Intel LGA socket 2011-v3 / 2011 / 1366 /
Hyper 212X
The hyper 212X includes a PWM controlled fan and prov ides
incredible 9 dBA low noise with a maximum of only 27.2 dBA.
Exclusive CDC™ and X-Vent technology, Funnel shaped
aluminum fins and a series of perforat ed dimples create a CPU
cooler that is optimized for great heat dissipation.
The universal bracket designs ens ur e easy and worry free
installation on every platform.
Exclusive X-Vent Technology - Vents are placed at a
45 degrees angle around each heatpip e.
Patent “V” Shaped Array - Funnel shaped aluminum
fins and a series of perforated dimples guide the
airflow towards the heatpipes.
Patented CDC™ Technology - 4 Continuous Direct
Contact Heatpipes create a gap-les s contact surface.
Optimized fin design - Aluminum Fin Array with Tunnel
Effect layout creates micro vortices that boost the
airflow and circulate it around the heatpipes.
Package Information
EAN Code 4719512050125
UPC Code 884102027567
Package Dimensions 90 x 157 x 228 mm
(3.5 x 6.2 x 9.0 inch)
Carton Dimensions 475 x 330 x 255 mm
(18.7 x 13.0 x 10.0 inch)
Unit / Carton 10 pcs
Carton / Pallet 42 pcs
Specification
CPU Socket
Dimensions
Heatsink Dimensions
Heatsink Material
Heatsink Weight
Heatpipe Dimensions
Fan Dimensions
Fan Speed
Fan Air Flow
Fan Air Pressure
Fan Life Expectancy
Noise Level
Bearing Type
Connector
Rated Voltage
Rated Current
Warranty
1151/1150/1156/1155/775
AMD Socket FM2+ / FM2 / FM1 / AM3+ /
120 x 79 x 158 mm (4.7 x 3.1 x 6.2 inch)
116 x 51 x 158 mm (4.6 x 2.0 x 6.2 inch)
4 Direct contact heatpipes / Aluminum fins
492g / 1.1lb
Ø6 mm
120 x 120 x 25 mm (4.7 x 4.7 x 1 inch)
600 ~ 1700 RPM (PWM) ± 10%
24.9 ~ 54.65 CFM ± 10%
0.3 ~ 2.03 mm H2O ± 10%
40,000 hours
9 ~ 27.2 dBA
Rifle Bearing
4-Pin
12 VDC
0.1A
2 years
Confidential. All rights reserved.
Positioned in a 45 degree angle and surr ounding the heatpipe,
each fin-blade features X-shaped vents that create areas of high
and low air pressure, resulting in s everal controlled vortices.
4 Continuous Direct Contact Heatpipes create a gap-less
contact surface for unmatched cooling efficiency.
Aluminum Fin Array with Tunnel Effect layout creates micro
vortices that boost the airflow and circulate it around the
heatpipes.
Funnel shaped aluminum fins and a series of perforated dimples
guide the airflow towards the heatp i pes
Supports all current CPU Sockets
BladeMaster 120