Cypress Semiconductor 2011 User Manual
PRELIMINARY
CYBLE-212019-00
EZ-BLE
TM
PRoC
TM
Module
General Description
The CYBLE-212019-00 is a turnkey Bluetooth Low Energy
(BLE) wireless module solution and includes onboard crystal
oscillators, trace antenna, passive components, and the Cypress
PRoC™ BLE 256KB chip. Refer to the CYBL10X7X datasheet
for additional details on the capabilities of the PRoC BLE device
used on this module.
The CYBLE-212019-00 supports a number of peripheral
functions (ADC, timers, counters, PWM) and serial
communication protocols (I
2
C, UART, SPI) through its
programmable architecture. The CYBLE-212019-00 includes a
royalty-free BLE stack compatible with Bluetooth 4.1 and
provides up to 23 GPIOs in a 14.52 × 19.20 × 2.00 mm package.
The CYBLE-212019-00 is drop-in compatible with the
CYBLE-012011-00.
The CYBLE-212019-00 is fully certified by Bluetooth SIG and is
targeted at applications requiring large memory size and
cost-optimized BLE wireless connectivity.
Module Description
n Module size: 14.52 mm ×19.20 mm × 2.00 mm (with shield)
n Castelated solder pad connections for ease-of-use
n Bluetooth 4.1 single-mode module
n Industrial temperature range: –40 °C to +85 °C
n 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
Functional Capabilities
n Up to 22 capacitive sensors for buttons or sliders with
best-in-class signal-to-noise ration (SNR) and liquid tolerance
n 12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
n Two serial communication blocks (SCBs) supporting I
2
C
(master/slave), SPI (master/slave), or UART
n Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
n LCD drive supported on all GPIOs (common or segment)
n Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
2
n I
S master interface
n Bluetooth Low Energy protocol stack supporting generic
access profile (GAP) Central, Peripheral, Observer, or
Broadcaster roles
n Switches between Central and Peripheral roles on-the-go
n Standard Bluetooth Low Energy profiles and services for
interoperability
n Custom profile and service for specific use cases
Benefits
multiply, operating at up to 48 MHz
n 256-KB flash memory, 32-KB SRAM memory
n Watchdog timer with dedicated internal low-speed oscillator
(ILO)
n Two-pin SWD for programming
n Up to 23 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z analog, HI-Z digial, or strong output
n Certified to FCC, IC, CE, MIC and KC regulations
n Bluetooth SIG 4.1 qualified
p QDID: TBD
p Declaration ID: TBD
Power Consumption
n TX output power: –18 dbm to +3 dbm
n Received signal strength indicator (RSSI) with 1-dB resolution
n TX current consumption of 15.6 mA (radio only, 0 dbm)
n RX current consumption of 16.4 mA (radio only)
n Low power mode support
p Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on
p Hibernate: 150 nA with SRAM retention
p Stop: 60 nA with XRES wakeup
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document Number: 002-09764 Rev. **
Revised November 4, 2015
The CYBLE-212019-00 module is provided as a turnkey
solution, including all necessary hardware required to use BLE
communication standards.
n Proven hardware design ready to use
n Cost optimized for applications without space constraint
n Reprogrammable architecture
n Fully certified module eliminates the time needed for design,
development and certification processes
n Bluetooth SIG qualified with QDID and Declaration ID
n Flexible communication protocol support
n PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
BLE application
CYBLE-212019-00
Contents
Overview............................................................................ 3
Module Description...................................................... 3
Pad Connection Interface ................................................ 5
Recommended Host PCB Layout ................................... 6
Power Supply Connections and Recommended External
Components...................................................................... 9
Connection Options..................................................... 9
External Component Recommendation ...................... 9
Critical Components List ........................................... 11
Antenna Design......................................................... 11
Electrical Specification .................................................. 12
GPIO ......................................................................... 14
XRES......................................................................... 15
Digital Peripherals ..................................................... 18
Serial Communication ............................................... 20
Memory ..................................................................... 21
System Resources .................................................... 21
Environmental Specifications ....................................... 24
Environmental Compliance ....................................... 24
RF Certification.......................................................... 24
Environmental Conditions ......................................... 24
ESD and EMI Protection ........................................... 24
Regulatory Information.................................................. 25
FCC........................................................................... 25
Industry Canada (IC) Certification............................. 26
European R&TTE Declaration of Conformity ............ 26
MIC Japan................................................................. 27
KC Korea................................................................... 27
Ordering Information...................................................... 28
Part Numbering Convention...................................... 28
Document Conventions............................................. 29
Document History Page................................................. 30
Sales, Solutions, and Legal Information...................... 31
Worldwide Sales and Design Support....................... 31
Products .................................................................... 31
PSoC® Solutions ...................................................... 31
Cypress Developer Community................................. 31
Technical Support ..................................................... 31
Document Number: 002-09764 Rev. ** Page 2 of 31
CYBLE-212019-00
Overview
Module Description
The CYBLE-212019-00 module is a complete module designed to be soldered to the applications main board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE
module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs
should be held within the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm).
Table 1. Module Design Dimensions
Dimension Item Specification
Module dimensions
Antenna location dimensions
PCB thickness Height (H) 0.80 ± 0.10 mm
Shield height Height (H) 1.20 ± 0.10 mm
Maximum component height Height (H) 1.20 mm typical (shield)
Total module thickness (bottom of module to highest component) Height (H) 2.00 mm typical
See Figure 1 on page 4 for the mechanical reference drawing for CYBLE-212019-00.
Length (X) 14.52 ± 0.15 mm
Width (Y) 19.20 ± 0.15 mm
Length (X) 11.00 ± 0.15 mm
Width (Y) 5.00 ± 0.15 mm
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CYBLE-212019-00
Figure 1. Module Mechanical Drawing
Top View
Side View
Bottom View
Note
1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on
recommended host PCB layout, see Figure 3 and Figure 4 on page 6.
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CYBLE-212019-00
Pad Connection Interface
As shown in the bottom view of Figure 1 on page 4, the CYBLE-212019-00 connects to the host board via solder pads on the backside
of the module. Tab l e 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-212019-00 module.
Table 2. Solder Pad Connection Description
Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch
SP 31 Solder Pads 1.02 mm 0.71 mm 1.27 mm
Figure 2. Solder Pad Dimensions
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CYBLE-212019-00
Recommended Host PCB Layout
Top View (On Host PCB)
Host PCB Keep Out Area Around Trace Antenna
Figure 3 details the recommended PCB layout pattern for the host PCB.
Figure 3. Recommended PCB Layout Pattern for CYBLE-212019-00 Module
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress BLE module is in a corner of the host board with the trace antenna located at the far corner.
This placement minimizes the additional recommended keep out area stated in item 2.
2. It is recommended that the area around the Cypress BLE module trace antenna should contain an additional keep out area, where
no grounding or signal trace are contained. The keep out area applies to all layers of the host board. The recommended dimensions
of the host PCB keep out area are shown in Figure 4 (dimensions are in mm).
Figure 4. Recommended Host PCB Keep Out Area Around the CYBLE-212019-00 Antenna
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CYBLE-212019-00
Ta bl e 3 details the solder pad pitch (center-to-center) for each of the neighboring connections.
Table 3. Module Solder Pad Connection Dimensions
Pad X Pad Y Pad Pitch (Pad X - Pad Y) Comments
Bottom Right Corner 1 4.88 mm Distance from Bottom Right Corner to Pad 1 center
1 2 1.27 mm Distance from Pad 1 center to Pad 2 center
2 3 1.27 mm Distance from Pad 2 center to Pad 3 center
3 4 1.27 mm Distance from Pad 3 center to Pad 4 center
4 5 1.27 mm Distance from Pad 4 center to Pad 5 center
5 6 1.27 mm Distance from Pad 5 center to Pad 6 center
6 7 1.27 mm Distance from Pad 6 center to Pad 7 center
7 8 1.27 mm Distance from Pad 7 center to Pad 8 center
8 9 1.27 mm Distance from Pad 8 center to Pad 9 center
9 10 1.27 mm Distance from Pad 9 center to Pad 10 center
10 11 1.27 mm Distance from Pad 10 center to Pad 11 center
Top Right Corner 12 2.04 mm Distance from Top Right Corner to Pad 12 center
12 13 1.27 mm Distance from Pad 12 center to Pad 13 center
13 14 1.27 mm Distance from Pad 13 center to Pad 14 center
14 15 1.27 mm Distance from Pad 14 center to Pad 15 center
15 16 1.27 mm Distance from Pad 15 center to Pad 16 center
16 17 1.27 mm Distance from Pad 16 center to Pad 17 center
17 18 1.27 mm Distance from Pad 17 center to Pad 18 center
18 19 1.27 mm Distance from Pad 18 center to Pad 19 center
19 20 1.27 mm Distance from Pad 19 center to Pad 20 center
20 21 1.27 mm Distance from Pad 20 center to Pad 21 center
Top Left Corner 22 2.90 mm Distance from Top Left Corner to Pad 22 center
22 23 1.27 mm Distance from Pad 22 center to Pad 23 center
23 24 1.27 mm Distance from Pad 23 center to Pad 24 center
24 25 1.27 mm Distance from Pad 24 center to Pad 25 center
25 26 1.27 mm Distance from Pad 25 center to Pad 26 center
26 27 1.27 mm Distance from Pad 26 center to Pad 27 center
27 28 1.27 mm Distance from Pad 27 center to Pad 28 center
28 29 1.27 mm Distance from Pad 28 center to Pad 29 center
29 30 1.27 mm Distance from Pad 29 center to Pad 30 center
30 31 1.27 mm Distance from Pad 30 center to Pad 31 center
31 Bottom Left Corner 4.88 mm Distance from Pad 31 center to Bottom Left Corner
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CYBLE-212019-00
Ta bl e 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on
Notes
2. TCPWM: Timer, Counter, and Pulse Width Modulator. If supported, the pad can be configured to any of these peripheral functions.
3. When using the capacitive sensing functionality, Pad 2 (P4.0) must be connected to a C
MOD
capacitor (located off of Cypress BLE Module). The value of this
capacitor is 2.2 nF and should be placed as close to the module as possible.
4. The main board needs to connect all GND connections (Pad 25/26/27/28) on the module to the common ground of the system.
5. If the I
2
S feature is used in the design, the I2S pins shall be dynamically routed to the appropriate available GPIO by PSoC Creator
CYBLE-212019-00, the BLE device port-pin, and denotes whether the function shown is available for each solder pad. Each
connection is configurable for a single option shown with a 3.
Table 4. Solder Pad Connection Definitions
Solder Pad
Number
1 XRES External Reset Hardware Connection Input
2P4.0
3P3.73(CTS) 33(Sensor) 33 3
4P3.63(RTS) 33(Sensor) 33
5P3.53(TX) 3(SCL) 33(Sensor) 33
6P3.43(RX) 3(SDA) 33(Sensor) 33
7P3.33(CTS) 33(Sensor) 33
8P3.23(RTS) 33(Sensor) 33
9P2.6 3(Sensor) 33
10 VREF Reference Voltage Input (Optional)
11 P2 .4
12 P2.3 3(Sensor) 33 3
13 P2.2 3(SS) 3(Sensor) 33
14 P2.0 3(SS) 3(Sensor) 33
15 V
16 P1.7
17 P1.6 3(RTS) 3(SS) 33(Sensor) 33
18 P1.5 3(TX) 3(MISO) 3(SCL) 33(Sensor) 33
19 P1.4 3(RX) 3(MOSI) 3(SDA) 33(Sensor) 33
20 P1.0 33(Sensor) 33
21 P0.4 3(RX) 3(MOSI) 3(SDA) 33(Sensor) 33 3
22 P0.5 3(TX) 3(MISO) 3(SCL) 33(Sensor) 33
23 P0.7 3(CTS) 3(SCLK) 33(Sensor) 33(SWDCLK) 3
24 P0.6 3(RTS) 3(SS) 33(Sensor) 33(SWDIO) 3
25 GND
26 GND Ground Connection
27 GND Ground Connection
28 GND Ground Connection
29 V
30 P5.0
31 P5.1 3(TX) 3(SCLK) 3(SCL) 33(Sensor) 33 3
Device
Port Pin
[3]
DD
[4]
DDR
UART SPI I2C TCPWM
[2]
CapSense
3(RTS) 3(MOSI) 33(C
MOD
WCO
ECO_OUT LCD SWD GPIO
Out
) 33
3(Sensor) 33
Digital Power Supply Input (1.8 to 5.5V)
3(CTS) 3(SCLK) 33(Sensor) 33
Ground Connection
Radio Power Supply (1.9V to 5.5V)
3(RX) 3(SS) 3(SDA) 33(Sensor) 33
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CYBLE-212019-00
Power Supply Connections and Recommended External Components
Two Ferrite Bead Option
Single Ferrite Bead Option
1.9V~5.5V Input
1.9V~5.5V Input
1.9V~5.5V Input
1.8V~5.5V Input
Power Connections
The CYBLE-212019-00 contains two power supply connections,
VDD and VDDR. The VDD connection supplies power for both
digital and analog device operation. The VDDR connection
supplies power for the device radio.
VDD accepts a supply range of 1.8 V to 5.5 V. VDDR accepts a
sup pl y r an ge of 1. 9 V to 5 .5 V. Th ese sp ec if ic at io ns can be fo un d
in Ta bl e 9. The maximum power supply ripple for both power
connections on the module is 100 mV, as shown in Tab l e 7 .
The power supply ramp rate of VDD must be equal to or greater
than that of VDDR.
Connection Options
Two connection options are available for any application:
1. Single supply: Connect VDD and VDDR to the same supply.
2. Independent supply: Power VDD and VDDR separately.
Figure 5. Recommended Host Schematic Options for a Single Supply Option
External Component Recommendation
In either connection scenario, it is recommended to place an
external ferrite bead between the supply and the module
connection. The ferrite bead should be positioned as close as
possible to the module pin connection.
Figure 5 details the recommended host schematic options for a
single supply scenario. The use of one or two ferrite beads will
depend on the specific application and configuration of the
CYBLE-212019-00.
Figure 6 details the recommended host schematic for an
independent supply scenario.
The recommended ferrite bead value is 330 Ω, 100 MHz. (Murata
BLM21PG331SN1D).
Figure 6. Recommended Host Schematic for an Independent Supply Option
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CYBLE-212019-00
The CYBLE-212019-00 schematic is shown in Figure 7.
Figure 7. CYBLE-212019-00 Schematic Diagram
Document Number: 002-09764 Rev. ** Page 10 of 31
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