❐ M8C Processor Speeds to 24 MHz
❐ 8x8 Multiply, 32-Bit Accumulate
❐ Low Power at High Speed
❐ 2.4 to 5.25 V Operating Voltage
❐ Operating Voltages Down to 1.0V Using On-
❐ 256 Bytes SRAM Data Storage
❐ In-System Serial Programming (ISSP ™)
❐ Partial Flash Updat es
❐ Flexible Protection Modes
❐ EEPROM Emulation in Flash
■ Programmable Pin Configurations
❐ 25 mA Sink on all GPIO
❐ Pull up, Pull down, High Z, Strong, or Open
Drain Drive Modes on all GPIO
❐ Up to 10 Analog Inputs on GPIO
❐ Two 30 mA Analog Outputs on GPIO
❐ Configurable Interrupt on all GPIO
Analog
Drivers
PSoC™ Functional Overview
The PSoC™ family consists of many Mixed-Signal Array with
On-Chip Controller devices. These devices are designed to
replace multiple traditional MCU-based system components
with one, low cost single-chip programmable device. PSoC
devices include configurable blocks of analog and digital logic,
as well as programmable interconnects. This architecture
allows the user to create customized peripheral configurations
that match the requirements of each individual application.
Sleep and
Watchdog
Additionally, a fast CPU, Flash program memory, SRAM data
memory, and configurable IO are included in a range of convenient pinouts and packages.
The PSoC architecture, as illustrated on the left, is com pri se d of
four main areas: PSoC Core, Digital System, Analog System,
and System Resources. Configurable global busing allows all
Analog
Ref
the device r esources to be c ombined into a compl ete custom
system. The PSoC CY8C2 4x23A f amily ca n ha ve up t o three IO
ports that connec t to the gl obal di git al and a nalog i ntercon ne cts ,
Analog
Input
Muxing
providing access to 4 digital blocks and 6 analog blocks.
The PSoC Core
■ New CY8C24x23A PSoC Device
❐ Derived from the CY8C24x23 Device
❐ Low Power and Low Voltage (2.4V)
■ Additional System Resources
2
❐ I
C™ Slave, Master, and Multi-Master to
400 kHz
❐ Watchdog and Sleep Timers
❐ User-Configurable Low Voltage Detection
❐ Integrated Supervisory Circuit
❐ On-Chip Precision Voltage Reference
■ Complete Development Tools
❐ Free Development Software
processor. The CPU utilizes an interrupt controller with 11 vectors, to simplify programming of real time embedded events.
Program execution is timed and protected using the included
Sleep and Watch Dog Timers (WDT).
Memory encompasses 4 KB of Flash for program storage, 256
bytes of SRAM for data storage, and up to 2 KB of EEPROM
emulated using the Flash. Program Flash utilizes four protection levels on blocks of 64 bytes, allowing customized software
IP protection.
The PSoC device incorporates flexible internal clock generators, including a 24 MHz IMO (internal main oscillator) accurate
to 2.5% over temperature and voltage. The 24 MHz IMO can
also be doubled to 48 MHz for use by the digital system. A low
power 32 kHz ILO (internal low speed oscillator) is provided for
the Sleep timer and WDT. If crystal accuracy is desired, the
ECO (32.768 kHz external crystal oscillator) is available for use
as a Real Time Cloc k (RT C) and can opti onally genera te a crys tal-accurate 24 MHz system clock using a PLL. The clocks,
together with programmable clock dividers (as a System
Resource), provide the flexibility to integrate almost any timing
requirement into the PSoC device.
PSoC GPIOs provide conne ct ion t o the CP U, di gital and analog
resources of the devi ce. Each pin’ s dri ve mod e may b e selec te d
from eight options, allowing great flexibility in external interfacing. Every pin also has the c apa bility to gen erate a syste m inte rrupt on high level, low level, and change from last read.
Digital peripheral configurations include those listed below.
■ PWMs (8 to 32 bit)
■ PWMs with Dead band (8 to 24 bit)
■ Counters (8 to 32 bit)
■ Timers (8 to 32 bit)
■ UART 8 bit with selectable parity
■ SPI master and slave
■ I2C slave and multi-master (1 available as a System
Resource)
■ Cyclical Redundancy Checker/Generator (8 to 32 bit)
■ IrDA (up to 1)
■ Pseudo Random Sequence Generators (8 to 32 bit)
The digital blocks can be connected to any GPIO through a
series of global buses that can route any signal to any pin. The
buses also allow for signal multiplexing and for performing logic
operations. This co nfig ura bil ity free s y our d e si gn s fro m th e co nstraints of a fixed peripheral controller.
Digital blocks are provided in rows of four, where the number of
blocks varies by PSoC device family. This allows you the optimum choice of system resources for your application. Family
resources are shown in the table titled “PSoC Device Charac-
teristics” on page 3.
The Analog System
The Digital System
The Digital System is composed of 4 digital PSoC blocks. Each
block is an 8-bit resource that can be used alone or combined
with other blocks to fo rm 8, 16 , 24, and 32-bit p eriphe rals, wh ich
are called user module references.
Port 1
Port 2
D
C
l
a
t
i
g
i
m
C
F
o
r
c
o
k
l
r
o
e
To System Bus
s
DIGITAL SYSTEM
Digital PSoC Block Array
8
DBB00 DBB01 DCB02 DCB03
Row Input
Configuration
GIE[7:0]
GIO[7:0]
Row 0
Global Digital
Interconnect
Port 0
To Analog
System
4
4
GOE[7:0]
GOO[7:0]
Configuration
Row Output
8
The Analog System is com posed of 6 configurable blocks, each
comprised of an opamp circuit allowing the creation of complex
analog signal flows. Analog peripherals are very flexible and
can be customized to support specific appl ica tio n req uire me nts.
Some of the more common PSoC analog functions (most available as user modules) are listed below.
■ Analog-to-digital converters (up to 2, with 6- to 14-bit resolu-
tion, selectable as Incr emental, Delta Sigma, and SAR)
■ Filters (2 and 4 pole band-pass, low-pass, and notch)
■ Amplifiers (up to 2, with selectable gain to 48x)
■ Instrumentation amplifiers (1 with selectable gain to 93x)
■ Comparators (up to 2, with 16 selectable thresholds)
■ DACs (up to 2, with 6- to 9-bit resolution)
■ Multiplying DACs (up to 2, with 6- to 9-bit resolution)
■ High current output drivers (two w ith 30 mA drive as a Core
88
Resource)
■ 1.3V refer ence (as a System Resource)
■ DTMF dialer
■ Modulators
■ Correlators
■ Peak detectors
■ Many other topologies possible
Digital System Block Diagram
September 8, 2004Document No. 38-12028 Rev. *B2
CY8C24x23A Final Data SheetPSoC™ Overview
p
Analog blocks are arranged in a column of three, which
includes one CT (Continuous Time) and two SC (Switched
Capacitor) blocks, as shown in the figure below.
P0[7]
P0[5]
P0[3]
P0[1]
P2[3]
P2[1]
Interface to
Digital System
Array Input Confi guration
ACI0[1:0]
Block Array
ACB00ACB01
ASC10
ASD20
RefHi
RefLo
AGND
ACI1[1:0]
ASD11
ASC21
Analog Reference
Reference
Generators
P0[6]
P0[4]
P0[2]
P0[0]
P2[6]
RefIn
P2[4]
AGNDIn
P2[2]
P2[0]
AGNDIn
RefIn
Bandga
Additional System Resources
System Resources, some of which have been previously listed,
provide additional capability useful to complete systems. Additional resources include a multiplier, decimator, switch mode
pump, low voltage detection, and power on reset. Brief statements describing the merits of each system resource are presented below.
■ Digital clock dividers provide three customizable clock fre-
quencies for use in applic ations . The clo cks c an be route d to
both the digital a nd analog systems. Additiona l clocks c an be
generated using digital PSoC blocks as clock dividers.
■ A multiply accumulate (MAC) provides a fast 8-bit multiplier
with 32-bit accumula te, to assi st in both genera l math as well
as digital filters.
■ The decimator provides a custom hardware filter for digital
signal processing applications inc lud in g t he creation of De lt a
Sigma ADCs.
■ The I2C module provides 100 and 400 kHz communication
over two wires. Slave, master, and multi-master modes are
all supported.
■ Low Voltage Detection (LVD) interrupts can signal the appli-
cation of f alling voltage levels, w hile the adv anced POR
(Power On Reset) circuit eliminates the need for a system
supervisor.
■ An internal 1.3V refe rence provides an absolute reference fo r
the analog system, including ADCs and DACs.
■ An integrated switch mode pump (S MP) gene rate s norm al
operating volt ages f rom a single 1.2V batt ery cel l, providin g a
low cost boost converter.
PSoC Device Characteristics
Depending on your PSoC device characteristics, the digital and
analog systems can have 16, 8, or 4 digital blocks and 12, 6, or
3 analog blocks. The following table lists the resources
available for specific PSoC device groups. The PSoC device
covered by this data sheet is shown in the next to the last row of
the table.
The quickest path to understanding th e PSoC s ili co n is by rea ding this data sheet and using the PSoC Designer Integrated
Development Environment (IDE). This data sheet is an overview of the PSoC integrated circuit and presents specific pin,
register, and electrical specifications. For in-depth information,
along with detailed programming information, reference the
PSoC™ Mixed Signal Array Technical Reference Manual.
For up-to-date Ordering, Packag ing, an d Electri cal Specification
information, reference the latest PSoC device data sheets on
the web at http://www.cypress.com/psoc.
Development Kits
Development Kits are available from the following distributors:
Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store
at http://www.onfulfillment.com/cypressstore/ contains develop-
ment kits, C compilers, and all accessories for PSoC development. Click on PSoC (Programmable System-on-Chip) to view
a current list of available items.
Tele-Training
Free PSoC "Tele-training" is available for beginners and taught
by a live marketing or appli ca tio n eng in eer ov er th e pho ne . F ive
training cl asses are availabl e to accelerate th e learning curve
including introduction, designing, debugging, advanced design,
advanced analog, as well as application-specific classes covering topics like PSoC and the LIN bus. For days and times of the
tele-training, see http://www.cypress.com/support/training.cfm.
Consultants
Certified PSoC Consultants offer everything from technical
assistance to complete d PSoC d esign s. To contact or be come a
PSoC Consultant, go to the following Cypress support web site:
http://www.cypress.com/support/cypros.cfm.
Technical Support
PSoC application engineers take pride in fast and accurate
response. They can be reached with a 4-hour guaranteed
response at http://www.cypress.com/support/login.cfm.
Development Tools
The Cypress MicroSystems PSoC Designer is a Microsoft
Windows-based, integrated development environment for the
Programmable System-on-Chip (PSoC) devices. The PSoC
Designer IDE and application runs on Windows NT 4.0, Windows 2000, Windows Millennium (Me), or Windows XP. (Reference the PSoC Designer Functional Flow diagram below.)
PSoC Designer helps the customer to select an operating configuration for the PSoC, write application code that uses the
PSoC, and debug the application. This system provides design
database management by project, an integrated debugger with
In-Circuit Emulator, in-system programming support, and the
CYASM macro assembler for the CPUs.
PSoC Designer also supports a high-level C language compiler
developed specifically for the devices in the family.
PSoCTM
Designer
Importable
Design
Database
Device
Database
Application
Database
Project
Database
User
Modules
Library
Graphical Designer
Interface
Results
Commands
TM
PSoC
Designer
Core
Engine
Context
Sensitive
Help
PSoC
Configuration
Sheet
Manufacturing
Information
File
®
Application Notes
A long list of application notes will assist you in every aspect of
your design effort. To locate the PSoC application notes, go to
Emulation
Pod
In-Circuit
Emulator
http://www.cypress.com/design/results.cfm.
PSoC Designer Subsystems
September 8, 2004Document No. 38-12028 Rev. *B4
Device
Programmer
CY8C24x23A Final Data SheetPSoC™ Overview
PSoC Designer Software Subsystems
Device Editor
The Device Edi tor su bsyst em al lows th e use r to se lect di ffere nt
onboard analog and digital components called user modules
using the PSoC blocks. Examples of user modules are ADCs,
DACs, Amplifiers, and Filters.
The device editor also supports easy development of multiple
configurations and dynamic reconfiguration. Dynamic configuration allows for changing configurations at run time.
PSoC Designer sets up power-on initialization tables for
selected PSoC block configurations and creates source code
for an application framework. The framework contains software
to operate the selected components and, if the project uses
more than one operating configuration, contains routines to
switch between different sets of PSoC block configurations at
run time. PSoC Designer can print out a configuration sheet for
a given project configuration for use during application programming in conj unc tion with the D evice Data S heet . Once the
framework is generated, the user can add application-specific
code to flesh out the fr am ew ork . It’s also possible to change the
selected components and regenerate the framework.
Design Browser
The Design Browser allows users to select and import preconfigured desi g ns into th e u se r’s project. Use rs ca n ea s il y br ow se
a catalog of preconfigured designs to facilitate time-to-design.
Examples provided in the tool s i nclude a 300-baud modem , LIN
Bus master and slave, fan controller, and magnetic card reader.
Application Editor
In the Application Editor you can edit your C language and
Assembly language source code. You can also assemble, compile, link, and build.
Debugger
The PSoC Designer Debugger subsystem provides hardware
in-circuit emulation, allowing the designer to test the program in
a physical system while providing an internal view of the PSoC
device. Debugger commands allow the designer to read and
program and read and write data memory, read and write IO
registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The
debugger also allows the designer to create a trace buffer of
registers and memory locations of interest.
Online Help System
The online help system displays online, context-sensitive help
for the user. Designed for procedural and quick reference, each
functional subsystem has its own context-sensitive help. This
system also provides tutorials and links to FAQs and an Online
Support Forum to aid the designer in getting started.
Hardware Tools
In-Circuit Emulator
A low cost, high functionality ICE (In-Circuit Emulator) is available for development support. This hardware has the capability
to program single devices.
The emulator consist s of a bas e unit th at conne ct s to th e PC by
way of the parallel or USB port. The base unit is universal and
will operate with all PSoC devices. Emulation pods for each
device family ar e ava ilabl e sep arate ly. The emulation pod t akes
the place of the PSoC device in the target board and performs
full speed (24 MHz) operation.
Assembler. The macro assembler allows the assembly code
to be merged seamlessly with C code. The link libraries automatically use abso lut e addre ssing or ca n be co mpil ed in relat ive
mode, and linked with other software modules to get absolute
addressing.
C Language Compiler. A C language compiler is available
that supports Cypress MicroSystems’ PSoC family devices.
Even if you have never worked in the C language before, the
product quickly allows you to create complete C programs for
the PSoC family devices.
The embedded, optimizing C compiler provides all the features
of C tailored to the PSoC architecture. It comes complete with
embedded libraries providing port and bus operations, standard
keypad and display support, and extended math functionality.
September 8, 2004Document No. 38-12028 Rev. *B5
CY8C24x23A Final Data SheetPSoC™ Overview
User Module Development Process
The development process for the PSoC device differs from that
of a traditional fixed function microprocessor. The configurable
analog and d igital hard ware blocks give the PS oC archite cture
a unique flexibility that p ays d ivide nds in mana gi ng specifi catio n
change during development and by lowering inventory costs.
These configurable resources, called PSoC Blocks, have the
ability to implement a wide variety of user-selectable functions.
Each block has several registers that determine its fu nction and
connectivity to other blocks, multiplexers, buses and to the IO
pins. Iterative devel op men t cy cl es perm it y ou to adapt the hardware as well as the software. This substantially lowers the risk
of having to select a different part to meet the final design
requirements.
To speed the development process, the PSoC Designer Integrated Development Environment (IDE) provides a library of
pre-built, pre-tested hardware peripheral functions, called “User
Modules.” User modules make selecting and implementing
peripheral devices simple, and come in analog, digital, and
mixed signal varieties. The standard User Module library contains over 50 common peripherals such as ADCs, DACs Timers, Counters, UARTs, and other not-so common peripherals
such as DTMF Generators and Bi-Quad analog filter sections.
Each user module establishes the basic register settings that
implement the selected function. It also provides parameters
that allow you to tailor its precise configuration to your particular
applicati on. For exam ple, a Pulse Width Modula tor User Module configures one or more digital PSoC blocks, one for each 8
bits of resolution. The user module parameters permit you to
establish the pulse width and duty cycle. User modules also
provide tested software to cut your development time. The user
module application programming interface (API) provides highlevel functions to control and respond to hardware events at
run-time. The API als o provides o ptional inte rrupt servic e routines that you can adapt as needed.
The API functions are documented in user module data sheets
that are viewed directly in the PSo C Desi gn er ID E. Th es e data
sheets explain the internal operation of the user module and
provide performance specifications. Each data sheet describes
the use of each user mod ule p ara me ter a nd d oc um ent s the setting of each register controlled by the user module.
The development process starts when you open a new project
and bring up the Device Editor, a graphical user interface (GUI)
for configuring the hardware. You pick the user modules you
need for your project and map them onto the PSoC blocks with
point-and-click simplicity. Next, you build signal chains by interconnecting user modules to each other and the IO pins. At this
stage, you also configure the clock source connections and
enter parameter values directly or by selecting values from
drop-down menus. When you are ready to test the hardware
configuration or move on to develo ping co de for the proj ect, yo u
perform the “Generate Application” step. This causes PSoC
Designer to generate source code that automatically configures
the device to your specif ic atio n an d pro vi des the high -le vel us er
module API functions.
Device Editor
User
Module
Selection
Placement
and
Parameter-
ization
Source
Code
Generator
Generate
Application
Application Editor
Project
Manager
Source
Code
Editor
Build
Manager
Build
All
Debugger
Interface
to ICE
Storage
Inspector
Event &
Breakpoint
Manager
User Module and Source Code Development Flows
The next step is to write your main program, and any sub-routines using PSoC Designer’s Application Editor subsystem.
The Application Editor includes a Project Manager that allows
you to open the project source code files (including all generated code files) from a hierarchal view. The source code editor
provides syntax coloring and advanced edit features for both C
and assembly language. File search capabilities include simple
string searches and recursive “grep-style” patterns. A single
mouse click invokes the Build Manager. It employs a professional-strength “makefile” system to automatically analyze all
file dependencies and run the compiler and assembler as necessary. Project-level options control optimization strategies
used by the compiler and linker. Syntax errors are displayed in
a console window. Double clicking the error message takes you
directly to the offending line of source code. When all is correct,
the linker builds a HEX file image suitable for programming.
The last step in the devel opm en t proc es s t ak es pla ce insi de the
PSoC Designer’s Debugger subsystem. The Debugger downloads the HEX image to the In-Circuit Emulator (ICE) where it
runs at full speed. Debugger capabilities rival those of systems
costing many times more. In addition to traditional single-step,
run-to-breakpoint and watch-variable features, the Debugger
provides a large trace buffer and allows you define complex
breakpoint event s tha t inc lu de m oni tori ng ad dres s and da t a bu s
values, memory locations and external signals.
September 8, 2004Document No. 38-12028 Rev. *B6
CY8C24x23A Final Data SheetPSoC™ Overview
Document Conventions
Acronyms Used
The following table lists the acronyms that are used in this document.
AcronymDescription
ACalternating current
ADCanalog-to-digital converter
APIapplication programming interface
CPUcentral processing unit
CTcontinuous time
DACdigital-to-analog converter
DCdirect current
ECOexternal crystal oscillator
EEPROMelectrically erasable programmable read-only memory
FSRfull scale range
GPIOgeneral purpose IO
GUIgraphical user interface
HBMhuman body model
ICEin-circuit emulator
ILOinternal low speed oscillator
IMOinternal main oscillator
IOinput/output
IPORimprecise power on reset
LSbleast-significant bit
LVDlow voltage detect
MSbmost-significant bit
PCprogram counter
PLLphase-locked loop
PORpower on reset
PPORprecision power on reset
PSoC™Programmable System-on-Chip™
PWMpulse width modulator
SCswitched capacitor
SLIMOslow IMO
SMPswitch mode pump
SRAMstatic random access memory
Units of Measure
A units of measure table is located in the Electrical Specifications section. Table 3-1 on page 15 lists all the abbreviations
used to measure the PSoC devices.
Numeric Naming
Hexidecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexi d ec im al nu mber s ma y al so be re p res en t ed by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’ or ‘b’ are decimal.
Table of Contents
For an in depth discussion and more information on your PSoC
device, obtain the PSoC Mixed Signal Array Technical Refer-ence Manual. This document encompasses and is organized
into the following chapters and sections.
1.Pin Information .................................................... ...... ...8
6.Sales and Company Information ............................... 47
6.1 Revision History ................................................... 47
6.2 Copyrights and Code Protection .......................... 47
September 8, 2004Document No. 38-12028 Rev. *B7
1.Pin Information
A
This chapter describes, lists, and illustrates the CY8C24x23A PSoC device pins and pinout configurations.
1.1Pinouts
The CY8C24x23A PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every
port pin (l abeled with a “P”) is capable of Digital IO. However, Vss, Vdd, SMP, and XRES are not capable of Digital IO.
1.1.18-Pin Part Pinout
Table 1-1. 8-Pin Part Pinout (PDIP, SOIC)
Pin
No.
1IOIOP0[5]Analog column mux input and column output.
2IOIOP0[3]Analog column mux input and column output.
3IOP1[1]Crystal Input (XTALin), I2C Serial Clock (SCL)
4PowerVssGround connection.
5IOP1[0]Crystal Output (XTALout), I2C Serial Data
1IOIP0[7]Analog column mux inpu t .
2IOIOP0[5]Analog column mux input and column out p ut .
3IOIOP0[3]Analog column mux input and column out p ut .
4IOIP0[1]Analog column mux inpu t .
5PowerSMPSwitch Mode Pump (SMP) connection to
6IOP1[7]I2C Serial Clock (SCL)
7IOP1[5]I2C Serial Data (SDA)
8IOP1[3]
9IOP1[1]Crystal Input (XTALin), I2C Serial Clock (SCL)
10PowerVssGround connection.
11IOP1[0]Crystal Output (XTALout), I2C Serial Data
10IOP1[7]I2C Serial Clock (SCL)
11IOP1[5]I2C Serial Data (SDA)
12IOP1[3]
13IOP1[1]Crystal Input (XTALin), I2C Serial Clock (SCL)
14PowerVssGround connection.
15IOP1[0]Crystal Output (XTALout), I2C Serial Data
16IOP1[2]
17IOP 1 [4]Opti o na l Ext er nal Clock Input (EXTCLK)
18IOP1[6]
19InputXRESActive high external reset with internal pull
Vdd
P0[6], AI
P0[4], AI
P0[2], AI
P0[0], AI
P2[6], External VRef
P2[4], External AGND
P2[2], AI
P2[0], AI
XRES
P1[6]
P1[4], EXTCLK
P1[2]
P1[0], XTALout, I2C SD
7IOP1[7]I2C Serial Clock (SCL)
8IOP1[5]I2C Serial Data (SDA)
9NCNo connection. Do not use.
10IOP1[3]
11IOP1[1]Crystal Input (XTALin), I2C Serial Clock (SCL)
12PowerVssGround connection.
13IOP1[0]Crystal Output (XTALout), I2C Serial Data
14IOP1[2]
15IOP1[4]Optional External Clock Input (EXTCLK)
16NCNo connection. Do not use.
17IOP1[6]
18InputXRESActive high external reset with internal pull
19IOIP2[0]Direct switched capacitor block input.
20IOIP2[2]Direct switched capacitor block input.
21IOP2[4]External Analog Ground (AGND)
22IOP2[6]External Voltage Reference (VR ef)
23IOIP0[0]Analog column mux input.
24IOIP0[2]Analog column mux input.
25NCNo connection. Do not use.
26IOIP0[4]Analog column mux input.
27IOIP0[6]Analog column mux input.
28PowerVddSu ppl y voltage.
29IOIP0[7]Analog column mux input.
30IOIOP0[5]Analog column mux input and column output.
31IOIOP0[3]Analog column mux input and column output.
32IOIP0[1]Analog column mux input.
Type
Digital Analog
Pin
Name
external componen ts requ ired.
(SDA)
down.
Description
CY8C24423A 32-Pin PSoC Device
P0[5], AIOP0[7], AI
Vdd
P0[3], AI
MLF
(Top View)
131415
Vss
I2C SCL, XTALin, P1[1]
I2C SDA, XTALout, P1[0]
P2[7]
P2[5]
AI, P2[3]
AI, P2[1]
Vss
SMP
I2C SCL, P1[7]
2C SDA, P1[5]
P0[1], AI
32313029282726
1
2
3
4
5
6
7
8
9
101112
NC
P1[3]
P0[6], AI
P0[4], AI
NC
25
P0[2], AI
24
P0[0], AI
23
22
P2[6], External VRe
21
P2[4], External AGN
P2[2], AI
20
P2[0], AI
19
XRES
18
P1[6]
17
16
NC
P1[2]
EXTCLK, P1[4]
LEGEND: A = Analog, I = Input, and O = Output.
* The MLF package has a center pad that must be connected to ground (Vss).
September 8, 2004Document No. 38-12028 Rev. *B11
2.Register Reference
This chapter lists the reg isters of the CY8C24 x23A PSoC device. Fo r detai led regi ster info rmatio n, referenc e the PSo C™ Mixed Si g-nal Array Technical Reference Manual.
2.1Register Conventions
2.1.1Abbreviations Used
The register conventions specific to this section are listed in the
following table.
ConventionDescription
RRead register or bit(s)
WWrite register or bit(s)
LLogical register or bit(s)
CClearable register or bit(s)
#Access is bit specific
2.2Register Mapping Tables
The PSoC device has a total register address space of 512
bytes. The register space is referred to as IO space and is
divided into two banks. The XOI bit in the Flag regist er (CPU_F)
determines which bank the user is currently in. When the XOI
bit is set the user is in bank 1.
Note In the following register mapping tables, blank fields are
reserved and should not be accessed.
This chapter presents the DC and AC electrical specifications of the CY8C24x23A PSoC device. For the most up to date electrical
specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com/psoc.
Specifications are valid for -40
than 12 MHz are valid for -40oC ≤ TA ≤ 70oC and TJ ≤ 82oC.
Refer to Table 3-20 for the electrical specifications on the internal main oscillator (IMO) using SLIMO mode.
o
C ≤ TA ≤ 85oC and TJ ≤ 100oC, except where noted. Specifications for devices running at greater
5.25
5.25
SLIMO
Mode=1
O
4.75
Vdd Voltage
3.00
2.40
93 kHz12 MHz24 MHz
3 MHz
V
p
a
l
e
R
CPU Frequency
i
d
r
a
e
t
g
i
n
i
o
g
n
Figure 3-1a. Voltage versus CPU Frequency Figure 3-1b. IMO Frequency Trim Options
The following table lists the units of measure that are used in this chapter.
µAmicro amperepppeak-to-peak
µFmicro faradppmparts per million
µHmicro henrypspicosecond
µsmicrosecondspssamples per second
µVmicro voltsσsigma: one standard deviation
µVrmsmicro volts root-mean-squareVvolts
degree CelsiusµWmicro watts
C
4.75
Vdd Voltage
SLIMO Mode= 0
3.60
3.00
2.40
93 kHz
SLIMO
Mode=1
SLIMO
Mode=1
6 MHz
IMO Frequency
SLIMO
Mode=1
12 MHz24 MHz
SLIMO
Mode=0
SLIMO
Mode=0
September 8, 2004Document No. 38-12028 Rev. *B15
CY8C24x23A Final Data Sheet3. Electrical Specifications
3.1Absolute Maximum Ratings
Table 3-2. Absolute Maximum Ratings
SymbolDescriptionMinTypMaxUnitsNotes
T
STG
T
A
VddSupply Voltage on Vdd Relative to Vss-0.5–+6.0V
V
IO
V
IOZ
I
MIO
ESDElectro Static Discharge Voltage2000––VHuman Body Model ESD
LULatch-up Current––200mA
Storage Temperature -55–+100
Ambient Temperature with Power Applied-40–+85
DC Input VoltageVss - 0.5 –Vdd + 0. 5 V
DC Voltage Applied to Tri-stateVss - 0.5 –Vdd + 0. 5 V
Maximum Curr ent into any Port Pin-25–+50mA
o
C
o
C
Higher storage temperatures will reduce data
retention time.
The temperature rise from ambient to junction is
package specific. See “Thermal Impedances”
on page 45. The user must limit the power con-
sumption to comply with this requirement.
September 8, 2004Document No. 38-12028 Rev. *B16
CY8C24x23A Final Data Sheet3. Electrical Specifications
3.3DC Electrical Characteristics
3.3.1DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-4. DC Chip-Level Specifications
SymbolDescriptionMinTypMaxUnitsNotes
VddSupply Voltage2.4–5.25VSee DC POR and LVD specifications, Table 3-
I
DD
I
DD3
I
DD27
I
SB
I
SBH
I
SBXTL
I
SBXTLH
V
REF
V
REF27
a. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This should be compared with devices t ha t ha ve si m i la r fu n ct i o ns
enabled.
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
18 on page 27.
Supply Current–58mA
Supply Current–3.36.0mA
Supply Current when IMO = 6 MHz using SLIMO mode.–24mA
Sleep (Mode) Current with POR, LVD, Sleep Timer, and
a
WDT.
Sleep (Mode) Current with POR, LVD, Sleep Timer, and
WDT at high temperature.
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,
and external crystal.
Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,
and external crystal at high temperature.
Reference Voltage (Bandgap)1.281.301.33VTrimmed for appropriate Vdd. Vdd > 3.0V.
Reference Voltage (Bandgap)1.161.301.33VTrimmed for appropriate Vdd. Vdd = 2.4V to
a
a
a
–36.5µAConditions are with internal slow speed oscilla-
–425µAConditions are with internal slow speed oscilla-
–47.5µAConditions are with properly loaded, 1 µW max,
–526µAConditions are with properly loaded, 1µW max,
Conditions are Vdd = 5.0V, TA = 25 oC, CPU = 3
MHz, SYSCLK doubler disabled, VC1 = 1.5
100 mA on even port pins (for example, P0[2],
P1[4]), maximum 100 mA on odd port pins (for
example, P0[3], P1[5])). 150 mA maximum combined IOL budget.
Input Low Level––0.8VVdd = 3.0 to 5.25
Input High Level2.1–VVdd = 3.0 to 5.25
Input Hysterisis–60–mV
Input Leakage (Absolute Value)–1–nAGross tested to 1 µA.
Capacitive Load on Pins as Input–3.510pF
Capacitive Load on Pins as Output–3.510pF
Package and pin dependent. Temp = 25oC.
Package and pin dependent. Temp = 25oC.
Table 3-6. 2.7V DC GPIO Specifications
SymbolDescriptionMinTypMaxUnitsNotes
R
PU
R
PD
V
OH
V
OL
V
IL
V
IH
V
H
I
IL
C
IN
C
OUT
Pull up Resistor45.68kΩ
Pull down Resistor45.68kΩ
High Output LevelVdd - 0.4 ––VIOH = 2 mA (6.25 Typ), Vdd = 2.4 to 3.0V (16
mA maximum, 50 mA Ty p combined IOH budget).
Low Output Level––0.75VIOL = 11.25 mA, Vdd = 2.4 to 3.0V (90 mA max-
imum combined IOL budget).
Input Low Level––0.8VVdd = 2.4 to 3.0
Input High Level2.0––VVdd = 2.4 to 3.0
Input Hysteresis–90–mV
Input Leakage (Absolute Value)–1–nAGross tested to 1 µA.
Capacitive Load on Pins as Input–3.510pF
Capacitive Load on Pins as Output–3.510pF
Package and pin dependent. Temp = 25oC.
Package and pin dependent. Temp = 25oC.
September 8, 2004Document No. 38-12028 Rev. *B18
CY8C24x23A Final Data Sheet3. Electrical Specifications
3.3.3DC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design g uidance only.
The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Cap PSoC
blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block. Typical parameters apply to 5V at
25°C and are for design guidance only.
T able 3-7. 5V DC Operatio nal A mpli fier Sp ecifications
SymbolDescriptionMinTypMaxUnitsNotes
V
OSOA
TCV
OSOA
I
EBOA
C
INOA
V
CMOA
G
OLOA
V
OHIGHOA
V
OLOWOA
I
SOA
PSRR
OA
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
Input Offset Voltage (absolute value)
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Average Input Offset Voltage Drift–7.035.0
Input Leakage Current (Port 0 Analog Pins)–20–pAGross tested to 1 µA.
Input Capacitance (Port 0 Analog Pins)–4.59.5pF
Common Mode Voltage Range
Common Mode Voltage Range (high power or high
opamp bias)
Open Loop Gain
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
High Output Voltage Swing (i nternal signals)
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Low Output Voltage Swing (internal signals)
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Supply Current (including associated AGND buffer)
Power = Low, Opamp Bias = High
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Power = High, Opamp Bias = High
Supply Voltage Rejection Ratio64––dB0V ≤ VIN ≤ (Vdd - 2.30) or
–1.6
–
–
0.0–Vdd
0.5–
60
60
80
Vdd - 0.2
Vdd - 0.2
Vdd - 0.5
–
–
–
–
–
–
–
–
–
1.3
1.2
––dBSpecification is applicable at high power. For all
–
–
–
–
–
–
150
300
600
1200
2400
4600
10
8
7.5
Vdd - 0.5
–
–
–
0.2
0.2
0.5
200
400
800
1600
3200
6400
mV
mV
mV
o
µV/
C
Package and pin dependent. Temp = 25
VThe common-mode input voltage range is mea-
V
V
V
V
V
V
µA
µA
µA
µA
µA
µA
sured through an analog output buffer. The
specification includes the limitations imposed
by the characteristics of the analog output
buffer.
other bias modes (except high power, high
opamp bias), minimum is 60 dB.
(Vdd - 1.25V)
≤ V
IN
≤ Vdd.
o
C.
September 8, 2004Document No. 38-12028 Rev. *B19
CY8C24x23A Final Data Sheet3. Electrical Specifications
Table 3-8. 3.3V DC Operational Amplifier Specifications
SymbolDescriptionMinTypMaxUnitsNotes
V
OSOA
TCV
OSOA
I
EBOA
C
INOA
V
CMOA
G
OLOA
V
OHIGHOA
V
OLOWOA
I
SOA
PSRR
Input Offset Voltage (absolute value)
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
–
–
1.65
1.32
10
8
mV
mV
High Power is 5 Volts Only
Average Input Offset Voltage Drift–7.035.0
µV/
o
C
Input Leakage Current (Port 0 Analog Pins)–20–pAGross tested to 1 µA.
Input Capacitance (Port 0 Analog Pins)–4.59.5pF
Package and pin dependent. Temp = 25
Common Mode Voltage Range0.2–Vdd - 0.2 VThe common-mode input voltage range is
measured through an analog output buffer.
The specification includes the limitations
imposed by the characteristics of the analog
output buffer.
Open Loop Gain
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = Low
Power = High, Opamp Bias = Low
60
60
80
––dBSpecification is applicable at high power. For
all other bias modes (except high power, high
opamp bias), minimum is 60 dB.
High Output Voltage Swing (i nternal signals)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = Low
Power = High is 5V only
Vdd - 0.2
Vdd - 0.2
Vdd - 0.2
–
–
–
–
–
–
V
V
V
Low Output Voltage Swing (internal signals)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = Low
Power = High, Opamp Bias = Low
–
–
–
–
–
–
0.2
0.2
0.2
V
V
V
Supply Current (including associated AGND buffer)
Power = Low, Opamp Bias = Low
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = Low
Power = High, Opamp Bias = High
Supply Voltage Rejection Ratio64––dB0V ≤ VIN ≤ (Vdd - 2.30) or
OA
–
–
–
–
–
–
150
300
600
1200
2400
4600
200
400
800
1600
3200
6400
µA
µA
µA
µA
µA
µA
(Vdd - 1.25V)
≤ V
IN
≤ Vdd.
o
C.
September 8, 2004Document No. 38-12028 Rev. *B20
CY8C24x23A Final Data Sheet3. Electrical Specifications
Table 3-9. 2.7V DC Operational Amplifier Specifications
SymbolDescriptionMinTypMaxUnitsNotes
V
OSOA
TCV
OSOA
I
EBOA
C
INOA
V
CMOA
G
OLOA
V
OHIGHOA
V
OLOWOA
I
SOA
PSRR
Input Offset Voltage (absolute value)
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = High
–
–
1.65
1.32
10
8
mV
mV
High Power is 5 Volts Only
Average Input Offset Voltage Drift–7.035.0
µV/
o
C
Input Leakage Current (Port 0 Analog Pins)–20–pAGross tested to 1 µA.
Input Capacitance (Port 0 Analog Pins)–4.59.5pF
Package and pin dependent. Temp = 25
Common Mode Voltage Range0.2–Vdd - 0.2 VThe common-mode input voltage range is
measured through an analog output buffer.
The specification includes the limitations
imposed by the characteristics of the analog
output buffer.
Open Loop Gain
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = Low
Power = High
60
60
80
––dBSpecification is applicable at high power. For
all other bias modes (except high power, high
opamp bias), minimum is 60 dB.
High Output Voltage Swing (i nternal signals)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = Low
Power = High is 5V only
Vdd - 0.2
Vdd - 0.2
Vdd - 0.2
–
–
–
–
–
–
V
V
V
Low Output Voltage Swing (internal signals)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = Low
Power = High, Opamp Bias = Low
–
–
–
–
–
–
0.2
0.2
0.2
V
V
V
Supply Current (including associated AGND buffer)
Power = Low, Opamp Bias = Low
Power = Low, Opamp Bias = High
Power = Medium, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = Low
Power = High, Opamp Bias = High
Supply Voltage Rejection Ratio64––dB0V ≤ VIN ≤ (Vdd - 2.30) or
OA
–
–
–
–
–
–
150
300
600
1200
2400
4600
200
400
800
1600
3200
6400
µA
µA
µA
µA
µA
µA
(Vdd - 1.25V)
≤ V
IN
≤ Vdd.
o
C.
September 8, 2004Document No. 38-12028 Rev. *B21
CY8C24x23A Final Data Sheet3. Electrical Specifications
3.3.4DC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-10. 5V DC Analog Output Buffer Specifications
SymbolDescriptionMinTypMaxUnitsNotes
V
OSOB
TCV
OSOB
V
CMOB
R
OUTOB
V
OHIGHOB
V
OLOWOB
I
SOB
PSRR
OB
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
Input Offset Voltage (Absolute Value)–312mV
Average Input Offset Voltage Drift–+6–µV/°C
Common-Mode Input Voltage Range0.5–Vdd - 1.0V
Output Resistance
Power = Low
Power = High
High Output Voltage Swing (Load = 32 ohms to Vdd/2)
Power = Low
Power = High
–
–
0.5 x Vdd + 1.1
0.5 x Vdd
+ 1.1
1
1
–
–
–
–
–
–
Ω
Ω
V
V
Low Output Voltage Swing (Load = 32 ohms to Vdd/2)
Power = Low
Power = High
–
–
–
–
0.5 x Vdd - 1.3
0.5 x Vdd
- 1.3
V
V
Supply Current Including Bias Cell (No Load)
Power = Low
Power = High
Supply Voltage Rejection Ratio52––dBV
–
–
1.1
2.6
5.1
8.8
mA
mA
> (Vdd - 1.25)
OUT
Table 3-11. 3.3V DC Analog Output Buffer Specifications
SymbolDescriptionMinTypMaxUnitsNotes
V
OSOB
TCV
OSOB
V
CMOB
R
OUTOB
V
OHIGHOB
V
OLOWOB
I
SOB
PSRR
Input Offset Voltage (Absolute Value)–312mV
Average Input Offset Voltage Drift–+6–µV/°C
Common-Mode Input Voltage Range0.5-Vdd - 1.0V
Output Resistance
Power = Low
Power = High
–
–
1
1
–
–
High Output Voltage Swing (Load = 1k ohms to Vdd/2)
Power = Low
Power = High
0.5 x Vdd + 1.0
0.5 x Vdd
+ 1.0
–
–
–
–
Low Output Voltage Swing (Load = 1k ohms to Vdd/2)
Power = Low
Power = High
–
–
–
–
0.5 x Vdd - 1.0
0.5 x Vdd
- 1.0
Supply Current Including Bias Cell (No Load)
Power = Low
Power = High
Supply Voltage Rejection Ratio52––dBV
OB
–
0.8
2.0
2.0
4.3
Ω
Ω
V
V
V
V
mA
mA
> (Vdd - 1.25)
OUT
September 8, 2004Document No. 38-12028 Rev. *B22
CY8C24x23A Final Data Sheet3. Electrical Specifications
Table 3-12. 2.7V DC Analog Output Buffer Specifications
SymbolDescriptionMinTypMaxUnitsNotes
V
OSOB
TCV
OSOB
V
CMOB
R
OUTOB
V
OHIGHOB
V
OLOWOB
I
SOB
PSRR
Input Offset Voltage (Absolute Value)–312mV
Average Input Offset Voltage Drift–+6–µV/°C
Common-Mode Input Voltage Range0.5-Vdd - 1.0V
Output Resistance
Power = Low
Power = High
–
–
1
1
–
–
High Output Voltage Swing (Load = 1k ohms to Vdd/2)
Power = Low
Power = High
0.5 x Vdd + 0.2
0.5 x Vdd
+ 0.2
–
–
–
–
Low Output Voltage Swing (Load = 1k ohms to Vdd/2)
Power = Low
Power = High
–
–
–
–
0.5 x Vdd - 0.7
0.5 x Vdd
- 0.7
Supply Current Including Bias Cell (No Load)
Power = Low
Power = High
Supply Voltage Rejection Ratio52––dBV
OB
–
0.8
2.0
2.0
4.3
Ω
Ω
V
V
V
V
mA
mA
> (Vdd - 1.25)
OUT
September 8, 2004Document No. 38-12028 Rev. *B23
CY8C24x23A Final Data Sheet3. Electrical Specifications
V
P
3.3.5DC Switch Mode Pump Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-13. DC Switch Mode Pump (SMP) Specifications
SymbolDescriptionMinTypMaxUnitsNotes
5V5V Output Voltage from Pump4.755.05.25V
V
PUMP
3V3.3V Output Voltage from Pump3.003.253.60V
V
PUMP
2V2.6V Output Voltage from Pump2.452.552.80V
V
PUMP
I
PUMP
V
5VInput Voltage Range from Battery1.8–5.0V
BAT
3VInput Voltage Range from Battery1.0–3.3V
V
BAT
2VInput Voltage Range from Battery1.0–3.0V
V
BAT
V
BATSTART
∆V
PUMP_Line
∆V
PUMP_Load
∆V
PUMP_Ripple
E
3
E
2
F
PUMP
DC
PUMP
a. L1 = 2 µH inductor, C1 = 10 µF capacitor, D1 = Schottky diode. See Figure3-2.
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
a
Configura tion of foot note
. Average, neglecting
ripple. SMP trip voltage is set to 5.0V.
a
Configura tion of foot note
. Average, neglecting
ripple. SMP trip voltage is set to 3.25V.
a
Configura tion of foot note
. Average, neglecting
ripple. SMP trip voltage is set to 2.55V.
Available Output Current
V
BAT
V
BAT
V
BAT
= 1.8V, V
= 1.5V, V
= 1.3V, V
PUMP
PUMP
PUMP
= 5.0V
= 3.25V
= 2.55V
5
8
8
–
–
–
–
–
–
mA
mA
mA
SMP trip voltage is set to 5.0V.
SMP trip voltage is set to 3.25V.
SMP trip voltage is set to 2.55V.
Configuration of footnote
set to 5.0V.
Configuration of footnote
Configuration of footnote
a
.
a
. SMP trip voltage is
a
. SMP trip voltage is
set to 3.25V.
a
Configuration of footnote
. SMP trip voltage is
set to 2.55V.
Minimum Input Voltage from Battery to Start Pump1.2––V
Line Regulation (over V
range)–5–%VO
BAT
Configuration of footnote
1.25V at T
= -40oC.
A
Configuration of footnote
a
. 0oC ≤ TA ≤ 100.
a
. VO is the “Vdd
Value for PUMP Trip” specified by the VM[2:0]
setting in the DC POR and LVD Specification,
Table 3-18 on page 27.
Load Regulation–5–%VO
Configuration of footnote
a
. VO is the “Vdd
Value for PUMP Trip” specified by the VM[2:0]
setting in the DC POR and LVD Specification,
Table 3-18 on page 27.
Output Voltage Ripple (depends on capacitor/load)–100–mVpp
Efficiency3550–%
CY8C24x23A Final Data Sheet3. Electrical Specifications
3.3.6DC Analog Reference Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design g uidance only.
The guaranteed specific ations are measure d throug h the Anal og Con tinuou s T im e PSoC block s. The powe r level s for AGND refer to
the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control
register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block.
Reference control power is high.
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-17. DC Analog PSoC Block Specifications
SymbolDescriptionMinTypMaxUnitsNotes
R
CT
C
SC
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
Resistor Unit Value (Continuous Time)–12.2–kΩ
Capacitor Unit Value (Switch Cap)–80–fF
September 8, 2004Document No. 38-12028 Rev. *B26
CY8C24x23A Final Data Sheet3. Electrical Specifications
3.3.8DC POR, SMP, and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design g uidance only.
Note The bits PORLEV and VM in the table below refer to bits in the VLT_CR register. See the PSoC Mixed Signal Array Technical
Reference Manual for more information on the VLT_CR register.
Table 3-18. DC POR and LVD Specifications
SymbolDescriptionMinTypMaxUnitsNotes
V
PPOR0
V
PPOR1
V
PPOR2
V
LVD0
V
LVD1
V
LVD2
V
LVD3
V
LVD4
V
LVD5
V
LVD6
V
LVD7
V
PUMP0
V
PUMP1
V
PUMP2
V
PUMP3
V
PUMP4
V
PUMP5
V
PUMP6
V
PUMP7
a. Always greater than 50 mV above V
b. Always greater than 50 mV above V
c. Always greater than 50 mV above V
d. Always greater than 50 mV above
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
Vdd Value for PPOR Trip
PORLEV[1:0] = 00b
PORLEV[1:0] = 01b
PORLEV[1:0] = 10b
2.36
–
2.82
4.55
2.40
2.95
4.70
V
V
V
Vdd must be greater than or equal to 2.5V
during startup, reset from the XRES pin, or
reset from Watchdog.
Vdd Value for LVD Trip
VM[2:0] = 000b
VM[2:0] = 001b
CY8C24x23A Final Data Sheet3. Electrical Specifications
3.3.9DC Programming Sp eci f ic ations
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-19. DC Programming Specifications
SymbolDescriptionMinTypMaxUnitsNotes
Vdd
IWRITE
I
DDP
V
ILP
V
IHP
I
ILP
I
IHP
V
OLV
V
OHV
Flash
ENPB
Flash
ENT
Flash
DR
a. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of
25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees more than
50,000 cycles).
For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to
the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
Supply Voltage for Flash Write Operations2.70––V
Supply Current During Programming or Verify–525mA
Input Low Voltage During Programming or Verify––0.8V
Input High Voltage During Programming or Verify2.1––V
Input Current when Applying Vilp to P1[0] or P1[1] During
Programming or Verify
Input Current when Applying Vihp to P1[0] or P1[1] During
Programming or Verify
Output Low Voltage During Programming or Verify––Vss + 0.75 V
Output High Voltage During Programming or VerifyVdd - 1.0–VddV
Flash Endurance (per block)50,000–––Erase/write cycles per block.
Flash Endurance (total)
Flash Data Retention10––Years
a
––0.2mADriving internal pull-down resistor.
––1.5mADriving internal pull-down resistor.
1,800,000 –––Erase/write cycles.
September 8, 2004Document No. 38-12028 Rev. *B28
CY8C24x23A Final Data Sheet3. Electrical Specifications
3.4AC Electrical Characteristics
3.4.1AC Chip-Level Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-20. 5V and 3.3V AC Chip-Level Specifications
Jitter24M1P 24 MHz Period Jitter (IMO) Peak -to-Peak–300ps
Jitter24M1R 24 MHz Period Jitter (IMO) Root Mean Squared––600ps
F
MAX
T
RAMP
a. 4.75V < Vdd < 5.25V.
b. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.
c. 3.0V < Vdd < 3.6V. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation at 3.3V.
d. See the individual user module data sheets for information on maximum frequencies for user modules.
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
Internal Main Oscillator Frequency for 24 MHz23.424
24.6
a,b,c
MHzTrimmed for 5V or 3.3V operati on using fac-
tory trim values. See Figure 3-1b on
page 15. SLIMO Mode = 0.
Internal Main Oscillator Frequency for 6 MHz5.756
6.35
a,b,c
MHzTrimmed for 5V or 3.3V operati on using fac-
tory trim values. See Figure 3-1b on
page 15. SLIMO Mode = 1.
CPU Frequency (5V Nomi nal)0.9324
CPU Frequency (3.3V Nominal)0.9312
Digital PSoC Block Frequency048
Digital PSoC Block Frequency024
24.6
12.3
49.2
24.6
a,b
MHz
b,c
MHz
a,b,d
MHzRefer to the AC Digital Block Specifications
below.
b, d
MHz
Internal Low Speed Oscillator Frequency153264kHz
External Crystal Oscillator–32.768–kHzAccuracy is capacitor and crystal dependent.
50% duty cycle.
PLL Frequency–23.986–MHzIs a multiple (x732) of crystal frequency.
PLL Lock Time0.5–10ms
PLL Lock Time for Low Gain Setting0.5–50ms
External Crystal Oscillator Startup to 1%–1700
2620
ms
External Crystal Oscillator Startup to 100 ppm–28003800msThe crystal oscillator frequency is within 100
ppm of its final value by the end of the T
period. Correct operation assu me s a prop-
osacc
erly loaded 1 uW maximum drive level
32.768 kHz crystal. 3.0V
≤ 85 oC.
≤ T
A
≤Vdd≤5.5V, -40 oC
External Reset Pulse Width10––µs
a,c
49.2
MHzTrimmed. Utilizing factory trim values.
Maximum frequency of signal on row input or row output.––12.3MHz
Supply Ramp Time0––µs
September 8, 2004Document No. 38-12028 Rev. *B29
CY8C24x23A Final Data Sheet3. Electrical Specifications
E
E
Table 3-21. 2.7V AC Chip-Level Specifications
SymbolDescriptionMinTypMaxUnitsNotes
F
IMO12
F
IMO6
F
CPU1
F
BLK27
F
32K1
Jitter32k32 kHz Period Jitter–150ns
T
XRST
DC12M12 MHz Duty Cycle405060%
Jitter12M1P12 MHz Period Jitter (IMO) Peak-to- Peak–340ps
Jitter12M1R12 MHz Period Jitter (IMO) Root Mean Squared––600ps
F
MAX
T
RAMP
Internal Main Oscillator Frequency for 12 MHz11.512
Internal Main Oscillator Frequency for 6 MHz5.756
CPU Frequency (2.7V Nominal)
Digital PSoC Block Frequency (2.7V Nominal)012
Internal Low Speed Oscillator Frequency83296kHz
External Reset Pulse Width10––µs
Maximum frequency of signal on row input or row output.––12.7MHz
Supply Ramp Time0––µs
0
0.93
0
0
3
a. 2.4V < Vdd < 3.0V.
b. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range.
c. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on maximum frequency for User Modules.
12.7
6.35
3.15
12.7
a,b,c
MHzTrimmed for 2.7V operation using factory
a,b,c
MHzTrimmed for 2.7V operation using factory
a,b
MHz
a,b,c
MHz
trim values. See Figure 3-1b on page 15.
SLIMO Mode = 1.
trim values. See Figure 3-1b on page 15.
SLIMO Mode = 1.
0
0
Refer to the AC Digital Block Specifications belo w.
PLL
nable
T
PLLSLEW
F
PLL
PLL
Gain
0
Figure 3-3. PLL Lock Timing Diagram
PLL
nable
T
PLLSLEWLOW
F
PLL
PLL
Gain
1
Figure 3-4. PLL Lock for Low Gain Setting Timing Diagram
24 MHz
24 MHz
September 8, 2004Document No. 38-12028 Rev. *B30
CY8C24x23A Final Data Sheet3. Electrical Specifications
6–50nsVdd = 2.4 to 3.0V, 10% - 90%
6–50nsVdd = 2.4 to 3.0V, 10% - 90%
1840120nsVdd = 2.4 to 3.0V, 10% - 90%
1840120nsVdd = 2.4 to 3.0V, 10% - 90%
90%
GPIO
Pin
Output
oltage
10%
TRiseF
TRiseS
Figure 3-8. GPIO Timing Diagram
TFallF
TFallS
September 8, 2004Document No. 38-12028 Rev. *B32
CY8C24x23A Final Data Sheet3. Electrical Specifications
3.4.3AC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design g uidance only.
Settling times, slew rates, and gain bandw idth are based on the Analog Continuous Time PSoC block.
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
Power = High and Opamp B ias = High is not supported at 3.3V and 2.7V.
Table 3-24. 5V AC Operational Amplifier Specifications
SymbolDescriptionMinTypMaxUnitsNotes
T
T
SR
SR
BW
E
ROA
SOA
ROA
FOA
OA
NOA
Rising Settling Time from 80% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Falling Settling Time from 20% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Gain Bandwidth Product
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Power = High, Opamp Bias = High
Noise at 1 kHz (Power = Medium, Opam p Bias = High)–100–nV/rt-Hz
–
–
–
–
–
–
0.15
1.7
6.5
0.01
0.5
4.0
0.75
3.1
5.4
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
3.9
0.72
0.62
5.9
0.92
0.72
–
–
–
–
–
–
–
–
–
µs
µs
µs
µs
µs
µs
V/
µs
V/
µs
V/
µs
V/
µs
V/
µs
V/
µs
MHz
MHz
MHz
Table 3-25. 3.3V AC Operational Amplifier Specifications
SymbolDescriptionMinTypMaxUnitsNotes
T
T
SR
SR
BW
E
ROA
SOA
ROA
FOA
OA
NOA
Rising Settling Time from 80% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Falling Settling Time from 20% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Gain Bandwidth Product
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Noise at 1 kHz (Power = Medium, Opam p Bias = High)–100–nV/rt-Hz
–
–
–
–
0.31
2.7
0.24
1.8
0.67
2.8
–
–
–
–
–
–
–
–
–
–
3.92
0.72
5.41
0.72
–
–
–
–
–
–
µs
µs
µs
µs
V/
µs
V/
µs
V/
µs
V/
µs
MHz
MHz
September 8, 2004Document No. 38-12028 Rev. *B33
CY8C24x23A Final Data Sheet3. Electrical Specifications
Table 3-26. 2.7V AC Operational Amplifier Specifications
SymbolDescriptionMinTypMaxUnitsNotes
T
T
SR
SR
BW
E
ROA
SOA
ROA
FOA
OA
NOA
Rising Settling Time from 80% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Falling Settling Time from 20% of ∆V to 0.1% of ∆V (10 pF
load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain)
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Gain Bandwidth Product
Power = Low, Opamp Bias = Low
Power = Medium, Opamp Bias = High
Noise at 1 kHz (Power = Medium, Opam p Bias = High)–100–nV/rt-Hz
–
–
–
–
0.31
2.7
0.24
1.8
0.67
2.8
–
–
–
–
–
–
–
–
–
–
3.92
0.72
5.41
0.72
–
–
–
–
–
–
µs
µs
µs
µs
V/
µs
V/
µs
V/
µs
V/
µs
MHz
MHz
3.4.4AC Digital Block Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-27. 5V and 3.3V AC Digital Block Specifications
FunctionDescriptionMinTypMaxUnitsNotes
TimerCapture Pulse Width
Maximum Frequency, No Capture––49.2MHz4.75V < Vd d < 5.25V.
Maximum Frequency, With Capture––24.6MHz
CounterEnable Pulse Width
Maximum Frequency, No Enable Input––49.2MHz4.75V < Vdd < 5. 25V.
Maximum Frequency, Enable Input––24.6MHz
Maximum Freq uency––12.7MHz
Maximum Input Clock Frequency––12.7MHz
Maximum Input Clock Frequency––12.7MHz
clocking.
Width of SS_ Negated Between Transmissions
100
0
–
0
–
ns
a
Maximum data rate at 1.59 MHz due to 8 x over
clocking.
Maximum data rate at 1.59 MHz due to 8 x over
clocking.
September 8, 2004Document No. 38-12028 Rev. *B35
CY8C24x23A Final Data Sheet3. Electrical Specifications
3.4.5AC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-29. 5V AC Analog Output Buffer Specifications
SymbolDescriptionMinTypMaxUnitsNotes
T
ROB
T
SOB
SR
ROB
SR
FOB
BW
OB
BW
OB
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
Rising Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Power = High
Falling Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Power = High
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load
Power = Low
Power = High
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load
Power = Low
Power = High
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load
Power = Low
Power = High
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load
Power = Low
Power = High
–
–
–
–
0.65
0.65
0.65
0.65
0.8
0.8
300
300
–
–
–
–
–
–
–
–
–
–
–
–
2.5
2.5
2.2
2.2
–
–
–
–
–
–
–
–
µs
µs
µs
µs
V/µs
V/
V/µs
V/
MHz
MHz
kHz
kHz
µs
µs
Table 3-30. 3.3V AC Analog Output Buffer Specifications
SymbolDescriptionMinTypMaxUnitsNotes
T
T
SR
SR
BW
BW
ROB
SOB
Rising Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Power = High
Falling Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Power = High
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load
ROB
Power = Low
Power = High
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load
FOB
Power = Low
Power = High
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load
OB
Power = Low
Power = High
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load
OB
Power = Low
Power = High
–
–
–
–
0.5
0.5
0.5
0.5
0.7
0.7
200
200
–
–
–
–
–
–
–
–
–
–
–
–
3.8
3.8
2.6
2.6
–
–
–
–
–
–
–
–
µs
µs
µs
µs
V/µs
V/
V/µs
V/
MHz
MHz
kHz
kHz
µs
µs
September 8, 2004Document No. 38-12028 Rev. *B36
CY8C24x23A Final Data Sheet3. Electrical Specifications
Table 3-31. 2.7V AC Analog Output Buffer Specifications
SymbolDescriptionMinTypMaxUnitsNotes
T
T
SR
SR
BW
BW
ROB
SOB
Rising Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Power = High
Falling Settling Time to 0.1%, 1V Step, 100pF Load
Power = Low
Power = High
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load
ROB
Power = Low
Power = High
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load
FOB
Power = Low
Power = High
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load
OB
Power = Low
Power = High
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load
OB
Power = Low
Power = High
–
–
–
–
0.4
0.4
0.4
0.4
0.6
0.6
180
180
–
–
–
–
–
–
–
–
–
–
–
–
4
4
3
3
–
–
–
–
–
–
–
–
µs
µs
µs
µs
V/µs
V/
V/µs
V/
MHz
MHz
kHz
kHz
µs
µs
3.4.6AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-32. 5V AC External Clock Specific ations
SymbolDescriptionMinTypMaxUnitsNotes
F
OSCEXT
–High Per iod20.6
–Low Peri od20.6
–Power Up IMO to Switch150
Table 3-33. 3.3V AC External Clock Specifications
SymbolDescriptionMinTypMaxUnitsNotes
F
OSCEXTFrequency with CPU Clock divide by 1
F
OSCEXT
–High Per iod with CPU Clock divide by 141.7
–Low Period with CPU C lock divide by 141.7
–Power Up IMO to Switch150
a. Maximum CPU frequency is 12 MHz at 3.3V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements.
b. If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider will ensure that the fifty per-
cent duty cycle requi rement is met.
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
Frequency0.093–24.6MHz
–5300ns
––ns
––µs
a
Frequency with CPU Clock divide by 2 or greater
b
0.093–12.3MHz
0.186–24.6MHz
–5300ns
––ns
––µs
September 8, 2004Document No. 38-12028 Rev. *B37
CY8C24x23A Final Data Sheet3. Electrical Specifications
Table 3-34. 2.7V AC External Clock Specifications
SymbolDescriptionMinTypMaxUnitsNotes
F
OSCEXT
F
OSCEXT
–High Per iod with CPU Clock divide by 141.7
–Low Period with CPU C lock divide by 141.7
–Power Up IMO to Switch150
Frequency with CPU Clock divide by 1
Frequency with CPU Clock divide by 2 or greater
a
b
0.093–12.3MHz
0.186–12.3MHz
–5300ns
––ns
––µs
a. Maximum CPU frequency is 12 MHz at 3.3V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements.
b. If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider will ensure that the fifty per-
cent duty cycle requi rement is met.
3.4.7AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-35. AC Programming Specifications
SymbolDescriptionMinTypMaxUnitsNotes
T
RSCLK
T
FSCLK
T
SSCLK
T
HSCLK
F
SCLK
T
ERASEB
T
WRITE
T
DSCLK
T
DSCLK3
T
DSCLK2
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
Rise Time of SCLK 1–20ns
Fall Time of SCLK 1–20ns
Data Set up Time to Falling Edge of SCLK40––ns
Data Hold Time from Falling Edge of SCLK40––ns
Frequency of SCLK0–8MHz
Flash Erase Time (Block)–20–ms
Flash Block Write Time–20–ms
Data Out Delay from Falling Edge of SCLK––45nsVdd > 3.6
Data Out Delay from Falling Edge of SCLK––50ns3.0 ≤ Vdd ≤ 3.6
Data Out Delay from Falling Edge of SCLK––70ns2.4 ≤ Vdd ≤ 3.0
September 8, 2004Document No. 38-12028 Rev. *B38
CY8C24x23A Final Data Sheet3. Electrical Specifications
S
3.4.8AC I2C Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V
and -40°C ≤ T
apply to 5V, 3.3V, and 2.7V at 25°C and are for design guidance only.
Table 3-36. AC Characteristics of the I
SymbolDescription
F
SCLI2C
T
HDSTAI2C
T
LOWI2C
T
HIGHI2C
T
SUSTAI2C
T
HDDATI2C
T
SUDATI2C
T
SUSTOI2C
T
BUFI2C
T
SPI2C
a. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement t
the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line
t
rmax
≤ 85°C, 3.0V to 3.6V and -4 0°C ≤ TA ≤ 85°C, or 2.4V to 3.0V a nd -40°C ≤ TA ≤ 85°C, respecti vely. Typical p a rameter s
A
2
C SDA and SCL Pins for Vdd > 3.0V
Standard ModeFast Mode
UnitsNotesMinMaxMinMax
SCL Clock Frequency01000400kHz
Hold Tim e (re pea ted ) START Condition. Af ter thi s per iod , the
first clock pulse is generated.
LOW Period of the SCL Clock4.7–1.3–µs
HIGH Period of the SCL Clock4.0–0.6–µs
Set-up Time for a Repeated START Condition4.7–0.6–µs
Data Hold Time0–0–µs
Data Set-up Time250–
Set-up Time for STOP Condition4.0–0.6–µs
Bus Free Time Between a STOP and START Condition4.7–1.3–µs
Pulse Width of spikes are suppress ed by the input filter.––050ns
+ t
= 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
SU;DAT
4.0–0.6–µs
a
100
SU;DAT
–ns
≥ 250 ns must then be met. This will automatically be the case if
Table 3-37. AC Characteristics of the I2C SDA and SCL Pins for Vdd <3.0V (Fast Mode Not Supported)
Standard ModeFast Mode
SymbolDescription
F
SCLI2C
T
HDSTAI2C
T
LOWI2C
T
HIGHI2C
T
SUSTAI2C
T
HDDATI2C
T
SUDATI2C
T
SUSTOI2C
T
BUFI2C
T
SPI2C
SCL Clock Frequency0100––kHz
Hold Tim e (re pea ted ) START Condition. Af ter thi s per iod , the
first clock pulse is generated.
LOW Period of the SCL Clock4.7–––µs
HIGH Period of the SCL Clock4.0–––µs
Set-up Time for a Repeated START Condition4.7–––µs
Data Hold Time0–––µs
Data Set-up Time250–––ns
Set-up Time for STOP Condition4.0–––µs
Bus Free Time Between a STOP and START Condition4.7–––µs
Pulse Width of spikes are suppress ed by the input filter.––––ns
4.0–––µs
UnitsNotesMinMaxMinMax
DA
T
LOWI2C
T
SUDATI2C
T
HDSTAI2C
T
SPI2C
T
BUFI2C
SCL
T
T
S
T
HDSTAI2C
T
HDDATI2C
T
HIGHI2C
SUSTAI2C
SrSP
Figure 3-9. Definition for Timing for Fast/Standard Mode on the I
September 8, 2004Document No. 38-12028 Rev. *B39
SUSTOI2C
2
C Bus
4.Packaging Information
This chapter illustrates the p ack aging specifications for the C Y8C 24 x2 3A PSoC dev ice, along with the thermal imped anc es for eac h
package and the typical package capacitance on crystal pins.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dime ns ion s at
AX = TQFP Pb Free
Speed: 24 MHz
Part Number
Family Code
Technology Code: C = CMOS
Marketing Code: 8 = Cypress MicroSystems
Company ID: CY = Cypress
September 8, 2004Document No. 38-12028 Rev. *B46
6.Sales and Company Information
To obtain information about Cypre ss Mi croSys tems or PSoC sales and tec hnic al support, refere nce the fol lowi ng infor mation or go to
the section titled “Getting Started” on page 4 in this document.
Cypress Mi croSystem s
2700 162nd Street SW
Building D
Lynnwood, WA 98037
Phone: 800.669.0557
Facsimile: 425.787.4641
Web Sites:Company Information – http://www.cypress.com
Technical Support – http://www.cypress.com/support/login.cfm
6.1Revision History
Table 6-1. CY8C24x23A Data Sheet Revision History
Document Title: CY8C24123A, CY8C24223A, and CY8C24423A PSoC Mixed Signal Array Final Data Sheet
Document Number: 38-12028
RevisionECN #Issue Date Origin of ChangeDescription of Change
**236409See ECNSFVNew silicon and new document – Preliminary Data Sheet.
*A247589See ECNSFVChanged the title to read “Final” data sheet. Updated Electrical Specifications chapter.
*B261711See ECNHMTInput all SFV memo changes. Updated Electrical Specifications chapter.
The information contained herein is subject to change without notice. Cypress Mi croSystems assumes no responsibility for the use of an y circuitry other th an circuitry
embodied in a Cypress MicroSystems product. Nor does it convey or imply any license under patent or other rights. Cypress MicroSystems does not aut ho riz e its products
for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of
Cypress MicroSystems products in life-sup port systems application implies that the manufact urer assumes all risk of such use and in doing so indemnifi es Cypress
MicroSystems against all charges. Cypress MicroSystems products are not warranted nor intended to be used for medical, life-support, life-saving, critical control or safety
applicati ons, unles s pursuant to an express written agr eement with Cypress MicroSystem s.
Flash Code Protection
Note the following details of the Flash code protection features on Cypress MicroSystems devices.
Cypress MicroSystems products meet the specifications contained in their particular Cypress MicroSystems Data Sheets. Cypress MicroSystems believes that its family of
products is one of the most secure families of its kind on the market today, regardless of how they are used. There may be methods, unkno wn to C yp ress MicroS ys tem s,
that can breach the code protection fe atures. Any of th ese methods , to our knowl edge, would b e dishonest an d possibly il legal. Neith er Cypress MicroSyste ms nor any
other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
Cypress MicroSystems is willing to work with the customer who is concerned about the integrity of their code. Code protection is constantly evolving. We at Cypress MicroSystems are committed to continuously improving the code protection features of our products.