CYPRESS CY7C401, CY7C403, CY7C402, CY7C404 User Manual

64 x 4 Cascadable FIFO 64 x 5 Cascadable FIFO
CY7C401/CY7C403 CY7C402/CY7C404
1CY7C40 2
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Features
• Processed with high-speed CMOS for optimum speed/power
• 25-MHz data rates
• 50-ns bubble-through time—25 MHz
• Expandable in word width and/or length
• 5-volt power supply ± 10% tolerance, both commercial and milita ry
• Independent asynchronous inputs and outputs
• TTL-compatible interface
• Output enable function available on CY7C403 and CY7C404
• Capable of withstanding greater than 2001V electro­static discharge
• Pin compatible with MMI 67401A/67402A
Functional Description
The CY7C401 and CY7C403 are asynchronous first-in first-out (FIFOs) organized as 64 four-bit words. The CY7C402 and CY7C404 are similar FIFOs organized as 64 five-bit
words. Both the CY7C403 and CY7C404 have an output en­able (OE) function.
The devices accept 4- or 5-bit words at the data input (DI DI
) under the control of the shift in (SI) input. The stored
n
words stack up at the output (DO were entered. A read command on the shift out (SO) input
– DOn) in the order they
0
0
causes the next to last word to move to the output and all data shifts down once in the stack. The input ready (IR) signal acts as a flag to indicate when the input is ready to accept new data (HIGH), to indicate when the FIFO is full (LOW), and to provide a signal for a cascading. The output ready (OR) signal is a flag to indicate the output contains valid data (HIGH), to indicate the FIFO is empty (LOW), and to provide a signal for cascad­ing.
Parallel expansion for wider words is accomplished by lo gical­ly ANDing the IR and OR signals to form c omposite signals.
Serial e xpansion is accomplished by tying the data inputs of one device to the data outputs of the previous device. The IR pin of the receiving device is connected to the SO pi n of the sending device, and the OR pin of the sending device is con­nected to the SI pin of the receiving device.
Reading and writing operations are completely asynchronous, allowing the FIFO to be used as a buffer between two digital machines of widely differing operating frequencies. The 25-MHz operation makes these FIFOs ideal for high-speed communication and controller applications.
Logic Block Diagram Pin Configurations
DI DI DI DI
(DI4)
MR
DI DI DI DI
NC
IR SI
0 1
2 3
SI
0 1 2
DIP
1 2 3
CY7C401
4
CY7C403
5 6 7 8
LCC
321 19 4 5
CY7C401 6
CY7C403
7 8
910111213
16 15 14 13 12 11 10
C401–2
20
V SO OR DO DO DO DO
9
MR
18 17 16 15 14
C401–3
NC OR DO DO DO
CC
0 1 2 3
0 1 2
(CY7C402) NC (CY7C404) OE
DI DI DI DI
C401–1
(CY7C401) NC (CY7C403) OE
OE
DO
0
DO
1
DO
2
DO
3
(DO4)
SO
OR
GND
DI DI DI
SI
IR
INPUT
CONTROL
LOGIC
0 1
DATAIN
2 3
MASTER
RESET
WRITEPOINTER
WRITE MULTIPLEXER
MEMORY
ARRAY
READ MULTIPLEXER
READ POINTER
OUTPUT ENABLE
DATAIN
OUTPUT
CONTROL
LOGIC
IR
SI DI DI DI DI DI
SI
0 1 2 3
1 2 3 4
0
5
1
6
2
7
3
8
4
9
321 19 4 5
CY7C402
6
CY7C404
7 8
910111213
DIP
CY7C402 CY7C404
LCC
20
18 17 16 15 14 13 12 11 10
C401–4
18 17 16 15 14
C401–5
Selectio n Guide
7C401/2–5 7C40X–10 7C40X–15 7C40X–25
Operating Frequency (MHz) 5 10 15 25 Maximum Operating
Current (mA)
Commercial 75 75 75 75 Military 90 90 90
OR DO DO DO DO
V SO OR DO DO DO DO DO MRGND
CC
0 1 2 3 4
0 1 2 3
Cypress Semiconductor Corporation 3901North First Street San Jose CA 95134 408-943- 2600
March 1986 – Revised April 1995
CY7C401/CY7C403
Maximum Ratings
(Above which the useful life may be impaired. For user guide­lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Output Current, into Outputs (LOW)..................... ....... 20 mA
Static Discharge Voltage ...........................................>2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current .....................................................>200 mA
Operating Range
CY7C402/CY7C404
Power Applied.............................................–55°C to +125°C
Supply Voltage to Ground Potential............... –0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State ............................................... –0.5V to +7.0V
DC Input Voltage............................................–3.0V to +7.0V
Range
Commercial 0°C to +70°C 5V ±10%
[1]
Military
Ambient
Temperature V
–55°C to +125°C 5V ±10%
Power Dissipation............................... ...........................1.0W
Electrical Characteristics Over the Operating Range (Unless Otherwise Noted)
[2]
7C40X–10, 15, 25
Parameter Descrip tion Test Conditions Min. Max. Unit
V V V V I V I
I I
IX
OZ
OS CC
OH OL IH IL
CD
[3]
Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 V Output LOW Voltage VCC = Min., IOL = 8.0 mA 0.4 V Input HIGH Voltage 2.0 6.0 V Input LOW Voltage –3.0 0.8 V Input Leakage Current GND VI V Input Diode Clamp Voltage Output Leakage Current GND V
Output Short Circuit Current
[3]
OUT
[4]
Output Disabled (CY7C403 and CY7C404) VCC = Max., V
Power Supply Current VCC = Max., I
CC
VCC, VCC = 5.5V
= GND –90 mA
OUT
= 0 mA Commercial 75 mA
OUT
–10 +10 µA
–50 +50 µA
Military 90 mA
CC
Capacitance
[5]
Parameter Description Test Conditions Max. Unit
C
IN
C
OUT
Notes:
1. T
is the “instant on” case temperature.
A
2. See the last page of this specification for Group A subgroup testing information.
3. The CMOS process does not provide a clamp diode. However, the FIFO is insensitive to –3V dc input levels and –5V undershoot pulses of less than 10 ns (measured at 50% output).
4. For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 30 seconds.
5. Tested initially and after any design or process changes that may affect these parameters.
Input Capacitance TA = 25°C, f = 1 MHz,
V
= 4.5V
Output Capacitance 7 pF
CC
5 pF
2
CY7C401/CY7C403 CY7C402/CY7C404
AC Test Loads and Waveforms
ALL INPUT PULSES
and 30-pF load
OL/IOH
90%
90%
10%
is tested with 5-pF load capacitance as
HZOE
10%
[7]
30 pF
R1 437
R2 272
5V
OUTPUT
INCLUDING JIG AND SCOPE
5V
OUTPUT
INCLUDING JIG AND SCOPE
(a) (b)
Equivalent to: THÉ VENIN EQUIVALENT
OUTPUT 1.73V
167
C401–8
Switching Characteristics Over the Operating Range
5 pF
R1 437
3.0V
R2 272
C401–6 C401–7
[2, 6]
GND
5ns 5ns
7C401–5
Test
Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Unit
f
O
t
PHSI
t
PLSI
t
SSI
t
HSI
t
DLIR
t
DHIR
t
PHSO
t
PLSO
t
DLOR
t
DHOR
t
SOR
t
HSO
t
BT
t
SIR
t
HIR
t
PIR
t
POR
t
PMR
t
DSI
t
DOR
t
DIR
t
LZMR
t
OOE
t
HZOE
Notes:
6. Test condition s assu me signa l tra nsit ion tim e of 5 ns or less, timin g refere nce levels o f 1.5V and output loading of the spe cifi ed I capacitance, as in part (a) of AC Test Loads and Waveforms.
7. Commercial/Military
8. I/fO > t
9. t
SSI
10. t
SIR
11. All data outputs will be at LOW level after reset goes HIGH until data is entered into the FIFO.
12. HIGH-Z transitions are referenced to the steady-state VOH –500 mV and VOL +500 mV levels on the output. t in part (b) of AC Test Loads and Waveforms.
Operating Frequency Note 8 5 10 15 25 MHz SI HIGH Time 20 20 20 11 ns SO LOW Time 45 30 25 20 ns Data Set-Up to SI Note 9 0 0 0 0 ns Data Hold from SI Note 9 60 40 30 20 ns Delay, SI HIGH to IR LOW 75 40 35 21/22 ns Delay, SI LOW to IR HIGH 75 45 40 28/30 ns SO HIGH Time 20 20 20 11 ns SO LOW Time 45 25 25 20 ns Delay, SO HIGH to OR LOW 75 40 35 19/21 ns Delay, SO LOW to OR HIGH 80 55 40 34/37 ns Data Set-Up to OR HIGH 0 0 0 0 ns Data Hold from SO LOW 5 5 5 5 ns Bubble-Through Time 200 10 95 10 65 10 50/60 ns Data Set-Up to IR Note 10 5 5 5 5 ns Data Hold from IR Note 10 30 30 30 20 ns Input Ready Pulse HIGH 20 20 20 15 ns Output Ready Pulse HIGH 20 20 20 15 ns MR Pulse Width 40 30 25 25 ns MR HIGH to SI HIGH 40 35 25 10 ns MR LOW to OR LOW 85 40 35 35 ns MR LOW to IR HIGH 85 40 35 35 ns MR LOW to Output LOW Note 11 50 40 35 25 ns Output Valid from OE LOW 35 30 20 ns Output High Z from OE HIGH Note 12 30 25 15 ns
+ t
PHSI
and t and t
, I/fO > t
DHIR
apply when memory is not full.
HSI
apply when memory is full, SI is high and minimum b ubble-t hr ough (tBT) conditions exist.
HIR
PHSO
+ t
DHOR
Conditions
7C402–5
7C40X–10 7 C40X–15 7C40X–25
3
CY7C401/CY7C403
Operational Description
Concept
Unlike traditional FIFOs, these devices are designed using a dual-port memory, read and write pointer, and control logic. The read and write pointers are incremented by the SO and SI respectively. The availability of an empty space to shift in data is indicated by the IR signal, while the presence of data at the output is indicated by the OR signal. The conventional concept of bubble-through is absent. Instead, the delay for input data to appear at the output is the time required to move a pointer and propagate an OR signal. The output enable (OE provides the capability to OR tie multiple FIFOs together on a common bus.
Resetting the FIFO
Upon power-up, the FIFO must be reset with a master reset (MR) signal. This causes the FIFO to enter an empty condition signified by the OR signal being LOW at the same time the IR signal is HIGH. In this condition, the data outputs (DO will be in a LOW state.
Shifting Data In
Data is shifted in on the rising edge of the SI signal. This loads input data into the first word location of the FIFO. On the falling edge of the SI signal, the write pointer is moved to the next word position and the IR signal goes HIGH, indicating the readiness to accept new data. If the FIFO is full, the IR will remain LOW until a word of data is shifted out.
Shifting Data Out
Data is shifted out of the FIFO on the falling edge of the SO signal. This causes the internal read pointer to be advanced to the next word location. If data is present, valid d ata will a ppear on the outputs and the OR signal will go HIGH. If data is not present, the OR signal will stay LOW indicating the FIFO is empty. Upon the rising edge of SO, the OR signal goes LOW. The data outputs of the FIFO should be sampled with edge-sensitive type D flip-f lops (or equivalent), using the SO signal as the clock input to the flip-flop.
Bubble-Through
Two bubble-through conditions exist. The first is when the de­vice is empty. After a word is shifted into an empty device, the data propagates to the output. After a delay, the OR flag goes HIGH, indicating valid data at the output.
The second bubble-through condition occurs when the device is full. Shifting data out creates an empty location th at propa­gates to the input. After a delay, the IR flag goes HIGH. If the SI signal is HIGH at this time, data on the input will be shifted in.
Possible Minimum Pulse Width Violation at the Boundary Conditions
If the handshaking signals IR and OR are not properly used to generate the SI and SO signals, it is possible to violate the minimum (effective) SI and SO positive pulse widths at the full and empty boundaries.
When this violation occurs, the operation of the FIFO is unpre­dictable. It must then be reset, and all data is lost.
) signal
– DOn)
0
CY7C402/CY7C404
Application of the 7C403–25/7C404–25 at 25 MHz
Application of the CY7C403 or CY7C404 Cypress CMOS FIFOs requires knowledge of characteristics that are not easily specified in a datasheet, but which are necessary for reliable operation under all conditions, so we will specify them here.
When an empty FIFO is filled with init ial information at maxi­mum “shift in” SI f requency, followed by immediate shifting out of the data also at maximum “shift out” SO frequency, the de­signer must be aware of a window of time which follows the initial rising edge of the OR signal, d uring which time the SO signal is not recognized. This condition exists only at high-speed operation where more than one SO may be gen­erated inside the prohibited window. This condition does not inhibit the operation of the FIFO at full-frequency operation, but rather delays the full 25-MHz operation until after the win­dow has passed.
There are several implementation techniques for managing the window so that all SO signals are recognized:
1. The first involves delaying SO operation such that it does not occur in the critical window. This can be accomplished by causing a fixed delay of 40 ns “initiated by the SI signal only when the FIFO is empty” to inhibit or gate the SO ac­tivity. However, this requires that the SO operation be at least temporarily synchronized with the input SI operation. In synchronous applications this may well be possible and a valid solution.
2. Another solution not uncommon in synchronous applica­tions is to only begin sh ifting data out of th e FIFO when it is more than half full. This is a common method of FIFO ap­plication, as earlier FIFOs could not be operated at maxi­mum frequency wh en near full or empty. Although Cypress FIFOs do not have this limitation, any system designed in this manner will not encounter the window condition de­scribed above.
3. The window may also be managed b y not allowing the fi rst SO sign al t o occu r until the window in question has passed. This can be accomplished by delaying the SO 40 ns from the rising edge of the initial OR signal. This however in­volves the requirement that this only occurs on the first oc­currence of data being loaded into the FIFO from an empty condition and therefore requires the knowledge of IR and SI conditions as well as SO.
4. Handshaking with the OR signal is a third method of avoid­ing the window in question. With this technique the rising edge of SO, or the fact that SO signal is HIGH, will cause the OR signal to go LOW. The SO signal is not taken LOW again, advancing the internal pointer to the next data, until the OR signal goes LOW. This ensures that the SO pulse that is initiated in the window will be automatically extended long enough to be recognized.
5. There remains the decision as to what signal will be used to latch the data from the output of the FIFO into the receiv­ing source. The leading edge of the SO signal is most ap­propriate because data is guaranteed to be stable prior to and after the SO leading edge for each FIFO. This is a solution for any number of FIFOs in parallel.
Any of the above solutions will ensure the correct operation of a Cypress FIFO at 25 MHz. The specific implemen tation is left to the designer and is dependent on the specific application needs.
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