CREE CXXX-CB290-S0100 Datasheet

G•SiC® Technology

SuperBright™ LEDs

CXXX-CB290-S0100

Features Applications

• High Performance

– 2.0mW (460nm) Deep Blue
– 2.0mW (470nm) Blue
– 1.5mW (505nm) Signal Green
– 1.0mW (527nm) Green

• Sorted to Wavelength and Power Bins

• Single Wire Bond Structure

• Class II ESD Rating

• Outdoor LED Video Displays

• White LEDs

• Automotive Dashboard Lighting

• Cellular Phone Backlighting

• Audio Product Display Lighting

• Entertainment and Amusement

Description

Cree's CB™ series of SuperBright™ LEDs combine highly efficient InGaN materials with Cree's
proprietary SiC substrate to deliver excellent price performance for high intensity blue and green LEDs.
These LED chips have an industry-standard vertical chip structure, which requires only a single wire bond
connection. Sorted Die Kits provide die sheets conveniently sorted into wavelength and radiant flux bins.
Cree's CB series chips are individually tested for conformity to optical and electrical specifications and
the ability to withstand 1000V ESD. These LEDs are useful in a broad range of applications such as
outdoor and indoor full motion LED video signs, transportation signaling and white LEDs, yet can also be
used in high volume applications such as LCD backlighting. Cree's CB series chips are compatible with
most radial and SMT LED assembly processes.

CXXX-CB290-S0100 Chip Diagram

Topside View

G

•

SiC® LED Chip

300 x 300 µm

Mesa (junction)
240 x 240 µm

Gold Bond Pad
120 µm Diameter

Anode (+)

Die Cross Section

h = 250

µm

Backside
Metallization

Cathode (-)

InGaN

SiC Substrate

CPR3U Rev. H
© 1998-2002 Cree, Inc. All Rights Reserved.

G•SiC® Technology

SuperBright™ LEDs

CXXX-CB290-S0100

Maximum Ratings at TA = 25°C

Notes 1&3

CXXX-CB290-S0100
DC Forward Current 30 mA

Peak Forward Current (1/10 duty cycle @ 1kHz) 100 mA
LED Junction Temperature 125°C
Reverse Voltage 5 V
Operating Temperature Range -20°C to +80°C
Storage Temperature Range -30°C to +100°C
Electrostatic Discharge Threshold (HBM)

Note 2

1000 V

Electrostatic Discharge Classification (MIL-STD-883E)

Note 2

Class 2

Typical Electrical/Optical Characteristics at TA = 25°C, If = 20mA

Note 3

Part Number

Forward Voltage

(V

f,

V)

Reverse Current

[I(Vr=5V), µA]

Peak Wavelength

(λ

p,

nm)

Halfwidth

(λ

D,

nm)

Optical Rise Time

(τ, ns)

Typ Max Max Typ Typ Typ

C460CB290-S0100 3.3 3.7 10 458 26 30

C470CB290-S0100 3.3 3.7 10 468 26 30

C505CB290-S0100 3.3 3.7 10 502 30 30

C525CB290-S0100 3.3 3.7 10 523 36 30

Mechanical Specifications

CXXX-CB290-S0100
Description Dimension Tolerance

P-N Junction Area (µm) 240 x 240 ± 25
Bottom Area (µm) 300 x 300 ± 25
Chip Thickness (µm) 250 ± 25
Au Bond Pad Diameter (µm) 120 ± 20
Au Bond Pad Thickness (µm) 1.2 ± 0.5
Back Contact Metal Width (µm) 19.8 -5,+10

Notes:

1) Maximum ratings are package dependent. The above ratings were determined using a T-1 3/4 package (with Hysol OS4000 epoxy) for characterization.
Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by the die but by the effect of the LED junction temperature on the
package. The junction temperature limit of 125°C is a limit of the T-1 3/4 package; junction temperature should be characterized in a specific package to
determine limitations. Assembly processing temperature must not exceed 350°C (< 15 minutes).

2) Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche energy test (RAET). The
RAET procedures are designed to approximate the maximum ESD ratings shown. The RAET procedure is performed on each die. The ESD classification of
Class II is based on sample testing according to MIL-STD 883E.

3) All Products conform to the listed minimum and maximum specifications for electrical and optical characteristics, when assembled and operated at 20 mA
within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are within the range of average values expected by the
manufacturer in large quantities and are provided for information only. All measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000
epoxy). Optical characteristics were measured in a Photoresearch Spectrascan Integrating Sphere. Illuminance E.

4) Specifications are subject to change without notice.

CPR3U Rev. H
© 1998-2002 Cree, Inc. All Rights Reserved.