Cypress Semiconductor 2005 User Manual
PRELIMINARY
CYBLE-222014-01
EZ-BLE™ PRoC™ Bluetooth 4.2 Module
EZ-BLE™ PRoC™ Bluetooth 4.2 Module
General Description
The Cypress CYBLE-222014-01 is a fully certified and qualified
module supporting Bluetooth
communication. The CYBLE-222014-01 is a turnkey solution
and includes onboard crystal oscillators, chip antenna, passive
components, and Cypress PRoC™ BLE. Refer to the
CYBL10X7X datasheet for additional details on the capabilities
of the PRoC BLE device used on this module.
The CYBLE-222014-01 supports a number of peripheral
functions (ADC, timers, counters, PWM) and serial
communication protocols (I
programmable architecture. The CYBLE-222014-01 includes a
royalty-free BLE stack compatible with Bluetooth 4.2 and
provides up to 16 GPIOs in a small 10 × 10 × 1.80 mm package.
The CYBLE-222014-01 is drop-in compatible with the
CYBLE-022001-00 (128KB BT 4.1) and CYBLE-222005-00
(256KB BT 4.1).
Module Description
■ Module size: 10.0 mm ×10.0 mm × 1.80 mm (with shield)
■ 256-KB flash memory, 32-KB SRAM memory
■ Up to 16 GPIOs configurable as open drain high/low,
pull-up/pull-down, HI-Z analog, HI-Z digital, or strong output
■ Bluetooth 4.2 qualified single-mode module
■ Certified to FCC, CE MIC, KC, and IC regulations
■ Eight-channel direct memory access (DMA) controller
■ 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit
multiply, operating at up to 48 MHz
■ Industrial temperature range: –40 °C to +85 °C
■ Watchdog timer with dedicated internal low-speed oscillator
(ILO)
■ Two-pin SWD for programming
Power Consumption
■ TX output power: –18 dbm to +3 dbm
■ Received signal strength indicator (RSSI) with 1-dB resolution
■ TX current consumption of 15.6 mA (radio only, 0 dbm)
■ RX current consumption of 16.4 mA (radio only)
■ Low power mode support
❐ Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on
❐ Hibernate: 150 nA with SRAM retention
❐ Stop: 60 nA with XRES wakeup
Low Energy (BLE) 4.2 wireless
2
C, UART, SPI) through its
Functional Capabilities
■ Up to 15 capacitive sensors for buttons or sliders with
best-in-class signal-to-noise ration (SNR) and liquid tolerance
■ 12-bit, 1-Msps SAR ADC with internal reference,
sample-and-hold (S/H), and channel sequencer
■ Two serial communication blocks (SCBs) supporting I
2
C
(master/slave), SPI (master/slave), or UART
■ Four dedicated 16-bit timer, counter, or PWM blocks
(TCPWMs)
■ Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
2
■ I
S master interface
■ Bluetooth Low Energy protocol stack supporting generic
access profile (GAP) Central, Peripheral, Observer, or
Broadcaster roles
■ Switches between Central and Peripheral roles on-the-go
■ Standard Bluetooth Low Energy profiles and services for
interoperability
■ Custom profile and service for specific use cases
Benefits
The CYBLE-222014-01 module is provided as a turnkey
solution, including all necessary hardware required to use BLE
communication standards.
■ Proven, qualified, and certified hardware design ready to use
■ Small footprint (10 × 10 mm × 1.80 mm), perfect for space
constrained applications
■ Reprogrammable architecture
■ Fully certified module eliminates the time needed for design,
development and certification processes
■ Bluetooth SIG qualified with QDID and Declaration ID
■ Flexible communication protocol support
■ PSoC Creator™ provides an easy-to-use integrated design
environment (IDE) to configure, develop, program, and test a
BLE application
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document Number: 002-11186 Rev. **
Revised February 18, 2016
PRELIMINARY
CYBLE-222014-01
More Information
Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to
quickly and effectively integrate the module into your design.
■ Overview: EZ-BLE Module Portfolio, Module Roadmap
■ EZ-BLE PRoC Product Overview
■ PRoC BLE Silicon Datasheet
■ Application notes: Cypress offers a number of BLE application
notes covering a broad range of topics, from basic to advanced
level. Recommended application notes for getting started with
EZ-BLE modules are:
❐ AN96841 - Getting Started with EZ-BLE Module
❐ AN94020 - Getting Started with PRoC BLE
❐ AN97060 - PSoC
®
4 BLE and PRoC™ BLE - Over-The-Air
(OTA) Device Firmware Upgrade (DFU) Guide
❐ AN91162 - Creating a BLE Custom Profile
❐ AN91184 - PSoC 4 BLE - Designing BLE Applications
❐ AN92584 - Designing for Low Power and Estimating Battery
Life for BLE Applications
❐ AN85951 - PSoC
❐ AN95089 - PSoC
®
4 CapSense® Design Guide
®
4/PRoC™ BLE Crystal Oscillator Selec-
■ Knowledge Base Articles
❐ KBA97095 - EZ-BLE™ Module Placement
■ Technical Reference Manual (TRM):
❐ PRoC
■ Development Kits:
❐ CY8CKIT-042-BLE, Bluetooth
❐ CY8CKIT-002, PSoC
■ Test and Debug Tools:
❐ CYSmart, Bluetooth
❐ CYSmart Mobile, Bluetooth
®
BLE Technical Reference Manual
Kit
®
MiniProg3 Program and Debug Kit
®
LE Test and Debug Tool (Windows)
®
Low Energy (BLE) Pioneer
®
LE Test and Debug Tool
(Android/iOS Mobile App)
tion and Tuning Techniques
❐ AN91445 - Antenna Design and RF Layout Guidelines
PSoC® Creator™ Integrated Design Environment (IDE)
PSoC Creator is an Integrated Design Environment (IDE) that enables concurrent hardware and firmware editing, compiling and
debugging of PSoC 3, PSoC 4, PSoC 5LP, PSoC 4 BLE, PRoC BLE and EZ-BLE module systems with no code size limitations. PSoC
peripherals are designed using schematic capture and simple graphical user interface (GUI) with over 120 pre-verified,
production-ready PSoC Components™.
PSoC Components are analog and digital “virtual chips,” represented by an icon that users can drag-and-drop into a design and
configure to suit a broad array of application requirements.
Blutooth Low Energy Component
The Bluetooth Low Energy Component inside PSoC Creator provides a comprehensive GUI-based configuration window that lets you
quickly design BLE applications. The Component incorporates a Bluetooth Core Specification v4.2 compliant BLE protocol stack and
provides API functions to enable user applications to interface with the underlying Bluetooth Low Energy Sub-System (BLESS)
hardware via the stack.
Technical Support
■ Frequently Asked Questions (FAQs): Learn more about our BLE ECO System.
■ Forum: See if your question is already answered by fellow developers on the PSoC 4 BLE and PRoC BLE forums.
■ Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States,
you can talk to our technical support team by calling our toll-free number: +1-800-541-4736. Select option 2 at the prompt.
Document Number: 002-11186 Rev. ** Page 2 of 37
PRELIMINARY
CYBLE-222014-01
Contents
Overview ............................................................................4
Module Description ...................................................... 4
Pad Connection Interface ................................................ 6
Recommended Host PCB Layout ................................... 7
Power Supply Connections
and Recommended External Components .................. 10
Connection Options ...................................................10
External Component Recommendation .................... 10
Critical Components List ...........................................12
Antenna Design ......................................................... 12
Electrical Specification .................................................. 13
GPIO .........................................................................15
XRES .........................................................................16
Digital Peripherals ..................................................... 19
Serial Communication ...............................................21
Memory .....................................................................22
System Resources ....................................................22
Environmental Specifications .......................................28
Environmental Compliance ....................................... 28
RF Certification .......................................................... 28
Environmental Conditions ......................................... 28
ESD and EMI Protection ...........................................28
Regulatory Information .................................................. 29
FCC ...........................................................................29
Industry Canada (IC) Certification .............................30
European R&TTE Declaration of Conformity ............ 30
MIC Japan ................................................................. 31
KC Korea ................................................................... 31
Packaging ........................................................................32
Ordering Information ...................................................... 34
Part Numbering Convention ......................................34
Acronyms ........................................................................35
Document Conventions ................................................. 35
Units of Measure ....................................................... 35
Document History Page ................................................. 36
Sales, Solutions, and Legal Information ...................... 37
Worldwide Sales and Design Support ....................... 37
Products ....................................................................37
PSoC® Solutions ......................................................37
Cypress Developer Community .................................37
Technical Support .....................................................37
Document Number: 002-11186 Rev. ** Page 3 of 37
PRELIMINARY
CYBLE-222014-01
Overview
Module Description
The CYBLE-222014-01 module is a complete module designed to be soldered to the applications main board.
Module Dimensions and Drawing
Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE
module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs
should be held within the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm).
Table 1. Module Design Dimensions
Dimension Item Specification
Module dimensions
Antenna location dimensions
PCB thickness Height (H) 0.50 ± 0.10 mm
Shield height Height (H) 1.10 ± 0.10 mm
Maximum component height Height (H) 1.30 mm typical (chip antenna)
Total module thickness (bottom of module to highest component) Height (H) 1.80 mm typical
See Figure 1 on page 5 for the mechanical reference drawing for CYBLE-222014-01.
Length (X) 10.00 ± 0.15 mm
Width (Y) 10.00 ± 0.15 mm
Length (X) 7.00 ± 0.15 mm
Width (Y) 5.00 ± 0.15 mm
Document Number: 002-11186 Rev. ** Page 4 of 37
PRELIMINARY
CYBLE-222014-01
Figure 1. Module Mechanical Drawing
Top View (View from Top)
Bottom View (Seen from Bottom)
Side View
Note
1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on
recommended host PCB layout, see “Recommended Host PCB Layout” on page 7.
Document Number: 002-11186 Rev. ** Page 5 of 37
PRELIMINARY
CYBLE-222014-01
Pad Connection Interface
Host PCB Keep Out Area Around Chip Antenna
As shown in the bottom view of Figure 1 on page 5, the CYBLE-222014-01 connects to the host board via solder pads on the back
of the module. Ta bl e 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-222014-01 module.
Table 2. Solder Pad Connection Description
Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch
SP 22 Solder Pads 0.71 mm 0.41 mm 0.76 mm
Figure 2. Solder Pad Dimensions (Seen from Bottom)
To maximize RF performance, the host layout should follow these recommendations:
1. The ideal placement of the Cypress BLE module is in a corner of the host board with the chip antenna located at the far corner.
This placement minimizes the additional recommended keep out area stated in item 2. Please refer to AN96841 for module
placement best practices.
2. To maximize RF performance, the area immediately around the Cypress BLE module chip antenna should contain an additional
keep out area, where no grounding or signal traces are contained. The keep out area applies to all layers of the host board. The
recommended dimensions of the host PCB keep out area are shown in Figure 3 (dimensions are in mm).
Figure 3. Recommended Host PCB Keep Out Area Around the CYBLE-222014-01 Chip Antenna
Document Number: 002-11186 Rev. ** Page 6 of 37
PRELIMINARY
CYBLE-222014-01
Recommended Host PCB Layout
Top View (On Host PCB)
Top View (On Host PCB)
Figure 4, Figure 5, Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout pattern for the
CYBLE-222014-01. Dimensions are in millimeters unless otherwise noted. Pad length of 0.91 mm (0.455 mm from center of the pad
on either side) shown in Figure 6 is the minimum recommended host pad length. The host PCB layout pattern can be completed using
either Figure 4, Figure 5, or Figure 6. It is not necessary to use all figures to complete the host PCB layout pattern.
Figure 4. Host Layout Pattern for CYBLE-222014-01 Figure 5. Module Pad Location from Origin
Document Number: 002-11186 Rev. ** Page 7 of 37
PRELIMINARY
CYBLE-222014-01
Ta bl e 3 provides the center location for each solder pad on the CYBLE-222014-01. All dimensions reference the to the center of the
solder pad. Refer to Figure 6 for the location of each module solder pad.
Table 3. Module Solder Pad Location Figure 6. Solder Pad Reference Location
Solder Pad
(Center of Pad)
1 (0.26, 1.64) (10.24, 64.57)
2 (0.26, 2.41) (10.24, 94.88)
3 (0.26, 3.17) (10.24, 124.80)
4 (0.26, 3.93) (10.24, 154.72)
5 (0.26, 4.69) (10.24, 184.65)
6 (0.81, 9.74) (31.89, 383.46)
7 (1.57, 9.74) (61.81, 383.46)
8 (2.34, 9.74) (92.13, 383.46)
9 (3.10, 9.74) (122.05, 383.46)
10 (3.86, 9.74) (151.97, 383.46)
11 (4.62, 9.74) (181.89, 383.46)
12 (5.38, 9.74) (211.81, 383.46)
13 (6.15, 9.74) (242.13, 383.46)
14 (6.91, 9.74) (272.05, 383.46)
15 (7.67, 9.74) (301.97, 383.46)
16 (8.43, 9.74) (331.89, 383.46)
17 (9.19, 9.74) (361.81, 383.46)
18 (9.75, 8.50) (383.86, 334.65)
19 (9.75, 7.74) (383.86, 304.72)
20 (9.75, 6.98) (383.86, 274.80)
21 (9.75, 6.22) (383.86, 244.88)
Location (X,Y) from
Orign (mm)
Dimension from
Orign (mils)
Document Number: 002-11186 Rev. ** Page 8 of 37
PRELIMINARY
CYBLE-222014-01
Ta bl e 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on
Notes
2. TCPWM stands for timer, counter, and PWM. If supported, the pad can be configured to any of these peripheral functions.
3. The main board needs to connect both GND connections (Pad 1 and Pad 10) on the module to the common ground of the system.
4. When using the capacitive sensing functionality, Pad 2 (P4.1) can be connected to a C
TAN K
capacitor (located off of Cypress BLE Module). C
Tank
should be used
if implementing a shield layer on the capacitive sensor. If used, this capacitor should be placed as close to the module as possible.
5. When using the capacitive sensing functionality, Pad 21 (P4.0) must be connected to a C
MOD
capacitor (located off of Cypress BLE Module). The value of this
capacitor is 2.2 nF and should be placed as close to the module as possible.
6. If the I
2
S feature is used in the design, the I2S pins shall be dynamically routed to the appropriate available GPIO by PSoC Creator
CYBLE-222014-01, the BLE device port-pin, and denotes whether the function shown is available for each solder pad. Each
connection is configurable for a single option shown with a ✓.
Table 4. Solder Pad Connection Definitions
Solder Pad
Number
1GND
2P4.1
3P5.1✓(TX) ✓(SCLK) ✓(SCL) ✓✓(Sensor) ✓✓ ✓
4P5.0✓(RX) ✓(SS) ✓(SDA) ✓✓(Sensor) ✓✓
5V
6P1.6
7P0.7✓(CTS) ✓(SCLK) ✓✓(Sensor) ✓✓(SWDCLK) ✓
8P0.4✓(RX) ✓(MOSI) ✓(SDA) ✓✓(Sensor) ✓✓ ✓
9P0.5✓(TX) ✓(MISO) ✓(SCL) ✓✓(Sensor) ✓✓
10 GND Ground Connection
11 P0 .6
12 P1.7 ✓(CTS) ✓(SCLK) ✓✓(Sensor) ✓✓
13 V
14 XRES External Reset Hardware Connection Input
15 P3.5
16 P3.4 ✓(RX) ✓(SDA) ✓✓(Sensor) ✓✓
17 P3.7 ✓(CTS) ✓(MISO) ✓(Sensor) ✓✓ ✓
18 P1.4 ✓(RX) ✓(MOSI) ✓(SDA) ✓✓(Sensor) ✓✓
19 P1.5 ✓(TX) ✓(MISO) ✓(SCL) ✓✓(Sensor) ✓✓
20 P3.6 ✓(RTS) ✓✓(Sensor) ✓✓
21 P4.0
Device
Port Pin
[3]
[4]
DDR
DD
[5]
UART SPI I2C TCPWM
[2]
CapSense
Ground Connection
✓(CTS) ✓(MISO) ✓✓(Sensor /
C
TAN K
Radio Power Supply (1.9V to 5.5V)
WCO
ECO_OUT LCD SWD GPIO
Out
✓✓
)
✓(RTS) ✓(SS) ✓✓(Sensor) ✓✓
✓(RTS) ✓(SS) ✓✓(Sensor) ✓✓(SWDIO) ✓
Digital Power Supply Input (1.71 to 5.5V)
✓(TX) ✓(SCL) ✓✓(Sensor) ✓✓
✓(RTS) ✓(MOSI) ✓✓(C
) ✓✓
MOD
Document Number: 002-11186 Rev. ** Page 9 of 37
PRELIMINARY
CYBLE-222014-01
Power Supply Connections and Recommended External Components
Two Ferrite Bead Option
Single Ferrite Bead Option
Power Connections
The CYBLE-222014-01 contains two power supply connections,
VDD and VDDR. The VDD connection supplies power for both
digital and analog device operation. The VDDR connection
supplies power for the device radio.
VDD accepts a supply range of 1.71 V to 5.5 V. VDDR accepts
a supply range of 1.9 V to 5.5 V. These specifications can be
found in Table 9. The maximum power supply ripple for both
power connections on the module is 100 mV, as shown in
Ta bl e 7 .
The power supply ramp rate of VDD must be equal to or greater
than that of VDDR.
Connection Options
Two connection options are available for any application:
1. Single supply: Connect VDD and VDDR to the same supply.
2. Independent supply: Power VDD and VDDR separately.
Figure 7. Recommended Host Schematic Options for a Single Supply Option
External Component Recommendation
In either connection scenario, it is recommended to place an
external ferrite bead between the supply and the module
connection. The ferrite bead should be positioned as close as
possible to the module pin connection.
Figure 7 details the recommended host schematic options for a
single supply scenario. The use of one or two ferrite beads will
depend on the specific application and configuration of the
CYBLE-222014-01.
Figure 8 details the recommended host schematic for an
independent supply scenario.
The recommended ferrite bead value is 330 , 100 MHz. (Murata
BLM21PG331SN1D).
Figure 8. Recommended Host Schematic for an Independent Supply Option
Document Number: 002-11186 Rev. ** Page 10 of 37
PRELIMINARY
CYBLE-222014-01
The CYBLE-222014-01 schematic is shown in Figure 9.
Figure 9. CYBLE-222014-01 Schematic Diagram
Document Number: 002-11186 Rev. ** Page 11 of 37
PRELIMINARY
CYBLE-222014-01
Critical Components List
Ta bl e 5 details the critical components used in the CYBLE-222014-01 module.
Table 5. Critical Component List
Component Reference Designator Description
Silicon U1 76-pin WLCSP Programmable Radio-on-Chip (PRoC) with BLE
Crystal Y1 24.000 MHz, 10PF
Crystal Y2 32.768 kHz, 12.5PF
Antenna E1 2.4 – 2.5 GHz chip antenna
Antenna Design
Ta bl e 6 details the chip antenna used in the CYBLE-222014-01 module. The specifications listed are according to the vendor’s
datasheet. The Cypress module performance improves many of these characteristics. For more information, see Ta b le 8 .
Table 6. Chip Antenna Specifications
Item Description
Chip Antenna Manufacturer Johanson Technology Inc.
Chip Antenna Part Number 2450AT18B100
Frequency Range 2400 – 2500 MHz
Peak Gain 0.5 dBi typical
Average Gain -0.5 dBi typical
Return Loss 9.5 dB minimum
Document Number: 002-11186 Rev. ** Page 12 of 37
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