Compaq SMA200 User Manual

TECHNICAL USER MANUAL FOR:
smartCore Express SMA200
Nordstrasse 11/F CH - 4542 Luterbach Tel.: ++41 (0)32 681 58 00 Fax: ++41 (0)32 681 58 01 Email: support@digitallogic.com Homepage:
http://www.digitallogic.com
DIGITAL-LOGIC AG SMA200 Manual V1.0
For internal use only:
File: SMA200_TechManual_V1.0.doc Path: R:\HANDBUCH\smart\SMA200\SMA200_TechManual_V1.0.doc
COPYRIGHT  2008 BY DIGITAL-LOGIC AG
This publication is protected by copyright and all rights are reserved. No part of this document may be reproduced, transmitted, transcribed or stored in a retrieval system, in any form or by any means, electronic, mechanical, optical, manual, or otherwise, without the prior written permission of DIGITAL-LOGIC AG.
The software described herein, together with this document, are furnished under a license agreement and may be used or copied only in accordance with the terms of that agreement.
About this Manual and How to Use It
This manual is written for the original equipment manufacturer (OEM) who plans to build computer systems based on the single board MICROSPACE-PC. It is for integrators and programmers of systems based on the MICROSPACE-Computer family. This manual provides instructions for installing and configuring the board, and describes the system and setup requirements. This document contains information on hardware requirements, interconnections, and details of how to program the system. Please check the Product CD for further information and manuals.
REVISION HISTORY:
Document Version
V0.1 07.2008 KUF Initial Version
V1.0 09.2008 WAS Details fine-tuned / Standard format w/Eng. applied
Date/Initials: Modification:
Remarks, News, Attention:
Attention!
1. All information in this manual, and the product, are subject to change without prior notice.
2. Read this manual prior to installation of the product.
3. Read the security information carefully prior to installation of the product.
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Table of Contents
1. PREFACE .....................................................................................................................................................4
1.1. Trademarks ..................................................................................................................................... 4
1.2. Disclaimer ....................................................................................................................................... 4
1.3. Environmental Protection Statement ........................................................................................... 4
1.4. Who should use this Product ....................................................................................................... 4
1.5. Recycling Information.................................................................................................................... 5
1.6. Technical Support .......................................................................................................................... 5
1.7. Limited Two Year Warranty ........................................................................................................... 5
1.8. Explanation of Symbols................................................................................................................. 6
1.9. Applicable Documents and Standards ........................................................................................ 7
1.10. For Your Safety............................................................................................................................... 8
1.11. RoHS Commitment......................................................................................................................... 8
1.11.1. RoHS Compatible Product Design .......................................................................................... 9
1.11.2. RoHS Compliant Production Process ..................................................................................... 9
1.11.3. WEEE Application.................................................................................................................... 9
1.12. Swiss Quality ................................................................................................................................ 10
1.13. The Swiss Association for Quality and Management Systems............................................... 10
2. OVERVIEW .................................................................................................................................................11
2.1. Standard Features........................................................................................................................ 11
2.2. Technical Specifications ............................................................................................................. 12
2.3. Examples of Ordering Codes ...................................................................................................... 14
3. DIMENSIONS & DIAGRAMS..........................................................................................................................15
3.1. Block Diagram .............................................................................................................................. 15
Design IN with the smartModule.............................................................................................................. 16
3.2. Dimensions of the smartCoreExpress Module ......................................................................... 16
3.3. Connector Placement & Pin Definition on the Carrier Board .................................................. 17
3.4. Photo of the Top Side of the PCB............................................................................................... 18
3.5. Dimensions of the Carrier Board Connector............................................................................. 19
3.6. Component Heights between Module and Carrier Board ........................................................ 19
4. COM-EXPRESS CONNECTOR DESCRIPTION ................................................................................................20
4.1. Signal Terminology Descriptions ............................................................................................... 20
4.2. smartCoreExpress Connector Pinout ........................................................................................ 21
5. SIGNAL DESCRIPTIONS OF THE SMARTCOREEXPRESS .................................................................................23
5.1. Wire Design for Typical Impedances ......................................................................................... 23
5.2. Matching of the Differential Pairs ............................................................................................... 23
5.3. Placing an AC Coupling Capacitor on each PCIe-TX ............................................................... 24
5.4. smartCoreExpress Signal Groups.............................................................................................. 25
5.4.1. PCI-Express........................................................................................................................... 25
5.4.2. SDVO..................................................................................................................................... 26
5.4.3. LVDS ..................................................................................................................................... 27
5.4.4. USB ....................................................................................................................................... 28
5.4.5. Parallel ATA........................................................................................................................... 29
5.4.6. LPC BUS ............................................................................................................................... 30
5.4.7. SMBus ................................................................................................................................... 31
5.4.8. HDA Audio Interface .............................................................................................................. 32
5.4.9. SD / SDIO Interface ............................................................................................................... 33
5.4.10. SPI BUS................................................................................................................................. 34
5.4.11. SATA Interface (Option) ........................................................................................................ 35
5.4.12. GLAN ..................................................................................................................................... 36
5.4.13. CAN / Serial ........................................................................................................................... 37
5.4.14. PM ......................................................................................................................................... 38
5.4.15. Supply.................................................................................................................................... 39
6. SMARTCORE-EXPRESS CONNECTOR SPECIFICATIONS .................................................................................40
7. SMARTCORE-EXPRESS VERSUS COMEXPRESS...........................................................................................41
8. INDEX ........................................................................................................................................................42
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1. PREFACE

The information contained in this manual has been carefully checked and is believed to be accurate; it is subject to change without notice. Product advances mean that some specifications may have changed. DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may appear in this manual. Furthermore, DIGITAL-LOGIC AG does not accept any liability arising from the use or application of any circuit or product described herein.

1.1. Trademarks

DIGITAL-LOGIC, DIGITAL-LOGIC-Logo, MICROSPACE, and smartModule are registered trademarks owned worldwide by DIGITAL-LOGIC AG, Luterbach (Switzerland). In addition, this document may include names, company logos, and registered trademarks which are, therefore, proprietary to their respective owners.

1.2. Disclaimer

DIGITAL-LOGIC AG makes no representations or warranties with respect to the contents of this manual, and specifically disclaims any implied warranty of merchantability or fitness, for any particular purpose. DIGITAL­LOGIC AG shall, under no circumstances, be liable for incidental or consequential damages or related expenses resulting from the use of this product, even if it has been notified of the possibility of such damage.

1.3. Environmental Protection Statement

This product has been manufactured to satisfy environmental protection requirements wherever possible. Many of the components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capable of being recycled. Final disposal of this product after its service life must be accomplished in accordance with applicable country, state, or local laws or regulations.

1.4. Who should use this Product

Electrical engineers with know-how in PC-technology.
Because of the complexity and the variability of PC-technology, we cannot guarantee that the product
will work in any particular situation or set-up. Our technical support will try to help you find a solution.
Pay attention to electrostatic discharges; use a CMOS protected workplace.
Power supply must be OFF when working on the board or connecting any cables or devices.
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1.5. Recycling Information

All components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances Directive). The product is soldered with a lead free process.

1.6. Technical Support

1. Contact your local DIGITAL-LOGIC Technical Support, in your country.
2. Use the Internet Support Request form at http://support.digitallogic.ch/ embedded products New Support Request
Support requests are only accepted with detailed information about the product (i.e., BIOS-, Board­version)!

1.7. Limited Two Year Warranty

DIGITAL-LOGIC AG guarantees the hardware and software products it manufactures and produces to be free from defects in materials and workmanship for two years following the date of shipment from DIGITAL­LOGIC AG, Switzerland. This warranty is limited to the original purchaser of the product and is not transferable.
During the two year warranty period, DIGITAL-LOGIC AG will repair or replace, at its discretion, any defective product or part at no additional charge, provided that the product is returned, shipping prepaid, to DIGITAL-LOGIC AG. All replaced parts and products become property of DIGITAL-LOGIC AG.
Before returning any product for repair, direct customers of DIGITAL-LOGIC AG, Switzerland
are required to register a RMA (Return Material Authorization) number in the Support Center at
http://support.digitallogic.ch/
All other customers must contact their local distributors for returning defective materials.
This limited warranty does not extend to any product which has been damaged as a result of accident, misuse, abuse (such as use of incorrect input voltages, wrong cabling, wrong polarity, improper or insufficient ventilation, failure to follow the operating instructions that are provided by DIGITAL-LOGIC AG or other contingencies beyond the control of DIGITAL-LOGIC AG), wrong connection, wrong information or as a result of service or modification by anyone other than DIGITAL-LOGIC AG. Nor if the user has insufficient knowledge of these technologies or has not consulted the product manuals or the technical support of DIGITAL-LOGIC AG and therefore the product has been damaged.
Empty batteries (external and onboard), as well as all other battery failures, are not covered by this manufacturer’s limited warranty.
Except, as directly set forth above, no other warranties are expressed or implied, including, but not limited to, any implied warranty of merchantability and fitness for a particular purpose, and DIGITAL-LOGIC AG expressly disclaims all warranties not stated herein. Under no circumstances will DIGITAL-LOGIC AG be liable to the purchaser or any user for any damage, including any incidental or consequential damage, expenses, lost profits, lost savings, or other damages arising out of the use or inability to use the product.
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1.8. Explanation of Symbols

CE Conformity
This symbol indicates that the product described in this manual is in compliance with all applied CE standards.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60V) when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the law may endanger your life/health and/or result in damage to your equipment.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 32V) when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the law may endanger your life/health and/or result in damage to your equipment
Warning, ESD Sensitive Device!
This symbol and title inform that electronic boards and their components are sensitive to Electro Static Discharge (ESD). In order to ensure product integrity at all times, care must always be taken while handling and examining this product.
Attention!
This symbol and title emphasize points which, if not fully understood and taken into consideration by the reader, may endanger your health and/or result in damage to your equipment.
Note...
This symbol and title emphasize aspects the user should read through carefully for his, or her, own advantage.
Warning, Heat Sensitive Device!
This symbol indicates a heat sensitive component.
Safety Instructions
This symbol shows safety instructions for the operator to follow.
This symbol warns of general hazards from mechanical, electrical, and/or chemical failure. This may endanger your life/health and/or result in damage to your equipment.
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1.9. Applicable Documents and Standards

The following publications are used in conjunction with this manual. When any of the referenced specifications are superseded by an approved revision, that revision shall apply. All documents may be obtained from their respective organizations.
Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright
© 1996-2003 Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix Technologies Ltd., Toshiba Corporation. All rights reserved. http://www.acpi.info/
ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS)
Interface Circuits, January 1, 2001. http://www.ansi.org/
ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002.
http://www.ansi.org/
ANSI INCITS 376-2003: American National Standard for Information Technology – Serial Attached
SCSI (SAS), October 30, 2003. http://www.ansi.org/
Audio Codec ’97 Revision 2.3 Revision 1.0, April 2002 Copyright © 2002 Intel Corporation. All rights
reserved. http://www.intel.com/labs/media/audio/
Display Data Channel Command Interface (DDC/CI) Standard (formerly DDC2Bi) Version 1, August
14, 1998 Copyright © 1998 Video Electronics Standards Association. All rights reserved.
http://www.vesa.org/summary/sumddcci.htm
ExpressCard Standard Release 1.0, December 2003 Copyright © 2003 PCMCIA. All rights reserved.
http://www.expresscard.org/
IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information
exchange between systems–Local and metropolitan area networks–Specific requirements – Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications. http://www.ieee.org
IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision
Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation.
http://www.ieee.org
Intel Low Pin Count (LPC) Interface Specification Revision 1.1, August 2002 Copyright © 2002 Intel
Corporation. All rights reserved. http://developer.intel.com/design/chipsets/industry/lpc.htm
PCI Express Base Specification Revision 1.1, March 28, 2005, Copyright © 2002-2005 PCI Special
Interest Group. All rights reserved. http://www.pcisig.com/
PCI Express Card Electromechanical Specification Revision 1.1, March 28, 2005, Copyright © 2002-
2005 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI Local Bus Specification Revision 2.3, March 29, 2002 Copyright © 1992, 1993, 1995, 1998, 2002
PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI-104 Specification, Version V1.0, November 2003. All rights reserved. http://www.pc104.org
PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004,
PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500, Wakefield, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. http://www.picmg.org/
Serial ATA: High Speed Serialized AT Attachment Revision 1.0a January 7, 2003 Copyright © 2000-
2003, APT Technologies, Inc, Dell Computer Corporation, Intel Corporation, Maxtor Corporation, Seagate Technology LLC. All rights reserved. http://www.sata-io.org/
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Smart Battery Data Specification Revision 1.1, December 11, 1998. www.sbs-forum.org
System Management Bus (SMBus) Specification Version 2.0, August 3, 2000 Copyright © 1994, 1995,
1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, Power­Smart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved.
http://www.smbus.org/
Universal Serial Bus Specification Revision 2.0, April 27, 2000 Copyright © 2000 Compaq Computer
Corporation, Hewlett-Packard Company, Intel Corporation, Lucent Technologies Inc., Microsoft Corporation, NEC Corporation, Koninklijke Philips Electronics N.V. All rights reserved.
http://www.usb.org/

1.10. For Your Safety

Your new DIGITAL-LOGIC product was developed and tested carefully to provide all features necessary to ensure its compliance with electrical safety requirements. It was also designed for a long, fault-free life. However, this life expectancy can be drastically reduced by improper treatment during unpacking and installation. Therefore, in the interest of your own safety and for the correct operation of your new DIGITAL-LOGIC product, please comply with the following guidelines.
Attention!
All work on this device must only be carried out by sufficiently skilled personnel.
Caution, Electric Shock!
Before installing your new DIGITAL-LOGIC product, always ensure that your mains power is switched off. This applies also to the installation of piggybacks or peripherals. Serious electrical shock hazards can exist during all installation, repair and maintenance operations with this product. Therefore, always unplug the power cable and any other cables which provide external voltage before performing work.
Warning, ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. In order to ensure product integrity at all times, be careful during all handling and examinations of this product.

1.11. RoHS Commitment

DIGITAL-LOGIC AG is committed to develop and produce environmentally friendly products according to the Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and Electronic Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a directive, which restricts the use of six hazardous materials in the manufacturing of various types of electronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment Directive (WEEE) 2002/96/EC, which has set targets for collection, recycling and recovery of electrical goods and is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.
Each European Union member state is adopting its own enforcement and implementation policies using the directive as a guide. Therefore, there could be as many different versions of the law as there are states in the EU. Additionally, non-EU countries like China, Japan, or states in the U.S. such as California may have their own regulations for green products, which are similar, but not identical, to the RoHS directive.
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RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:
Lead
Mercury
Cadmium
Chromium VI
PBB and PBDE
The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for Cadmium, which is limited to 0.01%) by weight of homogeneous material. This means that the limits do not apply to the weight of the finished product, or even to a component but to any single substance that could (theoretically) be separated mechanically.

1.11.1. RoHS Compatible Product Design

All DIGITAL-LOGIC standard products comply with RoHS legislation.
Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and mechanical components during the design-in phase of all DIGITAL-LOGIC standard products.

1.11.2. RoHS Compliant Production Process

DIGITAL-LOGIC selects external suppliers that are capable of producing RoHS compliant devices. These capabilities are verified by:
1. A confirmation from the supplier indicating that their production processes and resulting devices are RoHS compliant.
2. If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned substances in a produced device will be measured. These measurements are carried out by an accredited laboratory.

1.11.3. WEEE Application

The WEEE directive is closely related to the RoHS directive and applies to the following devices:
Large and small household appliances IT equipment Telecommunications equipment (although infrastructure equipment is exempt in some countries) Consumer equipment Lighting equipment – including light bulbs Electronic and electrical tools Toys, leisure and sports equipment Automatic dispensers
It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that brings the product to market, as defined in the directive. Components and sub-assemblies are not subject to product compliance. In other words, since DIGITAL-LOGIC does not deliver ready-made products to end users the WEEE directive is not applicable for DIGITAL-LOGIC. Users are nevertheless encouraged to properly recycle all electronic products that have reached the end of their life cycle.
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1.12. Swiss Quality

100% Made in Switzerland
DIGITAL-LOGIC is a member of "Swiss-Label"
This product was not manufactured by employees earning piecework wages
This product was manufactured in humane work conditions
All employees who worked on this product are paid customary Swiss market wages and are insured
ISO 9000:2001 (quality management system)
1.13. The Swiss Association for Quality and Management Systems
The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment services for all types of industries and services. SQS certificates are accepted worldwide thanks to accreditation by the Swiss Accreditation Service (SAS), active membership in the International Certification Network, IQNet, and co-operation contracts/agreements with accredited partners.
www.sqs.ch
The SQS Certificate ISO 9001:2000 has been issued to DIGITAL-LOGIC AG, the entire company, in the field of development, manufacturing and sales of embedded computer boards, embedded computer modules and computer systems. The certification is valid for three years at which time an audit is performed for recertification.
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2. OVERVIEW

2.1. Standard Features

The smartCoreExpress is an electrical and mechanical definition for a COM or Computer on Module (miniaturized PC system), based on Intel's ATOM chip unit incorporating the major elements of a PC compatible computer.
Powerful though low consumption ATOM CPU
Soldered DDR2 RAM 512k up to 2GByte
Single 220pin connectors (Tyco) for the smartCoreExpress BUS
5x x1 PCI-Express lanes
8x USB V2.0
1x PATA or (4x SATA plus 1x GE-LAN)
1x SDVO interface
1x LVDS 24bit interface
1x AC97 HAD interface
1x LPC BUS
1x SPI BUS
1x SM BUS
1x Generic Serial BUS (ex. CAN)
4x GPIO (programmable global in/out)
Maximum Thermal Design Power up to 40W
Reserved pins for: 1x Ethernet interface 1GE
Single 5Volt supply
Legacy signals for SuperIO
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2.2. Technical Specifications

CPU Specification
CoreDuo / Celeron M Intel Atom 510 1.10GHz with 0.5MB L2-cache
Intel Atom 530 1.60GHz with 0.5MB L2-cache Clock 1.1 or 1.6GHz 1st Level Cache 2x 32kByte 2nd Level Cache 0.54 MByte (on die) Technology 40nm VCCCore @ 1.6GHz 1.050V VCCCore @ 1.1GHz 0.844V VCCCore @ deep sleep 0.748V CPU BUS CMOS AGTL+ Termination Not needed FSB 533MHz quad-pumped synchronous BUS
Mathematics Coprocessor
Available on the Atom CPU
Intel US15W Graphics Memory Controller Hub Memory Controller Specification
Supports Socket DDR2 soldered memory Technologies DDR2-667 Capacity 512MByte up to 2GByte Voltage 1.8V Termination 0.9V Width 64bit ECC-Support No
Intel US15W Graphics Memory Controller Hub Graphic Controller
Max. Video Memory 128MByte with Intel GMA Graphic Core Frequency 250MHz SDVO Port 2 channels (multiplexed with the PEG signals)
Flat Panel Interface 2 channel LVDS interface
LVDS 24bit 200Mpixel/sec
Specification
1x 200 Mpixel/sec
Support for up to 1x DVI, 1x VGA and 1x LVDS
Dotclock = 165MHz
Compliant with DVI Spec.1.5
1x 18, 2x 18, 1x 24, 2x 24bpp TFT
Dotclock = up to 2x 112 MHz
Resolutions 640 x 480 up to 1600 x 1200 (UXGA)
Automatic panel detection via VESA EDID 1.3
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Intel US15W Specification
PCIe BUS 2x x1 Lane EIDE BUS 1x Ultra P-ATA 100 SATA BUS ­USB V2.0 8 channel USB APIC INTEL I/O APIC SMB V2.0 SMBus controller FWH FirmWare Hub for BIOS devices LPC Serialized BUS (no ISA) used for external SuperI/O Sound AC97 2.3 HDA Interface with 192kHz sampling rate and 8 channels IRQ Controller 8259 compatible Timers 8254 compatible Power Management Integrated
Reset & Power Management Specification
Controller Atmel Power Modes S5, S3 ACPI V3.0
BUS Specification
LPC 8bit 33MHz PCIexpress 2x x1 lane
Power Supply Specification
DC Input 5.0V, max. 200mV ripple Inrush Current Standby Power 0.1W Onboard Voltages VCC Core, 1.05V, 1.8V, 0.9V, CoreVCC, 1.5V Power Consumption 4W
Physical Characteristics Specification
Dimensions Length: 65 mm +/- 0.1mm
Weight 70 gr / 8 ounces PCB Thickness 1.6 mm / 0.0625 inches nominal PCB Layer Multilayer
5.0V up to 2Amp for 100µs
Use inductors in series to reduce the maximum inrush current!
Depth: 58 mm +/- 0.1mm
Height: 11 mm +/- 0.2mm (with 5mm bus connectors)
14 mm +/- 0.2mm (with 8mm bus connectors)
The connector height is selected by the connector on the carrier board.
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