METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
HP1 Series for Single TO-3 or Stud Mount Devices
Series HP1
Technical
DESCRIPTION OF CURVES
A. N.C. Horiz. Device
Only Mounted to G-10.
A. N.C. Horiz. & Vert.
With Dissipator.
B. 200 RPM w/Diss.
C. 500 RPM w/Diss.
E. 1000 RPM w/Diss.
• Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.
• Derate 1.0 °C/watt for unplated part in natural convection only.
Ordering Information
Unplated Comm’l. Black
HP1-000-U
HP1-TO3-U
HP1-TO3-33U
HP1-TO3-44U
HP1-436-U
HP1-TO6-U
HP1-TO15-U
HP1-420-U
IERC PART NO.
Anodize
HP1-000-CB
HP1-TO3-CB
HP1-TO3-33CB
HP1-TO3-44CB
HP1-436-CB
HP1-T06-CB
HP1-TO15-CB
HP1-420-CB
Mil. Black
Anodize
HP1-000-B
HP1-TO3-B
HP1-TO3-33B
HP1-TO3-44B
HP1-436-B
HP1-T06-B
HP1-TO15-B
HP1-420-B
Semiconductor
Accommodated
Undrilled
TO-3
TO-3 IC
TO-3 panel mount
TO-3 (4-pin)
TO-6, TO-36
TO-15, DO-5
Universal
Hole patt.
Ref. No.
(see pg.
1-28)
-16
17
31
18
19
23
27
Max. Weight
(Grams)
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
HP1 Series for Single TO-66 Outline
DESCRIPTION OF CURVES
B. N.C. Horiz. Device
Only Mounted to G-10.
D. N.C. Horiz. & Vert.
With Dissipator.
E. 200 RPM w/Diss.
F. 500 RPM w/Diss.
E. 1000 RPM w/Diss.
• Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.
• Derate 1.0 °C/watt for unplated part in natural convection only.
Ordering Information
Unplated Comm’l. Black
HP1-TO66-U
HP1-TO66-35U
HP1-TO66-49U
IERC PART NO.
Anodize
HP1-TO66-CB
HP1-TO66-35CB
HP1-TO66-49CB
Mil. Black
Anodize
HP1-TO66-B
HP1-TO66-35B
HP1-TO66-49B
Semiconductor
Accommodated
TO-66
TO-66 IC
TO-66 IC (Socket)
Hole patt.
Ref. No.
(see pg.
1-28)
24
25
26
Max. Weight
(Grams)
35.0
35.0
35.0
HP1 Series for Dual TO-66 Outline
DESCRIPTION OF CURVES
C. N.C. Horiz. Device
Only Mounted to G-10.
G. N.C. Horiz. & Vert.
With Dissipator.
H. 200 RPM w/Diss.
I. 500 RPM w/Diss.
E. 1000 RPM w/Diss.
• Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.
• Derate 2.0 °C/watt per device for unplated part in natural convection only.
• Case Temperatures Match Within 2°C at equivalent power levels.
Ordering Information
Unplated Comm’l. Black
HP1-TO66-4U
HP1-TO66-36U
IERC PART NO.
Anodize
HP1-TO66-4CB
HP1-TO66-36CB
Mil. Black
Anodize
HP1-TO66-4B
HP1-TO66-36B
Semiconductor
Accommodated
Two TO-66s
Two TO-66 Ics
Hole patt.
Ref. No.
(see pg.
1-30)
32
34
Max. Weight
(Grams)
35.0
35.0
HP1 Series for Three TO-66 Outline
DESCRIPTION OF CURVES
D. N.C. Horiz. Device
Only Mounted to G-10.
J. N.C. Horiz. & Vert.
With Dissipator.
K. 200 RPM w/Diss.
L. 500 RPM w/Diss.
E. 1000 RPM w/Diss.
• Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.
• Derate 3.0 °C/watt per device for unplated part in natural convection only.
• Case Temperatures Match Within 2°C at equivalent power levels in natural convection.
Ordering Information
Unplated Comm’l. Black
HP1-TO66-8U
HP1-TO66-39U
IERC PART NO.
Anodize
HP1-TO66-8CB
HP1-TO66-39CB
Mil. Black
Anodize
HP1-TO66-8B
HP1-TO66-39B
Semiconductor
Accommodated
Two TO-66s
Two TO-66 Ics
Hole patt.
Ref. No.
(see pg.
1-30)
33
35
Max. Weight
(Grams)
35.0
35.0
16. Hole pattern no. 1 accommodates T0-3s. Available in UP,
HOLE PATTERNS
UP1, UP2, HP1, and HP3 series heat dissipators.
17. Hole pattern no. 202 accommodates T0-3 ICs. Available in
UP, UP1, UP2, HP1, and HP3 series heat dissipators.
18. Hole pattern no. 436 accommodates t0-3s (4-pin). Available
in UP, UP1, UP2, HP1, and HP3 series heat dissipators.
19. Hole pattern no. 2 accommodates T0-6s or T0-36s.
Available in UP, UP1, UP2, HP1, and HP3 series heat
dissipators.
23. Hole pattern no. 3 accommodates TO-15s, DO-5s and other
¼” stud mount devices. Available in UP, UP1, UP2, HP1, and
HP3 series heat dissipators.
24. Hole pattern no. 114 accommodates TO-66s. Available in
UP, UP1, UP2, HP1, and HP3 series heat dissipators.
25. Hole pattern no. 199 accommodates TO-66 ICs. Available in
UP, UP1, UP2, HP1, and HP3 series heat dissipators.
31. Hole pattern no. 213 accommodates one TO-3 (panel
mounted). Available in HP1 and HP3 series heat dissipators
only.
26. Hole pattern no. 226 accommodates TO-66 ICs (socket).
Available in UP, UP1, UP2, HP1, and HP3 series heat
dissipators.
32. Hole pattern no. 150 accommodates two TO-66s. Available
in HP1 and HP3 series heat dissipators only.
33. Hole pattern no. 185 accommodates three TO-66s.
Available in HP1 and HP3 series heat dissipators only.
34. Hole pattern no. 201 accommodates two TO-66s ICs.
Available in HP1 and HP3 series heat dissipators only.
35. Hole pattern no. 203 accommodates three TO-66 ICs.
Available in HP1 and HP3 series heat dissipators only.
27. Hole pattern no. 420 (Universal) accommodates T0-3s, T066s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2,
HP1, and HP3 series heat dissipators.
CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872
Rev. 03-15-04
Loading...