Cypress CY8C22113, CY8C22213 User Manual

PSoC™ Mixed Signal Array Final Data Sheet

Features

CY8C22113 and CY8C22213

■ Powerful Harvard Architecture Processor

■ Advanced Peripherals (PSoC Blocks)

❐ M8C Processor Speeds to 24 MHz ❐ Low Power at High Speed ❐ 3.0 to 5.25 V Operating Voltage ❐ Industrial Temperature Range: -40°C to +85°C

❐ 3 Rail-to-Rail Analog PSoC Blocks Provide:

- Up to 14-Bit ADCs

- Up to 9-Bit DACs

- Programmable Gain Amplifiers

- Programmable Filters and Comparators

❐ 4 Digital PSoC Blocks Provide:

- 8- to 32-Bit Timers, Counters, and PWMs

- CRC and PRS Modules

- Full-Duplex UART

- SPI Masters or Slaves

- Connectable to all GPIO Pins

❐ Complex Peripherals by Combining Blocks

Port 1 Port 0

PSoC CORE

SYSTEM BUS

Global Digital Interconnect

SRAM

256 Bytes

Interrupt

Controller

SROM Flash 2K

CPU Core (M8C)

Multiple Clock Sources

(Includes IMO, ILO, PLL, and ECO)

DIGITAL SYSTE M

Digital

Block Array

(1 Row,

4 Blocks)

Global Analog Interconnect

ANALOG SYSTEM

Analog

Block Array

(1 Column,

3 Blocks)

■ Precision, Programmable Clocking

❐ Internal ±2.5% 24/48 MHz Oscillator ❐ High-Accuracy 24 MHz with Optional 32.768

kHz Crystal and PLL

❐ Optional External Oscillator, up to 24 MHz ❐ Internal Oscillator for Watchdog and Sleep

■ Flexible On-Chip Memory

❐ 2K Bytes Flash Program Storage 50,000

Erase/Write Cycles

❐ 256 Bytes SRAM Data Storage ❐ In-System Serial Programming (ISSP ) ❐ Partial Flash Updat es ❐ Flexible Protection Modes ❐ EEPROM Emulation in Flash

■ Programmable Pin Configurations

❐ 25 mA Sink on all GPIO ❐ Pull up, Pull down, High Z, Strong, or Open

Drain Drive Modes on all GPIO

❐ Up to 8 Analog Inputs on GPIO ❐ One 30 mA Analog Outputs on GPIO ❐ Configurable Interrupt on all GPIO

Analog Drivers

PSoC™ Functional Overview

The PSoC™ family consists of many Mixed Signal Array with On-Chip Controller devices. These devices are designed to

replace multiple traditional MCU-based system components with one, low cost single-chip programmable device. PSoC devices include configurable blocks of analog and digital logic, as well as programmable interconnects. This architecture allows the user to create customized peripheral configurations

Sleep and Watchdog

that match the requirements of each individual application. Additionally, a fast CPU, Flash program memory, SRAM data memory, and configurable IO are included in a range of convenient pinouts and packages.

The PSoC architecture, as illustrated on the left, is com pri se d of four main areas: PSoC Core, Digital System, Analog System,

Analog

Ref

and System Resources. Configurable global busing allows all the device r esources to be c ombined into a compl ete custom system. The PSoC CY8C22x13 family can have up to two IO ports that connec t to the gl obal di git al and a nalog i ntercon ne cts ,

Analog

Input

Muxing

providing access to 4 digital blocks and 3 analog blocks.

The PSoC Core

■ Additional System Resources

❐ I

C Slave, Master, and Multi-Master to

400 kHz

❐ Watchdog and Sleep Timers ❐ User-Configurable Low Voltage Detection ❐ Integrated Supervisory Circuit ❐ On-Chip Precision Voltage Reference

■ Complete Development Tools

❐ Free Development Software

(PSoC™ Designer)

❐ Full-Featured, In-Circuit Emulator and

Programmer

❐ Full Speed Emulation ❐ Complex Breakpoint Structure ❐ 128K Bytes Trace Memory

The PSoC Core is a powerful engine that supports a rich feature set. Th e co re in cl ud es a C PU , memo r y, clocks, and c on fig urable GPIO (General Purpose IO).

The M8C C PU core is a powerfu l proce ssor wit h spee ds up t o 24 MHz, providing a four MI PS 8-bit Harvar d archit ecture m icro-

Digital

Clocks

Decimator

I2C

SYSTEM RESOURCES

POR and LVD

System Resets

Internal Voltage

Ref.

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CY8C22x13 Final Data Sheet PSoC™ Overview

processor. The CPU utilizes an interrupt controller with 10 vectors, to simplify programming of real time embedded events. Program execution is timed and protected using the included Sleep and Watch Dog Timers (WDT).

Memory encompasses 2 KB of Flash for program storage, 256 bytes of SRAM for data storage, and up to 2 KB of EEPROM emulated using the Flash. Program Flash utilizes four protection levels on blocks of 64 bytes, allowing customized software IP protection.

The PSoC device incorporates flexible internal clock generators, including a 24 MHz IMO (internal main oscillator) accurate to 2.5% over temperature and voltage. The 24 MHz IMO can also be doubled to 48 MHz for use by the digital system. A low power 32 kHz ILO (internal low speed oscillator) is provided for the Sleep timer and WDT. If crystal accuracy is desired, the ECO (32.768 kHz external crystal oscillator) is available for use as a Real Time Cloc k (RT C) and can opti onally genera te a crys tal-accurate 24 MHz system clock using a PLL. The clocks, together with programmable clock dividers (as a System Resource), provide the flexibility to integrate almost any timing requirement into the PSoC device.

PSoC GPIOs provide conne ct ion t o the CP U, di gital and analog resources of the devi ce. Each pin’ s dri ve mod e may b e selec te d from eight options, allowing great flexibility in external interfacing. Every pin also has the c apa bility to gen erate a syste m inte rrupt on high level, low level, and change from last read.

The Digital System

The Digital System is composed of 4 digital PSoC blocks. Each block is an 8-bit resource that can be used alone or combined with other blocks to fo rm 8, 16 , 24, and 32-bit p eriphe rals, wh ich are called user module references.

Port 1 Port 0

To System Bus

DIGITAL SYSTEM

Digital PSoC Block Array

DBB00 DBB01 DCB02 DCB03

Row Input

Configuration

Row 0

To Analog

System

Configuration

Row Output

Digital peripheral configurations include those listed below.

■ PWMs (8 to 32 bit)

■ PWMs with Dead band (8 to 32 bit)

■ Counters (8 to 32 bit)

■ Timers (8 to 32 bit)

■ UART 8-bit with selectable parity (up to 1)

■ SPI master and slave (up to 1)

■ I2C slave and master (1 available as a System Resource)

■ Cyclical Redundancy Checker/Generator (8 to 32 bit)

■ IrDA (up to 1)

■ Pseudo Random Sequence Generators (8 to 32 bit)

The digital blocks can be connected to any GPIO through a series of global buses that can route any signal to any pin. The buses also allow for signal multiplexing and for performing logic operations. This co nfig ura bil ity free s y our d e si gn s fro m th e co nstraints of a fixed peripheral controller.

Digital blocks are provided in rows of four, where the number of blocks varies by PSoC device family. This allows you the optimum choice of system resources for your application. Family resources are shown in the table titled “PSoC Device Charac-

teristics” on page 3.

The Analog System

The Analog System is com posed of 3 configurable blocks, eac h comprised of an opamp circuit allowing the creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support specific application requirements . Some of the more common PSoC analog functions (most available as user modules) are listed below.

■ Analog-to-digital converters (one with 6- to 14-bit resolution,

selectable as Incremental, Delta Sigma, and SAR)

■ Filters (two pole band-pass, low-pass, and notch)

■ Amplifiers (one with selectable gain to 48x)

■ Comparators (one with 16 sel ectable thresholds)

■ DACs (one with 6- to 9-bit resolution)

■ Multiplying DACs (one with 6- to 9-bit resolution)

■ High current output drivers (one with 30 mA drive as a Core

Resource)

■ 1.3V refer ence (as a System Resource)

■ Many other topologies possible

GIE[7:0]

GIO[7:0]

Global Digital

Interconnect

GOE[7:0]

GOO[7:0]

Digital System Block Diagram

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Analog blocks are provided in columns of three, which includes one CT (Continuous Time) and two SC (Switched Capacitor) blocks. The number of bloc ks is depe ndant on the device family which is detailed in the table titled “PSoC Device Characteris-

tics” on page 3.

P0[7]

P0[5]

P0[3] P0[1]

Array Input Configuration

P0[6]

P0[4]

P0[2] P0[0]

Additional System Resources

System Resources, some of which have been previously listed, provide additional capability useful to complete systems. Additional resources inclu de a deci mator, low voltage detection, and power on reset. Brief statements describing the merits of each system resource are presented below.

■ Digital clock dividers provide three customizable clock fre-

quencies for use in applic ations . The clo cks c an be route d to both the digital a nd analog systems. Additiona l clocks c an be generated using digital PSoC blocks as clock dividers.

■ The decimator provides a custom hardware filter for digital

signal processing applications inc lud in g t he c r eati on of D e lta Sigma ADCs.

■ The I2C module provides 100 and 400 kHz communication

over two wires. Slave, master, and multi-master modes are all supported.

■ Low Voltage Detection (LVD) interrupts can signal the appli-

cation of f alling voltage levels, w hile the adv anced POR (Power On Reset) circuit eliminates the need for a system supervisor.

■ An internal 1.3 voltage reference provides an absolute refer-

ence for the analog system, including ADCs and DACs.

PSoC Device Characteristics

Block Array

ACB01

ASD11

ASC21

Analog Reference

Interface to

Digital System

M8C Interface (Address Bus, Data Bus, Etc.)

RefHi RefLo

AGND

Analog System Block Diagram

ACI1[1:0]ACI0[1:0]

Reference

Generators

AGNDIn RefIn Bandga

Depending on your PSoC device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks and 12, 6, or 3 analog blocks. The following table lists the resources available for specific PSoC device groups.

PSoC Device Characteristics

PSoC Part

Number

CY8C29x66

CY8C27x66

CY8C27x43

CY8C24x23

CY8C22x13

Digital

up to

Rows

Digital

4 16 12 4 4 12

2 8 12 4 4 12

1 4 12 2 2 6

1 4 8 1 1 3

Blocks

Inputs

Analog

Outputs

Analog

Columns

Blocks

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CY8C22x13 Final Data Sheet PSoC™ Overview

Getting Started

The quickest path to understanding th e PSoC s ili co n is by rea ding this data sheet and using the PSoC Designer Integrated Development Environment (IDE). This data sheet is an overview of the PSoC integrated circuit and presents specific pin, register, and electrical specifications. For in-depth information, along with detailed programming information, reference the PSoC™ Mixed Signal Array Technical Reference Manual.

For up-to-date Ordering, Packag ing, an d Electri cal Specification information, reference the latest PSoC device data sheets on the web at http://www.cypress.com/psoc.

Development Kits

Development Kits are available from the following distributors: Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store at http://www.onfulfillment.com/cypressstore/ contains develop- ment kits, C compilers, and all accessories for PSoC development. Click on PSoC (Programmable System-on-Chip) to view a current list of available items.

Tele-Training

Free PSoC "Tele-training" is available for beginners and taught by a live marketing or appli ca tio n eng in eer ov er th e pho ne . F ive training cl asses are availabl e to accelerate th e learning curve including introduction, designing, debugging, advanced design, advanced analog, as well as application-specific classes covering topics like PSoC and the LIN bus. For days and times of the tele-training, see http://www.cypress.com/support/training.cfm.

Development Tools

The Cypress MicroSystems PSoC Designer is a Microsoft Windows-based, integrated development environment for the Programmable System-on-Chip (PSoC) devices. The PSoC Designer IDE and application runs on Windows 98, Windows NT 4.0, Windows 2000, Windows Millennium (Me), or Windows XP. (Reference the PSoC Designer Functional Flow diagram below.)

PSoC Designer helps the customer to select an operating configuration for the PSoC, write application code that uses the PSoC, and debug the application. This system provides design database management by project, an integrated debugger with In-Circuit Emulator, in-system programming support, and the CYASM macro assembler for the CPUs.

PSoC Designer also supports a high-level C language compiler developed specifically for the devices in the family.

PSoC

Designer

Importable

Design

Database

Graphical Designer

Interface

Results

Commands

Context

Sensitive

Help

Consultants

Certified PSoC Consultants offer everything from technical assistance to complete d PSoC d esign s. To contact or be come a PSoC Consultant, go to the following Cypress support web site:

http://www.cypress.com/support/cypros.cfm.

Technical Support

PSoC application engineers take pride in fast and accurate response. They can be reached with a 4-hour guaranteed response at http://www.cypress.com/support/login.cfm.

Application Notes

A long list of application notes will assist you in every aspect of your design effort. To locate the PSoC application notes, go to

http://www.cypress.com/design/results.cfm.

Device

Database

Application

Database

Project

Database

User

Modules

Library

Emulation

Pod

PSoC

Designer

Core

Engine

In-Circuit Emulator

Programmer

PSoC Designer Subsystems

PSoC

Configuration

Sheet

Manufacturing

Information

File

Device

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PSoC Designer Software Subsystems

Device Editor

The Device Edi tor su bsyst em al lows th e use r to se lect di ffere nt onboard analog and digital components called user modules using the PSoC blocks. Examples of user modules are ADCs, DACs, Amplifiers, and Filters.

The device editor also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic configuration allows for changing configurations at run time.

PSoC Designer sets up power-on initialization tables for selected PSoC block configurations and creates source code for an application framework. The framework contains software to operate the selected components and, if the project uses more than one operating configuration, contains routines to switch between different sets of PSoC block configurations at run time. PSoC Designer can print out a configuration sheet for a given project configuration for use during application programming in conj unc tion with the D evice Data S heet . Once the framework is generated, the user can add application-specific code to flesh out the fr am ew ork . It’s also possible to change the selected components and regenerate the framework.

Design Browser

The Design Browser allows users to select and import preconfigured desi g ns into th e u se r’s project. Use rs ca n ea s il y br ow se a catalog of preconfigured designs to facilitate time-to-design. Examples provided in the tool s i nclude a 300-baud modem , LIN Bus master and slave, fan controller, and magnetic card reader.

Application Editor

Debugger

The PSoC Designer Debugger subsystem provides hardware in-circuit emulation, allowing the designer to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow the designer to read and program and read and write data memory, read and write IO registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also allows the designer to create a trace buffer of registers and memory locations of interest.

Online Help System

The online help system displays online, context-sensitive help for the user. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer in getting started.

Hardware Tools

In-Circuit Emulator

A low cost, high functionality ICE (In-Circuit Emulator) is available for development support. This hardware has the capability to program single devices.

The emulator consist s of a bas e unit th at conne ct s to th e PC by way of the parallel or USB port. The base unit is universal and will operate with all PSoC devices. Emulation pods for each device family ar e ava ilabl e sep arate ly. The emulation pod t akes the place of the PSoC device in the target board and performs full speed (24 MHz) operation.

In the Application Editor you can edit your C language and Assembly language source code. You can also assemble, compile, link, and build.

Assembler. The macro assembler allows the assembly code

to be merged seamlessly with C code. The link libraries automatically use abso lut e addre ssing or ca n be co mpil ed in relat ive mode, and linked with other software modules to get absolute addressing.

C Language Compiler. A C language compiler is available

that supports Cypress MicroSystems’ PSoC family devices. Even if you have never worked in the C language before, the product quickly allows you to create complete C programs for the PSoC family devices.

The embedded, optimizing C compiler provides all the features of C tailored to the PSoC architecture. It comes complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality.

PSoC Development Tool Kit

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User Modules and the PSoC Development Process

The development process for the PSoC device differs from that of a traditional fixed function microprocessor. The configurable analog and d igital hard ware blocks give the PS oC archite cture a unique flexibility that p ays d ivide nds in mana gi ng specifi catio n change during development and by lowering inventory costs. These configurable resources, called PSoC Blocks, have the ability to implement a wide variety of user-selectable functions. Each block has several registers that determine its fu nction and connectivity to other blocks, multiplexers, buses, and to the IO pins. Iterative devel op men t cy cl es perm it y ou to adapt the hardware as well as the software. This substantially lowers the risk of having to select a different part to meet the final design requirements.

To speed the development process, the PSoC Designer Integrated Development Environment (IDE) provides a library of pre-built, pre-tested hardware peripheral functions, called “User Modules.” User modules make selecting and implementing peripheral devices simple, and come in analog, digital, and mixed signal varieties. The standard User Module library contains over 50 common peripherals such as ADCs, DACs Timers, Counters, UARTs, and other not-so common peripherals such as DTMF Generators and Bi-Quad analog filter sections.

Each user module establishes the basic register settings that implement the selected function. It also provides parameters that allow you to tailor its precise configuration to your particular applicati on. For exam ple, a Pulse Width Modula tor User Module configures one or more digital PSoC blocks, one for each 8 bits of resolution. The user module parameters permit you to establish the pulse width and duty cycle. User modules also provide tested software to cut your development time. The user module application programming interface (API) provides highlevel functions to control and respond to hardware events at run-time. The API als o provides o ptional inte rrupt servic e routines that you can adapt as needed.

The API functions are documented in user module data sheets that are viewed directly in the PSo C Desi gn er ID E. Th es e data sheets explain the internal operation of the user module and provide performance specifications. Each data sheet describes the use of each user mod ule p ara me ter a nd d oc um ent s the setting of each register controlled by the user module.

The development process starts when you open a new project and bring up the Devi ce Edi t or, a pictorial environment (GUI) for configuring the hardware. You pick the user modules you need for your project and map them onto the PSoC blocks with pointand-click simplicity. Next, you build signal chains by interconnecting user modules to each other and the IO pins. At this stage, you also configure the clock source connections and enter parameter values directly or by selecting values from drop-down menus. When you are ready to test the hardware configuration or move on to develo ping co de for the proj ect, yo u perform the “Generate Application” step. This causes PSoC Designer to generate source code that automatically configures

the device to your speci fic ati on an d pro vi des the hig h-le ve l us er module API functions.

Device Editor

User

Module

Selection

Placement

and

Parameter

-ization

Source

Code

Generator

Generate Application

Application Edito r

Project

Manager

Source

Code

Editor

Build

Manager

Build All

Debugger

Interface

to ICE

Storage

Inspector

User Modules and Development Process Flow Chart

The next step is to write your main program, and any sub-routines using PSoC Designer’s Application Editor subsystem. The Application Editor includes a Project Manager that allows you to open the project source code files (including all generated code files) from a hierarchal view. The source code editor provides syntax coloring and advanced edit features for both C and assembly language. File search capabilities include simple string searches and recursive “grep-style” patterns. A single mouse click invokes the Build Manager. It employs a professional-strength “makefile” system to automatically analyze all file dependencies and run the compiler and assembler as necessary. Project-level options control optimization strategies used by the compiler and linker. Syntax errors are displayed in a console window. Double clicking the error message takes you directly to the offending line of source code. When all is correct, the linker builds a ROM file image suitable for programming.

The last step in the devel opm en t proc es s t ak es pla ce insi de the PSoC Designer’s Debugger subsystem. The Debugger downloads the ROM image to the In-Circuit Emulator (ICE) where it runs at full speed. Debugger capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint and watch-variable features, the Debugger provides a large trace buffer and allows you define complex breakpoint event s tha t inc lu de m oni tori ng ad dres s and da t a bu s values, memory locations and external signals.

Event &

Breakpoint

Manager

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Document Conventions

Acronyms Used

The following table lists the acronyms that are used in this document.

Acronym Description

AC alternating current ADC analog-to-digital converter API application programming interface CPU central processing unit CT continuous time DAC digital-to-analog converter DC direct current EEPROM electrically erasable programmable read-only memory FSR full scale range GPIO general purpose IO IO input/output IPOR imprecise power on reset LSb least-significant bit LVD low voltage detect MSb most-significant bit PC program counter POR power on reset PPOR precision power on reset PSoC™ Programmable System-on-Chip PWM pulse width modulator RAM random access memory ROM read only memory SC switched capacitor SMP switch mode pump

Units of Measure

A units of measure table is located in the Electrical Specifications section. Table 3-1 on page 13 lists all the abbreviations used to measure the PSoC devices.

Numeric Naming

Hexidecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’). Hexi d ec im al nu mber s ma y al so be re p res en t ed by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’ or ‘b’ are decimal.

Table of Contents

For an in depth discussion and more information on your PSoC device, obtain the PSoC Mixed Signal Array Technical Refer- ence Manual. This document encompasses and is organized into the following chapters and sections.

1. Pin Information .............................. ..... ...... .................... 8

1.1 Pinouts ................................................................... 8

1.1.1 8-Pin Part Pinout ...................................... 8

1.1.2 20-Pin Part Pinout .....................................8

1.1.3 32-Pin Part Pinout .....................................9

2. Register Reference ..................................................... 10

2.1 Register Conventions ...........................................10

2.1.1 Abbreviations Used ..................................10

2.2 Register Mapping Tables ..................................... 10

3. Electrical Specifications ............................................ 13

3.1 Absolute Maximum Ratings ............................... 14

3.2 Operating Temperature ......................................14

3.3 DC Electrical Characteristics ................................ 15

3.3.1 DC Chip-Level Specifications ................... 15

3.3.2 DC General Purpose IO Specifications .... 15

3.3.3 DC Operational Amplifier Specifications ... 16

3.3.4 DC Analog Output Buffer Specifications ... 18

3.3.5 DC Analog Reference Specifications ....... 19

3.3.6 DC Analog PSoC Block Specifications ..... 19

3.3.7 DC POR and LVD Specifications ............. 20

3.3.8 DC Programming Specifications ............... 21

3.4 AC Electrical Characteristics ................................22

3.4.1 AC Chip-Level Specifications ................... 22

3.4.2 AC General Purpose IO Specifications .... 24

3.4.3 AC Operational Amplifier Specifications ... 25

3.4.4 AC Digital Block Specifications ................. 27

3.4.5 AC Analog Output Buffer Specifications ... 28

3.4.6 AC External Clock Specifications ............. 29

3.4.7 AC Programming Specifications ............... 29

3.4.8 AC I2C Specifications ...............................30

4. Packaging Information ............................................... 31

4.1 Packaging Dimensions ......................................... 31

4.2 Thermal Impedances ..........................................34

4.3 Capacitance on Crystal Pins ............................... 34

5. Ordering Information .................................................. 35

5.1 Ordering Code Definitions ...................................35

6. Sales and Company Information ...............................36

6.1 Revision History .................................................. 36

6.2 Copyrights ............................................................ 36

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1. Pin Information

This chapter describes, lists, and illustrates the CY8C22x13 PSoC device pins and pinout configurations.

1.1 Pinouts

The CY8C22x13 PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every port pin (labeled with a “P”) is capab le of Digital IO. However, Vss, Vdd, SMP, and XRES are not capable of Digital IO.

1.1.1 8-Pin Part Pinout

Table 1-1. 8-Pin Part Pinout (PDIP, SOIC)

Pin No.

1 IO IO P0[5] Analog column mux input and column output. 2 IO I P0[3] Analog column mux input. 3 IO P1[1] Crystal Input (XTALin), I2C Serial Clock (SCL) 4 Power Vss Ground connection. 5 IO P1[0] Crystal Output (XTALout), I2C Serial Data

6 IO I P0[2] Analog column mux input. 7 IO I P0[4] Analog column mux input. 8 Power Vdd Supply voltage.

LEGEND: A = Analog, I = Input, and O = Output.

Type

Digital Analog

Name

Description

(SDA)

CY8C22113 8-Pin PSoC Device

AIO, P0[5]

AI, P0[3]

I2C SCL, XTALin, P1[1]

Vss

PDIP

SOIC

3 4

8 7 6 5

Vdd P0[4], AI P0[2], AI P1[0], XTALout, I2C SD

1.1.2 20-Pin Part Pinout

Table 1-2. 20-Pin Part Pinout (PDIP, SSOP, SOIC)

Pin No.

1 IO I P0[7] Analog column mux input. 2 IO IO P0[5] Analog column mux input and column output. 3 IO I P0[3] Analog column mux input. 4 IO I P0[1] Analog column mux input. 5 Power Vss Ground connection. 6 IO P1[7] I2C Serial Clock (SCL) 7 IO P1[5] I2C Serial Data (SDA) 8 IO P1[3] 9 IO P1[1] Crystal Input (XTALin), I2C Serial Clock (SCL) 10 Power Vss Ground connection. 11 IO P1[0] Crystal Output (XTALout), I2C Serial Data

12 IO P1[2] 13 IO P1[4] Optional External Clo ck Input (EXTCLK)

14 IO P1[6] 15 Input XRES Active high external reset with internal pull

16 IO I P0[0] Analog column mux input. 17 IO I P0[2] Analog column mux input. 18 IO I P0[4] Analog column mux input. 19 IO I P0[6] Analog column mux input. 20 Power Vdd Supply voltage.

LEGEND: A = Analog, I = Input, and O = Output.

Type

Digital Analog

Name

Description

(SDA)

down.

CY8C22213 20-Pin PSoC Device

AI, P0[7]

AIO, P0[5]

AI, P0[3] AI, P0[1]

Vss I2C SCL, P1[7] I2C SDA, P1[5]

P1[3]

I2C SCL, XTALin, P1[1]

Vss

1 2 3 4 5 6 7 8 9

PDIP

SSOP

SOIC

Vdd

P0[6], AI

19 18

P0[4], AI P0[2], AI

P0[0], AI

XRES

P1[6]

P1[4], EXTCLK

P1[2]

P1[0], XTALout, I2C SD

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CY8C22x13 Final Data Sheet 1. Pin Information

I I

1.1.3 32-Pin Part Pinout

Table 1-3. 32-Pin Part Pinout (MLF*)

Pin No.

1 NC No connection. Do not use. 2 NC No connection. Do not use. 3 NC No connection. Do not use. 4 NC No connection. Do not use. 5 Power Vss Ground connection. 6 Power Vss Ground connection. 7 IO P1[7] I2C Serial Clock (SCL) 8 IO P1[5] I2C Serial Data (SDA) 9 NC No connection. Do not use. 10 IO P1[3] 11 IO P1[1] Crystal Input (XTALin), I2C Serial Clock (SCL) 12 Power Vss Ground connection. 13 IO P1[0] Crystal Output (XTALout), I2C Serial Data

14 IO P1[2] 15 IO P1[4] Optional External Clock Input (EXTCLK) 16 NC No connection. Do not use. 17 IO P1[6] 18 Input XRES Active high external reset with internal pull

19 NC No connection. Do not use. 20 NC No connection. Do not use. 21 NC No connection. Do not use. 22 NC No connection. Do not use. 23 IO I P0[0] Analog column mux input. 24 IO I P0[2] Analog column mux input. 25 NC No connection. Do not use. 26 IO I P0[4] Analog column mux input. 27 IO I P0[6] Analog column mux input. 28 Power Vdd Supply voltage. 29 IO I P0[7] Analog column mux input. 30 IO IO P0[5] Analog column mux input and column output. 31 IO I P0[3] Analog column mux input. 32 IO I P0[1] Analog column mux input.

Type

Digital Analog

Name

Description

(SDA)

down.

I2C SCL, P1[7]

2C SDA, P1[5]

CY8C22213 PSoC Device

P0[1], A I

P0[3], A I

P0[5], A IO

P0[7], A I

Vdd

P0[6], A I

NC NC NC

NC Vss Vss

32313029282726

1 2 3 4 5 6 7 8

(Top View)

101112

P1[3]

MLF

Vss

I2C SCL, XTALin, P1[1]

131415

P1[2]

I2C SDA, XT ALo u t, P1[0]

P0[4], A I

P0[2], A

P0[0], A

NC NC

XRES

P1[6]

EXTCLK, P1[4]

LEGEND: A = Analog, I = Input, and O = Output. * The MLF package has a center pad that must be connected to the same ground

as the Vss pin.

June 3, 2004 Document No. 38-12009 Rev. *E 9

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2. Register Reference

This chapter lists the registers of the CY8C22x13 PSoC device by way of mapping tables, in offset order. For detailed register information, reference the PSoC™ Mixed Signal Array Technical Reference Manual.

2.1 Register Conventions

2.1.1 Abbreviations Used

The register conventions specific to this section are listed in the following table.

Convention Description

RW Read and write register or bit(s) R Read register or bit(s) W Write register or bit(s) L Logical register or bit(s) C Clearable register or bit(s) # Access is bit specific

2.2 Register Mapping Tables

The PSoC device has a total register address space of 512 bytes. The register space is also referred to as IO space and is broken into two parts. The XOI bit in the Flag register determines which bank the user is currently in. When the XOI bit is set, the user is said to be in the “extended” address space or the “configuration” registers.

Note In the following register mapping tables, blank fields are

Reserved and should not be accessed.

May 2004 © Cypress MicroSystems, Inc. 2003 — Document No. 38-12009 Rev. *E 10

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CY8C22x13 Final Data Sheet 2. Register Reference

Access

Name

PRT0DR 00 RW 40 80 C0 PRT0IE 01 RW 41 81 C1 PRT0GS 02 RW 42 82 C2 PRT0DM2 03 RW 43 83 C3 PRT1DR 04 RW 44 ASD11CR0 84 RW C4 PRT1IE 05 RW 45 ASD11CR1 85 RW C5 PRT1GS 06 RW 46 ASD11CR2 86 RW C6 PRT1DM2 07 RW 47 ASD11CR3 87 RW C7

DBB00DR0 20 # AMX_IN 60 RW A0 INT_MSK0 E0 RW DBB00DR1 21 W 61 A1 INT_MSK1 E1 RW DBB00DR2 22 RW 62 A2 INT_VC E2 RC DBB00CR0 23 # ARF_CR 63 RW A3 RES_WDT E3 W DBB01DR0 24 # CMP_CR0 64 # A4 DEC_DH E4 RC DBB01DR1 25 W ASY_CR 65 # A5 DEC_DL E5 RC DBB01DR2 26 RW CMP_CR1 66 RW A6 DEC_CR0 E6 RW DBB01CR0 27 # 67 A7 DEC_CR1 E7 RW DCB02DR0 28 # 68 A8 E8 DCB02DR1 29 W 69 A9 E9 DCB02DR2 2A RW 6A AA EA DCB02CR0 2B # 6B AB EB DCB03DR0 2C # 6C AC EC DCB03DR1 2D W 6D AD ED DCB03DR2 2E RW 6E AE EE DCB03CR0 2F # 6F AF EF

Blank fields are Reserved and should not be accessed. # Access is bit specific.

(0,Hex)

Addr

08 48 88 C8 09 49 89 C9 0A 4A 8A CA 0B 4B 8B CB 0C 4C 8C CC 0D 4D 8D CD 0E 4E 8E CE 0F 4F 8F CF 10 50 90 D0 11 51 91 D1 12 52 92 D2 13 53 93 D3 14 54 ASC21CR0 94 RW D4 15 55 ASC21CR1 95 RW D5 16 56 ASC21CR2 96 RW I2C_CFG D6 RW 17 57 ASC21CR3 97 RW I2C_SCR D7 # 18 58 98 I2C_DR D8 RW 19 59 99 I2C_MSCR D9 # 1A 5A 9A INT_CLR0 DA RW 1B 5B 9B INT_CLR1 DB RW 1C 5C 9C DC 1D 5D 9D INT_CLR3 DD RW 1E 5E 9E INT_MSK3 DE RW 1F 5F 9F DF

30 70 RDI0RI B0 RW F0 31 71 RDI0SYN B1 RW F1 32 72 RDI0IS B2 RW F2 33 73 RDI0LT0 B3 RW F3 34 ACB01CR3 74 RW RDIOLT1 B4 RW F4 35 ACB01CR0 75 RW RDI0RO0 B5 RW F5 36 ACB01CR1 76 RW RDI0RO1 B6 RW F6 37 ACB01CR2 77 RW B7 CPU_F F7 RL 38 78 B8 F8 39 79 B9 F9 3A 7A BA FA 3B 7B BB FB 3C 7C BC FC 3D 7D BD FD 3E 7E BE CPU_SCR1 FE # 3F 7F BF CPU_SCR0 FF #

Name

Access

(0,Hex)

Addr

Name

Access

(0,Hex)

Addr

Name

Access

(0,Hex)

Addr

June 3, 2004 Document No. 38-12009 Rev. *E 11

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CY8C22x13 Final Data Sheet 2. Register Reference

Access

Name

PRT0DM0 00 RW 40 80 C0 PRT0DM1 01 RW 41 81 C1 PRT0IC0 02 RW 42 82 C2 PRT0IC1 03 RW 43 83 C3 PRT1DM0 04 RW 44 ASD11CR0 84 RW C4 PRT1DM1 05 RW 45 ASD11CR1 85 RW C5 PRT1IC0 06 RW 46 ASD11CR2 86 RW C6 PRT1IC1 07 RW 47 ASD11CR3 87 RW C7

DBB00FN 20 RW CLK_CR0 60 RW A0 OSC_CR0 E0 RW DBB00IN 21 RW CLK_CR1 61 RW A1 OSC_CR1 E1 RW DBB00OU 22 RW ABF_CR0 62 RW A2 OSC_CR2 E2 RW

DBB01FN 24 RW 64 A4 VLT_CMP E4 R DBB01IN 25 RW 65 A5 E5 DBB01OU 26 RW AMD_CR1 66 RW A6 E6

DCB02FN 28 RW 68 A8 IMO_TR E8 W DCB02IN 29 RW 69 A9 ILO_TR E9 W DCB02OU 2A RW 6A AA BDG_TR EA RW

DCB03FN 2C RW 6C AC EC DCB03IN 2D RW 6D AD ED DCB03OU 2E RW 6E AE EE

Blank fields are Reserved and should not be accessed. # Access is bit specific.

(1,Hex)

Addr

08 48 88 C8 09 49 89 C9 0A 4A 8A CA 0B 4B 8B CB 0C 4C 8C CC 0D 4D 8D CD 0E 4E 8E CE 0F 4F 8F CF 10 50 90 GDI_O_IN D0 RW 11 51 91 GDI_E_IN D1 RW 12 52 92 GDI_O_OU D2 RW 13 53 93 GDI_E_OU D3 RW 14 54 ASC21CR0 94 RW D4 15 55 ASC21CR1 95 RW D5 16 56 ASC21CR2 96 RW D6 17 57 ASC21CR3 97 RW D7 18 58 98 D8 19 59 99 D9 1A 5A 9A DA 1B 5B 9B DB 1C 5C 9C DC 1D 5D 9D OSC_GO_EN DD RW 1E 5E 9E OSC_CR4 DE RW 1F 5F 9F OSC_CR3 DF RW

23 63 A3 VLT_CR E3 RW

27 ALT_CR0 67 RW A7 E7

2B 6B AB ECO_TR EB W

2F 6F AF EF 30 70 RDI0RI B0 RW F0 31 71 RDI0SYN B1 RW F1 32 72 RDI0IS B2 RW F2 33 73 RDI0LT0 B3 RW F3 34 ACB01CR3 74 RW RDIOLT1 B4 RW F4 35 ACB01CR0 75 RW RDI0RO0 B5 RW F5 36 ACB01CR1 76 RW RDI0RO1 B6 RW F6 37 ACB01CR2 77 RW B7 CPU_F F7 RL 38 78 B8 F8 39 79 B9 F9 3A 7A BA FA 3B 7B BB FB 3C 7C BC FC 3D 7D BD FD 3E 7E BE CPU_SCR1 FE # 3F 7F BF CPU_SCR0 FF #

Name

Access

(1,Hex)

Addr

Name

Access

(1,Hex)

Addr

Name

Access

(1,Hex)

Addr

June 3, 2004 Document No. 38-12009 Rev. *E 12

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3. Electrical S pecifications

This chapter presents the DC and AC electrical specifications of the CY8C22x13 PSoC device. For the most up to date electrical specifications, confirm that you have the most recent data sheet by referencing the web at http://www.cypress.com/psoc.

Specifications are v alid for -40 at greater than 12 MHz are valid for -40

5.25

4.75

Vdd Voltage

C ≤ TA ≤ 85oC and TJ ≤ 100oC as specified, except where noted. Specifications for devices running

C ≤ TA ≤ 70oC and TJ ≤ 82oC.

3.00

93 kHz 12 MHz 24 MHz

CPU Frequency

Figure 3-1. Voltage versus Operating Frequency

The following table lists the units of measure that are used in this chapter.

Table 3-1: Units of Measure

Symbol Unit of Measur e Symbol Unit of Measure

dB decibels mA milli-ampere

fF femto farad ms milli-second

Hz hertz mV milli-volts

KB 1024 bytes nA nano amper e Kbit 1024 bits ns nanosecond kHz kilohertz nV nanovolts

kΩ kilohm Ω ohm

MHz megahertz pA pico ampere

MΩ megaohm pF pico farad

µA micro ampere pp peak-to-peak µF micro farad ppm parts per million

µH micro henry ps picosecond

µs microsecond sps samples per second µV micro volts σ sigma: one standard deviation

µVrms micro volts root-mean-square V volts

degree Celsius µW micro watts

June 2004 Document No. 38-12009 Rev. *E 13

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.1 Ab solute Maximum Ratings

Table 3-2. Absolute Maximum Rat ings

Symbol Description Min Typ Max Units Notes

STG

Vdd Supply Voltage on Vdd Relative to Vss -0.5 – +6.0 V V

– DC Voltage Applied to Tri-state Vss - 0.5 – Vdd + 0.5 V I

MIO

MAIO

– Static Discharge Voltage 2000 – – V – Latch-up Current – – 200 mA

Storage Temperature -55 – +100

Ambient Temperature with Power Applied -40 – +85

DC Input Voltage Vss - 0.5 – Vdd + 0.5 V

Maximum Current into any Port Pin -25 – +50 mA Maximum Current into any Port Pin Configured as Analog

Driver

-50 – +50 mA

Higher storage temperatures will reduce data retention time.

3.2 Operating Temperature

Table 3-3. Operating Temperature

Symbol Description Min Typ Max Units Notes

Ambient Temperature -40 – +85 Junction Temperature -40 – +100

The temperature rise from ambient to junction is package specific. See “Thermal Impedances”

on page 34. The user must limit the power con-

sumption to comply with this requirement.

June 3, 2004 Document No. 38-12009 Rev. *E 14

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.3 DC Electrical Characteristics

3.3.1 DC Chip-Level Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-4. DC Chip-Level Specifications

Symbol Description Min Typ Max Units Notes

Vdd Supply Voltage 3.00 – 5.25 V I

DD3

SBH

SBXTL

SBXTLH

REF

a. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This should be compared with devices tha t ha ve si mi la r fu n ct i o ns

enabled.

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Supply Current – 5 8 mA

Supply Current – 3.3 6.0 mA

Sleep (Mode) Current with POR, LVD, Sleep Timer, and

WDT. Sleep (Mode) Current with POR, LVD, Sleep Timer, and

WDT at high temperature. Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT,

and external crystal.

Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT, and external crystal at high temperature.

Reference Voltage (Bandgap) 1.275 1.3 1.325 V Trimmed for appropriate Vdd.

– 3 6.5 µA Conditions are with internal slow speed oscilla-

– 4 25 µA Conditions are with internal slow speed oscilla-

– 4 7.5 µA Conditions are with properly loaded, 1 µW max,

– 5 26 µA Conditions are with properly loaded, 1 µW max,

Conditions are Vdd = 5.0V, 25 oC, CPU = 3 MHz, 48 MHz disabled. VC1 = 1.5 MHz, VC2 =

93.75 kHz, VC3 = 93.75 kHz. Condition s are Vdd = 3.3V, TA = 25 oC, CPU = 3

MHz, 48 MHz = Disabled, VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 93.75 kHz.

tor, Vdd = 3.3V, -40

tor, Vdd = 3.3V, 55

32.768 kHz crystal. Vdd = 3.3V, -40

32.768 kHz crystal. Vdd = 3.3V, 55

C <= TA <= 55 oC.

C < TA <= 85 oC.

C <= TA <=

C < TA <=

3.3.2 DC General Purpose IO Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-5. DC GPIO Specifications

Symbol Description Min Typ Max Units Notes

OUT

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Pull up Resistor 4 5.6 8 kΩ Pull down Resistor 4 5. 6 8 kΩ High Output Level Vdd - 1.0 – – V IOH = 10 mA, Vdd = 4.75 to 5.25V (80 mA max-

Low Output Level – – 0.75 V IOL = 25 mA, Vdd = 4.75 to 5.25V (1 50 mA

Input Low Level – – 0.8 V Vdd = 3.0 to 5.25 Input High Level 2.1 – V Vdd = 3.0 to 5.25 Input Hysterisis – 60 – mV Input Leakage (Absolute Value) – 1 – nA Gross tested to 1 µA. Capacitive Load on Pins as Input – 3.5 10 pF Capacitive Load on Pins as Output – 3.5 10 pF

imum combined IOH budget)

maximum combined IOL budget)

Package and pin dependent. Temp = 25oC. Package and pin dependent. Temp = 25oC.

June 3, 2004 Document No. 38-12009 Rev. *E 15

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.3.3 DC Operational Amplifier Specifications

The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified. The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Cap PSoC

blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block. Typical parameters apply to 5V at 25°C and are for design guidance only.

T able 3-6. 5V DC Operatio nal A mpli fier Sp eci fica tions

Symbol Description Min Typ Max Units Notes

OSOA

TCV

OSOA

EBOA

INOA

CMOA

OLOA

OHIGHOA

OLOWOA

SOA

PSRR

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Input Offset Voltage (absolute value) Low Power Input Offset Voltage (absolute value) Mid Power Input Offset Voltage (absolute value) High Power Average Input Offset Voltage Drift – 7.0 35.0

Input Leakage Current (Port 0 Analog Pins) – 20 – pA Gross tested to 1 µA. Input Capacitance (Port 0 Analog Pins) – 4.5 9.5 pF Common Mode Voltage Range

Common Mode Voltage Range (high power or high opamp bias)

Open Loop Gain Power = Low Power = Medium Power = High High Output Voltage Swing (worst case internal load) Power = Low Power = Medium Power = High Low Output Voltage Swing (worst case internal load) Power = Low Power = Medium Power = High Supply Current (including associated AGND buffer) Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High Power = High, Opamp Bias = High Supply Voltage Rejection Ratio 60 – – dB

–1.6 – –

0.0 – Vdd

0.5 –

60 60 80

Vdd - 0.2 Vdd - 0.2 Vdd - 0.5

– – –

– – – – – –

1.3

1.2

– – dB Specification is applicable at high power. For all

– – –

150 300 600 1200 2400 4600

10 8

7.5

Vdd - 0.5

– – –

0.2

0.5

200 400 800 1600 3200 6400

mV mV mV

µV/

Package and pin dependent. Temp = 25

V The common-mode input voltage range is mea-

V V V

µA µA µA µA µA µA

sured through an analog output buffer. The specification includes the limitations imposed by the characteristics of the analog output buffer.

other bias modes (except high power, high opamp bias), minimum is 60 dB.

June 3, 2004 Document No. 38-12009 Rev. *E 16

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

Table 3-7. 3.3V DC Operational Amplifier Specifications

Symbol Description Min Typ Max Units Notes

OSOA

TCV I

EBOA

INOA

CMOA

OLOA

OHIGHOA

OLOWOA

SOA

PSRR

OSOA

Input Offset Voltage (absolute value) Low Power Input Offset Voltage (absolute value) Mid Power

– –

1.65

1.32

10 8

mV High Power is 5 Volt Only Average Input Offset Voltage Drift – 7.0 35.0

µV/

Input Leakage Current (Port 0 Analog Pins) – 20 – pA Gross tested to 1 µA. Input Capacitance (Port 0 Analog Pins) – 4.5 9.5 pF

Package and pin dependent. Temp = 25

Common Mode Voltage Range 0.2 – Vdd - 0.2 V The common-mode input voltage range is

measured through an analog output buffer. The specification includes the limitations imposed by the characteristics of the analog output buffer.

Open Loop Gain Power = Low Power = Medium Power = High

60 60 80

– – dB Specification is applicable at high power. For

all other bias modes (except high power, high opamp bias), minimum is 60 dB.

High Output Voltage Swing (worst case internal load) Power = Low Power = Medium Power = High is 5V only

Vdd - 0.2 Vdd - 0.2 Vdd - 0.2

– – –

V Low Output Voltage Swing (worst case internal load)

Power = Low Power = Medium Power = High

– – –

0.2

V Supply Current (including associated AGND buffer)

Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High Power = High, Opamp Bias = High Supply Voltage Rejection Ratio 50 – – dB

– – – – – –

150 300 600 1200 2400 4600

200 400 800 1600 3200 6400

µA

June 3, 2004 Document No. 38-12009 Rev. *E 17

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.3.4 DC Analog Output Buffer Specifications

The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-8. 5V DC Analog Output Buffer Specifications

Symbol Description Min Typ Max Units Notes

OSOB

TCV

OSOB

CMOB

OUTOB

OHIGHOB

OLOWOB

SOB

PSRR

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Input Offset Voltage (Absolute Value) – 3 12 mV Average Input Offset Vol tage Drift – +6 – µV/°C Common-Mode Input Voltage Range 0.5 – Vdd - 1.0 V Output Resistance

Power = Low Power = High High Output Voltage Swing (Load = 32 ohms to Vdd/2)

Power = Low Power = High

Low Output Voltage Swing (Load = 32 ohms to Vdd/2) Power = Low Power = High

Supply Current Including Bias Cell (No Load) Power = Low Power = High Supply Voltage Rejection Ratio 60 – – dB

– –

0.5 x Vdd + 1.1

0.5 x Vdd

– –

+ 1.1

1 1

– –

1.1

2.6

– –

0.5 x Vdd - 1.3

0.5 x Vdd

5.1

8.8

- 1.3

Ω

V V

mA mA

Table 3-9. 3.3V DC Analog Output Buffer Specifications

Symbol Description Min Typ Max Units Notes

OSOB

TCV V

CMOB

OUTOB

OHIGHOB

OLOWOB

SOB

PSRR

OSOB

Input Offset Voltage (Absolute Value) – 3 12 mV Average Input Offset Voltage Drift – +6 – µV/°C Common-Mode Input Voltage Range 0.5 - Vdd - 1.0 V Output Resistance

Power = Low Power = High High Output Voltage Swing (Load = 1K ohms to Vdd/2) Power = Low Power = High

Low Output Voltage Swing (Load = 1K ohms to Vdd/2) Power = Low Power = High

Supply Current Including Bias Cell (No Load) Power = Low Power = High Supply Voltage Rejection Ratio 50 – – dB

– –

0.5 x Vdd + 1.0

0.5 x Vdd

– –

–

+ 1.0

1 1

– –

0.8

2.0

– –

0.5 x Vdd - 1.0

0.5 x Vdd

2.0

4.3

- 1.0

Ω

V V

mA mA

June 3, 2004 Document No. 38-12009 Rev. *E 18

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.3.5 DC Analog Reference Specifications

The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified. The guaranteed specific ations are measure d throug h the Anal og Con tinuou s T im e PSoC block s. The powe r level s for AGND refer to

the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block.

Table 3-10. 5V DC Analog Reference Specifications

Symbol Description Min Typ Max Units

–

a. AGND tolerance includes the offsets of the local buffer in the PSoC block. Bandgap voltage is 1.3V ± 2%.

Table 3-11. 3.3V DC Analog Reference Specifications

Symbol Description Min Typ Max Units

–

a. AGND tolerance includes the offsets of the local buffer in the PSoC block. Bandgap voltage is 1.3V ± 2%

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

AGND = Vdd/2 CT Block Power = High

Vdd/2 - 0.043 Vdd/2 - 0.025 Vdd/2 + 0.003 V

Vdd/2 - 0.037 Vdd/2 - 0.020 Vdd/2 + 0.002 V

3.3.6 DC Analog PSoC Block Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-12. DC Analog PSoC Block Specifications

Symbol Description Min Typ Max Units Notes

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Resistor Unit Value (Continuous Time) – 12.24 – kΩ Capacitor Unit Value (Switch Cap) – 80 – fF

June 3, 2004 Document No. 38-12009 Rev. *E 19

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.3.7 DC POR and LVD Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Note The bits PORLEV and VM in the table below refer to bits in the VLT_CR register. See the PSoC Mixed Signal Array Technical

Reference Manual for more information on the VLT_CR register.

Table 3-13. DC POR and LVD Specifications

Symbol Description Min Typ Max Units Notes

PPOR0R

PPOR1R

PPOR2R

PPOR0

PPOR1

PPOR2

PH0

PH1

PH2

LVD0

LVD1

LVD2

LVD3

LVD4

LVD5

LVD6

LVD7

a. Always greater than 50 mV above PPOR (PORLEV = 00) for f alling supply. b. Always greater than 50 mV above PPOR (PORLEV = 10) for f alling supply.

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Vdd Value for PPOR Trip (positive ramp) PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b

–

2.908

4.394

4.548

–

V V

Vdd Value for PPO R Trip (negative ramp) PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b

–

2.816

4.394

4.548

–

V V

PPOR Hysteresis PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b

– – –

92 0 0

– – –

mV mV mV

Vdd Value for LVD Trip VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b

2.863

2.963

3.070

3.920

4.393

4.550

4.632

4.718

2.921

3.023

3.133

4.00

4.483

4.643

4.727

4.814

2.979

3.083

3.196

4.080

4.573

4.736

4.822

4.910

V V

V V V V

V V V

June 3, 2004 Document No. 38-12009 Rev. *E 20

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.3.8 DC Programming Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-14. DC Programming Specifications

Symbol Description Min Typ Max Units Notes

DDP

ILP

IHP

ILP

IHP

OLV

OHV

Flash

ENPB

Flash

ENT

Flash

a. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of

25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (and so forth to limit the total number of cycles to 36x50,000 and that no single block ever sees more than 50,000 cycles).

For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Supply Current During Programming or Verify – 5 25 mA Input Low Voltage During Programming or Verify – – 0.8 V Input High Voltage During Programming or Verify 2.2 – – V Input Current when Applying Vilp to P1[0] or P1[1] During

Programming or Verify Input Current when Applying Vihp to P1[0] or P1[1] During

Programming or Verify Output Low Voltage During Programming or Verify – – Vss + 0.75 V

Output High Voltage During Programming or Verify Vdd - 1.0 – Vdd V Flash Endurance (per block) 50,000 – – – Erase/write cycles per block. Flash Endurance (total)

Flash Data Retention 10 – – Years

– – 0.2 mA Driving internal pull-down resistor.

– – 1.5 mA Driving internal pull-down resistor.

1,800,000 – – – Erase/write cycles.

June 3, 2004 Document No. 38-12009 Rev. *E 21

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.4 AC Electrical Characteristics

3.4.1 AC Chip-Level Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-15. AC Chip-Level Specifications

Symbol Description Min Typ Max Units Notes

IMO

CPU1

CPU2

48M

24M

32K1

32K2

PLL

Jitter24M2 24 MHz Period Jitter (PLL) – – 600 ps T

PLLSLEW

PLLSLEWS-

LOW

OSACC

Jitter32k 32 kHz Period Jitter – 100 ns T

XRST

DC24M 24 MHz Duty Cycle 40 50 60 % Step24M 24 MHz Trim Step Size – 50 – kHz Fout48M 48 MHz Output Frequency 46.8 48.0

Jitter24M1 24 MHz Period Jitter (IMO) – 600 ps F

MAX

RAMP

a. 4.75V < Vdd < 5.25V. b. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range. c. 3.0V < Vdd < 3.6V. See Application Note AN2012 “Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation” for information on trimming for operation at 3.3V. d. See the individual user module data sheets for information on maximum frequencies for user modules.

e. 3.0V < 5.25V. f. The crystal oscillator frequency is within 100 ppm of its final value by the end of the T

32.768 kHz crystal. 3.0V ≤ Vdd ≤ 5.5V, -40

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Internal Main Oscillator Frequency 23.4 24 CPU Frequency (5V Nomi nal) 0.93 24 CPU Frequency (3.3V Nominal) 0.93 12 Digital PSoC Block Frequency 0 48

Digital PSoC Block Frequency 0 24 Internal Low Speed Oscillator Frequency 15 32 64 kHz External Crystal Oscillator – 32.768 – kHz

24.6

12.3

49.2

24.6

MHz Trimmed. Utilizing factory trim values.

a,b

MHz

b,c

MHz

a,b,d

MHz Refer to the AC Digital Block Specifications

b,e,d

MHz

below.

Accuracy is capacitor and crystal dependent. 50% duty cycle.

PLL Frequency – 23.986 – MHz

PLL Lock Time 0.5 – 10 ms PLL Lock Time for Low Gain Setting 0.5 – 50 ms

External Crystal Oscillator Startup to 1% – 1700 External Crystal Oscillator Startup to 100 ppm – 2800

External Reset Pulse Width 10 – – µs

Maximum frequency of signal on row input or row output. – – 12.3 MHz Supply Ramp Time 0 – – µs

C ≤ TA ≤ 85 oC.

osacc

2620 3800

49.2

period. Correct operation assumes a properly loaded 1 uW maximum drive level

a,c

MHz Trimmed. Utilizing factory trim values.

Is a multiple (x732) of crystal frequency.

PLL nable

PLL

Gain

PLL

PLLSLEW

24 MHz

Figure 3-2. PLL Lock Timing Diagram

June 3, 2004 Document No. 38-12009 Rev. *E 22

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

PLL nable

PLLSLEWLOW

PLL

24 MHz

PLL

Gain

Figure 3-3. PLL Lock for Low Gain Setting Timing Diagram

32K

elect

32K2

Figure 3-4. External Crystal Oscillator Startup Timing Diagram

Jitter24M1

24M

Figure 3-5. 24 MHz Period Jitter (IMO) Timing Diagram

32 kHz

Jitter32k

32K2

Figure 3-6. 32 kHz Period Jitter (ECO) Timing Diagram

June 3, 2004 Document No. 38-12009 Rev. *E 23

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.4.2 AC General Purpose IO Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-16. AC GPIO Specifications

Symbol Description Min Typ Max Units Notes

GPIO

TRiseF Rise Time, Normal Strong Mode, Cload = 50 pF 3 – 18 ns Vdd = 4.5 to 5.25V, 10% - 90% TFallF Fall Time, Normal Strong Mode, Cload = 50 pF 2 – 18 ns Vdd = 4.5 to 5.25V, 10% - 90% TRiseS Rise Time, Slow Strong Mode, Cload = 50 pF 10 27 – ns Vdd = 3 to 5.25V, 10% - 90% TFallS Fall Time, Slow Strong Mode, Cload = 50 pF 10 22 – ns Vdd = 3 to 5.25V, 10% - 90%

PIO

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

GPIO Operating Frequenc y 0 – 12 MHz

90%

10%

TRiseF TRiseS

Figure 3-7. GPIO Timing Diagram

TFallF TFallS

June 3, 2004 Document No. 38-12009 Rev. *E 24

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.4.3 AC Operational Amplifie r Specifications

The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Note Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block.

Table 3-17. 5V AC Operational Amplifier Specifications

Symbol Description Min Typ Max Units Notes

ROA

SOA

ROA

FOA

NOA

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Rising Settling Time from 80% of ∆V to 0.1% of ∆V (10 pF load, Unity Gain)

Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High Power = High, Opamp Bias = High Falling Settling Time from 20% of ∆V to 0.1% of ∆V (10 pF

load, Unity Gain) Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High Power = High, Opamp Bias = High Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High Power = High, Opamp Bias = High Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High Power = High, Opamp Bias = High Gain Bandwidth Product Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High Power = High, Opamp Bias = High Noise at 1 kHz (Power = Medium, Opamp Bias = High) – 200 – nV/rt-Hz

– – – – – –

0.15

1.7

6.5

0.01

0.5

4.0

0.75

3.1

5.4

–

3.9

0.72

0.62

5.9

0.92

0.72

µs µs µs µs µs µs

V/ V/ V/ V/ V/ V/

MHz MHz MHz MHz MHz MHz

Specification maximums for low power and high opamp bias, medium power, and medium power and high opamp bias levels are between low and high power levels.

Specification minimums for low power and high opamp bias, medium power, and

µs

medium power and high opamp bias levels

µs

are between low and high power levels.

µs µs µs µs

Specification minimums for low power and high opamp bias, medium power, and

µs

medium power and high opamp bias levels

µs

are between low and high power levels.

µs µs µs µs

Specification minimums for low power and high opamp bias, medium power, and medium power and high opamp bias levels are between low and high power levels.

June 3, 2004 Document No. 38-12009 Rev. *E 25

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

Table 3-18. 3.3V AC Operational Amplifier Specifications

Symbol Description Min Typ Max Units Notes

ROA

SOA

NOA

ROA

FOA

Rising Settling Time from 80% of ∆V to 0.1% of ∆V (10 pF load, Unity Gain)

Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High (3.3 V olt High Bias Operation not support ed) Power = High, Opamp Bias = High (3.3 Volt High Power,

High Opamp Bias not supported)

–

3.92 – – – –

–

– –

–

0.72

–

µs µs µs µs µs

µs

Falling Settling Time from 20% of ∆V to 0.1% of ∆V (10 pF load, Unity Gain)

Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High (3.3 V olt High Bias Operation not support ed)

–

– – – – –

–

5.41

0.72 –

µs µs µs µs µs

Power = High, Opamp Bias = High (3.3 Volt High Power, High Opamp Bias not supported)

–

µs

Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High (3.3 V olt High Bias Operation not support ed)

0.31

2.7 –

–

V/ V/ V/ V/ V/

Power = High, Opamp Bias = High (3.3 Volt High Power, High Opamp Bias not supported)

–

V/ Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High (3.3 V olt High Bias Operation not support ed) Power = High, Opamp Bias = High (3.3 Volt High Power,

High Opamp Bias not supported)

0.24

1.8 –

–

– –

–

V/ Gain Bandwidth Product Power = Low Power = Low, Opamp Bias = High Power = Medium Power = Medium, Opamp Bias = High Power = High (3.3 V olt High Bias Operation not support ed)

Power = High, Opamp Bias = High

(3.3 Volt High Power,

High Opamp Bias not supported)

0.67

2.8 –

–

MHz

– –

–

– –

MHz

MHz Noise at 1 kHz (Power = Medium, Opamp Bias = High) – 200 – nV/rt-Hz

Specification maximums for low power and high opamp bias, medium power, and medium power and high opamp bias levels are between low and high power levels.

Specification minimums for low power and high opamp bias, medium power, and

µs

medium power and high opamp bias levels

µs

are between low and high power levels.

µs µs µs

µs

Specification minimums for low power and high opamp bias, medium power, and

µs

medium power and high opamp bias levels

µs

are between low and high power levels.

µs µs µs

µs

Specification minimums for low power and high opamp bias, medium power, and medium power and high opamp bias levels are between low and high power levels.

June 3, 2004 Document No. 38-12009 Rev. *E 26

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.4.4 AC Digital Block Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-19. AC Digital Block Specifications

Function Description Min Typ Max Units Notes

Timer Capture Pulse Width

Counter Enable Pulse Width

Dead Band Kill Pulse Width:

CRCPRS (PRS Mode)

CRCPRS (CRC Mode)

SPIM Maximum Input Clock Frequency – – 8.2 MHz SPIS Maximum Input Clock Frequency – – 4.1 ns

Transmitter Maximum Input Clock Frequency – – 16.4 MHz Receiver Maximum Input Clock Frequency – 16 49.2 MHz 4.75V < Vdd < 5.25V.

a. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period).

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

50 Maximum Frequency, No Capture – – 49.2 MHz 4.75V < Vdd < 5.25V. Maximum Frequency, With Capture – – 24.6 MHz

50 Maximum Frequency, No Enable Input – – 49.2 MHz 4. 75V < Vdd < 5.25V. Maximum Frequency, Enable Input – – 24.6 MHz

Asynchronous Restart Mode 20 – – ns Synchronous Restart Mode

Disable Mode

Maximum Frequency – – 49.2 MHz 4. 75V < Vdd < 5.25V. Maximum Inpu t Clock Frequency – – 49.2 MHz 4.75V < Vdd < 5. 25V.

Maximum Inpu t Clock Frequency – – 24.6 MHz

Width of SS_ Negated Between Transmissions

– – ns

June 3, 2004 Document No. 38-12009 Rev. *E 27

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.4.5 AC Analog Output Buffer Specifications

The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-20. 5V AC Analog Output Buffer Specifications

Symbol Description Min Typ Max Units Notes

ROB

SOB

ROB

FOB

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Rising Settling Time to 0.1%, 1V Step, 100pF Load Power = Low Power = High Falling Settling Time to 0.1%, 1V Step, 100pF Load Power = Low Power = High Rising Slew Rate (20% to 80%), 1V Step, 100pF Load Power = Low Power = High Falling Slew Rate (80% to 20%), 1V Step, 100pF Load Power = Low Power = High Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load

Power = Low Power = High Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load

Power = Low Power = High

–

0.65

0.8

300

– –

2.5

2.2

– –

µs µs

V/µs V/

MHz MHz

kHz kHz

µs

Table 3-21. 3.3V AC Analog Output Buffer Specifications

Symbol Description Min Typ Max Units Notes

ROB

SOB

ROB

Power = Low Power = High Falling Slew Rate (80% to 20%), 1V Step, 100pF Load

FOB

Power = Low Power = High Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load

Power = Low Power = High Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load

Power = Low Power = High

–

0.5

0.7

200

– –

3.8

2.6

– –

µs µs

V/µs V/

MHz MHz

kHz kHz

µs

June 3, 2004 Document No. 38-12009 Rev. *E 28

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.4.6 AC External Cl ock Specifications

The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-22. 5V AC External Clo ck Specifications

Symbol Description Min Typ Max Units Notes

OSCEXT

– High Period 20.6 – Low Period 20.6 – Power Up IMO to Switch 150

Table 3-23. 3.3V AC External Clock Specifications

Symbol Description Min Typ Max Units Notes

OSCEXT

– High Period with CPU Clock divide by 1 41.7 – Low Period with CPU Clock divide by 1 41.7 – Power Up IMO to Switch 150

a. Maximum CPU frequency is 12 MHz at 3.3V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements. b. If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider will ensure that the fifty per-

cent duty cycle requirement is met.

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Frequency 0 –24.24MHz

– –ns – –ns – – µs

Frequency with CPU Clock divide by 1 Frequency with CPU Clock divide by 2 or greater

0 –12.12MHz 0 –24.24MHz

– –ns – –ns – – µs

3.4.7 AC Programming Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

Table 3-24. AC Programming Specifications

Symbol Description Min Typ Max Units Notes

RSCLK

FSCLK

SSCLK

HSCLK

SCLK

ERASEB

WRITE

DSCLK

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Rise Time of SCLK 1 – 20 ns Fall Time of SCLK 1 – 20 ns Data Set up Time to Falling Edge of SCLK 40 – – ns Data Hold Time from Falling Edge of SCLK 40 – – ns Frequency of SCLK 0 – 8 MHz Flash Erase Time (Block) – 15 – ms Flash Block Write Time – 30 – ms Data Out Delay from Falling Edge of SCLK – – 45 ns

June 3, 2004 Document No. 38-12009 Rev. *E 29

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CY8C22x13 Final Data Sheet 3. Electrical Specifications

3.4.8 AC I2C Specifications

The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40°C ≤ T

are for design guidance only or unless otherwise specified.

≤ 85°C, or 3.0V to 3.6V and -40°C ≤ TA ≤ 85°C, respectively. Typical parameters apply to 5V and 3.3V at 25°C and

Table 3-25. AC Characteristics of the I

Symbol Description

SCLI2C

HDSTAI2C

LOWI2C

HIGHI2C

SUSTAI2C

HDDATI2C

SUDATI2C

SUSTOI2C

BUFI2C

SPI2C

a. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement t

SCL Clock Frequency 0 100 0 400 kHz Hold Time (repeated) START Condition. After this

period, the first clock pulse is generated. LOW Period of the SCL Clock 4.7 –1.3– µs

HIGH Period of the SCL Clock 4.0 –0.6– µs Set-up Time for a Repeated START Condition 4.7 –0.6– µs Data Hold Time 0 –0– µs Data Set-up Time 250 – Set-up Time for STOP Condition 4.0 –0.6– µs Bus Free Time Between a STOP and START Condition 4.7 –1.3– µs Pulse Width of spikes are suppressed by the input fil-

ter.

the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data

+ t

bit to the SDA line t

rmax

= 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.

SU;DAT

C SDA and SCL Pins

Standard Mode Fast Mode

4.0 –0.6– µs

– – 0 50 ns

100

–ns

≥ 250 ns must then be met. This will automatically be

SU;DAT

Units NotesMin Max Min Max

LOWI2C

SUDATI2C

HDSTAI2C

SPI2C

BUFI2C

SCL

HDSTAI2C

HDDATI2C

HIGHI2C

SUSTAI2C

Sr SP

Figure 3-8. Definition for Timing for Fast/Standard Mode on the I2C Bus

SUSTOI2C

June 3, 2004 Document No. 38-12009 Rev. *E 30

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4. Packaging Information

This chapter illustrates the packaging specifications for the CY8C22x13 PSoC device, along with the thermal impedances for each package and the typical package capacitance on crystal pins.

4.1 Packaging Dimensions

51-85075 - *A

Figure 4-1. 8-Lead (300-Mil) PDIP

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CY8C22x13 Final Data Sheet 4. Packaging Information

Figure 4-2. 8-Lead (150-Mil) SOIC

Figure 4-3. 20-Lead (300-Mil) Molded DIP

51-85011-A

51-85011 - *A

51-85066 *B

51-85066 - *C

June 3, 2004 Document No. 38-12009 Rev. *E 32

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CY8C22x13 Final Data Sheet 4. Packaging Information

Figure 4-4. 20-Lead (210-Mil) SSOP

51-85077 - *C

51-85024 - *B

Figure 4-5. 20-Lead (300-Mil) Molded SOIC

June 3, 2004 Document No. 38-12009 Rev. *E 33

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CY8C22x13 Final Data Sheet 4. Packaging Information

X = 138 MIL Y = 138 MIL

51-85188 - **

Figure 4-6. 32-Lead (5x5 mm) MLF

4.2 Thermal Impeda nces

Table 4-1. Thermal Impedances per Package

Package Typical θ

8 PDIP

8 SOIC

20 PDIP

20 SSOP

20 SOIC

32 MLF

* TJ = TA + POWER x θ

123 oC/W 185 oC/W 109 oC/W 117 oC/W

81 oC/W 22 oC/W

4.3 Capacitance on Crystal Pins

Table 4-2: Typical Package Capacitance on Crystal Pins

Package Package Capacitance

8 PDIP 2.8 pF 8 SOIC 2.0 pF

20 PDIP 3.0 pF

20 SSOP 2.6 pF

20 SOIC 2.5 pF

32 MLF 2.0 pF

June 3, 2004 Document No. 38-12009 Rev. *E 34

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5. Ordering Information

The following table lists the CY8C22x13 PSoC Device family’s key package features and ordering codes.

Table 5-1. CY8C22x13 PSoC Device Family Key Features and Ordering Information

Package

8 Pin (300 Mil) DIP CY8C22113-24PI 2 256 No -40C to +85C 4 3 6 4 1 No 8 Pin (150 Mil) SOIC CY8C22113-24SI 2 256 No -40C to +85C 4 3 6 4 1 No 8 Pin (150 Mil) SOIC

(Tape and Reel) 20 Pin (300 Mil) DIP CY8C22213-24PI 2 256 No -40C to +85C 4 3 16 8 1 Yes 20 Pin (210 Mil) SSOP CY8C22213-24PVI 2 256 No -40C to +85C 4 3 16 8 1 Yes 20 Pin (210 Mil) SSOP

(Tape and Reel) 20 Pin (300 Mil) SOIC CY8C22213-24SI 2 256 No -40C to +85C 4 3 16 8 1 Yes 20 Pin (300 Mil) SOIC

(Tape and Reel) 32 Pin (5x5 mm) MLF CY8C22213-24LFI 2 256 No -40C to +85C 4 3 16 8 1 Yes

CY8C22113-24SIT 2 256 No -40C to +85C 4 3 6 4 1 No

CY8C22213-24PVIT 2 256 No -40C to +85C 4 3 16 8 1 Yes

CY8C22213-24SIT 2 256 No -40C to +85C 4 3 16 8 1 Yes

Ordering

Code

Flash (Kbytes)

RAM (Bytes)

Pump

Switch Mode

Range

Temperature

(Rows of 4)

Digital Blocks

Analog Blocks

(Columns of 3)

Digital IO Pins

Analog Inputs

Analog Outputs

5.1 Ordering Code Definitions

Y 8 C 22 xxx-SPxx

Package Type: Thermal Rating:

P = PDIP C = Commercial S = SOIC I = Industrial PV = SSOP E = Extended LF = MLF

A = TQFP Speed: 24 MHz Part Number Family Code Technology Code: C = CMOS Marketing Code: 8 = Cypress MicroSystems Company ID: CY = Cypress

XRES Pin

June 3, 2004 Document No. 38-12009 Rev. *E 35

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6. Sales and Company Information

To obtain information about Cypre ss Mi croSys tems or PSoC sales and tec hnic al support, refere nce the fol lowi ng infor mation or go to the section titled “Getting Started” on page 4 in this document.

Cypress MicroSystems

2700 162nd Street SW Building D Lynnwood, WA 98037

Phone: 800.669.0557 Facsimile: 425.787.4641

Web Sites: Company Information – http://www.cypress.com

Sales – http://www.cypress.com/aboutus/sales_locations.cfm

Technical Support – http://www.cypress.com/support/login.cfm

6.1 Revision History

Table 6-1. CY8C22x13 Data Sheet Revision History

Document Title: CY8C22113 and CY8C22213 PSoC Mixed Signal Array Final Data Sheet Document N umber: 38-12009

Revision ECN # Issue Date Origin of Change Description of Change

** 128180 06/30/2003 New Silicon. New document – Advanced Data Sheet (two page product brief). *A 129202 09/16/2003 NWJ New document – Preliminary Data Sheet (300 page product detail). *B 130127 10/15/2003 NWJ Revised document for Silicon Revision A. *C 131679 12/05/2003 NWJ Changes to Electrical Specifications section, Miscellaneous changes to I2C, GDI, RDI,

*D 131803 12/22/2003 NWJ Changes to Electrical Specifications and miscellaneous small changes throughout the

*E 229421 06/03/2004 SFV New data sheet format and organization. Referenc e the PSoC Mixed Signal Array Tech-

Distribution: External /Public Posting: None

Registers, and Digital Block chapters.

data sheet.

nical Reference Manual

for additional informatio n. Title change.

6.2 Co pyrights

© Cypress MicroSystems , Inc. 20 04. All righ ts reser v ed. PSoC™ (Pr og ram ma ble Syste m- on- Chip ™) ar e trademarks of Cypress MicroSys tems, Inc. All other trademarks or registered trademarks referenced herein are property of the respective corporations.

The information contained herein is subject to change without notice. Cypr ess MicroSystems assumes no responsibility for the use of any circuitry othe r than circuitry embodied in a Cypress MicroSystems product. Nor does it convey or imply any license under patent or other rights. Cypress MicroSystems does not aut ho ri ze i t s pr od uc t s for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress MicroSystems products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress MicroSystems against all charges. Cypr ess MicroSystems products are not warran ted nor intended to be used for medica l, life-support, life-saving, critical contr ol or safety applications, unless pursuant to an express written agreement with Cypress MicroSystems.

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Cypress CY8C22113, CY8C22213 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1. Pin Information

1.1 Pinouts

2. Register Reference

2.1 Register Conventions

2.2 Register Mapping Tables

3. Electrical S pecifications

3.1 Ab solute Maximum Ratings

3.2 Operating Temperature

3.3 DC Electrical Characteristics

3.4 AC Electrical Characteristics

4. Packaging Information

4.1 Packaging Dimensions

4.2 Thermal Impeda nces

4.3 Capacitance on Crystal Pins

5. Ordering Information

5.1 Ordering Code Definitions

6. Sales and Company Information

6.1 Revision History

6.2 Co pyrights