Continental Automotive TIS 03 User Manual

Functional description
T
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1. SYSTEM OVERVIEW
The tire pressure monitoring system (referred as TG for Tire Guard) consists of the following u
nits:
- Tire guard wheel unit type TIS-03 which includes an integrated pressure, temperature and
acceleration sensor and a RF transmitter.
- LF receiver unit which includes a LF receiver (not described in this document)
The TG monitors a vehicle's tire pressure while driving or stationary. An electronic unit (wheel unit) inside each tire, mounted to the valve stem, periodically measures the actual tire pressure. By means of RF communication, this pressure information is transmitted to the RF transmitter.
. TECHNICAL DESCRIPTION
2
Carrier frequency: 433.92 MHz Number of channels: 1 Type of modulation: Frequency Shift Keying (FSK) Baud rate: 9600bps Rated Output Power: < 10mW Antenna: Internal Voltage supply range : 2.1 up to 3.2V
3. TYPICAL USAGE PATTERN
3.1 AVERAGE FACTOR CALCULATION (Standard 47 CFR Part 15C (periodic intentional transmitter))
Maximum transmitting duration in whatever 100ms windows: 10.31ms
Averaging factor = 20xlog(10.31/100)=-19.73dB
Note : The time between inter frames is always higher than the 100ms FCC window.
BLOCK DIAGRAM
4.
The block diagram below shows the main electronic units of the wheel unit:
Sensor Block Diagram
FXTH870x5
(P ress ure ,
te m per a tur e,
a cce le rat io n se ns o r,
µ co nt roll er & R F
T ran s m i tte r)
C rys tal :2 6M Hz
4 3 3. 92M H z o r 3 1 5M H z
R F C IRC UI T (T un n in g C om pon en ts)
A NT E NN A
Le ar nin g LF co il
(1 a xe C oil @
1 25 KH z)
L I TH I UM
B A TT E RY
3 V C R 20 5 0H R
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IC Block Diagram: FXTH870x5
he FXTH870x5 contains:
T
• Microcontroller with accelerometer and pressure sensor interfaces,
and RF transmitter (MCU)
• Optional ranges on pressure transducers
• Z-axis acceleration transducer
The MCU interfaces to the RF transmitter using a standard memory mapped registers. The transducers connect to the MCU using custom analog interfaces and inter-chip bonding wires.
5. PICTURE
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6. LABEL
1.1. U
SA
Continental TIS-03 FCC ID: KR5TIS-03
his device complies with Part 15 of the FCC Rules. Operation is subject to the following
T two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
1.2. CANADA
Continental TIS-03 IC: 7812D-TIS03
Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
4
of 4
FXTH870x6
Top and bottom view
Top view
Pin connections
24-Pin, 1-hole lid
7 x 7 QFN
20
21
22
23
24
18
PTA3
LFA
LFB
BKGD/PTA4
X0
X1
17
19
2
3
4
5
6
7
PTB1
PTA2
PTA1
8
1
RESET
10
11
12
13
14
15
V
DD
V
DDA
V
SSA
V
REG
RF
16
9
PTB0
N/C
N/C
N/C
N/C
N/C
ID Feature on top lid
PTA0
V
SS
RFV
SS
Freescale Semiconductor Document Number: FXTH870x6
Data Sheet: Advance Information Rev. 1.5, 02/2015
An Energy-Efficient Solution by Freescale
FXTH870x6 Tire Pressure Monitor Sensor
The FXTH870x6 family is comprised of the following functions all within the same package.
Features
Pressure sensor with one of two calibrated pressure ranges — 100 - 450 kPa — 100 - 900 kPa
Temperature sensor
Optional XZ- or Z-axis accelerometer with adjustable offset option
Voltage reference measured by ADC10
Six-channel, 10-bit analog-to-digital converter (ADC10) with two external
I/O inputs
8-bit MCU — S08 Core with SIM and interrupt — 512 RAM — 8K FLASH (in addition to 8K providing factory firmware and trim
Dedicated state machines to sequence routine measurement and
transmission processes for reduced power consumption
Internal 315-/434-MHz RF transmitter
Differential input LF detector/decoder on independent signal pins
Seven multipurpose GPIO pins
Real-Time Interrupt driven by LFO with interrupt intervals of
8, 16, 32, 64, 128, 256, 512 or 1024 ms
Low-power, wakeup timer and periodic reset driven by LFO
Watchdog timeout with selectable times and clock sources
Two-channel general purpose timer/PWM module (TPM1)
This document contains information on a new product. Specifications and information herein are subject to change without notice.
© 2014-2015 Freescale Semiconductor, Inc. All rights reserved.
data)
— 64-byte, low-power, parameter registers
— External crystal oscillator — PLL-based output with fractional-n divider — OOK and FSK modulation capability — Programmable data rate generator — Manchester, Bi-Phase or NRZ data encoding — 256-bit RF data buffer variable length interrupt — Direct access to RF transmitter from MCU for unique formats — Low power consumption (less than 8 mA at 434 MHz, 5 dBM at
3.0 V, 25 °C)
— Four pins can be connected to optional internal pullups/pulldowns and STOP4 wakeup interrupt — Two of seven pins can be connected to a channel on the ADC10 — Two of seven pins can be connected to a channel on the TPM1
Internal oscillators
Related Documentation
The FXTH870x6 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents:
1. Go to the Freescale homepage at:
http://www.freescale.com/
2. In the Keyword search box at the top of the page, enter the device number FXTH870x6.
— MCU bus clock of 0.5, 1, 2 and 4 MHz (1, 2, 4 and 8 MHz HFO) — Low frequency, low power time clock (LFO) with 1 ms period — Medium frequency, controller clock (MFO) of 8 sec period
Low-voltage detection
Normal temperature restart in hardware (over- or under-temperature detected by software)
ORDERING INFORMATION
Part number Accelerometer axis Package Range Code1
FXTH8705026T1 Z 2264 (7 x 7, 1-hole lid) 100-450 kPa $08 FXTH8705116T1 XZ 2264 (7 x 7, 1-hole lid) 100-450 kPa $0C FXTH8709026T1 Z 2264 (7 x 7, 1-hole lid) 100-900 kPa $18 FXTH8709116T1 XZ 2264 (7 x 7, 1-hole lid) 100-900 kPa $1C FXTH8709126T1 XZ Ext. Range 2264 (7 x 7, 1-hole lid) 100-900 kPa $1E
Code1 Code0
FXTH8709226T1 XZ 2264 (7 x 7, 1-hole lid) 100-900 kPa $1C Rel11
Sensors Freescale Semiconductor, Inc. 2
FXTH870x6
Contents
1 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 Overall Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.2 Multi-Chip Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.3 System Clock Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.4 Reference Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2 Pins and Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2 Recommended Application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Signal Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2 RUN Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.3 WAIT Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.4 ACTIVE BACKGROUND Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.5 STOP Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1 MCU Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.2 Reset and Interrupt Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.3 MCU Register Addresses and Bit Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.4 High Address Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.5 MCU Parameter Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.6 MCU RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.7 FLASH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.8 Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.9 FLASH Registers and Control Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5 Reset, Interrupts and System Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.2 MCU Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.3 Computer Operating Properly (COP) Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.4 SIM Test Register (SIMTST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.6 Low-Voltage Detect (LVD) System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.7 System Clock Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.8 Keyboard Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.9 Real Time Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.10 Temperature Sensor and Restart System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.11 Reset, Interrupt and System Control Registers And Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.12 System STOP Exit Status Register (SIMSES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6 General Purpose I/O. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6.1 Unused Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.2 Pin Behavior in STOP Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.3 General Purpose I/O Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.4 Port A Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.5 Port B Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7 Keyboard Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.4 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.5 Register Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.6 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
8 Central Processing Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
8.3 Programmer’s Model and CPU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
8.4 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
8.5 Special Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
8.6 HCS08 Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
. . . . . . . . . . . . . . . . . . . . 52
FXTH870x6
Sensors Freescale Semiconductor, Inc. 3
9 Timer Pulse-Width Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
9.2 TPM1 Configuration Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
9.3 External Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
9.4 Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
9.5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
9.6 TPM1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
10 .Other MCU Resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
10.1 Pressure Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
10.2 Temperature Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
10.3 Voltage Measurements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
10.4 Optional Acceleration Measurements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
10.5 Optional Battery Condition Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
10.6 Measurement Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
10.7 Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
11 Periodic Wakeup Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
11.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
11.2 Wakeup Divider Register - PWUDIV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
11.3 PWU Control/Status Register 0 - PWUCS0. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
11.4 PWU Control/Status Register 1 - PWUCS1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
11.5 PWU Wakeup Status Register - PWUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
11.6 Functional Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
12 LF Receiver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
12.2 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
12.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
12.4 Input Amplifier. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
12.5 LFR Data Mode States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
12.6 Carrier Detect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
12.7 Auto-Zero Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
12.8 Data Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
12.9 Data Clock Recovery and Synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
12.10 Manchester Decode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
12.11 Duty-Cycle For Data Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
12.12 Input Signal Envelope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
12.13 Telegram Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
12.14 Error Detection and Handling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
12.15 Continuous ON Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
12.16 Initialization Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
12.17 LFR Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
13 RF Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
13.1 RF Data Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
13.2 RF Output Buffer Data Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
13.3 Transmission Randomization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
13.4 RFM in STOP1 Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
13.5 Data Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
13.6 RF Output Stage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.7 RF Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
13.8 Datagram Transmission Times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
13.9 RFM Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
13.10 RFM Control Register 1 - RFCR1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
13.11 RFM Control Register 2 - RFCR2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
13.12 RFM Control Register 3 - RFCR3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
13.13 RFM Control Register 4 - RFCR4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
13.14 RFM Control Register 5 - RFCR5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
13.15 RFM Control Register 6 - RFCR6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
13.16 RFM Control Register 7 - RFCR7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
13.17 PLL Control Registers A- PLLCR[1:0], RPAGE = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
13.18 PLL Control Registers B- PLLCR[3:2], RPAGE = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
13.19 EPR Register - EPR (RPAGE = 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
13.20 RF DATA Registers - RFD[31:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
13.21 VCO Calibration Machine. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
. . . . . . . . . . . . . . . . . . . . 121
FXTH870x6
Sensors
4 Freescale Semiconductor, Inc.
14 Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
14.1 Software Jump Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
14.2 Function Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
14.3 Memory Resource Usage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
15 Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
15.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
15.2 Background Debug Controller (BDC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
15.3 Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
16 Battery Charge Consumption Modeling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
16.1 Standby Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
16.2 Measurement Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
16.3 Transmission Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
16.4 Total Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
17 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
17.1 Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
17.2 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
17.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
17.4 Power Consumption (MCU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
17.5 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153
17.6 Voltage Measurement Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154
17.7 Temperature Measurement Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155
17.8 Pressure Measurement Characteristic (100 to 450 kPa ranges) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156
17.9 Pressure Measurement Characteristic (100 to 900 kPa Ranges) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
17.10 Optional Acceleration Sensor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
17.11 LFR Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161
17.12 LFR Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
17.13 LFR Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
17.14 RF Output Stage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
17.15 Power Consumption RF Transmissions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
18 Mechanical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
18.1 Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
18.2 Media Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
18.3 Mounting Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
19 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
20 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
FXTH870x6
Sensors Freescale Semiconductor, Inc. 5
1 General Information
1.1 Overall Block Diagram
The block diagram of the FXTH870x6 is shown in Figure 1. This diagram covers all the main blocks mentioned above and their main signal interactions. Power management controls and bus control signals are not shown in this block diagram for clarity.
1.2 Multi-Chip Interface
The FXTH870x6 contains two to three devices using the best process technology for each.
Microcontroller with accelerometer and pressure sensor interfaces, and RF transmitter (MCU)
Optional ranges on pressure transducers
Optional XZ- or Z-axis acceleration transducer As shown in Figure 1 the MCU interfaces to the RF transmitter using a standard memory mapped registers. The transducers
connect to the MCU using custom analog interfaces and inter-chip bonding wires.
1.3 System Clock Distribution
The various clock sources and their distribution are shown in Figure 2. All clock sources except the low frequency oscillator, LFO, can be turned off by software control in order to conserve power.
FXTH870x6
Sensors
6 Freescale Semiconductor, Inc.
8K USER
FLASH
MEMORY
RAM
MEMORY
512
TPM1
TIMER/PWM
2-CHAN
LVD
RTI
TIMER
MCU CORE
S08
AV
DD
TEMP
AV
DD
AV
SS
TEMP
SENSOR
PRESS
SENSOR
BANDGAP
REF
LFA
PTA1
ADC10
10-BIT
6-CHAN
TEMP
BKGD
/
LFB
64 Byte
PARAMETER
REGISTER
DATA
ENCODE
BIT
RATE
256-BIT
DATA
BUFFER
RF
AMP
VCO/PLL
FRACTL
DIVIDER
XTAL
OSC
XI
XO
RF
MCU
TRANSDUCERS
VOLT
REG
RESTART
OSC
GEN
PWU
TIMER
MFO
8 Sec
RESET
LF
RECVR
D
X
V
SENS
V
TP
V
0
LFO
1 ms
LFI
SMI
Z
HFO
1, 2, 4 or 8
MHz
GP I/O
KEY
KBI
BOARD
WAKEUP
MFO
8K
FIRMWARE
MEMORY
PTA0
P
SENSOR MEASUREMENT
(SMI)
RF CONTROLLER
INTERF A CE
LFO
(LFR)
RFM
V
REG
PTA2
V
DD
V
DD
V
SS
RV
SS
PTA3
V
1
V
2
RF LVD
AV
DD
RFV
DD
V
REG
PTB0
PTB1
PTA4
XZ
XZ
ACCEL
(OPTION)
Z
ACCEL
(OPTION)
Figure 1. FXTH870x6 Overall Block Diagram
FXTH870x6
Sensors Freescale Semiconductor, Inc. 7
RTI
SYSTEM
CONTROL
LOGIC
2
HFO OSC
1, 2, 4,
f
OSC
f
BUS
CPU
BDC
TPM1
RAM FLASH
LFR
ADC10
MFO OSC
8 Sec
PWU
CLSA, CLKSB
f
LFO
(1 kHz)
XTL
OSC
26 MHz
XI XO
PLL VCO
BIT
RATE
DATA
BUFFER
PRESSURE
SENSOR
TRANSDUCERS
MCU
RTICLKS
PAR
REG
f
MFO
f
XCO
GEN
D
X
(500 kHz)
LFO
OSC
1 mS
PERIOD
SENSOR MEASUREMENT
INTERFACE
ADC10
CLOCK
ADCCLK ADC10
BUSCLKS[1:0]
WATCH
DOG
COPCLKS
Z-AXIS
SENSOR
LF
4 kbps
(125 kHz)
RF STATE MACHINE
LFRO
OSCILL
8
TCLKDIV
LFOSEL
f
MFO
PTA3
PTA2
f
LFO
(1 kHz)
CH0 CH1
RANDOM
(0 - 1 MHz)
RANDOM
(0 - 1 MHz)
RF
OUT
41.67 kHz Sampling
41.67 kHz Sampling
and 8 MHz
X-AXIS
SENSOR
41.67 kHz Sampling
Figure 2. Clock Distribution
1.4 Reference Documents
The FXTH870x6 utilizes the standard product MC9S08 CPU core. The user can obtain further detail on the full capabilities of this core by referring to the HCS08 Family Reference Manual (HCS08RMV1).
FXTH870x6
8 Freescale Semiconductor, Inc.
Sensors
2 Pins and Connections
20
21
22
23
24
18
PTA3
LFA
LFB
BKGD/PTA4
X0
X1
17
19
2
3
4
5
6
7
PTB1
PTA2
PTA1
8
1
RESET
10
11
12
13
14
15
V
DD
V
DDA
V
SSA
V
REG
RF
16
9
PTB0
N/C
N/C
N/C
N/C
N/C
ID Feature on top lid
PTA0
V
SS
RFV
SS
N/C = No Connect: Do not connect PCB pads to signal traces, power/ground or multi-layer via.
Top View
BKGD/PTA4
X-AXIS
ORIENTATION
+X
-X
Y-AXIS
ORIENTATION
+Y
-Y
Side View
Pressure
Port
POSITIVE ACCELERATION MOVES MASS IN +Z DIRECTION (VALUE INCREASES)
Z-AXIS
ORIENTATION
+Z
-Z
This section describes the pin layout and general function of each pin.
2.1 Package Pinout
The pinout for the FXTH870x6 device QFN package is shown in Figure 3 for the orientation of the pressure port up. The orientation of the internal Z-axis accelerometer is shown in Figure 4.
Figure 3. FXTH870x6 QFN Package Pinout
2.2 Recommended Application
Example of a simple OOK/FSK tire pressure monitors using the internal PLL-based RF output stage is shown in Figure 5. Any of the PTA[3:0] pins can also be used as general purpose I/O pins. Any of the PTA[3:0] pins that are not used in the application should be handled as described in Section 6.1.
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Figure 4. FXTH870x6 QFN Optional Z-axis Accelerometer Orientation
FXTH870x6
2.3 Signal Properties
FXTH870xxx
0.1 µF
V
DD
V
SS
3.0 V
BATTERY
LF
COIL
XTAL
RF
RV
SS
XI
XO
C1
ANT
L1
BKGD/PTA4
LFA
LFB
PTA1
RESET
GENERAL
PURPOSE I/O
PTA0
PTA2
AV
DD
AV
SS
V
REG
470 nF
0.1 µF
PTA3
MATCHING
NETWORK
C2
C3
C2, C3, C4 optimized for crystal
C5
C4*
R2
R3
R2 and R3, <10 k
recommended for
highest EMC resistance
R1
PTB0 PTB1
L1 and matching network optimized for specific PWB and antenna layout. Recommend 0603 minimum size for L1 and other matching network inductors for maximum efficiency.
C1 and R1 optimized for coil used, but recommended RC < 15.3 sec.
The device C
4
, although drawn here as a capacitor, may be any type of passive component(s) sufficient to block or reduce unwanted external radiated signals from corrupting the crystal oscillator circuit: PCB traces for the LFA / LFB, A V
DD
/ VDD, and VSS / A VSS pins and bypass capacitors should be minimized to reduce unw anted external
radiated signals from corrupting the power input circuits.
The following sections describe the general function of each pin.
2.3.1 VDD and VSS Pins
The digital circuits operate from a single power supply connected to the FXTH870x6 through the VDD and VSS pins. VDD is the positive supply and V locally decoupled as shown in Figure 6.
Care should be taken to reduce measurement signal noise by separating the V connection such that each metal trace does not share any load currents with other external devices as shown in Figure 6.
2.3.2 AVDD and AVSS Pins
is the ground. The conductors to the power supply should be connected to the VDD and VSS pins and
SS
Figure 5. FXTH870x6 Example Application
The analog circuits operate from a single power supply connected to the FXTH870x6 through the AVDD and AVSS pins. AVDD is the positive supply and AVSS is the ground. The conductors to the power supply should be connected to the AVDD and AVSS pins and locally decoupled as shown in Figure 6.
, VSS, A VDD, A VSS and RVSS pins using a “star”
DD
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10 Freescale Semiconductor, Inc.
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Care should be taken to reduce measurement signal noise by separating the V
0.1 µF
FXTH870xxx
V
DD
V
SS
to other
Battery
I
DD
I
LOAD
Bypass capacitors closely coupled to the package pins
FXTH870xxx and Other Load Currents star connected to battery terminals
loads
0.1 µF
AV
DD
AV
SS
RV
SS
The decoupling devices, although drawn here as 0.1 F capacitors, may be any type of passive component(s) sufficient to block or reduce unwanted external radiated signals from corrupting the power input protection circuits; application tuning may be required.
connection such that each metal trace does not share any load currents with other external devices as shown in Figure 6.
Figure 6. Recommended Power Supply Connections
, VSS, A VDD, A VSS and RVSS pins using a “star”
DD
2.3.3 V
The internal regulator for the analog circuits requires an external stabilization capacitor to AVSS.
REG
Pin
2.3.4 RVSS Pin
Power in the RF output amplifier is returned to the supply through the RVSS pin. This conductor should be connected to the power supply as shown in Figure 6 using a “star” connection such that each metal trace does not share any load currents with other supply pins.
2.3.5 RF Pin
The RF pin is the RF energy data supplied by the FXTH870x6 to an external antenna.
2.3.6 XO, XI Pins
The XO and XI pins are for an external crystal to be used by the internal PLL for creating the carrier frequencies and data rates for the RF pin.
2.3.7 LF[A:B] Pins
The LF[A:B] pins can be used by the LF receiver (LFR) as one differential input channel for sensing low level signals from an external low frequency (LF) coil. The external LF coil should be connected between the LFA and the LFB pins.
Signaling into the LFR pins can place the FXTH870x6 into various diagnostic or operational modes. The LFR is comprised of the detector and the decoder.
Each LF[A:B] pin will always have an impedance of approximately 500 k to V pins are used by the LFR when the LFEN con tro l b it is set and are not functional when the LFEN control bit is clear.
2.3.8 PTA[1:0] Pins
The PTA[1:0] pins are general purpose I/O pins. These two pins can be configured as normal bidirectional I/O pins with programmable pullup or pulldown devices and/or wakeup interrupt capability; or one or both can be connected to the two input channels of the A/D converter module. The pulldown devices can only be activated if the wakeup interrupt capability is enabled. User software must configure the general purpose I/O pins so that they do not result in “floating” inputs as described in
Section 6.1. PTA[1:02] map to keyboard Interrupt function bits [1:0].
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due to the LFR input circuitry. The LFA/LFB
SS
FXTH870x6
2.3.9 PTA[3:2] Pins
RESET
0.7 V
DD
0.3 V
DD
> 100 nsec
Reset Initiated
The PTA[3:2] pins are general purpose I/O pin. These two pins can be configured as normal bidirectional I/O pin with programmable pullup or pulldown devices and/or wakeup interrupt capability; or one or both can be connected to the two input channels of the Timer Pulse Width (TPM1) module. The pulldown devices can only be activated if the wakeup interrupt capability is enabled. User software must configure the general purpose I/O pins so that they do not result in “floating” inputs as described in Section 6.1. PTA[3:2] map to keyboard Interrupt function bits [3:2].
2.3.10 BKGD/PTA4 Pin
The BKGD/PTA4 pin is used to place the FXTH870x6 in the BACKGROUND DEBUG mode (BDM) to evaluate MCU code and to also transfer data to/from the internal memories. If the BKGD/PT A4 pin is held low when the FXTH870x6 comes out of a power­on reset the device will go into the ACTIVE BACKGROUND DEBUG mode (BDM).
The BKGD/PTA4 pin has an internal pullup device and can connected to V BDM operation after the device as been soldered into the PWB. If in-circuit BDM is desired the BKGD/PTA4 pin can be left unconnected, but should be connected to VDD through a low impedance resistor (< 10 k) which can be over-driven by an external signal. This low impedance resistor reduces the possibility of getting into the debug mode in the application due to an EMC event.
in the application unless there is a need to enter
DD
2.3.11 RESET Pin
The RESET pin is used for test and establishing the BDM condition and providing the programming voltage source to the internal FLASH memory. This pin can also be used to direct to the MCU to the reset vector as described in Section 5.2.
The RESET operation after the device as been soldered to the PWB. If in-circuit BDM is desired the RESET should be connected to VDD through a low impedance resistor (< 10 k) which can be over-driven by an external signal. This low impedance resistor reduces the possibility of getting into the debug mode in the application due to an EMC event.
Activation of the external reset function occurs when the voltage on the RESET pin goes below 0.3 x V before rising above 0.7 x VDD as shown in Figure 7.
pin has an internal pullup device and can connected to VDD in the application unless there is a need to enter BDM
pin can be left unconnected; but
for at least 100 nsec
DD
Figure 7. RESET Pin Timing
2.3.12 PTB[1:0] Pins
The PTB[1:0] pins are general purpose I/O pins. These two pins can be configured as nominal bidirectional I/O pins with programmable pullup. User software must configure the general purpose I/O pins so that they do not result in “floating” inputs as described in Section 6.1
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3 Modes of Operation
The operating modes of the FXTH870x6 are described in this section. Entry into each mode, exit from each mode, and functionality while in each of the modes are described.
3.1 Features
ACTIVE BACKGROUND DEBUG mode for code development
STOP modes: — System clocks stopped — STOP1: Power down of most internal circuits, including RAM, for maximum power savings; voltage regulator in
standby
— STOP4: All internal circuits powered and full voltage regulation maintained for fastest recovery
3.2 RUN Mode
This is the normal operating mode for the FXTH870x6. This mode is selected when the BKGD/PTA4 pin is high at the rising edge of reset. In this mode, the CPU executes code from internal memory following a reset with execution beginning at address specified by the reset pseudo-vector ($DFFE and $DFFF).
3.3 WAIT Mode
The WAIT mode is also present like other members of the Freescale S08 family members; but is not normally used by the FXTH870x6 firmware or typical TPMS applications.
3.4 ACTIVE BACKGROUND Mode
The ACTIVE BACKGROUND mode functions are managed through the BACKGROUND DEBUG controller (BDC) in the HCS08 core. The BDC provides the means for analyzing MCU operation during software development.
ACTIVE BACKGROUND mode is entered in any of four ways:
When the BKGD/PTA4 pin is low at the rising edge of a power up reset
When a BACKGROUND command is received through the BKGD/PTA4 pin
When a BGND instruction is executed by the CPU
When encountering a BDC breakpoint
Once in ACTIVE BACKGROUND mode, the CPU is held in a suspended state waiting for serial BACKGROUND commands rather than executing instructions from the user’s application program. Background commands are of two types:
Non-intrusive commands, defined as commands that can be issued while the user program is running. Non-intrusive
commands can be issued through the BKGD/PTA4 pin while the MCU is in RUN mode; non-intrusive commands can also be executed when the MCU is in the ACTIVE BACKGROUND mode. Non-intrusive commands include:
— Memory access commands — Memory-access-with-status commands — BDC register access commands — The BACKGROUND command
ACTIVE BACKGROUND commands, which can only be executed while the MCU is in ACTIVE BACKGROUND mode.
ACTIVE BACKGROUND commands include commands to:
— Read or write CPU registers — Trace one user progra m in stru ct io n at a time — Leave ACTIVE BACKGROUND mode to return to the user’s application program (GO)
The ACTIVE BACKGROUND mode is used to program a bootloader or user application program into the FLASH program memory before the MCU is operated in RUN mode for the first time. When the FXTH870x6 is shipped from the Freescale factory, the FLASH program memory is erased by default (unless specifically requested otherwise) so there is no program that could be executed in RUN mode until the FLASH memory is initially programmed.
The ACTIVE BACKGROUND mode can also be used to erase and reprogram the FLASH memory after it has been previously programmed.
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3.5 STOP Modes
One of two stop modes are entered upon execution of a STOP instruction when the STOPE bit in the system option register is set. In all STOP modes, all internal clocks are halted except for the low frequency 1 kHz oscillator (LFO) which runs continuously whenever power is applied to the VDD and VSS pins. If the STOPE bit is not set when the CPU executes a STOP instruction, the MCU will not enter any of the STOP modes and an illegal opcode reset is forced. The STOP modes are selected by setting the appropriate bits in SPMSC2. Table 1 summarizes the behavior of the MCU in each of the STOP1 and STOP4 modes. The STOP2 mode found in other Freescale S08 family members is not available; but the STOP3 mode is present like other members of the Freescale S08 family members.
3.5.1 STOP1 Mode
The STOP1 mode provides the lowest possible standby power consumption by causing the internal circuitry of the MCU to be powered down.
When the MCU is in STOP1 mode, all internal circuits that are powered from the voltage regulator are turned off. The voltage regulator is in a low-power standby state. STOP1 is exited by asserting either a reset or an interrupt function to the MCU.
Entering STOP1 mode automatically asserts LVD. STOP1 cannot be exited until the V
is greater than V
DD
LVDH
or V
LV/DL
rising
(VDD must rise above the LVI re-arm voltage). Upon wakeup from STOP1 mode, the MCU will start up as from a power-on reset (POR) by taking the reset vector.
NOTE
If there are any pending interrupts that have yet to be serviced then the device will not go into the STOP1 mode. Be certain that all interrupt flags have been cleared before entry to STOP1 mode.
3.5.2 STOP4 LVD Enabled in STOP Mode
The L VD system is cap able of generating either an interrupt or a reset when the supply voltage drops below the LVD voltage. If the LVD is enabled by setting the LVDE and the LVDSE bits in SPMSC1 when the CPU executes a STOP instruction, then the voltage regulator remains active during STOP mode. If the user attempts to enter the STOP1 with the LVD enabled in STOP (LVDSE = 1), the MCU will enter STOP4 instead.
Table 1. STOP Mode Behavior
Mode STOP1 STOP4
LFO Oscillator, PWU Always On & Clocking Real-Time Interrupt (RTI) MFO Oscillator HFO Oscillator Off Off CPU Off Standby RAM Off Standby Parameter Registers On On FLASH Off Standby TPM1 2-Chan Timer/PWM Off Off Digital I/O Disabled Standby Sensor Measurement Interface (SMI) Off Optionally On Pressure P-cell Off Optionally On Optional Acceleration g-cell Off Optionally On Temperature Sensor (in ADC10) Off Optionally On Normal Temperature Restart Optionally On Optionally On Voltage Reference (in ADC10) Off Optionally On LFR Detector LFR Decoder Optionally On Optionally On RF Controller, Data Buffer, Encoder Optionally On Optionally On RF Transmitter ADC10 Off Optionally On
(2)
(4)
(5)
(1)
Optionally On Optionally On
Periodically On Periodically On
Optionally On Optionally On
Always On if using LFO as Clock
(3)
(3)
(3)
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Table 1. STOP Mode Behavior (continued)
Mode STOP1 STOP4
Regulator Off On I/O Pins Hi-Z States Held Wakeup Methods Interrupts, resets Interrupts, resets
1. RTI can be used in STOP1 or STOP4 if the clock selected is the LFO. To use the HFO as the clock the MCU must be in the RUN mode.
2. MFO oscillator started if the LFR detectors are periodically sampled, the LFR detectors detect an input signal; a pressure or acceleration reading is in progress or the RF state machine is sending data.
3. Requires internal ADC10 clock to be enabled.
4. Period of sampling set by MCU.
5. RF data buffer may be set up to run while the CPU is in the STOP modes.
Specific to the tire pressure monitoring application the parameter registers and the LFO with wakeup timer are powered up at all times whenever voltage is applied to the supply pins. The LFR detector and MFO may be periodically powered up by the LFR decoder.
3.5.3 Active BDM Enabled in STOP Mode
Entry into the ACTIVE BACKGROUND DEBUG mode from RUN mode is enabled if the ENBDM bit in BDCSCR is set. The BDCSCR register is not memory mapped so it can only be accessed through the BDM interface by use of the BDM commands READ_STATUS and WRITE_CONTROL. If ENBDM is set when the CPU executes a STOP instruction, the s ystem clocks to the BACKGROUND DEBUG logic remain active when the MCU enters STOP mode so BACKGROUND DEBUG communication is still possible. In addition, the voltage regulator does not enter its low-power standby state but maintains full internal regulation. If the user attempts to enter the STOP1 with ENDBM set, the MCU will instead enter this mode which is STOP4 with system clocks running.
Most BACKGROUND commands are not available in STOP mode. The memory-access-with-status commands do not allow memory access, but they report an error indicating that the MCU is in STOP mode. The BACKGROUND command can be used to wake the MCU from stop and enter ACTIVE BACKGROUND mode if the ENDBM bit is set. Once in BACKGROUND DEBUG mode, all BACKGROUND commands are available.
3.5.4 MCU On-Chip Peripheral Modules in STOP Modes
When the MCU enters any STOP mode, system clocks to the internal peripheral modules except the wakeup timer and LFR detectors/decoder are stopped. Even in the exception case (ENDBM = 1), where clocks are kept alive to the BACKGROUND debug logic, clocks to the peripheral systems are halted to reduce power consumption.
I/O Pins
If the MCU is configured to go into STOP1 mode, the I/O pins are forced to their default reset state (Hi-Z) upon entry into stop. This means that the I/O input and output buffers are turned off and the pullup is disconnected.
Memory
All module interface registers will be reset upon wakeup from STOP1 and the contents of RAM are not preserved. The MCU must be initialized as upon reset. The contents of the FLASH memory are non-volatile and are preserved in any of the STOP modes.
Parameter Registers
The 64 bytes of parameter registers are kept active in all modes of operation as long as power is applied to the supply pins. The contents of the parameter registers behave like RAM and are unaffected by any reset.
LFO
The LFO remains active regardless of any mode of operation.
MFO
The medium frequency oscillator (MFO) will remain powered up when the MCU enters the STOP mode only when the SMI has been initiated to make a pressure or acceleration measurement; or when the RF transmitter’s state machine is processing data.
HFO
The HFO is halted in all STOP modes.
PWU
The PWU remains active regardless of any mode of operation.
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ADC10
The internal asynchronous ADC10 clock is always used as the conversion clock. The ADC10 can continue operation during STOP4 mode. Conversions can be initiated while the MCU is the STOP4 mode. All ADC10 module registers contain their reset values following exit from STOP1 mode.
LFR
When the MCU enters STOP mode the detectors in the LFR will remain powered up depending on the states of the bits selecting the periodic sampling. Refer to Section 12 for more details.
Bandgap Reference
The bandgap reference is enabled whenever the sensor measurement interface requires sensor or voltage measurements.
TPM1
When the MCU enters STOP mode, the clock to the TPM1 module stops and the module halts operation. If the MCU is configured to go into STOP1 mode, the TPM1 module will be reset upon wakeup from STOP and must be re-initialized.
Voltage Regulator
The voltage regulator enters a low-power standby state when the MCU enters any of the STOP modes except STOP4 (LVDSE = 1 or ENBDM = 1).
Temperature Sensor
The temperature sensor is powered up on command from the MCU.
Temperature Restart
When the MCU enters a STOP mode the temperature restart will remain powered up if the TRE bit is set. If the temperature restart level is reached the MCU will restart from the reset vector.
3.5.5 RFM Module in STOP Modes
The RFM’s external crystal oscillator (XCO), bit rate generator, PLL, VCO, RF data buffer , data encoder , and RF output stage will remain powered up in STOP modes during a transmission, or if the SEND bit has been set and DIRECT mode has been enabled.
RF Output
When the RFM finishes a transmission sequence the external crystal oscillator (XCO), bit rate generator, PLL, VCO, RF data buffer, data encoder, and RF output stage will remain powered up if the SEND bit is set.
3.5.6 P-cell in STOP Modes
The P-cell is powered up only during a measurement if scheduled by the sensor measurement interface. Otherwise it is powered down.
3.5.7 Optional g-Cell in STOP Modes
The g-cell is powered up only during a measurement if scheduled by the sensor measurement interface. Otherwise it is powered down.
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4Memory
$0000 $004F
$0050 $008F
$1800
$17FF
$182B $182C
$FFFF
$0090
$C000
$BFFF
DIRECT PAGE REGISTERS
RAM 512 BYTES
UNIMPLEMENTED
HIGH PAGE REGISTERS
5488 BYTES
41964 BYTES
$028F $0290
PARAMETER REGISTERS
$DFC0
$DFBF
USER FLASH
8128 BYTES
USER VECTORS
FIRMWARE FLASH
8128 BYTES
$E000
$DFFF
$E040
$E03F
FIRMWARE JUMP TABLE
The overall memory map of the FXTH870x6 resides on the MCU.
4.1 MCU Memory Map
As shown in Figure 8, MCU on-chip memory in the FXTH870x6 consists of parameter registers, RAM, FLASH program memory for nonvolatile data storage, and I/O and control/status registers. The registers are divided into four groups:
Direct-page registers ($0000 through $004F)
Parameter registers ($0050 through $008F)
RAM ($0090 through $028F)
High-page registers ($1800 through $182B)
Figure 8. FXTH870x6 MCU Memory Map
The total programmable FLASH memory map is 16K, but the upper 8K is used for firmware and test software. Upon power up the firmware will initialize the device and redirect all vectors to the user area from $DFC0 through $DFFF . Any calls to the firmware subroutines are accessed through a jump table starting at location $E000 (see Section 14).
4.2 Reset and Interrupt Vectors
Table 2 shows address assignments for jump table to the reset and interrupt vectors. The vector names shown in this table are
the labels used in the equate file provided by Freescale in the CodeWarrior project file.
Table 2. Vector Summary
User Vector Addr Vector Name Module Source
$DFE0:DFE1 Vkbi KBI $DFE2:DFE3 $DFE4:DFE5 $DFE6:DFE7 Vrti Sys Ctrl - RTI
$DFE8:DFE9 Vlfrcvr LFR $DFEA:DFEB Vadc1 ADC10 $DFEC:DFED Vrf RFM
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Reserved Reserved
FXTH870x6
Table 2. Vector Summary (continued)
User Vector Addr Vector Name Module Source
$DFEE:DFEF Vsm SMI
$DFF0:DFF1 Vtpm1ovf TPM1
$DFF2:DFF3 Vtpm1ch1 TPM1
$DFF4:DFF5 Vtpm1ch0 TPM1
$DFF6:DFF7 Vwuktmr PWU
$DFF8:DFF9 Vlvd Sys Ctrl - LVD
$DFFA:DFFB $DFFC:DFFD Vswi SWI opcode
$DFFE:DFFF Vreset
Reserved
Sys Ctrl - POR, PRF, COP, LVD
Temp Restart, Illegal opcode or address
4.3 MCU Register Addresses and Bit Assignments
The registers in the FXTH870x6 are divided into these four groups:
Direct-page registers are located in the first 80 locations in the memory map; these are accessible with efficient direct addressing mode instructions.
The parameter registers begin at address $0050; these are also accessible with efficient direct addressing mode instructions.
High-page registers are used less often, so they are located above $1800 in the memory map. This leaves more room in the direct page for more frequently used registers and variables.
The nonvolatile register area consists of a block of 16 locations in FLASH memory at $FFB0:FFBF. Nonvolatile register locations include:
— Three values that are loaded into working registers at reset — An 8-byte back door comparison key that optionally allows the user to gain controlled access to secure memory.
Because the nonvolatile register locations are FLASH memory, they must be erased and programmed like other FLASH memory locations.
Direct page registers are located within the first 256 locations in the memory map, so they are accessible with efficient direct addressing mode instructions, which requires only the lower byte of the address. Bit manipulation instructions can be used to access any bit in any direct-page register. Table 3 is a summary of all user-accessible direct-page registers and control bits. Those related to the TPMS application and modules are described in detail in this specification.
The register names in column two of the following tables are shown in bold to set them apart from the bit names to the right. Cells that are not associated with named bits are shaded. A shaded cell with a 0 indicates this unused bit always reads as a 0. Shaded cells with dashes indicate unused or reserved bit locations that could read as 1s or 0s.
Table 3. MCU Direct Page Register Summary
AddressRegister NameBit 7654321Bit 0
$0000 PTAD $0001 PTAPE $0002 Reserved $0003 PTADD PTADD[3:0] $0004 PTBD $0005 PTBPE $0006 Reserved $0007 PTBDD PTBDD[1:0] $0008 Reserved $0009 Reserved $000A Reserved $000B Reserved $000C KBISC 0 0 0 0 KBF KBACK KBIE KBIMOD
PTAD[4:0]
PTAPE[3:0]
PTBD[1:0]
PTBPE[1:0]
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Table 3. MCU Direct Page Register Summary (continued)
AddressRegister NameBit 7654321Bit 0
$000D KBIPE KBIPE[3:0] $000E KBIES $000F Reserved $0010 TPM1SC TOF TOIE CPWMS CLKSB CLKSA PS2 PS1 PS0 $0011 TPM1CNTH Bit [15:8] $0012 TPM1CNTL Bit [7:0] $0013 TPM1MODH Bit [15:8] $0014 TPM1MODL Bit [7:0] $0015 TPM1C0SC CH0F CH0IE MS0B MS0A ELS0B ELS0A $0016 TPM1C0VH Bit [15:8] $0017 TPM1C0VL Bit [7:0] $0018 TPM1C1SC CH1F CH1IE MS1B MS1A ELS1B ELS1A $0019 TPM1C1VH Bit [15:8] $001A TPM1C1VL Bit [7:0] $001B Reserved $001C PWUDIV WDIV[5:0] $001D PWUCS0 WUF WUFAK WUT[5:0] $001E PWUCS1 PRF PRFAK PRST[5:0] $001F PWUS PSEL 0 CSTAT[5:0] $0020-27 LFR Registers LFR Registers, see Table 4 and Table 5 $0028 ADSC1 $0029 ADSC2 $002A ADRH $002B ADRL $002C ADCVH $002D ADCVL $002E ADCFG $002F ADPCTL1 $0030-4F RFM Registers RFM Registers, see Table 6 and Table 7 $0050-8F Parameter Reg PARAM[63:0]
Note: Shaded bits are recommended to only be controlled by firmware or factory test.
COCO AIEN ADCO ADCH[4:0]
ADACT ADTRG ACFE ADCFGT 0 0 0 0
0 0 0 0 ADR[11:8]
ADR[7:0]
0 0 0 0 ADCV[11:8]
ADCV[7:0]
ADLPC ADIV[1:0] ADLSMP MODE[1:0] ADICLK[1:0]
ADPC[7:0]
KBEDG[3:0]
0 0
0 0
Table 4. LFR Register Summary - LPAGE = 0
AddressRegister NameBit 7654321Bit 0
$0020 LFCTL1 LFEN SRES CARMOD LPAGE IDSEL[1:0] SENS[1:0] $0021 LFCTL2 LFSTM[3:0] LFONTM[3:0] $0022 LFCTL3 LFDO TOGMOD SYNC[1:0] LFCDTM[3:0] $0023 LFCTL4 LFDRIE LFERIE LFCDIE LFIDIE DECEN VALEN TIMOUT[1:0] $0024 LFS LFDRF LFERF LFCDF LFIDF LFOVF LFEOMF LPSM LFIAK $0025 LFDATA RXDATA[7:0] $0026 LFIDL ID[7:0] $0027 LFIDH ID[15:8]
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Table 5. LFR Register Summary - LPAGE = 1
AddressRegister NameBit 7654321Bit 0
$0020 LFCTL1 LFEN SRES CARMOD LPAGE IDSEL[1:0] SENS[1:0] $0021 LFCTRLE $0022 LFCTRLD AVFOF[1:0} DEQS AZDC[1:0] ONMODE CHK125[1:0] $0023 LFCTRLC AMPGAIN[1:0] FINSEL[1:0] AZEN LOWQ[1:0] DEQEN $0024 LFCTRLB HYST[1:0] LFFAF LFCAF LFPOL LFCPTAZ[2:0] $0025 LFCTRLA TESTSEL[3:0] LFCC[3:0] $0026 Reserved $0027 Reserved Note: Shaded bits are recommended to only be controlled by firmware or factory test.
TRIMEE AZSC[2:0]
Table 6. RFM Register Summary - RPAGE = 0
AddressRegister NameBit 7654321Bit 0
$0030 RFCR0 BPS[7:0] $0031 RFCR1 FRM[7:0] $0032 RFCR2 SEND RPAGE EOM PWR[4:0] $0033 RFCR3 DATA $0034 RFCR4 RFBT[7:0] $0035 RFCR5 BOOST LFSR[6:0] $0036 RFCR6 VCO_GAIN[1:0] RFFT[5:0] $0037 RFCR7 RFIF RFEF RFVF RFIAK RFIEN RFLVDEN RCTS RFMRST $0038 PLLCR0 AFREQ[12:5] $0039 PLLCR1 AFREQ[4:0] POL CODE[1:0] $003A PLLCR2 BFREQ[12:5] $003B PLLCR3 BFREQ[4:0] CF MOD CKREF $003C RFD0 RFD[7:0] $003D RFD1 RFD[15:8] $003E RFD2 RFD[23:16] $003F RFD3 RFD[31:24] $0040 RFD4 RFD[39:32] $0041 RFD5 RFD[47:40] $0042 RFD6 RFD[55:48] $0043 RFD7 RFD[63:56] $0044 RFD8 RFD[71:64]] $0045 RFD9 RFD[79:72] $0046 RFD10 RFD[87:80] $0047 RFD11 RFD[95:88] $0048 RFD12 RFD[103:96] $0049 RFD13 RFD[111:104] $004A RFD14 RFD[119:112] $004B RFD15 RFD[127:120] $004C Reserved $004D Reserved $004E Reserved $004F Reserved
Note: Shaded bits are recommended to only be controlled by firmware or factory test.
IFPD ISPC IFID FNUM[3:0]
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Table 7. RFM Register Summary - RPAGE = 1
AddressRegister NameBit 7654321Bit 0
$0030 RFCR0 BPS[7:0] $0031 RFCR1 FRM[7:0] $0032 RFCR2 SEND RPAGE EOM PWR[4:0] $0033 RFCR3 DATA $0034 RFCR4 RFBT[7:0] $0035 RFCR5 BOOST LFSR[6:0] $0036 RFCR6 VCO_GAIN[1:0] RFFT[5:0] $0037 RFCR7 RFIF RFEF RFVF RFIAK RFIEN RFLVDEN RCTS RFMRST $0038 EPR —/VCD3 PLL_LPF_[2:0]/VCD[2:0] $0039 Reserved $003A Reserved $003B Reserved $003C RFD0 RFD[135:128] $003D RFD1 RFD[143:136] $003E RFD2 RFD[151:144] $003F RFD3 RFD[159:152] $0040 RFD4 RFD[167:160] $0041 RFD5 RFD[175:168] $0042 RFD6 RFD[183:176] $0043 RFD7 RFD[191:184] $0044 RFD8 RFD[199:192] $0045 RFD9 RFD[207:200] $0046 RFD10 RFD[215:208] $0047 RFD11 RFD[223:216] $0048 RFD12 RFD[231:224] $0049 RFD13 RFD[239:232] $004A RFD14 RFD[247:240] $004B RFD15 RFD[255:248] $004C Reserved $004D Reserved $004E Reserved $004F Reserved Note: Shaded bits are recommended to only be controlled by firmware or factory test.
IFPD ISPC IFID FNUM[3:0]
PA_SLOPE VCD_EN
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4.4 High Address Registers
High-page registers are used much less often, so they are located above $1800 in the memory map. This leaves more room in the direct page for more frequently used registers and variables. The registers control system level features as given in Table 8.
Table 8. MCU High Address Register Summary
AddressRegister NameBit 7654321Bit 0
$1800 SRS POR PIN COP ILOP ILAD PWU LVD $1801 SBDFR $1802 SIMOPT1 COPE COPCLKS STOPE RFEN TRE TRH BKGDPE $1803 SIMOPT2 $1804 Reserved $1805 Reserved $1806 SDIDH REV[3:0] ID[11:8] $1807 SDIDL ID[7:0] $1808 SRTISC RTIF RTIACK RTICLKS RTIE
$1809 SPMSC1 LVDF LVDACK LVDIE LVDRE LVDSE LVDE $180A SPMSC2 $180B Reserved $180C SPMSC3 LVWF LVWACK LVDV LVWV 0 0 0 0 $180D SIMSES $180E SOTRM SOTRM[7:0]
$180F SIMTST
$1810-1F Reserved
$1820 FCDIV DIVLD PRDIV8 DIV[5:0]
$1821 FOPT KEYEN FNORED
$1822 Reserved
$1823 FCNFG 0 0 KEYACC 0 0 0 0 0
$1824 FPROT FPS[7:1] FPDIS
$1825 FSTAT FCBEF FCCF FPVIOL FACCERR
$1826 FCMD FERASE FCMD[6:0]
$1827-3F Reserved
Note: Reserved bits shown as 0 must always be written to 0.
Reserved bits shown as 1 must always be written to 1. Shaded bits are recommended to only be controlled by firmware or factory test.
0 0 0 0 0 0 0BDFR
0 COPT[2:0] LFOSEL TCLKDIV BUSCLKS[1:0]
0RTIS{2:0]
0BGBE
0 0 0PDF0 PPDACK PDC 0
KBF IRQF TRF PWUF LFF RFF
TRH[2:0] TRO
0 0 0 0 SEC0[1:0}
0 FBLANK 0 0
0
1
4.5 MCU Parameter Registers
The 64 bytes of parameter registers are located at addresses $0050 through $008F. These registers are powered up at all times and may be used to store temporary or history data during the times that the MCU is in any of the STOP modes. The parameter register at $008F is used by the firmware for interrupt flags.
4.6 MCU RAM
The FXTH870x6 includes static RAM. The locations in RAM below $0100 can be accessed using the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit-manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed program variables in this area of RAM is preferred.
The RAM retains data when the MCU is in low-power WAIT, STOP3 or ST OP4 modes. At power-on or after wakeup from STOP1, the contents of RAM are not initialized. RAM data is unaffected by any reset provided that the supply voltage does not drop below the minimum value for RAM retention (V
When security is enabled, the RAM is considered a secure memory resource and is not accessible through BDM or through code executing from non-secure memory. See Section 4.8 for a detailed description of the security feature.
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RAM).
Sensors
None of the RAM locations are used directly by the firmware provided by Freescale. The firmware routines utilize RAM only through stack operations; and the user needs to be aware of stack depth required by each routine as described in the CodeWarrior project files supplied by Freescale.
4.7 FLASH
The FLASH memory is intended primarily for program storage. The operating program can be loaded into the FLASH memory after final assembly of the application product using the single-wire BACKGROUND DEBUG interface. Because no speci al voltages are needed for FLASH erase and programming operations, in-application programming is also possible through other software-controlled communication paths. For a more detailed discussion of in-circuit and in-application programming, refer to the HCS08 Family Reference Manual, Volume I, Freescale document order number HCS08RMV1/D.
4.7.1 Features
Features of the FLASH memory include:
User Program FLASH Size — 8192 bytes (16 pages of 512 bytes each)
Single power supply program and erase
Command interface for fast program and erase operation
Up to 100,000 program/erase cycles at typical voltage and temperature
Flexible block protection
Security feature for FLASH and RAM
Auto power-down for low-frequency read accesses
4.7.2 Program and Erase Times
Before any program or erase command can be accepted, the FLASH clock divider register (FCDIV) must be written to set the internal clock for the FLASH module to a frequency (f so normally this write is performed during reset initialization. FCDIV cannot be written if the access error flag, FACCERR in FSTAT, is set. The user must ensure that FACCERR is not set before writing to the FCDIV register. One period of the resulting clock (1/f
) is used by the command processor to time program and erase pulses. An integer number of these timing pulses
FCLK
are used by the command processor to complete a program or erase command.
) between 150 kHz and 200 kHz. This register can be written only once,
FCLK
Table 9 shows program and erase times. The bus clock frequency and FCDIV determine the frequency of FCLK (f
for one cycle of FCLK is t case where t
=5s. Program and erase times shown include overhead for the command state machine and enabling and
FCLK
FCLK
=1/f
. The times are shown as a number of cycles of FCLK and as an absolute time for the
FCLK
FCLK
). The time
disabling of program and erase voltages.
Table 9. Program and Erase Times
Parameter Cycles of FCLK Time if FCLK = 200 kHz
Byte program 9 45 s
Byte program (burst) 4 20 s
Page erase 4000 20 ms Mass erase 20,000 100 ms
1. Excluding start/end overhead
(1)
4.7.3 Program and Erase Command Execution
The steps for executing any of the commands are listed below. The FCDIV register must be initialized and any error flags cleared before beginning command execution. The command execution steps are:
1. Write a data value to an address in the FLASH array. The address and data information from this write is latched into the FLASH interface. This write is a required first step in any command sequence. For erase and blank check commands, the value of the data is not important. For page erase commands, the address may be any address in the 512-byte page of FLASH to be erased. For mass erase and blank check commands, the address can be any address in the FLASH memory. Whole pages of 512 bytes are the smallest block of FLASH that may be erased. Do not program any byte in the FLASH more than once after a successful erase operation. Reprogramming bits to a byte which is already programmed is not allowed without first erasing the page in which the byte resides or mass erasing the entire FLASH memory. Programming without first erasing may disturb data stored in the FLASH.
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2. Write the command code for the desired command to FCMD. The five valid commands are blank check (0x05), byte program (0x20), burst program (0x25), page erase (0x40), and mass erase (0x41). The command code is latched into the command buffer.
3. Write a 1 to the FCBEF bit in FSTAT to clear FCBEF and launch the command (including its address and data information).
A partial command sequence can be aborted manually by writing a 0 to FCBEF any time after the write to the memory array and before writing the 1 that clears FCBEF and launches the complete command. Aborting a command in this way sets the FACCERR access error flag which must be cleared before starting a new command.
A strictly monitored procedure must be obeyed or the command will not be accepted. This minimizes the possibility of any unintended changes to the FLASH memory contents. The command complete flag (FCCF) indicates when a command is complete. The command sequence must be completed by clearing FCBEF to launch the command. Figure 9 is a flowchart for executing all of the commands except for burst programming. The FCDIV register must be initialized before using any FLASH commands. This must be done only once following a reset.
4.7.4 Burst Program Execution
The burst program command is used to program sequential bytes of data in less time than would be required using the standard program command. This is possible because the high voltage to the FLASH array does not need to be disabled between program operations. Ordinarily, when a program or erase command is issued, an internal charge pump associated with the FLASH memory must be enabled to supply high voltage to the array. Upon completion of the command, the charge pump is turned off. When a burst program command is issued, the charge pump is enabled and then remains enabled after completion of the burst program operation if these two conditions are met:
The next burst program command has been queued before the current program operation has completed.
The next sequential address selects a byte on the same physical row as the current byte being programmed. A row of FLASH memory consists of 64 bytes. A byte within a row is selected by addresses A5 through A0. A new row begins when addresses A5 through A0 are all zero.
The first byte of a series of sequential bytes being programmed in burst mode will take the same amount of time to program as a byte programmed in standard mode. Subsequent bytes will program in the burst program time provided that the conditions above are met. In the case the next sequential address is the beginning of a new row, the program time for that byte will be the standard time instead of the burst time. This is because the high voltage to the array must be disabled and then enabled again. If a new burst command has not been queued before the current command completes, then the charge pump will be disabled and high voltage removed from the array.
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START
WRITE TO FLASH
TO BUFFER ADDRESS AND DATA
WRITE COMMAND TO FCMD
NO
YES
FPVIOL OR
WRITE 1 TO FCBEF
TO LAUNCH COMMAND
AND CLEAR FCBEF
(2)
1
0
FCCF?
ERROR EXIT
DONE
Note 2: Wait at least four bus cycles
0
FACCERR?
CLEAR ERROR
FACCERR?
WRITE TO FCDIV
(1)
Note 1: Required only once after reset.
1
before checking FCBEF or FCCF.
FLASH PROGRAM AND
ERASE FLOW
Figure 9. FLASH Program and Erase Flowchart
Programming time for the FLASH through the BDM function is dependent on the specific external BDM interface tool and software being used. Consult tool vendor for programming times.
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FXTH870x6
1
0
FCBEF?
START
WRITE TO FLASH
TO BUFFER ADDRESS AND DATA
WRITE COMMAND ($25) TO FCMD
NO
YES
FPVIO OR
WRITE 1 TO FCBEF
TO LAUNCH COMMAND
AND CLEAR FCBEF
(2)
NO
YES
NEW BURST COMMAND?
1
0
FCCF?
ERROR EXIT
DONE
Note 2: Wait at least four bus cycles before
1
0
FACCERR?
CLEAR ERROR
FACCERR?
Note 1: Required only once after reset.
WRITE TO FCDIV
(1)
checking FCBEF or FCCF.
FLASH BURST
PROGRAM FLOW
4.7.5 Access Errors
An access error occurs whenever the command execution protocol is violated. Any of the following specific actions will cause the access error flag (FACCERR) in FSTAT to be set. FACCERR must be cleared
Figure 10. FLASH Burst Program Flowchart
by writing a 1 to FACCERR in FSTAT before any command can be processed.
Writing to a FLASH address before the internal FLASH clock frequency has been set by writing to the FCDIV register
Writing to a FLASH address while FCBEF is not set (A new command cannot be started until the command buffer is empty.)
Writing a second time to a FLASH address before launching the previous command (There is only one write to FLASH for every command.)
Writing a second time to FCMD before launching the previous command (There is only one write to FCMD for every command.)
Writing to any FLASH control register other than FCMD after writing to a FLASH address
Writing any command code other than the five allowed codes (0x05, 0x20, 0x25, 0x40, or 0x41) to FCMD
Accessing (read or write) any FLASH control register other than the write to FSTAT (to clear FCBEF and launch the command) after writing the command to FCMD.
The MCU enters STOP mode while a program or erase command is in progress (The command is aborted.)
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