CY7C107BN
CY7C1007BN
1M x 1 Static RAM
Features
•High speed
—t
= 15 ns
AA
• CMOS for optimum speed/power
• Automatic power-down when deselected
• TTL-compatible inputs and outputs
Functional Description
The CY7C107BN and CY7C1007BN are high-performance
CMOS static RAMs organized as 1,048,576 words by 1 bit.
Easy memory expansion is provided by an active LOW Chip
Enable (CE
automatic power-down feature that reduces power
consumption by more than 65% when deselected.
Writing to the devices is accomplished by taking Chip Enable
(CE
) and Write Enable (WE) inputs LOW. Data on the input pin
(D
IN
address pins (A
) and three-state drivers. These devices have an
) is written into the memory location specified on the
through A19).
0
Reading from the devices is accomplished by taking Chip
Enable (CE
) LOW while Write Enable (WE) remains HIGH.
Under these conditions, the contents of the memory location
specified by the address pins will appear on the data output
(D
) pin.
OUT
The output pin (D
when the device is deselected (CE
operation (CE
and WE LOW).
) is placed in a high-impedance state
OUT
HIGH) or during a write
The CY7C107BN is available in a standard 400-mil-wide SOJ;
the CY7C1007BN is available in a standard 300-mil-wide SOJ
LogicBlockDiagram Pin Configuration
SOJ
A
A
A
A
A
A
NC
A
A
A
A
D
OUT
WE
GND
10
11
12
13
14
15
16
17
18
19
Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
D
IN
INPUT BUFFER
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
512 x 2048
ARRA
ROW DECODER
COLUMN
DECODER
Y
D
OUT
SENSE AMPS
POWER
DOWN
CE
V
A
A
A
A
A
A
NC
A
A
A
A
D
CE
CC
9
8
7
6
5
4
3
2
1
0
IN
9
A
A10A11A
13
A12A14A16A
A17A18A
19
15
WE
Selection Guide
7C107BN-15
7C1007BN-15
Maximum Access Time (ns) 15
Maximum Operating Current (mA) 80
Maximum CMOS Standby Current I
Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600
Document #: 001-06426 Rev. ** Revised February 1, 2006
(mA) 2
SB2
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CY7C107BN
CY7C1007BN
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ..................................-65°C to +150°C
Ambient Temperature with
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current.....................................................>200 mA
Operating Range
Power Applied..............................................-55°C to +125°C
Supply Voltage on V
DC Voltage Applied to Outputs
in High Z State
[1]
DC Input Voltage
Relative to GND
CC
.................................... -0.5V to VCC + 0.5V
[1]
..................................-0.5V to VCC + 0.5V
[1]
.....-0.5V to +7.0V
Commercial 0°C to +70°C 5V ± 10%
Industrial -40°C to +85°C 5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description T est Conditions
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
OS
I
CC
I
SB1
I
SB2
Capacitance
Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 V
Output LOW Voltage VCC = Min., IOL = 8.0 mA 0.4 V
Input HIGH Voltage 2.2 V
Input LOW Voltage
Input Leakage Current GND < VI < V
[1]
CC
Output Leakage Current GND < VI < VCC,
Output Disabled
Output Short Circuit
[3]
Current
VCC Operating Supply
Current
Automatic CE Power-Down
Current— TTL Inputs
Automatic CE Power-Down
Current — CMOS Inputs
[4]
VCC = Max., V
VCC = Max., I
MAX
= 1/t
f = f
= GND -300 mA
OUT
= 0 mA,
OUT
RC
Max. VCC, CE > VIH, VIN >V
V
< VIL, f = f
IN
MAX
Max. VCC, CE > VCC – 0.3V,
V
> VCC – 0.3V or VIN < 0.3V, f = 0
IN
Range Ambient Temperature
7C107BN-15
7C1007BN-15
Min. Max. Unit
+ 0.3 V
CC
-0.3 0.8 V
-1 +1 mA
–5 +5 mA
80 mA
IH
or
20 mA
2mA
[2]
V
CC
Parameter Description Test Conditions Max. Unit
: Addresses Input Capacitance TA = 25 × C, f = 1 MHz,
C
IN
: Controls 10 pF
C
IN
C
OUT
Notes:
(min.) = –2.0V for pulse durations of less than 20 ns.
1. V
IL
is the “Instant On” case temperature.
2. T
A
3. Not more than 1 output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
4. Tested initially and after any design or process ch anges that may affect these parameters.
Output Capacitance 10 pF
V
CC
= 5.0V
7pF
Document #: 001-06426 Rev. ** Page 2 of 7
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CY7C107BN
CY7C1007BN
AC Test Loads and Waveforms
Ω
5V
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
Equivalentto: THÉ VENIN EQUIVALENT
Switching Characteristics
R1 480
R2
255Ω
(a) (b)
OUTPUT 1.73V
167Ω
5V
OUTPUT
5pF
INCLUDING
JIG AND
SCOPE
[5]
Over the Operating Range
Parameter Description Min. Max. Unit
READ CYCLE
t
RC
t
AA
t
OHA
t
ACE
t
LZCE
t
HZCE
t
PU
t
PD
WRITE CYCLE
t
WC
t
SCE
t
AW
t
HA
t
SA
t
PWE
t
SD
t
HD
t
LZWE
t
HZWE
Notes:
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
6. At any given temperature and voltage condition, t
7. t
8. The internal write time of the memory is defined by the overlap of CE
and 30-pF load capacitance.
I
OL/IOH
and t
HZCE
of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.
[8]
are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage .
HZWE
Read Cycle Time 15 ns
Address to Data Valid 15 ns
Data Hold from Address Change 3 ns
CE LOW to Data Valid 15 ns
CE LOW to Low Z
CE HIGH to High Z
CE LOW to Power-Up 0 ns
CE HIGH to Power-Down 15 ns
Write Cycle Time 15 ns
CE LOW to Write End 12 ns
Address Set-Up to Write End 12 ns
Address Hold from Write End 0 ns
Address Set-Up to Write Start 0 ns
WE Pulse Width 12 ns
Data Set-Up to Write End 8 ns
Data Hold from Write End 0 ns
WE HIGH to Low Z
WE LOW to High Z
HZCE
R1 480Ω
[6]
[6, 7]
[6]
[6, 7]
is less than t
ALL INPUT PULSES
90%
90%
10%
≤ 3
ns
R2
255Ω
3.0V
GND
≤ 3
10%
ns
7C107BN-15
7C1007BN-15
3ns
7ns
3ns
7ns
and t
LZCE
LOW and WE LOW. CE and WE must be LOW to initiate a write, a nd the t ransition of a ny
is less than t
HZWE
for any given device.
LZWE
Document #: 001-06426 Rev. ** Page 3 of 7
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