CYPRESS PALCE20V8 User Manual

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PALCE20V8
Flash Erasable,
Reprogrammab l e CMOS PAL Device
Features
• Active pull-up on data input pins
• Low power version (20V8L) —55 mA max. commercial (15, 25 ns) —65 mA max. military/industrial
(15, 25 ns)
• Standard version has low power —90 mA max. commercial
(15, 25 ns) —115 mA max. commercial (10 ns) —130 mA max. military/industrial (15, 25 ns)
• CMOS Flash technology for electrical erasability and reprogrammability
• User-programmable macrocell
—Output polarity control —Individually selectable for registered or combinato-
rial operation
LogicBlock Diagram(PDIP/CDIP/QSOP)
GND11I
12
10
I
9
1098765 4321
I
8
I
7
I
6
• QSOP package availa ble —10, 15, and 25 ns com’l version
—15, and 25 ns military/industrial versions
• High reliability —Proven Flash technology
—100% programming and functional testing
Functional Description
The Cypress PALCE20V8 is a CMOS Flash Erasable sec­ond-generation programmable array logic device. It is imple­mented with the famili ar sum-of-product (AND-OR ) logic struc­ture and the programmable macroce ll .
The PALCE20V8 is executed in a 24-pin 300-mil molded DIP, a 300-mil c erdip, a 28-lead square ceramic lea dless chip car­rier, a 28-lead square pl astic leaded ch ip carrier , and a 24-lea d quarter size outline. The device provides up to 20 inputs and 8 outputs. The PALCE20V8 ca n be elec trical ly erase d and re­programmed. The programmable macrocell enables the de­vice to function as a superset to the familia r 24-pin PLDs such as 20L8, 20R8, 20R6, 20R4.
I
5
I
4
I
3
I
2
I
CLK/I
1
0
PROGRAMMABLE
AND ARRAY
(64 x 40)
8888888 8
MUX
13 15 16 17 18 19 20 21 22 23
OE/I
11
Macrocell Macrocell Macrocell Macrocell Macrocell Macrocell Macrocell Macrocell
14
I
12
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
MUX
24
6
I/O
I
7
V
13
CC
20V8–1
PAL is a registered trademark of Advanced Micro Devices, Inc.
Cypress Semiconductor Corporation 3901 North First Street San Jose CA 95134 408-943-2600 Document #: 38-03026 Rev. ** Revised March 26, 1997
PALCE20V8
Pin Configuration
5
3
6
4
7
5
8 9
6
10
7
11
8
PLCC/LCC
Top View
0
CC
1
2
IICLK/I
4 3 2 2827 26
121314 1516 1718
9
I
VII/O
NC
1
10
11
I
GND
NC
I
OE/I
7
13
I/O
25
6
I/O
24
5
I/O
23
4
NC
22
I/O
21
3
I/O
20
2
I/O
19
1
0
12
I/O
20V8–3
DIP/QSOP
Top View
CLK/I
1
24
V
CC
I
23
13
22
I/O
7
I/O
21
6
20
I/O
5
I/O
19
4
I/O
18
3
I/O
17
2
I/O
1
16
I/O
15
0
I
12
OE/I
11
20V8–2
NC
I I I
I I I
GND
0
I
1
I
2
I
3
I
4
I
5
I
6
I
7
I
8
I
9
I
10
2 3 4 5 6 7 8 9 10 11 14 12 13
Selection Guide
tPD ns tS ns tCO ns ICC mA
Generic Part Number
PALCE20V8−5 5 3 4 115 PALCE20V8−7 7.5 7 5 115 PALCE20V810 10 10 10 10 7 10 115 130 PALCE20V815 15 15 12 12 10 12 90 130 PALCE20V825 25 25 15 20 12 20 90 130 PALCE20V8L15 15 15 12 12 10 12 55 65 PALCE20V8L25 25 25 15 20 12 20 55 65
Shaded area contains preliminary information.
Coml/Ind Mil Coml/Ind Mil Coml/Ind Mil Coml Mil/Ind
Functional Description (continued)
The PALCE20V8 features 8 product terms per output and 40 input terms into the AN D array . The fi rst product term in a mac­rocell can be used eit her as an inter nal out put en abl e con tr ol or as a data product term.
There are a total of 18 architecture bits in the PALCE20V8 macrocell; two are global bits that apply to all macrocells and 16 that apply locally, two bits per macrocell. The architecture bits determine whether th e macrocell functions as a reg ister or combinatorial wi th invert ing or no ninvertin g output. The outp ut enable control c an come from an external pin o r internally fro m a product term. The output can also be perma ne ntly ena ble d, functioning as a dedicated output or permanently disabled, functioning as a dedicated input. Feedback paths are select­able from either the input/output pin associated with the mac­rocell, the input/outpu t pin as so ci ated wi th an adj ac ent pin, or from the macrocell register itself.
Power-Up Reset
All registers in the PALCE20V8 power-up to a logic LOW for predictable system initialization. For each register, the associ­ated output pin will be HIGH due to active-LOW outputs.
Electronic Signature
An electronic signature word is provided in the PALCE20V8 that consists of 64 bi ts of programmabl e memory that can co n­tain user-defined data.
Security Bit
A security bit is provided that defeats the readback of the in­ternal programmed pattern when the bit is programmed.
Low Power
The Cypress PALCE20V8 provides low-power operation through the use of CMO S technology , and in creased testabilit y with Flash reprogrammability.
Product Term Disable
Product Term Disabl e (PT D) fuses are included for e ach prod­uct term. The P TD fuses a llow each pro duct term to be individ­ually disabled.
Input and I/O Pin Pull-Ups
The PALCE20V8 input and I/O pins have built-in active pull-ups that will float unused inputs and I/Os to an active HIGH state (logical 1). All unused inputs and three-stated I/O pins should be connected to another active input, V Ground to improve noise immunity and reduce I
CC
, or
CC
.
Document #: 38-03026 Rev. ** Page 2 of 14
Configuration Table
CG
0
0 1 0 Registered Output Registered Med PALs 0 1 1 Combinatorial I/O Registered Med PALs 1 0 0 Combinatorial Output Small P A L s 1 0 1 Input Small P A L s 1 1 1 Combinatorial I/O 20L8 only
Macrocell
CG
1
CL0
x
Cell Configuration Devices Emulated
PALCE20V8
1
1
01X
0
CL0
CG
V
CC
CL1
x
x
1
CLK
CG1for pin 16 to 21 (DIP)
CG0for pin 15 and 22 (DIP)
Maximum Ratings
(Above which the useful life may be impai red. For user guide­lines, not tested.)
Storage Temperature .....................................−65°C to +150°C
Ambient Temperature with
Power Applied..................................................−55°C to +125°C
Supply Voltage to Ground Potential
(Pin 24 to Pin 12).................................................−0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State.....................................................−0.5V to +7.0V
DC Input Voltage.................................................−0.5V to +7.0V
1
1
OE
V
CC
QD
Q
100 0
1 01X
1 1 0
0 1
1
0
0 1 X
CL0
x
To
Adjacent
Macrocell
From Adjacent Pin
I/O
x
20V8–4
Output Current into Outputs (LOW).............................24 mA
DC Programming Voltage.............................................12.5V
Latch-Up Current.....................................................>200 mA
Operating Range
Range
Commercial 0°C to +75°C 5V ±5% Industrial 40°C to +85°C 5V ±10%
[1]
Military
Note:
is the instant on case temperature.
1. T
A
Ambient
Temperature V
CC
55°C to +125°C 5V ±10%
Document #: 38-03026 Rev. ** Page 3 of 14
PALCE20V8
Electrical Characteristics Ov er the Op erat ing Range
[2]
Parameter Description Test Conditions Min. Max. Unit
V
V
V V I
I
I I
IH
IL
SC CC
OH
OL
IH IL
[5]
[4]
Output HIGH Voltage VCC = Min.,
= VIH or V
V
IN
Output LOW Voltage VCC = Min.,
= VIH or V
V
IN
IOH = 3.2 mA Com’l 2.4 V
IL
IOH = 2 mA Mil/Ind IOL = 24 mA Com’l 0.5 V
IL
IOL = 12 mA Mil/Ind Input HIGH Level Guaranteed Input Logical HIG H Vo ltage for All Inputs Input LOW Level Guaranteed Input Logical LOW Voltage f or All Inputs Input or I/O HIGH Leakage
Current Input or I/O LOW Leakage
3.5V < VIN < V
CC
0V < VIN < VIN (Max.) −100 µA
Current Output Short Circuit Current VCC = Max., V Operating Power Supply
Current
VCC = Max.,
= 0V, VIH = 3V,
V
IL
Output Open, f = 15 MHz (counter)
OUT
[6,7]
= 0.5V
5, 7, 10 ns Com’l 115 mA
15, 25 ns 90 mA
15L, 25L ns 55 mA
10, 15, 25 ns Mil/Ind 130 mA
[3] [3]
2.0 V
0.5 0.8 V
30 150 mA
10 µA
15L, 25L ns Mil/Ind 65 mA
Capacitance
[7]
Parameter Description Test Conditions Typ. Unit
C C
IN OUT
Input Capacitance VIN = 2.0V @ f = 1 MHz 5 pF Output Capacitance V
= 2.0V @ f = 1 MHz 5 pF
OUT
Endurance Characteristics
[7]
Parameter Description Test Conditions Min. Max. Unit
N Minimum Reprogramm ing Cycle s Normal Programming Conditions 100 Cycles
Notes:
2. See the last page of this specification for Gro up A subgro up test in g infor ma ti on .
3. These are absolute values with respect to device ground. All overshoots due to system or tester noise are included.
4. V
(Min.) is equal to 3.0V for pulse durations less than 20 ns.
IL
5. The leakage current is due to the internal pull-up resistor on all pins.
6. Not more than one output should be tested at a time. Durati on of the sho rt circuit s hould not be more t han one secon d. V caused by tester ground degrad ation.
7. Tested initially and after any design or process changes that may affect these parameters.
= 0.5V has been chosen to a void test problems
OUT
Document #: 38-03026 Rev. ** Page 4 of 14
AC Test Loads and Waveforms
PALCE20V8
Specification S
tPD, t t
PZX
t
PXZ
CO
, t
EA
, t
ER
Closed 50 pF 200 390 390 750 1.5V Z H: Open
Z L: Closed H Z: Open
L Z: Closed
3.0V
GND
1
2ns
OUTPUT
ALL INPUT PULSES
90%
10%
2ns
20V8–5
TEST POINT
20V8–6
10%
90%
5V
S1
R1
R2
C
L
Commercial Military
C
L
1
R
2
R
1
R
Measured Output ValueR
2
1.5V
5 pF H Z: VOH 0.5V
L Z: V
+ 0.5V
OL
Document #: 38-03026 Rev. ** Page 5 of 14
PALCE20V8
Commercial and Industrial Switching Characteristics
[2]
20V8520V8−7 20V8−10 20V8−15 20V8−25
Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Unit
t
PD
t
PZX
t
PXZ
t
EA
t
ER
t
CO
t
S
t
H
t
P
t
WH
t
WL
f
MAX1
f
MAX2
f
MAX3
t
CF
t
PR
Shaded area contains preliminary information.
Notes:
8. Min. times are tested initially and after any design or process changes that may affect these parameters.
9. This parameter is measured as the time after OE HIGH level has fallen to 0.5 volts below V
10. This specification indicates the guaranteed maximum frequency at which a state machine configuration with external feedback can operate.
11. This specification indicates the guaranteed maximum frequency at which the device can operate in data path mode.
12. This specification indicates the guaranteed maximum frequency at which a state machine configuration with internal only feedback can operate.
13. This parameter is calculated from the clock period at f
Input to Output Propagation Delay
[8]
1 517.51 10 1 15 1 25 ns
OE to Output Enable 5610 15 20 ns OE to Output Disable 5610 15 20 ns Input to Output
Enable Delay Input to Output
Disable Delay
[7]
[7,9]
Clock to Output Delay Input or Feedback
[8]
6910 15 25 ns
6910 15 25 ns
1 4151 7 1 10 1 12 ns 3 7 10 12 15 ns
Set-Up Time Input Hold Time 0 0 0 0 0 ns External Clock Period
+ tS)
(t
CO
Clock Width HIGH Clock Width LOW External Maximum
Frequency (1/(t
CO
[7]
[7]
+ tS))
[7,10]
Data Path Maximum Frequency (1/(t
WH
Internal Feedbac k Maximum Frequency (1/(t
Register Clock to Feedback Input
Power-Up Reset Time
+ tWL))
[7, 11]
CF
[7, 13]
[7,12]
+ tS))
[7]
min. or a previous LOW le vel h as rise n to 0 .5 vol ts a bove VOL max.
OH
7 12 17 22 27 ns
3 5 8 8 12 ns 3 5 8 8 12 ns
143 83 58 45.5 37 MHz
166.
100 62.5 62.5 41.6 MHz
6
166.
100 62.5 50 40 MHz
6
336 8 10 ns
1 1 1 1 1 µs
pin or internal disable input disables or enable s the output pin. This delay is mea sured to the point at which a previous
internal (1/f
MAX
) as measured (s ee Note 7 above ) minu s tS.
MAX3
Document #: 38-03026 Rev. ** Page 6 of 14
PALCE20V8
Military Switching Characteristics
Parameter Description
t
PD
t
PZX
t
PXZ
t
EA
t
ER
t
CO
t
S
t
H
t
P
t
WH
t
WL
f
MAX1
f
MAX2
f
MAX3
t
CF
t
PR
Shaded area contains preliminary information.
Input to Output Propagation Delay
[8]
OE to Output Enable 10 15 20 ns OE to Output Disable 10 15 20 ns Input to Output Enable Delay Input to Output Disable Delay Clock to Output Delay Input or Feedback Set-Up T im e 10 12 20 ns Input Hold Time 0 0 0 ns External Clock Period (tCO + tS)20 24 40 ns Clock Width HIGH Clock Width LOW External Maximum Frequency
+ tS)
(1/(t
CO
Data Path Maxi mum Frequency
+ tWL))
(1/(t
WH
[7]
[7]
[7,10]
[7, 11 ]
Internal Feedback Maximum Frequency (1/(t
Register Clock to Feedback Input
CF
[7, 13]
+ tS))
Power-Up Reset Time
[2]
[8]
[7,12]
[7]
[7]
[7,9]
20V810
20V815 20V825
Min. Max. Min. Max. Min. Max. Unit
1101 15 1 25 ns
10 15 25 ns 10 15 25 ns
1101 12 1 20 ns
8 10 15 ns 8 10 15 ns
50 41.7 25 MHz
62.5 50 33.3 MHz
62.5 50 33.3 MHz
6 8 10 ns
1 1 1 µs
Document #: 38-03026 Rev. ** Page 7 of 14
Switching Waveform
INPUTS, I/O,
REGISTERED
FEEDBACK
CP
PALCE20V8
WH
t
WL
t
S
t
H
t
REGISTERED
OUTPUTS
COMBINATORIAL
OUTPUTS
Power-Up Reset Waveform
SUPPLY VOLTAGE
POWER
REGISTERED ACTIVE LOW
OUTPUTS
CLOCK
10%
t
CO
t
PD
90%
t
MAX= 1 µs
PR
t
P
t
PR
t
PXZ,tER
t
PXZ,tER
t
WL
[10]
[10]
t
S
tEA,t
tEA,t
PZX
PZX
20V8–7
20V8–8
V
[10]
[10]
CC
Document #: 38-03026 Rev. ** Page 8 of 14
Functional Logic Diagram for PALCE20V8
PIN NUMBERS DIP(PLCC) PACKAGE
1 (2)
2 (3)
3 (4)
4 (5)
280
320
600
0
0
16 20 24 28
1284
32 32 PTD
PIN NUMBERS DIP(PLCC)PACKAGE
1 0
CG
0
MC7 CL1=2560 CL0=2632
MC6 CL1=2561 CL0=2633
PALCE20V8
23 (27)
22 (26)
21 (25)
5 (6)
6 (7)
7 (9)
8 (10)
9 (11)
10 (12) 11 (13)
640
920
960
1240
1280
1560
1600
1880
1920
2200
2240
2520
ELECTRONIC SIGNATURE ROW
2568 2569. . . . . . 2630 2631
BYTE7 BYTE6 . . . . . . BYTE1BYTE0
MSB LSB
CL1=2562 CL0=2634
CL1=2563 CL0=2635
CL1=2564 CL0=2636
CL1=2565 CL0=2637
CL1=2566 CL0=2638
CL1=2567 CL0=2639
0 1
CG
0
CG0=2704 CG1=2705
MC5
20 (24)
MC4
19 (23)
MC3
18 (21)
MC2
17 (20)
MC1
16 (19)
MC0
15 (18)
14 (17)
13 (16)
20V8–9
Document #: 38-03026 Rev. ** Page 9 of 14
PALCE20V8
Ordering Information for PALCE20V8
I
(mA)
(ns)
115 5 3 4 PALCE20V85JC J64 28-Lead Plastic Leaded Chip Carrier Commercial 115 7.5 7 5 PALCE20V87JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
115 10 10 7 PALCE20V810JC J64 28-Lead Plastic Leaded Chip Carrier
130 10 10 10 PALCE20V810JI J64 28-Lead Plastic Leaded Chip Carrier Industrial
90 15 12 10 PALCE20V815JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
130 15 12 12 PALCE20V815JI J64 28-Lead Plastic Leaded Chip Carrier Industrial
90 25 15 12 PALCE20V825JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
130 25 20 20 PALCE20V825JI J64 28-Lead Plastic Leaded Chip Carrier Industrial
t
CC
PD
t
t
S
(ns)
CO
(ns) Ordering Code
PALCE20V87PC P13 24-Lead (300-Mil) Molded DIP
PALCE20V810PC P13 24-Lead (300-Mil) Molded DIP PALCE20V810QC Q13 24-Lead Quarter-Size Outline
PALCE20V810PI P13 24-Lead (300-Mil) Molded DIP PALCE20V810DMB D14 24-Lead (300-Mil) CerDIP Military PALCE20V810LMB L64 28-Pin Square Leadless Chip Carrier
PALCE20V815PC P13 24-Lead (300-Mil) Molded DIP PALCE20V815QC Q13 24-Lead Quarter-Size Outline
PALCE20V815PI P13 24-Lead (300-Mil) Molded DIP PALCE20V815QI Q13 24-Lead Quarter-Size Outline PALCE20V815DMB D14 24-Lead (300-Mil) CerDIP Military PALCE20V815LMB L64 28-Pin Square Leadless Chip Carrier
PALCE20V825PC P13 24-Lead (300-Mil) Molded DIP PALCE20V825QC Q13 24-Lead Quarter-Size Outline
PALCE20V825PI P13 24-Lead (300-Mil) Molded DIP PALCE20V825QI Q13 24-Lead Quarter-Size Outline PALCE20V825DMB D14 24-Lead (300-Mil) CerDIP Military PALCE20V825LMB L64 28-Pin Square Leadless Chip Carrier
Package
Name Package Type
Operating
Range
Shaded area contains preliminary information.
Document #: 38-03026 Rev. ** Page 10 of 14
PALCE20V8
Ordering Information for PALCE20V8L
I
(mA)
(ns)
t
CC
55 15 12 10 PALCE20V8L15JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
65 15 12 12 PALCE20V8L15JI J64 28-Lead Plastic Leaded Chip Carrier Industrial
55 25 15 12 PALCE20V8L25JC J64 28-Lead Plastic Leaded Chip Carrier Commercial
65 25 20 20 PALCE20V8L25JI J64 28-Lead Plastic Leaded Chip Carrier Industrial
PD
t
t
S
(ns)
CO
(ns) Ordering Code
PALCE20V8L15PC P13 24-Lead (300-Mil) Molded DIP PALCE20V8L15QC Q13 24-Lead Quarter-Size Outline
PALCE20V8L15PI P13 24-Lead (300-Mil) Molded DIP PALCE20V8L15QI Q13 24-Lead Quarter-Size Outline PALCE20V8L15DMB D14 24-Lead (300-Mil) CerDIP Military PALCE20V8L15LMB L64 28-Pin Square Leadless Chip Carrier
PALCE20V8L25PC P13 24-Lead (300-Mil) Molded DIP PALCE20V8L25QC Q13 24-Lead Quarter-Size Outline
PALCE20V8L25PI P13 24-Lead (300-Mil) Molded DIP PALCE20V8L25QI Q13 24-Lead Quarter-Size Outline PALCE20V8L25DMB D14 24-Lead (300-Mil) CerDIP Military PALCE20V8L25LMB L64 28-Pin Square Leadless Chip Carrier
Package
Name Package Type
Operating
Range
MILITARY SPECIFICATIONS Group A Subgroup Testing
DC Characteristics
Parameter Subgroups
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3
DC Characteristics
Parameter Subgroups
I
CC
1, 2, 3
Switching Characteristics
Parameter Subgroups
t
PD
t
CO
t
S
t
H
9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11
Document #: 38-03026 Rev. ** P age 11 of 14
Package Diagrams
PALCE20V8
24-Lead (300-Mil) CerDIP D14
MILSTD1835 D9 Config.A
28-Square Leadless Chip Carrier L64
28-Lead Plastic Leaded Chip Carrier J64
MILSTD1835 C4
Document #: 38-03026 Rev. ** Page 12 of 14
ng so indemnifies Cypress Semiconductor against all charges.
Package Diagrams (continued)
PALCE20V8
24-Lead (300-Mil) Molded DIP P13/P13A
24-Lead Quarter Size Outline
Q13
Document #: 38-03026 Rev. ** Page 13 of 14
© Cypress Semiconductor Corporation, 1997. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress Semiconductor product. No r does it convey or imply any license under patent or other rights. Cypress Semiconductor does not autho rize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress Semiconductor products in life-support systems application implies that the manufacturer assume s all risk of such use and in doi
Document Title: PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL® Devic e Document Number: 38-03026
REV. ECN NO.
** 106371 07/11/01 SZV Change from Spec Number: 38-00367 to 38-03026
Issue
Date
Orig. of
Change Description of Change
PALCE20V8
Document #: 38-03026 Rev. ** Page 14 of 14
Copyright © Each Manufacturing Company.
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