PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
4
3
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
2
Date :Sheeto f
Compal Electronics, Inc.
Cover Sheet
Cover Sheet
Cover Sheet
LA-G871P
LA-G871P
LA-G871P
1109Tuesday, March 05, 2 019
1109Tuesday, March 05, 2 019
1109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
4
3
2
1
Merion14 AR Block Diagram
Memory BUS (DDR4)
DDR4 2400MHz for WHL-U
DD
2-Lane eDP1.3
P38
PCIE[5][6][7][8]
HDMI 1.4
CONN
EDP CONN
HDMI
P40
AR-SP
P42-4 3
SMBus
SATA[1]/PC IE[12]
M.2,2230 Key E
P52
USB2.0[7]USB2.0[10]
WLAN+BT/CNVi
PCIE[10]
P52
Left side TypeC
USB2.0
SD4.0
PCIE[9]
P70
P70
SMBus
Micro SIM
USB2.0[1] from PCH
CC
Card reader
RTS524 2
P45
PD Solut i on
TPS65982DD
P52
TBT
P44,50
M.2,3042 Key B
WWAN/LTE/HCA
PCIex2 for 2nd SSD and
Optane
CNVi
EDP
DDI[1]
DDI[2]
INTEL
WHL-U 42 MCP
PAGE 6~19
USB/PCIE MUX
PCIE[11]
HD3SS3212
P54
USB3.0[4]
SPI
SATA[2]/PCIE[16][15] [14][13]
Pop option
GD25B256 DYIG
BB
vPro use
256Mb 4K sector WSON8
P8
GD25B64CYIGR
Non-vPro use
64Mb 4K sector WSO N8
Smart Card
USH board
AA
TDA8034HN
RFID/NFC
Fingerprint
CONN
Fingerprint
MOCV
USH TPM1.2
BCM58202
SPI
SPI
FP-USB2.0
P66
USB2.0[8]
ESPI
SMSC KBC
MEC510 5
P58-5 9
GD25B127D SIGR
Non-vPro use
128Mb 4K sector SOP8
TPM2.0
ST-ST33HTPH 2032AHC 1
BC link
KB/TP CONN
PWM
FAN CONN
P8
P8
P63
P63
Up to 2x16GB Modules
USB
I2C
P66
USB2.0[2]
SLGC55544BVTR
USB POWER SHARE
HD Audio I/F
Reverse Type
DDR4-SO-DIMM X2
BANK 0, 1, 2, 3
P23~24
I2C[0]
USB2.0[6]
USB2.0[2]_PS
P71
USB3.0[2]
USB2.0[3]
USB3.0[3]
I2C[3]
HDA Codec
ALC3254
M.2 2280
SSD Conn
P56
P68
LCD Touch
USB3.0 Conn
PS(Ext Port 1)
USB3.0 Conn
(Ext Port 2)
ActiveSteeringAntenna(MB
)
INT.Speaker
Universal Jack
Dig. MIC
Camera
P38
P38
P71
P72
P56
P56
P38
Trough eDP Cable
Trough eDP Cable
Right side
Left side
P9
LED/B
Bettery LED
Breath LED
LID SWITCH
USH CONN
CPU&PCH XDP Port
AUTOMATIC POWER
SWITCH(APS)
DC/DC Interface
POWER ON/OFF SW
P64
P64
P66
P79
P79
P78
P77
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL . IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
5
4
3
PARTY WITHOUT DE LL'S EXPRESS WRITTEN CONSENT.
2
Title
Size
Size
Size
Date :Sheetof
Date :Sheetof
Date :Sheetof
Compal Electronics, Inc.
Block Diagram
Block Diagram
Block Diagram
Document Num berRe v
Document Num berRe v
Document Num berRe v
LA-G871P
LA-G871P
LA-G871P
1
2109Tuesday, March 05, 2019
2109Tuesday, March 05, 2019
2109Tuesday, March 05, 2019
1.0
1.0
1.0
5
smd.db-x7.ru
POWER STATES
Signal
State
S0 (Full ON) / M0
DD
S3 (Suspend to RAM) / M3LOW
S4 (Suspend to DISK) / M3
S5 (SOFT OFF) / M3
S3 (Suspend to RAM) / M-OFF
S4 (Suspend to DISK) / M-OFF
S5 (SOFT OFF) / M-OFF
CC
SLP
S3#
HIGH
LOW
LOW
LOWLOWLOW
LOWLOWLOWLOW
SLP
SLP
S5#
S4#
HIGH HIGH
HIGH HIGH
HIGH HIGH
LOW
LOW
LOW
HIGH HIGH
HIGH
SLP
A#
HIGH
HIGH
HIGH
LOW
4
ALW AYS
PLANE
ON
ONONON
ONON
ONON
ONON
ON
ON
M
PLANE
ON
OFFOFFOFF
OFFOFFOFFOFF
OFFOFFOFFOFF
SUS
PLANE
RUN
PLAN E
ONONON
OFF
OFF
OFF
OFF
OFFLOW
CLOCKS
OFF
OFF
OFF
3
USB3.0
USB3.0-1
USB3.0-2
USB3.0-3
USB3.0-4
USB3.0-5
USB3.0-6
SSIC
2
PCIE
PCIE-1
PCIE-2
PCIE-3
PCIE-4
SATA
N/A
JUSB1-->Right
JUSB2-->Lef t
M.2 3042(LTE)
PCIE-5
PCIE-6
Alpine Ridge - SP
PCIE-7
PCIE-8
PCIE-9
PCIE-10M.2 2230(BT)
PCIE-11
PCIE-12
SATA-0
SATA-1
Card Reader
M.2 2230(WLAN)
M.2 3042(LTE)
USB PORT#DESTINATION
1
2
3
4
5
6
7
8
9
10
1
DESTINATION
Type C
JUSB1-->Right
JUSB2-->Left
N/A
N/A
Camera
M2 3042(WWAN)
USH
Reserve for FPR in PB
PCIE-13
PCIE-14
PCIE-15
PCIE-16
SATA-1*
SATA-2
M.2 2280 SSD
(PCIex4 or SATA)
PM TABLE
+5V_ALW
+3.3V_ALW
BB
State
S0
S5 S4/AC
AA
S5 S4/AC doesn't existOFFOFFOFF
power
plane
5
+3.3V_ALW_DSW
+3.3V_ALW_PCH
+RTC_CELL
+1.8V_PRIM
+5V_ALW2
+3.3V_ALW2
+3.3V_RTC_LDO
+1.0V_PRIM
ON
ON
+1.2V_MEM
+2.5V_MEM
+1.0V_VCCSTG
ONON
OFFOFF
+5V_RUN
+3.3V_RUN
+0.6V_DDR_VTT
+1.8V_RUN
4
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
3
2
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
Port assignment
Port assignment
Port assignment
LA-G871P
LA-G871P
LA-G871P
3109Tuesday, March 05, 2 019
3109Tuesday, March 05, 2 019
3109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
Barrel
ADAPT ER
DD
CC
Type-C
ADAPTER
CHARGER
ISL9538
(PU700)
BATTERY
+13.5VB
4
SY8210A
(PU200)
SY8286R
(PU301)
SYV828C
(PU102)
SY8288B
(PU100)
SIO_SLP_S4#
0.6V_DDR_ VTT_ON
PCH_P RIM_EN
ALWO N
ALWO N
+1.2V_MEM
+0.6V_DDR_VTT
+1.0V_PRIM
+5V_ALW
+5V_ALW2
+3.3V_RTC_LDO
+3.3V_ALW2
+3.3V_ALW
3
TPS22961
(UZ27)
VCCSTG_ EN
SY8057BQ
(PU401)
SY8057CQ
(PU402)
EM5209
(UZ47)
SLGC55544C
(UI3)
SY6288
(UI1)
+VCCPLL_OC
RUN_ ON
PCH_P RIM_EN
RUN_ ON
USB_PW R_SHR_ VBUS_EN
USB_PW R_EN1#
2
TPS22961
(UZ19)
TPS22961
(UZ21)
+1.0VS_VCCIO
+1.0V_PRIM_CORE
+5V_RUN
+5V_USB_CHG_PWR
+USB_EX2_PWR
VCCSTG_ EN
RUN_ ON
+1.0V_VCCSTG
+1.0V_VCCST
Merion 14 Touch PWR is +5V
PJV1701
(QV8)
EM5209
(@UZ5)
3.3V_TS_EN
AUD_PW R_EN
+TS_PWR
+5V_RUN_AUDIO
1
CPU PWR
PCH PWR
Peripheral Device PWR
TYPE-C Power
RT8097A
FDMF3035
ISL95808
(PU614)
BB
IMVP_V R_ON
+5V_ALW
+20V_TBTA_VBUS_1(5V~20V)
FDMF3035
(PU612)
IMVP_V R_ON
+VCC_GT+VCC_SA
(PU610)
FDMF303 5
(PU613)
IMVP_V R_ON
+VCC_CORE
TPS65982DD
(UT5)
AO6405
(QV1)
EN_IN VPWR
+BL_PWR_SRC
+20V_TBTA_VBUS_1(5V~20V)
TYPE-C
(PU501)
EM5209
(UZ47)
EM5209
(UZ3)
EM5209
(UZ4)
G527ATP1U
(UV24)
AP7361C
(PU503)
PCH_P RIM_EN
WLAN_ PWR_EN
PCH_P RIM_EN
RUN_ ON
3.3V_W WAN_EN
EN_LC DPWR
SIO_SLP_S4#
+1.8V_PRIM
+3.3V_W LAN
+3.3V_ALW_PCH
+3.3V_RUN
+3.3V_W WAN
+LCDV DD
+2.5V_MEM
for D DR4
AOZ1336
(UZ8)
EM5209
(@UZ5)
PJV1701
(QZ1)
RUN_ ON
AUD_PW R_EN
3.3V_CAM_ EN#
+1.8V_RUN
+3.3V_RUN_AUDIO
+3.3V_CAM
AA
AP2204
(UT8)
5
+5V_ALW
+5V_TBT_VBUS
AP2112 K
(UT7)
4
+3.3V_VDD_PIC
Reserved
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EX PRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EX PRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET O F ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFO RMATION OF DELL INC. ("DELL ") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLO SED TO ANY THIRD
5
4
PARTY WITHOUT D ELL'S EXPRESS WRITTEN CONSENT.
3
2
Compal Electronics, Inc.
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
Size Document NumberRe v
Size Document NumberRe v
Size Document NumberRe v
Date :Sheetof
Date :Sheetof
Date :Sheetof
Power Sequence
Power Sequence
Power Sequence
LA-G871P
LA-G871P
LA-G871P
1
5109Tuesday, March 05 , 2019
5109Tuesday, March 05 , 2019
5109Tuesday, March 05 , 2019
1.0
1.0
1.0
5
smd.db-x7.ru
4
3
2
1
For 2LANE EDP
+3.3V_RUN
DD
CC
CPU_DP1_CTRL_CLK
12
RC5032.2K_0402_5%
CPU_DP1_CTRL_DATA
12
RC1782.2K_0402_5%
CPU_DP2_CTRL_CLK
12
RC1762.2K_0402_5%
CPU_DP2_CTRL_DATA
12
RC5022.2K_0402_5%
All VREF traces should
have 10 mil trace width
AR
+1.0VS_VCCIO
COMPENSATION PU FOR eDP
CAD Note:
Trace width=5 mils
Isolation Spacing=25mil,
Max length=100 mils.
driving it to opposite direction during strap sampling.
CPU_C10_GATE#
CN27
CM27
GPP_H21
CF25
RTD3_CIO_PWR_EN
CN26
GPP_H23
CM26
CK17
TBT_RTD3_WAKE#
BV35
CN20
TBT_FORCE_PWR
CG25
CH25
MEM_CONFIG0
CR20
MEM_CONFIG1
CM20
MEM_CONFIG2
CN19
MEM_CONFIG3
CM19
MEM_CONFIG4
CN18
CR18
CP18
CM18
CM16
CP16
CR16
CN16
EMMC_RCOMP
CK15
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXP RESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
CAD Note:
Trace width=12~15 mil, Spacing=20 mils
Max trace length= 500 mil
12
RC5121_040 2_1%
12
RC50480.6_0402_ 1%
12
RC7100_040 2_1%
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL . IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PLACE RC62 AND RC515 CLOS
TO THE SPI SIGNAL TO AVOID STUB
Disa bled
Enabled
MEM_SMBDATA
CH15
GPP_C2
CJ15
SML0_SMBCLK
CH14
SML0_SMBDATA
CF15
GPP_C5
CG15
SML1_SMBCLK
CN15
SML1_SMBDATA
CM15
GPP_B23
CC34
ESPI_IO0_R
CA29
ESPI_IO1_R
BY29
ESPI_IO2_R
BY27
ESPI_IO3_R
BV27
CA28
CA27
ESPI_CLK
BV32
BV30
GPP_A8
BY30
566439_CNL_PCH_UY_EDS_Vol_1_Rev_1. 1.pdf
External pull-up is required. Recommend 100K if pulled
up to 3.3V or 75K if pulled up to 1.8V. This strap should sample HIGH.
There should NOT be any on-board device driving it to opposite direction
during strap sampling.
Merion Limit height
QC2 change to SB000014O00 H=0.6mm(MAX)
+3.3V_RUN
1219 Change
MEM_SMBDATA
QC2
2
5
1
S1
G1
D1
S2
G2
D2
PJX138K_ SOT563-6
3
MEM_SMBCLK
6
4
DDR_XDP_WAN_SMBCLK <23,24,79>
DDR_XDP_WAN_SMBDAT <23,24,79>
DDR_XDP_WAN_SMBDAT
DDR_XDP_WAN_SMBCLK
GPP_A8
MEM_SMBCLK
MEM_SMBDATA
SML1_SMBCLK
SML1_SMBDATA
SML0_SMBCLK
SML0_SMBDATA
RTC_DET#
+3.3V_RUN
12
RC3182.2K_0402_5%
12
RC3192.2K_0402_5%
12
RC8498.2K_04 02_5%@
+3.3V_ALW_PCH
12
RC121 K_0402_5%
12
RC141 K_0402_5%
12
RC151 K_0402_5%
12
RC5071K_040 2_5%
12
RC347499_040 2_1%@
12
RC348499_040 2_1%@
12
RC86610K_02 01_5%
1031 change
Follow RVP pull up change to 4.7K
BB
PCH_SPI_D1_ R1<66>
PCH_SPI_D0_ R1<66>
PCH_SPI_CLK _R1<6 6>
Pop optio n at P.102
For vPro
256Mb WSON8 Flash ROM
For Non-vPro
PCH_SPI_CLK_1_RPCH_SPI_CLK_0_R
33_0402_5%
@EMI@
12
RC289
AA
33P_0402_50V8J
12
CC1452
5
33_0402_5%
@EMI@
12
RC299
@EMI@
33P_0402_50V8J
@EMI@
12
CC1453
PCH_SPI_CS#0_R1
PCH_SPI_D2_R1
PCH_SPI_CS#1_R1PCH_SPI_CS#1_R2
PCH_SPI_D2_R1
12
RC320_0201_5%@
12
RC3349.9_0201_1%
VPRO@
NVPRO@
12
RC3020_0201_5%
12
RC3533 _0201_1%
NVPRO@
4
PCH_SPI_CS#0_R2
PCH_SPI_D1_0_R
PCH_SPI_D2_0_R
PCH_SPI_D1_1_R
PCH_SPI_D2_1_R
64Mb WSON8 Flash ROM
UC5VPRO@
1
CS#
2
SO(IO1)
3
IO2
4
VSS
ThemalPad
GD25B256DYIG_W SON8_8X6
For Non-vPro
128Mb SOP8 Flash ROM
UC6NVPRO@
1
CS#
2
DO(IO1)
3
IO2
4
DI(IO0)
GND
GD25B127DS IGR_SO8
SOFTWARE TAA
VPRO PDG P.296 R1 50 ohm
PCH_SPI_D1_R1
RC73449.9_0201_ 1%VPRO@
PCH_SPI_D0_R1
RC57049.9_0201_ 1%VPRO@
PCH_SPI_CLK_R1
RC57149.9_0201_ 1%VPRO@
PCH_SPI_D3_R1
RC57249.9_0201_ 1%VPRO@
NVPRO follow PDG P.298 R1 33 ohm
PCH_SPI_D1_R1PCH_SPI_D1_1_R
RC57333_0201_1%NVPRO@
PCH_SPI_D0_R1
RC57433_0201_1%NVPRO@
PCH_SPI_CLK_R1
RC57533_0201_1%NVPRO@
PCH_SPI_D3_R1
RC57633_0201_1%NVPRO@
PDG SPI0 2 resistor 50ohm, SPI0 3 resistor 33ohm
CLOSEED TO ROM
Please place close for future replace to RP
+3.3V_SPI
8
PCH_SPI_D3_0_R
VCC
7
PCH_SPI_CLK_0_R
IO3
6
PCH_SPI_D0_0_R
SCLK
5
SI(IO0)
9
+3.3V_SPI
8
PCH_SPI_D3_1_R
VCC
7
PCH_SPI_CLK_1_R
IO
6
PCH_SPI_D0_1_R
CLK
5
3
12
12
12
12
12
12
12
12
CC9
1 2
0.1U_0201_1 0V6K
NVPRO@
CC10
1 2
0.1U_0201_1 0V6K
PCH_SPI_D1_0_R
PCH_SPI_D0_0_R
PCH_SPI_CLK_0_R
PCH_SPI_D3_0_R
PCH_SPI_D0_1_R
PCH_SPI_CLK_1_R
PCH_SPI_D3_1_R
Pop optio n at P.102
Pop optio n at P.102
VPRO PDG P.296 R2 5 ohm
NVPRO PDG P.298 R2 10 ohm
12
RC240_ 0201_5%NVPRO@
12
RC254. 99_0201_1%
VPRO@
12
RC264. 99_0201_1%
VPRO@
12
RC274. 99_0201_1%
VPRO@
12
RC280_ 0201_5%@
12
RC294. 99_0201_1%
VPRO@
12
RC304. 99_0201_1%
VPRO@
+3.3V_SPI
+3.3V_ALW _PCH
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL . IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DE LL'S EXPRESS WRITTEN CONSENT.
PROM_BIOS_R<63 >
12
RC310_ 0201_5%@
DC4
RB521CM-30T2R _SOD923-2
PCH_SPI_CS# 1_R1
PCH_SPI_D0_ R1
PCH_SPI_D1_ R1
PCH_SPI_CLK _R1
PCH_SPI_CS# 0_R1
PCH_SPI_D2_ R1
PCH_SPI_D3_ R1
21
PCH_SPI_CS# 1
PCH_SPI_D0
PCH_SPI_D1
PCH_SPI_CLK
PCH_SPI_CS# 0
PCH_SPI_D2
PCH_SPI_D3
JSPI1
CONN@
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
10
11
11
12
12
13
13
14
14
15
15
16
16
17
17
18
18
19
19
20
20
21
GND1
22
GND2
ACES_5050 6-02041-P01
2
DELL CONFIDENTIAL/PROPRIETARY
GPP_C2
RC2664.7K _0402_5%
TLS CONFIDENTIALITY
HIGH
LOW(DEFAULT)
GPP_C5
RC2774.7K _0402_5%
GPP_C5
@
RC39720K _0402_5%
EC interface
HIGH
LOW (DEFAULT)
GPP_B23
RC317150K_0402_5%
for DCI-OOB
EXI BOOT STALL BYPASS
HIGH
LOW(DEFAULT)
WEAK INTERNAL PD
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
Size
Size
Size
Date :Sheetof
Date :Sheetof
Date :Sheetof
Compal Electronics, Inc.
CPU(3/14)SPI,ESPI,SMB,LPC
CPU(3/14)SPI,ESPI,SMB,LPC
CPU(3/14)SPI,ESPI,SMB,LPC
Document Num berRe v
Document Num berRe v
Document Num berRe v
LA-G871P
LA-G871P
LA-G871P
1
12
ENABLE
DISABLE
12
12
ESPI
LPC
12
ENABLED
DIABLED
+3.3V_ALW_PCH
+3.3V_ALW_PCH
+3.3V_ALW_PCH
8109Tuesd ay, March 05, 2 019
8109Tuesd ay, March 05, 2 019
8109Tuesd ay, March 05, 2 019
1.0
1.0
1.0
5
smd.db-x7.ru
@
T12
PAD~D
TPM_PIRQ#< 66>
PCH_3.3V_TS_EN<38>
RC710,RC711 change to 33oh m from 75ohm,
DD
PU OPTION TO AVOID RSP SIGNALS
+1.8V_PRIM
CC
+3.3V_RUN
BB
FROM FLOATING IN CASE INTERNAL PUS NOT ENABLED IN A0
I2C3_A NT for ACTIVE S TEERING ANT for MERIO N
+3.3V_ALW_PC H
12
RC8314.7K_0402_5 %
12
12
12
12
12
12
NRB_BIT
RC72420K _0402_5%@
RC73320K _0402_5%@
RC747100K_0402_ 5%@
RC84110K_0402_5 %@
RC5122.2K_ 0201_5%
RC5132.2K_ 0201_5%
CNV_BRI_PRX_DTX<52>
CNV_RGI_PTX_DRX_R<52>
CNV_BRI_PTX_DRX_R<52>
CNV_RGI_PRX_DTX<52>
CNV_BRI_PRX_DTX
CNV_RGI_PRX_DTX
PCH_3.3V_TS_ EN
GPP_A7
I2C3_ANT_SDA
I2C3_ANT_SCL
M.2 CNVI MODES
0 = Integrated CNVi enable.
1 = Integrated CNVi disable. (Disable CNVi for bring up)
WEAK INTERNAL PU
follow Intel MOW WW32
12
RC71033_0402_5 %
12
RC71133_0402_5 %
RC710,RC711 place d closer to PCH.
3MM_CAM_DET #<38>
P_SENSOR_PWR_SAVE#<38>
SMART_SPK_DET1#<56>
TS_INT#<38>
TS
TP
Follow RVP,PDG pull up change to 20K
+1.8V_PRIM
TS_I2C_SDA<38 >
TS_I2C_SCL<38>
I2C1_SDA_TP<63>
I2C1_SCK_TP<63>
@
T388
PAD~D
@
T389
PAD~D
566439_CNL_PCH_LP__EDS_Rev1p2
P.119 Primary Well Group H (Per-pad 1.8 V or 3.3 V)
Please setting 3.3V
add I2C3 TP for for sensor IC(Reserved)
add I2C3_ANT TP for ACTIVE STEERING ANT for MERION
NB_MODE for NB13/Bandon
LID_CL#_NB for NB13/Bandon
LID_CL#_TAB for NB13/Bandon
ISH_ALS_INT# for Merion
6
5
Link CI1804M1HRG-NH done 0212
VR_LPM_R# <87>
2
IR_CAM_DET# <38>
1
@
T420
PAD~D
1
@
T415
PAD~D
1
@
T416
PAD~D
ISH_I2C1_ALS_SDA <38>
ISH_I2C1_ALS_SCL <38>
ISH_I2C2_SDA <52>
ISH_I2C2_SCL <52>
Reserve
WWAN_FULL_PWR _EN <52>
SIO_EXT_WAKE# <5 8>
LCD_CBL_DET# < 38>
1
@
T421
PAD~D
1
@
T395
PAD~D
1
@
T396
PAD~D
1
@
T397
PAD~D
ISH_ALS_INT# <38>
1
@
T375
PAD~D
1
@
T376
PAD~D
1
@
T377
PAD~D
TBT_DET#
RF Request
SML0B_SMBCL K
PRIM_CORE_OPT_ DIS
SIO_EXT_WAKE#
SML0B_SMBCLK
SML0B_SMBDATA
GPP_D12
LCD_CBL_D ET#
IR_CAM_DET#
ISH_I2C2_SDA
ISH_I2C2_SCL
1
+3.3V_ALW_PCH
@
RC400
10K_0402_5 %
12
12
10K_0402_5 %
RC401
1 2
CC1476@RF@33P _0402_50V8J
Place close CPU side
12
RC85410K_04 02_5%@
12
RC74810K_04 02_5%
12
RC8291K_040 2_5%@
12
RC8301K_040 2_5%@
12
RC847100K_0 402_5%
12
RC749100K_0 402_5%
RC345100K_0 402_5%
12
RC3631K_040 2_5%
12
RC3621K_040 2_5%
+3.3V_ALW_PCH
12
TBT_DET#
HIG HNON AR
LOWAR
+3.3V_RUN
+3.3V_RUN
+3.3V_ALW_PC H
AA
12
2.2K_0402_5 %
RC46
@
GPP_B22
BOOT BIOS Dest i nat i on(Bi t 6)
HIGH
LOW(DEFAULT)
LPC
SPI
5
10K_0402_5%
12
DIMM Detect
HIGH
LOW
RC53
ONE_DIMM#
1 DIMM
2 DIMM
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EX PRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EX PRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WR ITTEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date:Sheeto f
Date:Sheeto f
Date:Sheeto f
Compal Electronics, Inc.
CPU(5/14)PCIE,USB,SATA
CPU(5/14)PCIE,USB,SATA
CPU(5/14)PCIE,USB,SATA
LA-G871P
LA-G871P
LA-G871P
10109Tuesday, March 05, 2019
10109Tuesday, March 05, 2019
10109Tuesday, March 05, 2019
1
1.0
1.0
1.0
5
smd.db-x7.ru
CLK_PCIE_N0<52>
M.2 3042 WWAN--->
DD
M.2 2230 WLAN--->
M.2 2280 SSD--->
Card Reader --->
AR--->
+3.3V_ALW_DSW
RC32310K_0402_5%
CC
RC671K _0402_5%
+1.0V_VCCST
RC711K _0402_5%
RC53610K_0 402_5%@
PCH GLITCH ISSUE MIT IGATION(PDG p.130)
BB
+3.3V_ALW_PCH
AA
H_CPUPW RGD VCCST_PWRGD
100P_0402_50V8J
12
CC300ESD@
CLK_PCIE_P0<52>
CLKREQ_PCIE#0<52>
+3.3V_RUN
CLK_PCIE_N1<52>
CLK_PCIE_P1<52>
CLKREQ_PCIE#1<52>
+3.3V_RUN
CLK_PCIE_N2<68>
CLK_PCIE_P2<68>
CLKREQ_PCIE#2<68>
+3.3V_RUN
+3.3V_RUN+RTC_CELL_PCH
CLK_PCIE_N4<70>
CLK_PCIE_P4<70>
CLKREQ_PCIE#4<70>
+3.3V_RUN
CLK_PCIE_N5<42>
CLK_PCIE_P5<42>
CLKREQ_PCIE#5<42>
+3.3V_RUN
LAN_W AKE#
12
PCH_PCIE_W AKE#
12
VCCST_PW RGD
12
PCH_PW ROK
12
SIO_SLP_SUS #
12
RC229100K_0402_ 5%
12
CC14650.33U_040 2_10V6K@
SIO_SLP_S4#
12
RC232100K_0402_ 5%
12
CC14670.33U_040 2_10V6K@
SIO_SLP_S3#
12
RC231100K_0402_ 5%
12
CC14680.33U_040 2_10V6K@
SIO_SLP_A#
12
RC233100K_0402_ 5%
12
CC14690.33U_040 2_10V6K@
SIO_SLP_W LAN#
12
RC234100K_0402_ 5%
12
CC14700.33U_040 2_10V6K@
SIO_SLP_LAN #
12
RC761100K_0402_ 5%
12
CC14710.33U_040 2_10V6K@
SIO_SLP_S5#
12
RC230100K_0402_ 5%@
PCH_PLTRST#
12
RC237100K_0402_ 5%@
1211 change
Follow NB14 UU AR, Intel CNVi recommendation RC237 pop,
But measure cold reset and Global reset sequence timing fail, So depop RC237
SIO_SLP_S0#
12
RC763100K_0402_ 5%
100P_0402_50V8J
12
CC301ESD@
ESD Request:place near CPU side
5
12
RC2970_0 201_5%@RF@
12
RC18910K _0402_5%
12
RC5260_0 201_5%@RF@
12
RC52210K _0402_5%
12
RC7270_0 201_5%@RF@
12
RC52510K _0402_5%
12
RC52310K _0402_5%
12
RC5280_0 201_5%@RF@
12
RC5110K_0402_5 %
12
RC5290_0 201_5%@RF@
12
RC19010K _0402_5%
PCH_PLTRST#
MC74VHC1G0 8DFT2G_SC70-5
S4 power side PD need @,need check
RC215
POP
NO Support Deep sleep
DE-POP
Support Deep sleep
PCH_DPW ROKPCH_ RSMRST#_AND
12
0.01UF_0402_25V7K
100K_0402_1%
12
1
@
CC266
RC220
2
UC7
@NDS3@
RC215
0_0201_5%
CLKREQ_PCIE #0_R
CLKREQ_PCIE #1_R
CLKREQ_PCIE #2_R
CLKREQ_PCIE #3_R
CLKREQ_PCIE #4_R
CLKREQ_PCIE #5_R
+3.3V_ALW_PCH
5
1
P
B
2
A
G
3
T355
12
4
O
@
PAD~D
10K_0402_5%
RC75
4
PCH_PLTRST#_AND
12
RC65
@
100K_0402_ 5%
1
VCCST_PWRGD<59,79>
ME_SUS_PWR_ACK is for LPC use only
PCH_PLTRST#_A ND
.047U_0402_16V7K
12
CC196ESD@
4
CPU@
UC1J
AW2
CLKOUT_PCIE_N_0
AY3
CLKOUT_PCIE_P_0
CF32
GPP_B5/SRCCLKREQ0#
BC1
CLKOUT_PCIE_N_1
BC2
CLKOUT_PCIE_P_1
CE32
GPP_B6/SRCCLKREQ1#
BD3
CLKOUT_PCIE_N_2
BC3
CLKOUT_PCIE_P_2
CF30
GPP_B7/SRCCLKREQ2#
BH3
CLKOUT_PCIE_N_3
BH4
CLKOUT_PCIE_P_3
CE31
GPP_B8/SRCCLKREQ3#
BA1
CLKOUT_PCIE_N_4
BA2
CLKOUT_PCIE_P_4
CE30
GPP_B9/SRCCLKREQ4#
BE1
CLKOUT_PCIE_N_5
BE2
CLKOUT_PCIE_P_5
CF31
GPP_B10/SRCCLKREQ5#
WHL-U42 _BGA1528
PCH_PLTRST#_AND <38 ,42,52,68,70>
SYS_RESET#<79>
PCH_RSMRST#_AND<63,79>
12
RC771K _0402_5%@
12
RC7862 _0402_5%
Follow PDG P.251
SYS_PW ROK<58,79>
PCH_PWROK<88>
PCH_DPWROK<58>
T380
SUSACK# is for LPC use only
For E SD solution
T381
PCH_PCIE_WAKE#<42,58,59>
LAN_WAKE#<58>
@
T422
PAD~D
@
PAD~D
@
PAD~D
CLOCK SINGNALS
10 of 20
PCH_PLTRST#
SYS_RESET#
PCH_RSMRS T#_AND
H_CPUPW RGDH_ CPUPWRG D_R
VCCST_PW RGD_CPU
1
1
LAN_W AKE#
PM_LANPH Y_ENABLE
1
XDP_DBRESET#<79>
GPP_A13
GPP_A15
CLKOUT_ITPXDP_N
CLKOUT_ITPXDP_P
GPD8/SUSCLK
XTAL_IN
XTAL_OUT
XCLK_BIASREF
CLKIN_XTAL
RTCX1
RTCX2
SRTCRST#
RTCRST#
CPU@
UC1K
BJ35
GPP_B13/PLTRST#
CN10
SYS_RESET#
BR36
RSMRST#
AR2
PROCPWRGD
BJ2
VCCST_PWRGOOD
CR10
SYS_PWROK
BP31
PCH_PWROK
BP30
DSW_PWROK
BV34
GPP_A13/SUSWARN#/SUSPWRDACK
BY32
GPP_A15/SUSACK#
BU30
WAKE#
BU32
GPD2/LAN_WAKE#
BU34
GPD11/LANPHYPC
WHL-U42 _BGA1528
+3.3V_ALW_PCH
12
1
2
3
CLK_ITPXDP_N
AU1
CLK_ITPXDP_P
AU2
BT32
CK3
CK2
CJ1
CM3
BN31
BN32
BR37
BR34
PCH_PLTRST#
PCH_PLTRST#_A ND
Support DS3
No Support DS3
@
12
RC530
12
RC298
SUSCLK
XTAL24_IN_CPU
XTAL24_OUT_CPU
XCLK_BIASR EF
REFCLK_CNV
PCH_RTCX1
PCH_RTCX2
SRTCRST#
PCH_RTCRST# <58,79>
PCH_RTCRST#
CMOS1 DVT1.0 footprint change to SHORTPADS-NPM
CMOS1 must take care short & touch risk on layout placement
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL . IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DE LL'S EXPRESS WRITTEN CONSENT.
Follow NB14 UU AR
'CNV_RF_RESET#' change to 75K PD from 71.5K
'CLKREQ_CNV#' change to 71.5K PD from 75K
RC75271.5K_04 02_1%
RC64075K_0402_5%
RC86875K_0402_5%
1218
Follow NB14 UU AR
Add 75K PD for 'CNVI_EN#'
RC1832.2K_0402_5%@
TOP SWAP STRAP
HIGH
LOW(DEFAULT)
Internal 20k PD
+3.3V_ALW_PCH
RC1874.7K_0402_5%@
Flash Descriptor Security override
HIGH
LOW(DEFAULT)
RF Request. Place near CPU side (Intel MOW)
1
2
HDA_RST#
CC331
2.2P_0402_50V8C
@RF@
HDA_SDIN0
1
2
CC332
@RF@
HDA_SDOUT
1
2
CC333
2.2P_0402_50V8C
2.2P_0402_50V8C
@RF@
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WR ITTEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date:Sheeto f
Date:Sheeto f
Date:Sheeto f
Compal Electronics, Inc.
CPU(7/14)MISC,JTAG,HDA,SDIO
CPU(7/14)MISC,JTAG,HDA,SDIO
CPU(7/14)MISC,JTAG,HDA,SDIO
LA-G871P
LA-G871P
LA-G871P
12109Tuesday, March 05, 2019
12109Tuesday, March 05, 2019
12109Tuesday, March 05, 2019
1
1.0
1.0
1.0
5
smd.db-x7.ru
4
3
2
1
12
RC1201K_0201_1%@
EAR-STALL/NOT STALL RESET
SEQUENCE AFTER PCU PLL IS LOCKED
CFG0
DD
12
RC4051K_0201_1%@
PCH/ PCH LESS MODE SELECTION
CFG1
12
RC4061K_0201_1%@
PCI EXPRESS STATIC LANE REVERSAL
FOR ALL PEG PORTS
CFG2
CC
12
RC4071K_0201_1%@
PCH/ PCH LESS MODE SELECTION
CFG3
12
RC7231K_0201_1%
0: AN EXTERNAL DISPLAY PORT DEVICE PORT IS CONNECTED TO THE EMBEDDED PORT
1: NO PHYSICAL DISPLAY PORT ATTACHED TO EMBEDDED DISPLAY PORT
01: DEVICE1 FUNTION 1, DISABLED, DEVICE 1 FUNCTION2 ENABLED
00: DEVICE 1 FUNCTION 1 ENABLED, DEVICE 1 FUNCTION 2 ENABLED
PMSYNC AYNC MODE- PM SYNC
1: (DEFAULT)SYNCHCRONOUS (1 24 MHZ CYCLE PER BIT)
CFG13
0: ASYNC - 4-24MHZ CYCLES PER BIT
AA
RC4181K_0201_1%@
12
CFG14CFG15
RC4191K_0201_1%@
12
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
CFG14CFG15
5
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WR ITTEN CONSENT.
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date:Sheeto f
Date:Sheeto f
Date:Sheeto f
Compal Electronics, Inc.
CPU(8/14)CFG,RSVD
CPU(8/14)CFG,RSVD
CPU(8/14)CFG,RSVD
LA-G871P
LA-G871P
LA-G871P
13109Tuesday, March 05, 2019
13109Tuesday, March 05, 2019
13109Tuesday, March 05, 2019
1
1.0
1.0
1.0
5
smd.db-x7.ru
+1.0V_VCC ST
RC2181K_0201 _1%
12
12
RC21949.9_020 1_1%@
+1.0V_VCC STG
RC5581K_0201 _1%
12
DD
+3.3V_RUN
12
RC8210K _0201_5%@
12
RC56710K_020 1_5%
CC
H_THERMTRIP#_ R
H_CATERR#
PROCHOT#
TOUCH_SCREE N_PD#
TOUCHPAD_INTR#
PECI_EC<58>
PROCHOT#<58, 84,88>
H_THERMTRIP#<23,24 ,59>
PROCHOT#
TOUCH_SCREEN_DET#<38>
TOUCHPAD_INTR#<58,63>
4
12
RC84499 _0402_1%
12
RC5590_0201_5%@
XDP_OBS0_R<79 >
XDP_OBS1_R<79 >
@
T366
PAD~D
@
T367
PAD~D
12
12
RC106
49.9_0201_1%
H_CATERR#
PROCHOT#_R
H_THERMTRIP#_ R
XDP_OBS 2_R
1
XDP_OBS 3_R
1
MEM_INTERLE AVED
TOUCH_SCREE N_PD#
TOUCHPAD_INTR#
CPU_POPI RCOMP
PCH_POPI RCOMP
EDRAM_OP IO_RCOMP
EOPIO_RC OMP
12
12
RC107
RC108
RC109
49.9_0201_1%
@
@
49.9_0201_1%
49.9_0201_1%
need check
RC108,RC109
This is applicable only for CFL U43e. These pins are
RSVD in WHL and hence can be left unconnected
Merion Limit height
QC4 change to SB000014O00 H=0.6mm(MAX)
TOUCH_SCREEN_PD# don't move to RPC,
TOUCH_SCREE N_PD#
TOUCH_SCREE N_PD
1219 Change
QC4
@
2
5
12
RC5660 _0201_5%@
1
S1
G1
D1
S2
G2
D2
PJX138K _SOT563-6
3
TOUCH_SCREE N_PD
6
4
1
TOUCH_SCREEN_PD#_R
+3.3V_RUN
12
RC104
@
10K_020 1_5%
TOUCH_SCREEN_PD#_R <38>
Reserve for Panel side TS PH voltage problem
+3.3V_ALW_PCH
@
RC843
10K_020 1_5%
MEM_INTERLE AVED
@ESD@
CC304
@ESD@
0.1U_0201_25V6K
1
CC305
2
12
12
RC844
10K_020 1_5%
DIMM TYPE
HIGHInterlea ve
Non-In terleave
LOW
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER P ROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DIS CLOSED TO ANY THIRD
5
4
3
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
2
Title
Size
Size
Size
Date:Sheeto f
Date:Sheeto f
Date:Sheeto f
Compal Electronics, Inc.
CPU(9/14)XDP
CPU(9/14)XDP
CPU(9/14)XDP
Document NumberRe v
Document NumberRe v
Document NumberRe v
LA-G871P
LA-G871P
LA-G871P
1
14109Tuesday, March 05, 2019
14109Tuesday, March 05, 2019
14109Tuesday, March 05, 2019
1.0
1.0
1.0
5
smd.db-x7.ru
PSC(Primary side cap) : Place as close to the package as possible
BSC(Backside cap) : Place on secondary side, underneath the package
CAD Note: Place the PU resistors close to CPU
RC154 close to CPU 1000 - 1500mils
H_CPU_SVIDALRT#
12
RC155220_0402_5%
CAD Note: Place the PU resistors close to CPU
RC156close to CPU 1000 - 1500mils
VIDSOUT_R
12
RC1570_0201_5%@
CAD Note: Place the PU resistors close to CPU
RC158close to CPU 1000 - 1500mils
12
VIDSCLK_R
RC1590_0201_5%@
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WR ITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WR ITTEN CONSENT.
WHL_U PDG rev0. 8 P.479
VCCIO:
Primary Side cap
4x 1uF 0201
Primary or Secondary Side
6x 10uF 0402
Placeholder Only
4x 10uF 0402
1
1
CC1461
CC1460
2
2
1U_0201_6.3V6M
1U_0201_6.3V6M
1U_0201_6.3V6M
PDG P.479 0402
1
1
CC236
CC237
2
2
10U_0402_6.3V6M
10U_0402_6.3V6M
10U_0402_6.3V6M
1
1
CC41
CC42
2
2
@
@
10U_0402_6.3V6M
10U_0402_6.3V6M
10U_0402_6.3V6M
RC164
100_0402_1%
VSS_SENSE_SA <88>
VCC_SENSE_SA <88>
1
1
CC51
2
2
10U_0402_6.3V6M
RC165
@
0_0201_5%
CC52
10U_0402_6.3V6M
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL . IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
5
4
3
PARTY WITHOUT DE LL'S EXPRESS WRITTEN CONSENT.
2
Title
Size
Size
Size
Date :Sheetof
Date :Sheetof
Date :Sheetof
Compal Electronics, Inc.
CPU(12/14)PWR-VCCIO,MEM
CPU(12/14)PWR-VCCIO,MEM
CPU(12/14)PWR-VCCIO,MEM
Document Num berRe v
Document Num berRe v
Document Num berRe v
LA-G871P
LA-G871P
LA-G871P
1
17109Tuesday, Marc h 05, 2019
17109Tuesday, Marc h 05, 2019
17109Tuesday, Marc h 05, 2019
1.0
1.0
1.0
5
smd.db-x7.ru
4
3
2
1
close UC1 <100mil
12
LC1LQM18PN2R2NC0L_2P~D
RC422
@
0.01_0603_1%
12
DD
0809 BSOD
Pop LC2 INDUCTOR,CC100 22U_0603
+1.0V_PRIM+1.0V_CLK
depop RC175
Add CC103 22U_0603
12
LC2LQM18PN2R2NC0L_2P~D
RC175
@
0.01_0603_1%
12
CC100/CC103 one is close to the
CPU and the other is far fr om the CPU.
0801 Confirmed with
Intel can change to 0201,
Follow MOW Delete CC74
DCPRTC
1
2
PCH Internal VRM
close to BP24
CAD NOTE: CAPs
1.8V @0. 696 A
3.0V @0. 002 A
CC76
@
1U_0201_6.3V6M
+VCCDPHY_1P24
+1.8V_PRIM
+RTC_CELL_PCH
1
1
CC73
CC72
2
2
1U_0201_6.3V6M
0.1U_0201_6.3V6K
PDG0.8 P.505 0402
0801 Confirmed with
Intel can change to 0201
PCH Internal VRM
close to CP25
1
PDG P.505 0402
CC84
2
4.7U_0402_6.3V6M
+3.3V_ALW_DSW
3.3V @0. 199 A
1
CC1464 close to CP23
PDG0.8 P.505 0402 reserve
CC1464
2
0801 Confirmed with
Intel can change to 0201
@
1U_0201_6.3V6M
CC72/CC73 close to BR23
1
CC1463 close to BR24
CC1463
2
PDG0.8 P.505 0402 reserve
0801 Confirmed with
@
Intel can change to 0201
1U_0201_6.3V6M
+3.3V_ALW_DSW+3.3V_ALW_PCH
12
RC4400_0402_5%@NDS3@
12
RC2140_0201_5%@
+3.3V_ALW_DSW_R
12
RC4390_0402_5%DS3@
22U_0402_6.3V6M
22U_0402_6.3V6M
@
@
1
1
CC279
CC280
2
2
AA
Support DS3
No Support DS3
RC439
RC440RE53 6RC215R C441RC44 2
VVV
X
VVV
XX
X
X
'V' mean POP, 'X' mean DE-POP
5
QC7 c hange to SB00000SS00
For Merion layout l imit height
QC7
DS3@
NTK3139PT1G_SOT723-3
13
D
2
0.1U_0402_25V6K
12
12
@
CC340
X
L2N7002WT1G_SC-70-3
13
D
DS3@
S
QC6
+3.3V_ALW
S
499K_0402_1%
DS3@
12
G
RC432
100K_0402_5%
49.9K_0402_1%
DS3@
RC433
2
G
RC431
12
VCCDSW_EN_GPIO <11>
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF E NGINEERING DRAWING A ND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT M AY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
MCP(14/14)VSS
MCP(14/14)VSS
MCP(14/14)VSS
LA-G871P
LA-G871P
LA-G871P
19109Tuesday, March 05, 2 019
19109Tuesday, March 05, 2 019
19109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
DD
CC
4
3
2
1
Reserve
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
SOC or PCH / FCH
SOC or PCH / FCH
SOC or PCH / FCH
LA-G871P
LA-G871P
LA-G871P
20109Tuesday, March 05, 2 019
20109Tuesday, March 05, 2 019
20109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
DD
CC
4
3
2
1
Reserve
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
SOC or PCH / FCH
SOC or PCH / FCH
SOC or PCH / FCH
LA-G871P
LA-G871P
LA-G871P
21109Tuesday, March 05, 2 019
21109Tuesday, March 05, 2 019
21109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
DD
CC
4
3
2
1
Reserve
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
SOC or PCH / FCH
SOC or PCH / FCH
SOC or PCH / FCH
LA-G871P
LA-G871P
LA-G871P
22109Tuesday, March 05, 2 019
22109Tuesday, March 05, 2 019
22109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
DDR_A_DQS#[0..7]<7>
DDR_A_D[0..63]<7>
DDR_A_DQS[0..7]<7>
DDR_A_MA[0..16]<7>
Layout Note:
Place near JDIMM1
DD
CC
+1.2V_MEM
12
+1.2V_MEM
1
2
10U_0603_10V6M
CD1
12
1U_0201_6.3V6M
1
CD9
2
10U_0603_10V6M
10U_0603_10V6M
CD2
CD3
12
12
1U_0201_6.3V6M
1U_0201_6.3V6M
1
1
CD10
CD11
2
2
0801 Confirmed with
Intel 1U can change to 0201
Layout Note:
Place near
JDIMM1.258
Refence WHL R VP rev0 .7
10U_0603_10V6M
10U_0603_10V6M
CD5
CD4
12
12
1U_0201_6.3V6M
1U_0201_6.3V6M
1
1
CD12
CD13
2
2
10U_0603_10V6M
1U_0201_6.3V6M
Refence WHL R VP rev0 .7
+0.6V_DDR_VTT
10U_0603_10V6M
10U_0603_10V6M
@
12
12
CD63
BB
DIMM Select
SA01SA1
0
DIMM1
*
DIMM2
1
0
DIMM3
1
DIMM4
AA
1U_0201_6.3V6M
1U_0201_6.3V6M
1
1
CD22
CD24
CD23
2
2
0801 Confirmed with
Intel 1U can change to 0201
SA2
0
0
0
0
0
0
1
1U_0201_6.3V6M
1
CD69
2
12
12
Merion Limit height
CD17 change to SGA0000AM00 H=1.0mm(MAX)
WHL_U PDG rev0.8 P.92
VDDQ:
4 near each side of the DIMM
220U_D7_2VM_R4.5M
10U_0603_10V6M
10U_0603_10V6M
connector close to VDD pins
16x 10uF 0603
@
1
16x 1uF 0402
CD6
12
CD14
1
2
RD4
@
0_0201_5%
RD5
@
0_0201_5%
1U_0201_6.3V6M
1
2
1U_0201_6.3V6M
CD70
CD17
CD7
CD8
12
+
Placehold er
1x 330uF 7343
2
VPP :
DIMM pin side, 1 p er DIMM
2x 10uF 0603
2x 1uF 0402
+2.5V_MEM
1U_0201_6.3V6M
1
CD16
CD15
2
WHL_U PDG rev0.8 P.92
VTT:
Place on VTT plane close to SODIMM
2x 10uF 0603(1 cap stuffed, 1 placeholder)
4x 1uF 0402
VDD SP D:
Place close to DIMM
2x 0.1uF 0402
2x 2.2uF 0402
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL . IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL . IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
5
4
3
PARTY WITHOUT DE LL'S EXPRESS WRITTEN CONSENT.
2
Title
Size
Size
Size
Date :Sheetof
Date :Sheetof
Date :Sheetof
Compal Electronics, Inc.
DDR4 DIMMB
DDR4 DIMMB
DDR4 DIMMB
Document Num berRe v
Document Num berRe v
Document Num berRe v
LA-G871P
LA-G871P
LA-G871P
1
24109Tuesday, Marc h 05, 2019
24109Tuesday, Marc h 05, 2019
24109Tuesday, Marc h 05, 2019
1.0
1.0
1.0
5
smd.db-x7.ru
DD
CC
4
3
2
1
Reserve
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
DDR_2
DDR_2
DDR_2
LA-G871P
LA-G871P
LA-G871P
25109Tuesday, March 05, 2 019
25109Tuesday, March 05, 2 019
25109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
DD
CC
4
3
2
1
Reserve
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
DDR_3
DDR_3
DDR_3
LA-G871P
LA-G871P
LA-G871P
26109Tuesday, March 05, 2 019
26109Tuesday, March 05, 2 019
26109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
DD
CC
4
3
2
1
Reserve
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
DGPU
DGPU
DGPU
LA-G871P
LA-G871P
LA-G871P
27109Tuesday, March 05, 2 019
27109Tuesday, March 05, 2 019
27109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
DD
CC
4
3
2
1
Reserve
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
DGPU
DGPU
DGPU
LA-G871P
LA-G871P
LA-G871P
28109Tuesday, March 05, 2 019
28109Tuesday, March 05, 2 019
28109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
DD
CC
4
3
2
1
Reserve
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
DGPU
DGPU
DGPU
LA-G871P
LA-G871P
LA-G871P
29109Tuesday, March 05, 2 019
29109Tuesday, March 05, 2 019
29109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
5
smd.db-x7.ru
DD
CC
4
3
2
1
Reserve
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOU T THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRIT TEN CONSENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date :Sheeto f
Date :Sheeto f
Date :Sheeto f
Compal Electronics, Inc.
DGPU
DGPU
DGPU
LA-G871P
LA-G871P
LA-G871P
30109Tuesday, March 05, 2 019
30109Tuesday, March 05, 2 019
30109Tuesday, March 05, 2 019
1
1.0
1.0
1.0
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