• Peak electromagnetic interference (EMI) reduction by
8–16 dB
• Fast time to market
• Cost reduction
• Available in 8-pin (150-mil) SOIC package
Block DiagramPin Configuration
300K
XIN/CLKIN
XOUT
VDD
VSS
1
8
7
2
REFERENCE
DIVIDER
MODULATION
CONTROL
INPUT
DECODER
36
PD#
S0
PD and
CP
VCO
COUNTER
DIVIDER
and
MUX
LF
VCO
4
SSCLK
5
REFCLK
XIN/CLKIN
Vss
SSCLK
1
2
CY25818
CY25819
3
S0
4
8 Pin SOIC
8-pin SOIC
8
XOUT
7
Vdd
6
PD#
5
REFCLK
Cypress Semiconductor Corporation•198 Champion Court•San Jose, CA 95134-1709•408-943-2600
Document #: 38-07362 Rev. *B Revised April 11, 2006
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Pin Description
PinNameDescription
1XIN/CLK Clock, Crystal, or Ceramic Resonator Input Pin.
2VssPower Supply Ground.
3S0Digital Spread% Control Pin. 3-Level input (H-M-L). Default = M.
4SSCLK
5REFCLK
6PD#Power-Down Control Pin. Default = H (Vdd).
7VddPositive Power Supply.
8XOUT
Modulated Spread S pectrum Output Clock. The output frequency is referenced to input frequency . Refer
to Table 2 for the amount of modulation (Spread%).
Unmodulated Reference Clock Output. The unmodulate d output frequency is the same as the input
frequency.
Clock, Crystal, or Ceramic Resonator Output Pin. Leave this pin unconnected if an external clock is used
at X
pin.
IN
CY25818/19
Overview
The Cypress CY25818/19 products are Spread Spectrum
Clock Generator (SSCG) ICs used f or the purpose of re ducing
EMI found in today’s high-speed digital electronic systems.
The devices use a Cypress proprietary phase-locked loop
(PLL) and Spread Spectrum Clock (SSC) technology to
synthesize and modulate the frequency of the input clock. By
frequency modulating the clock, the measured EMI at the
fundamental and harmonic frequencies is greatly reduced.
This reduction in radiated energy can significantly reduce the
cost of complying with regulatory agency requirements and
improve time to market without degrading system performance.
The input frequency range is 8–16 MHz for the CY25818 and
16–32 MHz for the CY25819. Both products accept external
clock, crystal, or ceramic resonator inputs.
The CY25818/19 provide separate modulated (SSCLK) and
unmodulated reference (REFCLK) clock outputs which are the
same frequency as the input clock frequency. Down spread
frequency modulation can be selected by the user, based on
three discrete values of Spread%. A separate power down
function is also provided.
The CY25818/19 products are available in an 8-pin SOIC
(150-mil) package with a commercial operating temperature
range of 0–70°C. Contact Cypress for availability of –40 to
+85°C industrial temperature range operation or TSSOP
package versions. Refer to the CY25568, CY25811,
CY25812, and CY25814 products for other functions such as
clock multiplication of 1×, 2×, or 4× to generate a wide range
of Spread Spectrum output clocks from 4 to 128 MHz.
Input Frequency Range and Selection
CY25818/19 input frequency range is 8–32 MHz. This range
is divided into two segments, as given in Table 1.
Table 1. Input and Output Frequency Selection
ProductInput/Output Frequency Range
CY258188–16 MHz
CY2581916–32 MHz
Spread% Selection
CY25818/19 SSCG products provide Down-Spread frequency
modulation. The amount of Spread% is selected by using
3-Level S0 digital input. Spread% values are given in Table 2.
Document #: 38-07362 Rev. *BPage 2 of 7
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CY25818/19
3-Level Digital Inputs
S0 digital input is designed to sense three logic levels desig nated as HIGH “1,” LOW “0,” and MIDDLE “M.” With this
3-Level digital input logic, the 3-Level logic is able to detect
three different logic levels .
The S0 pin includes an on-chip 20K (10K/10K) resistor divider.
No external application resistors are needed to implement
3-Level logic, as follows.
Logic Level “0”: 3-Level logic pin connected to GND.
Logic Level “M”: 3-Level logic pin left floating (no connection.)
Logic Level “1”: 3-Level logic pin connected to Vdd.
Figure 1 illustrates how to implement 3-Level Logic.
LOGIC
HIGH (H)
VDD
S0
to VDD
LOW (0)
S0
to V S S
LOGIC
LOGIC
MIDDLE (M)
S0
UNCONNECTED
VSS
Figure 1. 3-Level Logic
Modulation Rate
Spread Spectrum Clock Generators utilize frequency
modulation (FM) to distribute energy over a specific band of
frequencies. The maximum frequency of the clock (fmax) and
minimum frequency of the clock (fmin) determine this band of
frequencies. The time required to transition from fmin to fmax
and back to fmin is the period of the Modulation Rate, T mod.
The Modulation Rates of SSCG clocks are generally referred
to in terms of frequency, and fmod = 1/Tmod.
The input clock frequency, fin, and the internal divider
determine the Modulation Rate.
In the case of CY25818/19 devices, the (Spread Spectrum)
Modulation Rate, fmod, is given by the following formula:
fmod = f
where fmod is the Modulation Rate, fIN is the Input Frequency,
and DR is the Divider Ratio, as given in Table 3.
IN
/DR
Table 3. Modulation Rate Divider Ratios
ProductInput Frequency RangeDivider Ratio (DR)
CY258188–16 MHz256
CY2581916–32 MHz512
Maximum Ratings
[1, 2]
Supply Voltage (Vdd):..................................................+ 5.5V
Input Voltage Relative to Vdd:..............................Vdd + 0.3V
Input Voltage Relati ve to Vss:............ ...................Vss + 0.3V
Operating Temperature:...................................0°C to + 70°C
Storage Temperature:................................ –65°C to + 150°C
Table 4. DC Electrical Characteristics Vdd = 3.3V ±10%, TA = 0°C to +70°C and CL = 15 pF (unless otherwise noted)
ParameterDescriptionConditionsMin.Typ.Max.Unit
VddPower Supply Range2.973.33.63V
V
V
V
V
V
V
V
C
C
I
DD1
I
DD3
I
DD4
INH
INM
INL
OH1
OH2
OL1
OL2
IN1
IN2
Input HIGH VoltageS0 Input0.85 VddVddVddV
Input MIDDLE VoltageS0 Input0.40 Vdd0.50 Vdd0.60 VddV
Input LOW VoltageS0 Input0.00.00.15 VddV
Output HIGH VoltageIOH = 4 ma, SSCLK and REFCLK 2.4––V
Output HIGH VoltageIOH = 6 ma, SSCLK and REFCLK 2.0––V
Output LOW VoltageIOL = 4 ma, SSCLK Output––0.4V
Output LOW VoltageIOL = 10 ma, SSCLK Output––1.2V
Input CapacitanceXIN (Pin 1) and X
(Pin 8)6.07.59.0pF
OUT
Input CapacitanceAll Digital Inputs3.54.56.0pF
Power Supply CurrentFIN=8 MHz, no load–10.012.5mA
Power Supply CurrentFIN=32 MHz, no load–19.023.0mA
Power Supply CurrentPD# = Vss–150250mA
Document #: 38-07362 Rev. *BPage 3 of 7
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CY25818/19
Table 5. Timing Electrical Characteristics Vdd = 3.3V ±10%, TA = 0°C to +70°C and CL = 15 pF (unless otherwise noted)
ParameterDescriptionConditionsMin.Typ.Max.Unit
ICLKFR1Input Frequency RangeCY258188–16MHz
ICLKFR2Input Frequency RangeCY2581916–32MHz
trise1Clock Rise Time SSCLK and REFCLK, 0.4V to 2.4V2.03.04.0ns
tfall1Clock Fall Time SSCLK and REFCLK, 0.4V to 2.4V2.03 .04.0ns
CDCinInput Clock Duty CycleX
IN
CDCoutOutput Clock Duty Cycle SSCLK and REFCLK @ 1.5V455055%
CCJssCycle-to-Cycle JitterSSCLK; F
CCJrefCycle-to-Cycle JitterREFCLK; F
Characteristics Curves
The following curves demonstrate the characteristic behavior
of the CY25818/19 when tested over a number of environ mental and application specific parameters. These are typical
performance curves and are not meant to replace any
parameter specified in Table 4 and Table 5.
300
290
REFCLK CY25818
280
270
260
250
240
CCJ (ps)
230
SSCLK CY25818
220
210
200
8 121620242832
Frequency ( MHz )
Figure 2. CCJ (ps) vs. Frequency (MHz)
2.75
BW %
2.5
2.25
2
12 MHz
REFCLK CY25819
SSCLK CY25819
32 .0 MH z
IN
= F
IN
= 8–32 MHz250350ps
OUT
= F
= 8–32 MHz275375ps
OUT
20
19
CY25818
18
8 - 16 MH z
17
16
15
IDD(mA
14
13
12
11
10
8 1216 20242832
Figure 4. IDD (mA) vs. Frequency (MHz)
3.1
3
2.9
2.8
2.7
2.6
2.5
BW (%)
2.4
2.3
2.2
2.1
2
1.9
1.8
2.82.933.13.23 .33.43.53.63.7
205080%
CY25819
16 - 32 MH z
Frequency ( MHz )
CY25818@ 8.0 MHz
CY25819@ 32 M Hz
VDD (volts)
Figure 5. Bandwidth% vs. Vdd
1.75
-40 -25 -105203550658095110 125
Temp (C)
Figure 3. Bandwidth% vs. Temperature
Notes:
1. Single Power Supply: The voltage on any input or I/O pin cannot exceed the power pin during power-up.
2. Operation at any Absolute Maximum Rating is not implied.
Document #: 38-07362 Rev. *BPage 4 of 7
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SSCG Profiles
CY25818/19 SSCG products use a non-linear “optimized”
frequency profile as shown in Figure 6 and Figure 7. The use
of Cypress proprietary “optimized” frequency profile maintains
flat energy distribution over the fundamental and higher order
harmonics. This results in additional EMI reduction in
electronic systems.
CY25818SC8-pin SOICCommercial, 0° to 70°C
CY25818SCT8-pin SOIC–Tape and ReelCommercial, 0° to 70°C
CY25819SC8-pin SOICCommercial, 0° to 70°C
CY25819SCT8-pin SOIC–Tape and ReelCommercial, 0° to 70°C
Lead-free
CY25818SXC8-pin SOICCommercial, 0° to 70°C
CY25818SXCT8-pin SOIC–Tape and ReelCommercial, 0° to 70°C
CY25819SXC8-pin SOICCommercial, 0° to 70°C
CY25819SXCT8-pin SOIC–Tape and ReelCommercial, 0° to 70°C
Package Drawing and Dimensions
8-lead (150-Mil) SOIC S8
8Lead(150Mil)SOIC-S08
PIN1ID
14
CY25818/19
0.050[1.270]
BSC
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
58
0.189[4.800]
0.196[4.978]
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.004[0.102]
SEATING PLANE
0°~8°
1. DIMENSIONS IN INCHES[MM] MIN.
2. PIN1IDISOPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
3. REFERENCE JEDEC MS-012
4. PACKAGE WEIGHT 0.07gms
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
PART #
0.016[0.406]
0.035[0.889]
MAX.
0.010[0.254]
0.016[0.406]
X 45°
0.0075[0.190]
0.0098[0.249]
All product and company names mentioned in this document may be the trademarks of their respective holders.
**11246203/21/02OXCNew Data Sheet
*A12270112/28/02RBIAdded power up requirements to maximum rating information.
*B448097See ECNRGLAdd Lead-free devices
Issue
Date
Orig. of
ChangeDescription of Change
CY25818/19
Document #: 38-07362 Rev. *BPage 7 of 7
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