Cyan Z22, Z33, Z77, Z Series, L-AMP Engineering And Planning Manual

CYAN

Z-Series

Engineering and Planning Guide

Release 5.0 Cyan, Inc. 2013

Cyan Z-Series Engineering and Planning Guide Release 5.0

Copyright © 2009 – 2013 Cyan, Inc. All Rights Reserved. All text, images, graphics, animation, videos, music and other materials in this publication are subject to the copyright and other intellectual property rights of Cyan, Inc. or its licensors. These materials may not be reproduced, transmitted, distributed, modified or posted to other websites or printed without the express written permission of Cyan, Inc.

Cyan®, the Cyan logo, Z22™, Z33®, Z77®, Blue Planet™ and other trademarks and service marks of Cyan appearing in this publication are the property of Cyan. Trade names, trademarks and service marks of other companies appearing in this publication are the property of the respective holders.

Cyan Z-Series Engineering and Planning Guide Release 5.0

Naming Conventions

Throughout this guide, a standardized system is used to identify various functions or to stress importance to the reader.

Important! — Information that must be seriously considered.

Note: Special suggestions, advice, or information that should be seriously considered.

Cyan Z-Series Engineering and Planning Guide Release 5.0

Before you work on any equipment, be aware of the hazards involved with electrical circuitry

SAVE THESE INSTRUCTIONS

a moderate level of awareness. There is a moderate level of danger to

Before you work on any equipment, be aware of the hazards involved with electrical circuitry

rings, necklaces, bracelets, key chains, metal wristwatches, and apparel with metal buttons).

1 and AS/NZS 3260) should be

be accessed only through the use of a special tool, lock and key, or other means of security.

A copy of the installation documents and the list of accessories can be found in CyLibrary in

Safety Symbols and Labels

Read and understand all warning labels before working with equipment.

Warning

IMPORTANT SAFETY INSTRUCTIONS

This warning symbol means danger. You are in a situation that could cause bodily injury.

Caution

and be familiar with standard practices for preventing accidents.

Environment requires yourself or others.

Laser Equipment Present

Electrostatic Discharge (ESD) Sensitive Equipment

Safety and Compliance Information

Warning

IMPORTANT SAFETY INSTRUCTIONS

This warning symbol means danger. You are in a situation that could cause bodily injury.

Warning

Warning Installation of the equipment must comply with local and national electrical codes.

Warning

and be familiar with standard practices for preventing accidents.

SAVE THESE INSTRUCTIONS

Before working on the equipment, remove conductive clothing and jewelry (for example:

Conductive items can cause serious burns or weld the metal object to the terminals.

Only trained and qualified personnel (as defined in IEC 60950allowed to install, replace, or service this equipment.

This unit is intended for installation in restricted access areas. A restricted access area can

Read the installation directions before connecting the system to the power source or installing the modules and the accessories which are intended to be used only with Cyan Optical Packet system.

Cyan Central at http://cyaninc.com/resources/compliance.

Cyan Z-Series Engineering and Planning Guide Release 5.0

Do not perform cabling on an electrically live system. Before performing any of the following

protection to be provided as part of the facility. Install only

shelf assembly. Failure to ensure rack stability may cause the rack to tip over.

Never use the cable management guide to lift the chassis. This is NOT the intended purpose

Ensure that all power wiring is sufficient for the load carried to the shelf assembly. All wiring and installation must be in accordance with local building and electrical codes acceptable to

an electrician if you are uncertain that suitable grounding is

integral circuit protection.

Warning

Warning A readily accessible two-poled disconnect device must be incorporated in the fixed wiring.

Warning

procedures, ensure that power is removed from the DC circuit.

No user serviceable parts are contained inside. Contact the manufacturer regarding service of this equipment.

This device requires short-circuit in accordance with national and local wiring regulations.

The copper RJ-45 SFP modules are suitable for connection only to shielded Ethernet intra-building cabling grounded at both ends.

Do not work on the system, or connect or disconnect cables during periods of lightning activity.

Do not stack the chassis on any other equipment. If the chassis falls, it can cause severe bodily injury and equipment damage.

Stability hazard. The rack must be stabilized or bolted to the floor before you mount this

To prevent bodily harm when mounting or servicing this device in a rack, you must ensure that the shelf remains stable. The Following guidelines are provided to ensure your safety:

• This unit should be mounted at the bottom of the rack if it is the only unit in the rack.

• When mounting this unit in a partially filled rack, load the rack from bottom to the

top with the heaviest component at the bottom of the rack.

• If the rack is provided with stabilizing devices, install the stabilizers before mounting or servicing the unit in the rack.

Warning

of the cable guide. Personal injury and/or damage to the Z22 shelf assembly may result.

Warning

the authorities in the countries where the equipment is installed and used.

This equipment must be grounded. Never defeat the ground conductor or operate the equipment in the absence of a suitably installed ground conductor. Contact the appropriate electrical inspection authority or

Warning

available.

When installing or replacing the unit, the ground connection must always be made first and disconnected last.

This unit might have more than one power supply connection. All connections must be removed to de-energize the unit.

For connections outside the building where the equipment is installed, the 10/100/1000 Ethernet ports must be connected through an approved network termination unit with

Warning

Operating this equipment in an area that exceeds ambient air temperature of 50° C / 120° F will result in overheating.

Cyan Z-Series Engineering and Planning Guide Release 5.0

regulations.

the Hungarian EMC Class A requirements (MSZEN55022). Class A equipment is designed for

irements for industrial use. The seller

or buyer should be aware of this. If this type was sold or purchased by mistake, it should be

Environment requires a moderate level of awareness. There is a moderate level of danger to

Warning

Operating I-Temp equipment in an area that exceeds ambient air temperature of 65° C / 149° F will result in overheating.

Ultimate disposal of this product should be handled according to all national laws and

Connect the unit only to DC power source that complies with the safety extra-low voltage (SELV) requirements in IEC 60950-based safety standards.

This is a Class A product. In a domestic environment this product may cause radio interference, in which case the user may be required to take adequate measures.

This is a Class A product based on the standard of the VCCI Council. If this equipment is used in a domestic environment, radio interference may occur, in which case, the user may be required to take corrective actions.

This equipment is a class A product and should be used and installed properly according to

typical commercial establishments for which special conditions of installation and protection distance are used.

This is a Class A Information Product. When used in residential environment, it may cause radio frequency interference, under such circumstances, the user may be requested to take appropriate countermeasures.

This is a Class A Device and is registered for EMC requ

Warning

replaced with a residential-use type.

Air Management Boards are required to meet EMI certification standards. Air Management Boards must be installed to cover all unused slots.

Caution

yourself or others.

Caution

Caution Keep all ventilation openings clear and unobstructed.

Caution To prevent damage, do NOT install or remove XFP/SFP transceivers with cables attached.

Caution

To avoid damage to the Z22 shelf, the fan module should not be removed for longer than 60 seconds from an operating system.

The Air Management Boards are essential to proper cooling of the shelf assembly. Air Management Boards must be installed over all unused slot openings to prevent damage

Caution

from overheating.

Do not apply power to the unit until you complete all installation steps and check the continuity of the battery and battery return. When terminating power, return, and frame ground, do not use soldering lug connectors, push-in connectors, quick-connect

Caution Star washers must be used for anti-rotation on all power and ground fasteners.

Caution Use copper conductors only.

connectors, or other friction-fit connectors.

Cyan Z-Series Engineering and Planning Guide Release 5.0

OSP environment, the appropriate hardened modules must be used and DC power interfaces

Some Cyan shelf components are Electrostatic Discharge (ESD) sensitive devices. Conform

area is likely to cause harmful interference, in which case, the user will be required to correct

Caution

Note

This equipment is suitable for installation in Network Telecommunications Facilities, Customer Premises, and OSPs. If this equipment is installed in a Customer Premise or an

must be connected to DC power via a proper fuse panel.

The intra-building port(s) of the equipment or sub-assembly is suitable for connection to intra building or unexposed wiring or cabling only. The intra-building port(s) of the equipment or sub-assembly MUST NOT be metallically connected to interfaces that connect to the Outside Plant (OSP) or its wiring. These interfaces are designed for use as intra-building interfaces only (Type 2 or Type 4 ports as described in GR-1089-CORE, Issue

4) and require isolation from the exposed OSP cabling. The addition of Primary Protectors is not sufficient protection in order to connect these interfaces metallically to OSP wiring.

This equipment is intended to be grounded to a Common Bonding Network per GR-CORE

1089. Ensure that the host is connected to earth ground during normal use.

Hazard Level 1M Laser radiation. Do not view directly with non-attenuating optical instruments.

This product may employ Class 1M SFP or XFP. Check pluggable transceiver label for laser classification.

to the following rules:

• Observe standard precautions for handling ESD-sensitive devices.

• Assume that all solid-state electronic devices are ESD-sensitive.

• Ensure that you are grounded with a grounded wrist strap or equivalent while

working with ESD-sensitive devices.

• Transport, store, and handle ESD-sensitive devices in static-safe environments.

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential

Note

the interference at own expense.

The battery return connection is treated as DC-isolated (DC-I), as defined in Telcordia GR-1089-CORE Issue 3.

Note This Class A digital apparatus complies with Canadian ICES-003.

Cyan Z-Series Engineering and Planning Guide Release 5.0

Safety Symbols and Labels ......................................................................................................................... 4

Safety and Compliance Information .......................................................................................................... 4

New in this Release .................................................................................................................................... 21

Chapter 1: Cyan Z-Series Shelves ........................................................................................................ 23

1.1 Cyan Z22 Shelf............................................................................................................................... 23

1.1.1 Z22 Shelf Description .............................................................................................................. 24

1.1.2 Z22 Card Installation Guidelines ............................................................................................. 25

1.1.3 CEMi Controller Card: +24 Volt ............................................................................................. 26

1.1.4 Z22 Physical ............................................................................................................................ 26

1.1.5 Z22 External Timing ................................................................................................................ 27

1.1.6 Z22 Alarms .............................................................................................................................. 27

1.1.7 Z22 Shelf Power ...................................................................................................................... 28

1.2 Cyan Z33 Shelf............................................................................................................................... 29

1.2.1 Z33 Shelf Description .............................................................................................................. 31

1.2.2 Z33 Line Card Configuration Guidelines ................................................................................ 32

1.2.3 Common Equipment Module (CEMi) ..................................................................................... 33

1.2.4 Z33 Timing .............................................................................................................................. 35

1.2.5 Z33 Alarms .............................................................................................................................. 36

1.2.6 Z33 Shelf Power ...................................................................................................................... 36

1.2.7 Z33 Physical ............................................................................................................................ 37

1.3 Cyan Z77 Shelf v2 .......................................................................................................................... 37

1.3.1 Z77 Card Installation Guidelines ............................................................................................. 40

1.3.2 Z77 Power ................................................................................................................................ 41

1.3.3 Z77 Physical ............................................................................................................................ 41

1.3.4 Z77 Timing .............................................................................................................................. 41

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1.3.5 Z77 Management ..................................................................................................................... 41

1.4 Cyan L-AMP Shelf ......................................................................................................................... 42

1.4.1 L-AMP Shelf Pinouts .............................................................................................................. 43

1.4.2 L-AMP Interfaces .................................................................................................................... 44

1.4.3 L-AMP OSC Specifications..................................................................................................... 45

1.4.4 L-AMP Features ...................................................................................................................... 45

1.4.5 L-AMP Applications ............................................................................................................... 45

1.4.6 L-AMP Physical ...................................................................................................................... 45

1.4.7 L-AMP Power .......................................................................................................................... 46

1.4.8 L-AMP Compliance ................................................................................................................. 46

Chapter 2: Z-Series Line Cards, Modules, Optics, and Optical Protection ..................................... 47

2.1 LAD Modules ................................................................................................................................. 49

2.1.1 Functional Interfaces................................................................................................................ 56

2.1.2 LAD OSC Specifications ......................................................................................................... 57

2.1.3 Management ............................................................................................................................ 57

2.1.4 Physical .................................................................................................................................... 57

2.1.5 Power ....................................................................................................................................... 58

2.1.6 Environmental .......................................................................................................................... 58

2.1.7 LAD Module Wavelength Assignments .................................................................................. 58

2.1.8 LAD-2P and LAD-8i 1310nm Add/Drop Port ........................................................................ 60

2.1.9 LAD-2G 1550nm Add/Drop Port ............................................................................................ 60

2.1.10 Compliance / Safety ................................................................................................................. 60

2.2 DTM-8 and DTM-8G Transponder Modules ................................................................................. 61

2.2.1 DTM-8/DTM-8G System Requirements ................................................................................. 64

2.2.2 Applications ............................................................................................................................. 64

2.2.3 DTM-8

Interfaces .................................................................................................................... 64

2.2.4 DTM-8G Interfaces ................................................................................................................. 64

2.2.5 DTM-8/DTM-8G Management ............................................................................................... 65

2.2.6 DTM-8/DTM-8G Physical ...................................................................................................... 65

2.2.7 DTM-8/DTM-8G Power .......................................................................................................... 65

2.2.8 DTM-8/DTM-8G Environmental ............................................................................................ 65

2.2.9 DTM-8/DTM-8G Compliance / Safety ................................................................................... 65

2.3 2.5G-LME4 Multiplex-Transponder Module ................................................................................. 66

2.3.1 System Requirements .............................................................................................................. 67

2.3.2 Interfaces .................................................................................................................................. 67

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2.3.3 Management ............................................................................................................................ 68

2.3.4 Physical .................................................................................................................................... 68

2.3.5 Power ....................................................................................................................................... 68

2.3.6 Environmental .......................................................................................................................... 68

2.3.7 Compliance / Safety ................................................................................................................. 68

2.4 PME-412 Packet Multiplexer Module ........................................................................................... 69

2.4.1 Synchronous Ethernet .............................................................................................................. 71

2.4.2 System Requirements .............................................................................................................. 71

2.4.3 PME-412 Ethernet Services, OAM, QoS, and Synchronization .............................................. 71

2.4.4 PME-412 Capacity ................................................................................................................... 72

2.4.5 Optical Transport ..................................................................................................................... 73

2.4.6 Interfaces .................................................................................................................................. 73

2.4.7 Management ............................................................................................................................ 73

2.4.8 Physical .................................................................................................................................... 73

2.4.9 Power ....................................................................................................................................... 74

2.4.10 Environmental .......................................................................................................................... 74

2.4.11 Standards.................................................................................................................................. 74

2.4.12 Compliance / Safety ................................................................................................................. 74

2.5 PME-216i Packet Multiplexer Module .......................................................................................... 75

2.5.1 Synchronous Ethernet .............................................................................................................. 78

2.5.2 System Requirements .............................................................................................................. 78

2.5.3 PME-216i Ethernet Services, OAM, QoS, and Synchronization ............................................ 78

2.5.4 PME-216i Capacity ................................................................................................................. 79

2.5.5 Standards.................................................................................................................................. 80

2.5.6 Optical Transport ..................................................................................................................... 80

2.5.7 Interfaces .................................................................................................................................. 80

2.5.8 Manag

ement ............................................................................................................................ 81

2.5.9 Physical .................................................................................................................................... 81

2.5.10 Power ....................................................................................................................................... 81

2.5.11 Environmental .......................................................................................................................... 81

2.5.12 Compliance / Safety ................................................................................................................. 81

2.6 PSW-10G10 Packet Module .......................................................................................................... 82

2.6.1 System Requirements .............................................................................................................. 85

2.6.2 Ethernet Services and Standards .............................................................................................. 85

2.6.3 Optical Transport ..................................................................................................................... 85

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2.6.4 Interfaces .................................................................................................................................. 85

2.6.5 Management ............................................................................................................................ 85

2.6.6 Physical .................................................................................................................................... 85

2.6.7 Power ....................................................................................................................................... 86

2.6.8 Environmental .......................................................................................................................... 86

2.6.9 Compliance / Safety ................................................................................................................. 86

2.7 PSW-618 Packet Module ............................................................................................................... 87

2.7.1 System Requirements .............................................................................................................. 89

2.7.2 Ethernet Services and Standards .............................................................................................. 89

2.7.3 Optical Transport ..................................................................................................................... 89

2.7.4 Interfaces .................................................................................................................................. 89

2.7.5 Management ............................................................................................................................ 89

2.7.6 Physical .................................................................................................................................... 90

2.7.7 Power ....................................................................................................................................... 90

2.7.8 Environmental .......................................................................................................................... 90

2.7.9 Compliance / Safety ................................................................................................................. 90

2.8 TSW-10G10 Packet Aggregation and Transport Module .............................................................. 91

2.8.1 System Requirements .............................................................................................................. 92

2.8.2 Interfaces and Optical Transport .............................................................................................. 92

2.8.3 Management ............................................................................................................................ 93

2.8.4 Physical .................................................................................................................................... 93

2.8.5 Power ....................................................................................................................................... 93

2.8.6 Environmental .......................................................................................................................... 93

2.8.7 Compliance / Safety ................................................................................................................. 93

2.9 LAC-8 Lambda Aggregator Module .............................................................................................. 94

2.9.1 System Requirements .............................................................................................................. 94

2.9.2 Functional Interfaces................................................................................................................ 94

2.9.3 Manag

ement ............................................................................................................................ 95

2.9.4 Physical .................................................................................................................................... 95

2.9.5 Power ....................................................................................................................................... 95

2.9.6 Environmental .......................................................................................................................... 95

2.9.7 LAC-8 Wavelength Assignments ............................................................................................ 95

2.9.8 Compliance / Safety ................................................................................................................. 96

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2.10 LAC-4P Lambda Aggregator CWDM Terminal Multiplexer ........................................................ 97

2.11 SFT-8 Module Transponder Module .............................................................................................. 98

2.11.1 System Requirements ............................................................................................................ 100

2.11.2 Functional Interfaces.............................................................................................................. 100

2.11.3 Management .......................................................................................................................... 100

2.11.4 Physical .................................................................................................................................. 100

2.11.5 Power ..................................................................................................................................... 100

2.11.6 Environmental ........................................................................................................................ 101

2.11.7 Compliance / Safety ............................................................................................................... 101

2.12 SFT-10G16 Multi-Rate Transponder Module .............................................................................. 102

2.12.1 SFT-10G16 Applications ....................................................................................................... 104

2.12.2 System Requirements ............................................................................................................ 104

2.12.3 Management .......................................................................................................................... 104

2.12.4 Physical .................................................................................................................................. 104

2.12.5 Power ..................................................................................................................................... 104

2.12.6 Environmental ........................................................................................................................ 104

2.12.7 Compliance / Safety ............................................................................................................... 104

2.13 DTM-100G Transponder Module ................................................................................................ 105

2.13.1 System Requirements ............................................................................................................ 107

2.13.2 DTM-100G Applications ....................................................................................................... 107

2.13.3 Interfaces ................................................................................................................................ 107

2.13.4 Optical Transport ................................................................................................................... 108

2.13.5 Management .......................................................................................................................... 108

2.13.6 Physical .................................................................................................................................. 108

2.13.7 Power ..................................................................................................................................... 108

2.13.8 Environmental ........................................................................................................................ 108

2.13.9 Co

mpliance / Safety ............................................................................................................... 109

2.14 MSE-1482 Multiservice SONET/SDH Aggregation/ Transport .................................................. 110

2.14.1 Applications ........................................................................................................................... 114

2.14.2 System Requirements ............................................................................................................ 114

2.14.3 Functional Interfaces.............................................................................................................. 114

2.14.4 GbE Support .......................................................................................................................... 114

2.14.5 Timing / Synchronization ...................................................................................................... 114

2.14.6 Management .......................................................................................................................... 114

2.14.7 Physical .................................................................................................................................. 115

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2.14.8 Power ..................................................................................................................................... 115

2.14.9 Environmental ........................................................................................................................ 115

2.14.10 Compliance / Safety ........................................................................................................... 115

2.15 FLX-216i Multi-Rate OTN Muxponder Module ......................................................................... 116

2.15.1 System Requirements ............................................................................................................ 117

2.15.2 Applications ........................................................................................................................... 118

2.15.3 Interfaces ................................................................................................................................ 118

2.15.4 OTN Multiplexing and Cross-Connect Formats .................................................................... 118

2.15.5 Optical Transport ................................................................................................................... 118

2.15.6 Management .......................................................................................................................... 118

2.15.7 Physical .................................................................................................................................. 118

2.15.8 Power ..................................................................................................................................... 118

2.15.9 Environmental ........................................................................................................................ 119

2.15.10 Compliance / Safety ........................................................................................................... 119

2.16 WSS-402 and WSS-404 Wavelength Selective Switch ............................................................... 120

2.16.1 WSS DWDM Specifications ................................................................................................. 126

2.16.2 WSS OSC Specifications ....................................................................................................... 127

2.16.3 System Requirements ............................................................................................................ 127

2.16.4 Physical .................................................................................................................................. 127

2.16.5 Power ..................................................................................................................................... 127

2.16.6 Environmental ........................................................................................................................ 127

2.16.7 WSS/AWG-40 Wavelength Assignments ............................................................................. 128

2.16.8 Compliance / Safety ............................................................................................................... 128

2.17 Broadband Operating System Supervisor .................................................................................... 129

2.17.1 Shelf Compatibility ................................................................................................................ 130

2.17.2 CPU........................................................................................................................................ 130

2.17.3 RAM

...................................................................................................................................... 130

2.17.4 Timing.................................................................................................................................... 130

2.17.5 Craft ....................................................................................................................................... 130

2.17.6 Physical .................................................................................................................................. 130

2.17.7 Power ..................................................................................................................................... 130

2.17.8 Compliance ............................................................................................................................ 130

2.17.9 Electrical ................................................................................................................................ 131

2.18 BOSS Termination Module .......................................................................................................... 131

2.18.1 Shelf Compatibility ................................................................................................................ 133

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2.18.2 Physical .................................................................................................................................. 133

2.18.3 Timing.................................................................................................................................... 133

2.19 Line Card SYNC LED ................................................................................................................. 134

2.20 Ring Closure Modules .................................................................................................................. 135

2.21 XC-2800 Switch Fabric Modules ................................................................................................. 135

2.21.1 XC-2800 Applications ........................................................................................................... 137

2.21.2 System Requirements ............................................................................................................ 137

2.21.3 Capacity and Throughput....................................................................................................... 137

2.21.4 Redundancy and Protection ................................................................................................... 137

2.21.5 Physical .................................................................................................................................. 137

2.21.6 Power ..................................................................................................................................... 137

2.22 Optical Protection Groups ............................................................................................................ 138

2.22.1 Optical Protection Groups Equipment ................................................................................... 138

2.22.2 Optical Protection Groups – Rules and Guidelines ............................................................... 140

2.23 Optical Protection Switch ............................................................................................................. 141

2.23.1 1+1 Protection ........................................................................................................................ 141

2.23.2 Switching Modes ................................................................................................................... 142

2.23.3 Local or Remote Operation.................................................................................................... 142

2.23.4 OPS Specifications ................................................................................................................ 143

2.24 XFP, SFP, and SFP+ Transceivers ............................................................................................... 143

Chapter 3: Optical Link Design .......................................................................................................... 145

3.1 DWDM XFP Specifications with GFEC ...................................................................................... 145

3.2 LAD Modules ............................................................................................................................... 146

3.3 Dispersion Compensation Modules.............................................................................................. 151

Chapter 4: Application Configurations ............................................................................................. 153

4.1 App 1: OC-192/STM-64/10GbE (10G λ) transport ..................................................................... 155

4.1.1 10G Lambda Transport, OEO Application Feature Set ......................................................... 156

4.2 A

pp 2: OC-48/STM-16 Transport ................................................................................................ 158

4.3 App 3: Packet (10GbE and 1GbE) Transport and Switching ....................................................... 159

4.3.1 Protected and Unprotected Configurations ............................................................................ 161

4.4 App 4: Multiservice Lambda Transport, OEO ............................................................................. 162

4.4.1 Multiservice Lambda Transport OEO Application Feature Set ............................................. 163

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4.5 App 5: MSE-1482 Transparent Line Functionality ...................................................................... 165

4.6 App 6: MSE-1482 Path Cross-Connect Functionality ................................................................. 167

4.7 App 7: Ethernet over SONET (EoS) ............................................................................................ 168

4.8 App 8: WSS Network Configuration ........................................................................................... 169

4.9 App 9: Ethernet Services and Transport ....................................................................................... 170

4.10 App 10: Collector Rings ............................................................................................................... 171

4.11 App 11: FLX-216i Configurations ............................................................................................... 172

Chapter 5: System Power .................................................................................................................... 175

5.1 Cyan Z22 Power ........................................................................................................................... 175

5.2 Cyan Z33 Power ........................................................................................................................... 176

5.3 Cyan Z77 Power ........................................................................................................................... 177

5.4 Fuses ............................................................................................................................................. 177

5.5 Z77 Fuse Positions and DC Feeds ................................................................................................ 178

Chapter 6: Management Network Configuration Guidelines.......................................................... 181

6.1 Single Physical LAN .................................................................................................................... 182

6.2 Multiple Physical LANs ............................................................................................................... 185

6.3 Multiple Physical LANs and the Same IP Sub-Network ............................................................. 192

6.4 Network and Host Routes ............................................................................................................ 198

Appendix A: Best Practices for Network Configurations .................................................................... 199

Appendix B: Acronyms and Cyan Terminology .................................................................................. 205

Table of Figures

Figure 1: Front and Rear View of the Z22 -48V Shelf Layout ................................................................... 24

Figure 2: Z22 System and Environmental Alarms Connection ................................................................... 27

Figure 3: Z33 Front and Rear Shelf Layout ................................................................................................ 29

Figure 4: CEMi Controller Card ................................................................................................................. 33

Figure 5: CEMi and MSE-1482 Configuration - Traffic via EoS ............................................................... 34

Figure 6: CEMi and MSE-1482 DCN Configuration Option ..................................................................... 34

Figure 7: Z77 Shelf v2 – Front and Rear Views ......................................................................................... 37

Figure 8: L-AMP Shelf – Front View ......................................................................................................... 42

Figure 9: L-AMP Block Diagram ............................................................................................................... 43

Figure 10: Cyan Z22 LAD-2P Module ....................................................................................................... 50

Figure 11: Cyan Z-Series LAD-4A Module ................................................................................................ 50

Figure 12: Cyan Z-Series LAD-8i Module ................................................................................................. 50

Figure 13: Cyan Z-Series LAD-40E Module .............................................................................................. 50

Figure 14: AWG-40 External Module ......................................................................................................... 51

Figure 15: LAD-40E and AWG-40 Installation Example ........................................................................... 51

Figure 16: LAD-2P LGX Passive Module .................................................................................................. 52

Figure 17: LAD-2G LGX Passive Module ................................................................................................. 52

Figure 18: LAD-2P Block Diagram ............................................................................................................ 53

Figure 19: LAD-2G Block Diagram ........................................................................................................... 53

Figure 20: LAD-4 Block Diagram .............................................................................................................. 53

Figure 21: LAD-4A Block Diagram ........................................................................................................... 54

Figure 22: LAD-8 Block Diagram .............................................................................................................. 54

Figure 23: LAD-8i Block Diagram ............................................................................................................. 54

Figure 24: LAD-8A

Figure 25: LAD-8E Block Diagram ............................................................................................................ 55

Block Diagram ........................................................................................................... 54

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Figure 26: LAD-8X Block Diagram ........................................................................................................... 55

Figure 27: LAD-40 Block Diagram ............................................................................................................ 55

Figure 28: LAD-40E Block Diagram .......................................................................................................... 56

Figure 29: Cyan Z-Series DTM-8 Module .................................................................................................. 61

Figure 30: DTM-8 Functional Block Diagram ............................................................................................ 61

Figure 31: DTM-8G Functional Block Diagram ......................................................................................... 61

Figure 32: Z-Series 2.5G-LME4 Module .................................................................................................... 66

Figure 33: Z-Series 2.5G-LME4 Functional Block Diagram ...................................................................... 66

Figure 34: Z-Series PME-412 Module ........................................................................................................ 69

Figure 35: PME-412 Functional Block Diagram ........................................................................................ 69

Figure 36: Z-Series PME-216i Module ....................................................................................................... 75

Figure 37: PME-216i Functional Block Diagram ....................................................................................... 75

Figure 38: PSW-10G10 Functional Block Diagram ................................................................................... 82

Figure 39: Typical Extended Switch Configuration with PSW-10G10 Line Cards .................................... 82

Figure 40: PSW-618 Functional Block Diagram ........................................................................................ 87

Figure 41: Typical Extended Switch Configuration with PSW-618 Line Cards ........................................ 87

Figure 42: Z77 TSW-10G10 Module .......................................................................................................... 91

Figure 43: TSW-10G10 Configuration Example ........................................................................................ 91

Figure 44: Z77 Aggregation Comparison Using TSW-10G10 Line Cards ................................................. 92

Figure 45: Cyan Z-Series LAC-8 Module ................................................................................................... 94

Figure 46: LAC-8 Block Diagram ............................................................................................................... 94

Figure 47: LAC-4P Wiring Example .......................................................................................................... 97

Figure 48: SFT-8 Module ............................................................................................................................ 98

Figure 49: SFT-8 Module Trunk and Client Interfaces ...............................................................................

gure 50: Z-Series SFT-10G16 Module .................................................................................................. 102

Figure 51: SFT-10G16 Block Diagram ..................................................................................................... 103

Figure 52: Z-Series DTM-100G Transponder Module ............................................................................. 105

Figure 53: DTM-100G Transponder and OTN Functional Block Diagram .............................................. 106

Figure 54: DTM-100G Transponder Block Diagram ................................................................................ 106

Figure 55: Cyan Z-Series MSE-1482 Module ........................................................................................... 110

Figure 56: MSE-1482 Trunk and Client Interfaces ................................................................................... 110

Figure 57: MSE-1482 Any-to-Any Cross-Connect Capabilities ............................................................... 111

Figure 58: MSE-1482 Path (UPSR or SNCP) and Line Protection .......................................................... 112

Figure 59: FLX-216i Trunk and Client Interfaces .................................................................................... 116

Figure 60: WSS-402 and WSS-404 Wavelength Selective Switch Modules ............................................ 120

Cyan Z-Series Engineering and Planning Guide Release 5.0

Figure 61: AWG-40 External Module ....................................................................................................... 121

Figure 62: Z77 Shelf, WSS-402, DTM-8, and AWG-40 Two-Degree Configuration Example ............... 121

Figure 63: WSS-402 AMP Optical RX and TX Paths .............................................................................. 122

Figure 64: OFX-4 Module – External Optical Fabric Cross-Connect ....................................................... 122

Figure 65: WSS-404 Four-Degree Optical Switching ............................................................................... 123

Figure 66: WSS-402 DWDM Diagram ..................................................................................................... 125

Figure 67: Z77 BTM ................................................................................................................................. 131

Figure 68: Ring Closure Module (RCM) .................................................................................................. 135

Figure 69: Z77 with XC-2800 (Rear View) .............................................................................................. 136

Figure 70: Optical protection Group Configuration Example ................................................................... 139

Figure 71: OPS 1+1 Protection ................................................................................................................. 141

Figure 72: Local/Remote Switch on Control Module ............................................................................... 142

Figure 73: LAD-2P Block Diagram .......................................................................................................... 146

Figure 74: LAD-2G Block Diagram ......................................................................................................... 146

Figure 75: LAD-8E Variable Optical Attenuator (VOA) Control Points ................................................. 147

Figure 76: LAD-8X VOA Control Points ................................................................................................. 148

Figure 77: LAD-40E VOA Control Points ................................................................................................ 150

Figure 78: Four-Wave 10G Transport Application with LAD-4/LAD-4A ............................................... 155

Figure 79: Eight-Wave 10G Transport Application with LAD-8/A/E/i/X ................................................ 156

Figure 80: OC-48/STM-16 Transport ....................................................................................................... 158

Figure 81: Application with a Pair of PME Modules – Each PME Supports Two 10 GbE Trunks .......... 159

Figure 82: Z-Series 10G Ring with a Single PME Module ....................................................................... 160

Figure 83: Multiservice Lambda Transport OEO ..................................................................................... 162

Figure 84: Z77 Multiservice Lambda Transport OEO .............................................................................. 163

Figure 85: MSE-1482 Transparent Line Application ................................................................................

gure 86: MSE-1482 Transparent Line Functionality - Route Diversity ................................................. 166

165

Figure 87: MSE-1482 Path Cross-Connect Application ........................................................................... 167

Figure 88: MSE-1482 Path Level Capability ............................................................................................ 167

Figure 89: MSE-1482 Ethernet over SONET Application ........................................................................ 168

Figure 90: WSS-402 Network Configuration / Regeneration ................................................................... 169

Figure 91: Z22 - Aggregation, Transport, and Edge Access ..................................................................... 170

Figure 92: Z22, Z33, and Z77 Collector Rings ......................................................................................... 171

Figure 93: Z22 Collector Ring Node Configuration ................................................................................. 171

Figure 94: FLX-216i Point-to-Point Configuration .................................................................................. 172

Figure 95: FLX-216i Ring Topology, Single-Card Configuration............................................................ 172

Cyan Z-Series Engineering and Planning Guide Release 5.0

Figure 96: FLX-216i Ring Topology, Two-Card Configuration .............................................................. 173

Figure 97: Z77 Fuse Assignment for Fan Module .................................................................................... 178

Figure 98: Z77 Shelf Fuse Assignment for Fan Modules ......................................................................... 179

Figure 99: Single Physical LAN Example ................................................................................................ 182

Figure 100: Collocated Planet Operate Server Example ........................................................................... 183

Figure 101: Non-Collated Planet Operate Server Example....................................................................... 184

Figure 102: Multiple Physical LANs Example ......................................................................................... 185

Figure 103: Collocated Planet Operate Server Sharing Same LAN as the Gateway Cyan Node ............. 186

Figure 104: Collocated Planet Operate Server with Redundant Cyan Gateway Nodes ............................ 187

Figure 105: Non-Collocated Planet Operate Server and Gateway Node Separated by One or More Routers . 188

Figure 106: Non-Collocated Planet Operate Server with Redundant Cyan Gateway Nodes .................... 190

Figure 107: Collocated Planet Operate Server and Cyan Nodes ............................................................... 192

Figure 108: Collocated Planet Operate Server with Redundant Cyan Gateway Nodes ............................ 194

Figure 109: Non-Collocated Planet Operate Server and Cyan Nodes Separated by a Router .................. 195

Figure 110: Non-Collocated Planet Operate Server with Redundant Cyan Gateway Nodes .................... 197

Figure 111: Linear Chain – Slot and Line Card Assignments ................................................................... 201

Figure 112: Typical Z33 and Z77 Ring Configuration ............................................................................. 202

Figure 113: Ring Configuration with WSS-402 Cards Only in a Node Site ............................................. 203

Cyan Z-Series Engineering and Planning Guide Release 5.0

New in this Release

This release of the Cyan Z-Series Engineering and Planning Guide describes the following new features:

• BOSS2 shelf control card. The BOSS2 supports enhanced packet scalability, including support for

more than 500 Flow Domains. The BOSS2 card is recommended for Z77 shelves configured with

the XC-2800 switch fabric modules. Refer to Broadband Operating System Supervisor.

• PSW-10G10 10-port 10 GbE packet switch module. Refer to PSW-10G10 Packet Module starting

on page 82.

• PSW-618 24-port Ethernet switching and transport module. Refer to PSW-618 Packet Module

starting on page 87.

• In this Release, the DTM-100G line card supports an OTU4 client-side interface. The interface

supports 100G wavelength regeneration applications and future LME transport applications. The client side of the DTM-100G module accepts either 100 GbE or OTU4 (GFEC) and re-maps the client into an OTU4 on the line side.

New in Release 4.3

Release 4.3 of the Cyan Z-Series Engineering and Planning Guide includes the following new feature:

• FLX-216i is a multi-rate OTN muxponder I-Temp module. Refer to FLX-216i Multi-Rate OTN

Muxponder Module starting on page 116.

New in Release 4.2

Release 4.2 of the Cyan Z-Series Engineering and Planning Guide includes the following new features:

• DTM-100G 100Gbps dual-slot transponder module with configurable OTU4 mapping. Refer to

DTM-100G Transponder Module starting on page 105.

• MSE-1482 line cards can be installed in a Z77 shelf or a Z77 shelf v2 supported by the XC-2800

switch fabric. The XC-2800 switch fabric module supports the MSE-1482 in a standalone muxponder configuration. However, the XC-2800 switch fabric module does not support MSE-1482 card-to-card backplane cross-connections or protection.

Intended audience

The primary audience for this guide includes network planners and engineers, and other personnel responsible for planning and engineering carrier networks. It is also a guide for personnel involved in configuring, administrating, and operating the Cyan Z-Series shelves and third-party equipment. It assumes you have an understanding of standard telecom terminology and practices.

The guide provides information about system features, engineering guidelines, optical design, configurations, applications, and technical specifications for the Cyan Z-Series platform: the Cyan Z22 shelf, the Cyan Z33 shelf, and the Cyan Z77 shelf.

Note: In this guide, "Z33" refers to the Cyan standard C-Temp Z33 shelf and the Z33 I-Temp shelf. "Z77" refers to the Cyan Z77 and Z77 shelf v2.

Cyan Z-Series Engineering and Planning Guide Release 5.0

Chapter 1: Cyan Z-Series Shelves

This section describes the Cyan Z-Series platform: the Cyan Z22, Z33, Z77 shelves and the L-AMP shelf.

In This Chapter

Cyan Z22 Shelf ........................................................................................ 23

Cyan Z33 Shelf ........................................................................................ 29

Cyan Z77 Shelf v2 ................................................................................... 37

1.1 Cyan Z22 Shelf

The Cyan Z22 Industrial Temperature (I-Temp) shelf is a compact, cost-effective member of the Z-Series multi-layer transport networking platforms. The Z22 shelf assembly is a 2 DC model and a -48 volt DC model.

The Z22 system is optimized for edge and access node applications. Z22 deployments enable service providers to scale packet services, leverage existing services and infrastructure. It optimizes their networks with multi-layer networking using integrated 10G DWDM transport with planned 100G capacity modules.

A Z22 shelf equipped with Z-Series trunk-side PME-216i modules can be configured to support a variety of network functions, including:

• Outside Plant (OSP) cabinet deployments

• Packet switch providing advanced Layer 2 Ethernet services, access grooming and

connection-oriented Ethernet

 Carrier-grade SLA transport performance with Y.1731 OAM capability  Advanced aggregation and MEF services (EPL, EVPL, E-LAN, and E-VLAN).

• Integrated G.709 OTN/DWDM mapping (OTU2) for enhanced performance and management

• Multi-channel DWDM with full optical add/drop multiplexing

• Gigabit Ethernet services

• OEO switching

RU chassis offered as a +24 volt

Cyan Z-Series Engineering and Planning Guide Release 5.0

Fan Module

CEMi

PME-216i Modules

LAD-2P Module

Power

Timing

Alarms

iLAN Interface

Front View

Rear View

Management Interface

Figure 1: Front and Rear View of the Z22 -48V Shelf Layout

Note: The iLAN interface on the rear of the Z22 chassis is reserved for future use.

1.1.1 Z22 Shelf Description

The Z22 I-Temp system employs advanced technologies, with high-density modularity in a compact 2 RU high, 19" (48.26 cm) wide chassis. Optimized for low entry costs, the Z22 shelf has two horizontal service module slots and two common equipment slots supporting advanced services and network topologies.

• Line card (module) slots: 2

• Common control module slots: 2 (A and B)

Note: If the Z22 shelf is configured with an in-chassis LAD-2P or LAD-2G module, the module

must be installed in common control slot B.

• 1+1 equipment protection

• ITU timing

• All front access line cards and card interface connections

• All Z-Series modules are hot-swappable

• Power connectors: Dual-feed Quick-Connect Terminal Block

• Alarm connectors: Quick-Connect Terminal Block

• Management connectivity: RJ-45 (10/100/1000Base-T)

All shelf components are modular and can be removed and replaced in the field. This provides full serviceability and a simple upgrade path for future expansion. Each Z22 shelf ships with the following items:

• (1) Front protective shield

• (1) Cable management guide

• (2) 10-position plug terminal block, 3.81 mm, 16–28 AWG

• (2) 4-position plug terminal block, 3.81 mm, 16–28 AWG

• (1) Ground cable

• (1) Power cable assembly

• (1) Fan module

• (1) Fan air filter

Cyan Z-Series Engineering and Planning Guide Release 5.0

Z22 shelves should be installed in accordance with the Cyan Z22 Installation and Safety Guide. This will

ensure correct installation of modules, all associated wire management, power and grounding requirements, and related components.

Redundancy and Protection

• Redundant fans

• Redundant power connections

• Equipment Protection: 1:1 for all common cards and service modules

• Carrier Ethernet Protection:

 IEEE 802.3ad Link Aggregation  IEEE 802.3Qay Path Protection  ITU-T G.8032 Ethernet Ring Protection

• SONET/SDH Protection:

 1+1 APS/MSP  UPSR/SNCP

1.1.2 Z22 Card Installation Guidelines

Z22 shelf slot restrictions and line card placement guidelines are shown in the tables below. CEMi controller cards can only be installed in slots A and B. If deploying the in-chassis LAD-2P or LAD-2G module, you must install the LAD module in slot B.

+24V Z22 Shelf

The PME-216i +24V I-Temp line card is identical in function to the -48V I-Temp PME-216i line card, but is designed to operate in 24-volt applications supported by the Z22 +24V model. Voltage range for the +24 Volt PME-216i line card is 18 to 30 Vdc.

Line Cards

CEMi X X LAD-2P or LAD-2G X PME-216i (+24V) X X

Important! – At least one PME-216i line card must be installed in slots 1 and/or 2 of the +24V Z22 shelf to act as the shelf manager.

A B 1 2

Slots

Cyan Z-Series Engineering and Planning Guide Release 5.0

48V

-48V Z22 Shelf

Line Cards

A B 1 2

Slots

CEMi X X LAD-2P or LAD-2G X PME-216i (-48V)

X X PME-412 X X MSE-1482 X X SFT-8

X X

2.5G-LME4 X X SFT-10G16 X X DTM-8 / DTM-8G

X X DTM-100G X X FLX-216i X X WSS-402

X X WSS-404 X X

Important! – At least one Z-Series line card must be installed in slots 1 and/or 2 of the Z22 shelf to act as the shelf manager.

Note: A dual-slot DTM-100G line card installed in slots 1 and 2 does NOT provide shelf manager redundancy.

1.1.3 CEMi Controller Card: +24 Volt

The CEMi +24V model is identical in function to the -48V CEMi controller card, but is designed to operate in 24-volt applications supported by the Z22 +24V shelf model. Voltage range for the +24 volt CEMi card is 18 to 30 Vdc.

For CEMi controller card feature details and specifications, see Common Equipment Module (CEMi)

starting on page 33.

1.1.4 Z22 Physical

• Height: 3.5" / 88.9 mm (2 RU)

• Width: 19.00" / 483 mm

• Depth: 14.85" / 377 mm

• Weight: 15 lbs. / 6.8 kg (with 2 CEMi cards and fan tray)

• Operating temperature: -40°F to +149°F / -40°C to +65°C (I-Temp)

Cyan Z-Series Engineering and Planning Guide Release 5.0

COM

CRIT

MAJ

MIN

FAIL

OUT2

IN1

IN2

IN3

IN4

OUT1

ALARMS

1.1.5 Z22 External Timing

The Z22 system supports the following timing inputs/outputs used for network synchronization:

• 2 T1/E1 outputs

• 2 T1/E1 inputs

The timing inputs and outputs are accessed through an 8-position pluggable terminal block on the rear side of the Z22 chassis.

The following table shows the external timing connector pinouts:

Pin Description

1 T1/E1 TX1_+ (Output) 2 T1/E1 TX1_- (Output) 3 T1/E1 RX1_+ (Input) 4 T1/E1 RX1_- (Input) 1 T1/E1 TX2_+ (Output) 2 T1/E1 TX2_- (Output) 3 T1/E1 RX2_+ (Input) 4 T1/E1 RX2_- (Input)

1.1.6 Z22 Alarms

The Z22 platform supports system and environmental alarms. System alarms include Critical, Major, Minor, and Failsafe. The environmental alarms include 4 inputs and 2 outputs. Alarms are accessed through a combination 20-position pluggable terminal block on the rear side of the Z22 chassis.

Figure 2: Z22 System and Environmental Alarms Connection

Cyan Z-Series Engineering and Planning Guide Release 5.0

The following table shows the connector pinouts for the system and environmental alarms:

Pin Description Pin Description

1 CRIT_NO 1 IN1_+ 2 CRIT_C 2 IN1_COM 3 MAJ_NO 3 IN2_+ 4 MAJ_C 4 IN2_COM 5 MIN_NO 5 IN3_+ 6 MIN_C 6 IN3_COM 7 FAIL_NC 7 IN4_+ 8 FAIL_C 8 IN4_COM 9 OUT2_NO 9 OUT1_NO

10 OUT2_C 10 OUT1_C

For details on configuring environmental alarms, see the Cyan Z-Series Troub lesh ooting and Maintenance Guide.

1.1.7 Z22 Shelf Power

Feeds: Voltage range:

Max voltage: Max current:

2 1-A & 1-B

-48V Configuration -40 to -60 Vdc Guaranteed Operation

+24V Configuration 18 to 30 Vdc Guaranteed Operation

-/+100 Vdc Non-operational, no damage

-48V Configuration 10 Amps

+24V Configuration 20 Amps

Note: Use Planet Design as a guideline based on the total configured system current draw. You must size fuses according to NEC standards or local site practice.

Cyan Z-Series Engineering and Planning Guide Release 5.0

Front View

Rear View

Fan Module

Fan Filter

CEMi A

Power

System Alarms

Environmental Alarms

Timing

Management Interface

CEMi B

1.2 Cyan Z33 Shelf

The Cyan Z33 Industrial Temperature (I-Temp), 400 Gbps packet-optical transport shelf is a compact, cost-effective member of the Z-Series multi-layer transport networking platforms. The system provides multi-layer add/drop multiplexing (MADM) and transport functions in one fully integrated system. The system’s shared mesh protection provides full protection and sub-50 ms restoration for all services.

The Z33 shelf is a smaller version of the Z77 chassis intended for lower capacity and more cost-sensitive edge applications. Z33 deployments enable service providers to scale packet services, leverage existing services and infrastructure. It also optimizes their networks with multi-layer networking using 2.5G CWDM and 10G DWDM transport.

A Z33 system equipped with Z-Series interchangeable trunk-side modules can be configured to support a variety of network functions, including:

• Fully Reconfigurable Optical Add Drop Multiplexer (ROADM) with Optical-Optical-Optical

(OOO) switching and optical pass-through.

• Standalone SONET or SDH aggregation and transport.

• Packet switching providing advanced Layer 2 Ethernet services, access grooming and connection

oriented Ethernet.

• Efficient G.709 OTN grooming of the above services on to 10G multiservice wavelengths.

• Multi-channel DWDM with full optical add/drop multiplexing.

• CWDM channels of up to eight 2.5G wavelengths.

• Aggregation, grooming and STS-1 level switching of SONET/SDH and GbE services from existing

Ethernet switches, routers, DSLAMs, DLC/BLCs and third-party products.

• Transponding Gigabit Ethernet and OC-3/12/48 SONET STM-1/4/16 SDH services.

• Any combination of the above.

Figure 3: Z33 Front and Rear Shelf Layout

Cyan Z-Series Engineering and Planning Guide Release 5.0

Utilizing GbE and 10GbE switching and transport, the Z33 platform provides 2.5G CWDM transport, 10G DWDM transport, OTN digital wrapper functionality, and multi-layer optimization and management.

The Z33, with a WSS-402 or WSS-404 module installed and paired with a passive AWG-40 optical patch panel, provides a full ROADM with OOO switching and optical pass through. The WSS-402 provides 2 degrees and the WSS-404 provides 4 degrees of 40-wavelength cross-connect capacity in a single Z33 shelf. Each WSS module provides optical add/drop multiplexing capability in the 1550nm band across pre-defined ITU channel designations with 100 GHz spacing.

The shelf is optimized for edge and access node applications. The 5

RU chassis with six line card slots and

two common equipment modules can be equipped with any combination of Ethernet, CWDM, and DWDM line cards to support a range of advanced services and applications. Further scalability is accomplished by simply adding additional Z33 shelves or by redeploying interchangeable Z33 line cards into the larger-capacity Z77 platform for increased aggregation and grooming.

The Z33 shelf provides the following key features:

• Supports 1 to 40 lambda 10G waves in ITU grid 100 GHz DWDM channel spacing.

• Supports CWDM (20nm spacing) capability with the addition of the LAC-8 module.

• Supports addition of 2.5G waves using SFT-8 modules.

• Supports 2-degree (East/West) configurations (WSS-402) or 4-degree (North/South/East/West)

configurations (WSS-404).

• 6 service slots, 2 Common Equipment Module (CEMi) slots (A and B).

• All Z-Series modules are hot-swappable.

• Over 100 Gbps per slot capacity.

• Service cards are common with the Z-Series platform. The CEMi controller cards are specific to the

Z33 and Z22 chassis.

The card/slot restrictions are as follows:

• Slots 1 and 2 must be the first slots that are occupied in the chassis.

• Slots 1 and 2 must contain a line card with management processing capability. These line cards

include: 2.5G-LME4, PME-412, PME-216i, DTM-8, DTM-8G, DTM-100G, SFT-8, SFT-10G16, MSE-1482, WSS-402, and WSS-404 but not any LAD or LAC-8 modules.

Chassis Capacity

• Packet: Up to 240 Gbps of protected services

• Optical:

 4-degree, 40-channel ROADM  4, 8, or 40 channel, C-Band Terminal Mux  Tunable or Fixed wavelength transceiver options

Redundancy and Protection

• Redundant fans

• Redundant power connections

• Equipment Protection: 1:1 for all common cards and service modules

+ 186 hidden pages

Cyan Z22, Z33, Z77, Z Series, L-AMP Engineering And Planning Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Safety Symbols and Labels

Safety and Compliance Information

Contents

Table of Figures

New in this Release

Chapter 1: Cyan Z-Series Shelves

1.1 Cyan Z22 Shelf

1.1.1 Z22 Shelf Description

1.1.2 Z22 Card Installation Guidelines

1.1.3 CEMi Controller Card: +24 Volt

1.1.4 Z22 Physical

1.1.5 Z22 External Timing

1.1.6 Z22 Alarms

1.1.7 Z22 Shelf Power

1.2 Cyan Z33 Shelf