Compal LS-4683P KALA0 Schematic

A
B
COMPAL CONFIDENTIAL
C
D
E
MODEL NAME: PCB NAME:
1 1
COMPAL P/N: REVISION: DATE:
2 2
+3VS
3 3
<BOM Structure>
<BOM Structure> <BOM Structure>
<BOM Structure>
D2
D2
6
5
4
PJUSB208 SOT23-6
PJUSB208 SOT23-6
+3VS
CH3
Vp
CH4
R4 24_0402_5%
R4 24_0402_5%
1 2
R5 24_0402_5%
R5 24_0402_5%
1 2
JP1 - GOLD Finger CONN.
20mils
USB20_P10
20mils
KALA0 LS-4683P REV1.0 FP/B DA60000A310
1.0 2008/11/27
U1
U1
Vin
Vout
FLAGB
ON
GND
FPF2005_SC70-5
FPF2005_SC70-5
<BOM Structure>
<BOM Structure>
JP1
JP1
6
G2
3
2
1
5
G1
4
4
3
3
2
2
1
1
ACES_85201-04051
ACES_85201-04051
@
@
USB20_N10
20mils
20mils
20mils
USB20_N10DMINUS USB20_P10DPLUS
D2 close to JP1
CH2
Vn
CH1
+3VS +OVC_VDDA +3VS
20mils 20mils 20mils
5 1
3
OVC_DET#
4 2
0.22U_0603_16V7K
0.22U_0603_16V7K
R2
R2 100K_0402_5%
100K_0402_5%
1 2
R2 as close as possible to U1_5 and U1_3
<BOM Structure>
<BOM Structure>
2
C5
C5
1
<BOM Structure>
<BOM Structure>
+OVC_VDDA
R6 470_0402_5%
R6 470_0402_5%
+3VS
Y1 12MHZ_16P_DSX840GA
Y1 12MHZ_16P_DSX840GA
1 2
<BOM Structure>
<BOM Structure>
1 2
C6
C6
10P_0402_50V8J
10P_0402_50V8J
<BOM Structure>
<BOM Structure>
R8
R8 47K_0402_5%
47K_0402_5%
<BOM Structure>
<BOM Structure>
<BOM Structure>
<BOM Structure>
CLKSEL1 CLKSEL0
00
+OVC_VDDA
D6 D7
D10
OVC_DET#
RESET#
+3VDD
D9 D3
B2 C2
C3
CRYSTAL CLOCK SELECT FREQUENCY
10
S
S
20mils 20mils
1 2
+3VDD
R1
R1
1.8 +-1% 0402
1.8 +-1% 0402
<BOM Structure>
R1 as close as possible to U2_D6 and U2_D7
U2
U2
OVC_SENSE OVC_VDDA OVC_VDD OVC_DET# RESET#
SYS_CLK SYSCLKSEL1
SYSCLKSEL0
<BOM Structure>
VDDA_ON#
+3VDD
B5
B4
B6
VDDB3VDD
VDD
VDDA_ON#
AES1610
AES1610
Internal 57k pullup
Internal 57k pullup
VSS
VSS
VSS
VSS
VSS
A4
B1
B9
A10
C10
+VDDA
A2
VDDA
VSS
D4
6 MHz
12 MHz
SI2301BDS-T1-E3_SOT23-3
SI2301BDS-T1-E3_SOT23-3 Q1
Q1
D
D
13
G
G
2
<BOM Structure>
<BOM Structure>
A6
D2
A3
B7
B8
N/C
VDDA
C1
VSSL
C4
VDDA
VSSL
D8
VSSL
PLL_FILTER
A5
PLL_FILTER
1 2
R9
R9 1K_0402_5%
1K_0402_5%
<BOM Structure>
<BOM Structure>
DPLUS
DMINUS
DRIVE_RING2
D5
+VDDA
DMINUS DPLUS
C7
ENUM
C6
SF_CS#
C9
SF_CLK
C8
SF_WP#
B10
SF_MOSI
A7
SF_MISO
A8
GPO2
A9
GPO1
C5
GPO0
DRIVE_RING1
FDRV
AES1610-C-DF-TR-GO00-AC-BGA40
AES1610-C-DF-TR-GO00-AC-BGA40
A1
D1
C7
C7 10P_0402_50V8J
10P_0402_50V8J
1 2
1 2
C8
C8
<BOM Structure>
<BOM Structure>
1000P_0402_50V7K
1000P_0402_50V7K
1
C1
C1
0.1U_0402_16V4Z
0.1U_0402_16V4Z
2
<BOM Structure>
<BOM Structure>
12
R3
R3
1.5K_0402_1%
1.5K_0402_1%
<BOM Structure>
<BOM Structure>
SPI_MISO
FDRV
DRIVE_RING
<BOM Structure>
<BOM Structure>
+OVC_VDDA +3VDD+VDDA
R7
R7
100K_0402_1%
100K_0402_1%
<BOM Structure>
<BOM Structure>
1
C2
C2
0.1U_0402_16V4Z
0.1U_0402_16V4Z
2
<BOM Structure>
<BOM Structure>
1
C3
C3
0.1U_0402_16V4Z
0.1U_0402_16V4Z
2
<BOM Structure>
<BOM Structure>
C3 close to U2_B3 C4 close to U2_B6
C4
C4 1U_0402_6.3V4Z
1U_0402_6.3V4Z
<BOM Structure>
<BOM Structure>
R10 as close as possible to U2_A1 and U2_D1
R10
R10 47_0402_5%
47_0402_5%
Trace as short as possible 3 vias to GND plane
ZZZ1
ZZZ1
PCB
PCB
4 4
ZZZ2
ZZZ2
FFC
FFC
45@
45@
GND
20mils
1 2
R11
R11 0_0402_5%
0_0402_5%
R11 close to CONN.
<BOM Structure>
<BOM Structure>
20mils
GND_ESD
20mils 20mils
+3VS
Trace as short as possible 3 vias to +3VS plane
20mils
Add FD1~FD4 (20071207)
FD1
H_1P1
H_1P1
H2
H1
H1
H2
H_1P1
H_1P1
@
@
@
1
A
@
1
FD1
@
@
1
FIDUCIAL_C40M80
FIDUCIAL_C40M80
FD2
FD2
@
@
1
FIDUCIAL_C40M80
FIDUCIAL_C40M80
FD4
FD4
@
@
1
FIDUCIAL_C40M80
FIDUCIAL_C40M80
B
FD3
FD3
@
@
1
FIDUCIAL_C40M80
FIDUCIAL_C40M80
Security Classification
Security Classification
Security Classification
Issued Date
Issued Date
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
2008/11/27 2009/11/27
2008/11/27 2009/11/27
2008/11/27 2009/11/27
Compal Secret Data
Compal Secret Data
Compal Secret Data
1 2
D1
D1
6
CH3
5
Vp
4
CH4
PJUSB208 SOT23-6
PJUSB208 SOT23-6
D1 close to U2
Deciphered Date
Deciphered Date
Deciphered Date
<BOM Structure>
<BOM Structure>
CH2
CH1
DRIVE_RINGFDRV
3
2
Vn
D
20mils
1
GND_ESD
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
Size Document Number Rev
Size Document Number Rev
Size Document Number Rev
Custom
Custom
Custom
Date: Sheet
Date: Sheet
Date: Sheet
Compal Electronics, Inc.
SCHEMATIC FINGERPRINT/B S4683
SCHEMATIC FINGERPRINT/B S4683
SCHEMATIC FINGERPRINT/B S4683
4059VC
4059VC
Friday,November 27,2008
4059VC
E
B
B
B
of
of
of
11
11
11
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