Datasheet CY7C135, CY7C1342 Datasheet (CYPRESS)

p
CY7C135
CY7C1342
4K x 8 Dual-Port Static RAM and 4K x 8 Dual-Port
Features
True Dual-Ported memory cells which allow simulta-
neous reads of the same memory location
4K x 8 organization
0.65-micron CMOS for optimum speed/power
High-speed access: 15 ns
Low operating power: ICC = 160 mA (max.)
• Fully asynchronous operation
Automatic power-down
Semaphores included on the 7C1342 to permit software
handshaking between ports
Available in 52-pin PLCC
Logic Block Diagram
R/W
L
CE
L
OE
L
SRAM with Sema
hores
Functional Description
The CY7C135 and CY7C1342 are high-speed CMOS 4K x 8 dual-port static RAMs. The CY7C1342 includes semaphores that provide a means to allocate portions of the dual-port RAM or any shared resource. Two ports are provided permitting in dependent, asynchronous access for reads and writes to any location in memory. Application areas include interproces sor/multiprocessor designs, communications status buffering, and dual-port video/graphics memory.
Each port has independent control pins: chip enable (CE), read or write enable (R/ CY7C135 is suited for those systems that do not require on-chip arbitration or are intolerant of wait states. Therefore, the user must be aware that simultaneous access to a location is possible. Semaphores are offered on the CY7C1342 to as sist in arbitrating between ports. The semaphore logic is com­prised of eight shared latches. Only one side can control the latch (semaphore) at any time. Control of a semaphore in di cates that a shared resource is in use. An automatic pow­er-down feature is controlled independently on each port by a chip enable (
CE) pin or SEM pin (CY7C1342 only).
The CY7C135 and CY7C1342 are available in 52-pin PLCC.
W), and output enable (OE). The
R/W
R
CE
R
OE
R
-
-
-
-
I/O
7L
I/O
0L
A
11L
A
0L
(7C1342 only)
SEM
I/O
CONTROL
ADDRESS
DECODER
CE
L
OE
L
R/W
L
L
MEMORY
ARRAY
SEMAPHORE ARBITRATION (7C1342 only)
I/O
CONTROL
ADDRESS DECODER
CE
R
OE
R
R/W
R
(7C1342 only)
SEM
I/O
7R
I/O
0R
A
11R
A
0R
R
1342–1
Document #: 38-06038 Rev. *B Revised June 22, 2004
CY7C135
CY7C1342
Selection Guide
7C135–15
7C1342–15
Maximum Access Time (ns) 15 20 25 35 55 Maximum Operating
Commercial 220 190 180 160 160
Current (mA) Maximum St andby
Current for I
SB1
(mA)
Commercial 60 50 40 30 30
Pin Configurations
PLCC
Top View
L
0L
10L
11L
N/C
OE
A
A
A
A A A A A A A A
A I/O I/O I/O I/O
A A A A A A A A
A I/O I/O I/O I/O
7 6 5 4 3 2 52 51 50 49 48 47
1L
8
2L
9
3L
10
4L
11
5L
12
6L
13
7L
14
8L
15
9L
16
0L
17
1L
18
2L
19
3L
20
2122 23 24 25 26 27 28 29 30 31 32 33
4L5L6L
I/O
I/O
L
0L
OE
A
765432 525150494847
1L
8
2L
9
3L
10
4L
11
5L
12
6L
13
7L
14
8L
15
9L
16
0L
17
1L
18
2L
19
3L
20
2122 23 24 25 26 27 28 29 30 31 32 33
4L5L6L
I/O
I/O
A
I/O
I/O
10L
I/O
A
I/O
7C135
7L
NC
PLCC
Top View
L
11L
SEM
7C1342
7L
NC
GND
Pin Definitions
Left Port Right Port Description
A
0L–11L
CE
L
OE
L
R/W
L
SEM
L
(CY7C1342 only)
A
0R–11R
CE
R
OE
R
R/W
R
SEM
R
(CY7C1342 only)
Address Lines Chip Enable Output Enable Read/Write Enable Semaphore Enable. When asserted LOW, allows access to eight semaphores. The
three least significant bits of the address lines will determine which semaphore to write or read. The I/O by writing a 0 into the respective location.
pin is used when writing to a semaphore. Semaphores are requested
0
7C135–20
7C1342–20
L
R/W
1
GND
L
R/W
1
I/O
CE
I/O
R
LCER
CC
V
CE
R/W
0R1R2R3R4R5R6R
I/O
I/O
I/O
I/O
R
LCER
CC
V
R/W
0R1R2R3R4R5R6R
I/O
I/O
I/O
I/O
7C135–25
7C1342–25
10R
11R
N/C
A
A
OE
46
R
A
45
0R
A
44
1R
A
43
2R
A
42
3R
A
41
4R
A
40
5R
A
39
6R
A
38
7R
A
37
8R
A
36
9R
NC
35
I/O
34
7R
I/O
I/O
R
11R
SEM
A
I/O
I/O
1342–3
10R
A
OE
46
R
A
45
0R
A
44
1R
A
43
2R
A
42
3R
A
41
4R
A
40
5R
A
39
6R
A
38
7R
A
37
8R
A
36
9R
NC
35
I/O
34
7R
1342–4
7C135–35
7C1342–35
7C135–55
7C1342–55
Document #: 38-06038 Rev. *B Page 2 of 12
CY7C135
CY7C1342
Maximum Ratings
[1]
Static Discharge Voltage...........................................> 2001V
(per MIL-STD-883, Method 3015)
Storage Temperature ..................................–65°C to +150°C
Ambient Temperature with
Power Applied..............................................–55°C to +125°C
Supply Voltage to Ground Potential
(Pin 48 to Pin 24)............................................–0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State................................................–0.5V to +7.0V
DC Input Voltage
[2]
.........................................–3.0V to +7.0V
Electrical Characteristics Over the Operating Range
Latch-Up Current....................................................> 200 mA
Operating Range
Range
Commercial 0°C to +70°C 5V ± 10%
Industrial –40°C to +85°C 5V ± 10%
[4]
7C135–15 7C1342–1
Ambient
Temperature V
7C135–20 7C1342–207C135–25
5
7C1342–25
Max.Min.Max
Parameter Description Test Conditions Min.
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC
I
SB1
I
SB2
I
SB3
Ind. 30
Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 2.4 2.4 V Output LOW Voltage VCC = Min., IOL = 4.0 mA 0.4 0.4 0.4 V Input HIGH Volt age 2.2 2.2 2.2 V Input LOW Volt age 0.8 0.8 0.8 V Input Load Current GND VI V
CC
Output Leakage Current Outputs Disabled,
GND VO V
CC
Operating Current VCC = Max.,
I
= 0 mA
OUT
Standby Current (Both Ports TTL Levels)
Standby Current (One Port TTL Level)
Standby Current (Both Ports CMOS Levels)
CEL and CER VIH, f = f
CEL and CER VIH, f = f
MAX
MAX
[5]
[5]
Both Ports CE and CER V
– 0.2V ,
CC
VIN VCC – 0.2V or VIN 0.2V, f = 0
[5]
Com’l 220 190 180 mA
Ind. 190
Com’l 60 50 40 mA
Ind. 50
Com’l 130 120 110 mA
Ind. 120
Com’l 15 15 15 mA
–10 +10 –10 +10 –10 +10 µA –10 +10 –10 +10 –10 +10 µA
. Min.
CC
Max.Uni
t
I
SB4
Notes:
1. The Voltage on any input or I/O pin cannot exceed the power pin during power-up.
2. Pulse width < 20 ns.
3. TA is the “instant on” case temper ature.
4. See the last page of this specification for Group A subgroup testing information.
5. f
MAX
Standby Current (One Port CMOS Level)
= 1/tRC = All inputs cycling at f = 1/tRC (except output enable). f = 0 means no address o r control lines cha nge. This applies only to input s at CMOS level st andby I
One Port CEL or CER ≥ VCC – 0.2V , VIN ≥VCC – 0.2V or VIN ≤ 0.2V, Active Port Outputs, f =
[5]
f
MAX
Com’l 125 115 100 mA
Ind. 115
SB3
.
Document #: 38-06038 Rev. *B Page 3 of 12
CY7C135
CY7C1342
Electrical Characteristics Over the Operating Range
[4]
(continued)
7C135–35
7C1342–35
7C135–55
7C1342–55
Parameter Description Test Conditions Min. Max. Min. Max. Unit
V V V V I
IX
I
OZ
I
CC
I
SB1
I
SB2
I
SB3
I
SB4
OH OL IH IL
Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 2.4 V Output LOW Voltage VCC = Min., IOL = 4.0 mA 0.4 0.4 V
2.2 2.2 V Input LOW Volt age 0.8 0.8 V Input Load Current GND VI ≤ V
CC
Output Leakage Current Outputs Disabled, GND ≤ VO ≤ V Operating Current VCC = Max., I
VCC = Max., I
Standby Current
CEL and CER VIH, f = f
(Both Ports TTL Levels) Standby Current
CEL and CER VIH, f = f
(One Port TTL Level) Standby Current
(Both Ports CMOS Levels)
Both Ports CE and CER ≥ VCC – 0.2V , VIN ≥ VCC – 0.2V or VIN ≤ 0.2V , f = 0
Standby Current (One Port CMOS Level)
One Port CEL or CER ≥ VCC – 0.2V , VIN ≥ VCC – 0.2V or VIN ≤ 0.2V , Active Port Outputs, f = f
= 0 mA Com’l 160 160 mA
OUT
= 0 mA Ind. 180 180
OUT
[5]
MAX
MAX
MAX
[5]
[5]
[5]
CC
Com’l 30 30 mA
Ind. 40 40
Com’l 100 100 mA
Ind. 110 110
Com’l 15 15 mA
Ind. 30 30
Com’l 90 90 mA
Ind. 100 100
–10 +10 –10 +10 µA –10 +10 –10 +10 µA
Capacitance
[6]
Parameter Description Test Conditions Max. Unit
C C
IN OUT
Input Capacitanc e TA = 25°C, f = 1 MHz, Output Capacitance 10 pF
VCC = 5.0V
AC Test Loads and Waveforms
5V
R1= 893
OUTPUT
C=
30pF
(a) Normal Load (Load 1)
Note:
6. Tested initially and after any design or process changes that may affect these parameters.
R1= 347
1342–5 1342–6 1342–7
3.0V
GND
OUTPUT
C=
(b) Thévenin Equivalent (Load 1)
10%
3ns
R
= 250
TH
30pF
ALL INPUT PULSES
90%
V
TH
90%
=1.4V
10%
3
ns
10 pF
R
OUTPUT
C= 5pF
(c) Three-State Delay (Load 3)
1342–8
TH
= 250
V
X
Document #: 38-06038 Rev. *B Page 4 of 12
CY7C135
CY7C1342
Switching Characteristics Over the Operating Range
7C135–15
7C1342–15
[7, 8]
7C1342–20
7C135–20
7C135–25
7C1342–25
7C135–35
7C1342–35
7C135–55
7C1342–55
Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Unit
READ CYCLE
t
RC
t
AA
t
OHA
t
ACE
t
DOE
t
LZOE
t
HZOE
t
LZCE
t
HZCE
t
PU
t
PD
[9,10,11]
[9,10,11]
[9,10,11]
[9,10,11] [11] [11]
Read Cycle Time 15 20 25 35 55 ns Address to Data Valid 15 20 25 35 55 ns Output Hold From
3 3 3 3 3 ns
Address Change CE LOW to Data Valid 15 20 25 35 55 ns OE LOW to Data Valid 10 13 15 20 25 ns OE Low to Low Z 3 3 3 3 3 ns OE HIGH to High Z 10 13 15 20 25 ns CE LOW to Low Z 3 3 3 3 3 ns CE HIGH to High Z 10 13 15 20 25 ns CE LOW to Power Up 0 0 0 0 0 ns CE HIGH to Power Down 15 20 25 35 55 ns
WRITE CYCLE
t
WC
t
SCE
t
AW
t
HA
t
SA
t
PWE
t
SD
t
HD
[10,11]
t
HZWE
[10,11]
t
LZWE
[12]
t
WDD
[12]
t
DDD
SEMAPHORE TIMING
t
SOP
t
SWRD
t
SPS
Notes:
7. See the last page of this specification for Group A subgroup testing information.
8. T est condition s assume signal transit ion time of 3 ns or less, timing refer ence levels of 1.5V, input pulse levels of 0 to 3.0V, and out put loading of th e specified IOL/IOH and 30-pF load capacitance.
9. At any given temperature and voltage condition for any given device, t
10. Test conditions used are Load 3.
11. This parameter is guaranteed but not tested.
12. For information on port-to-port delay through RAM cells from writing port to reading port, refer to Read Timing with Port-to-Port Delay waveform.
13. Semaphore timing applies only to CY7C1342.
Write Cycle Time 15 20 25 35 55 ns CE LOW to Write End 12 15 20 30 50 ns Address Set-Up to Write End 12 15 20 30 50 ns Address Hold from Write End 2 2 2 2 2 ns Address Set-Up to Write Start 0 0 0 0 0 ns Write Pulse Width 12 15 20 25 50 ns Data Set-Up to Write End 10 13 15 15 25 ns Data Hold from Write End 0 0 0 0 0 ns R/W LOW to High Z 10 13 15 20 25 ns R/W HIGH to Low Z 3 3 3 3 3 ns Write Pulse to Data Delay 30 40 50 60 70 ns Write Data Valid to Read
25 30 30 35 40 ns
Data Valid
[13]
SEM Flag Update Pulse
10 10 10 15 15 ns
(OE or SEM) SEM Flag Write to Read Time 5 5 5 5 5 ns SEM Flag Contention Window 5 5 5 5 5 ns
is less than t
HZCE
LZCE
and t
HZOE
is less than t
LZOE
.
Document #: 38-06038 Rev. *B Page 5 of 12
Switching Waveforms
OE
CC
ISB
[14,15]
[14,16]
t
PU
R
Read Cycle No. 1
ADDRESS
DATA OUT
Read Cycle No. 2
[13]
SEM
or CE
DATA OUT
I
Read Timing with Port-to-Port
ADDRESS
t
OHA
t
LZCE
[17]
t
LZOE
Either Port Address Access
t
RC
t
AA
Either Port CE/OE Access
t
ACE
t
DOE
t
wc
MATCH
DATA VALID
DATA VALIDPREVIOUS DATA VALID
t
HZOE
CY7C135
CY7C1342
t
HZCE
t
PD
1342–9
1342–10
t
R/W
R
DATA
INR
ADDRESS
DATA
Notes:
14. R/W is HIGH for read cycle.
15. Device is continuously selected, CE = VIL and OE = VIL.
16. Address valid prior to or coincident with CE transition LOW.
17. CEL = CER =LOW; R/WL = HIGH
L
OUTL
MATCH
PWE
t
SD
VALID
t
WDD
t
DDD
t
HD
VALID
1342–11
Document #: 38-06038 Rev. *B Page 6 of 12
Switching Waveforms (continued)
CY7C135
CY7C1342
Write Cycle No. 1: OE Three-States Data I/Os (Either Port)
ADDRESS
SEM
[13]
t
SCE
ORCE
t
AW
R/W
t
SA
DATA
IN
OE
t
DATA
HZOE
OUT
HIGH IMPEDANCE
Write Cycle No. 2:R/W Three-States Data I/Os (Either Port)
[18,19,20]
t
WC
t
PWE
[19, 21]
t
SD
DATA VALID
t
HA
t
HD
t
LZOE
1342–12
t
WC
ADDRESS
t
[13]
SEM
CE
OR
t
R/W
DATA
IN
DATA
OUT
Notes:
18. The internal write time of the memory is defined by the overlap of CE or SEM LOW and R/W LOW . Both signals must be LOW to initiate a write and either signal can terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.
19. R/W must be HIGH during all a ddress transaction s.
20. If OE is LOW during a R/W controlled write cycle, the write pulse width must be the larger of t bus for the required t
.
t
PWE
21. Data I/O pins enter high-impedance when OE is held LOW during write.
. If OE is HIGH during a R/W controlled write cycle (as in this exampl e), this requirement does not apply and the write pulse can be as short as the specified
SD
SA
SCE
t
AW
t
PWE
t
SD
DATAVALID
t
HZWE
HIGH IMPEDANCE
or (t
PWE
+ tSD) to allow the I/O drivers to turn off and data to be placed on the
HZWE
t
HA
t
LZWE
t
HD
1342–13
Document #: 38-06038 Rev. *B Page 7 of 12
Switching Waveforms (continued)
Semaphore Read After Write Timing, Either Side (CY7C1342 only)
A0–A
SEM
I/O
R/W
2
0
t
VALID ADDRESS VALID ADDRESS
t
AW
t
t
SCE
HA
t
SD
DATAINVALID
t
SA
t
PWE
HD
[22]
t
SOP
CY7C135
CY7C1342
OUT
t
VALID
OHA
t
AA
t
ACE
DATA
t
SWRD
OE
WRITE CYCLE READ CYCLE
Timing Diagram of Semaphore Contention (CY7C1342 only)
A0L–A
R/W
SEM
A0R–A
R/W
SEM
2L
L
L
2R
R
R
MATCH
t
SPS
MATCH
t
SOP
[23,24,25]
t
DOE
1342–14
1342–15
Notes:
22. CE = HIGH for the duration of the above timing (both write and read cycle).
23. I/O0R = I/O0L = LOW (request semaphore); CER = CEL = HIGH.
24. Semaphores are reset (available to both ports) at cycle start.
25. If t
is violated, it is guaranteed that only one side will gain access to the semaphore.
SPS
Document #: 38-06038 Rev. *B Page 8 of 12
CY7C135
CY7C1342
Architecture
The CY7C135 consists of an array of 4K words of 8 bits each of dual-port RAM cells, I/O and address lines, and control sig nals (CE, OE, R/W). Two semaphore control pins exist for the CY7C1342 (
SEM
L/R
).
-
Functional Description
Write Operation
Data must be set up for a duration of tSD before the rising edge of R/
W in order to guarantee a valid write. Since there is no on-chip arbitration, the user must be sure that a specific loca tion will not be accessed simultaneously by both ports or erro­neous data could result. A write operation is controlled by ei­ther the OE pin (see Write Cycle No. 1 timing diagram) or the
W pin (see Write Cycle No. 2 timing diagram). Data can be
R/ written t falling edge of R/ summarized in
after the OE is deasserted or t
HZOE
W. Required inputs for write operations are
Table 1.
HZWE
after the
If a location is being written to by one port and the opposite port attempts to read the same location, a port-to-port flowthrough delay is met before the data is valid on the output. Data will be valid on the port wishing to read the location t after the data is presented on the writing port.
Read Operation
When reading the device, the user must assert both the OE and CE pins. Data will be available t OE are asserted. If the user of the CY7C1342 wishes to ac-
after CE or t
ACE
DOE
cess a semaphore, the SEM pin must be asserted instead of the
CE pin. Required inputs for read operations are summa-
rized in Table 1.
Semaphore Operation
The CY7C1342 provides eight semaphore latches which a re separate from the dual port memory locations. Semaphores are used to reserve resources which are shared between the two ports. The state of the semaphore indicates that a re source is in use. For example, if the left port wants to request a given resource, it sets a latch by writing a zero to a sema phore location. The left port then verifies its success in setting the latch by reading it. After writing to the semaphore, OE must be deasserted for t semaphore. The semaphore value will be available t
after the rising edge of the semaphore write. If the left port
t
DOE
was successful (reads a zero), it assumes control over the
before attempting to read the
SOP
shared resource, otherwise (reads a one) it assumes the right port has control and continues to poll the semaphore. Whe n the right side has relinquished control of the sema phore (by writing a one), the left side will succeed in gaining control of the semaphore. If the left side no longer requires the sema phore, a one is written to cancel its request.
Semaphores are accessed by asserting SEM LOW. The SEM pin functions as a chip enable for the semaphore latches. CE must remain HIGH during SEM LOW. A semaphore address.
OE and R/W are used in the same man-
represents the
0–2
ner as a normal memory access. When writing or reading a semaphore, the other address pins have no effect.
When writing to the semaphore, only I/O0 is used. If a 0 is written to the left port of an unused semaphore, a one will appear at the same semaphore address on the right port. That semaphore can now only be modified by the side showing a
DDD
after
SEM or
+
SWRD
-
-
-
-
zero (the left port in this case). If the left port now relinquishes control by writing a one to the semaphore, the semaphore will be set to one for both sides. However, if the right port had requested the semaphore (written a zero) while the left port had control, the right port would immediately own the sema phore. Table 2 shows sample semaphore operations.
When reading a semaphore, all eight data lines output the semaphore value. The read value is latched in an output reg ister to prevent the semaphore from changing state during a write from the other port. If both ports request a semaphore control by writing a 0 to a semaphore within t it is guaranteed that only one side will gain access to the sema
of each other ,
SPS
phore. Initialization of the semaphore is not automatic and must be
reset during initialization program at power-up. All sema phores on both sides should have a one written into them at initialization from both sides to assure that they will be free when needed.
Table 1. Non-Contending Read/Write
Inputs Outputs
CE R/W OE SEM
I/O0 – I/O
7
Operation
H X X H High Z Power-Down H H L L Data Out Read
Semaphore X X H X High Z I/O Lines Disabled H L X L Data In Write to Semaphore
L H L H Data Out Read L L X H Data In Write L X X L Illegal Condition
Table 2. Semaphore Operation Example
I/O
I/O
Function
Left
0-7
0-7
Right Status
No Action 1 1 Semaphore free Left port writes
semaphore Right port writes 0 to
semaphore Left port writes 1 to
semaphore
0 1 Left port obtains
semaphore
0 1 Right side is denied
access
1 0 Right port is granted
access to Sema
-
phore
Left port writes 0 to semaphore
Right port writes 1 to semaphore
Left port writes 1 to semaphore
Right port writes 0 to semaphore
Right port writes 1 to semaphore
Left port writes 0 to semaphore
Left port writes 1 to semaphore
1 0 No change. Left port
is denied access
0 1 Left port obtains
semaphore
1 1 No port accessing
semaphore address
1 0 Right port obtains
semaphore
1 1 No port accessing
semaphore
0 1 Left port obtains
semaphore
1 1 No port accessing
semaphore
-
-
-
-
Document #: 38-06038 Rev. *B Page 9 of 12
Typical DC and AC Characteristics
NORMALIZED SUPPLY CURRENT
OUTPUT SOURCE CURRENT
CY7C135
CY7C1342
NORMALIZED SUPPLY CURRENT vs. SUPPLY VOLTAGE
1.4 I
SB
SB
1.2
CC
1.0
0.8
0.6
0.4
NORMALIZED I, I
0.2
0.0
I
CC
4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V)
NORMALIZED ACCESS TIME vs. SUPPLY VOLTAGE
1.10 =25°C
T
AA
A
1.05
1.00
NORMALIZED t
0.95
4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE (V)
vs. AMBIENT TEMPERATURE
1.2 I
CC
1.0
CC SB
0.8
0.6
0.4
NORMALIZED I, I
6.0
0.2
0.6
–55 25 125
I
SB3
V
CC
V
IN
AMBIENT TEMPERATURE (°C)
NORMALIZED ACCESS TIME vs. AMBIENT TEMPERATURE
1.2
AA
1.1
1.0 V
NORMALIZED t
CC
0.9
0.8
–55 125
25
AMBIENT TEMPERATURE (°C)
=5.0V
= 5.0V
= 5.0V
vs. OUTPUT VOLTAGE
140 120 100
80 60 40
20
0
OUTPUT SOURCE CURRENT (mA)
0 1.0 2.0 3.0 5.0
OUTPUT VOLTAGE (V)
OUTPUT SINK CURRENT vs. OUTPUT VOLTAGE
100
90
80
70
V
60
OUTPUT SINK CURRENT (mA)
50
CC
T
A
0.0 1.0 2.0 3.0 OUTPUT VOLTAGE (V)
V
CC
T
A
=5.0V
= 25°C
=5.0V
=25°C
4.0
4.0
5.0
TYPICAL POWER-ON CURRENT vs. SUPPLY VOLTAGE
1.0
PC
0.75
0.50
NORMALIZED t
0.25
0.0 0 1.0 2.0 3.0 5.0
SUPPLY VOLTAGE (V)
4.0
TYPICAL ACCESS TIME CHANGE vs. OUTPUT LOADING
20.0
15.0
AA
10.0
DELTA t (ns)
5.0
V
T
CC
= 25°C
A
0
0 200 400 600 800
CAPACITANCE (pF)
=4.5V
1000
NORMALIZED I
1.25 V
T
CC
V
=5.0V
CC
=25°C
A
= 0.5V
IN
vs.CYCLE TIME
CC
1.0
0.75
NORMALIZED I
0.50
10 50
20 30
CYCLE FREQUENCY (MHz)
40
Document #: 38-06038 Rev. *B Page 10 of 12
CY7C135
CY7C1342
Ordering Information
4K x8 Dual-Port SRAM
Speed
(ns) Ordering Code
15 CY7C135–15JC J69 52-Lead Plastic Leaded Chip Carrier Commercial 20 CY7C135–20JC J69 52-Lead Plastic Leaded Chip Carrier Commercial 25 CY7C135–25JC J69 52-Lead Plastic Leaded Chip Carrier Commercial
CY7C135–25JI J69 52-Lead Plastic Leaded Chip Carrier Industrial
35 CY7C135–35JC J69 52-Lead Plastic Leaded Chip Carrier Commercial
CY7C135–35JI J69 52-Lead Plastic Leaded Chip Carrier Industrial
55 CY7C135–55JC J69 52-Lead Plastic Leaded Chip Carrier Commercial
CY7C135–55JI J69 52-Lead Plastic Leaded Chip Carrier Industrial
4K x8 Dual-Port SRAM with Semaphores
Speed
(ns) Ordering Code
15 CY7C1342–15JC J69 52-Lead Plastic Leaded Chip Carrier Commercial 20 CY7C1342–20JC J69 52-Lead Plastic Leaded Chip Carrier Commercial 25 CY7C1342–25JC J69 52-Lead Plastic Leaded Chip Carrier Commercial
CY7C1342–25JI J69 52-Lead Plastic Leaded Chip Carrier Industrial
35 CY7C1342–35JC J69 52-Lead Plastic Leaded Chip Carrier Commercial
CY7C1342–35JI J69 52-Lead Plastic Leaded Chip Carrier Industrial
55 CY7C1342–55JC J69 52-Lead Plastic Leaded Chip Carrier Commercial
CY7C1342–55JI J69 52-Lead Plastic Leaded Chip Carrier Industrial
Package
Name Package Type
Package
Type Package Type
Operating
Range
Operating
Range
Package Diagrams
52-Lead Plastic Leaded Chip Carrier J69
51-85004-*A
Document #: 38-06038 Rev. *B Page 11 of 12
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to ch an ge without notice. Cypress Semiconductor Corporation assu me s no r esp onsib i lity f or th e u se of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY7C135
CY7C1342
Document History Page
Document Title: CY7C135/CY7C1342 4K x 8 Dual Port Static RAM and 4K x 8 Dual Port Static RAM w/Semaphores Document Number: 38-06038
REV. ECN NO.
** 110181 10/21/01 SZV Change from Spec number: 38-00541 to 38-06038 *A 122288 12/27/02 RBI Power up requirements added to Maximum Ratings Information *B 236763 SEE ECN YDT Removed cross information from features section
Issue Date
Orig. of Change Description of Change
Document #: 38-06038 Rev. *B Page 12 of 12
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