This document provides information about products from Kontron Embedded Modules GmbH, and/or
its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has
been made to ensure that the information in this document is accurate, the information contained
within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents
or other rights of third parties are concerned.
Kontron Embedded Modules GmbH and Advantech Co., Ltd. are founding members of the
Industrial Group the purpose of which is the definition, marketing and promotion of the COM
Technologies.
Kontron Embedded Modules GmbH and Advantech Co., Ltd. Have significantly contributed to the
development and promotion of the COM Industrial Standard and administrates the COM Industrial
Group’s website (http://www.com-ig.org/).
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COM
1.3 Technical Support
Technicians and engineers from COM Industrial Group Members are available for technical support.
We are committed to making our product easy to use and will help you use our products in your
systems.
Although the information presented in this document was carefully reviewed and is believed to be
accurate, it is not guaranteed. The reader assumes all liability for the use of the information herein.
The COM Express™ Extension Specification builds on the COM Express™ (COM.0) standard as
defined by the PCI Industrial Computer Manufacturers’ Group (PICMG®) which is an industry
standard adopted for Computer-On-Modules. The COM Express™ Extension Specification is focused
with its intellectual properties on the deep embedded market and is intended to be an add-on to the
PICMG’s COM Express™ COM.0 Specification. It is the intention of the authors of this specification
to propose the information contained here within to PICMG® as a means of updating the current
COM Express™ standard to ensure continued saleability and compatibility of all COM Express™
solutions.
2.2 COM Express™ Extension Design Guide
The COM Express™ Design Guide, a separate document from both the PICMG® COM Express™
Specification and this COM Express™ Extension Specification, is available to COM Express™ module
customers upon request. For download the COM Express™ Extension Design guide please visit our
web page:
The COM Express™ Design Guide explores the requirements of the COM Express™ Extension
Specification and provides recommendations on designing COM Express™ baseboards to support
various features of COM Express™ compliant modules.
The COM Express™ Design Guide, based upon the COM Express™ Extension Specification and
PICMG® COM Express™ Specification, discusses capabilities in the specification with schematic
examples where applicable and offers ideas to consider for maximum flexibility in designing
baseboards.
2.3 COM Express™ Computer-On-Module
A COM Express™ Computer-On-Module (COM) is a module with all components necessary for a
bootable host computer, packaged as a super component. COMs require a carrier board in order to
bring out I/O and to power up the CPU module.
COMs are used to build single board computer solutions and offer OEMs fast time-to-market with
reduced development cost.
Like integrated circuits, they provide OEMs with significant freedom when working to meet form-fitfunction requirements. For all of these reasons, COM methodology has gained significant popularity
with OEMs in the embedded industry. The COM Express™ standard is designed to be future proof
and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage
Differential Signalling) interfaces. These include the PCI bus and parallel ATA on the one hand and
PCI Express and Serial ATA on the other hand.
Key features include:
Rich complement of contemporary high bandwidth serial interfaces, including PCI
Express, Serial ATA, USB 2.0, and Gigabit Ethernet
32-bit PCI, LPC and Parallel ATA options preserved for easy interface to a range of
peripherals
Extended power-management capabilities
Robust thermal and mechanical concept
Cost-effective design
Legacy-free design (no Super I/O, PS2 keyboard or mouse)
COM Express™ module size with two currently defined footprint options (“Basic”
and “Extended”) to satisfy a range of performance requirements. The option for
future more compact footprints like microETXexpress and nanoETXexpress are
present.
High-performance mezzanine connector with several defined pin-out types to
satisfy a range of application requirements
The COM Express™ Extension specification has been created to support to a range of vertical
embedded markets. It has been formulated to be applicable to a broad range of system types, from
floor-installed and bench-top to mobile handheld.
Markets and applications include but are not limited to:
Gaming & entertainment - simulators, slot machines, etc.
Test & measurement - scientific and industrial test and measurement instruments
Industrial automation - industrial robots, vision systems, etc.
Security - digital CCTV, luggage scanners, intrusion detectors, etc.
Defence & government - unmanned vehicles, rugged laptops, wearable computers,
etc.
Systems developed according to the COM Express™ Extension Specification require the
implementation of an application-specific carrier board that accepts the module. The carrier board is
typically a 4- to 8-layer PCB. User-specific features such as external connector choices and locations
and peripheral circuits can be tailored to suit the application. The OEM can focus on application-
specific features rather than caring for a CPU board design. The OEM also benefits from a wide
choice of modules providing a scalable range of price and performance upgrade options.
2.4 Objective
Consistent with the objective of the PICMG® COM Express™ Specification, the COM Express™
Extension specification defines COM Express™ compliant modules at a level of detail sufficient to
allow interoperability between independent vendor modules and carrier boards.