PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Side Bottom
Side Top
ICH8-M
Biometric Reader
SMART CARD
PCI TABLE
Lane 3
R5C833
REQ#/GNT#
REQ#1 / GNT#1AD17PIRQC, D
PIRQPCI DEVICEIDSEL
Lane 4
Lane 5
Lane 6
AA
AD24REQ#0 / GNT#0
PIRQADocking
None
EXPRESS CARD
None
GIGA LAN
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
SCHEMATIC, M/B LA-3751P
401490
348Wednesday, March 28, 2007
1
A
of
5
4
3
2
1
RUN_ON
DD
ADAPTER
FDS6679AZ
(Q106)
+GFX_PWR_SRC
+5V_ALW
SUS_ON
HDDC_EN
+15V_ALW
SI3456BDV
(Q148)
SI3456BDV
(Q111)
+5V_SUS
+5V_HDD
+PWR_SRC
BATTERY
ISL6260
(PU6)(PU2)
CHARGER
CC
RUNPWROK
+VCC_CORE
+1.8V_SUS
ISL6236
DDR_ON
1.25V_RUN_ON
+1.25V_RUN
ISL6236
(PU4)
1.05V_RUN_ON
1.5V_RUN_ON
+1.05V_VCCP+1.5V_RUN
ISL6236
(PU1)
ALWON
+3.3V_ALW
ALWON
RUN_ON
SI4810BDY
(Q154)
AUDIO_AVDD_ON
MAX9789A
+5V_RUN
JUMP
(PJP22)(U41)
0.9V_DDR_VTT_ON
ENAB_3VLAN
SI3456BDV
(Q125)
3.3V_SUS_ON
SI4810BDY
(Q149)
3.3V_RUN_ON
SI4810BDY
(Q157)
WLAN_3V_ENABLE
+VDDA+5V_ODD
SI3456BDV
(Q133)
TPS51100
(PU3)
BB
+3.3V_LAN+3.3V_RUN+3.3V_SUS
+3.3V_WLAN
+0.9V_DDR_VTT
REGCTL_PNP25
REGCTL_PNP12
R1024
MBT35200MT2GPBSS5540Z
(Q126)
(Q127)
+3.3V_R5C833
AA
+2.5V_LAN+1.2V_LAN
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
SCHEMATIC, M /B LA-3751P
401490
448Wednesday, March 28, 2007
1
of
A
5
4
+3.3V_SUS
3
2
+3.3V_RUN
1
2.2K
ICH_SMBCLK
AJ26
DD
CC
ICH8-M
SIO
ICH_SMBDATA
AD19
LCD_SMBCLK
8
LCD_SMBDAT
7
THRM_SMBCLK
100
THRM_SMBDAT
99
PBAT_SMBCLK
112
PBAT_SMBDAT
111
+3.3V_ALW
8.2K
+3.3V_ALW
4.7K4.7K
+3.3V_ALW
2.2K2.2K
2.2K
8.2K
+3.3V_ALW
+3.3V_ALW
+3.3V_ALW
D7B6911
BCM5756
SMBUS Address [C8]
EXPRESS
CARD
SMBUS Address [TBD]
100
100
3032
MINI WLAN
SMBUS Address [TBD]
8
Graphic BTB CONN
10
12
11
9
10
3
4
inverter
GUARDIAN
EMC4001
CHARGER
ISL88731
BATTERY
Connector
2N7002
MEM_SCLK
MEM_SDATA
2N7002
SMBUS Address [58]
SMBUS Address [2F]
SMBUS Address [12]
SMBUS Address [16]
2.2K2.2K
197
195
197
195
30
32
DIMMA
SMBUS Address [A0]
DIMMB
SMBUS Address [A4]
MINI
ROBSON
SMBUS Address [TBD]
BB
DOCK_SMBCLK
6
DOCK_SMBDAT
5
+5V_ALW
8.2K8.2K
+3.3V_ALW
+5V_ALW
39
40
+3.3V_RUN
DOCKING
SMBUS Address [C4, 72, 70, 48]
MEC5025
2.2K2.2K
CKG_SMBCLK
13
AA
5
CKG_SMBDAT
12
+3.3V_ALW
4
2N7002
2N7002
CLK_SCLK
CLK_SDATA
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
For the purpose of testability, route these signals
through a ground referenced Z0 = 55ohm trace that
ends in a via that is near a GND via and is
accessible through an oscilloscope connection.
Resistor placed within 0.5" of
CPU pin.Trace should be at least
25 mils away from any other
toggling signal. COMP0, COMP2
trace should be 27.4 ohm.
COMP1, COMP3 should be 55
ohm.
54.9_0402_1%~D
27.4_0402_1%~D
12
R339
12
12
R340
27.4_0402_1%~D
+VCC_CORE+VCC_CORE
JCPUC
A7
VCC[001]
A9
VCC[002]
A10
VCC[003]
A12
VCC[004]
A13
VCC[005]
A15
VCC[006]
A17
VCC[007]
A18
VCC[008]
A20
VCC[009]
B7
VCC[010]
B9
VCC[011]
B10
VCC[012]
B12
VCC[013]
B14
VCC[014]
B15
VCC[015]
B17
VCC[016]
B18
VCC[017]
B20
VCC[018]
C9
VCC[019]
C10
VCC[020]
C12
VCC[021]
C13
VCC[022]
C15
VCC[023]
C17
VCC[024]
C18
VCC[025]
D9
VCC[026]
D10
VCC[027]
D12
VCC[028]
D14
VCC[029]
D15
VCC[030]
D17
VCC[031]
D18
VCC[032]
E7
VCC[033]
E9
VCC[034]
E10
VCC[035]
E12
VCC[036]
E13
VCC[037]
E15
VCC[038]
E17
VCC[039]
E18
VCC[040]
E20
VCC[041]
F7
VCC[042]
F9
VCC[043]
F10
VCC[044]
F12
VCC[045]
F14
VCC[046]
F15
VCC[047]
F17
VCC[048]
F18
VCC[049]
F20
VCC[050]
AA7
VCC[051]
AA9
VCC[052]
AA10
VCC[053]
AA12
VCC[054]
AA13
VCC[055]
AA15
VCC[056]
AA17
VCC[057]
AA18
VCC[058]
AA20
VCC[059]
AB9
VCC[060]
AC10
VCC[061]
AB10
VCC[062]
AB12
VCC[063]
AB14
VCC[064]
AB15
VCC[065]
AB17
VCC[066]
AB18
VCC[067]
TYCO_1-1674770-2_Merom~D
AB20
VCC[068]
AB7
VCC[069]
AC7
VCC[070]
AC9
VCC[071]
AC12
VCC[072]
AC13
VCC[073]
AC15
VCC[074]
AC17
VCC[075]
AC18
VCC[076]
AD7
VCC[077]
AD9
VCC[078]
AD10
VCC[079]
AD12
VCC[080]
AD14
VCC[081]
AD15
VCC[082]
AD17
VCC[083]
AD18
VCC[084]
AE9
VCC[085]
AE10
VCC[086]
AE12
VCC[087]
AE13
VCC[088]
AE15
VCC[089]
AE17
VCC[090]
AE18
VCC[091]
AE20
VCC[092]
AF9
VCC[093]
AF10
VCC[094]
AF12
VCC[095]
AF14
VCC[096]
AF15
VCC[097]
AF17
VCC[098]
AF18
VCC[099]
AF20
VCC[100]
G21
VCCP[01]
V6
VCCP[02]
J6
VCCP[03]
K6
VCCP[04]
M6
VCCP[05]
J21
VCCP[06]
K21
VCCP[07]
M21
VCCP[08]
N21
VCCP[09]
N6
VCCP[10]
R21
VCCP[11]
R6
VCCP[12]
T21
VCCP[13]
T6
VCCP[14]
V21
VCCP[15]
W21
VCCP[16]
B26
VCCA[1]
C26
VCCA[2]
AD6
VID[0]
AF5
VID[1]
AE5
VID[2]
AF4
VID[3]
AE3
VID[4]
AF3
VID[5]
AE2
VID[6]
AF7
VCCSENSE
AE7
VSSSENSE
VCCSENSE/VSSSENSE trace length
match wit h i n 25 mils, Z0=27.4 ohm
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
SCHEMATIC, M /B LA-3751P
401490
848Thursday, March 29, 2007
1
A
of
5
High Frequence Decoupling
+VCC_CORE
4
3
2
1
Place these inside
socket cavity on
DD
CC
North side
Secondary
Place these inside
socket cavity on
Sourth side
Secondary
Place these inside
socket cavity on
North side
Primary
Place these inside
socket cavity on
Sourth side
Primary
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
C226
10U_0805_4VAM~D
C54
10U_0805_4VAM~D
C329
10U_0805_4VAM~D
C335
10U_0805_4VAM~D
1
C227
10U_0805_4VAM~D
2
1
C53
10U_0805_4VAM~D
2
1
C330
10U_0805_4VAM~D
2
1
C336
10U_0805_4VAM~D
2
1
C228
10U_0805_4VAM~D
2
1
C52
10U_0805_4VAM~D
2
1
C331
10U_0805_4VAM~D
2
1
C222
10U_0805_4VAM~D
2
1
C229
10U_0805_4VAM~D
2
1
C51
10U_0805_4VAM~D
2
1
C332
10U_0805_4VAM~D
2
1
C223
10U_0805_4VAM~D
2
1
C363
10U_0805_4VAM~D
2
1
C50
10U_0805_4VAM~D
2
1
C333
10U_0805_4VAM~D
2
1
C224
10U_0805_4VAM~D
2
1
C64
10U_0805_4VAM~D
2
1
C364
10U_0805_4VAM~D
2
1
C334
10U_0805_4VAM~D
2
1
C225
10U_0805_4VAM~D
2
1
C65
10U_0805_4VAM~D
2
1
C68
10U_0805_4VAM~D
2
1
C66
10U_0805_4VAM~D
2
1
C67
10U_0805_4VAM~D
2
1
C55
10U_0805_4VAM~D
2
1
C69
10U_0805_4VAM~D
2
1
C190
10U_0805_4VAM~D
2
1
C185
10U_0805_4VAM~D
2
10uF 0805 X6S
Near VCORE regulator.
+VCC_CORE
220U_X_2VM_R7M~D
South Side Secondary
BB
1
C338
C366
+
2
220U_X_2VM_R7M~D
220U_X_2VM_R7M~D
1
1
C365
+
+
2
2
220U_X_2VM_R7M~D
220U_X_2VM_R7M~D
1
C177
C179
+
2
220U_X_2VM_R7M~D
1
C178
+
2
North Side Secondary
1
+
2
ESR <= 1.5m ohm
+1.05V_VCCP
1
C312
0.1U_0402_10V7K~D
2
AA
1
C256
0.1U_0402_10V7K~D
2
1
C293
0.1U_0402_10V7K~D
2
1
C250
0.1U_0402_10V7K~D
2
1
C310
0.1U_0402_10V7K~D
2
1
C264
0.1U_0402_10V7K~D
2
Place these inside
socket cavity on
Secondary side
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
SCHEMATIC, M /B LA-3751P
401490
948Wednesday, March 28, 2007
1
A
of
5
H_D#[0..63]<8>
DD
CC
+1.05V_VCCP
54.9_0402_1%~D
54.9_0402_1%~D
12
12
R348
R347
BB
H_RESET#<7>
12
H_CPUSLP#<8>
R350
24.9_0402_1%~D
Layout Note:
H_RCOMP trace width
and spacing is 10/20
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
SCHEMATIC, M/B LA-3751P
401490
1448Wednesday, March 28, 2007
1
A
of
5
4
3
2
1
VGA fan control and Tachometer
+15V_ALW
C1441
12
0.1U_0603_50V4Z~D
FAN2_PWM
DD
+15V_ALW
5
IN+
6
IN-
12
120K_0402_5%~D
8
P
7
O
G
U73B
LM358DR2G_SOIC8~D
4
R1605
FAN2VREF
0.22U_0603_10V7K~D
FAN2_VFB
1
C1442
2
2200P_0402_50V7K~D
R160678.7K_0402_1%~D
120K_0402_5%~D
R1607
12
3
2
C1443
12
8
P
IN+
IN-
FAN2_ON
1
O
G
U73A
LM358DR2G_SOIC8~D
4
12
D47
21
+5V_RUN
6
2
1
D
Q182
G
22U_0805_6.3V6M~D
S
45
1000P_0402_50V7K~D@
C1445
1
2
SI3456BDV-T1-E3_TSOP6~D
FAN2_5V
MOLEX_53398-0371~D
3
RB751S40T1_SOD523-2~D@
C1439
1
2
+3.3V_RUN
12
R1270
10K_0402_5%~D
FAN2_TACH <36>
1000P_0402_50V7K~D@
C1444
1
JFAN2
1
1
2
2
3
2
3
R438
VSET =0.865V=
x 3.3V
R436+R438
Tp-70
VSET =
=> Tp = 88.2 C
21
Place close to JDIMA
+5V_SUS
12
R771
2.21K_0603_1%~D
VCP2
1
C750
2200P_0402_50V7K~D
2
12
R772
10K_0603_1%_TSM1A103F34D3RZ~D
Q102
13
D
2N7002W-7-F_SOT323-3~D
2
G
S
+3.3V_SUS
12
R773
10K_0402_5%~D
Place Q41 close to JDIMMB
REM_DIODE3_N, REM_DIODE3_P routing together.
Trace width / Spacing = 10 / 10 mil
5V_CAL_SIO#
Main fan cont ro l a nd Tachometer
Place under CPU
RB751S40T1_SOD523-2~D@
H_THERMTRIP#<7>
C630
1
2
+1.05V_VCCP
+3.3V_RUN
22U_0805_6.3V6M~D
+1.05V_VCCP
12
R424
10K_0402_5%~D
12
FAN1_TACH <36>
R414
0_0402_5%~D
+FAN1_VOUT
FAN1_TACH_FB
MOLEX_53398-0371~D
R425
12
2.2K_0402_5%~D
MMST3904-7-F_SOT323-3~D
R427
12
2.2K_0402_5%~D@
MMST3904-7-F_SOT323-3~D@
5
1
2
3
+3.3V_SUS
2
B
Q38
+3.3V_SUS
2
B
Q39
JFAN1
1
2
3
12
R423
8.2K_0402_5%~D
C
E
31
12
R426
8.2K_0402_5%~D
C
E
31
CC
D19
21
BB
AA
+3.3V_SUS
THERMATRIP1#
1
C628
0.1U_0402_16V4Z~D
2
THERMATRIP2#
1
C632
0.1U_0402_16V4Z~D@
2
2
C633
1
2200P_0402_50V7K~D@
Place C636 close to Guardian pin as possible
H_THERMDA<7>
H_THERMDC<7>
R428
12
49.9_0603_1%~D
THERMTRIP_VGA#<18>THERMTRIP_MCH#<10>
Place C633 close to the Q40 as possible
C
Q40
2
B
E
MMST3904-7-F_SOT323-3~D
31
C636
470P_0402_50V7K~D
0.1U_0402_16V4Z~D
1
+RTC_CELL
C637
2
+3.3V_SUS
0.1U_0402_16V4Z~D
+3.3V_SUS
C639
12
10K_0402_5%~D@
12
10K_0402_5%~D@
4
R196
R194
332K_0402_1%~D
1
2
+3.3V_RUN
12
R186
1
2
R436
12
MDC_RST_DIS#
SIO_GFX_PWR
R187
8.2K_0402_5%~D
2
C634
2200P_0402_50V7K~D
1
1
2
C638
ICH_PWRGD#<39>
0.1U_0402_16V4Z~D
118K_0402_1%~D
12
R438
2.2K_0402_5%~D@
12
THERM_B3
MMST3904-7-F_SOT323-3~D@
SUSPWROK<39>
C100
Place C634 close to the
Guardian pins as possible
THRM_SMBDAT<36,46>
THRM_SMBCLK<36,46>
REM_DIODE1_P
REM_DIODE1_N
+3VSUS_THRM
R4291K_0402_5%~D
12
R4321K_0402_5%~D
12
THERMATRIP1#
THERMATRIP2#
THERMATRIP3#
2200P_0402_50V7K~D
R437
MDC_RST_DIS#<25>
SIO_GFX_PWR<18>
12
C
C203
E
31
1K_0402_5%~D
12
R433
8.2K_0402_5%~D
0.1U_0402_16V4Z~D@
1
2
2
1
AUDIO_AVDD_ON<26>
+3.3V_SUS
2
B
Q76
PWR_MON<45>
U31
11
SMDATA
12
SMBCLK
38
DP1
37
DN1
41
DP2
40
DN2
35
3V_SUS
21
RTC_PWR3V
23
+FAN1_VOUT
FAN2_PWM
MDC_RST_DIS#
SIO_GFX_PWR
5V_CAL_SIO#
AUDIO_AVDD_ON
VSUS_PWRGD
16
3V_PWROK#
17
THERMTRIP1#
18
THERMTRIP2#
19
THERMTRIP3#
42
VSET
26
XEN
34
VSS
7
FAN_OUT
8
FAN_OUT
39
FAN_DAC1
10
GPIO1
13
GPIO2
14
GPIO3
15
GPIO4
22
GPIO5
36
GPIO6/FAN_DAC2
49
PAD_GND
EMC4001_QFN48~D
POWER_SW#
ACAVAIL_CLR
THERMTRIP_SIO
LDO_SHDN#/ADDR
SMBus address: 2F
THERMATRIP3#
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
VCP1
VCP2
DP3
DN3
DP4
DN4
DP5
DN5
ATF_INT#
SYS_SHDN#
LDO_POK
LDO_SET
LDO_OUT
LDO_OUT
LDO_IN
LDO_IN
VDD_3V
VDD_5V
VDD_5V
43
46
45
44
48
47
2
1
20
3
4
25
24
27
33
28
32
31
30
29
9
5
6
+5V_RUN
C645
1
2
VCP2
REM_DIODE3_P
REM_DIODE3_N
REM_DIODE4_P
REM_DIODE4_N
7.5K_0402_5%~D
LDO_SET
+3V_LDOIN
10U_0805_10V4Z~D
C646
1
2
R434
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
2
ATF_INT#
ATF_INT# <35>
POWER_SW# <36,37>
ACAV_IN <18,36,46>
12
0.1U_0402_16V4Z~D
1
C649
2
2200P_0402_50V7K~D
Diode circuit at DP4/DN4 is used for skin temp sensor
(placed optimally between CPU, MCH and GPU)
1
C418
2
2200P_0402_50V7K~D
R96
10K_0402_5%~D
+3.3V_SUS
2.5V_RUN_PWRGD <39>
1
1
2
1
2
1
2
C640
2
0_1210_5%~D
C643
1U_0603_10V4Z~D
@
+3.3V_RUN
1
C647
10U_0805_10V4Z~D
2
C644
C641
1
2
C648
C
Q41
2
B
E
2
B
12
+3.3V_SUS
R430
10K_0402_5%~D
R431
10K_0402_5%~D@
+2.5V_RUN
10U_0805_10V4Z~D@
+3.3V_RUN
R439
12
2200P_0402_50V7K~D@
MMST3904-7-F_SOT323-3~D
31
C649 close to Guardian and
C650 close to diode Q41
C
Q19
2200P_0402_50V7K~D@
MMST3904-7-F_SOT323-3~D
C418 close to Guardian and
C904 close to diode Q19
R1608
0_0402_5%~D@
12
THERM_STP# <42>
+RTC_CELL
Voltage margining
circuit for LDO output
LDO_SET
For Vmargin, stuff Ra=31.6K and Rb=30K
For production, stuff Rb=1K only
12
E
31
+3.3V_ALW
12
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
SCHEMATIC, M /B LA-3751P
401490
C650
+2.5V_RUN
12
R485
12
R441
1
1
2
1
C904
2
THERMTRIP_SIO <35>
31.6K_0402_1%~D@
Ra
1K_0402_1%~D
Rb
1548Wednesday, March 28, 2007
A
of
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