Cypress CapSense CY8C21x34/B Design Manual
CY8C21x34/B
CapSense® Design Guide
Doc. No 001-66271 Rev. *B
Cypress Semiconductor
198 Champion Court
San Jose, CA 95134-1709
Phone (USA): 1.800.541.4736
Phone (Intnl): 408.943.2600
http://www.cypress.com
Copyrights
Copyrights
© Cypress Semiconductor Corporation, 2010–2011. The information contained herein is subject to change without notice.
Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a
Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted
nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an
express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical
components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury
to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all
risk of such use and in doing so indemnifies Cypress against all charges.
Trademarks
PSoC Designer™, Programmable System-on-Chip™, PSoC Creator™, and SmartSense™ are trademarks and PSoC® and
CapSense® are registered trademarks of Cypress Semiconductor Corp. All other trademarks or registered trademarks
referenced herein are property of the respective corporations.
Source Code
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected
by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international
treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use,
modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of
creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or
representation of this Source Code except as specified above is prohibited without the express written permission of
Cypress.
Disclaimer
CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described
herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein.
Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure
may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against
all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
2 Document No. 001-66271 Rev. *B CY8C21x34/B CapSense® Design Guide
Contents
1. Introduction .................................................................................................................................................................... 7
1.1 Abstract ................................................................................................................................................................. 7
1.2 Cypress CapSense Documentation Ecosystem .................................................................................................... 7
1.3 CY8C21x34/B CapSense Plus Family Features.................................................................................................... 9
1.3.1 Advanced Touch Sensing Features .......................................................................................................... 9
1.3.2 Device Features........................................................................................................................................ 9
1.4 Document Conventions ....................................................................................................................................... 10
2. CapSense Technology ................................................................................................................................................ 11
2.1 CapSense Fundamentals .................................................................................................................................... 11
2.2 CapSense Methods in CY8C21x34/B .................................................................................................................. 13
2.2.1 CapSense with Sigma Delta Modulator (CSD) ....................................................................................... 13
2.2.2 CSD with ADC Functionality (CSDADC) ................................................................................................. 14
2.2.3 SmartSense™ Auto-tuning ..................................................................................................................... 14
3. CapSense Design Tools .............................................................................................................................................. 16
3.1 Overview of CapSense Design Tools .................................................................................................................. 16
3.1.1 PSoC Designer™ and User Modules ..................................................................................................... 16
3.1.2 Universal CapSense Controller Kit ......................................................................................................... 17
3.1.3 Universal CapSense Controller Module Board ....................................................................................... 18
3.1.4 CapSense Data Viewing Tools ............................................................................................................... 18
3.2 User Module Overview ........................................................................................................................................ 18
3.3 CapSense User Module Global Arrays ................................................................................................................ 18
3.3.1 Raw Count .............................................................................................................................................. 19
3.3.2 Baseline .................................................................................................................................................. 19
3.3.3 Difference Count (Signal) ....................................................................................................................... 19
3.3.4 Sensor State ........................................................................................................................................... 19
3.4 CSD User Module Configurations ........................................................................................................................ 20
3.4.1 CSD without Clock Prescaler .................................................................................................................. 20
3.4.2 CSD with Clock Prescaler ....................................................................................................................... 20
3.5 CSD User Module Parameters ............................................................................................................................ 20
3.6 CSD User Module High-Lev el Parame t ers .......................................................................................................... 21
3.6.1 Finger Threshold..................................................................................................................................... 21
3.6.2 Noise Threshold...................................................................................................................................... 21
3.6.3 Baseline Update Threshold .................................................................................................................... 21
3.6.4 Sensors Autoreset .................................................................................................................................. 21
3.6.5 Hysteresis ............................................................................................................................................... 21
CY8C21x34/B CapSense® Design Guide Document No. 001-66271 Rev. *B 3
Debounce ............................................................................................................................................... 22
3.6.6
3.6.7 Negative Noise Threshold ...................................................................................................................... 22
3.6.8 Low Baseline Reset ................................................................................................................................ 22
3.6.9 High Level Parameter Recommendations .............................................................................................. 22
3.7 CSD User Module Low-Lev el Parame ter s ........................................................................................................... 23
3.7.1 Scanning Speed ..................................................................................................................................... 23
3.7.2 Resolution ............................................................................................................................................... 23
3.7.3 Reference ............................................................................................................................................... 24
3.7.4 Ref Value ................................................................................................................................................ 24
3.7.5 Prescaler Period ..................................................................................................................................... 24
3.7.6 Shield Electrode Out ............................................................................................................................... 24
3.8 CSDADC User Module Configurations ................................................................................................................ 24
3.8.1 CSDADC with PRS16 Clock Source....................................................................................................... 24
3.8.2 CSDADC with PRS8 Clock Source......................................................................................................... 24
3.8.3 CSDADC with PWM8 Clock Source ....................................................................................................... 25
3.8.4 CSDADC with VC2 Clock Source ........................................................................................................... 25
3.9 CSDADC User Module Parameters ..................................................................................................................... 25
3.10 Low-Level Parameters ......................................................................................................................................... 25
3.10.1 Scanning Speed ..................................................................................................................................... 25
3.10.2 Resolution ............................................................................................................................................... 25
3.10.3 Reference ............................................................................................................................................... 26
3.10.4 Ref Value ................................................................................................................................................ 26
3.10.5 Prescaler Period ..................................................................................................................................... 26
3.10.6 Shield Electrode Out ............................................................................................................................... 26
3.10.7 ADC Enabled .......................................................................................................................................... 26
3.11 SmartSense User Module Parameters ................................................................................................................ 27
3.12 Low-Level Parameters ......................................................................................................................................... 27
3.12.1 Shield Electrode Out ............................................................................................................................... 27
3.12.2 Modulator Capacitor Pin ......................................................................................................................... 27
3.12.3 Feedback Resistor Pin ............................................................................................................................ 27
3.12.4 Threshold Setting Mode .......................................................................................................................... 27
3.12.5 Sensitivity Level ...................................................................................................................................... 27
3.12.6 Finger Threshold..................................................................................................................................... 28
4. CapSense Performance Tuning with User Modules ................................................................................................. 29
4.1 General Considerations ....................................................................................................................................... 29
4.1.1 Signal, Noise, and SNR .......................................................................................................................... 29
4.1.2 Charge/Discharge Rate .......................................................................................................................... 30
4.1.3 Importance of Baseline Update Threshold Verification ........................................................................... 31
4.2 Tuning the CSD and CSDADC User Modules ..................................................................................................... 32
4.2.1 Set Up Hardware and Software for Tuning ............................................................................................. 33
4.2.2 Select Prescaler...................................................................................................................................... 33
4.2.3 Set Raw Count Range with Rb ................................................................................................................ 33
4.2.4 Set High-Level Parameters ..................................................................................................................... 34
4.3 Configuring SmartSense User Module ................................................................................................................ 34
5. Design Considerations ............................................................................................................................................... 37
4 Document No. 001-66271 Rev. *B CY8C21x34/B CapSense
®
Design Guide
Overlay Selection ................................................................................................................................................ 37
5.1
5.2 ESD Protection .................................................................................................................................................... 38
5.2.1 Prevent ................................................................................................................................................... 38
5.2.2 Redirect .................................................................................................................................................. 38
5.2.3 Clamp ..................................................................................................................................................... 38
5.3 Electromagnetic Compatibility (EMC) Considerations ......................................................................................... 38
5.3.1 Radiated Interference ............................................................................................................................. 38
5.3.2 Radiated Emissions ................................................................................................................................ 39
5.3.3 Conducted Immunity and Emissions ....................................................................................................... 39
5.4 Software Filtering ................................................................................................................................................. 39
5.5 Power Consumption ............................................................................................................................................ 40
5.5.1 System Design Recommendations ......................................................................................................... 40
5.5.2 Sleep-Scan Method ................................................................................................................................ 40
5.5.3 Response Time versus Power Consumption .......................................................................................... 41
5.5.4 Measuring Average Power Consumption ............................................................................................... 41
5.6 Pin Assignments .................................................................................................................................................. 42
5.7 PCB Layout Guidelines ....................................................................................................................................... 42
6. Water Tolerance ........................................................................................................................................................... 43
6.1 Shield Electrode and Guard Sensor .................................................................................................................... 43
6.1.1 Shield ...................................................................................................................................................... 43
6.1.2 Guard Sensor ......................................................................................................................................... 46
6.2 Design Recommendations .................................................................................................................................. 48
7. Proximity Sensing ....................................................................................................................................................... 49
7.1 Types of Proximity Sensors ................................................................................................................................. 49
7.1.1 Button ..................................................................................................................................................... 49
7.1.2 Wire ........................................................................................................................................................ 49
7.1.3 PCB Trace .............................................................................................................................................. 49
7.1.4 Sensor Ganging ...................................................................................................................................... 49
7.2 Design Recommendations .................................................................................................................................. 50
8. Low Power Design Considerations ............................................................................................................................ 51
8.1 Additional Power Saving Techniques .................................................................................................................. 51
8.1.1 Set Drive Modes to Analog HI-Z ............................................................................................................. 51
8.1.2 Putting it All Together ............................................................................................................................. 52
8.1.3 Sleep Mode Complications ..................................................................................................................... 52
8.1.4 Pending Interrupts .................................................................................................................................. 52
8.1.5 Global Interrupt Enable ........................................................................................................................... 52
8.2 Post Wakeup Execution Sequence ..................................................................................................................... 53
8.2.1 PLL Mode Enabled ................................................................................................................................. 53
8.2.2 Execution of Global Interrupt Enable ...................................................................................................... 53
8.2.3 I2C Slave with Sleep Mode ..................................................................................................................... 53
8.2.4 Sleep Timer ............................................................................................................................................ 53
9. Resources .................................................................................................................................................................... 55
CY8C21x34/B CapSense® Design Guide Document No. 001-66271 Rev. *B 5
Website ............................................................................................................................................................... 55
9.1
9.2 Datasheet ............................................................................................................................................................ 55
9.3 Technical Reference Manual ............................................................................................................................... 55
9.4 Development Kits ................................................................................................................................................ 55
9.4.1 Universal CapSense Controller Kit ......................................................................................................... 55
9.4.2 Universal CapSense Module Boards ...................................................................................................... 55
9.4.3 In-Circuit Emulation (ICE) Kit .................................................................................................................. 56
9.5 PSoC Programmer .............................................................................................................................................. 56
9.6 MultiChart ............................................................................................................................................................ 56
9.7 PSoC Designer .................................................................................................................................................... 56
9.8 Code Examples ................................................................................................................................................... 56
9.9 Design Support .................................................................................................................................................... 57
9.10 Document Revision History ................................................................................................................................. 57
6 Document No. 001-66271 Rev. *B CY8C21x34/B CapSense
®
Design Guide
1. Introduction
1.1 Abstract
This document gives design guidance for using capacitive touch sensing (CapSense®) functionality with the
CY8C21x34/B family of CapSense Plus Controllers. The following topics are covered in thi s guide:
Features of the CY8C21x34/B family of CapSense Plus Controllers
CapSense principl es of oper ati on
Introduction to CapSense design tools
In depth guide to tuning the CapSense touch sensing system for optimal performance
Advanced features such as water tolerance and proximity detection
Electrical and mechanical system design consid erations
Additional resources and support for designing CapSense into your system
1.2 Cypress CapSense Documentation Ecosystem
Figure 1-1 and Table 1-1 summarize the Cypress CapSense documentation ecosystem. These resources allow
implementers to quickly access the information needed to successfully complete a CapSense product design.
Figure 1-1 shows the typical flow of a product design cycle with capacitive sensing; the information in this guide is
most pertinent to the topics highlighted in green. Table 1-1 includes links to the supporting documents for each of the
numbered tasks in Figure 1-1.
CY8C21x34/B CapSense® Design Guide Document No. 001-66271 Rev. *B 7
2. CapSense device selection based
on needed functionality
3. Mechanical
Design
4. Schematic
capture and
PCB layout
1. Specify system requirements and
characteristics
5. PSoC
Designer
project
creation
Preproduction build (prototype)
6. Firmware
development
7. CapSense
configuration
and tuning
8. Test and evaluate system functionality and
CapSense performance
Design for CapSense
Performance
satisfactory
Production
Yes
No
= Topics covered in this document
Figure 1-1. Typical CapSense Product Design Flow
Numbered Design Task of
Figure 1-1
1 Getting Started with CapSense
2
3
4
5 PSoC Designer User Guides
6
7
8
Table 1-1. Cypress Documents Supporting Numbered Design Tasks of Figure 1-1
Supporting Cypress CapSense Documentation
Getting Started with CapSense
CY8C21x34/B CapSense Device Datasheets
Getting Started with CapSense
PSoC Family Specific CapSense
CapSense Application Notes
Getting Started with CapSense
PSoC Family Specific CapSense
CapSense Application Notes
CapSense Application Notes
CapSense Code Examples
PSoC Family Specific Technical Reference Manual (for CY8C21x34/B)
PSoC Family Specific CapSense Design Guide (this document)
PSoC Family Specific CapSense User Module Datasheets (CSD, CSDADC, and SmartSense)
PSoC Family Specific Technical Reference Manual (for CY8C21x34/B)
PSoC Family Specific CapSense Design Guide (this document)
CapSense Code Examples
Design Guide (this document)
Design Guide (this document)
8 Document No. 001-66271 Rev. *B CY8C21x34/B CapSense
®
Design Guide
1.3 CY8C21x34/B CapSense Plus Family Features
Cypress’s CY8C21x34/B is a low-power, high-perfor ma nce, progr a mm able CapSense controller family that features:
1.3.1 Advanced Touch Sensing Features
Programmable capacitive sensing elements
Supports a combination of CapSense buttons, sliders, and proximity sensors with CSD and CSDADC
capacitive sensing technology
SmartSense™ Auto-tuning (CY8C21x34B)
Contains an integrated API to implement buttons and sliders
Supports up to 24 capacitive buttons and 4 sliders
Supports proximity sensing up to 5 cm (with on-board PCB trace)
Water-tolerant performance with shield electrode
1.3.2 Device Features
High-performance, low-power M8C Harvard-architec tur e pro ces sor
M8C processor speeds up to 24 MHz
Flexible on-chip memory
Up to 8 KB of flash and 512 B of SRAM
Emulated EEPROM supported
Precision, progra mma ble cloc king
Internal main oscillator (IMO): 24/48 MHz ± 2.5%
Internal low-speed oscillator (ILO) at 32 kHz for watchdog and sleep
Enhanced general-purpose input/output (GPIO) features
Up to 28 general-purpose I/Os (GPIOs) with programmable pin configuration
25-mA sink current on all GPIOs
Internal resistive pull-up, HI-Z, open-drain, and strong drive modes on all GPIOs
Peripheral features
Counter, timer, PWM, Pulse Width Discriminator (PWD), and hardware 7-segment drive
2
I
C communication with Master, Slave, and Multi-Master configurations
SPI, UART, IRDA, and one-wire communication protocols
Operating Conditions
Operating Voltage: 2.4 V to 5.25 V with operation down to 1.0 V by using on-chip switch mode pump
Temperature Range: –40
Packaging
16-pin SOIC (150-MIL) to 32-pin QFN (5 x 5 mm)
AEC qualified automotive grade parts – CY8C21334 and CY8C21534
o
C to +85 oC
CY8C21x34/B CapSense® Design Guide Document No. 001-66271 Rev. *B 9
1.4 Document Conventions
Convention Usage
Courier New
Italics
[Bracketed, Bold]
File > Open
Bold
Times New Roman
Text in gray boxes Describes Cautions or unique functionality of the product.
Displays file locations, user entered text, and source code:
C:\ ...cd\icc\
Displays file names and reference documentation:
Read about the sourcefile.hex file in the PSoC Designer User Guide.
Displays keyboard commands in procedures:
[Enter] or [Ctrl] [C]
Represents menu paths:
File > Open > New Project
Displays commands, menu paths, and icon names in procedures:
Click the File icon and then click Open.
Displays an equation:
2 + 2 = 4
10 Document No. 001-66271 Rev. *B CY8C21x34/B CapSense
®
Design Guide
2. CapSense Technology
CY8C21x34/B Rb
Cmod
Cx,n
Cx,2
Cx,1
Sensor Equivalent
Capacitors
P1[1] or P1[5]
P0[1] or P0[3]
2.1 CapSense Fundamentals
CapSense is a touch-sensing technology that works by measuring the capacitance of each I/O pin on the CapSense
controller that has been designated as a sensor. As shown in Figure 2-1, the total capacitance on each of the sensor
pins can be modeled as equivalent lumped capacitors with values of C
Circuitry internal to the CY8C21x34/B device converts the magnitude of each C
post processing. The other components, namely Rb and C
circuitry.
Figure 2-1. CapSense Implementation in a CY8C21x34/B PSoC Device
, are used by the CapSense controller’s internal
MOD
through C
X,1
X
for a design with n sensors.
X,n
into a digital code that is stored for
As shown in Figure 2-2, each sensor I/O pin is connected to a sensor pad by traces, vias, or both as necessary. The
overlay is a nonconductive cover over the sensor pad that constitutes the product’s touch interface. When a f inger
comes into contact with the overlay, the conductivity and mass of the body effectively introduces a grounded
conductive plane parallel to the sensor pad. This is represented in Figure 2-2. This arrangement constitutes a pa r all e l
plate capacitor whose capacitance is given by Equation 1.
.
CY8C21x34/B CapSense® Design Guide Document No. 001-66271 Rev. *B 11
D
A
C
r
F
εε
0
=
PX
CC =
FPX
CCC +=
Figure 2-2. Cross Section of Typical CapSense PCB with the Sensor Being Activated by a Finger
Equation 1
Where:
CF = The capacitance affected by a finger in contact with the overlay over a sensor
ε
= Free space permittivity
0
= Dielectric constant (relative permittivity) of overlay
ε
r
A = Area of finger and sensor pad overlap
D = Overlay thickness
In addition to the parallel plate capacitance, a finger in contact with the overlay causes electric field fringing between
itself and other conductors in the immediate vicinity. The effect of these fringing fields is typically minor compared to
that of the parallel plate capacitor and can usually be ignored.
Even without a finger touching the overlay, the sensor I/O pin has some parasitic capacitance (C
). CP results f rom
P
the combination of the CapSense controller internal parasitics and electric field coupling between the sensor pad,
traces, and vias, and other conductors in the system such as ground plane, other traces, any metal in the product’s
chassis or enclosure, and so on. The CapSense controller measures the total capacitance (C
) connected to a
X
sensor pin.
When a finger is not touching a sensor:
Equation 2
When a finger is touching the sensor:
Equation 3
In general CP is an order of magnitude greater than CF. CP usually ranges from 6 pF to 15 pF, but in extreme cases
can be as high as 50 pF. CF usually ranges from 0.1 pF to 0.4 pF. The magnitude of C
is of critical importance when
P
tuning a CapSense system and will be discussed in CapSense Performance Tuning with User Modules.
12 Document No. 001-66271 Rev. *B CY8C21x34/B CapSense
®
Design Guide
Cx
Vdd
i
sensor
Sigma-Delta
Converter
Precharge
Clock
Cmod
Rb
High-Z
input
Sw1
Sw2
CY8C21x34/B
Gnd
i
bleed
= External Connection
AMUX Bus
Vref
Rbus
R
inline
2.2 CapSense Methods in CY8C21x34/B
CY8C21x34/B devices support several CapSense methods for converting sensor capacitance (CX) into a digi t al co de.
These are CapSense Sigma Delta (CSD), CSD with ADC (CSDADC), and SmartSense. These methods are
implemented in the form of PSoC Designer User Modules and are described in Section 3 of this design guide.
2.2.1 CapSense with Sigma Delta Modulator (CSD)
The CapSense Sigma-Delta (CSD) method in CY8C21x34/B devices incorporates CX into a switched-capacitor circuit
as shown in Figure 2-3. The sensor (C
underlapped switches Sw1 and Sw2, respectively. Sw1 and Sw2 are driven by a Precharge clock to generate a
current (I
) into the AMUX bus. The magnitude of I
SENSOR
Sigma-Delta converter samples AMUX bus voltage and generates a modulating bit stream that controls the constant
current source (I
sensor bleeds off the charge I
), which charges AMUX such that the average AMUX bus voltage is maintained at V
DAC
SENSOR
low-pass filter that attenuates Precharge switching transients at the Sigma-Delta converter input.
) is alternately connected to VDD and the Analog MUX (AMUX) bus by the
X
is directly proportional to the magnitude of CX. The
SENSOR
from the modulating capacitor (C
MOD
). C
in combination with Rbus forms a
MOD
Figure 2-3. CSD Block Diagram
REF
. The
In maintaining the average AMUX voltage at a steady state value (V
average bleed current (I
BLEED
) to I
by controlling the bit stream duty cycle. The Sigma-Delta converter stores
SENSOR
), the Sigma-Delta converter matches the
REF
the bit stream over the duration of a sensor scan and the accumulated result is a digital output value, known as raw
counts, that is directly proportional to C
state. Figure 2-4 plots the CSD raw counts from a number of consecutive scans during which the sensor is touched
and then released by a finger. As explained in CapSense Fundamentals, the fing er touch caus es C
which in turn causes raw counts to increase proportionally. By comparing the shift in steady state raw count level
C
F,
. This raw count is interpreted by high-level algorithms to resolve sensor
x
to increase by
x
to a predetermined threshold, the high-level algorithms can determine whether the sensor is in an On (Touch) or Off
(No Touch) state.
CY8C21x34/B CapSense® Design Guide Document No. 001-66271 Rev. *B 13
Figure 2-4. CSD Raw Counts during a Finger Touch
2.2.2 CSD with ADC Functionality (CSDADC)
The CSDADC CapSense method functions in an identical manner as CSD except that it is augmented with the ADC
functionality in addition to capacitance measurement.
2.2.2.1 ADC Features
Absolute and ratiometric ADC input modes with run-time mode switching, which allows you to easily scan
different sensor types
Single-slope ADC for absolute voltage input mode
Built-in calibration mechanism for the single-slope ADC
Integrating incremental ADC for ratiometric input mode
2.2.3 SmartSense™ Auto-tuning
Tuning the touch-sensing user interface is a critical step in ensuring proper system operation and a pleasant user
experience. The typical design flow entails tuning the sensor interface in the initial design phase, during system
integration, and finally production fine-tuning before the production ramp. Tuning is an iterative process and can be
time consuming. SmartSense Auto-tuning was developed to simplify the user interface development cycle. It is easy
to use and significantly reduces the design cycle time by eliminating the tuning process throughout the entire product
development cycle, from prototype to mass production. SmartSense tunes each CapSense sensor automatically at
power up and then monitors and maintains optimum sensor performance during run time. This technology adapts for
manufacturing variation in PCBs, overlays, and noise generators such as LCD inverters, AC line noise, and switchmode power supplies, and automatically tunes them out. SmartSense Auto-tuning requires between 2.1 KB -3.7 KB
of flash depending on configuration and 29B of RAM per sensor.
2.2.3.1 Process Variation
The SmartSense User Module (UM) for the CY8C21x34B is designed to work with sensor parasitic capacitance in the
range of 5 pF to 45 pF (typical sensor CP values are in the range of 10 pF to 20 pF). The sensitivity parameter for
each sensor is set automatically, based on the characteristics of that particular sensor. This improves the yield in
mass production, as consistent response is maintained from every sensor regardless of C
within the specified range of 5 to 41 pF. Parasitic capacitance of the individual sensors can vary due to PCB layout,
PCB manufacturing process variation, or with vendor-to-vendor PCB variation within a multisourced supply chain.
The sensitivity of a sensor depends on its parasitic capacitance; higher C
result in decreased finger touch signal amplitude. In some cases, the change in C
resulting in less than optimum sensor performance (either too sensitive or not sensitive enough) or, wor st case, a
nonoperational sensor. In either situation, you must retune the system, and in some cases requalify the UI
subsystem. SmartSense Auto-tuning solves these issues.
values decrease the sensor sensitivity and
P
variation between sensors
P
value detunes the system,
P
14 Document No. 001-66271 Rev. *B CY8C21x34/B CapSense
®
Design Guide
Feasibility
Study
Schematics
Design
PCB Layout
Design
Mechanical Design
Review
System
Integration
Re-tuning for any
changes
Tuning process
Production Fine
Tuning
Design
Validation
Production
Typical capacitive user interface Design Cycle
Firmware
Development
Feasibility
Study
Schematics
Design
PCB Layout
Design
Mechanical Design
Review
System
Integration
Design
Validation
Production
SmartSense based capacitive user interface Design Cycle
Firmware
Development
SmartSense Auto-tuning makes platform designs possible. Imagine the capacitive touch sensing multimedia keys in a
laptop computer; the spacing between the buttons depends on the size of the laptop and keyboard layout. In this
example, the wide-screen machine has larger spaces between the buttons than a standard-screen model. More
space between buttons means increased trace length between the sensor and the CapSense controller, which leads
to higher parasitic capacitance of the sensor. This means that the parasitic capacitance of the CapSense buttons can
be different in different models of the same platform design. Though the functionality of these buttons is the same for
all of the laptop models, the sensors must be tuned for each model. SmartSense enables you to do platform designs
using the recommended best practices shown in the PCB Layout in Getting Started with CapSense, knowing the
tuning will be done efficiently and automatically.
Figure 2-5. Design of Laptop Multimedia Keys for a 21-inchModel
Figure 2-6. Design of Laptop Multimedia Keys for a 15-inchModel with Identical Functionality and Button Size
2.2.3.2 Reduced Design Cycle Time
Usually the most time-consuming task for a capacitive sensor interface design is firmware development and sensor
tuning. With a typical touch-sensing controller, the sensor must be retuned when the same design is ported to
different models or when there are changes in the mechanical dimensions of the PCB or the sensor PCB layout. A
design with SmartSense solves these challenges because it needs less firmware development effort, no tuning, and
no retuning. This makes a typical design cycle much faster. Figure 2-7 compares the design cycles of a t ypi c al t ouc h sensing controller and a SmartSense-based design.
Figure 2-7. Typical Capacitive Inter fa ce Design Cycle Comparison
CY8C21x34/B CapSense® Design Guide Document No. 001-66271 Rev. *B 15
3. CapSense Design Tools
3.1 Overview of CapSense Design Tools
Cypress offers a full line of hardware and software tools for developing your CapSense capacitive touch-sense
application. A basic development system for the CY8C21x34/B family includes the components discussed in this
chapter. See Resources for ordering information.
3.1.1 PSoC Designer™ and User Modules
Cypress’s exclusive integrated design environment, PSoC Designer, allows you to configure analog and digital
blocks, develop firmware, tune, and debug your design. Applications are developed in a drag-and-drop design
environment using a library of user modules. User modules are configured either through the Device Editor GUI or by
writing into specific registers with firmware. PSoC Designer comes with a built-in C compiler and an embedded
programmer. A pro compiler is available for complex designs.
CSD, CSDADC, and SmartSense User Modules implement capacitive touch sensors using switched-capacitor
circuitry, an analog multiplexer, a comparator, digital counting functions, and high-level software routines (APIs). User
modules for other analog and digital peripherals are available to implement additional functionality such as I
TX8, Timers, and PWMs.
Figure 3-1. PSoC Designer Device Editor
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C, SPI,
3.1.1.1 Gett ing Started with CapSense User Modules
To create a new CY8C21x34/B project in PSoC Designer:
1. Create a new CY8C21x34/B PSoC Designer proje ct.
2. Select and place any user modules requiring dedicated pins (such as I
3. Select and place the CSD, CSDADC, or SmartSense User Module.
4. Right-click the user module to access the User Module wizard.
5. Set button sensor count, slider configuration, pin assignments, and associations.
6. Set pins and global user mod u le parame ter s .
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C or LCD) and assign ports and pins.
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Design Guide
DC Supply
Jack
5-V Voltage
Regulator IC
SPI / I2C
Expansion Header
ISSP Header
LEDs D1 and D2
Adjustable
Voltage
Regulator IC
CapSense
Controller
CY8C21001
Jumper for
XRES Selection
CapSense Module
Connector
ICE Cube
Connector
Jumper to Select
Power Option
9-V Battery
Terminal
7. Generate the application and switch to Application Editor.
8. Adapt sample code from U ser Module Datasheet: (CY8C21x34) to implement buttons or sliders.
3.1.2 Universal CapSense Controller Kit
The Universal CY3280-BK1 CapSense Controller Kit features predefined control circuitry and plug-in hardware to
make prototyping and debugging easy. Programming and I2C-to-USB Bridge hardware are included for tuning and
data acquisition.
Figure 3-2. CY3280-21x34 CapSense Controller Kit
CY8C21x34/B CapSense® Design Guide Document No. 001-66271 Rev. *B 17
3.1.3 Universal CapSense Controller Module Board
Cypress’s module boards feature a variety of sensors, LEDs, and interfaces to meet your application’s needs.
CY3280-BSM Simple Butto n Module
CY3280-BMM Matrix Button Module
CY3280-SLM Linear Slider Module
CY3280-SRM Radial Slider Module
CY3280-BBM Universal CapSense Prototyping Module
3.1.4 CapSense Data Viewing Tools
Many times during the CapSens e design process, you will want to monitor CapSense data (raw counts, baseline,
difference counts, and so on) for tuning and debugging purposes. There are two CapSense Data Viewing Tools,
MultiChart, and Bridge Control Panel. These tools are explained in more detail in the application note
AN2397 – CapSense Data Viewing Tools.
3.2 User Module Overview
Figure 3-3. User Module Block Diagram
User modules contain an entire CapSense system from physical sensing to data processing. The behavior of the user
module is defined using several parameters. These parameters affect different parts of the sensing system and can
be separated into low-level and high-level parameters that communicate with one another using global arrays.
Low-level parameters, such as the speed and resolutions for scanning sensors, define the behavior of the sensing
method at the physical layer, and relate to the conversion from capacitance to raw count. Low-level parameters are
unique to each type of sensing method and are described in CSDADC User Module Configurations, CSDADC Use r
Module Parameters, and SmartSense User Module Parameters.
High-level parameters, such as debounce counts and noise thresholds, define how the raw counts are processed to
produce information such as the sensor ON/OFF state and the estimated finger position on a slider. These
parameters are the same for all sensing methods and are described in CSD User Module High-Level Parameters.
3.3 CapSens e Us e r Module Global Arrays
Before learning CapSense User Module parameters, you must be familiar with certain global arrays used by the
CapSense system. These arrays should not be altered manually, but may be inspected for debugging purposes.
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Design Guide
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