tab le 5 using the ModusToolbox Device Configurator.

External Oscillator Input

(32KHz)

External Oscillator

Output (32KHz)

A signal from the CYBT-2x305x-02 module to the host indicating that the Bluetooth device requires

-- -

-- -

attention.

✓ see Table 5

✓ see Table 524 P15 P15 - IN20 ✓

✓ see Table 5

[2]

Document Number: 002-29172 Rev. ** Page 9 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Ta bl e 5 details the available Input and Output functions that are configurable to any solder pad (in this table) that are marked as

SuperMux capable.

Table 5. GPIO SuperMux Input and Output Functions

Function Input or Output Function Type

SPI 1 Input/Output

SPI 2 Input/Output

Input Serial Communication Input

PUART

Output Serial Communication Output

2

C Input/Output

I

PCM In Input Audio Input Communication 3

PCM Out Output

2

S In Input Audio Input Communication 3

I

2

S Out Output

I

PDM Input Microphone 1 ~ 2

PWM Output Pulse Width Modulator 1 ~ 6

Serial Communication

(Master or Slave)

Serial Communication

(Master or Slave)

Serial Communication

(Master or Slave)

Audio Output

Communication

Audio Output

Communication

GPIOs

Required

4 ~ 7

4 ~ 7

4

2

3

3

Function Connection Description

SPI 1 Clock

SPI 1 Chip Select

SPI 1 MOSI

SPI 1 MISO

SPI 1 I/O 2 (Quad SPI)

SPI 1 I/O 3 (Quad SPI)

SPI 1 Interrupt

SPI 2 Clock

SPI 2 Chip Select

SPI 2 MOSI

SPI 2 MISO

SPI 2 I/O 2 (Quad SPI)

SPI 2 I/O 3 (Quad SPI)

SPI 2 Interrupt

Peripheral UART RX

Peripheral UART CTS

Peripheral UART TX

Peripheral UART RTS

I2C Clock

I2C Data

PCM Input

PCM Clock

PCM Sync

PCM Output

PCM Clock

PCM Sync

I2S DI, Data Input

I2S WS, Word Select

I2S Clock

I2S DO, Data Output

I2S WS, Word Select

I2S Clock

PDM Input Channel 1

PDM Input Channel 2

PWM Channel 0

PWM Channel 1

PWM Channel 2

PWM Channel 3

PWM Channel 4

PWM Channel 5

Document Number: 002-29172 Rev. ** Page 10 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Connections and Optional External Components

Power Connections (VDD)

The CYBT-223058-02 contains one power supply connection, VDD. VDD accepts a supply input of 1.71 V to 3.63 V. Table 12 provides
this specification. The maximum power supply ripple for this power connection is 100 mV, as shown in Ta b le 1 2 . The CYBT-253059-02
contains one power supply connection, VDD. VDD accepts a supply input of 2.6 V to 3.63 V. Table 12 provides this specification. The
maximum power supply ripple for this power connection is 100 mV, as shown in Table 12.

External Reset (XRES)

The CYBT-2x305x-02 has an integrated power-on reset circuit which completely resets all circuits to a known power-on state. This
action can also be invoked by an external reset signal, forcing it into a power-on reset state. XRES is an active-low input signal on
the CYBT-2x305x-02 module (solder pad 3). The CYBT-2x305x-02 does not require external pull-up resistors on the XRES input.
Refer to Figure 10 on page 16 for Power On and XRES operation and timing requirements during power on events.

HCI UART Connections

The recommendations in this section apply to the HCI UART (Solder Pads 29, 30, 32, and 33). For full UART functionality, all UART
signals must be connected to the Host device. If full UART functionality is not being used, and only UART RXD and TXD are desired
or capable, then the following connection considerations should be followed for UART RTS and CTS:

■ UART RTS: Can be left floating, pulled low, or pulled high. RTS is not critical for initial firmware uploading at power on.

■ UART CTS: Must be pulled low to bypass flow control and to ensure that continuous data transfers are made from the host to the

module.

External Component Recommendation

Power Supply Circuitry

It is not required to place any power supply decoupling or noise reduction circuitry on the host PCB. If desired, an external ferrite bead
between the supply and the module connection can be included. The ferrite bead should be positioned as close as possible to the
module pad connection.

If used, the recommended ferrite bead value is 330 Ω, 100 MHz. (Murata BLM21PG331SN1D).

Figure 8 illustrates the CYBT-2x305x-02 schematic.

Document Number: 002-29172 Rev. ** Page 11 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Figure 8. CYBT-2x305x-02 Schematic Diagram

P32

XRES

P27

P37

P29

P26

P0

P1

P13

P10

P12

P11

P9

P14

P17

P5

P2

P3

XTALI_32K

XTALO_32K

P8

P15

P6

P4

P28

UART_CTS_N

UART_RTS_N

HOST_WAKE

UART_RXD

UART_TXD

DEV_WAKE

VDD

Pin 1 is For Radiator Electrode
Pin 3 is For Feeding

Filter

L1 2.7nH,0201

C5

1.8pF

P0
P1
P2
P3
P4
P5
P6
P8
P9
P10
P11
P12
P13
P14
P15
P17
P26
P27
P28
P29
P32
P37

MODULE PAD ASSIGNMENT

XRES

UART_CTS_N
UART_RTS_N
UART_RXD
UART_TXD

HOST_WAKE

DEV_WAKE

LC2

5.6nH,0201

G1

C7
E6
D7
D6

D8

E7

A8

G2

1 3

C1

0.1uF

RST_N

UART_CTS_N
UART_RTS_N
UART_RXD
UART_TXD

HOST_WAKE

DEV_WAKE

ADC_AVSS

JTAG_SEL

A1

2

Antenna

C2

0.1uF

D1

VDDO2

Antenna Matching

LC1 5.6nH,0201

LC4

DNI,0201

DIGLDO_OUTVDD

C3

0.1uF

B8

VDDO1

VSSC1

VSSC3

VSSC2

E3

C6

C3

C8

VDDC1

E1

VDDC2

P10
P11
P12
P13
P14
P15
P17
P26
P27
P28
P29
P32
P37

P0
P1
P2
P3
P4
P5
P6
P8
P9

LC3

1.0pF,0201

C4

0.1uF

U1A
CYW20820_B62

D2
C1
B5
A5
C5
B4
A4
A6
A2
C2
B2
A1
B1
B3
B6
A3
D4
F1
C4
D3
F2
E2

VDD

C8

4.7uF,0402

C7

10uF,0402

H3

H2

G3

SR_PVDD

PMU_AVDD

BT_RF

H6

26

GND

P4

P28

UART_CTS_N

UART_RTS_N

HOST_WAKE

UART_RXD

UART_TXD

DEV_WAKE

GND

E4

P6

P15

RF

PMU_LDO_ONLY_STRAP

P8

P3

XTALO_32K

XTALI_32K

P2

P5

C6

1.8pF

27

35

Castellated solder pad

DIGLDO_OUT

L2

2.2uH,0603

C9

2.2uF,0201

E5

SR_VLX

RFLDO_DIGLDO_VDDIN

14

P9

P14

P17

P11

P12

13

P13

P10

P1

P0

P26

P29

P37

P27

XRES

P32

VDD

GND

1

(BOTTOM VIEW)

RFLDO_OUTCBUCK_OUT

C10

2.2uF,0201

G4

DIGLDO_VDDOUT

PMU_AVSS

F4

F7

PAVDD

PALDO_OUT

VDD

C17

C18

0.1uF

2.2uF,0201

C11

0.1uF

G5

F5

H4

RFLDO_VDDOUT

NC_0 (PALDO_VDDIN)

PAVSS

PLLVSS

IFVSS

VCOVSSG7SR_PVSS

H1

H7

G6

RFLDO_OUT

For CYBT-223058-02, install R1;
For CYBT-253059-02, install R2.

NC_1 (PALDO_VDDOUT)

PAVDD

R1

0ohm,0201

H5

PAVDD

0ohm,0201

XTALI_32K

B7

XTALI_32K

PALDO_OUT

R2

FB1 600@100M

C12

0.1uF

F6

IFVDD

XTALO_32K

A7

XTALO_32K

0.1uF

G8

C13

PLLVDD

RFLDO_OUT

FB2
600@100M

H8

VCOVDD

XTALO

XTALI

C14

10pF,0201

U1B
CYW20820_B62

E8

F8

C15

12pF,0201

Y1

24MHz

C16

12pF,0201

TP1

TP2

TP3

TP4

TP5

TP6

TP7

TP8

TP9

TP10

TP11

TP12

TP13

TP14

TP15

TP16

TP17

TP18

TP19

TP20

TP21

TP22

TP23

TP24

TP25

TP26

TP27

TP28

TP29

TP30

TP31

TP32

TP33

TP34

TP35

Document Number: 002-29172 Rev. ** Page 12 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Critical Components List

Ta bl e 6 details the critical components used in the CYBT-2x305x-02 module.

Table 6. Critical Component List

Component Reference Designator Description

Silicon U1 62-pin QFN Bluetooth Silicon Device - CYW20819/20
Crystal Y1 24.000 MHz, 8 PF
Chip Antenna A1 Antenna, 2.4 GHz

Antenna Design

Ta bl e 7 details the chip antenna used in the CYBT-2x305x-02 module.

Table 7. PCB Antenna Specifications

Item Description

Frequency Range 2400 – 2500 MHz
Peak Gain -2.5 dBi typical
Return Loss 10 dB minimum

Bluetooth Baseband Core

The Bluetooth Baseband Core (BBC) implements all time-critical functions required for high-performance Bluetooth operation. The
BBC manages the buffering, segmentation, and routing of data for all connections. It prioritizes and schedules all RX/TX activities
including adv, paging, scanning, and servicing of connections. In addition to these functions, it independently handles the host
controller interface (HCI) including all commands, events, and data flowing over HCI. The core also handles symbol timing, forward
error correction (FEC), header error control (HEC), cyclic redundancy check (CRC), authentication, data encryption/decryption, and
data whitening/dewhitening.

Table 8. Bluetooth Features

Bluetooth 1.0 Bluetooth 1.2 Bluetooth 2.0

Basic Rate Interlaced Scans EDR 2 Mbps and 3 Mbps
SCO Adaptive Frequency Hopping –
Paging and Inquiry eSCO –
Page and Inquiry Scan – –
Sniff – –

Bluetooth 2.1 Bluetooth 3.0 Bluetooth 4.0

Secure Simple Pairing Unicast Connectionless Data Bluetooth Low Energy
Enhanced Inquiry Response Enhanced Power Control –
Sniff Subrating eSCO –

Bluetooth 4.1 Bluetooth 4.2 Bluetooth 5.0

Low Duty Cycle Advertising Data Packet Length Extension LE 2 Mbps
Dual Mode LE Secure Connection Slot Availability Mask
LE Link Layer Topology Link Layer Privacy High Duty Cycle Advertising

Document Number: 002-29172 Rev. ** Page 13 of 45

PRELIMINARY

CYBT-223058-02
CYBT-253059-02

Power Management Unit

Figure 9 shows the CYW20819/20 power management unit (PMU) block diagram. The CYW20819/20 includes an integrated buck

regulator, a digital LDO for the digital core, a PA LDO for internal PA (CYW20820 only), and an RF LDO for the Radio. The PMU also
includes a brownout detector which places the part in shutdown when input voltage is below a certain threshold.

Figure 9. Default Usage Mode

Document Number: 002-29172 Rev. ** Page 14 of 45