Cypress W184 Datasheet

Six Output Peak Reducing EMI Solution
Features
Cypress PREMIS™ family offering
• Generates an EMI optimized c locking signal at the output
• Selectable i nput t o output frequency
• Six 1.25%, 3.75%, or 0% down or center spr ead outputs
• One non-Spread refer ence output
• Integrated loop filter components
• Operates with a 3.3 or 5V supply
• Low power CMOS design
• Available in 24-pin SSOP (Shrunk Small Outline Package)
• Outputs may be selectively disabled
Key Specifications
Suppl y Voltages: ............ .. ... ....... .. ... ....... ... ....VDD = 3.3V±5%
Fr equency Range: ................. .......... ... 8 MHz ≤ F
Crystal Reference Range.................... 8 MHz ≤ F
Cycle to Cy c le Ji tte r:........... ....... .. ... ....... ... .. ..... 300 ps (max.)
Selectabl e Spread Percentage: ....... .. .......... .1.2 5% or 3.75%
Output Duty Cycle: ............................... 40/60% (worst case)
Output R is e a n d Fall Tim e : . .. .. ........ .. ... ....... .. ... .... 5 ns (max.)
or V
= 5V±10%
DD
28 MHz
in
28 MHz
in
Table 1. Modulation Width Selection
SS%
0F
1F
W184
Output
F
in
out
F
in
out
– 1.25% F
F
in
– 3.75% F
F
in
0.625%
–1.875%
W184-5
Output
+ 0.625% ≥ F
in
+ 1.875% ≥ F
in
T able 2. Frequency Range Selection
FS2 FS1 Frequency Range
00 8 MHz ≤ F 0 1 10 MHz ≤ F 10 15 MHz ≤ F 11 18 MHz ≤ F
IN
IN IN IN
10 MHz
15 MHz
18 MHz
28 MHz
Table 3. Output Enable
EN1 EN2 CLK0:4 CLK5
0 0 Low Low 01Low Active 10Active Low 1 1 Active Active
W184
in
in≥
Simplified Block Diagram
3.3 or 5.0V
X1
XTAL Input
Oscillator or Ref e re nce Input
PREMIS is a trademark of Cypress Semiconductor Corporation.
X2
W184
3.3 or 5.0V
W184
Spread Spectrum Outputs
(EMI suppres s ed )
Spread Spectrum
Outputs
(EMI suppressed)
Pin Configuration
SSOP
REFOUT
FS2
GND SS%
EN2 GND
CLK0 VDD CLK1 CLK2
X1 X2
1 2 3 4
5 6
7
8 9
10
11
12
24 23
W184/W184-5
22 21 20 19 18 17 16 15
14 13
SSON# RESET FS1 VDD VDD
NC EN1
CLK5 VDD CLK4
GND CLK3
Cypress Semiconductor Corporation
3901 North First Street San Jose CA 95134 408-943-2600 July 2 5, 2000, rev. *B
Pin Definitions
W184
Pin Name Pin No.
CLK0:5 9, 11, 12 , 13,
15, 17
CLKIN or X1 3 I
NC or X2 4 I
SS% 6 I
Reset 23 I
REFOUT 14 O
EN1:2 18, 7 I
SSON# 24 I
FS1:2 22, 2 I
VDD 10, 16, 20, 21 P
Pin
Ty pe Pin Description
O
Modulated Frequency O utputs:
ulated input clock (SSON# asserted).
Crystal Connection or External Reference Frequency Input:
dual functions. It may ei ther be connected to an external crystal, or to an external reference clock.
Crystal Connection:
connected.
Modulation Width Selection:
this pin is used to selec t t he am ount of v ariation and peak EM I r eduction that is desired on the output signal. This pin has an int ernal pull-up resistors.
Modulation Profile Restart:
pattern at the begi nning of its de fined path . This pin has an internal pul l-do wn resistor.
Non-Modulated Output:
This output will not have the Spread Spectrum feature enabled regardless of the state of logic input SSON#.
Output Enable Select Pins:
buffers. Set them to di sable unused outputs using Table 3 as a guid e.
Spread Spectrum Contro l (Active LOW):
turns the internal modul ation wav e f orm on. Thi s pin has an internal pul l-do wn resistor.
Frequency Selection Bit 1 and 2:
tion. Refer to Table 1. These pins have internal pull-up resistors.
Po wer Connec tion:
If using an external re ference, this pin must be left un-
This pin provides a copy of the ref erence frequ ency.
Connected to 3.3V or 5V po wer supply.
Fr equency modu lat ed copi es of th e unmod -
This pin has
When Spread Spectrum feature is turned on,
A rising edge on this input restarts the modulati on
These pins contr ol the act ivi ty of spec ifi c output
Asserting this signal (acti ve LOW )
These pins select the frequency of opera-
2
W184
Overview
The W184 products are one series of devices in the Cypress PREMIS family. The PREMIS family incorporates the latest advanc es in PLL spread spectrum frequency synthesizer t ech­niques. By frequency modulating the output with a low­frequency carrier, peak EMI is greatly reduced. Use of this technology allows systems to pass increasingly difficult EMI testing without resorting to costly shielding or redesign.
In a system, not only i s EMI reduce d in the v arious cl oc k li nes, but also in all signals which are synchronized to the clock. Therefore, the benefits of using this technology increase with the number of address and dat a lines in the syst em. The Sim­plified Block Diagram sho ws a simple implementa ti on.
Functional Description
The W184 uses a Phase-Locked Loop (PLL) to frequency modulate an input clock. The result is an output clock whose frequency is slowly swept over a narrow band near the input signal. The basic circuit topology is shown in Figure 1. The input reference signal is divided by Q and fed to the phase detector. A signal from the VCO is divided by P and fed back to the phase detec tor als o . The PLL will f or ce the frequen cy of the VCO output sign al to change until the divid ed output signal and the divided reference signal match at the phase detector input. The output frequency is then equal to the ratio of P/Q
times the ref er ence fre quenc y. (Note: Fo r the W 184 the ou tpu t frequency is nominally equal to the input frequency.) The unique feature of the Spread Spectrum Frequency Timing Generator is that a modulating waveform is superimposed at the input to th e VCO. This causes the VCO output to be s low ly swept across a predetermined frequency band.
Because the modulating frequency is typically 1000 times slower than the fundamental clock, the spread spectrum pro­cess has little impact on system performance.
Frequency Selection With SSFTG
In Spread Spectrum Frequency Timing Generation, EMI re­duction depends on the shape, modulation percentage, and frequency of the modulating waveform. While the shape and frequency of the modulating waveform are fixed for a given frequency, the modulation percent age m ay be varied .
Using frequency select bits (FS1:2 pins), the f requency range can be set. Spreading percentage may be selected to 1.25% or 3.75% (see Tabl e 1).
A larger spreading per centage improv es EMI reduction. Ho w­ever, large spread percentages may either exceed system maximum frequ ency ra tings o r lo wer the a v er age fr eque ncy to a point where performance is affected. For these reasons, spreading percent age options are provided.
V
DD
Clock Input
Reference Input (EMI suppressed)
Freq. Phase
Q
Detector
Feedback
Divider
P
Charge
Pump
GND
Σ
Modulating
Waveform
VCO
PLL
Post
DividersDivider
CLKOUT
Figure 1. Functional Block Diagram
3
W184
Spread Spectrum Frequency Timing Generation
The device generates a clock that is frequency modulated in order to increase the bandwidth that it occu pies. By increas ing the bandwidth of the fundamental and its harmonics, the am­plitudes of the radiated electromagnetic emissions are re­duced. This effect is depicted in
As shown in
)LJXUH
, a harmonic of a modulated clock has a much low er amplit ude than that of an un modulated si gnal. The reduction in amplitude is dependent on the harmonic number and the frequency deviation or spread. The equation for the reduction is:
dB = 6.5 + 9*log
Amplitude (dB)
(P) + 9*log10(F)
10
SSFTG Typical Clock
)LJXUH
.
Where P is the pe rcentag e of de vi ation an d F is the frequency in MHz where the reduction is measured.
The output clock is modulated with a waveform depicted in
)LJXUH
. This waveform, as discussed in Spread Spectrum Clock Gener ation f or the Redu ct ion of Radiat ed Emission s by Bush, Fessler, and Hardin produces the maximum reduction in the amplitude of radiat ed electro magnetic emis sions.
details the Cypress spreading pattern. Cypress does offer
)LJXUH
options with more spread and greater EMI reduction. Contact your local Sales representative for details on these devices.
EMI Reduction
Spread
Spectrum
Enabled
Amplitude (dB)
Non-
Spread
Spectrum
Frequency Span (MHz)
Center Spread
Frequency Span (MHz)
Down Spread
Figure 2. Clock Har monic with and without SSCG Modulat ion Frequenc y Domain Represent ation
MAX.
10%
20%
30%
40%
50%
60%
70%
80%
FREQUENCY
MIN.
90%
100%
10%
20%
30%
40%
50%
60%
70%
80%
Figure 3. Typical Modulation Profile
90%
100%
4
Absolute Maximum Ratings
W184
Stresses greater than those listed in this table may cause per­manent damage to the de vice . These represent a stress ratin g only. Operation of the device at these or any other conditions
.
above those specified in the operating sections of t his specifi­cation is not implied. Maximum conditions for ex tended peri­ods may affect reliability.
Parameter Description Rating Unit
V
, V
DD
IN
T
STG
T
B
T
A
P
D
DC Electr i cal C h ar acteristics
Voltage on any pin with respect to GND –0.5 to +7 .0 V Storage Temperature –65 to +150 °C Ambient Temperature under Bias –55 to +125 °C Operating Temperature 0 to +70 °C Power Dissipation 0.5 W
:
0°C < T
< 70°C, VDD = 3.3V ±5%
A
Parameter Description T est Condition Min. Typ. Max. Unit
I
DD
t
ON
V
IL
V
IH
V
OL
V
OH
I
IL
I
IH
I
OL
I
OH
C
I
C
I
R
P
Z
OUT
Note:
1. Inputs FS1:2, SS% have a pull-up resistor; Input SSON# has a pull-down resistor.
Supply Current 18 32 mA Power Up Time First locked clock c ycle after Power
5ms
Good Input Low Voltage 0.8 V Input High Voltage 2.4 V Output Low Voltage 0.4 V Output High Voltage 2.4 V Input Low Current Note 1 –50 µA Input High Current Note 1 50 µA Output Low Current @ 0.4V, VDD = 3.3V 15 mA Output High Current @ 2.4V, VDD = 3.3V 15 mA Input Capacitance All pins e xcept CLKIN 7 pF Input Capacitance CLKIN pin only 6 10 pF Input Pull-Up Resistor 500 k Clock Output I mp edance 25
5
W184
DC Electr i cal C h ar acteristics:
0°C < T
< 70°C, VDD = 5V ±10%
A
Parameter Description Test Condi ti on Min. Typ. Max. Unit
I
DD
t
ON
V
IL
V
IH
V
OL
V
OH
I
IL
I
IH
I
OL
I
OH
C
I
C
I
R
P
Z
OUT
AC Electrical Characteristics:
Supply Current 30 50 mA Power Up Time First locked clock cycle after
5ms
Power Good Input Low Voltage 0.15V Input High Voltage 0.7V
DD
DD
Output Low Voltage 0.4 V Output High Voltage 2.4 V Input Low Current Note 2 –50 µA Input High Current Note 2 50 µA Output Low Current @ 0.4V, VDD = 5V 24 mA Output High Current @ 2.4V, VDD = 5V 24 mA Input Capacitance All pins except CLKIN 7 pF Input Capacitance CLKIN pin only 6 10 pF Input Pull-Up Resistor 500 k Clock Output I mp edance 25
TA = 0°C to +70°C, VDD = 3.3V ±5% or 5V±10%
Symbol Parameter T est Condition Min. Typ. Max. Unit
f
IN
f
OUT
t
R
t
F
t
OD
t
ID
t
JCYC
EMI
RED
Input Frequency Input Clock 8 28 MHz Output Frequency Spread Off 8 28 MHz Output Rise Time VDD, 15-pF load 0.8V–2.4V 2 5 ns Output Fall Time VDD, 15-pF load 2.4V–0.8V 2 5 ns Output Duty Cycle 15-pF load 40 60 % Input Duty Cycle 40 60 % Jitter, Cycle-to-Cy c le 250 300 ps Harmonic Reduction f
= 40 MHz, thir d harmonic
out
measured, reference board,
8dB
15-pF load
t
SK
Note:
2. Inputs FS1:2 have a pull-up resistor; Input SSON# has a pull-down resistor.
Output to Output Skew 200 ps
V V
6
W184
Application Information
Recommended Circuit Configuration
For optimum performance in system applications the power supply decoupli ng scheme sho wn in Figure 4 should be used .
decoupling is important to both reduce phase jitter and
V
DD
EMI radiation. The 0.1-µF decoupling capacitor should be
W184
Clock Output
XTAL connection or NC
Clock Output
Clock Output Clock Output
R1
Logic Input
Reference Input
Logic Input Logic Input
R1
R1 R1
C1
0.1 µF
1 2 3 4
5 6 7
8
9
10 11 12
3.3 or 5V System Supply
placed as close to the V
pin as possible, otherwise the in-
DD
creased trace inductance will negate i ts decoupling capability. The 10-µF decoupling capacitor shown should be a tantalum type. For further EMI protection, the V
connection can be
DD
made via a ferrite bead, as shown.
Logic Input
24
Logic Input
23 22 21
20 19
18 16
15 14
13
17
Logic Input
NC
Logic Input
R1
R1
R1
FB
Clock Clock
Clock
Output Output
Output
C2 10-
C1
0.1
C1
0.1
µF Tantalum
µF
µF
C1
0.1 µF
Ordering Information
Ordering Code
W184 W184-5
Document #: 38-00797-B
Figure 4. Recommended Circuit Configuration
Package
Name
Package Type
H 24-Pin SSOP (209-mil)
7
Package Diagram
W184
24-Pin Shrink Small Outline Package (SSOP, 209 mils)
© Cypress Semiconductor Corporation, 2000. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it conv ey or imply any lice nse under patent or other rights. Cypress Semicondu ctor does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
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