Copyright © 2012 congatec AG CEVA_c_m10 7/47
Contents
1 COM Express™ Specication Overview ....................................8
1.1 Concept of COM Express™ .......................................................8
1.2 Module Form Factors .................................................................8
1.3 Module Types Overview ...........................................................10
2 Connector Layout .....................................................................12
3 Specications ...........................................................................13
3.1 Mechanical Dimensions ...........................................................13
3.2 Power Supply ...........................................................................13
3.2.1 Status LEDs D1‑D4 ..................................................................15
3.2.2 PWR_OK Signal ......................................................................15
3.2.3 Power‑up Control .....................................................................16
3.2.4 Module Type Detection ............................................................16
3.3 CMOS Battery ..........................................................................17
3.4 Environmental Specications ...................................................17
4 Connector Subsystems Rows A,B,C,D ....................................18
4.1 Connector Pinout Rows A and B ..............................................18
4.1.1 SM Bus ....................................................................................19
4.1.2 I²C Bus .....................................................................................20
4.1.3 SPI Bus ....................................................................................20
4.1.4 HDA Audio ................................................................................21
4.1.4.1 HDA/AC97 Header X49 ...........................................................22
4.1.4.2 Low Pin Count Bus (LPC) ........................................................22
4.1.4.3 LPC Super I/O device ..............................................................23
4.1.4.4 LPC Firmware Hubs .................................................................25
4.1.5 Universal Serial Bus (USB) ......................................................25
4.1.6 LAN 10/100/1000 .....................................................................26
4.1.7 Serial ATA
™ .............................................................................26
4.1.8 VGA ..........................................................................................27
4.1.9 LVDS Flat Panel Interface ........................................................28
4.1.9.1 Flat Panel and Backlight Power Supply ...................................29
4.1.9.2 Flat Panel and Backlight Power Supply Connection ................30
4.1.10 PCI Express x1 Connectors .....................................................31
4.1.11 ExpressCard and PCI Express Mini Card ................................33
4.1.11.1 ExpressCard ............................................................................33
4.1.11.2 PCI Express Mini Card .............................................................34
4.1.12 TV‑Out ......................................................................................36
4.2 Connector Pinout Rows C and D .............................................37
4.2.1 PCI Express Graphics (PEG) ...................................................38
4.2.2 PATA 100 ..................................................................................39
4.2.3 CompactFlash Socket ..............................................................40
4.2.4 PCI BUS ...................................................................................41
5 Additional Features ..................................................................42
5.1 Reset .......................................................................................42
5.2 PC Speaker (Beeper) ...............................................................42
5.3 Debug Display ..........................................................................43
5.4 TPM Physical Presence Pin .....................................................43
5.5 Ground Test Points ..................................................................43
5.6 Fan Connector and Power Conguration .................................44
5.7 SMART Battery Management Module .....................................44
5.8 Feature Connector ...................................................................45
6 Mechanical Drawing conga‑CEVAL ......................................... 46
7 Industry Specications .............................................................47