Ver.1.00
F&eIT Series
Isolated Digital I/O Module
DIO-4/4(FIT)GY
* Specifications, color and design of the products are subject to
change without notice.
This product can perform 4-point digital signal input and 4-point
digital signal output, treating 4 points as a group.
Input section is ready to accept both the current sinking output
and current source output.
The output section is a high sink current, open collector type
using high-capacitance transistors.
150 mA/24 VDC or 50 mA/48 VDC max. (per channel)
Isolated I/O operations using an optocoupler improves noise
immunity.
A rotary switch allows you to set device IDs, making it easy to
keep track of device numbers.
Like other F&eIT series products, the module has a 35mm DIN
rail mounting mechanism as standard. A connection to a
controller module can be effected on a lateral, stack basis in a
unique configuration, which permits a simple, smart system
configuration without the need for a backplane board.
Packing List
Module[DIO-4/4(FIT)GY] …1
First step guide … 1
CD-ROM [F&eIT Series Setup Disk] *1…1
Interface connector plug…1
*1 The CD-ROM contains various software and User’s Guide.
This product is an expansion module (device module) that adds
digital signal I/O interfaces to one of various types of controllers.
The product is used in combination with the I/O controller
module <CPU-CAxx(FIT)GY> (*1) or microcontroller unit
<CPU-SBxx(FIT)GY> (*1) in the F&eIT Series.
This product can perform a maximum of 4 points of
Optocoupler isolated input and 4 points of Optocoupler isolated
output per module. (Input: 12 - 24 VDC specified, output: 12 48 VDC specified)
*1 This module is available in different product models. "x" in each model number
represents a blank or one alphanumeric character. This is applicable to the rest of this
document.
Specification Features
Specifications
Item
Input section
Input format Optocoupler isolated input
Input resistance 3kΩ
Input ON current 3.4mA or more
Input OFF current 0.16mA or less
Number of input signal points 4 points (4 points/common)
Response time Within 1msec
External circuit power supply 12 - 24VDC (±15%)
Output section
Output format Optocoupler isolated open collector output (current sink type)
Number of output signal
points
Response time Within 1msec
External circuit power supply 12 - 48VDC (±15%)
Common section
Interrupt level Using CPU-SBxx(FIT)GY: IRQ 5, 7, or 9
Internal current consumption 5VDC(±5%) 150mA(Max.) *1
Allowable distance of signal
extension
Physical dimensions (mm) 25.2(W) x 64.7(D) x 94.0(H) (exclusive of protrusions)
Weight of the module itself 100g
Module connection method Stack connection by means of a connection mechanism
Module installation method One-touch connection to 35mm DIN rails
Applicable wire AWG 28 - 16 wire type: 0.32 - 1.30mm
Applicable plug FRONT-MC 1,5/12-STF-3,81 (made by Phoenix Contact
*1 The stack connector accepts currents of up to 3.0A (Max.).
Output voltage 12 - 48VDC (±15%) Ratings
Output current 150mA (12 - 24V) (per channel) (Max.)
(compatible with current sink output and current source
output)
(4mA/12V - 8mA/24V per channel)
50mA (36 - 48V) (per channel) (Max.)
4 points (4 points/common)
Approx. 50m (depending on wiring environment)
standard with the system.
(standard connection mechanism provided in the system)
Corp.)
3.81mm-pitch, rated current: 8A (Max.)
Installation Environment Requirements
Operating temperature 0 - 50°C
Storage temperature -10 - 60°C
Operating humidity 10 - 90%RH (No condensation)
Floating dust particles Not to be excessive
Corrosive gases None
Noise immunity
Vibration
resistance
Impact resistance 15G half-sine shock for 11ms in X, Y, and Z directions
*1 When using a POW-AD22GY
Item Requirement description
Line-noise
*1
Static
electricity
resistance
Sweep
resistance
AC line/2kV, Signal line/1kV
(IEC1000-4-4Level 3, EN61000-4 -4Level 3)
Contact discharge/4kV (IEC1000-4-2Level 2,
EN61000-4-2Level 2)
Atmospheric discharge/8kV (IEC1000-4-2Level 3,
EN61000-4-2Level 3)
10 - 57Hz/semi-amplitude 0.15mm, 57 - 150Hz/2.0G
80minutes each in X, Y, and Z directions
(JIS C0040-compliant, IEC68-2-6-compliant)
(JIS C0041-compliant, IEC68-2-27-compliant)
Specifications
DIO-4/4(FIT)GY
DIO-4/4(FIT)GY 1
Ver.1.00
CAUTION
When connecting one of the modules to a controller module,
the internal current consumption should be taken into
account. If the total current exceeds the capacity of the
power supply unit, the integrity of the operation cannot be
guaranteed. For further details, please see the Controller
Module manual.
Block Diagram
Interface Connector IN00 - IN03 Interface Connector OUT00 - OUT03
94
Opto-Coupler &
Transistor
Output Data
Latch
Device ID
14.0
35.0
45.0
[mm]
Opto-Coupler
Tri- State
Buffer
Physical Dimensions
14
31.5
Control Circuit
Stack Connector
(1.2) (1.2)
X
0123
4567
6
040
Device
4
ID
2
COM0
NC
0
1
2
3
X
COM1
NC
4
5
6
7
DI-8
25.23.5 64.7 4.0
Functions and control method by
controller connected
This product can be connected to a variety of controllers.
Supported controllers
Microcontroller Unit : CPU-SBxx(FIT)GY
I/O Controller Module : CPU-CAxx(FIT)GY
Monitoring & Control Server Unit : SVR-MMF2(FIT)
Monitoring & Control Server Unit : SVR-MMF(FIT)GY
Check each controller to which the module can be connected
as well as the method of controlling the module when
connected to that controller.
Connections to controllers
Y
Y
G
G
)
)
T
T
I
I
F
F
(
(
x
x
x
B
O: Permitted
×: Not permitted
DIO-4/4(FIT)GY ΟΟΟΟ
DI-8(FIT)GY ΟΟΟΟ
DO-8(FIT)GY ΟΟΟΟ
Device ID setting range 0 - 7 0 - 7 0 - 7 0 - 7
S
-
U
P
P
C
C
F
x
M
A
C
M
-
-
U
R
V
S
Y
)
G
)
T
I
T
I
F
F
(
2(
F
M
M
-
R
V
S
Control method by controller connected
Y
Y
G
G
)
)
T
T
I
I
F
F
(
(
x
x
x
x
A
Control using the I/O address map Ο
Control using the memory address map
Control via the Windows driver *
Control over the web
(as set from within the browser)
* The API-SBP(W32) is included in the development kit [DTK-SBxx(FIT)GY]; the other
drivers are bundled with each controller.
FIT Protocol
API-CAP(W32)
API-SBP(W32)
B
C
S
-
U
P
C
Ο
Ο
Ο
Ο
-
U
P
C
ΟΟ
M
-
R
V
S
Y
)
G
)
T
I
T
I
F
F
(
2(
F
F
M
M
M
-
R
V
S
Control using the I/O address map
When connected to the CPU-SBxx(FIT)GY, the module can
receive I/O instructions directly from the controller module.
Control using the memory address map
When connected to the CPU-CAxx(FIT)GY, the module can be
accessed from the host computer over the network. The
module is assigned with its device ID in the memory managed
by the controller module. The application running on the host
computer controls the module by reading/writing the memory
managed by the controller module.
Control via the Windows driver
For the functions and settings available when using the
Windows driver, refer to the reference manual and online help
for each module.
Control over the web
You can monitor collected data and manage the log over the
web. You can use your familiar browser to easily make
various settings. For details, refer to the reference manual for
the SVR-MMF2(FIT), SVR-MMF(FIT)GY.
DIO-4/4(FIT)GY 2