THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
2007/01/072008/01/12
C
Compal Secret Data
Deciphered Date
D
Compal Electr onics, Inc.
Title
Cover Sheet
Size Docume nt NumberRe v
Cus tom
LA- 3733P
Date:Sheetof
136Monday , Marc h 05, 2007
E
0.1
5
4
3
2
1
Compal confidential
533/667/800
Project Code: IBL80
File Name : LA-3733P
DD
Therm al S ensor
AD M 10 32AR M
page 4
AMD Turion/Sempron CPU
So ck et S1 638 P
page 4 ,5,6,7
HT L INK
200-800MHz
DD RI IDD RI I-SO-DIM M X2
page 08,09
Dual Channel
USB con n x1
CRT & TV-ou t
page 19
LCD Co nn.2C H LVDS
page 18
Nvidia
MCP67-MV
836 BGA
USB 2.0 BUS
HD Audio
IDE BUS
SATA2.0 BUS
3.3V 2 4.576MHz/48Mhz
3.3V A TA-100
CD RO M
CC
PCI- Express
port 1
Co nn.
page 20
USB SU B/ B
page 26page 26
HD A Codec
CX20549
page 22
S- ATA HDD
MI NI C ard
WLAN
page 20
BB
Po wer On /Of f C KT / L ID swi tch / Power O K CKT
DC /DC Inter face CKT.
Power Circu it DC/ DC
AA
page 28
page 29~36
L ED
page 25
LAN (10/100)
RTL8201CL
page 21
RJ -4 5
page 21
page 25
RTC CKT.
page 16
MI I
page 1 0,11,12 ,13,14,15,16,17
LP C BUS
ENE KB926
page 27
To uc h P ad
page 25
EC I/ O BufferSP I RO M
page 26
Int. KBD
page 27
page 26
Co nn.
page 20
Audio A MP
TI6017CX20548
page 24
Phone Jack
page 24
AM O M
page 24
RJ -1 1
page 21
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
2007/01/072008/01/12
3
Compal Secret Data
Deciphered Date
Title
BLOCK D IAGRAM
Size Docume nt NumberRe v
Custo m
LA- 3733P
2
Date:Sheetof
236Monda y, Marc h 05, 2007
1
0.1
5
Voltage Rails
Power PlaneDescription
DD
CC
VIN
B+
+CPU_CORE
+0.9V0.9V switch ed power rail for DDR terminator
+1.5VS
+1.2VALWONONON*
+1.2VSONOFF OFF
+1.2V_HT
+1.8V1.8V power rail for DDR
+1.8VS1.8V switch ed power rail
+3VALW
+3VS
+5VALW
+5VS
Note : ON* m eans that this power plane is ON only with AC power available, otherwise it is OFF.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
VLDT_Ax AND VLDT_Bx ARE CONNECTED TO THE LDT_RUN POWER
SUPPLY THROUGH THE PACKAGE OR ON THE DIE. IT IS ONLY CONNECTED
ON THE BOARD TO DECOUPLING NEAR THE CPU PACKAGE
NEAR HT POWER PINS THAT ARE NOT CONNECTED DIRECTLY
TO DOWNSTREAM HT DEVICE, BUT CONNECTED INTERNALLY
TO OTHER HT POWER PINS
PLACE CLOSE TO VLDT0 POWER PINS
CLOSE CPU,
CPU_THERMDA&CPU_THERMDC PLACE
CLOSE TO PROCESSOR WITHIN 1" INCH
SMB_EC_CK2
8
SCLK
SMB_EC_DA2
7
SDATA
6
ALERT#
5
1
C5
0.1U_0 402_16V4Z
2
12
ZD1
@
RLZ5.1B _LL34
SMB_EC_DA2
SMB_EC_CK2
SMB_EC_DA227
SMB_EC_CK227
SP02000D000 S W-CONN ACES 85204-02001 2P P1.25
ACES_85204-02001_2P
C4
4.7U_0 805_10V4Z
FAN
JP2
1
1
2
2
3
G1
4
G2
ACES_85204-02001
CONN @
A1
A26
ZZZ1
AA
PCB
LA-3733P
DA600005I00
5
AF1
Athlon 64 S1g1
uPGA638
Top View
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
2007/01/072008/01/12
3
Compal Secret Data
Deciphered Date
Title
AMD CPU HT I/F
Size Docume nt NumberRe v
Custo m
LA- 3733P
2
Date:Sheetof
436Monda y, Marc h 05, 2007
1
0.1
A
B
C
D
E
Processor DDR2 Memory Interface
VDD_VTT_SUS_CPU IS CONNECTED TO THE VDD_VTT_SUS POWER
SUPPLY THROUGH THE PACKAGE OR ON THE DIE. IT IS ONLY CONNECTED
ON THE BOARD TO DECOUPLING NEAR THE CPU PACKAGE
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
B
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
Compal Secret Data
2007/01/072008/01/12
Deciphered Date
D
Title
AMD CPU DDRII MEMORY I/F
Size Docume nt Numb erRev
Cus tom
LA-3 733P
Date :Sheeto f
536Monda y, M arch 05, 2007
E
0.1
5
+2.5VS
1
C18
22U_0 805_6.3 V6M
2
DD
CC
HTCP U_PW RGD10
HTCPU_ STOP#10
HTCPU_ RST#10
12
FCM2 012C-800_ 0805
L1
1
C19
2
4.7U_ 0805 _10V4Z
+1.8V
12
R17
300_0402_ 5%
+1.8V
12
R20
300_0402_ 5%
+1.8V
12
R22
300_0402_ 5%
1
C20
2
0.22 U_0603_ 16V7K
12
R190_0402_5%
12
R210_0402_5%
12
R230_0402_5%
4
W=50mils
1
C21
3300P_040 2_50V7K
2
CPU_ SIC15
CPU_ SID15
+1.8V
+1.2 V_HT
R10300_0402_ 5%
12
R11300_0402_ 5%
12
R120_0402_5%
12
R130_0402_5%
12
R1444.2_0603 _1%
12
R1544.2_0603 _1%
12
place t hem to CPU within 1"
CPU CLK10
CPUC LK#10
CPU_AL L_P WROK
CPU_L DTSTOP#
CPU_HT _RES ET#
3
ATHLON Control and Debug
LAYOUT: ROUTE VDDA TRACE APPROX.
50 mils WIDE (USE 2x25 mil TRACES TO
EXIT BALL FIELD) AND 500 mils LONG.
ROUTE AS 80 Ohm DIFFERENTIAL PAIR
PLACE IT CLOSE TO CPU WITHIN 1"
HDT Connector
BB
CPU_ DBRE Q#
CPU _DB RD Y
CPU_ TCK
CP U_TDI
CPU_TR ST#
CP U_TDO
NOTE: HDT TERMINATION IS REQUIRED
FOR REV. Ax SILICON ONLY.
AA
+1.8V
JP3
2
1
4
3
6
5
8
7
10
9
12
11
14
13
16
15
18
17
20
19
22
21
2423
26
SAMTEC _ASP-68200-0 7
@
R35
220_0402_ 5%@
3V_L DT_RST#CPU_HT_R ESET#
+3VALW+3VS
12
2
G
1 3
D
S
Q4
2N700 2_SOT23@
PRO CHOT#10
+1.8V+ 1.8V+3VALW+3VAL W
12
@
Q2
3 1
MMBT3904_SOT23
12
R360_0402_5%
CPU_P ROCHO T#_1. 8
12
2
10K_0402_ 5%
R31
300_0402_ 5%
H_THER MTRIP_ S#H_THER MTRIP#CPU_TMS
12
R390_0402_5%
R32
1K_0402_5 %
@
R37
+1.8V+3VS
12
CP U_PH_G
B
2
Q5
E
3 1
C
MMBT3904_SOT23
12
R34
10K_0402_ 5%
@
12
12
2
3 1
R38
4.7K_0402_ 5%
R33
1K_0402_5 %@
Q3
MMBT3904_SOT23
@
EC_THE RM# 15,27
MAI NPWO N 31,35
H_THER MTRIP# 10
Connect to MCP67
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
DECOUPLING BETWEEN PROCESSOR AND DIMMs
PLACE CLOSE TO PROCESSOR AS POSSIBLE
+1.8V
1
2
1
2
+0.9V
1
2
C30
10U_0 805_10V6M
1
2
22U_0 805_6.3 V
1
1
C36
2
2
0.22 U_0603_ 10V7K
1
1
C45
2
2
C54
4.7U_ 0805 _10V4Z
C61
0.22 U_040 2_10V4Z
C66
4.7U_ 0805 _10V4Z
0125 Cost down $0.155
1
+
C25
330U_ 4V_M
2
1
2
C31
10U_0 805_10V6M
1
C38
C37
2
22U_0 805_6.3 V
180P _0402_50V8J
1
C46
C47
2
0.01 U_0402_ 16V7K
1
C55
4.7U_ 0805 _10V4Z
2
1
C62
0.01 U_0402_ 16V7K
2
1
C67
4.7U_ 0805 _10V4Z
2
C32
10U_0 805_10V6M
1
2
22U_0 805_6.3 V
1
C39
2
1
C48
2
1
+
C26
330U_ 4V_M
2
1
2
C33
10U_0 805_10V6M
1
C40
2
22U_0 805_6.3 V
1
C49
180P _0402_50V8J
2
1
C56
4.7U_ 0805 _10V4Z
2
1
C63
0.01 U_0402_ 16V7K
2
1
C68
4.7U_ 0805 _10V4Z
2
C34
10U_0 805_10V6M
1
2
22U_0 805_6.3 V
1
C41
2
1
2
1
2
1
+
2
1
2
C35
10U_0 805_10V6M
1
2
22U_0 805_6.3 V
C57
4.7U_ 0805 _10V4Z
1
C64
180P_0402 _50V8J
2
C69
4.7U_ 0805 _10V4Z
C27
330U_ 4V_M
22U_0 805_6.3 V
C42
1
C43
2
+1.8V
10U_0 805_10V6M
1
2
1
C58
0.22 U_040 2_10V4Z
2
1
2
1
C70
0.22 U_040 2_10V4Z
2
1
C44
22U_0 805_6.3 V
2
C50
C65
180P_0402 _50V8J
+CPU_ CORE
1
+
2
1
C51
2
10U_0 805_10V6M
1
C59
0.22 U_040 2_10V4Z
2
1
C71
0.22 U_040 2_10V4Z
2
C28
820U_ E9_2 .5V_M_R7
45@
0.22 U_040 2_10V4Z
1
C52
2
1
C60
0.22 U_040 2_10V4Z
2
1
C72
0.22 U_040 2_10V4Z
2
1
C53
0.22 U_040 2_10V4Z
2
1
C73
0.22 U_040 2_10V4Z
2
1
C76
1000P_040 2_50V7K
2
Compal Secret Data
Deciphered Date
2
1
C77
1000P_040 2_50V7K
2
1
1
2
AA
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
RP1
18
27
36
45
47_0 804_8P4R_5%
RP2
18
27
36
45
47_0 804_8P4R_5%
RP3
45
36
27
18
47_0 804_8P4R_5%
RP4
45
36
27
18
47_0 804_8P4R_5%
RP5
45
36
27
18
47_0 804_8P4R_5%
RP6
18
27
36
45
47_0 804_8P4R_5%
RP7
18
27
36
45
47_0 804_8P4R_5%
RP8
45
36
27
18
47_0 804_8P4R_5%
2007/01/072008/01/12
Compal Secr et Data
Deciphered Date
220U_ D2_4V M_R15
1
C101
+
2
2
Layout Note:
Plac e one ca p close to every 2 pul lup
resi stors term inated to + 0.9V
0.1U_ 0402_1 6V4Z
0.1U_ 0402_1 6V4Z
1
2
C85
0.1U_ 0402_1 6V4Z
0.1U_ 0402_1 6V4Z
1
2
C94
2.2U_ 0805_ 16V4Z
C102
1
2
0.1U_ 0402_1 6V4Z
0.1U_ 0402_1 6V4Z
1
2
C86
Layout Note:
Plac e one ca p close to every 2 pul lup
resi stors term inated to + 0.9V
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
+0.9V
0.1U_ 0402_1 6V4Z
0.1U_ 0402_1 6V4Z
1
2
C114
+1.8V
0.1U_ 0402_ 16V4Z
0.1U_ 0402_ 16V4Z
1
2
C122
+0.9V
RP9
47_0 804_8P4R_5%
RP10
47_0 804_8P4R_5%
RP11
47_0 804_8P4R_5%
RP12
47_0 804_8P4R_5%
RP13
47_0 804_8P4R_5%
RP14
47_0 804_8P4R_5%
RP15
47_0 804_8P4R_5%
RP16
47_0 804_8P4R_5%
2007/01/072008/01/12
1
2
C115
1
2
C123
45
36
27
18
45
36
27
18
18
27
36
45
18
27
36
45
18
27
36
45
18
27
36
45
45
36
27
18
45
36
27
18
0.1U_ 0402_1 6V4Z
0.1U_ 0402_1 6V4Z
1
2
C116
0.1U_ 0402_ 16V4Z
0.1U_ 0402_ 16V4Z
1
2
C124
+0.9V
Compal Secr et Data
1
2
C117
1
2
C125
Deciphered Date
2
0.1U_ 0402_1 6V4Z
0.1U_ 0402_1 6V4Z
0.1U_ 0402_1 6V4Z
1
1
2
2
C119
C118
0.1U_ 0402_ 16V4Z
0.1U_ 0402_ 16V4Z
0.1U_ 0402_ 16V4Z
1
1
2
2
C127
C126
2
1
0.1U_ 0402_1 6V4Z
1
1
2
C120
1
2
C128
Layout Note:
Plac e one ca p close to every 2 pul lup
2
resi stors term inated to + 0.9V
C121
0.1U_ 0402_ 16V4Z
Layout Note:
1
Plac e one ca p close to every 2 pul lup
resi stors term inated to + 0.9V
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.