@ : Nopop Component
1@ : Use TCM only
2@ : Use TAA only
3@ : Use BROADCOM TPM only
4@ : Use without TAA only
5@ : Use with BKT only
6@ : Use without BKT only
7@ : Use disable TPM only
8@ : Use with TCM depop
9@ : Use with ZTE TCM
44
MB PCB
Part NumberDescription
DAA00000Q1L
PCB 03S LA-4151P REV0 M/B
A
10@ : Use with Jetway TCM
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
DESTINATION
MINI CARD-1 WWAN
MINI CARD-2 WLAN
None
EXPRESS CARD
None
None
10/100/1G LAN
DOCKING
USH->BIO10
Camera
PCI TABLE
REQ#/GNT#
R5C833REQ#1 / GNT#1AD17
AA
PIRQPCI DEVICEIDSEL
PIRQ[C..D]
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Index and Config.
LA-4151P
357Friday, July 04, 2008
1
1.0
of
5
4
3
2
1
RUN_ON
FDS4435
Q16
+INV_PWR_SRC
ADAPTER
DD
GFX_CORE_ON
ADP3209
(PU15)
+VGFX_COREP
BlackTop function
BATTERY
+PWR_SRC
RUN_ON&BKT_GPIO4
STS11NF30L
(Q145)
+5V_RUN_
BKT_PWR
+15V_ALW
CHARGER
CC
ALW_ON
3.3V_SUS_ON
ISL6236
(PU2)
SI3456BDV
(Q60)
(PU7)(PU14)
IMVP_VR_ON
+VCC_CORE+0.75V_DDR_VTT+1.5V_MEM
MAX8794ISL6260
(PU12)
1.8V_RUN_ON
+1.8V_RUN+1.05V_M
TPS51100D
GQRG4
0.75V_DDR_VTT_ON
VT351FC
(PU25,PU26)
ISL6236
(PU2)
1.5V_RUN_ON
DDR_ON
SI4336DY
(Q128)
ALWON
ALWON
+5V_ALW
+3.3V_ALW
ENAB_3VLAN
STS11NF30L
RUN_ON
3.3V_RUN_ON&BKT_GPIO3
3.3V_RUN_ON
(Q44)
STS11NF30L
BKT_GPIO2
SI4336DY
(Q61)
(Q55)
MAX8511(LDO)
(U103)
BlackTop function
SI4336DY
+5V_RUN
+1.5V_ALW_HDA
(Q140)
+5V_ALW
BB
HDDC_EN
MODC_EN
+3.3V_SUS
RUN_ON
1.05V_RUN_ONM_ON
SI4336DY
Q67
+1.5V_RUN
On I/O board
+3.3V_LAN
REGCTL_PNP1
REGCTL_PNP18
+3.3V_RUN
+3.3V_RUN_
BKT_PWR
BCP69BCP69
SI3456BDVSI3456BDV
(Q29)(Q32)
AA
+5V_HDD
+5V_MOD
TPA6040
(U9)
+VDDA
+1.05V_VCCP
(Q4)SI3456BDV
(Q3)
(Q143)
+3.3V_BKT_PWR
+1V_LAN_M
+1.8V_LAN_M
SI4336DY
(Q137)
+3.3V_RUN_
WWAN_PWR
DELL CONFIDENTIAL/PROPRIETARY
on I/O board
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
H_THERMTRIP# should connect
to ICH9 and G MCH without
T-ing(no stub )
+1.05V_VCCP
ITP_BPM#2
R1000
ITP_BPM#3
R1001
ITP_BPM#4
R1002
ITP_BPM#5
H_RESET#
R57124_0402_1%~D
ITP_TDO
12
12
12
12
12
12
12
CLK_CPU_ITP<6>
CLK_CPU_ITP#<6>
12
R5822.6_0402_1%~D
Layout Note: for ITP700Flex debug port with a XDP based Run Control Tools
ITP_BPM#[0..5], TCK, and TMS routings
must be a maximum of 1.5ns = 7500 mil
ITP_BPM#[0..5], and TCK to FBO routings
must be length matched to within 50ps = 250 mil
Place R67 close to JITP pin 5
TCK to FBO routing should refer to debug port design guide
H_RESET# should be routed from GMCH with split to ITP conn. Refer to DG page #56
Depop JITP, C19,C20,R62, R64, R67, R977, R65, R66
JITP1
28
VTT1
27
VTT0
26
VTAP
25
DBR#
24
DBA#
23
BPM0#
22
GND5
21
BPM1#
20
GND4
19
BPM2#
18
GND3
17
BPM3#
16
GND2
15
BPM4#
14
GND1
13
BPM5#
12
RESET#
11
FBO
10
GND0
9
BCLKP
8
BCLKN
7
TDO
6
NC2
5
TCK
4
NC1
3
TRST#
2
TMS
1
TDI
0.1U_0402_16V4Z~D
C19
12
29
GND6
GND7
MOLEX_52435-2891_28P~D@
30
0.1U_0402_16V4Z~D
1
C20
2
ITP_DBRESET#
ITP_BPM#5
51_0402_1%~D
ITP_TDI
ITP_TRST#
+1.05V_VCCP
12
12
12
H_RESET#
51_0402_1%~D
ITP_TDO
ITP_TMS
ITP_TCK
R1059
@
R6256_0402_5%~D
R6439_0402_5%~D
R6727_0402_5%
Place close to JITP within 200ps = 1000 mil
when JIP connector is depopulated
Place close to CPU within 200ps = 1000 mil
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Penryn Processor(1/2)
LA-4151P
757Friday, July 04, 2008
1
1.0
of
5
4
3
2
1
+VCC_CORE+VCC_CORE
DD
CC
BB
12
Place CAP close to the TEST4 pin
AA
Make sure TEST4 routing is reference
to GND and away from other noisy signals.
For the purpose of testability, route these signals
through a ground referenced Z0 = 55ohm trace that
ends in a via that is near a GND via and is
accessible through an oscilloscope connection.
Resistor placed within 0.5" of
CPU pin.Trace should be at least
25 mils away from any other
toggling signal. COMP0, COMP2
trace should be 27.4 ohm.
COMP1, COMP3 should be 55
ohm.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Place these inside
socket cavity on L8
(North side
Secondary)
+VCC_CORE
Place these inside
socket cavity on L8
(Sorth side
Secondary)
+VCC_CORE
Place these inside
socket cavity on L8
(North side
Primary)
Place these inside
socket cavity on L8
(Sorth side
Primary)
1
C24
10U_0805_4VAM~D
2
1
C34
10U_0805_4VAM~D
2
1
C44
10U_0805_4VAM~D
2
+VCC_CORE
1
@
C50
10U_0805_4VAM~D
2
South Side Secondary
+1.05V_VCCP
1
2
+VCC_CORE
2
1
+VCC_CORE
2
1
3
1
C25
10U_0805_4VAM~D
2
1
C35
10U_0805_4VAM~D
2
1
C45
10U_0805_4VAM~D
2
1
@
C51
10U_0805_4VAM~D
2
+VCC_CORE
C62
0.1U_0402_10V7K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
2
@
@
C1177
C1176
1
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
2
@
@
C1190
C1191
1
3
2
1
C26
10U_0805_4VAM~D
2
1
C36
10U_0805_4VAM~D
2
1
C46
10U_0805_4VAM~D
2
1
C52
10U_0805_4VAM~D
2
270U_D_2VM_R4.5M~D
270U_D_2VM_R4.5M~D
1
1
+
2
C57
C56
+
2
1
C63
0.1U_0402_10V7K~D
2
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
2
2
@
@
C1178
C1179
1
1
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
2
2
@
@
C1192
C1193
1
1
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
270U_D_2VM_R4.5M~D
1
+
2
1
2
1U_0402_6.3V6K~D
2
@
C1180
1
1U_0402_6.3V6K~D
2
@
C1194
1
1
C27
10U_0805_4VAM~D
2
1
C37
10U_0805_4VAM~D
2
1
@
C48
10U_0805_4VAM~D
2
1
@
C53
10U_0805_4VAM~D
2
C58
C64
0.1U_0402_10V7K~D
1U_0402_6.3V6K~D
2
@
C1181
1
1U_0402_6.3V6K~D
2
@
C1195
1
1U_0402_6.3V6K~D
2
@
1
1U_0402_6.3V6K~D
2
@
1
1
2
1
2
1
2
1
C65
0.1U_0402_10V7K~D
2
1U_0402_6.3V6K~D
2
C1182
1
1U_0402_6.3V6K~D
2
C1196
1
C28
10U_0805_4VAM~D
C38
10U_0805_4VAM~D
@
C49
10U_0805_4VAM~D
1
@
C54
10U_0805_4VAM~D
2
2
@
C1183
1
2
@
C1197
1
1
C29
10U_0805_4VAM~D
2
1
C39
10U_0805_4VAM~D
2
1
@
C55
10U_0805_4VAM~D
2
High Frequence Decoupling
10uF 0805 X6S -> 85 degree C
1
C66
0.1U_0402_10V7K~D
2
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
2
@
@
C1184
C1185
+VCC_CORE
1
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
2
@
@
C1199
C1198
1
2
1
C30
10U_0805_4VAM~D
2
1
C40
10U_0805_4VAM~D
2
1
C67
0.1U_0402_10V7K~D
2
1
C31
10U_0805_4VAM~D
2
1
C41
10U_0805_4VAM~D
2
Place these inside
socket cavity on L8
(North side
Secondary)
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Low = DMI x 2
High = DMI x 4 (Default)
Low = iTPM enable
High = iTPM disable(Defult)
Low = TLS cipher s u i t e wit h n o c onfidentiality
High = TLS cip h e r s u i t e with
confidentiality(Default)
Low = Reverse Lane
High = Normal O p e r a t i o n(Default)
Low=Dynamic O D T Disable
High=Dynamic ODT Enable(default)
Low=Normal (default)
High=Lane Reversed
Low=Only SDVO or PCIEx1 is
operational (default)
High=SDVO and P C I E x 1 a r e o p e rating
simultaneously via PEG port
Low=No SDVO Device Present
(default)
High=SDVO Dev i ce Present
Follow ERB,CRB option
to select +1.05V_M or
+1.05V_VCCP
0.1U_0402_16V4Z~D
1
C119
2
+VCCPRUN
220U_D2_4VY_R15M~D
+1.5V_RUN_QDAC
1
2
64.8mA Max.64.8mA Max.
+1.8V_RUN_LVDS
+3.3V_RUN+1.05V_VCCP
12
R122
@
10_0603_5%~D
C145
@
0.1U_0402_16V4Z~D
0.01U_0402_25V7K~D
1
C738
C737
2
+1.05V_M_MPLL
0.1U_0402_16V4Z~D
1
2
0.1U_0402_16V4Z~D
1
2
@
PJP61
12
PAD-OPEN 1x1m
L44
BLM18PG181SN1_0603~D
C132
12
1
2
10UH_LB2012T100MR_20%_0805~D
1
+
C742
2
1
12
PJP1
PAD-OPEN1x1m
12
L6
@
1
LBC2518T91NM_1210~D
+
2
+1.5V_RUN
12
L5
LQH32CNR15M33L_1210~D
R120
0_0603_5%~D
C133
22U_0805_6.3VAM~D
220U_D2_4VY_R15M~D
12
+1.05V_MPLL
+1.05V_M
L46
12
C740
12
L47
HK1608R10J-T_0603~D
+VCC_PEG
+1.05V_M
+VCC_TX_LVDS+1.8V_RUN
22U_0805_6.3V6M~D
1000P_0402_50V7K~D
C745
1
1
C744
2
2
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
CANTIGA GMCH SFF_FCBGA1363~D
5
4
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
DDRIII-SODIMM SLOT1
LA-4151P
1657Fr id ay, July 04, 2008
1
1.0
of
5
4
3
2
1
+1.5V_MEM
DDR_B_D0
DDR_B_D1
DDR_B_DM0
DDR_B_D2
DDR_B_D3
DDR_B_D8
DDR_B_D9
DDR_B_DQS#1
DDR_B_DQS1
DDR_B_D10
DDR_B_D11
DDR_B_D16
DDR_B_D17
DDR_B_DQS#2
DDR_B_DQS2
DDR_B_D18
DDR_B_D19
DDR_B_D24
DDR_B_D25
DDR_B_DM3
DDR_B_D26
DDR_B_D27
DDR_CKE2_DIMMB
DDR_B_BS2
DDR_B_MA12
DDR_B_MA9
DDR_B_MA8
DDR_B_MA5
DDR_B_MA3
DDR_B_MA1
M_CLK_DDR2
M_CLK_DDR#2
DDR_B_MA10
DDR_B_BS0
DDR_B_WE#
DDR_B_CAS#
DDR_B_MA13
DDR_CS3_DIMMB#
DDR_B_D32
DDR_B_D33
DDR_B_DQS#4
DDR_B_DQS4
DDR_B_D34
DDR_B_D35
DDR_B_D40
DDR_B_D41
DDR_B_DM5
DDR_B_D42
DDR_B_D43
DDR_B_D48
DDR_B_D49
DDR_B_DQS6
DDR_B_D50
DDR_B_D51
DDR_B_D56
DDR_B_D57
DDR_B_DM7
DDR_B_D58
DDR_B_D59
2.2U_0603_6.3V6K~D
+0.75V_DDR_VTT
C216
C215
1
1
2
2
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Place C223 close to the Q8 as possible
Place C224, C225 close to the Guardian pins as possible
470P_0402_50V7K~D
Place C228 close to the Guardian pins as possible
1
C227
@
100P_0402_50V8K~D
2
12
R142 0_0603_5%~D
0.1U_0402_16V4Z~D
2
C223
@
Rset=1.5K,Tp=95degree
+3.3V_M
AA
5
4
D2
21
2
B
Q8
MMST3904-7-F_SOT323-3~D
2
B
Q9
MMST3904-7-F_SOT323-3~D
12
R151
1.5K_0402_1%~D
2200P_0402_50V7K~D
+5V_RUN
4
C219
1U_0603_10V4Z~D
1
2
0.1U_0402_16V4Z~D
1
C234
2
1
2
22U_0805_6.3VAM~D
BC_DAT_EMC4002<34>
BC_CLK_EMC4002<34>
2
C224
2200P_0402_50V7K~D
1
C228
C230
3.3V_M_PWRGD<34,37>
ICH_PWRGD#<37>
10U_0805_10V4Z~D
+3.3V_RUN
C235
1
2
3
+3.3V_M
12
R136
10K_0402_5%~D
FAN1_DET#<22>
1
2
R1461K_0402_5%~D
R1481K_0402_5%~D
+3V_M_THRM
10U_0805_10V4Z~D
0.1U_0402_16V4Z~D
1
1
C237
C236
2
2
EC_32KHZ_OUT<34>
Pull-up Resistor
on ADDR_MODE/XEN
<= 4.7K +/- 5%2F(r/w)
*
10K
18K
>= 33K
+FAN1_VOUT
FAN1_TACH_FB
REM_DIODE1_N
REM_DIODE3_P
REM_DIODE3_N
+3V_M_THRM
+RTC_CELL_R
12
12
THERMATRIP1#
THERMATRIP2#
THERMATRIP3#
VSET
12
R1504.7K_0402_5%~D
+FAN1_VOUT
FAN1_TACH_FB
EC_32KHZ_OUT
For Remote1
mode
2N3904
2N3904
Thermistor
Thermistor
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
JFAN1
1
1
2
2
3
3
4
4
5
GND
6
GND
MOLEX_53780-0470
U3
EMC4002
10
SMDATA/BC-LINK_DATA
11
SMBCLK/BC-LINK_CLK
36
DP1/VREF_T
35
DN1/THERM
38
DP2
37
DN2
41
DP3/DN7
40
DN3/DP7
4
VCC
21
RTC_PWR3V
THERMTRIP_SIO/PWM1/GPIO5
18
VCC_PWRGD
17
3V_PWROK#
22
THERMTRIP1#
23
THERMTRIP2#
24
THERMTRIP3#
42
VSET
3
ADDR_MODE/XEN
6
VDD_5V
5
VDD_5V
9
VDD_3V
7
FAN_OUT
8
FAN_OUT
15
TACH1/GPIO3
14
CLK_IN/GPIO2
SMBUS
Address
2E(r/w)
2F(r/w)
2E(r/w)
200K_0402_1%~D
DP6/VREF_T2
ATF_INT#/BC-LINK_IRQ#
POWER_SW#
ACAVAIL_CLR
VDDH/VDD_5V2
VDDH/VDD_5V2
VDDL/VDD_3V2
LDO_OUT/FAN_OUT2
LDO_OUT/FAN_OUT2
TACH2/GPIO4
PWM2/GPIO1
VSS
49
0_0402_5%~D
R1033
VIN1
VCP1
VCP2
DP4/DN8
DN4/DP8
DP5/DN9
DN5/DP9
DN6/VIN2
SYS_SHDN#
LDO_SHDN#
LDO_POK
LDO_SET
POWER_SW#
12
R1032
12
39
48
45
REM_DIODE4_PREM_DIODE1_P
44
REM_DIODE4_N
43
47
46
1
2
R14110K_0402_5%~D
12
POWER_SW#
26
27
20
25
R1081
@
19
R14910K_0402_5%~D
34
LDO_SET
33
+3V_LDOIN
32
31
28
29
30
16
13
+RTC_CELL
5
IN1
4
O
IN2
3
12
R10630_0402_5%~D@
12
R10640_0402_5%~D@
2
12
R10614.7K_0402_5%~D
Place C221 close to the
Guardian pins as possible.
12
C1158 0.1U_0402_16V4Z~D
12
P
G
U93
74AHC1G08GW_SOT353-5~D
BC_INT#_EMC4002 <34>
ACAV_IN <34,46>
12
10K_0402_5%~D
12
2.5V_RUN_PWRGD <33,37>
+1.8V_RUN_LVDS
10U_0805_10V6K~D
1
2
1
R1430_0402_5%~D
2
R1440_0402_5%~D
2
1
PWR_MON_GFX <47>
PWR_MON <45>
MAX8731_IINP
1
C221
2
2200P_0402_50V7K~D
THERMISTOR OPTION:
Single-ended ro ut in g t o thermistor is permissible
(ground retu r n ) . Pl a c e R139 and C226 near EMC4002
+3.3V_M
0.1U_0402_16V4Z~D
1
C239
C238
2
12
12
MAX8731_IINP <46>
12
R139
1.2K_0402_1%~D
R14510K_0402_5%~D
12
R14747K_0402_1%~D@
+3.3V_SUS
10U_0805_10V4Z~D
1
1
@
C232
2
2
PM_EXTTS#0 <10,16,17>
DOCK_PWR_SW# <34>
POWER_SW_IN# <34>
Diode circui t a t DP 4 /DN4 is used for skin
temp sensor (p la ce d o ptimally between CPU,
MCH and MEM).
C
Q7
2
B
MMST3904-7-F_SOT323-3~D
E
31
12
R140
10KB_0603_1%_TSM1A103F34D3R~D
12
C226
0.1U_0402_16V4Z~D
12
At maximum loa d c ur rent of 600mA,the the
voltage drop a c r o ss the should be keep
in the range of 0.5V to 1V
0.1U_0402_16V4Z~D
R152
0_1210_5%~D
C233
+3.3V_M
THERM_STP# <42>
+RTC_CELL
+3.3V_RUN
12
1
C222
@
100P_0402_50V8K~D
2
Place C222 close to Q7 as
possible.
LDO_SET
Voltage margi ning circuit
for LDO output. Adjustable
from 1.2 to 2.5V.
Ra=((LDO_OUT /1.2)-1)*Rb.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
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BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
ICH9-M(1/4)
LA-4151P
2257Fr id ay, July 04, 2008
1
1.0
of
5
DD
+3.3V_ALW_ICH
GLAN_DOCK#
12
R22110K_0402_5%~D
CMOS settingCMOS_CLR1
Shunt
Open
Shunt
Open
CC
ICH_AZ_MCH_SDOUT<10>
ICH_AZ_MCH_SYNC<10>
ICH_AZ_MCH_RST#<10>
ICH_AZ_MCH_BITCLK<10>
BB
Clear CMOS
Keep CMOS
TPM settingME_CLR1
Clear ME RTC Registers
Keep ME RTC Registers
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
CardBus/SD card Socket
LA-4151P
2857Fr id ay, July 04, 2008
1
1.0
of
5
4
3
2
1
IO connector II
DD
DAT_DDC2_CRT<20>
CLK_DDC2_CRT<20>
CC
TYCO_2041070-6
FP_SW_USBD+<40>
FP_SW_USBD-<40>
JBIO3
1
1
2
2
3
3
4
4
5
5
6
6
7
GND
8
GND
R4220_0402_5%~D
R4230_0402_5%~D
USBP3-<24>
USBP3+<24>
+5V_FP
12
12
+5V_RUN
+3.3V_RUN
DAT_DDC2_CRT
CLK_DDC2_CRT
USBP3USBP3+
+5V_ALW
FP_USB_DFP_USB_D+
12
R873
@
0_0402_5%~D
FPRESET#
FP_USB_D+
FP_USB_D-
JBIO2
112
334
556
778
9910
11
11
13
13
151516
171718
191920
212122
232324
252526
27
27
29
29
31
GND
GND
32
GND
GND
33
GND
GND
TYCO_3-1775014-0~D
+3.3V_TP_PWR
+5V_TP_PWR
BAT54CW_SOT323~D
FP_USB_D-
2
4
6
8
10
12
12
14
14
16
18
20
22
24
26
28
28
30
30
34
35
36
1
RED_CRT
GREEN_CRT
BLUE_CRT
HSYNC_CRT
VSYNC_CRT
ESATA_USB_OC#
ESATA_USB_PWR_EN#
ESATA_IRX_DTX_N4_C
ESATA_IRX_DTX_P4_C
ESATA_ITX_DRX_P4
ESATA_ITX_DRX_N4
D82
3
2
U51
1
GND
IO2
2
IO1
VIN
PRTR5V0U2X_SOT143-4~D
RED_CRT <20>
GREEN_CRT <20>
BLUE_CRT <20>
HSYNC_CRT <20>
VSYNC_CRT <20>
ESATA_USB_OC# <24>
ESATA_IRX_DTX_N4_C <23>
ESATA_IRX_DTX_P4_C <23>
ESATA_ITX_DRX_P4 <23>
ESATA_ITX_DRX_N4 <23>
FP_RESET# <32>
BKT_GPIO17 <35>
FP_USB_D+
3
4
ESATA_USB_PWR_EN# <33>
+3.3V_TP_PWR
Place close to
JBIO1.1
+3.3V_TP_PWR
+5V_TP_PWR
0.1U_0402_16V4Z~D
1
1
C770
2
2
0.1U_0402_16V4Z~D
@
C1035
USB PORT#
0
1
2
3
4
5
6
7
9
11
JUSB1 (Ext Right Side Top)
BLT mode
NC
JESATA1 (Ext Left Side Bottom)
WLAN
WWAN
BT
Card Bus/Express card
DOCKING8
DOCKING
USH->BIO10
Camera
DESTINATION
BB
JSPK1
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
GND
11
GND
MOLEX_53780-0919
Speaker Connector
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Series from EC to LPC_EN_R
Series from EC to LPD#
Pull-up on LPD#
Pull-up on EC
Pull-down on China TPM
Series from EC to China PD#
Broadcom USH
China TPM
LPCBus Series Resistors
TPM_ID(Strap Low)ICH9M GP I O6 Pin AH21POP
PART/PINDESCRIPTIONB0 USHA0 USHRef Des
USH pin R6 LPCEN
USH pin R6 LPCEN
EC to USH Pin R6 LPCEN
EC to USH Pin P7 LPCPD_N
USH pin P7 LPCPD_N
SIO pin 105 OUT65
To China TPM U24 pin 28
SIO to China Pin 28 LPCPD#
U32 USH
U24 China TPM
R705,R723,R7 24,R732,R733
R841
R483
3@ R464
R466
R474
R788
1@ R892
1@ R893
U32
1@ U24
3@
1@ R988
POPPOP
@
@
@
@
@
@
POP
@@
POPPOP
3@ R987@POP@POP
BA0
PIN9
0
1
0
1@ is for TCM
3@ is for Broadcom TPM only
9@ is for ZTE TCM
10@ is for Jetway TCM
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Place close to JDOCK1 connectorPlace close to JDOCK1 connector
BB
DPB_LANE_P0_C
10
DPB_LANE_N0_C
9
DPB_LANE_P1_C
7
DPB_LANE_N1_C
6
DPB_LANE_P2_C
10
DPB_LANE_N2_C
9
DPB_LANE_P3_C
7
DPB_LANE_N3_C
6
DPB_DOCK_AUX
10
DPB_DOCK_AUX#
9
DPB_DOCK_HPDDPB_DOCK_HPD
7
DPB_DOCK_CA_DETDPB_DOCK_CA_DET
6
DOCK_LOM_SPD10LED_GRN#<21>
DPB_DOCK_CA_DET<21>
DPB_LANE_P0_C<12>
DPB_LANE_N0_C<12>
DPB_LANE_P1_C<12>
DPB_LANE_N1_C<12>
DPB_LANE_P2_C<12>
DPB_LANE_N2_C<12>
DPB_LANE_P3_C<12>
DPB_LANE_N3_C<12>
+NBDOCK_DC_IN_SS
DOCK_SMB_DAT<34>
DOCK_PWR_BTN#<34>
DPB_DOCK_AUX<21>
DPB_DOCK_AUX#<21>
DPB_DOCK_HPD<21>
BLUE_DOCK<20>
RED_DOCK<20>
GREEN_DOCK<20>
HSYNC_DOCK<20>
VSYNC_DOCK<20>
CLK_MSE<34>
DAT_MSE<34>
DAI_BCLK#<21>
DAI_LRCK#<21>
DAI_12MHZ#<21>
D_LAD0<33>
D_LAD1<33>
D_LAD2<33>
D_LAD3<33>
D_LFRAME#<33>
D_CLKRUN#<33>
D_SERIRQ<33>
D_DLDRQ1#<33>
CLK_PCI_DOCK<6>
DOCK_SMB_CLK<34>
DOCK_SMB_ALERT#<34,41>
DOCK_PSID<41>
SLICE_BAT_PRES#<33,41,48>
+DOCK_PWR_BAR
0.1U_0603_50V4Z~D
DOCK_DET_1
DPB_LANE_P0_C
DPB_LANE_N0_C
DPB_LANE_P1_C
DPB_LANE_N1_C
DPB_LANE_P2_C
DPB_LANE_N2_C
DPB_LANE_P3_C
DPB_LANE_N3_C
DPB_DOCK_AUX
DPB_DOCK_AUX#
DPB_DOCK_HPD
BLUE_DOCK
RED_DOCK
GREEN_DOCK
DAI_DI<21>
DAI_DO#<21>
SLICE_BAT_PRES#
2
3
1
C1034
2
D73
1
AA
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
12
R4731K_0402_5%~D
12
R4834.7K_0402_5%~D7@
12
R7371K_0402_5%~D
12
R4794.7K_0402_5%~D
12
R9504.7K_0402_5%~D@
Pull-downs for 5880
Rev A0, and pull-ups
for Rev B0
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
+3.3V_ALW
0.1U_0402_16V4Z~D
C1112
0.1U_0402_16V4Z~D
C679
3
BKT_GPIO1
BKT_GPIO2
BKT_GPIO3
BKT_GPIO4
BKT_GPIO5
BKT_GPIO6
BKT_GPIO7
BKT_GPIO8
BKT_GPIO9
BKT_GPIO11
BKT_GPIO12
For LVDS signals switch
For BKT power switch
For TP power swich&USB signal switch
For AMP/TP power source&USB signal switch
For LID_Closed
For PAD_Out
For BKT Reset
For USB_SEL_BLK
For Radio_OFF
Biometric mux switch
For WLAN antenna mux control
RSB_DET#BKT_GPIO13
BKT_GPIO14
BKT_GPIO15
For Inverter Power
For WWAN Power
BKT_GPIO16For SMBALERT
For Biometic reset signalBKT_GPIO17
BKT_GPIO18
BKT_GPIO19
TP_DATA
TP_CLK
1
2
3
10P_0402_50V8J~D
C680
For LVDS Power switch
For TP Power
L41
12
BLM18AG601SN1D_0603~D
12
L42
10P_0402_50V8J~D
BLM18AG601SN1D_0603~D
1
C681
2
2
RTC BATT@
Part NumberDescription
GC20323MX00
FAN@
Part NumberDescription
DC28A000800
Speak@
Part NumberDescription
PK230003Q0L
SM CARD BODY
Part NumberDescription
SP070007V0L
PCMCIA BODY
Part NumberDescription
DC000001Q0L
PWR cable@
Part NumberDescription
NBX00009O0L
LCD-LED cable@
Part NumberDescription
DC02000KC0L
LED cable@
Part NumberDescription
DA300003O0L
TOUCH PAD cable@
Part NumberDescription
NBX0000BA0L
Bluetooth cable@
+5V_ALW
R594
C682
4.7K_0402_5%~D
12
10P_0402_50V8J~D
1
2
R595
DAT_TP_SIO
CLK_TP_SIO
C683
DAT_TP_SIO <34>
CLK_TP_SIO <34>
4.7K_0402_5%~D
12
10P_0402_50V8J~D
1
2
Part NumberDescription
NBX00009L0L
SW cable@
Part NumberDescription
NBX0000BF0L
Finger print cable@
Part NumberDescription
NBX00009M0L
1
BATT CR2032 3V
220MAH MAXELL
FAN SET DAQ20 DC5V AB7405HB-HB3 ADDA
SPK PACK ZJX 2.0W 4 OHM FG
S SOCKET TYCO 1770551-1
10P H5.9 SMART
PCMCIA TYCO
1759096-1
FFC 4P G P.5
PAD=.3 79MM
MB-PWR_SW/B 03S
H-CONN SET 03S MB-LCD
FPC 03S LF-4151P REV0
M/B-LED/B
FFC 16P G P0.5
PAD=0.3 117MM
MB-TP 03S
FFC 12P F P0.5
PAD=0.3
76MM MB-BT/B 03S
FFC 12P A P1
PAD=0.6 L=83MM
03I
FFC 6P F P0.5
PAD=0.3 257.2MM
MB-FP 03S
DELL CONFIDENTIAL/PROPRIETARY
Title
SizeDocument NumberRev
2
Date:Sheet
Compal Electronics, Inc.
Touch PAD/Int KB/LID
LA-4151P
3557Friday, July 04, 2008
1
1.0
of
5
DC/DC Interface
+15V_ALW
+3.3V_ALW2
12
R602
100K_0402_5%~D
DD
ICH_ALW<34>
CC
BB
AA
SUS_ON<34,37>
AUX_ON<34>
+3.3V_ALW
+5V_ALW
12
R1034 4.7K_0402_5%~D
12
R1004 4.7K_0402_5%~D
M_ON<34>
12
R1103 100K_0402_5%~D@
Q136B
Q136A
+3.3V_ALW2
2
+3.3V_ALW2
2
EN_1.05VALW
2N7002DW-7-F_SOT363-6~D
3
2N7002DW-7-F_SOT363-6~D
61
M_ON
ALW_ON_3.3V#
61
Q57A
2N7002DW-T/R7_SOT363-6~D
2
+3.3V_ALW2
12
R604
100K_0402_5%~D
SUS_ON_3.3V#
61
Q62A
2N7002DW-T/R7_SOT363-6~D
2
12
R611
100K_0402_5%~D
M_ON_3.3V#
61
Q68A
2N7002DW-T/R7_SOT363-6~D
12
R620
100K_0402_5%~D
AUX_ON_R
2N7002DW-T/R7_SOT363-6~D
61
Q74A
4
5
2
12
R1100 0_0402_5%~D@
5
+15V_ALW
12
3
5
4
+15V_ALW
5
200K_0402_5%~D
12
@
R629
EN_1.05VALW <43>
12
R598
100K_0402_5%~D
ALW_ENABLE
3
5
4
+15V_ALW
12
R603
100K_0402_5%~D
SUS_ENABLE
3
5
4
100K_0402_5%~D
R610
M_ENABLE
Q68B
2N7002DW-T/R7_SOT363-6~D
12
R619
100K_0402_5%~D
2N7002DW-T/R7_SOT363-6~D
3
Q74B
4
+5V_ALW
+3.3V_ALW+3.3V_ALW_I CH
Q57B
2N7002DW-T/R7_SOT363-6~D
+3.3V_ALW
Q62B
2N7002DW-T/R7_SOT363-6~D
+3.3VM Source
+3.3V_ALW
1
2
R1035 4.7K_0402_5%~D
12
R1003 4.7K_0402_5%~D
DDR_ON<10,34,44>
Q66
SI3456BDV-T1-E3_TSOP6~D
6
2
1
C698
4700P_0402_25V7K~D
+3.3V_ALW
12
4
+3.3V_ALW_ICH Source
Q54
SI3456BDV-T1-E3_TSOP6~D
D
6
S
45
2
1
G
3
1
2
+3.3V_SUS Source
Q60
SI3456BDV-T1-E3_TSOP6~D
D
6
S
2
1
G
3
1
C692
4700P_0402_25V7K~D
2
D
S
45
G
3
1
C696
4700P_0402_25V7K~D
2
12
R621
@
470K_0402_5%~D
12
R1102 100K_0402_5%~D@
EN_1.5VALW
2N7002DW-T/R7_SOT363-6~D
3
4
Q150B
5
2N7002DW-T/R7_SOT363-6~D
61
Q150A
2
12
R1101 0_0402_5%~D@
4
1
C687
2
10U_0805_10V4Z~D
C688
4700P_0402_25V7K~D
+3.3V_SUS
45
10U_0805_10V4Z~D
1
C690
2
+3.3V_M
10U_0805_10V4Z~D
12
1
C694
2
ENAB_3VLAN <21>
EN_1.5VALW <43>
R601
20K_0402_5%~D
20K_0402_5%~D
R612
3
2
1
Discharg Circuit
+3.3V_M+1.05V_M
2
G
2
G
@
R623
2N7002W-7-F_SOT323-3~D
@
Q77
+3.3V_ALW_ICH
2
G
OUT
NC
GND
2
1K_0402_5%~D
@
12
R616
2N7002W-7-F_SOT323-3~D
13
D
S
+1.05V_VCCP
1K_0402_5%~D
12
13
D
S
12
13
D
2
G
S
1K_0402_5%~D
12
13
D
S
5
4
@
Q72
@
R626
2N7002W-7-F_SOT323-3~D
@
Q80
1K_0402_5%~D
@
R624
2N7002W-7-F_SOT323-3~D
@
Q78
@
R628
2N7002W-7-F_SOT323-3~D
@
Q82
2
C1200
1U_0603_10V6K~D
1
RUN_ON<19,21,33,37,39>
3.3V_RUN_ON<33,39>
1.05V_RUN_ON<33>
+1.5V_ALW_HDA
1.5V_RUN_ON<33>
12
R599
100K_0402_5%~D
RUN_ON_5V#
61
Q56A
2N7002DW-T/R7_SOT363-6~D
2
12
R608
100K_0402_5%~D
RUN_ON_3V#
61
Q64A
2N7002DW-T/R7_SOT363-6~D
2
12
R617
100K_0402_5%~D
RUN_ON_1.05V#
61
Q70A
2N7002DW-T/R7_SOT363-6~D
2
12
R910
100K_0402_5%~D
61
Q129A
2N7002DW-T/R7_SOT363-6~D
2
RUN_ON_1.5V#
+15V_ALW+3.3V_ALW2+5V_ALW
12
R597
100K_0402_5%~D
RUN_ENABLEM_ON_3.3V#
3
Q56B
2N7002DW-T/R7_SOT363-6~D
5
4
12
R606
100K_0402_5%~D
3
5
Q64B
2N7002DW-T/R7_SOT363-6~D
4
12
R613
100K_0402_5%~D
3
5
Q70B
2N7002DW-T/R7_SOT363-6~D
4
12
R911
100K_0402_5%~D
3
5
Q129B
2N7002DW-T/R7_SOT363-6~D
4
75_0603_5%~D
12
@
R615
12
+3.3V_RUN
12
20K_0402_5%~D
12
R605
RUN_ON_3V#
RUN_ON_5V#
SUS_ON_3.3V#ALW_ON_3.3V#
2
G
2
G
2
G
+3.3V_ALW
13
D
S
+5V_RUN
1K_0402_5%~D
12
13
D
S
+3.3V_SUS
12
13
D
S
2
1
2N7002W-7-F_SOT323-3~D
13
D
2
39_0402_5%~D
@
R622
2N7002W-7-F_SOT323-3~D
1K_0402_5%~D
C1201
1U_0603_10V6K~D
@
Q71
G
S
R625
2N7002W-7-F_SOT323-3~D
RUN_ON_1.05V#
Q79
+1.5V_RUN+0.75V_DDR_VTT
1K_0402_5%~D
12
13
D
@
2
Q76
G
S
@
R627
2N7002W-7-F_SOT323-3~D
@
Q81
U103
MAX8511EXK15+T_SC70-5~D
1
IN
3
#SHDN
1.5 Volt +/-5%
Design Current:11mA
Peak current: 11mA
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
+5VRUN Source
Q55
STS11NF30L_SO8~D
8
7
5
4
1
2
+3.3V_RUN Source
Q61
+3.3V_ALW+3.3V_ALW2+15V_ALW
D30
@
RB751V_SOD323-2~D
R609
0_0402_5%~D
+1.05V_M+3.3V_ALW2+15V_ALW
D31
@
RB751V_SOD323-2~D
R618
0_0402_5%~D
@
RB751V_SOD323-2~D
SI4336DY-T1-E3_SO8~D
8
7
5
21
12
+1.05V_VCCP Source
Q67
SI4336DY-T1-E3_SO8~D
8
7
5
21
12
+1.5V_RUN Source
Q128
SI4336DY-T1-E3_SO8~D
+1.5V_MEM+3.3V_ALW2+15V_ALW
8
7
5
21
D65
12
R913
0_0402_5%~D
Compal Electronics, Inc.
POWER CONTROL
LA-4151P
1
2
36
2200P_0402_50V7K~D
C689
1
2
36
4
1
C693
470P_0402_50V7K~D
2
1
2
36
4
1
C697
470P_0402_50V7K~D
2
1
2
36
4
1
C1081
470P_0402_50V7K~D
2
1
1
2
C691
10U_0805_10V4Z~D
C695
10U_0805_10V4Z~D
C1080
+5V_RUN
10U_0805_10V4Z~D
C686
+3.3V_RUN
1
2
+1.05V_VCCP
1
2
1
2
10U_0805_10V4Z~D
12
R600
20K_0402_5%~D
12
12
+1.5V_RUN
3657Fr id ay, July 04, 2008
R607
20K_0402_5%~D
R614
20K_0402_5%~D
12
R912
20K_0402_5%~D
1.0
of
5
4
3
2
1
@
2.5V_RUN_PWRGD<18,33>
+5V_RUN
DD
1
2
+3.3V_RUN
1
2
CC
BB
+1.5V_RUN
1
2
+3.3V_SUS
21
D32
RB751V_SOD323-2~D
C702
0.1U_0402_16V4Z~D
21
D33
RB751V_SOD323-2~D
C704
0.1U_0402_16V4Z~D
21
D66
RB751V_SOD323-2~D
C1082
0.1U_0402_16V4Z~D
D34
RB751V_SOD323-2~D
21
1
C707
0.1U_0402_16V4Z~D
2
12
12
12
200K_0402_5%~D
12
R642
200K_0402_5%~D
R634
200K_0402_5%~D
R638
200K_0402_5%~D
R916
10K_0402_5%~D
2200P_0402_50V7K~D
1
2
R633
10K_0402_5%~D
12
1
C703
2200P_0402_50V7K~D
2
12
R637
10K_0402_5%~D
1
C705
2200P_0402_50V7K~D
2
12
R915
10K_0402_5%~D
1
C1083
2200P_0402_50V7K~D
2
R641
12
C708
+5V_ALW
B
2
+3.3V_ALW
B
2
+1.5V_MEM
B
2
+3.3V_ALW
E
3
B
Q88
2
MMBT3906WT1G_SC70-3~D
C
1
200K_0402_5%~D
12
R643
E
3
Q83
MMBT3906WT1G_SC70-3~D
C
1
R635
4.7K_0402_5%~D
12
E
3
Q85
MMBT3906WT1G_SC70-3~D
C
1
R639
4.7K_0402_5%~D
12
E
3
Q130
MMBT3906WT1G_SC70-3~D
C
1
R917
4.7K_0402_5%~D
12
D35
RB751V_SOD323-2~D
21
1.8V_RUN_PWRGD<44>
C
Q84
2
B
MMST3904-7-F_SOT323-3~D
E
31
C
Q86
2
B
MMST3904-7-F_SOT323-3~D
E
31
C
Q131
2
B
MMST3904-7-F_SOT323-3~D
E
31
+3.3V_ALW
8
P
A3Y
G
U39C
74LVC3G14DC_VSSOP8~D
4
5
R6300_0402_5%~D
R8790_0402_5%~D
12
12
+3.3V_SUS
12
1
2
100K_0402_5%~D
0.1U_0402_16V4Z~D
R632
C701
+3.3V_M
+3.3V_ALW
12
8
P
A1Y
G
U39A
74LVC3G14DC_VSSOP8~D
4
IMVP_PWRGD<24,33,45,47>
RESET_OUT#<34>
D36
RB751V_SOD323-2~D
21
1
C709
0.1U_0402_16V4Z~D
2
C699
0.1U_0402_16V4Z~D
7
12
SUS_ON<34,36>
IMVP_PWRGD
RESET_OUT#
200K_0402_5%~D
R645
+3.3V_ALW
A6Y
RUN_ON<19,21,33,36,39>
10K_0402_5%~D
12
2200P_0402_50V7K~D
1
C710
2
8
P
G
4
R644
2
U39B
74LVC3G14DC_VSSOP8~D
12
R636
0_0402_5%~D
3.3V_5V_SUS_PWRGD
+3.3V_ALW
14
13
P
IN1
11
OUT
12
IN2
G
U40D
74VHC08MTCX_NL_TSSOP14~D
7
E
3
B
Q89
2
MMBT3906WT1G_SC70-3~D
C
1
200K_0402_5%~D
12
+3.3V_ALW
14
1
IN1
2
IN2
7
+3.3V_ALW
14
10
IN1
9
IN2
7
ICH_PWRGD
21
D37
RB751V_SOD323-2~D
R646
C700
0.1U_0402_16V4Z~D
12
U40A
74VHC08MTCX_NL_TSSOP14~D
P
3
OUT
G
4
5
P
8
OUT
G
U40C
74VHC08MTCX_NL_TSSOP14~D
+3.3V_M
R640
100K_0402_5%~D
2
G
+3.3V_ALW+3.3V_ALW
8
A1Y
4
+3.3V_ALW
14
U40B
74VHC08MTCX_NL_TSSOP14~D
P
IN1
6
OUT
IN2
G
7
12
ICH_PWRGD#
13
D
Q87
2N7002W-7-F_SOT323-3~D
S
P
7
G
U41A
74LVC3G14DC_VSSOP8~D
RUNPWROK
ICH_PWRGD# <18>
ICH_PWRGD <10,24>
3.3V_M_PWRGD <18,34>
RUNPW ROK <33,34,45>
SUSPWROK <34>
+3.3V_LAN
D40
RB751V_SOD323-2~D
21
1
C714
0.1U_0402_16V4Z~D
2
AA
200K_0402_5%~D
12
R652
10K_0402_5%~D
12
2200P_0402_50V7K~D
1
C715
2
R651
E
3
B
Q91
2
MMBT3906WT1G_SC70-3~D
C
1
200K_0402_5%~D
12
R653
21
D41
RB751V_SOD323-2~D
+3.3V_ALW+3.3V_ALW
C713
0.1U_0402_16V4Z~D
12
8
P
2
A6Y
G
U41B
74LVC3G14DC_VSSOP8~D
4
3.3V_LAN_PWRGD <34>
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Power Good
LA-4151P
3757Fr id ay, July 04, 2008
1
1.0
of
5
+5V_RUN+3.3V_RUN
12
R654
10K_0402_5%~D
D
SATA_ACT#_R<23>
MASK_BASE_LEDS#
DD
S
G
2
SATA_ACT#
13
Q93
2N7002W-7-F_SOT323-3~D
2
13
HDD LED solution for Blue LED
+3.3V_WLAN+5V_RUN
12
R662
100K_0402_5%~D
D
S
LED_WLAN#LED_W#
LED_WLAN_OUT#<21>
MASK_BASE_LEDS#
BKT_LED<39>
BKT_LEDBATT_YELLOW_LED_R
13
Q98
G
2
2N7002W-7-F_SOT323-3~D
D
S
13
Q168
5@
G
2
2N7002W-7-F_SOT323-3~D
21
D75 SDM10U45-7_SOD523-2~D
+5V_RUN_BKT_PWR
2
2
13
WLAN_LED_RMASK_BASE_LEDS#
13
Q167
PDTA114EU_SC70-3~D
WLAN&BKT LED solution for Blue LED
CC
+3.3V_RUN_BKT_PWR
12
R206
LED_WWAN_OUT#<21>
100K_0402_5%~D
MASK_BASE_LEDS#
D
S
13
G
Q116
2
2N7002W-7-F_SOT323-3~D
LED_WWAN#
+5V_TP_PWR
2
13
WWAN LED solution for Blue LED
+3.3V_RUN
C1152 0.1U_0402_16V4Z~D
1 2
5
1
P
BT_ACTIVE_RBT_ACTIVE#
NC
BT_ACTIVE<2 1,30>
BB
SNIFFER_YELLOW#<33>
AA
SNIFFER_BLUE#<33>
10K_0402_5%~D
12
74LVC1G14GV_SOT753-5
R1051
A2Y
U91
2
2
G
3
+3.3V_ALW
+5V_ALW
5
4
MASK_BASE_LEDS#
@
Q100
DDTA114EUA-7-F_SOT323-3~D
13
Q102
DDTA114EUA-7-F_SOT323-3~D
13
D
S
13
G
Q95
2
2N7002W-7-F_SOT323-3~D
Mask All LEDs (Sn iffer Function)
Mask Base MB LEDs (Lid Closed)
Do not Mask LEDs (Lid Opened)11
12
R667220_0402_5%~D@
12
R668150_0402_5%~D
+5V_RUN
2
13
LED Circuit Control Table
SNIFFER_YELLOW
SNIFFER_BLUE
4
Q92
DDTA114EUA-7-F_SOT323-3~D
SATA_LED
12
R6591K_0402_5%~D
Q97
PDTA114EU_SC70-3~D
D83 SDM10U45-7_SOD523-2~D
21
R6631K_0402_5%~D
5@
Q115
PDTA114EU_SC70-3~D
R1251K_0402_5%~D
Q94
DDTA114EUA-7-F_SOT323-3~D
R6611K_0402_5%~D
12
12
12
WLAN_LED
WWAN_LED
BT_LED
BT LED
SYS_LED_MASK#LID_CL#
0
10
SNI FFER_YE LLOW <21>
SNIF FER_BLUE <21>
4
LID_CL#<29,33>
SYS_LED_MASK#<33>
X
LID_CL#
SYS_LED_MASK#
H1
@H_3P4N
@
BAT2_LED#<34>
BAT1_LED#<34>
BREATH_LED#<31,34>
+3.3V_ALW
C1165 0.1U_0402_16V4Z~D
1 2
5
U90
1
P
IN1
O
2
IN2
G
74AHC1G08GW_SOT353-5~D
3
H2
@H_3P4N
1
@
CAP_LED#<33>
NUM_LED#<33>
SCRL_LED#<33>
BAT2_LED#
BAT1_LED#
MASK_BASE_LEDS#
4
3
H3
@H_2P3
1
1
@
+3.3V_ALW
A2Y
MASK_BASE_LEDS#
+3.3V_ALW
C1163 0.1U_0402_16V4Z~D
1 2
5
1
P
NC
A2Y
G
NC7SZ04P5X_NL_SC70-5~D
3
12
R1113
47K_0402_1%~D
3
2
H4
H5
@H_2P3
1
@
2
MASK_BASE_LEDS#
C1162 0.1U_0402_16V4Z~D
1 2
5
1
P
NC
4
G
U87
NC7SZ04P5X_NL_SC70-5~D
3
4
U88
2N7002DW-7-F_SOT363-6~D
+3.3V_ALW
5
A2Y
3
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
LVDS switch when system
on powe r mode or BKT mode
SW_LVDS_A0+
SW_LVDS_A1SW_LVDS_A1+
11
12
15
16
10
14
17
19
21
39
41
43
6@
14
23
0_0404_4P2R_5%~D
6@
14
23
0_0404_4P2R_5%~D
MAX4889
2
COM1+
3
COM1-
6
COM2+
7
COM2-
COM3+
COM3-
COM4+
COM4-
9
SEL
1
GND
4
GND
GND
GND
GND
GND
GND
GND
GND
GND
MAX4889ETO+_TQFN42_3P5x9~D
RN2
LCD_A0-_MCHSW_LVDS_A0LCD_A0+_MCH
RN5
LCD_A1-_MCH
LCD_A1+_MCH
Bypass BKT function
2
5
V+
8
V+
13
V+
18
V+
20
V+
30
V+
40
V+
42
V+
38
NC1+
37
NC1-
34
NO1+
33
NO1-
36
NC2+
35
NC2-
32
NO2+
31
NO2-
29
NC3+
28
NC3-
25
NO3+
24
NO3-
27
NC4+
26
NC4-
23
NO4+
22
NO4-
SW_LVDS_A2SW_LVDS_A2+
SW_LVDS_ACLKSW_LVDS_ACLK+
+3.3V_RUN_BKT_PWR
5@
5@
1
C1145
2
0.1U_0402_16V4Z~D
LCD_A0+_MCH
LCD_A0-_MCH
BKT_LVDS_RIN0+
BKT_LVDS_RIN0-
LCD_A1+_MCH
LCD_A1-_MCH
BKT_LVDS_RIN1+
BKT_LVDS_RIN1-
LCD_A2+_MCH
LCD_A2-_MCH
BKT_LVDS_RIN2+
BKT_LVDS_RIN2-
LCD_ACLK+_MCH
LCD_ACLK-_MCH
BKT_LVDS_CLK+
BKT_LVDS_CLK-
6@
RN3
14
23
0_0404_4P2R_5%~D
6@
RN4
14
23
0_0404_4P2R_5%~D
C1146
5@
1
1
C1147
2
2
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
LCD_A0+_MCH <12>
LCD_A0-_MCH <12>
BKT_LVDS_RIN0+ <39>
BKT_LVDS_RIN0- <39>
LCD_A1+_MCH <12>
LCD_A1-_MCH <12>
BKT_LVDS_RIN1+ <39>
BKT_LVDS_RIN1- <39>
LCD_A2+_MCH <12>
LCD_A2-_MCH <12>
BKT_LVDS_RIN2+ <39>
BKT_LVDS_RIN2- <39>
LCD_ACLK+_MCH <12>
LCD_ACLK-_MCH <12>
BKT_LVDS_CLK+ <39>
BKT_LVDS_CLK- <39>
LCD_A2-_MCH
LCD_A2+_MCH
LCD_ACLK-_MCH
LCD_ACLK+_MCH
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
BlackTopII
LA-4151P
4057Fr id ay, July 04, 2008
1
of
1.0
5
4
3
2
1
+COINCELL
12
+3.3V_RTC_LDO
DD
+3.3V_ALW
ESD Diodes
2
2
3
Primary Battery Connector
FOX_BP02093-P5652-7F~D
11
10
12
PC4
2200P_0402_50V7K~D
CC
BB
PJPDC1
1
1
2
2
-DCIN_JACK
3
3
4
4
+DCIN_JACK
5
5
6
6
7
7
MOLEX_87438-0743
AA
GND
GND
PBATT1
12
PC414
0.1U_0603_25V7K~D
9
9
8
8
7
7
6
6
5
5
4
4
3
3
2
2
1
1
0_0402_5%~D
PC412
Z4304
Z4305
Z4306
GND
NB_PSID
+5V_ALW
2
3
PD12
@
DA204U_SOT323~D
1
PR20
12
1 2
PC183
@
PL20
.47U_0402_6.3V6-K~D
FBMJ4516HS720NT_1806~D
12
1
PD29
12
@
2
VZ0603M260APT_0603
PC413
0.1U_0603_25V7K~D
FBMJ4516HS720NT_1806~D
@
PL21
12
NB_AC_OFF_BJT<48>NB_AC_OF F <33,46,48>
DA204U_SOT323~D@
100_0402_5%~D
GND
DCIN _CBL_DET# <33>
IMD2AT- 108_SC74-6~D
12
12
PR272
0.1U_0603_25V7K~D
0_0402_5%~D
@
5
PD5
PR7
12
PQ4B
2
16
BLM18BD102SN1D_0603~D
PQ4A
IMD2AT- 108_SC74-6~D
1
PR8
100_0402_5%~D
12
PL3
+DC_IN
PC5
1 2
43
0.022U_0603_50V7K~D
PD6
DA204U_SOT323~D@
3
12
+DC_IN
12
PR16
3
2
PD7
1
PR9
100_0402_5%~D
12
100_0402_5%~D
PQ2
FDS6679AZ_SO8~D
1
2
36
4
1M_0402_5%~D
12
PR21
1M_0402_5%~D
2
3
1
DA204U_SOT323~D@
12
PR10
1
@
2
1
DC_IN+ Source
8
7
5
12
PR22
22K_0402_1%~D
13
D
2
G
PQ5
S
RHU002N06_SOT323
PD8
DA204U_SOT323~D@
PBAT_ALARM#
3
@
PD10
SM24_SOT23
PC6
0.1U_0603_25V7K~D
PR285
100K_0402_5%~D
12
12
PBAT_SMBCLK <34>
PBAT_SMBDAT <34>
PR14
12
100K_0402_1%~D
PR18
12
15K_0402_1%~D
12
12
PC7
0.1U_0603_25V7K~D
PC11
0.1U_0603_25V7K~D
PBATT+_C
PC8
0.1U_0603_25V7K~D
FBMA-L18-453215-900LMA90T_1812~D
PC3
0.1U_0603_25V7K~D
PR12
@
12
0_0402_5%~D
D
S
13
PQ1
FDV301N_SOT23~D
G
2
C
PQ3
2
B
MMST3904-7-F_SOT323~D
E
31
+DC_IN_SS
12
12
PC9
PR19
4.7K_0805_5%~D
12
10U_1206_25V6M~D
12
12
PAD-OPE N 4x4m
PR13
33_0402_5%~D
12
12
PL2
PJP12
PD9
DA204U_SOT323~D
+5V_ALW
3
+5V_ALW
+3.3V_ALW
PR17
10K_0402_5%~D@
SLICE_BAT_PRES#<31, 33,48>
PD11
@
PR6
10K_0402_1%~D
+3.3V_ALW
PR11
12
2.2K_0402_5%~D
+5V_ALW
3
DA204U_SOT323~D
12
RB751V_SOD323~D
2
1
PBAT_PRES# <33>
PD22
NB_PSID _TS5A63157
PQ47
FDN338P_NL_SOT23-3~D
1
3
13
21
2
2
PR334
12
0_0402_5%~D
PSID_ DISAB LE# <33>
12
PC38
1500P_0402_50V7K~D
DOCK_PSID<31>GPIO_P SID_SELECT <33>
PBATT+
2
GND
1
12
PR15
10K_0402_1%~D
12
Z4012
3
2
PD28
1
BAT54CW_SOT323~D
<BOM Structure>
27.4
DOCK_SMB_ALERT# <31,34>
PU1
1
NO
2
GND
NC3COM
TS5A63157DCKR_SC70-6~D
COIN RTC Battery
PR271
1K_0402_5%~D
1
2
IN
V+
RTC_BAT_DET#<23>
+RTC_CELL
PC244
1U_0603_10V4Z~D
Move to power schematic
6
5
+5V_ALW
4
PS_I D<34>
+COINCELL
JRTC2
1
1
2
2
3
3
4
GND
5
GND
MOLEX_53780-0370~D
DELL CONFIDENTIAL/PROPRIETARY
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONT AINS CONFIDE NTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE C OMPETENT DIVIS ION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INF ORMATION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WR ITT EN CO NSE NT OF COMPAL ELECTRONICS, INC.
Component select
Input CAP 10uF_1206_25V *2
Output Cap 330uF_D3L_6.3VM_R18(Sanyo_6TPE330ML)*1
H_MOSFET FDMC8878
L_MOSFET FDS6676AS(5.9/7.25mOhm@4.5V, 14.5A)
Inductor 2.8U_SSC-1350F3-2R8-R_16A(TNP)
AA
DELL CONFIDENTIAL/PROPRIETARY
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE C OMPETENT DIVIS ION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INF ORMATION IT CONT AINS
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
AVDD2
PJP25
12
PAD-OPEN 4x4m
PJP24
12
PAD-OPEN 4x4m
EN2
5
PR64
0_0402_5%~D
12
12
12
PC419
0.22U_0402_10V7K~D
GNDA_1.05V
AVDD1
10_0402_1%~D
PR278
10_0402_1%~D
12
12
PC437
0.22U_0402_10V7K~D
GNDA_1.5V
+1.5V_MEM
EN_1.05VALW <36>
PR277
38.3K_0402_1%
PC420
PC438
2200P_0402_50V7K~D
+1.05V_R_SEL/LOAD
12
2200P_0402_50V7K~D
PR53
12
0_0402_5%~D
PR282
12
PR54
0_0402_5%~D
12
+1.05V_VDES
VSENSE2
PR275
3.09K_0402_1%
+1.5V_R_SEL/LOAD
3.74K_0402_1%~D
PR280
56K_0402_1%
12
4
A1
A2
A3
A4
EN2
A5
B1
PR276
44.2K_0402_1%
GNDA_1.05V
DC_5V_ALW1
BIAS
+1.5V_VDES
VSENSE1
EN1
PR281
PR65
1.05V_POK2
1.5V_POK1
1.5V_POK1 <10,34>
E5
BIAS
R_SEL/ILOAD
VDES
VSENSE+
OE
AGND
B2
PR274
31.6K_0402_1%~D
A1
A2
A3
A4
A5
B1
44.2K_0402_1%
12
100K_0402_1%~D
GND
VDDE4VDD
GNDE3GNDE2GND
PU25
VT351AFCX-ADJ
IRIPL
AVDD
B4
B3
AVDD2
PJP22
12
PAD-OPEN1x1m
E5
VDDE4VDD
BIAS
R_SEL/ILOAD
VDES
VSENSE+
OE
AGND
IRIPL
B2
B3
AVDD1
PR279
PJP20
12
24K_0402_1%~D
PAD-OPEN1x1m
GNDA_1.5V
+3.3V_ALW+3.3V_ALW
PR66
PC449
@
12
100K_0402_1%~D
12
PR283
@
0_0402_5%~D
E1
D4
VXD5VX
VX
VX
VX
VDD
VDD
GND
STATB5TEMP
GNDC2GND
C1
1.05V_POK2
GND
E1
GNDE3GNDE2GND
PU26
VT351AFCX-ADJ
STATB5TEMP
AVDD
1.5V_POK1
B4
C1
12
0.1U_0402_10V7K~D
1.05V_M_PWRGD <34>
1.5V_SUS_PWRGD <10,34>
D3
VXD5VX
D2
D1
C5
C4
C3
D4
VX
VX
VX
VDD
VDD
GND
GNDC2GND
+1.05V_VX
12
PC187
1000P_0603_50V7K~D
1_0805_5%~D
PR286
PR47
0_0402_5%~D
12
VSENSE2
PR48
@
0_0402_5%~D
D3
D2
D1
C5
C4
C3
THIS SHEET OF EN GINEE RING D RAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1.8 Volt +/-5%
Design Current: 221.3mA
Max current: 316.3mA
+1.8V_RUN
12
PJP27
21
PAD-OPEN 2x2m~D
12
PC179
10U_0805_6.3V6M~D
9
8
3
6
1
11
BP
1.8V_OUT
PC180
12
PC178
1U_0603_10V6K~D
10U_0805_6.3V6M~D
+5V_ALW
PU24
10
PJP48
+1.5V_SUS_P
0.75V_DDR_VTT_ON<33>
CC
BB
5V_3V_REF
DDR_ON<10,34,36>
+3.3V_ALWP
1.8V_RUN_PWRGD<37>
PAD-OPEN 2x2m~D
1.8V_RUN_ON<33>
PR270
10K_0402_1%
12
21
PJP28
21
PAD-OPEN 2x2m~D
DC_1+0.75V_VTT_PWR_SRC
PC348
12
10U_0805_6.3V6M~D
100K_0402_5%~D@
1U_0603_10V6K~D
91K_0402_1%~D
12
2
1
7
9
12
PC410
0.1U_0603_25V7K~D
PR134
12
PC181
12
PR135
VIN
VLDOIN
VDDQSNS
S3
S5
TPS51100DGQRG4_MSOP10~D
DC_1+1.8V_RUN_PWR_SRC
+3.3V_ALW
12
PC182
1U_0603_10V6K~D
+V_DDR_MCH_REF
3
VTT
5
VTTSNS
6
VTTREF
4
PGND
8
GND
11
BP
PC184
10U_0805_6.3V6M~D
12
PU12
MAX8794
10
IN
2
VCC
5
PGOOD
7
SHDN#
4
REFIN
REFOUT
PGND and GND sholud be tied
together at one point near the GND Pin
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE C OMPETENT DIVIS ION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INF ORMATION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WR ITT EN CO NSE NT OF COMPAL ELECTRONICS, INC.
BOOT1BOOT1_1
1
BOOT
8
7
4
BOOT
UGATE
PHASE
LGATE
4
PR87
2.2_0603_5%~D
LGATE1
PR98
2.2_0603_5%~D
BOOT2
1
8
7
LGATE2
4
4
UGATE1
UGATE2
0.22U_0603_10V7K~D
12
1 2
2
BOOT2_2
12
2
PC96
3
D
G
S
1
FDMS8670AS_ POWER56-8
PC108
0.22U_0603_10V7K~D
1 2
3
D
G
S
1
FDMS8670AS_ POWER56-8
PQ17
PQ21
PQ22
2
PQ19
SI4686DY-T1-E3~D
2
G
SI4686DY-T1-E3~D
G
8
1
3
D
S
1
8
1
3
D
S
1
3
12
PC113
@
D5D6D7D
1500P_0603_25V7K~D
G4S3S2S
@
4.7_1206_5%~D
12
PHASE1
PQ18
FDMS8670AS_ POWER56-8
1500P_0603_25V7K~D
PC114
@
D5D6D7D
G4S3S2S
PR268
@
4.7_1206_5%~D
PQ20
FDMS8670AS_ POWER56-8
3
PR269
12
12
+CPU_PWR_SRC
12
PC91
0.1U_0603_25V7K~D
12
PC99
1000P_0603_50V7K~D
PR266
4.7_1206_5%~D
12
12
PC102
0.1U_0603_25V7K~D
PHASE2
12
PC110
1000P_0603_50V7K~D
PR267
4.7_1206_5%~D
12
12
12
PC93
PC92
2200P_0402_50V7K~D
12
PC103
PC94
10U_1206_25V6M~D
PL13
0.45UH_ETQP4LR45XFC_25A_20%~D
4
3
PR90
430_0402_1%~D
12
PR91
7.68K_0805_1%~D
@
VSUM
12
12
PC104
2200P_0402_50V7K~D
10U_1206_25V6M~D
0.45UH_ETQP4LR45XFC_25A_20%~D
PR109
430_0402_1%~D
12
PR111
7.68K_0805_1%~D
@
12
VSUMFBS
2
12
10U_1206_25V6M~D
1
2
PC98
1UU_0603_25V5K~D
+CPU_PWR_SRC
12
PC105
10U_1206_25V6M~D
PL14
4
3
1UU_0603_25V5K~D
FBMJ4516HS720NT_1806~D
12
@
1
1
+
+
PC88
2
100U_25V_M~D
Iccmax=TDB
I_TDC=TDB
OCP=TDBA, Intel spec=TDBA
12
1
2
PC109
12
PR121
0_0402_5%~D
PC89
2
100U_25V_M~D
12
PR88
0_0402_5%~D
12
PR92
0_0402_5%~D
VO
12
CSN2
PAD-OPE N 4x4m
12
PR106
0_0402_5%~D
12
PR112
0_0402_5%~D
@
VO
PL12
PJP32
12
+VCC_CORE
+VCC_CORE
1
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Doc um e n t N u mb erRe v
Date:Sheet
2
Compal Electronics, Inc.
+VCORE
LA-4151P
4557Friday, July 04, 2008
1
of
+PWR_SRC
0.2
5
PD30
B540C~D
21
PQ34
SI4835BDY-T1-E3_SO8~D
8
+DC_IN_SS
DD
CC
BB
AA
NB_AC_OFF <33,41,48>
NB_AC_OFF#
3
PQ68B
2N7002DW-T/R7_SOT363-6~D
5
4
365K_0402_1%
PR154
49.9K_0402_1%~D
PC146
0.01U_0402_25V7K~D
GNDA_CHG
0.1U_0402_10V7K~D
CKG_SMBCLK<6,21,34>
CKG_SMBDAT<6,21,34>
2
PR145
12
12
+5V_ALW
PC153
MAX8731_IINP<18>
ADAPT_TRIP_SET<33>
7
5
PR174
10K_0402_5%~D
PR52
12
MAX8731A_LDO
ACAV_IN<18,34>
12
MAX8731_IINP
5
12
PR152
10K_0402_1%~D
33.2K_0402_1%~D
61
PQ68A
2N7002DW-T/R7_SOT363-6~D
200K_0402_1%~D
+SDC_IN
12
GNDA_CHG
4
24K_0402_1%~D
+DOCK_PWR_BAR
+DC_IN_SS
MAX8731_REF
12
PR157
15.8K_0402_1%~D
PR162
MAX8731_REF
PR167
@
12
0_0402_5%~D
PR169
@
12
GNDA_CHG
@
12
8.45K_0402_1%~D
PC168
@
1
2
36
PR175
PR173
12
0.01U_0402_25V7K~D
12
0_0402_5%~D
PC164
12
GNDA_CHG
12
PR184
@
12
2
3
0.1U_0402_10V7K~D
ACAV_DOCK_SRC<48>
12
PR166
@
PR171
@
PR172
@
51.1K_0402_1%~D
17.8K_0402_1%
348_0402_1%~D
0_0402_5%~D
PD52
BAT54CW_SOT323~D
1
PR156
12
0_0402_5%~D
12
PR176
@
200K_0402_5%~D
12
PR159
PC241
@
10K_0402_5%~D
130P_0402_10V7K~D
12
12
PC165
0.01U_0402_25V7K~D
12
12
12
PC169
PC170
@
@
12
GNDA_CHG
0.01U_0402_25V7K~D
GNDA_CHG
100P_0402_50V8J
New Create Part Number
5
12
4
+SDC_IN
+DC_IN
12
PR143
10K_0402_5%~D
3
PQ67B
2N7002DW-T/R7_SOT363-6~D
4
12
PR150
33K_0402_5%~D
2000P_0402_10V7K~D
PC242
12
@
130P_0402_10V7K~D
12
12
PC156
PC157
0.01U_0402_25V7K~D
0.01U_0402_25V7K~D
1M_0402_1%~D
12
2
IN-
3
IN+
12
PC171
@
100P_0402_50V8J
GNDA_CHGGNDA_CHGG N DA_CHG
+5V_ALW
4
PQ67A
2
12
PC142
0.047U_0603_25V7K~D
1U_0805_25V4Z~D
GNDA_CHG
12
PC243
@
12
PC158
1U_0603_10V6K~D
PR164
@
GNDA_CHG
4
G
O
P
8
PC172
@
12
PR141
33K_0402_5%~D
12
PR146
10K_0402_5%~D
61
2N7002DW-T/R7_SOT363-6~D
PC145
12
MAX8731_IINP
12
PR262
@
7.5K_0402_5%~D
MAX8731_REF
PR263
@
12
0_0402_5%~D
GNDA_CHG
PU11A
LM393DR_SO8~D
1
12
PC173
@
100P_0402_50V8J
0.01U_0402_25V7K~D
PC163
0.1U_0402_10V7K~D
12
@
12
PC135
0.1U_0603_25V7K~D
13
1
2
2
3
PC138
@
0.1U_0603_25V7K~D
12
GNDA_CHG
DCIN
12
@
GNDA_CHGGNDA_CHG
PR168
@
100K_0402_1%~D
PC167
10P_0402_50V8J~D
PU10
22
DCIN
2
ACIN
13
ACOK
11
VDD
10
SCL
9
SDA
14
BATSEL
8
IINP
6
CCV
5
CCI
4
CCS
3
REF
7
DAC
12
GND
29
GND
12
12
0.22U_0402_6.3V6K
PQ33
@
RHU002N06_SOT323
3
PR140
0.01_1206_1%~D
1
2
@
10K_0402_5%~D
1
MAX8731AETI+_TQFN28~D
2
G
THIS SHEET OF EN GINEE RING D RAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED B Y OR D ISCLOS ED T O ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Component select
Input CAP 10uF_1206_25V*2
Output Cap 330U_D2E_2VM_R7*2
H_MOSFET FDMC8878
L_MOSFET FDMC8854(5.6/7.6mOhm@4.5V, 13A)
Inductor 0.42U_MPCG0740LR42_20A(NEC_TOKIN)
330U_D2E_2.5VM_R7~D
12
0.1U_0402_16V7K
12
12
PC176
PC177
@
@
10U_0805_6.3V6M~D
10U_0805_6.3V6M~D
+3.3V_RUN
12
PR222
10K_0603_5%
PR362
0_0402_5%~D
PMONFS
PR230
12
187K_0402_1%
GNDA_VGA
12
FB
COMP
SS
ST
PMON
CLIM
12
12
12
PU15
1
FBRTN
2
FB
3
COMP
4
SS
5
ST
6
PMON
7
PMONFS
8
CLIM
PR231
78.7K_0402_1%~D
PR236
0_0402_5%~D
@
PR240
0_0402_5%~D
EN
32
30
31
PWRGD
VARFREQ#
LLINE9CSCOMP10CSREF11CSFB12RAMP13VRPM14RPM15RT
LLINE
CSREF
CSCOMP
VDD1
VDD0
EN
VID029VID128VID227VID326VID4
RAMP
CSFB
PR233
VDD3
VDD2
RPM
VRPM
12
200K_0402_1%~D
12
@
2200P_0402_50V7K~D
VDD4
25
VCC
BST
DRVH
SW
PVCC
DRVL
PGND
GND
AGND
ADP3209JCPZ-RL_LFCSP32_5X5~D
16
RT
12
PR234
357K_0603_0.5%
GNDA_VGAGNDA_VGA
PC218
IMVP_PWRGD<24,33,37,45>
VSS_AXG_SENSE<14>
CC
PR226
100_0402_5%~D
12
PC215
1000P_0402_50V7K~D
GNDA_VGA
VCC_AXG_SENSE<14>
BB
33.2K_0402_1%
VSS_AXG_SENSE
12
12
PR224
12
PC206
@
22P_0402_50V8J
PR227
12
1K_0402_1%~D
PR229
@
100_0402_1%~D
12
PR364
12
0_0402_5%~D
PWR_MON_GFX<18>
+VGFX_COREP
22P_0402_50V8J
20K_0402_1%~D
1 2
12
PC208
470P_0402_50V7K
GNDA_VGA
PC207
12
PR228
GNDA_VGA
PR232 200K_0402_1%~D
12
PC217
2.2U_0603_6.3VAK~D
12
12
12
PC209
0.012U_0402_16V7K~D
12
PR235
3K_0402_1%
VGFX_CORE_FB
GNDA_VGA
PC210
680P_0402_50V7K~D
GNDA_VGA
PJP39
PAD-OPEN1x1m
PR242
12
12
PC220
1000P_0402_50V7K~D
GNDA_VGAGNDA_VGA
340K_0402_1%
12
1K_0402_1%~D
12
PC221
100P_0402_50V8J
PR243
+VGFX_SRC
12
PJP40
+VGFX_COREP
12
PAD-OPEN 4x4m
+VCC_GFXCORE
A
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Title
ADP3209 Power Up both Intel GMCH and ATI M54
Size Doc um e n t N u mb erRe v
Date:Sheet
Compal Electronics, Inc.
LA-4151P
4757Friday, July 04, 2008
0.2
of
5
+DOCK_PWR_BAR
DD
+3.3V_ALW2
12
PR182
100K_0402_5%~D
ACAV_DOCK_SRC#<31>
CC
SI4835BDY_SO8~D
PQ45
8
+VCHGR
BB
PBATT_OFF<33>
AA
7
5
+3.3V_ALW
12
PR353
3
PQ62B
2N7002DW-T/R7_SOT363-6~D
5
4
PBATT_OFF<33>
DOCK_AC_OFF<31,33>
5
4
12
61
100K_0402_5%~D
2
PR352
47K_0402_1%~D
2N7002DW-T/R7_SOT363-6~D
21
+3.3V_ALW2
12
3
5
4
1
2
36
PR291
12
PR351
240K_0402_5%~D
PQ62A
PBATT_OFF<33>
PD34
RB751S40T1_SOD523-2~D
PR292
PR183
100K_0402_5%~D
PQ64B
2N7002DW-T/R7_SOT363-6~D
390K_0402_5%~D
12
PR293
2
390K_0402_5%~D
12
3
PQ55B
2N7002DW-T/R7_SOT363-6~D
5
4
21
PD36
RB751S40T1_SOD523-2~D
4
61
PQ64A
2
2N7002DW-T/R7_SOT363-6~D
PBATT+
PR294
620K_0402_5%~D
12
61
33_0402_5%~D
2N7002DW-T/R7_SOT363-6~D
PQ55A
4
12
PR147
100K_0402_5%~D
12
PR179
22K_0402_5%~D
2N7002DW-T/R7_SOT363-6~D
PQ69B
FDS6679AZ_SO8~D
1
2
36
4
12
12
SLICE_BAT_PRES#<31,33,41>
+3.3V_ALW+3.3V_ALW
12
13
D
2
G
S
3
5
4
PQ41
8
7
5
+DC_IN_SS
PC193
1U_0805_25V4Z~D
12
PR357
330K_0402_5%~D
PR178
100K_0402_5%~D
PQ65
RHU002N06_SOT323
SW_GND<46>
61
2
PQ69A
2N7002DW-T/R7_SOT363-6~D
PR360
0_0402_5%~D
PBATT_IN_SS
PD19
12
RB751V-40_SOD323~D
+3.3V_ALW2
12
PR329
100K_0402_5%~D
SLICE_BAT_PRES
3
PQ56B
2N7002DW-T/R7_SOT363-6~D
5
4
3
PD27
B540C~D
21
FDS6679AZ_SO8~D
PQ23
8
7
5
12
PR180
100K_0402_5%~D
NB_AC_OFF <33,41,46>
61
PQ66A
2N7002DW-T/R7_SOT363-6~D
2
+5V_ALW
12
PR181
22K_0402_5%~D
NB_AC_OFF_BJT <41>ACAV_DOCK_SRC <46>
3
PQ66B
2N7002DW-T/R7_SOT363-6~D
5
4
SLICE_BAT_PRES
12
D
42
47K_0402_5%~D
PR363
1K_1206_5%
PC192
1U_0603_25V6-K~D
12
12
+NBDOCK_DC_IN_SS
+DOCK_PWR_BAR
PQ59B
NTGD4161PT1G_TSOP6~D
S
G
3
PR325
12
240K_0402_5%~D
PR327
12
61
PQ56A
2N7002DW-T/R7_SOT363-6~D
2
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
1
2
36
4
12
PR148
47K_0402_1%~D
PR361
@
330K_0402_5%~D
12
PR326
12
240K_0402_5%~D
12
12
PR142
PC141
240K_0402_5%~D
0.47U_0805_25V7K~D
IMD2AT-108_SC74-6~D
+DC_IN_SS
PQ59A
NTGD4161PT1G_TSOP6~D
S
D
65
G
1
PR328
12
47K_0402_5%~D
13
D
PQ61
2
RHU002N06_SOT323
G
S
PQ24B
IMD2AT-108_SC74-6~D
43
PQ24A
PD20
RB751V-40_SOD323~D
2
2
16
PD51
3
2
RB715F_SOT323~D
12
D
S
2
12
PR144
22K_0402_5%~D
EN_DOCK_PWR_BAR#
5
PQ28
RHU002N06_SOT323
13
D
2
G
S
12
PR151
22K_0402_5%~D
2
3
PQ42
FDS6679AZ_SO8~D
8
7
5
1
PR186
47K_0402_5%~D
PQ70
RHU002N06_SOT323
13
2
G
PR358
0_0402_5%~D
PR359
@
0_0402_5%~D
1
EN_DOCK_PWR_BAR <33>
PD31
PDS5100H-13_POWERDI5-3~D
1
1
2
36
4
12
12
12
12
PC174
2200P_0402_50V7K~D
EN_DOCK_PWR_BAR#
ACAV_DOCK_SRC
+PWR_SRC
12
PC175
0.1U_0603_25V7K~D
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Selector
LA-4151P
1
4857Fr id ay, July 04, 2008
0.2
of
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
2
3
4
5
6
7CPU12/14/2007HWAdd R1059 H_RESET# pull up +1.05V_VCCP and Depop R1059 Depop R1059
9CPU12/14/2007HWFor Intel CPU power transientChange C56,C57and C58 to 470UF
10MCH12/14/2007HWFor Intel request for DP functionChange R180,R181,R182 and R183 to 4.02K
10,34MCH12/14/2007HWFor design issueChange U80 and U57 to 74AHC1G08GW
13MCH12/14/2007HWFor disable TV-OUT function
Owner
For Intel request power seqHW12/14/2007MCH13
Depop D1 and R122
Modify U78.K30 to GND plane
-Disconnect PWR_MON_GFX from U3.45
7
18EMC400212/14/2007DellFor Dell request
-Connect U3.45 to MAX8731_IINP with a 4.7k series resistor
-Identify the values of R1033 and R1061
8
CC
9
10
11
12
13
14
15
18EMC400212/14/2007DellFor U3 POWER_SW# Input-Add AND Gate
21DP12/14/2007IntelFollow Intel proposal for DP interoperabilityAdd U94,U95,Q163,Q164,C1159,R1073,R1074 and C1160
32USH12/14/2007 Broadcom Follow Broadcom request to modify schematics for USH
33SIO12/14/2007DellGPIO Map update
33SIO12/14/2007Dell
The LCD/LED will keep had power with USB
device when unplug AC & Battery
33SIO12/14/2007DellOn Battery Mode U35 have +3.3V backdrive
33SIO12/14/2007DellAdd PD on SYS_LED_MASK#Add R1069
-Add U93,C1158,R1063,and R1064
-Change R142 to 0ohm
-Add R1066,R1067,R1068 and del R495,R499 and change R771 to 1K
-Depop R1067,R490,C594,C591,R467 and pop R829,add R1072
-Changed pin 82 from USB_CHARGER_PWR_EN# to ESATA_USB_PWR_EN#
-Change pin 104 from ESATA_USB_PWR_EN# to USB_POWERSHARE_PWR_EN#
-Add 100k no pop pull-ups to +3.3V_ALW2 on:
USB_SIDE_EN#,ESATA_USB_PWR_EN#,USB_POWERSHARE_PWR_EN#
-No stuff R502, R504, R1013.
-Add diode on signal INSTANT_ON_SW# to 5028 pin 28
-Add D74 and R1070
Solution DescriptionRev.Page#1Title
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
Request
16
BB
17
18
19
20
21
22
23
24
AA
33SIO12/14/2007 CompalChange BID to X01(001)Pop R529 and depop R534
33SIO12/14/2007DellGPIO Map updateAdd U96 and C1161X01
34EC12/14/2007DellGPIO Map update
-Del U59,C1012,R553,R558 and add R1071,Change R1050 from 1K to 33K
-Change ACAV_IN_DOCK# to ACAC_DOCK_SRC# ACAV_IN_MB/DOCK to ACAV_IN
35EC12/14/2007DellGPIO Map update-For BKT add U38.15 to BKT_GPIO17 connect to D71.2
38LED12/14/2007 CompalBackdrive from +3.3V_WLAN to +5V_RUN on S3 modeAdd D75 between Q97 and Q98
38LED12/31/2007 CompalAdd Bypass Capacitor for TTL GateAdd C1162~C1165
USH3212/31/2007 Broadcom Follow Broadcom request to modify schematics for USH
-Change R476 to 5.1M ohms and R488 to 3.3M ohms to lower
-Pop D70, C641, C647,add R1077 and Depop R464,R1077
Docking12/31/200731DellRoush + Docking AC protect issue(crowbar)Add D77, R1075,R1076,and Depop R124.
33SIO12/31/2007DellFor Power change Media Slice issue Add D78, R1079 and Depop R1078.
X01
X01
X01
X01
X01
X01
X01
X01
2521,40USB01/03/2008CompalFor power leakage for USB switchChange U97,P/N from FSUSB31K8X_US8 to TS3USB31RSER_QFN8
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History1
LA-4151P
4957Fr id ay, July 04, 2008
1
0.5
of
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
16,17DIMM01/03/2008MEFor ME team change foxconn to main source
Owner
-Change DIMMA P/N from TYCO_2013022-1 to FOX_AS0A620_U4SN-7F
-Change DIMMB P/N from TYCO_2013297-1 to FOX_AS0A620_U8SN-7F
MEFor ME team change connectorChange JTP1 to SP070801070
-Change Y3 to SJ100005X0L,C674 to 27PF
-Change C608,C296,C297 to 12PF,C609,C1032,C1058 to 15PF
Solution DescriptionRev.Page#26Title
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
Request
4038LED01/09/2008MEFor ME team change LED board to FPCChange JBIO5 pin-define
4121,35WLAN01/10/2008HWFor GPIO update for WLAN switch
BB
Add BKT_GPIO12(U38.8) and BKT_GPIO13(U38.9) connect to JBIO1.75
and JBIO1.120
4207ITP01/10/2008HWFor Intel ITP solution updateChange R62,R64,R65,R66,R67 from 51ohm to 56ohm and R977 depop
4332USH01/11/2008HWFollow Broadcom request to modify schematics for USHAdd R1089
UMA display TV solution implementHW01/14/2008MCH1044
HW01/14/2008MCH1045
Follow Roush UMA implement (CRT/LVDS)
UMA display TV solution implementHW01/14/2008MCH1146
ICH9M2347Follow Roush UMA implement
HW01/14/2008
Follow Roush UMA implementHW01/14/2008DP/Card1 IO2148
AA
ICH9M24,3549
HW01/14/2008
HW01/15/2008LVDS19Add D81 between LVDS and MCH, ADD 1091 pullup.
CIS Symbol update
BIA_PWM signal seems to be floating in " BKT mode ".50
Remove TV_CVBS/TV_Y/TV_C signals with pull down resistors
(R674,R677 and R678). Connect pin J27,E27 and G27 to GND
Remove R1048,R1049(CRT_H/VSYNC)pull up. Change R688 from
2.37K_1% to 2.4K_1%; Change R672 from 1.02K_1% to 976_1%
Change pin N32 of U78(VCCD_TVDAC) from +1.5V_RUN to GND. Remove
C138 and C139
Remove R952, connect pin AC23 of U79 to pin2 of R237
Remove BIO_DET# net(Del. R823,R932; pin A16 of U79), depop R754
Add R1090(100K)pull up to +3.3V_ALW_ICH on PCIE_MCARD1_DET# net,
make R439 depop; change C1135 from .1uf to 1uf
Link JP3(Change to JP6) and JTP1
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
X01
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History2
LA-4151P
5057Fr id ay, July 04, 2008
1
0.5
of
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
516CLKGENFor component derating 03/04/2008HWL1 change to SM01002480L
DD
52
7CPU03/04/2008HWFor ITP modify solution
Owner
R57 change to 124ohm, R64 change to 39ohm, R65 change to 150ohm,
R66 change to 649ohm, R67 change to 27ohm
539CPU03/04/2008HWFor CPU power loadline solutionC52 change to pop and C56,C57,C58 change to 270UF(SGA00003H0L)X02
5410MCH03/04/2008HWFor DP modify solutionR180,R181,R182,R183 change to 2.2K ohmX02
5519PFG03/04/2008HWAdd Camera solution for PFG
Add Q165,Q166,R1094(unpop),R1095,R1096,R1097,R1098,C1168,C1169
C1170,C1171,U98(unpop),L70(unpop),JCAM and net CAM_MIC_CBL_DET#
5619LVDS,JBIO1 03/04/2008HWFor BKT table updatedModify D68.2 to BKT_GPIO18 for +LCDVDD power and X02
5721Audio03/04/2008HWFor audio vendor solutionR327,R828 change to 499K ohm and R328 unpopX02
5827R5C83303/04/2008HWFor R5C833 crystal solution by test resultModify X2(SJ124P5M53L)-->Y2(SJ10000690L) X02
6032BCM588003/04/2008HWFor EMI solution by BCM5880
6133ECE502803/04/2008HWFor ECE5028 and board ID updated
6234ECE503503/04/2008HWFor ECE5035 updated
Add L71,L72,C1172,C1173
R841 change to 3K and R473 change to 1K,R849 pop
Del R1084, add PWR_BTN_BD_DET#
R529(unpop),R534(pop),R530(pop),R535(unpop) for X02
Modify R560 to pop,R877 change to 200K and
R565,R567 change to 2.2K ohm
6338LED03/04/2008HWAdd WLAN LED share to BKT LEDAdd Q167,Q168
39BKT function 03/04/2008HWFor BKT function updated
JBIO4 change from Tyco_1734242-4 to Tyco_1734242-6
add PWR_BTN_BD_DET# for PWR board
Modify +3.3V_RUN_BKT_PWR source to alway pop
Add net BKT_LED to control LED
6640BKT function 03/04/2008HWFor BKT table updatedModify U86.9 to BKT_GPIO11(U38.14)
Solution DescriptionRev.Page#Titl e
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
Request
6724SPI03/04/2008HWFor del recovery bios functionDel U13,R295,R303,R304,R305,R306,R308,R309,C329X 0 2
BB
6831Dock03/04/2008HWFor Docking ESD concernModify D73 from SC10T24C010 and SC600000N0LX02
6936Power03/04/2008HWFor power control concernReserve R1100,R1101 to bypass level shiftX02
7029,35BKT function 03/05/2008HWFor BKT table updatedAdd net BKT_GPIO17 and R1104(unpop),D82 for Biometic reset signal X02
7135TP03/06/2008HWFor backdrive from Touch PADModify R594,R595 pull-up to +5V_ALWX02
7232USH03/06/2008HWFor smart card concernModify R849 to 1.5K and R973 to 300ohmX02
733803/07/2008HWFor keyboard LED modify
7419,22
AA
LED
Camera03/10/2008HWFor Camera functionModify net name from CAM_MIC_CBL_DET# to CAM_CBL_DET#X02
-Modify JBIO5 to TYCO_1-1734242-2 and add net MASK_BASE_LEDS#
-Q120.3,Q121.3,Q122.3 modify to +5V_ALW
X02
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History3
LA-4151P
5157Fr id ay, July 04, 2008
1
0.5
of
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
75
DD
7604/07/2008
77
78
79
80
81
33
38
33
18
34
24
DockingSlice battery issue04/07/2008HWchange R1076 from 1K to 910KX0331
EC5028
LED
EC5028
EMC4002
EC5035
SPI ROM
04/07/2008
04/07/2008
04/07/2008
04/07/2008
04/07/2008
Owner
HW
HW
HW
HW
HW
HW
Support wireless on#/off switch on BLT mode
Blue LED brightness concern
Roush MB side have backdrive when plug some USB device
which have extra-power source
Vendor recommend value
change from 150 ohm to 1K ohm
R504 change to 10K and made pop.R502 and R1013 change to pop
R1033 change to 200K
Remove U37,C672,R589,R590,R591,R592,R593 and R558
Add U13,C329,R295,R304,R305,R306,R308,,R307 and R309
D28 and D29 change connect to RFREADER_TXN1_P1 and RFREADER_TXP1_P1
82
CC
32
USH
04/07/2008
HW
Vendor recommend schematics for EMI
R494 and C639 change connect to RFREADER_TXN1
R498 and C643 change connect to RFREADER_TXP1
Add U99~U101(SN74CBTD3306) and C1174~C1175(0.1UF)
83
21
DP
04/07/2008
HW
Vendor recommend schematics for DP switch
R1053 change from 100K ohm to 1M ohm
Del Q19,Q20,Q163,Q164,R958,R960,R964,R966,R1073,R1074
84
85
86
87
88
BB
12
24,33
35
06
40
TV
EC5028,
SPI ROM
TouchPAD
Clock
BlackTop
8919Camera 04/07/2008
90
91
92
38LED04/09/2008HWAdd WWAN LED control on BLT modeX03
27R5C83304/09/2008HW
29PWR SW04/09/2008HWRemove PWR SW for debug Remove PWRSW1,PWRSW2 and C684X03
04/07/2008
04/07/2008
04/07/2008
04/07/2008
04/07/2008
HW
HW
ME
Vendor recommend schematics for TV disable
GPIO table update
ME concern need to shorten TouchPAD FFC length
Isolate CLK_PCI_DOCK signal that has risk for docking
HW
HW
scenarios.
USB interface change for BKT to ICH
HWCamera pinout modify for vendor
Add SC CLK impedance control between chip(20~30 ohm)
and connector
Add R1105~R1107 to 75 ohm
Add net name SPI_WP#_SEL and R1108~R1109(0 ohm)
Swap JTP1 Pin1~Pin16 net name
change CLK_PCI_PCM to U1.33
Del U83 and C1144,Modify U97.5 to USB1-,U97.3 to USB1+ and U85.6
from BKT_GPIO3 to GND and change U97.1to BKT_GPIO3
USBP11_D- change to JCAM.2,USBP11_D+ change to JCAM.3
CAM_CBL_DET# change to JCAM.5
Modify R206.1 to +3.3V_RUN_BKT_PWR and Q115.3 to +5V_TP_PWR
Add R1110X03
Solution DescriptionRev.Page#Titl e
X03
X03
X03
X03
X03
X03
X03
X03
X03
X03
X03
X03
X03
X03
Request
93
94
95
96
AA
9710S304/21/2008HWModify U80 power to +3.3V_ALW_ICHFixed S3 resume
Vendor recommend schematics modify to damping resistor
for share CLK signals
Modify Hall sensor from smart card connector to
SPK connector
Modify R27 to 33ohmX03
Modify JSC1 to 10pin and JSPK1 to 9pin connectorX03
24,27RF issue04/21/2008HWAdd 14M/33M/48MHz terminator for RF issuePOP R279,C312,R285,C318,R803 and C1057X03
X03
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History4
LA-4151P
5257Fr id ay, July 04, 2008
1
0.5
of
5
4
Version Change List ( P. I. R. List )
3
2
1
Request
DateIssue DescriptionItemTitlePage#
DD
98
Owner
HW04/21/2008Reserve 24 pcs high frequence for ULV CPUCPUAdd C1176~C1199X039
Thermal04/22/200899HWX0318Modidy thermal protect on 95 degreechange R151 to 1.5K
10021DP04/23/2008HWUpdate new DP swith schematicsDepop R1085~R1088X03
10136
10239BLT04/25/2008HW
backdrive 04/24/2008HWFix +3.3V_RUN backdrive from North bridgeModify R625 to 33ohm 0603 and pop Q79X03
Update BLT GPIO tableAdd BKT_GPIO5 connect to JBKT1.63X03
Add U103,C1200,C1201 and del U92,C1156,C1157,R1060 ,U79.V10
06/10/2008HWFix slice battery concern on powerChange R503 from 100K to 4.7K
06/10/2008HWFix 1394 reset timingModify R801 to 47K
06/10/2008HWUpdate GPIO table for TPM and TCM Add R1111
06/10/2008HWbackdriveFix +3.3V_RUN backdrive from North bridgeModify R625 to 39ohm 0402
connector06/11/2008MEFix ME concern for factory buildModify JBT and JBIO5 to SP070805091(TYCO_1-2041070-2)
connector06/11/2008MEFix ME concern for factory buildModify JBIO3,JCAM,JCS1 and JBIO4 to SP070805092(TYCO_2041070-6)
connector06/11/2008MEFix ME concern for factory buildModify JEXP1 to SP070805271(TYCO_2-2041070-6)
06/11/2008MEFix ME concern for factory build
Modify JEXP1 to SP070805270(TYCO_1-2041070-6)
JSATA1 to SP01000SE0L(TYCO 2-1759838-5)
Modify L71,L72 change to SHI00005Y0L
and C639,C643 change to +-10%
11412NB06/13/2008HWUpdate NB reference schematicsAdd C1202
11529SPK
06/16/2008ME
Modify SPK connector pin define to improve cable
routing for ME concern
Re-define SPK connector pin-out
1166CLKGEN06/20/2008HWFix setup ME power package5 issue when power onAdd R1112
Rev.Solution Description
X04
X04
X05
X05
X05
X05
X05
X05
X05
X05
X05
X05
X05
X05
11738LED06/20/2008HWFix LED flash bright when unplug ACAdd R1113
118
11930BT06/20/2008HWFix BT cable for factory assemble
21USB Charge 06/20/2008HWFollow Roush reduce USB charge schematics Delete R995
Modify BT_DET# from JBT.1 to JBT.12
Add R1115~R1119,C1202,C1203 and R383 change to 10K,R884 change to
1K and delete R381,R382
X05
X05
X05
X05
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History5
LA-4151P
5357Fr id ay, July 04, 2008
1
0.5
of
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
2
Battery slice
41
application
Charger12/13Dell
46/48
46
Charger
3
4
46Charger12/13
12/13Dellfor Slice battery to detect NB battery is
12/13
Owner
Dell
insert or not.
To block +PWR_SRC (19.5V) from
Docking connector DOCK_DCIN_S +/- pins when NB is not docked
Charger of ISL88731 will turn off
When ACIN is no power
This change to allow charging when AC adapter only in Dock.
Note TI and Intersil version of charger will disable
charging when AC OK goes low.
Add PQ47(FDN338P_NL), PD22(RB751V) and PR234 (0 ohm)
Add PQ63 A/B(NTGD4161PT1G),P341(100K),PR342(100K),
PR343(100K).
Add PQ46 RHU002N06 to control PQ62 on/off
Remove PR188 and PR187,
Change PR145 from +DC_IN to +SDC_IN.
change PR157 net name from ACAV_IN_NB to ACAV_IN.
Maxim charger function was fine.
The added comparator circuit is used to give BIOS
indication when AC adapter is inserted or removed from
CC
5
6
46Charger12/13DellChange PQ36.2 connection
Charger
12/1346/48
Dell
48Selector12/13DellPBATT back drive to Battery Slice
7
notebook.
Replaces charger AC OK function.
Change all notebook signal
name's "ACAV_IN_DOCK" and "ACAV_IN_DOCK#" to
"ACAV_DOCK_SRC" and "ACAV_DOCK_SRC#" respectfully.
Change PQ36.2 connection
from ACAV_IN_NB to "ACAV_IN"
vias charger high side MOSFET
Change PQ40_Pin1 from "ACAV_IN_DOCK#" to "ACAV_DOCK_SRC#"
Change PQ40_Pin2 from "ACAV_IN_DOCK" to "ACAV_DOCK_SRC"
Change PQ43_Pin2 from "ACAV_IN_DOCK" to "ACAV_DOCK_SRC"
from ACAV_IN_NB to "ACAV_IN"
Add PQ45 between PBATT+ and +VCHGR
Use PBATT_OFF control PQ62 to switch PQ45
Add PR351(240K), PR352(47K) and PR353(100K)
8
48
Selector12/13CompalPBATT_OFF connect to DOCK_AC_OFFAdd PD34 RB751V-40X01
Solution DescriptionRev.Page#1Title
X01
X01
X01
X01Dell
X01
X01
X01
Request
9
BB
10
11
41DC_IN12/13DellAdd PC183 and non-stuff
42+3.3V/+5V12/13DellEE work item
48Selector12/14Compal
For save the placement space, use one dule MOS chip to
replace 2pcs MOS chip
Add PC183 and non-stuffX01
Change PL6 and PL7 from HMP1350-3R3LD-R to SSC-1350F3-2R8
Change PQ6 and PQ7 from FDMC8878 to FDMS8692
X01
Add PQ64 A/B (2N7002DW-T/R7) to replace PQ29 and
PQ40 (RHU002N06)
X01
Add PQ65 A/B (2N7002DW-T/R7) to replace PQ37 and
PQ46 (RHU002N06)
Add PQ66A/B (2N7002DW-T/R7) to replace PQ 38and
PQ39 (RHU002N06)
12
46Charger12/14Compal
For save the placement space, use one dule MOS chip to
replace 2pcs MOS chip
Add PQ67 A/B (2N7002DW-T/R7) to replace PQ27 and
PQ43 (RHU002N06)
X01
Add PQ68 A/B (2N7002DW-T/R7) to replace PQ35 and
PQ44 (RHU002N06)
13
1445CPU_VCORE12/14Compal Connect MAX8786_VCC to PU7_Pin3 to disable third phaseConnect MAX8786_VCC to PU7_Pin3X01
AA
42+3.3V/+5V12/14Compal
ME highet limit issue
Change PL16 from HMU1356-5R6 to MPLCH1040L5R6
X01
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-4151P
5457Fr id ay, July 04, 2008
1
1.0
of
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
2
3
48Selector1/7
46Charger1/7
48SelectorHot dock issue, adapter crowber1/7
Owner
AJ
Compal
Merle
DELL
Merle
DELL
Charger for Battery Slice
Change PQ63 to 2N7002DW
Add PR360 0_0402_5% between PQ63 and SLICE_BAT_PRES
Charger Isense MOSFET timing changePC142 change to 0.047u_0603_25V
Add PR357 330K_0402 form +DOCK_PWR_BAR to GND.
Add PQ70 RHU002N06 parallel PQ61, series PR358 0_0402
to EN_DOCK_PWR_BAR#,serial PR359 0_0402 to ACAV_DOCK_SRC
4
5
41+DC_IN1/7
PWR
Snubber
1/9
Doug
DELL
Guangyong
DELL
PJPDC1 change to 7pin connector
DELL request add a snubber circuit
on every regulator
PJPDC1 change to MOLEX_87438-0743_7P-T
Change PR20 to 0_0402_5% and populate
Change Battery Pin from 9 to 7pinChange Battery Pin from 9 to 7pin
Populate PR224
7
47ADP3209
NB_CORE
8
45CPU_CORE1/10CompalThe load line SPEC is 4 mohm for SFF SV CPU
1/10Guangyong
DELL
Modify ADP3209 schematic
Follow ADI suggestion
Change PR239 from220K_0603_1% to 49.9K_0603_1%
Change PR238 from 140K_0402_1% to 169K_0402_1%
Change PC219 from 2200p_0402_50V to 1200p_0402_50V
Change PR124 from 6.49K_0603_1% to 14.3K_0603_1%
Change PR118 from 4.99K_0402_1% to 6.34K_0402_1%
Change PR136 from 1.43K_0402_1% to 732_0402_1%
Change PR90 and PR109 fro, 2K_0402_1% to 430_0402_1%
Change P98 and PC109 from 0.22U_0603_10V to 1U_0603_25V
No stuff PC131, PC132 and PC133
46Charger2/19
BO
DELL
Maxim Charger from powering on while in S5 and battery only
9
BB
1. Un-pop PR184, PR347.
2.Add PD52 BAT54CW_SOT323,
+DOCK_PWR_BAR/+DC_IN_SS
Reserve PR184 0_0402_5% form +SDC_IN to PU10 PIN22
Add PR363 1K_1206 and PC192 1U_0603_25V from
+NBDOCK_DC_IN_SS to ground.
Add PD35 RB751S40T1_SOD523-2 from NB_AC_OFF# to
ACAV_IN_NB.
Change PD31 from SCSB540C08L(S SCH DIO B540C-13-F SMC) to
SCS00002M0L(S SCH DIO PDS5100H-13 POWERDI5).
Add PR364 SD02800008L(S RES 1/16W 0 +-5% 0402 between
VCC_AXG_SENSE and PR227.2
X02
X02
X02
Add PR362:SD02800008L(S RES 1/16W 0 +-5% 0402) between
IMVP_PWRGD and pin31 of PU15.
13
PWRSnubber
3/5Compal
EMI
In order to meet the derating requirement,
change the resister component size
Change component sixe from 0805 t0 1206 below location of
regulator switching node
X02
+3.3V_ALW: PR290 +5V_ALW: PR288,
AA
+VCHGR:PR289, Vcore: PR266,PR267,PR268 and PR269
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-4151P
5557Fr id ay, July 04, 2008
1
1.0
of
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
2
3
4
5
CC
48Selector3/6MERLE
46Charger
3/6CompalMaterial smooth control
41DC_IN4/8AJ
45VCORE
43+1.5V/1.05V
42,43,
45,46,
EMC&Noise4/8
4/8James
4/8CompalChenge logic high level voltage for OE pin
47
Owner
DELL
Compal
Compal
EMI and
Key Part
DELL
Application for Battery Slice
SPACE limitation
PWM circuitry DH/DL still switch a few cycles in all
3 phase after power off resulted in a voltage pulse
observed at output Vcore with a negative voltage
( -0.24V approximately).
from 5V to 3.3V
To solve the EMI and system noisde issue
Delete PR260 and PR261
Change PQ55 from IMD2AT to 2N7002DW
Add PR291, PR292, PR293, PR294, PC193 and PD36
Change PQ30 and PQ31 from SI7326DN-T1-E3 to FDMC8878
Change PQ32 from SI7230DN-T1-E3 to FDMC8854
Change PC5 to SE00000GG8L(22U_0603) from SE002223K8L(22U_0806)
Add PR128 (10K_0402) between PWM1 to GND
Add PR133 (10K_0402) Between PWM2 to GND
Change PU25 and PU26 from SA000022Y0L(S IC VT351FCX-ADJ CSP 25P)
to SA00002GE0L (S IC VT351AFCX-ADJ CSP 25P
1.Boost resister.
a.CPU Vocre
Change PR87 and PR98 from 0ohm_0603 to 2.2ohm_0603
2 Snubber
a.CPU Vcore
Change PC99 and PC110 from 1500PF_0603 to 1000PF_0603
Stuff PR266 (4.7ohm_1206), PR267(4.7ohm_1206), PC99
and PC110.
b.5V/3.3V/Charger/GPU_Core
Change PC191, PC140, PC190 and PC189 from 1500PF_0603
to 1000PF_0603.
Change PR288, PR265, PR289 and PR290 from 4.7ohm_1206
to 2.2ohm_1206.
Stuff PC189, PC191, PC190, PC140, PR265, PR289,
PR288 and PR290.
C.1.5V/1.05V
Change PC187 and PC188 from 1500PF_0603 to 1000PF_0603.
Change PR286 and PR287 from 4.7ohm_1206 to 1ohm_1206.
Stuff PC187, PC188, PR286 and PR287.
BB
6
42+3.3V/+5V4/22
7
45VCORE4/22
8
4/8Change PQ41 and PQ42 from SI4835 to FDS6679Z
Kenny
Compal
Kenny
Compal
LES
DELL
Current Derating issue48Selector
Material PSL issue
PWM circuitry DH/DL still switch a few cycles in all
3 phase after power off resulted in a voltage pulse
Change PL6 and PL7 from SSC-1350F3-2R8 (TMP) to HMP1350-2R8
(Delta)
Change PR128 and PR138 from 10K_0402 to 33K_0402
observed at output Vcore with a negative voltage
( -0.24V approximately).
46ChargerM09 NB_AC_IN design change for sequence issue
9
10
46
Charger
6/2
6/2
AJ
Compal
AJ
Compal
Change UL setting from 65W to 90W
Change PC185 from 1000p to 100p.
Change PR175 from 100K to 24K
Change PR166 from 57.6K to 51.1K
Cgange PR171 from 13K to 17.8K
Change PR172 from 105 to 348
Pop Pr169
41DC_IN6/3
11
AA
46Charger6/20
12
5
AJ
Compal
AJ
Compal
SLICE_BAT_PRES# glitch issue
Follow the common design
4
Add PC38 (1500n) between PQ47 to GND
Change PR354 from 10K to 100K
De-POP PR355
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
Solution DescriptionRev.Page#1Title
X02
X02
X03
X03
X03
X03
X03
X03
X03
X05
X05
X05
X05
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
2
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-4151P
5657Fr id ay, July 04, 2008
1
1.0
of
Request
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
436/20Henry
Owner
Change PR65 pull high voltage from +3.3V_SUS to +3.3V_ALW +1.5V/1.05VChange PR65 pull high voltage from +3.3V_SUS to +3.3V_ALW
Compal
2
3
4
47
+Vgfx_Core
45+Vcore6/20
42/45/46
EMI ISN6/25
6/20Kenny
Compal
Kenny
Compal
EMI
Compal
Load lide 6.9mohm to follow HW North Bridge setting
Change PR239 from 49.9K to 69.8K
on performance mode
Modify the CPU power monitor error on thermal control panel Change PR139 from 22.1K to 14.3K
EMI ISN issueAdd PL15(FBMJ4516HS720NT) and PC222(470P_0402)
Change PR155 from 0 ohm to 4.7 ohm.
Change PR37 from 1ohm to 4.7 ohm.
POP PL12 and de-POP PJP32
CC
46
5
Charger
7/4
Merle
Dell
Because the the average current is not over 3A(65W adapter).Depop UL circuit, pop PR170
Solution DescriptionRev.Page#1Title
X05
X05
X05
X05
X05
Request
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-4151P
5757Fr id ay, July 04, 2008
1
1.0
of
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