CVICLOUD FWS703 User Manual
Subject
Product Specification
Rev1.0
Marketing
Name
M32
HomeKit Wi
-Fimodule
Model No.
FWS703
Page1of11Description
M32 Wi
-Fi2.4GHz
module
support HomeKit
1. Overview
M32 is 2.4GHz 1T1R Wi-Fi module that targets the Internet of Thing market, especially for Apple
HomeKit application. The module shows low-power and easy development. Also integrated WAC
function and compliance to Apple HomeKit Accessory Protocol standard. As such the module does
offer industry-leading specifications and the best performance for electronic integration, range,
power consumption,
and connectivity.
Key Features
IEEE802.11 b/g/n
Wi-Fi 2.4GHz 1T1R 150Mbps
Compliance to Wireless Accessory Configuration protocol
Compliance to Bonjour protocol
Compliance to HomeKit Accessory Profile (HAP) R12
Apple CP embedded
Support Apple defined profile (Outlet, thermostat, LightBulb , Fan..etc)
OTA (Over The Air) to Cloud function ( Optional )
Dual Image
Categories Items Specifications
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM,
I2S,IR
GPIO, capacitive touch sensor, ADC, DAC
Average: 80mA
500 mA
0°C ~+80°C
AES/RSA/ECC/SHA
Hardware
Moduleinterface
On-chip sensor Hallsensor,temperaturesensor
On-board clock 40 MHz crystal
Operatingvoltage/Powersupply 2.7 ~3.6V
Operating current
Minimum current delivered by
power supply
Operating temperature range
Ambient temperature range Normal temperature
Package size 18±0.2mm x25.5±0.2mm x 3.1±0.15 mm
Wi-Fi mode Station/SoftAP/SoftAP+Station/P2P
Wi-FiSecurity WPA/WPA2/WPA2-Enterprise/WPS
Encryption
Subject
Product Specification
Rev1.0
Marketing
Name
M32
HomeKit Wi
-Fimodule
Model No.
FWS703
Page2of11Description
M32 Wi
-Fi2.4GHz
module
support HomeKit
Protocols
Firmware upgrade
Software
Categories Items Specifications
Certification
Wi-Fi
Networkprotocols IPv4, IPv6, SSL, TCP/UDP/HTTP/FTP/MQTT
RFcertification
Wi-Fi certification
Bluetooth certification
Green certification
Frequencyrange 2.4 GHz ~2.5 GHz
UARTDownload/OTA(downloadandwritefirmware via
networkorhost)
FCC/CE/IC/TELEC/KCC/SRRC/NCC
Wi-FiAlliance
BQB
RoHS/REACH
802.11 b/g/n (802.11n up to150 Mbps)
Table 1: M32 Module Specifications
2. Pin Definitions
2.1 Pin Layout
Figure 1: M32 Pin Layout
Subject
Product Specification
Rev1.0
Marketing
Name
M32
HomeKit Wi
-Fimodule
Model No.
FWS703
Page3of11Description
M32 Wi
-Fi2.4GHz
module
support HomeKit
2.2 Pin Description
M32 has 38 pins. See pin definitions in Table 2.
Table 2: Pin Definitions
Name No. Type Function
GND
3V3 2
EN
SENSOR_VP
SENSOR_VN
IO34 6
IO35 7
IO32 8 I/O
IO33 9 I/O
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
1
3
4
5
P
P
I
I
I
I
I
Ground
Power supply.
Chip-enablesignal. Active high.
GPIO36,SENSOR_VP,ADC_H,ADC1_CH0,RTC_GPIO0
GPIO39,SENSOR_VN,ADC1_CH3,ADC_H,RTC_GPIO3
GPIO34, ADC1_CH6, RTC_GPIO4
GPIO35, ADC1_CH7, RTC_GPIO5
GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
GPIO33,XTAL_32K_N(32.768kHzcrystaloscillatoroutput),ADC1_CH5,
TOUCH8, RTC_GPIO8
Name No. Type Function
IO14 13 I/O
IO12 14 I/O
GND
IO13 16 I/O
SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD*
SCK/CLK*
SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO15 23 I/O
IO2 24 I/O
15
19 I/O
20 I/O
P
GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,
SD_CLK,EMAC_TXD2
GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15,
HS2_DATA2, SD_DATA2, EMAC_TXD3
Ground
GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
HS2_DATA3, SD_DATA3, EMAC_RX_ER
GPIO11,SD_CMD, SPICS0,HS1_CMD,U1RTS
GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD,
SD_CMD,EMAC_RXD3
GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,SD_DATA0
MTDI,
HSPIQ,
Subject
Product Specification
Rev1.0
Marketing
Name
M32
HomeKit Wi
-Fimodule
Model No.
FWS703
Page4of11Description
M32 Wi
-Fi2.4GHz
module
support HomeKit
bit LX6 microprocessors. The internal memory
IO0 25 I/O
IO4 26 I/O
IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 29 I/O
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND
Note:
32 - -
38
P
GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,SD_DATA1,
EMAC_TX_ER
GPIO5,VSPICS0,HS1_DATA6,EMAC_RX_CLK
Ground
EMAC_TX_CLK
*
Pins
SCK/CLK,
connectedtothe
SDO/SD0,
integrated SPI flash integrated on
SDI/SD1,
SHD/SD2, SWP/SD3
3. Functional Description
This chapter describes the modules and functions
3.1 CPU and Internal Memory
M32 contains two low-power Xtensa® 32includes:
• 448 kB of ROM for booting and core functions.
• 520 kB (8 kB RTC FAST Memory included) of on-chip SRAM for data and instruction.
• 8 kB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the
co-processor during the Deep-sleep mode.
• 1 Kbit of eFuse, of which 320 bits are used for the system (MAC address and chip
configuration) and the remaining 704 bits are reserved for customer applications,
including Flash-Encryption and Chip-ID.
and
SCS/CMD,
M32
andare notrecommended
namely,GPIO6toGPIO11are
for
other
uses.
3.2 External Flash and SRAM
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