Compaq COM Express Extension User Manual

Download

Page 1

 COM Express™ Extension

 Specification

Rev. 013

Page 2

This page intentionally left blank

Page 3

Table of Contents

User Information......................................................................................................................... 5

1.1

About This Document...................................................................................................... 5

1.2

Copyright Notice ............................................................................................................. 5

1.3

Technical Support............................................................................................................ 5

1.4

Disclaimer........................................................................................................................ 5

Introduction................................................................................................................................. 6

2.1

COM Express™ Extension Specification......................................................................... 6

2.2

COM Express™ Design Guide......................................................................................... 6

2.3

COM Express™ Computer-On-Module........................................................................... 6

2.4

Objective.......................................................................................................................... 8

COM Express™ Module sizes..................................................................................................... 9

3.1

Overview - Module Size.................................................................................................. 9

3.1.1 Figure - Overview – three module sizes........................................................................ 10

3.1.2 Small Form Factor nano, COM Express™ Type 1........................................................ 10

Figure 3 – Small Form Factor nano............................................................................................. 11

Signal Description..................................................................................................................... 12

4.1

Graphic Signal Description............................................................................................ 12

4.1.1 Table – Graphic Signal Description - Row C for Pin-out Type 2 ................................. 12

4.1.2 Table – Graphic Signal Description - Row D for Pin-out Type 2................................. 13

Hardware extensions................................................................................................................. 15

5.1

Wide Range Input Power............................................................................................... 15

5.1.1 Wide Range Input Power for nano SFF......................................................................... 15

5.2

GPIO General Purpose I/O Recommended Use............................................................ 16

5.2.1 Alternative GPIO use for SDIO Interface...................................................................... 17

SDIO Pin description....................................................................................................................... 17

5.3

Thermal Control............................................................................................................. 18

Software extensions................................................................................................................... 19

6.1

TPM support.................................................................................................................. 19

6.2

Smart Battery BIOS support.......................................................................................... 19

6.3

Legacy Super I/O support in BIOS................................................................................ 20

6.4

CMOS backup in BIOS................................................................................................. 20

6.4.1 Console redirection in BIOS.......................................................................................... 20

iii

Page 4

Table of Contents

6.4.2 User editor for default settings....................................................................................... 20

Apendix A: PC Architecture Information.............................................................................. 21

7.1

Buses.............................................................................................................................. 21

7.1.1 ISA, Standard PS/2 – Connectors.................................................................................. 21

7.1.2 PCI 21

7.2

7.3

7.3.1 RS-232 Serial................................................................................................................. 22

7.3.2 Serial ATA..................................................................................................................... 22

7.3.3 USB ............................................................................................................................... 22

7.4

APPENDIX B: DOCUMENT-REVISION HISTORY.......................................................... 24

General PC Architecture................................................................................................ 21

Ports............................................................................................................................... 22

Programming ................................................................................................................. 23

Page 5

1 User Information

1.1 About This Document

This document provides information about products from Kontron Embedded Modules GmbH, and/or its subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of third parties are concerned.

1.2 Copyright Notice

Kontron Embedded Modules GmbH and Advantech Co., Ltd. are founding members of the Industrial Group the purpose of which is the definition, marketing and promotion of the COM Technologies.

Kontron Embedded Modules GmbH and Advantech Co., Ltd. Have significantly contributed to the development and promotion of the COM Industrial Standard and administrates the COM Industrial Group’s website (http://www.com-ig.org/).

All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission of COM Industrial Group founding Members.

COM

1.3 Technical Support

Technicians and engineers from COM Industrial Group Members are available for technical support. We are committed to making our product easy to use and will help you use our products in your systems.

http://www.comexpress-extension.org/members/members.php

Before contacting COM Industrial Group Members technical support, please consult our web site at

http://www.comexpress-extension.org for the latest product documentation, utilities, and drivers. If the

information does not help solve the problem, contact us by email.

http://www.comexpress-extension.org/contact/contact.php

1.4 Disclaimer

Although the information presented in this document was carefully reviewed and is believed to be accurate, it is not guaranteed. The reader assumes all liability for the use of the information herein.

Specification Rev 013

Page 6

2 Introduction

2.1 COM Express™ Extension Specification

The COM Express™ Extension Specification builds on the COM Express™ (COM.0) standard as defined by the PCI Industrial Computer Manufacturers’ Group (PICMG®) which is an industry standard adopted for Computer-On-Modules. The COM Express™ Extension Specification is focused with its intellectual properties on the deep embedded market and is intended to be an add-on to the PICMG’s COM Express™ COM.0 Specification. It is the intention of the authors of this specification to propose the information contained here within to PICMG® as a means of updating the current COM Express™ standard to ensure continued saleability and compatibility of all COM Express™ solutions.

2.2 COM Express™ Extension Design Guide

The COM Express™ Design Guide, a separate document from both the PICMG® COM Express™ Specification and this COM Express™ Extension Specification, is available to COM Express™ module customers upon request. For download the COM Express™ Extension Design guide please visit our web page:

http://www.comexpress-extension.com/specs/specs.php

The COM Express™ Design Guide explores the requirements of the COM Express™ Extension Specification and provides recommendations on designing COM Express™ baseboards to support various features of COM Express™ compliant modules.

The COM Express™ Design Guide, based upon the COM Express™ Extension Specification and PICMG® COM Express™ Specification, discusses capabilities in the specification with schematic examples where applicable and offers ideas to consider for maximum flexibility in designing baseboards.

2.3 COM Express™ Computer-On-Module

A COM Express™ Computer-On-Module (COM) is a module with all components necessary for a bootable host computer, packaged as a super component. COMs require a carrier board in order to bring out I/O and to power up the CPU module.

COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost.

Like integrated circuits, they provide OEMs with significant freedom when working to meet form-fitfunction requirements. For all of these reasons, COM methodology has gained significant popularity with OEMs in the embedded industry. The COM Express™ standard is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage

Specification Rev 013

Page 7

2 Introduction

Differential Signalling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.

Key features include:

 Rich complement of contemporary high bandwidth serial interfaces, including PCI

Express, Serial ATA, USB 2.0, and Gigabit Ethernet

 32-bit PCI, LPC and Parallel ATA options preserved for easy interface to a range of

peripherals

 Extended power-management capabilities  Robust thermal and mechanical concept

Cost-effective design

 Legacy-free design (no Super I/O, PS2 keyboard or mouse)  COM Express™ module size with two currently defined footprint options (“Basic”

and “Extended”) to satisfy a range of performance requirements. The option for future more compact footprints like microETXexpress and nanoETXexpress are present.

 High-performance mezzanine connector with several defined pin-out types to

satisfy a range of application requirements

The COM Express™ Extension specification has been created to support to a range of vertical embedded markets. It has been formulated to be applicable to a broad range of system types, from floor-installed and bench-top to mobile handheld.

Markets and applications include but are not limited to:

 Healthcare - clinical diagnostic imaging systems, patient bedside monitors, etc.  Retail & advertising - electronic shopping carts, billboards, kiosks, POS/POI

systems, etc.

 Gaming & entertainment - simulators, slot machines, etc.  Test & measurement - scientific and industrial test and measurement instruments  Industrial automation - industrial robots, vision systems, etc.  Security - digital CCTV, luggage scanners, intrusion detectors, etc.  Defence & government - unmanned vehicles, rugged laptops, wearable computers,

etc.

Systems developed according to the COM Express™ Extension Specification require the implementation of an application-specific carrier board that accepts the module. The carrier board is typically a 4- to 8-layer PCB. User-specific features such as external connector choices and locations and peripheral circuits can be tailored to suit the application. The OEM can focus on application-

Specification Rev 013

Page 8

2 Introduction

specific features rather than caring for a CPU board design. The OEM also benefits from a wide choice of modules providing a scalable range of price and performance upgrade options.

2.4 Objective

Consistent with the objective of the PICMG® COM Express™ Specification, the COM Express™ Extension specification defines COM Express™ compliant modules at a level of detail sufficient to allow interoperability between independent vendor modules and carrier boards.

Specification Rev 013

Page 9

3 COM Express™ Module sizes

3.1 Overview - Module Size

The primary difference between the current basic module and the extended module as well as future compact footprints like microETXexpress and nanoETXexpress is the over-all physical size and the performance envelope supported by each. The extended module offers larger real estate and can accommodate larger processor, chips and memory solutions which are not possible on the basic module.

The extended module and the basic module use the same connectors and pin-outs and utilize several common mounting hole positions. This level of compatibility allows that a carrier board designed to accommodate an extended module can also support a basic module, microETXexpress or nanoETXexpress modules. This holds true for any future defined compact modules as they too will utilize the same connectors and pin-outs

Up to 440 pins of connectivity are available between COM Express™ modules and the carrier board. Legacy buses such as PCI, parallel ATA, LPC, AC'97 can be supported as well as new high speed serial interconnects such as PCI Express, Serial ATA or SAS and Gigabit Ethernet. To enhance interoperability between COM Express™ modules and carrier boards, five common signalling configurations (Pin-out Types) have been defined to ease system integration. Some Pin-out Types definitions require only a single 220-pin connector, like nanoETXexpress and others require both 220pin connectors to supply all the defined signalling.

Specification Rev 013

Page 10

3 COM Express™ Module sizes

Figure - Overview – three module sizes

All coordinates in mm. top view ( X1 is on bottom side, seen through pcb)

3.1.1 Small Form Factor nano, COM Express™ Type 1

Specification Rev 013

Page 11

3 COM Express™ Module sizes

COM

xpress

™ Type 1

The PCB size for the nano module is defined as 55mm x 84mm. The holes shown in this drawing are intended for mounting the module / heat-spreader combination to the carrier board. An independent, implementation specific set of holes and spacers shall be used to attach the heat-spreader to the module.

Figure - Small Form Factor nano

Holes Compatible to COM Express™

All dimensions are shown in millimetres. Tolerances should be ± 0.25mm [±0.010"], unless noted otherwise. The tolerances on the module connector locating peg holes (dimensions [16.50, 6.00]) should be ± 0.10mm [±0.004"]. The 220 pin connector shall be mounted on the backside of the PCB and is seen “through” the board in this view. The X mounting holes shown should use 6mm diameter pads and should have 2.7mm plated holes, for use with 2.5mm hardware. The pads should be tied to the PCB ground plane.

Specification Rev 013

Page 12

4 Signal Description

4.1 Graphic Signal Description

Based on the different available graphic interfaces offered by the different chipsets from silicon vendors including Intel, ATI, VIA, etc., there is a need for optional assignment in addition to the ones already defined by PICMG in the COM.0 specification. These will allow for ease when integrating upcoming new graphic interfaces while still assuring compatibility of COM Express™ compliant modules and carrier boards.

Graphic signals are defined on Row C and Row D. The following table describes the signal uses up on the required graphic interface.

4.1.1 Table – Graphic Signal Description - Row C for Pin-out Type 2

Row C Definition

Pin No. Pin Name C52 PEG_RX0+ SDVO_TVCLK+ HDMI_TVCLKIN C53 PEG_RX0- SDVO_TVCLK- HDMI_TVCLKIN# C54 TYPE0# TYPE0# TYPE0# TYPE0# C55 PEG_RX1+ SDVOB_INT+ C56 PEG_RX1- SDVOB_INT- C57 TYPE1# TYPE1# TYPE1# TYPE1# C58 PEG_RX2+ SDVO_FLDSTALL+ TMDS_DDC_DAT DPB_AUX C59 PEG_RX2- SDVO_FLDSTALL- TMDS_DDC_CLK DPB_AUXB C60 GND (FIXED) GND (FIXED) GND (FIXED) GND (FIXED) C61 PEG_RX3+ TMDS_HPD DPB_HPD C62 PEG_RX3- C63 RSVD RSVD RSVD RSVD C64 RSVD RSVD RSVD RSVD C65 PEG_RX4+ C66 PEG_RX4- C67 RSVD RSVD RSVD RSVD C68 PEG_RX5+ SDVOC_INT+ C69 PEG_RX5- SDVOC_INT- C70 GND (FIXED) GND (FIXED) GND (FIXED) GND (FIXED) C71 PEG_RX6+ TMDS_2_DDC_DAT DPC_AUX C72 PEG_RX6- TMDS_2_DDC_CLK DPC_AUXB C73 SDVO_DATA SDVO_DATA C74 PEG_RX7+ TMDS_2_HPD DPC_HPD C75 PEG_RX7- C76 GND GND GND C77 RSVD RSVD RSVD

PCIE x 16 SDVO TMDS(DVI)/HDMI/DVO Display Port

Specification Rev 013

Page 13

4 Signal Description

C78 PEG_RX8+ DVO D11 C79 PEG_RX8- DVO D10 C80 GND (FIXED) GND (FIXED) GND (FIXED) C81 PEG_RX9+ DVO D9 C82 PEG_RX9- DVO D8 C83 RSVD RSVD RSVD C84 GND GND GND C85 PEG_RX10+ DVO D7 DPD_AUX C86 PEG_RX10- DVO D6 DPD_AUXB C87 GND GND GND C88 PEG_RX11+ DVO CLK+ DPD_HPD C89 PEG_RX11- DVO D5 C90 GND (FIXED) GND (FIXED) GND (FIXED) C91 PEG_RX12+ DVO D4 C92 PEG_RX12- DVO D3 C93 GND GND GND C94 PEG_RX13+ DVO D2 C95 PEG_RX13- DVO D1 C96 GND GND GND C97 RSVD RSVD RSVD C98 PEG_RX14+ DVO D0 C99 PEG_RX14- DVO DE C100 GND (FIXED) GND (FIXED) GND (FIXED) C101 PEG_RX15+ DVO HS C102 PEG_RX15- DVO VS C103 GND GND GND C104 VCC_12V VCC_12V VCC_12V C105 VCC_12V VCC_12V VCC_12V C106 VCC_12V VCC_12V VCC_12V C107 VCC_12V VCC_12V VCC_12V C108 VCC_12V VCC_12V VCC_12V C109 VCC_12V VCC_12V VCC_12V C110 GND (FIXED) GND (FIXED) GND (FIXED)

4.1.2 Table – Graphic Signal Description - Row D for Pin-out Type 2

Row D Definition

Pin No. Pin Name D52 PEG_TX0+ SDVOB_RED+ TMDS DATA 2+ DPB_LANE0 D53 PEG_TX0- SDVOB_RED- TMDS DATA 2- DPB_LANE0# D54 PEG_LANE_RV# PEG_LANE_RV# PEG_LANE_RV# PEG_LANE_RV# D55 PEG_TX1+ SDVOB_GRE+ TMDS DATA 1+ DPB_LANE1 D56 PEG_TX1- SDVOB_GRE- TMDS DATA 1- DPB_LANE1# D57 TYPE2# TYPE2# TYPE2# TYPE2# D58 PEG_TX2+ SDVOB_BLU+ TMDS DATA 0+ DPB_LANE2 D59 PEG_TX2- SDVOB_BLU- TMDS DATA 0- DPB_LANE2# D60 GND (FIXED) GND (FIXED) GND (FIXED) GND (FIXED)

Specification Rev 013

PCIE x 16 SDVO TMDS(DVI)/HDMI/DVO Display Port

Page 14

4 Signal Description

D61 PEG_TX3+ SDVOB_CLK+ TMDS Clock + DPB_LANE3 D62 PEG_TX3- SDVOB_CLK- TMDS Clock - DPB_LANE3# D63 RSVD RSVD RSVD RSVD D64 RSVD RSVD RSVD RSVD D65 PEG_TX4+ SDVOC_RED+ TMDS DATA 5+ DPC_LANE0 D66 PEG_TX4- SDVOC_RED- TMDS DATA 5- DPC_LANE0# D67 GND GND GND GND D68 PEG_TX5+ SDVOC_GRE+ TMDS DATA 4+ DPC_LANE1 D69 PEG_TX5- SDVOC_GRE- TMDS DATA 4- DPC_LANE1# D70 GND (FIXED) GND (FIXED) GND (FIXED) GND (FIXED) D71 PEG_TX6+ SDVOC_BLU+ TMDS DATA 3+ DPC_LANE2 D72 PEG_TX6- SDVOC_BLU- TMDS DATA 3- DPC_LANE2# D73 SDVO_CLK SDVO_CLK D74 PEG_TX7+ SDVOC_CLK+ TMDS_2_CLK + DPC_LANE3 D75 PEG_TX7- SDVOC_CLK- TMDS_2_CLK - DPC_LANE3# D76 GND GND GND D77 IDE_CBLID# IDE_CBLID# IDE_CBLID# D78 PEG_TX8+ DVO_SDA DPD_LANE0 D79 PEG_TX8- DVO_SCL DPD_LANE0# D80 GND (FIXED) GND (FIXED) GND (FIXED) D81 PEG_TX9+ DVO_HPD DPD_LANE1 D82 PEG_TX9- DPD_LANE1# D83 RSVD RSVD RSVD D84 GND GND GND D85 PEG_TX10+ DPD_LANE2 D86 PEG_TX10- DPD_LANE2# D87 GND GND GND D88 PEG_TX11+ DVO CLK- DPD_LANE3 D89 PEG_TX11- DPD_LANE3# D90 GND (FIXED) GND (FIXED) GND (FIXED) D91 PEG_TX12+ D92 PEG_TX12- D93 GND GND GND D94 PEG_TX13+ D95 PEG_TX13- D96 GND GND GND D97 PEG_ENABLE# PEG_ENABLE# PEG_ENABLE# D98 PEG_TX14+ D99 PEG_TX14- D100 GND (FIXED) GND (FIXED) GND (FIXED) D101 PEG_TX15+ D102 PEG_TX15- D103 GND GND GND D104 VCC_12V VCC_12V VCC_12V D105 VCC_12V VCC_12V VCC_12V D106 VCC_12V VCC_12V VCC_12V D107 VCC_12V VCC_12V VCC_12V D108 VCC_12V VCC_12V VCC_12V D109 VCC_12V VCC_12V VCC_12V D110 GND (FIXED) GND (FIXED) GND (FIXED)

Specification Rev 013

Page 15

5 Hardware extensions

Wide Range Input Power for basic, extended and micro form factor

Wide range input power: +8.5VDC to +18VDC It allows direct operation from 108 nominal 3 cell lithium ion battery pack to 4-cell lithium-ion battery

packs (16,8 V fully charged) Additionally, Smart Battery Support offers a great base for a mobile application. See Software section

for more details

5.1.1 Wide Range Input Power for nano SmallFormFactor (SFF)

The nano modules should use a single main power rail with a wide range power supply of 5V to +14V+/-5% (4,75V to 14,7V)

Two additional rails are specified, a +5V standby power rail and a +3V battery input to power the module real-time clock (RTC) circuit in the absence of other power sources. The +5V standby rail could be left unconnected on the carrier board if the standby functions are not required by the application. Likewise, the +3V battery input may be left open if the application does not require the RTC to keep time in the absence of the main and standby sources. There may be module specific concerns regarding storage of system setup parameters that may be affected by the absence of the +5V standby and / or the +3V battery.

The rationale for this power-delivery scheme is:

• Module pins are scarce. It is more pin-efficient to bring power in on a higher voltage rail.

• Single supply operation is attractive to many users.

• Lithium ion battery packs for mobile systems are most prevalent with a +14.4V output. This is well suited for the +12V main power rail.

• Contemporary chipsets have no power requirements for +5V other than to provide a reference voltage for +5V tolerant inputs. No COM Express™ module pins are allocated to accept +5V except for the +5V standby pins. In the case of an ATX supply, the switched (non standby) +5V line would not be used for the COM Express™ module, but it might be used elsewhere on the carrier board.

Specification Rev 013

Page 16

5 Hardware extensions

5.2 GPIO General Purpose I/O Recommended Use

In general, GPIOs are defined for specific customers. Any generic GPIOs should be be set as well in order to assure compatibility of various COM Express™ compliant modules and carrier boards.

Pin Description Recomended Use Function Comment GPI0 General Purpose Input LID Button Power Management Event Please see Board Specification GPI1 General Purpose Input GPI2 General Purpose Input GPI3 General Purpose Input GPO0 General Purpose Output Fan Control TTL output for external fan Please see Board Specification GPO1 General Purpose Output GPO2 General Purpose Output GPO3 General Purpose Output

Specification Rev 013

Page 17

5.2.1 Alternative GPIO use for SDIO Interface

Pin GPIO SDIO Pin GPIO SDIO A54 GPI0 DATA0 B54 GPO1 CMD A63 GPI1 DATA1 B57 GPO2 WP A67 GPI2 DATA2 B63 GPO3 CD# A85 GPI3 DATA3 A93 GPO0 CLK

SDIO Pin description

Signal Type Description SD_DATA[3:0] I/O

CMOS3.3

SD_CMD I/O

CMOS3.3

SD1_CLK O

CMOS3.3

SD0_WP I

CMOS3.3

SD1_CD# I

CMOS3.3

SDIO Controller 0/1/2 Data: These signals operate in push-pull mode. The SD card includes internal pullup resistors for all data lines. By default, after powerup, only SDn_DATA0 is used for data transfer. Wider data bus widths can be configured for data transfer. SDIO Controller 0/1/2 Command: This signal is used for card initialization and transfer of commands. It has two operating modes: open-drain for initialization mode, and push-pull for fast command transfer. SDIO Controller 0/1/2 Clock: With each cycle of this signal a one-bit ransfer on the command and each data line occurs. This signal is generated by Intel SCH at a maximum frequency of: 24 Mhz for SD and SDIO. 48 Mhz for MMC. SDIO Controller 0/1/2 Write Protect: These signals denote the state of the write-protect tab on SD cards. SDIO Controller 0/1/2 Card Detect: Indicates when a card is present in an external slot.

5 Hardware extensions

Specification Rev 013

Page 18

5 Hardware extensions

5.3 Thermal Control

A three-pin fan header is stuffed onboard the module to support thermal control through the use of a fan. Through BIOS-settings, it is possible to control the fan depending on the Active Trip Point temperature. The fan switches on/off depending on the adjusted Active Trip Point temperature. In order for this feature to function properly, an ACPI compliant OS is necessary. (Except for nanoETXexpress modules)

- Part number (Molex): 53261-0390

- Mates with: 51021-0300

- Crimp terminals: 50079-8100

Electrical characteristics:

- Vcc = 5 V

- Imax (continuous) = 0,68 A

- Imax (pulsed) = 2 A

- Sense (Tacho-pulse) = 4 Pulses per turn

Specification Rev 013

Page 19

6 Software extensions

6.1 TPM support

Trusted Computing is a technology developed and promoted by the Trusted Computing Group (TCG). The term is taken from the field of trusted systems and has a specialized meaning. "Trusted computing" means that the computer will consistently behave in specific ways and those behaviors will be enforced by hardware and software.

Trusted computing encompasses five key technology concepts, of which all are required for a fully trusted system.

 Endorsement Key  Secure Input and Output  Memory curtaining / Protected execution  Sealed storage  Remote attestation

COM Express™ Extension COMs are designed to support basic TPM features. (more information: TBD)

COM Express™ Extension COMs are compliant to TCG 1.2. That includes efficient processing of hash and RSA algorithms with key length up to 2048bit and random generator.

This technology is necessary for all security -sensitive applications such as those for the gaming and ecommerce industries.

6.2 Smart Battery BIOS support

The BIOS supports smart battery to monitor the actual battery state on your system.

MARS is a Smart Battery reference System that is able to control up to two Smart batteries. The reference system will be implemented on a customized carrier board. The core of the SBS MARS is a dual Smart Battery System Manager. Additionally, the system contains a buck-boost converter at the input side, a dual buck converter and a buck-boost converter at the output side. There is also a CPLD used in MARS to get the functionality of an ATX power supply and for additional tasks.

Specification Rev 013

Page 20

6 Software extensions

MARS = Mobile Application platform for Rechargeable Systems Please following the link listed below to the document where you can find more information regarding

a Smart Battery reference system:

http://emea.kontron.com/products/computeronmodules/etx/mars.html

6.3 Legacy Super I/O support in BIOS

Although COM Express™ is meant for legacy free systems there still often is the need for legacy interfaces like serial port, parallel port, floppy, etc.

To make an adaption of these ports possible the BIOS of COM Express™ modules has integrated support for LPC SUPER I/O chips. For detailed description, please see the COM Express™ Design Guide.

More information:

http://www.comexpress-extension.com/datasheet/COM_Express_Design_Guide_Rev_14.pdf

6.4 CMOS backup in BIOS

CMOS backup is supported by the BIOS. Customer settings are saved in spite of battery remove in the EEPROM.

6.4.1 Console redirection in BIOS

(More information: TBD)

6.4.2 User editor for default settings

(More information: TBD)

Specification Rev 013

Page 21

7 Apendix A: PC Architecture Information

The following sources of information can help you better understand PC architecture.

7.1 Buses

7.1.1 ISA, Standard PS/2 – Connectors

 AT Bus Design: Eight and Sixteen-Bit ISA, E-ISA and EISA Design, Edward

Solari, Annabooks, 1990, ISBN 0-929392-08-6

 AT IBM Technical Reference Vol. 1 & 2, 1985  ISA & EISA Theory and Operation, Edward Solari, Annabooks, 1992, ISBN

0929392159

 ISA Bus Specifications and Application Notes, Jan. 30, 1990, Intel  ISA System Architecture, Third Edition, Tom Shanley and Don Anderson,

Addison-Wesley Publishing Company, 1995, ISBN 0-201-40996-8

 Personal Computer Bus Standard P996, Draft D2.00, Jan. 18, 1990, IEEE Inc  Technical Reference Guide, Extended Industry Standard Architecture Expansion

Bus, Compaq 1989

7.1.2 PCI

 PCI SIG

The PCI-SIG provides a forum for its ~900 member companies, who develop PCI products based on the specifications that are created by the PCI-SIG. You can search for information about the SIG on the Web.

 PCI & PCI-X Hardware and Software Architecture & Design, Fifth Edition,

Edward Solari and George Willse, Annabooks, 2001, ISBN 0-929392-63-9.

 PCI System Architecture, Tom Shanley and Don Anderson, Addison-Wesley, 2000,

ISBN 0-201-30974-2.

7.2 General PC Architecture

 Embedded PCs, Markt & Technik GmbH, ISBN 3-8272-5314-4 (German)  Hardware Bible, Winn L. Rosch, SAMS, 1997, 0-672-30954-8  Interfacing to the IBM Personal Computer, Second Edition, Lewis C. Eggebrecht,

SAMS, 1990, ISBN 0-672-22722-3

 The Indispensable PC Hardware Book, Hans-Peter Messmer, Addison-Wesley,

1994, ISBN 0-201-62424-9

Specification Rev 013

Page 22

 The PC Handbook: For Engineers, Programmers, and Other Serious PC Users,

Sixth Edition, John P. Choisser and John O. Foster, Annabooks, 1997, ISBN 0-

929392-36-1

7.3 Ports

7.3.1 RS-232 Serial

 EIA-232-E standard

The EIA-232-E standard specifies the interface between (for example) a modem and a computer so that they can exchange data. The computer can then send data to the modem, which then sends the data over a telephone line. The data that the modem receives from the telephone line can then be sent to the computer. You can search for information about the standard on the Web.

 RS-232 Made Easy: Connecting Computers, Printers, Terminals, and Modems,

Martin D. Seyer, Prentice Hall, 1991, ISBN 0-13-749854-3

7 Apendix A: PC Architecture Information

 National Semiconductor

The Interface Data Book includes application notes. Type “232” as search criteria to obtain a list of application notes. You can search for information about the data book on National Semiconductor’s Web site.

7.3.2 Serial ATA

 Serial AT Attachment (ATA) Working Group.  This X3T10 standard defines an integrated bus interface between disk drives and

host processors. It provides a common point of attachment for systems manufacturers and the system. You can search for information about the working group on the Web. We recommend you also search the Web for information on 4.2 I/O cable, if you use hard disks in a DMA3 or PIO4 mode.

7.3.3 USB

 USB Specification.  USB Implementers Forum, Inc. is a non-profit corporation founded by the group

of companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide a support organization and forum for the advancement and adoption of Universal Serial Bus technology. You can search for information about the standard on the Web.

Specification Rev 013

Page 23

7.4 Programming

 C Programmer’s Guide to Serial Communications, Second Edition, Joe Campbell,

SAMS, 1987, ISBN 0-672-22584-0

 Programmer’s Guide to the EGA, VGA, and Super VGA Cards, Third Edition,

Richard Ferraro, Addison-Wesley, 1990, ISBN 0-201-57025-4

 The Programmer’s PC Sourcebook, Second Edition, Thom Hogan, Microsoft

Press, 1991, ISBN 1-55615-321-X

 Undocumented PC, A Programmer’s Guide to I/O, CPUs, and Fixed Memory

Areas, Frank van Gilluwe, Second Edition, Addison-Wesley, 1997, ISBN 0-201-

47950-8

7 Apendix A: PC Architecture Information

Specification Rev 013

Page 24

8 APPENDIX B: DOCUMENT-REVISION

HISTORY

8 APPENDIX B: DOCUMENT-REVISION

HISTORY

Revision Date Edited by Changes

0.1 02.06.06 Z. Loncaric Created preliminary specification.

0.2 05.10.06 Z. Loncaric Index updates:

- no microETXexpress inputs anymore, now a separate specification

- new hardware, software and mechanical issues

0.3 02.04.07 Z. Loncaric Defined new chapter, 4.0 Signal Description, 4.1 Graphic signal description

0.4 02.04.07 Z. Loncaric / Aaron Su

0.5 15.05.07 Z. Loncaric / P. Müller

0.6 16.05.07 C. Van De Graaf

0.7 24.07.07 M. Ciolacu/ N. Feuerecker

1.1 31.05.08 VGG Add 3.1.2 new small form factor nano, add 5.2.1alternative GPIO use for SDIO

1.1 02.06.08 G.Szczuka Minor changes and grammar edits

1.2 11.06.08 VGG Minor changes, enter reverence to micro and nano

1.3 12.12.2008 G.Szczuka Correction of revision numbers 0.11 to 1.1 / 0.12 to 1.2

Neutral document format. Update by comments of Aaron Su.

Brand COM Express Extension, Updates for chapters: 4.1 Grafic signal description,

5.2 General GPIOs, 5.3 Thermal Control, 6.1 TPM Support, 6.3 Legacy SuperI/O Support

Minor message and grammar edits

New neutral layout

interface, add 5.1.1 wide Range for SFF

Specification Rev 013

Compaq COM Express Extension User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual