Cypress Semiconductor 3043 User Manual

PRELIMINARY

CYBT-213043-02

EZ-BT™ Module

General Description

The CYBT-213043-02 is a dual-mode Bluetooth BR/EDR and Low Energy (BLE) wireless module solution. The CYBT-213043-02 includes an onboard crystal oscillator, passive components, and the Cypress CYW20819 silicon device.

The CYBT-213043-02 supports a number of peripheral functions (ADC, PWM), as well as multiple serial communication protocols (UART, SPI, I royalty-free stack compatible with Bluetooth 5.0 in a 12.0 × 16.61 × 1.70 mm module form-factor.

The CYBT-213043-02 includes an integrated PCB trace antenna, is qualified by Bluetooth SIG, and includes regulatory certification approval for FCC, ISED, MIC, and CE.

Module Description

■ Module size: 12.00 mm × 16.61 mm × 1.70 mm

■ Complies with Bluetooth Core Specification version 5.0 and

includes support for BR, EDR 2/3 Mbps, eSCO, BLE, LE 2 Mbps, as well as Bluetooth Mesh.

❐ QDID: TBD ❐ Declaration ID: TBD

■ Certified to FCC, ISED, MIC, and CE standards

■ 256-KB on-chip Flash, 176-KB on-chip RAM

■ Industrial temperature range: –30 °C to +85 °C

■ Integrated Arm

floating point unit (FPU)

RF Characteristics

■ Maximum TX output power: +4.0 dBm

■ BLE RX Receive Sensitivity: –95.0 dBm

C, I2S/PCM). The CYBT-213043-02 includes a

Cortex®-M4 microprocessor core with

Functional Capabilities

■ Up to 22 GPIOs

■ I

C, I2S, UART, and PCM interfaces

■ Two Quad-SPI interfaces

■ Auxiliary ADC with up to 15 analog channels

■ Programmable key scan 20 × 8 matrix

■ General-purpose timers and PWM

■ Real-time clock (RTC) and watchdog timers (WDT)

■ Bluetooth Basic Rate (BR) and Enhanced Data Rate (EDR)

Support

■ BLE protocol stack supporting generic access profile (GAP)

Central, Peripheral, or Broadcaster roles

■ Hardware Security Engine

Benefits

CYBT-213043-02 is fully integrated and certified solution that provides all necessary components required to operate Bluetooth communication standards.

■ Proven hardware design ready to use

■ Ultra-flexible supermux I/O design allows maximum flexibility

for GPIO function assignment

■ Over-the-air update capable for development or field updates

■ Bluetooth SIG qualified.

■ ModusToolbox™ provides an easy-to-use integrated design

environment (IDE) to configure, develop, program, and test your Bluetooth application

Power Consumption

■ TX current consumption ❐ BLE silicon: 5.8 mA (radio only, 4 dBm)

■ RX current consumption ❐ Bluetooth silicon: 5.9 mA (radio only)

■ Cypress CYW20819 silicon low power mode support ❐ PDS: 16.5 A with 176 KB RAM retention

❐ ePDS: 8.7 A ❐ HIDOFF (External Interrupt): 1.75 A

Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Document Number: 002-26540 Rev. ** Revised February 21, 2019

PRELIMINARY

CYBT-213043-02

More Information

Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to quickly and effectively integrate the module into your design.

References

■ Overview: EZ-BLE/EZ-BT Module Portfolio, Module Roadmap

■ Development Kits: ❐ CYBT-213043-EVAL, CYBT-213043-02 Evaluation Board ❐ CYBT-213043-MESH, Mesh Evaluation Kit

❐ CYW920819Q40EVB-01, Evaluation Kit for CYW20819

silicon device

■ Test and Debug Tools: ❐ CYSmart, Bluetooth

❐ CYSmart Mobile, Bluetooth

LE Test and Debug Tool (Windows)

LE Test and Debug Tool

(Android/iOS Mobile App)

■ Knowledge Base Article ❐ KBA97095 - EZ-BLE™ Module Placement

❐ RF Regulatory Certifications for CYBT-213034-02 EZ-BT

WICED Modules (TBD)

❐ KBA213976 - FAQ for BLE and Regulatory Certifications with

EZ-BLE modules

❐ KBA210802 - Queries on BLE Qualification and Declaration

Processes

❐ KBA218122 - 3D Model Files for EZ-BLE/EZ-BT Modules ❐ KBA223428 - Programming an EZ-BT WICED Module ❐ KBA225450 - Putting 2073x, 2070x, and 20719 Based De-

vices or Modules in HCI Mode

Development Environments

ModusToolbox Integrated Development En viro nme nt (IDE)

ModusToolbox simplifies development for IoT designers. It delivers easy-to-use tools and a familiar microcontroller (MCU) integrated

development environment (IDE) for Windows wireless connectivity libraries, power analysis, application-specific configurators for Bluetooth well as other peripherals.

In addition, code examples, documentation, technical support and community forums are available to help your IoT development process along. These tools and features enable an IoT designer to develop innovative IoT applications efficiently and with ease.

, macOS®, and Linux®. It provides a sophisticated environment for system setup,

Low Energy (BLE), CapSense®, as

Technical Support

■ Cypress Community: Whether you are a customer, partner, or a developer interested in the latest Cypress innovations, the Cypress

Developer Community offers you a place to learn, share, and engage with both Cypress experts and other embedded engineers around the world.

■ Frequently Asked Questions (FAQs): Learn more about our Bluetooth ecosystem.

■ Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States,

you can talk to our technical support team by calling our toll-free number: +1-800-541-4736. Select option 2 at the prompt.

Document Number: 002-26540 Rev. ** Page 2 of 45

PRELIMINARY

CYBT-213043-02

Contents

Overview............................................................................ 4

Functional Block Diagram ........................................... 4

Module Description...................................................... 4

Pad Connection Interface ................................................ 6

Recommended Host PCB Layout ................................... 7

Module Connections ........................................................ 9

Connections and Optional External Components ..... 11

Power Connections (VDD) ........................................ 11

External Reset (XRES).............................................. 11

HCI UART Connections ............................................ 11

External Component Recommendation .................... 11

Critical Components List ...........................................13

Antenna Design......................................................... 13

Bluetooth Baseband Core ............................................. 14

BQB and Regulatory Testing Support....................... 14

Power Management Unit................................................ 15

Integrated Radio Transceiver........................................ 16

Transmitter Path........................................................ 16

Receiver Path............................................................ 16

Local Oscillator.......................................................... 16

Microcontroller Unit ....................................................... 17

External Reset........................................................... 17

32-kHz Crystal Oscillator........................................... 17

Power Modes ............................................................ 18

Firmware ................................................................... 18

Peripherals and Communication Interfaces ................ 19

I2C............................................................................. 19

HCI UART Interface .................................................. 19

Peripheral UART Interface ........................................ 19

Serial Peripheral Interface......................................... 19

ADC Port ................................................................... 20

GPIO Port.................................................................. 20

PWM.......................................................................... 21

PDM Microphone....................................................... 21

I2S Interface ..............................................................22

PCM Interface ........................................................... 22

Electrical Characteristics............................................... 23

Current Consumption ................................................ 24

Silicon Core Buck Regulator ..................................... 24

Digital LDO................................................................ 25

RF LDO ..................................................................... 25

Digital I/O Characteristics.......................................... 26

ADC Characteristics.................................................. 26

Chipset RF Specifications ............................................. 28

Timing and AC Characteristics ..................................

UART Timing............................................................. 30

SPI Timing................................................................. 31

I2C Compatible Interface Timing............................... 33

I2S Interface Timing .................................................. 34

Environmental Specifications ....................................... 36

Environmental Compliance ....................................... 36

RF Certification.......................................................... 36

Safety Certification .................................................... 36

Environmental Conditions ......................................... 36

ESD and EMI Protection ........................................... 36

Regulatory Information.................................................. 37

FCC........................................................................... 37

ISED.......................................................................... 38

European Declaration of Conformity ......................... 39

MIC Japan................................................................. 39

Packaging........................................................................ 40

Ordering Information...................................................... 42

Acronyms........................................................................ 43

Document Conventions ................................................. 43

Units of Measure ....................................................... 43

Document History Page................................................. 44

Sales, Solutions, and Legal Information...................... 45

Worldwide Sales and Design Support....................... 45

Products .................................................................... 45

PSoC® Solutions ...................................................... 45

Cypress Developer Community................................. 45

Technical Support ..................................................... 45

... 30

Document Number: 002-26540 Rev. ** Page 3 of 45

PRELIMINARY

CYBT-213043-02

Overview

Functional Block Diagram

Figure 1 illustrates the CYBT-213043-02 functional block diagram.

Figure 1. Functional Block Diagram

Note: General Purpose Input/Output pins shown in Figure 1 are configurable to any specified input or output function in the SuperMux table detailed in Tab le 5 in the Module

Connections section.

Note: Connections shown in Figure 1 are maximum number of connections per function. The total number of GPIOs available on the CYBT-213043-02 is 22.

Module Description

The CYBT-213043-02 module is a complete module designed to be soldered to the applications main board.

Module Dimensions and Drawing

Cypress reserves the right to select components from various vendors to achieve the Bluetooth module functionality. Such selections will still guarantee that all mechanical specifications and module certifications are maintained. The CYBT-213043-02 will be held within the physical dimensions shown in the mechanical drawings in Figure 2 on page 5. All dimensions are in millimeters (mm).

Table 1. Module Design Dimensions

Dimension Item Specification

Module dimensions

Antenna location dimensions

PCB thickness Height (H) 0.50 ± 0.10 mm Shield height Height (H) 1.20 mm typical Maximum component height Height (H) 0.80 mm typical Total module thickness (bottom of module to top of shield) Height (H) 1.70 mm typical

See Figure 2 for the mechanical reference drawing for CYBT-213043-02.

Length (X) 12.00 ± 0.15 mm

Width (Y) 16.61 ± 0.15 mm

Length (X) 12.00 mm

Width (Y) 4.55 mm

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PRELIMINARY

CYBT-213043-02

Figure 2. Module Mechanical Drawing

Bottom View (Seen from Bottom)

Side View

Top View (Seen from Top)

Note

1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on the recommended host PCB layout, see “Recommended Host PCB Layout” on page 7.

Document Number: 002-26540 Rev. ** Page 5 of 45

PRELIMINARY

CYBT-213043-02

Pad Connection Interface

Solder Pad Connections

(Seen from Bottom)

Optional Host PCB Keep

Out Area Around PCB An-

tenna

(Seen from Bottom)

As shown in the bottom view of Figure 2 on page 5, the CYBT-213043-02 has 28 connections to a host board via solder pads (SP).

Ta bl e 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of the CYBT-213043-02 module.

Table 2. Connection Description

Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch

SP 35 Solder Pad 1.02 mm 0.61 mm 0.90 mm

Figure 3. Solder Pad Dimensions (Seen from Bottom)

To maximize RF performance, the host layout should follow these recommendations:

1. Antenna Area Keepout: The host board directly below the antenna area of the Cypress module (see Figure 2 on page 5) must contain no ground or signal traces. This keep out area requirement applies to all layers of the host board.

2. Module Placement: The ideal placement of the Cypress Bluetooth module is in a corner of the host board with the PCB antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 3 below. Refer to

AN96841 for module placement best practices.

3. Optional Keepout: To maximize RF performance, the area immediately around the Cypress Bluetooth module PCB antenna may contain an additional keep out area, where there are no grounding or signal traces. The keep out area applies to all layers of the host board. The recommended dimensions of the host PCB keep out area are shown in Figure 4 (dimensions are in mm).

Figure 4. Optional Additional Host PCB Keep Out Area Around the CYBT-213043-02 PCB Antenna

Document Number: 002-26540 Rev. ** Page 6 of 45

PRELIMINARY

CYBT-213043-02

Recommended Host PCB Layout

Top View (Seen on Host PCB)

Figure 5, Figure 6, Figure 7, and Ta bl e 3 provide details that can be used for the recommended host PCB layout pattern for the

CYBT-213043-02. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.633 mm from center of the pad on either side) shown in Figure 7 is the minimum recommended host pad length. The host PCB layout pattern can be completed using either Figure 5, Figure 6, or Figure 7. It is not necessary to use all figures to complete the host PCB layout pattern.

Figure 5. CYBT-213043-02 Host Layout (Dimensioned) Figure 6. CYBT-213043-02 Host Layout (Relative to Origin)

Document Number: 002-26540 Rev. ** Page 7 of 45

PRELIMINARY

CYBT-213043-02

Ta bl e 3 provides the center location for each solder pad on the CYBT-213043-02. All dimensions are referenced to the center of the

Top View (Seen on Host PCB)

solder pad. Refer to Figure 7 for the location of each module solder pad.

Table 3. Module Solder Pad Location Figure 7. Solder Pad Reference Location

Solder Pad

(Center of Pad)

1 (0.38, 4.85) (14.96, 190.94) 2 (0.38, 5.75) (14.96, 226.38) 3 (0.38, 6.65) (14.96, 261.81) 4 (0.38, 7.56) (14.96, 297.64) 5 (0.38, 8.46) (14.96, 333.07) 6 (0.38, 9.36) (14.96, 368.50) 7 (0.38, 10.26) (14.96, 403.94) 8 (0.38, 11.16) (14.96, 439.37)

9 (0.38, 12.07) (14.96, 475.20) 10 (0.38, 12.97) (14.96, 510.63) 11 (0.38, 13.87) (14.96, 546.06) 12 (0,38, 14.77) (14.96, 581.49) 13 (1.49, 16.23) (58.66, 638.98) 14 (2.39, 16.23) (94.09, 638.98) 15 (3.30, 16.23) (129.92, 638.98) 16 (4.20, 16.23) (165.35, 638.98) 17 (5.10, 16.23) (200.79, 638.98) 18 (6.00, 16.23) (236.22, 638.98) 19 (6.90, 16.23) (271.65, 638.98) 20 (7.80, 16.23) (307.09, 638.98) 21 (8.71, 16.23) (342.91, 638.98) 22 (9.61, 16.23) (378.35, 638.98) 23 (10.51, 16.23) (413.78, 638.98) 24 (11.62, 14.47) (457.48, 581.49) 25 (11.62, 13.87) (457.48, 546.06) 26 (11.62, 12.97) (457.48, 510.63) 27 (11.62, 12.07) (457.48, 475.20) 28 (11.62, 11.16) (457.48, 439.37) 29 (11.62, 10.26) (457.48, 403.94) 30 (11.62, 9.36) (457.48, 368.50) 31 (11.62, 8.46) (457.48, 333.07) 32 (11.62, 7.56) (457.48, 297.64) 33 (11.62, 6.65) (457.48, 261.81) 34 (11.62, 5.75) (457.48, 226.38) 35 (11.62, 4.85) (457.48, 190.94)

Location (X,Y) from

Orign (mm)

Dimension from

Orign (mils)

Document Number: 002-26540 Rev. ** Page 8 of 45

PRELIMINARY

CYBT-213043-02

Module Connections

Note

2. The CYBT-213043-02 can configure GPIO connections to any Input/Output function described in Tab l e 5 using the ModusToolbox Device Configurator.

Ta bl e 4 details the solder pad connection definitions and available functions for each connection pad. The GPIO connections available

on the CYBT-213043-02 can be configured to any of the input or output functions listed in Table 5 . Table 4 specifies any function that is required to be used on a specific solder pad, and also identifies SuperMux capable GPIOs that can be configured using the ModusToolbox device configurator.

Table 4. CYBT-213043-02 Solder Pad Connection Definitions

Pad Pad Name Silicon Pin Name XTALI/O ADC GPIO SuperMux Capable

1 GND GND Ground 2 VDD VDDIO Power Supply Input (1.71V ~ 3.63V) 3 XRES RST_N External Reset (Active Low) 4 P29 P29 - IN10 ✓✓ see Table 5 5P32 P32 - IN7 ✓✓ see Table 5 6P27 P27 - - ✓✓ see Table 5 7P37 P37 - IN2 ✓✓ see Table 5 8P28 P28 - IN11 ✓✓ see Table 5

9P0 P0 - IN29 ✓✓ see Table 5 10 P1 P1 - IN28 ✓✓ see Table 5 11 P 10 P1 0 - IN 25 ✓✓ see Table 5 12 P13 P13 - IN22 ✓✓ see Table 5 13 GND GND Ground 14 P12 P12 - IN23 ✓✓ see Table 5 15 P11 P11 - IN24 ✓✓ see Table 5 16 P9 P9 - IN26 ✓✓ see Table 5 17 P14 P14 - IN21 ✓✓ see Table 5 18 P17 P17 - IN18 ✓✓, see Ta bl e 5 19 P5 P5 - - ✓✓ see Table 5 20 P6 P6 - - ✓✓ see Table 5 21 P4 P4 - - ✓ ✓ see Table 5 22 P2 P2 - - ✓✓ see Table 5 23 P3 P3 - - ✓✓ see Table 5

24 XTALI_32K XTALI_32K

25 XTALO_32K XTALO_32K

26 P15 P15 - IN20 ✓✓ see Table 5 27 P8 P8 - IN27 ✓✓ see Table 5 28 UART_CTS_N UART_CTS_N UART (HCI UART) Clear To Send Input Only 29 UART_RTS_N UART_RTS_N UART (HCI UART) Request To Send Output Only 30 UART_TXD UART_TXD UART (HCI UART) Transmit Data Only 31 UART_RXD UART_RXD UART (HCI UART) Receive Data Only

32 HOST_WAKE HOST_WAKE

33 DEV_WAKE DEV_WAKE 34 P26 P26 - - ✓✓ see Table 5 35 GND GND Ground

External Oscillator Input

(32KHz)

External Oscillator

Output (32KHz)

A signal from the CYBT-213043-02 module to the host indicating that the Bluetooth device requires

A signal from the host to the CYBT-213043-02 module indicating that the host requires attention.

-- -

attention.

[2]

Document Number: 002-26540 Rev. ** Page 9 of 45

PRELIMINARY

CYBT-213043-02

Ta bl e 5 details the available Input and Output functions that are configurable to any solder pad in Table 4 that are marked as SuperMux

capable.

Table 5. GPIO SuperMux Input and Output Functions

Function Input or Output Function Type GPIOs Required Function Connection Description

SPI 1 Clock

SPI 1 Chip Select

SPI 1 Input/Output

SPI 2 Input/Output

Input Serial Communication Input

PUART

Output Serial Communication Output

C Input/Output

PCM In Input Audio Input Communication 3

PCM Out Output Audio Output Communication 3

S In Input Audio Input Communication 3

S Out Output Audio Output Communication 3

PDM Input Microphone 1 ~ 2

PWM Output Pulse Width Modulator 1 ~ 6

Serial Communication

(Master or Slave)

Serial Communication

(Master or Slave)

Serial Communication

(Master or Slave)

4 ~ 7

SPI 1 MOSI

SPI 1 MISO SPI 1 I/O 2 (Quad SPI) SPI 1 I/O 3 (Quad SPI)

SPI 1 Interrupt

SPI 2 Clock

SPI 2 Chip Select

SPI 2 MOSI

SPI 2 MISO SPI 2 I/O 2 (Quad SPI) SPI 2 I/O 3 (Quad SPI)

SPI 2 Interrupt

Peripheral UART RX

Peripheral UART CTS

Peripheral UART TX

Peripheral UART RTS

I2C Clock

I2C Data

PCM Input

PCM Clock

PCM Sync

PCM Output

PCM Clock

PCM Sync

I2S DI, Data Input

I2S WS, Word Select

I2S Clock I2S DO, Data Output I2S WS, Word Select

I2S Clock

PDM Input Channel 1 PDM Input Channel 2

PWM Channel 0 PWM Channel 1 PWM Channel 2 PWM Channel 3 PWM Channel 4 PWM Channel 5

Document Number: 002-26540 Rev. ** Page 10 of 45

PRELIMINARY

CYBT-213043-02

Connections and Optional External Components

Power Connections (VDD)

The CYBT-213043-02 contains one power supply connection, VDD. VDD accepts a supply input of 1.71 V to 3.63 V. Ta bl e 1 2 provides this specification. The maximum power supply ripple for this power connection is 100 mV, as shown in Tab l e 1 2 .

External Reset (XRES)

The CYBT-213043-02 has an integrated power-on reset circuit which completely resets all circuits to a known power-on state. This action can also be invoked by an external reset signal, forcing it into a power-on reset state. XRES is an active-low input signal on the CYBT-213043-02 module (solder pad 3). The CYBT-213043-02 does not require external pull-up resistors on the XRES input Refer to Figure 10 on page 17 for Power On and XRES operation and timing requirements during power on events.

HCI UART Connections

The recommendations in this section apply to the HCI UART (Solder Pads 28, 29, 30, and 31). For full UART functionality, all UART signals must be connected to the Host device. If full UART functionality is not being used, and only UART RXD and TXD are desired or capable, then the following connection considerations should be followed for UART RTS and CTS:

■ UART RTS: Can be left floating, pulled low, or pulled high. RTS is not critical for initial firmware uploading at power on.

■ UART CTS: Must be pulled low to bypass flow control and to ensure that continuous data transfers are made from the host to the

module.

External Component Recommendation

Power Supply Circuitry

It is not required to place any power supply decoupling or noise reduction circuitry on the host PCB. If desired, an external ferrite bead between the supply and the module connection can be included. The ferrite bead should be positioned as close as possible to the module pad connection.

If used, the recommended ferrite bead value is 330 , 100 MHz. (Murata BLM21PG331SN1D).

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CYBT-213043-02

Figure 8 illustrates the CYBT-213043-02 schematic.

Figure 8. CYBT-213043-02 Schematic Diagram

Document Number: 002-26540 Rev. ** Page 12 of 45

PRELIMINARY

CYBT-213043-02

Critical Components List

Ta bl e 6 details the critical components used in the CYBT-213043-02 module.

Table 6. Critical Component List

Component Reference Designator Description

Silicon U1 62-pin QFN Bluetooth Silicon Device - CYW20819 Crystal Y1 24.000 MHz, 8PF

Antenna Design

Ta bl e 7 details the PCB trace antenna used in the CYBT-213043-02 module.

Table 7. PCB Antenna Specifications

Item Description

Frequency Range 2400–2500 MHz Peak Gain –0.5 dBi typical Return Loss 10 dB minimum

Document Number: 002-26540 Rev. ** Page 13 of 45

PRELIMINARY

CYBT-213043-02

Bluetooth Baseband Core

The Bluetooth Baseband Core (BBC) implements all time-critical functions required for high-performance Bluetooth operation. The BBC manages the buffering, segmentation, and routing of data for all connections. It prioritizes and schedules all RX/TX activities including adv, paging, scanning, and servicing of connections. In addition to these functions, it independently handles the host controller interface (HCI) including all commands, events, and data flowing over HCI. The core also handles symbol timing, forward error correction (FEC), header error control (HEC), cyclic redundancy check (CRC), authentication, data encryption/decryption, and data whitening/dewhitening.

Table 8. Bluetooth Features

Bluetooth 1.0 Bluetooth 1.2 Bluetooth 2.0

Basic Rate Interlaced Scans EDR 2 Mbps and 3 Mbps SCO Adaptive Frequency Hopping – Paging and Inquiry eSCO – Page and Inquiry Scan – – Sniff – –

Bluetooth 2.1 Bluetooth 3.0 Bluetooth 4.0

Secure Simple Pairing Unicast Connectionless Data Bluetooth Low Energy Enhanced Inquiry Response Enhanced Power Control – Sniff Subrating eSCO –

Bluetooth 4.1 Bluetooth 4.2 Bluetooth 5.0

Low Duty Cycle Advertising Data Packet Length Extension LE 2 Mbps Dual Mode LE Secure Connection Slot Availability Mask LE Link Layer Topology Link Layer Privacy High Duty Cycle Advertising

BQB and Regulatory Testing Support

The CYBT-213043-02 fully supports Bluetooth Test mode as described in Part I:1 of the Specification of the Bluetooth System Version

3.0. This includes the transmitter tests, normal and delayed loop back tests, and reduced hopping sequence. In addition to the standard Bluetooth Test Mode, the CYBT-213043-02 also supports enhanced testing features to simplify RF

debugging and qualification and type-approval testing. These features include:

■ Fixed frequency carrier wave (unmodulated) transmission ❐ Simplifies some type-approval measurements (Japan)

❐ Aids in transmitter performance analysis

■ Fixed frequency constant receiver mode ❐ Receiver output directed to I/O pin ❐ Allows for direct BER measurements using standard RF test equipment

❐ Facilitates spurious emissions testing for receive mode

■ Fixed frequency constant transmission ❐ 8-bit fixed pattern or PRBS-9

❐ Enables modulated signal measurements with standard RF test equipment

Document Number: 002-26540 Rev. ** Page 14 of 45

+ 31 hidden pages

Cypress Semiconductor 3043 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

General Description

Module Description

RF Characteristics

Functional Capabilities

Benefits

Power Consumption

More Information

References

Development Environments

Technical Support

Overview

Functional Block Diagram

Module Description

Module Dimensions and Drawing

Pad Connection Interface

Recommended Host PCB Layout

Module Connections

Connections and Optional External Components

Power Connections (VDD)

External Reset (XRES)

HCI UART Connections

External Component Recommendation

Power Supply Circuitry

Critical Components List

Antenna Design

Bluetooth Baseband Core

BQB and Regulatory Testing Support