@ : Nopop Component
1@ : Populate for G72MV
2@ : Populate for G86MV
45144731L01 pop for G86MV
45144XXXXX pop for G72MV
44
MB PCB
Part NumberDescription
DAA00000K0L
PCB ZGX LA-3302P
REV0 M/B DIS
A
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Index and Config.
LA-3302P
366Monday, February 26, 2007
1
0.4
of
Page 4
5
4
3
2
1
RUN_ON
ADAPTER
DD
+PWR_SRC
FDS4435
(Q24)
ISL6236
(PU25)
M_ON
GFX_CORE_ON
+INV_PWR_SRC
+1.25V_M
+GPU_CORE
RUN_ON
MAX1510E
(PU26)
MAX1510E
(PU26)
+1.25V_RUN
+1.05V_M
BATTERY
RUN_ON
SI4810DY
(Q58)
+15V_ALW
+5V_RUNSI4810DY
(Q52)
M_ON
SI4800BDY
(Q67)
CHARGER
ISL6260
CC
SUS_ON
+5V_SUS
+3.3V_SUS
(PU11)(PU6)
RUNPWROK
+VCC_CORE
ISlL88550_AVDD
+1.8V_SUS+0.9V_DDR_VTT
ISL88550A
DDR_ON
ISL6236
(PU21)
1.05V_RUN_ON
1.5V_RUN_ON
ISL6236
(PU20)
+1.05V_VCCP+1.5V_RUN
ALWON
ALWON
+5V_ALW
+3.3V_ALW
ENAB_3VLAN
SI3456BDV
RUN_ON
(Q44)
RUN_ON
BB
MAX9789A
AUDIO_AVDD_ON
SI3456BDV
(Q54)
HDDC_EN#
SI3456SI3456BDV
(Q48)(Q56)(U37)
MODC_EN#
+3.3V_LAN
CTRL_18
+3.3V_RUN
CTRL_10
+3.3V_M
BCP69BCP69
+5V_HDD
+5V_MOD
(Q45)
+VDDA
(Q46)
+1.8VRUN
AA
+1.8V_LAN+1.0V_LAN
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Power Rail
LA-3302P
466Monday, February 26, 2007
1
0.4
of
Page 5
5
AJ26
ICH_SMBCLK
ICH_SMBDATA
ICH8-M
DD
AD19
2.2K
2.2K
4
+3.3V_SUS
WWAN
SMBUS Address [TBD]
3
3032
C8C7
Intel LAN
SMBUS Address [TBD]
3230
2N7002
2N7002
2N7002
2N7002
WLAN_SMBCLK
WLAN_SMBDATA
2.2K
2.2K
2
MEM_SCLK
MEM_SDATA
+3.3V_WLAN
WLAN
2.2K
2.2K
@ 0
+3.3V_RUN
197
195
DIMMA
197
195
DIMMB
CLK_SCLK@ 0
CLK_SDATA
1
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [TBD]
8.2K
8.2K
8
LCD_SMBCLK
7
CC
LCD_SMDATA
4.7K
4.7K
100
THRM_SMBCLK
99
THRM_SMBDAT
+3.3V_ALW
+3.3V_ALW
6
5
10
9
12
11
INVERTER
(JLVDS)
Charger
EMC4001
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [TBD]
2.2K
SBAT_SMBCLK
10
SBAT_SMBDAT
SIO
9
2.2K
2.2K
111
PBAT_SMBCLK
PBAT_SMBDAT
112
BB
2.2K
+3.3V_ALW
100 ohm
100 ohm
+3.3V_ALW
100 ohm
100 ohm
3
4
3
4
9
10
2'nd
BATTERY
BATTERY
CONN
CHARGER
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [TBD]
8.2K
+5V_ALW
6
5
DOCKING
SMBUS Address [TBD]
MEC 5025
6
5
8.2K
DOCK_SMB_CLK
DOCK_SMB_DAT
2.2K
2.2K
CKG_SMBDAT
12
CKG_SMBCLK
13
2N7002
2N7002
+3.3V_RUN
CLK_SDATA
CLK_SCLK
17
16
CLK GEN
SMBUS Address [TBD]
AA
Title
Size Document NumberRev
5
4
3
2
Date:Sheet
Compal Electronics, Inc.
SMBUS TOPOLOGY
LA-3302P
566Monday, February 26, 2007
1
0.4
of
Page 6
5
+3.3V_RUN
R435
@
12
0_0402_5%~D
CKG_SMBDAT39
DD
+3.3V_RUN
CKG_SMBCLK39
FSCFSBFSA CPU
CLKSEL2CLKSEL0CLKSEL1
13
13
12
R440
@
0_0402_5%~D
000
1
00
1
0
*
0
1
CC
1
1
11
0
11
00
1
0
1
0
1
R265
D
S
Q34
2N7002W-7-F_SOT323-3~D
G
2
2
G
Q35
2N7002W-7-F_SOT323-3~D
D
S
SRC
MHz
MHz
100
266
100
133
100
200
100
166
100
333
100
100
100
400
20010033.3
Table : ICS954305AK
CPU_BSELCPU_BSEL2(FSC) CPU_BSEL1(FSB)
133
166
+3.3V_RUN
R290
BB
10K_0402_5%~D
12
PCI_PCM
+3.3V_RUN
12
R304
10K_0402_5%~D
PCI_ICH
0
0
CLK_NV_27M52
84.5_0402_1%~D
Populate R697,R833 for G72MV
Populate R286 for G86MV.
R833,R286 place overlap
PGMODE
ITP_EN
+3.3V_RUN+3.3V_RUN
12
R318
10K_0402_5%~D
AA
PCI_LOM
12
R319
@
10K_0402_5%~D
12
R329
@
10K_0402_5%~D
FSA
12
R391
@
10K_0402_5%~D
*
TME
*
FCTSEL1 PIN43PIN44PIN47PIN48
0=UMA
*
0=UMA
1=DIS
12
12
R266
2.2K_0402_5%~D
2.2K_0402_5%~D
CLK_SDATA
CLK_SCLK
PCI
MHz
33.3
33.3
33.3
33.3
33.3
33.3
Place crystal within
33.3
500 mils of CK410
CLK_ICH_48M23
CLK_SMC_48M31
CPU_MCH_BSEL08,10
CPU_MCH_BSEL18,10
CPU_MCH_BSEL28,10
CLK_PCI_TPM28
0
1
R697
1@
0
1
0
1
Normal Operation
0
Trusted Mode Enabled
1
CLK_PCI_DOCK36
CLK_PCI_PCM30
CLK_PCI_502539
CLK_PCI_501838
CLK_ICH_14M23
CLK_SIO_14M38
CLK_NVSS_27M52
12
CLK_PCI_ICH21
CLK_PWRGD23
PIN 9
VTT_PWRGD#/PD
CKPWRGD/PD#
PIN 37
Pin 5/6 as SRC_10
Pin 5/6 as CPU_ITP
PIN 32
DOT96T DOT96C96/100M_T 96/100M_C
27M_out 27M SSout SRCT0SRCC0
1=Disc. GRFX down
5
+CK_VDD_48
1
C99
2
4.7U_0603_6.3V4Z~D
1
C708
2
3.3P_0402_50V8C~D
C483
27P_0402_50V8J~D
C484
33P_0402_50V8J~D
CLK_NVSS_27M
4
1
C471
2
0.1U_0402_16V4Z~D
1
C799
2
0.047U_0402_16V4Z~D
CLK_SMC_48MCLK_ICH_48M
1
2
X1
14.31818MHz_20P_1BX14318CC1A~D
12
12
12
CLK_ICH_48M
CLK_SMC_48M
CLK_PCI_TPM
CLK_PCI_DOCK
CLK_PCI_PCM
CLK_PCI_5025
CLK_PCI_5018
CLK_ICH_14M
CLK_SIO_14M
CLK_NV_27M
CLK_PCI_ICH
CLK_PWRGD
+3.3V_RUN
4
12
L28
BLM21PG600SN1D_0805~D
L87
0.047U_0402_16V4Z~D
0_0402_5%~D
12
R298
CLK_SCLK34
CLK_SDATA34
R271
12
12
12
12
12
12
+CK_VDD_MAIN2
12
BLM21PG600SN1D_0805~D
+CK_VDD_REF
1
C189
2
C774
3.3P_0402_50V8C~D
R27315_0402_5%~D
R27515_0402_5%~D
12
R3092.2K_0402_5%~D
12
R3148.2K_0402_5%~D
12
R27733_0402_5%~D
R59633_0402_5%~D
R28033_0402_5%~D
R28215_0402_5%~D
R33315_0402_5%~D
12
R28415_0402_5%~D
12
R28515_0402_5%~D
12
R28633_0402_5%~D 2@
12
R833147_0402_1%~D1@
12
R28733_0402_5%~D
12
R29133_0402_5%~D
R295
@
10K_0402_5%~D
12
@
12
10K_0402_5%~D
R760
12
12
R7582.2_0603_5%~D
+CK_VDD_MAIN+3.3V_RUN
1_0603_5%~D
CLK_XTAL_IN
CLK_XTAL_OUT
FSA
FSC
PCI_LOM
PCI_DOCK
PCI_PCM
PCI_SIO
CLKREF
DOT96
CLK_NVSS
PCI_ICH
PGMODE
CLK_SCLK
CLK_SDATA
3
+CK_VDD_MAIN
1
1
1
C474
C473
C472
2
10U_0805_10V4Z~D
1
C480
2
10U_0805_10V4Z~D
R759
12
2.2_0603_5%~D
U28
1
49
54
65
30
36
+CK_VDD_REF
+CK_VDD_48
12
18
40
20
19
41
45
23
34
33
32
27
22
43
44
37
39
9
16
17
4
15
21
31
35
42
68
73
74
75
76
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
For the purpose of testability, route these signals
through a ground referenced Z0 = 55ohm trace that
ends in a via that is near a GND via and is
accessible through an oscilloscope connection.
Resistor placed within 0.5" of
CPU pin.Trace should be at least
25 mils away from any other
toggling signal. COMP0, COMP2
trace should be 27.4 ohm.
COMP1, COMP3 should be 55
ohm.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Place these inside
socket cavity on L8
(North side
Secondary)
DD
Place these inside
socket cavity on L8
(Sorth side
Secondary)
Place these inside
socket cavity on L8
(North side
Primary)
Place these inside
socket cavity on L8
(Sorth side
Primary)
CC
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
C329
10U_0805_4VAM~D
C222
10U_0805_4VAM~D
C363
10U_0805_4VAM~D
C364
10U_0805_4VAM~D
1
C330
10U_0805_4VAM~D
2
1
C223
10U_0805_4VAM~D
2
1
C64
10U_0805_4VAM~D
2
1
C50
10U_0805_4VAM~D
2
1
C331
10U_0805_4VAM~D
2
1
C224
10U_0805_4VAM~D
2
1
C65
10U_0805_4VAM~D
2
1
C51
10U_0805_4VAM~D
2
1
C332
10U_0805_4VAM~D
2
1
C225
10U_0805_4VAM~D
2
1
C66
10U_0805_4VAM~D
2
1
C52
10U_0805_4VAM~D
2
4
1
2
1
2
1
2
1
2
C333
10U_0805_4VAM~D
C227
10U_0805_4VAM~D
C67
10U_0805_4VAM~D
C53
10U_0805_4VAM~D
1
C334
10U_0805_4VAM~D
2
1
C226
10U_0805_4VAM~D
2
1
C68
10U_0805_4VAM~D
2
1
C54
10U_0805_4VAM~D
2
1
C335
10U_0805_4VAM~D
2
1
C228
10U_0805_4VAM~D
2
10uF 0805 X6S -> 85 degree C
3
1
C336
10U_0805_4VAM~D
2
1
C229
10U_0805_4VAM~D
2
1
C55
10U_0805_4VAM~D
2
1
C69
10U_0805_4VAM~D
2
1
C190
10U_0805_4VAM~D
2
1
C185
10U_0805_4VAM~D
2
2
1
High Frequence Decoupling
Near VCORE regulator.
+VCC_CORE+VCC_CORE
South Side Secondary
C177
BB
220U_X_2VM_R7M~D
1
1
+
+
C179
C178
2
2
@
220U_X_2VM_R7M~D
220U_X_2VM_R7M~D
1
1
+
+
C338
C366
2
2
@
220U_X_2VM_R7M~D
220U_X_2VM_R7M~D
1
+
2
North Side Secondary
1
+
C365
2
220U_X_2VM_R7M~D
ESR <= 1.5m ohm
Capacitor > 1980uF
1
C870
0.1U_0402_10V7K~D
2
@
1
C871
0.1U_0402_10V7K~D
2
@
1
C872
0.1U_0402_10V7K~D
2
@
1
C873
0.1U_0402_10V7K~D
2
@
BITs WI97837
+1.05V_VCCP
1
C312
0.1U_0402_10V7K~D
2
AA
1
C256
0.1U_0402_10V7K~D
2
1
C293
0.1U_0402_10V7K~D
2
1
C250
0.1U_0402_10V7K~D
2
1
C310
0.1U_0402_10V7K~D
2
1
C264
0.1U_0402_10V7K~D
2
Place these inside
socket cavity on L8
(North side
Secondary)
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PEG_MTX_GRX_P[0..15] 52
PEG_MTX_GRX_N[0..15] 52
3
C5000.1U_0402_10V7K~D
12
C5010.1U_0402_10V7K~D
C5020.1U_0402_10V7K~D
12
C5040.1U_0402_10V7K~D
12
C5060.1U_0402_10V7K~D
12
C5080.1U_0402_10V7K~D
12
C5100.1U_0402_10V7K~D
12
C5120.1U_0402_10V7K~D
12
C5140.1U_0402_10V7K~D
12
C5160.1U_0402_10V7K~D
12
C5180.1U_0402_10V7K~D
12
C5200.1U_0402_10V7K~D
12
C5220.1U_0402_10V7K~D
12
C5240.1U_0402_10V7K~D
12
C5260.1U_0402_10V7K~D
12
C5280.1U_0402_10V7K~D
12
C5300.1U_0402_10V7K~D
12
12
C5030.1U_0402_10V7K~D
12
C5050.1U_0402_10V7K~D
12
C5070.1U_0402_10V7K~D
12
C5090.1U_0402_10V7K~D
12
C5110.1U_0402_10V7K~D
12
C5130.1U_0402_10V7K~D
12
C5150.1U_0402_10V7K~D
12
C5170.1U_0402_10V7K~D
12
C5190.1U_0402_10V7K~D
12
C5210.1U_0402_10V7K~D
12
C5230.1U_0402_10V7K~D
12
C5250.1U_0402_10V7K~D
12
C5270.1U_0402_10V7K~D
12
C5290.1U_0402_10V7K~D
12
C5310.1U_0402_10V7K~D
12
Strap Pin Table
PCI Express
Graphic Lane
FSB Dynamic
ODT
DMI Lane
Reversal
SDVO/PCIE
Concurrent
Operation
PEG_MTX_GRX_P0
PEG_MTX_GRX_N0
PEG_MTX_GRX_P1
PEG_MTX_GRX_N1
PEG_MTX_GRX_P2
PEG_MTX_GRX_N2PEG_MTX_GRX_C_N2
PEG_MTX_GRX_P3
PEG_MTX_GRX_N3
PEG_MTX_GRX_N4
PEG_MTX_GRX_P5
PEG_MTX_GRX_N5
PEG_MTX_GRX_P6
PEG_MTX_GRX_N6
PEG_MTX_GRX_P7
PEG_MTX_GRX_N7
PEG_MTX_GRX_P8
PEG_MTX_GRX_N8
PEG_MTX_GRX_P9
PEG_MTX_GRX_N9
PEG_MTX_GRX_P10
PEG_MTX_GRX_N10
PEG_MTX_GRX_P11
PEG_MTX_GRX_N11
PEG_MTX_GRX_P12
PEG_MTX_GRX_N12
PEG_MTX_GRX_P13
PEG_MTX_GRX_N13
PEG_MTX_GRX_P14
PEG_MTX_GRX_N14
PEG_MTX_GRX_P15
PEG_MTX_GRX_N15
Low = DMI x 2
High = DMI x 4 (Default)
Low = Reverse LaneCFG9
High = Normal O p e r a t i o n ( Default)
Low=Dynamic O D T Disable
High=Dynamic ODT Enable(default)
Low=Normal (default)
High=Lane Reversed
Low=Only SDVO or PCIEx1 is
operational (defaults)
High=SDVO and P C I E x 1 a r e o p e rating
simultaneously via PEG port
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Layout Note:
Place one cap close to every 2 pullup
resistors terminated to +0.9V_DDR_VTT
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C138
C137
14
23
14
23
14
23
14
23
14
23
R223
56_0402_5%~D
23
14
5
1
2
1
2
RN4
RN3
RN9
RN2
RN1
RN7
C132
0.1U_0402_16V4Z~D
C139
C437
1
2
0.1U_0402_16V4Z~D
C131
1
2
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
2
C140
+0.9V_DDR_VTT
12
C116
1
2
C118
0.1U_0402_16V4Z~D
1
2
C105
DDR_A_MA9
DDR_A_MA12
DDR_A_MA7
DDR_A_MA6
DDR_A_MA5
DDR_A_MA8
DDR_A_MA4
DDR_A_MA2
DDR_A_MA0
DDR_A_BS1
M_ODT0
DDR_A_MA13
DDR_A_MA14
DDR_A_MA11
0.1U_0402_16V4Z~D
Layout Note:
Place near JDIM1
0.1U_0402_16V4Z~D
1
1
2
2
C106
C107
4
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C109
C108
Layout Note:
Place these resistor
closely DIMM0,all
trace length<750 mil
Layout Note:
Place these resistor
closely DIMM0,all
trace length
Max=1.3"
4
3
+1.8V_SUS+1.8V_SUS
ON TOP SIDE
JDIM2
1
VREF
3
2.2U_0603_6.3V6K~D
C115
VSS
5
DQ0
7
DQ1
9
VSS
11
DQS0#
13
DQS0
15
VSS
17
DQ2
19
DQ3
21
VSS
23
DQ8
25
DQ9
27
VSS
29
DQS1#
31
DQS1
33
VSS
35
DQ10
37
DQ11
39
VSS
41
VSS
43
DQ16
45
DQ17
47
VSS
49
DQS2#
51
DQS2
53
VSS
55
DQ18
57
DQ19
59
VSS
61
DQ24
63
DQ25
65
VSS
67
DM3
69
NC
71
VSS
73
DQ26
75
DQ27
77
VSS
79
CKE0
81
VDD
83
NC
85
BA2
87
VDD
89
A12
91
A9
93
A8
95
VDD
97
A5
99
A3
101
A1
103
VDD
105
A10/AP
107
BA0
109
WE#
111
VDD
113
CAS#
115
NC/S1#
117
VDD
119
NC/ODT1
121
VSS
123
DQ32
125
DQ33
127
VSS
129
DQS4#
131
DQS4
133
VSS
135
DQ34
137
DQ35
139
VSS
141
DQ40
143
DQ41
145
VSS
147
DM5
149
VSS
151
DQ42
153
DQ43
155
VSS
157
DQ48
159
DQ49
161
VSS
163
NC,TEST
165
VSS
167
DQS6#
169
DQS6
171
VSS
173
DQ50
175
DQ51
177
VSS
179
DQ56
181
DQ57
183
VSS
185
DM7
187
VSS
189
DQ58
191
DQ59
193
VSS
195
SDA
197
SCL
199
VDDSPD
201
GND
TYCO_1470815-2~D
RESERVE
DDR_A_D0
DDR_A_D5
DDR_A_DQS#0
DDR_A_DQS0
DDR_A_D3
DDR_A_D7
DDR_A_D13
DDR_A_D12
DDR_A_DQS#1
DDR_A_DQS1
DDR_A_D10
DDR_A_D17
DDR_A_D21
DDR_A_DQS#2
DDR_A_DQS2
DDR_A_D22
DDR_A_D23
DDR_A_D29
DDR_A_DM3
DDR_A_D27
DDR_A_D30
DDR_CKE0_DIMMA10
DDR_A_BS211
DDR_A_BS011
DDR_A_WE#11
DDR_A_CAS#11
DDR_CS1_DIMMA#10
M_ODT110
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C110
C707
MEM_SDATA17,23
MEM_SCLK17,23
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Layout Note:
Place one cap close to every 2 pullup
resistors terminated to +0.9V_DDR_VTT
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C454
C453
+0.9V_DDR_VTT
RN23
RN24
RN17
RN18
RN25
12
RN26
5
2.2U_0603_6.3V6K~D
C438
1
2
0.1U_0402_16V4Z~D
C414
1
2
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
2
C450
Layout Note:
Place near JDIM2
C411
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C410
C409
4
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
1
2
2
2
C408
Layout Note:
Place these resistor
closely DIMM0,all
trace length<750 mil
Layout Note:
Place these resistor
closely DIMM0,all
trace length
Max=1.3"
C406
C407
4
3
ON BOTTOM SIDE
DDR_B_D0
DDR_B_DQS#0
DDR_B_DQS0
DDR_B_D6
DDR_B_D7
DDR_B_D8
DDR_B_D9
DDR_B_DQS#1
DDR_B_DQS1
DDR_B_D14
DDR_B_D15
DDR_B_D16
DDR_B_D21
DDR_B_DQS#2
DDR_B_DQS2
DDR_B_D19
DDR_B_D18
DDR_B_D24DDR_B_D28
DDR_B_D25
DDR_B_DM3
DDR_B_D26
DDR_B_D27
DDR_CKE2_DIMMB10
DDR_B_BS211
DDR_B_BS011
DDR_B_WE#11
DDR_B_CAS#11
DDR_CS3_DIMMB#10
1
2
C405
M_ODT310
MEM_SDATA16,23
MEM_SCLK16,23
DDR_CKE2_DIMMB
DDR_B_BS2
DDR_B_MA12
DDR_B_MA9
DDR_B_MA8
DDR_B_MA5
DDR_B_MA3
DDR_B_MA1
DDR_B_MA10
DDR_B_BS0
DDR_B_WE#
DDR_B_CAS#
DDR_CS3_DIMMB#
M_ODT3
DDR_B_D36
DDR_B_DQS#4
DDR_B_DQS4
DDR_B_D34
DDR_B_D40
DDR_B_D41
DDR_B_DM5
DDR_B_D42
DDR_B_D53
DDR_B_D49DDR_B_D48
DDR_B_DQS#6
DDR_B_DQS6
DDR_B_D55
DDR_B_D50
DDR_B_D56
DDR_B_D60
DDR_B_DM7
DDR_B_D58
DDR_B_D59
MEM_SDATA
MEM_SCLK
+3.3V_RUN
0.1U_0402_16V4Z~D
2.2U_0603_6.3V6K~D
C431
1
1
2
2
C429
JDIM1
1
VREF
3
VSS
5
DQ0
7
DQ1
9
VSS
11
DQS0#
13
DQS0
15
VSS
17
DQ2
19
DQ3
21
VSS
23
DQ8
25
DQ9
27
VSS
29
DQS1#
31
DQS1
33
VSS
35
DQ10
37
DQ11
39
VSS
41
VSS
43
DQ16
45
DQ17
47
VSS
49
DQS2#
51
DQS2
53
VSS
55
DQ18
57
DQ19
59
VSS
61
DQ24
63
DQ25
65
VSS
67
DM3
69
NC
71
VSS
73
DQ26
75
DQ27
77
VSS
79
CKE0
81
VDD
83
NC
85
BA2
87
VDD
89
A12
91
A9
93
A8
95
VDD
97
A5
99
A3
101
A1
103
VDD
105
A10/AP
107
BA0
109
WE#
111
VDD
113
CAS#
115
NC/S1#
117
VDD
119
NC/ODT1
121
VSS
123
DQ32
125
DQ33
127
VSS
129
DQS4#
131
DQS4
133
VSS
135
DQ34
137
DQ35
139
VSS
141
DQ40
143
DQ41
145
VSS
147
DM5
149
VSS
151
DQ42
153
DQ43
155
VSS
157
DQ48
159
DQ49
161
VSS
163
NC,TEST
165
VSS
167
DQS6#
169
DQS6
171
VSS
173
DQ50
175
DQ51
177
VSS
179
DQ56
181
DQ57
183
VSS
185
DM7
187
VSS
189
DQ58
191
DQ59
193
VSS
195
SDA
197
SCL
199
VDDSPD
201
GND
TYCO_1565917-4~D
DIMMB
STANDARD
DQ4
DQ5
DM0
DQ6
DQ7
DQ12
DQ13
DM1
CK0#
DQ14
DQ15
DQ20
DQ21
DM2
DQ22
DQ23
DQ28
DQ29
DQS3#
DQS3
DQ30
DQ31
NC/CKE1
VDD
NC/A15
NC/A14
VDD
VDD
VDD
RAS#
VDD
ODT0
NC/A13
VDD
DQ36
DQ37
DM4
DQ38
DQ39
DQ44
DQ45
DQS5#
DQS5
DQ46
DQ47
DQ52
DQ53
CK1#
DM6
DQ54
DQ55
DQ60
DQ61
DQS7#
DQS7
DQ62
DQ63
SAO
GND
VSS
VSS
VSS
VSS
VSS
VSS
CK0
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
BA1
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
CK1
VSS
VSS
VSS
VSS
VSS
VSS
SA1
NC
A11
A7
A6
A4
A2
A0
S0#
NC
2
+1.8V_SUS+1.8V_SUSV_DDR_MCH_REF
2
DDR_B_D5
4
DDR_B_D4DDR_B_D1
6
8
DDR_B_DM0
10
12
DDR_B_D2
14
DDR_B_D3
16
18
DDR_B_D13
20
DDR_B_D12
22
24
DDR_B_DM1
26
28
M_CLK_DDR2
30
M_CLK_DDR#2
32
34
DDR_B_D10
36
DDR_B_D11
38
40
42
DDR_B_D20
44
DDR_B_D17
46
48
PM_EXTTS#1
50
DDR_B_DM2
52
54
DDR_B_D22
56
DDR_B_D23
58
60
62
DDR_B_D29
64
66
DDR_B_DQS#3
68
DDR_B_DQS3
70
72
DDR_B_D30
74
DDR_B_D31
76
78
DDR_CKE3_DIMMB
80
82
84
DDR_B_MA14
86
88
DDR_B_MA11
90
DDR_B_MA7
92
DDR_B_MA6
94
96
DDR_B_MA4
98
DDR_B_MA2
100
DDR_B_MA0
102
104
DDR_B_BS1
106
DDR_B_RAS#
108
DDR_CS2_DIMMB#
110
112
M_ODT2
114
DDR_B_MA13
116
118
120
122
DDR_B_D33DDR_B_D32
124
DDR_B_D37
126
128
DDR_B_DM4
130
132
DDR_B_D38
134
DDR_B_D39DDR_B_D35
136
138
DDR_B_D44
140
DDR_B_D45
142
144
DDR_B_DQS#5
146
DDR_B_DQS5
148
150
DDR_B_D43DDR_B_D46
152
DDR_B_D47
154
156
DDR_B_D52
158
160
162
M_CLK_DDR3
164
M_CLK_DDR#3
166
168
DDR_B_DM6
170
172
DDR_B_D54
174
DDR_B_D51
176
178
DDR_B_D57
180
DDR_B_D61
182
184
DDR_B_DQS#7
186
DDR_B_DQS7
188
190
DDR_B_D62
192
DDR_B_D63
194
196
198
200
202
10K_0402_5%~D
12
M_CLK_DDR2 10
M_CLK_DDR#2 10
PM_EXTTS#1 10
DDR_CKE3_DIMMB 10
DDR_B_BS1 11
DDR_B_RAS# 11
DDR_CS2_DIMMB# 10
M_ODT210
M_CLK_DDR3 10
M_CLK_DDR#3 10
R243
10K_0402_5%~D
R241
V_DDR_MCH_REF
2.2U_0603_6.3V6K~D
1
C447
2
+3.3V_RUN
12
1
0.1U_0402_16V4Z~D
1
C436
2
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
DDRII-SODIMM SLOT2
LA-3302P
1766Thursday, March 01, 2007
1
0.4
of
Page 18
5
+3.3V_SUS
12
R423
8.2K_0402_5%~D
2
Q38
2
Q39
B
+3.3V_SUS
B
C
E
31
12
C
E
31
THERMATRIP1#
1
C628
0.1U_0402_16V4Z~D
2
R426
8.2K_0402_5%~D
THERMATRIP2#
1
C632
0.1U_0402_16V4Z~D
2
+1.05V_VCCP
R425
DD
H_THERMTRIP#7
THERMTRIP_MCH#10
2.2K_0402_5%~D
12
MMST3904-7-F_SOT323-3~D
+1.05V_VCCP
R427
2.2K_0402_5%~D
12
MMST3904-7-F_SOT323-3~D
Place under CPU
CC
C633
@
2200P_0402_50V7K~D
Place C633 close to the Q40 as possible
Place C636 close to the Guardian pins as possible
H_THERMDA7
470P_0402_50V7K~D
H_THERMDC7
+3.3V_SUS
0.1U_0402_16V4Z~D
12
R186
8.2K_0402_5%~D
+3.3V_SUS
BB
+3.3V_SUS
R196
@
12
10K_0402_5%~D
@
12
10K_0402_5%~D
AA
R194
MDC_RST_DIS#
SIO_GFX_PWR
+3.3V_RUN
THERMTRIP_VGA#52
5
R428
12
49.9_0603_1%~D
1
C639
2
C100
2200P_0402_50V7K~D
12
2
1
C636
1
C637
0.1U_0402_16V4Z~D
2
2
1
R187
2.2K_0402_5%~D
2@
THERM_B3
C
+3.3V_SUS
2
B
4
RB751S40T1_SOD523-2~D
E
31
+RTC_CELL
E
@
2
B
Q40
MMST3904-7-F_SOT323-3~D
1
2
12
R436
332K_0402_1%~D
12
R438
118K_0402_1%~D
12
R433
8.2K_0402_5%~D
THERMATRIP3#
C
Q76
MMST3904-7-F_SOT323-3~D
2@
31
4
D19
21
+3VSUS_THRM
1
C638
2
0.1U_0402_16V4Z~D
1
C630
2
22U_0805_6.3VAM~D
2200P_0402_50V7K~D
2
C634
1
SUSPWROK42
ICH_PWRGD#42
R437
12
1K_0402_5%~D
MDC_RST_DIS#33
AUDIO_AVDD_ON27
1
C203
0.1U_0402_16V4Z~D
2
2@
3
FAN1 Control and Tachometer
+3.3V_RUN
12
R424
10K_0402_5%~D
12
R414
0_0402_5%~D
+FAN1_VOUT
FAN1_TACH_FB
Place C634 close to the
Guardian pins as possible
THRM_SMBDAT39,49
THRM_SMBCLK39,49
REM_DIODE1_P
REM_DIODE1_N
12
R4291K_0402_5%~D
12
R4321K_0402_5%~D
THERMATRIP1#
THERMATRIP2#
THERMATRIP3#
MDC_RST_DIS#
SIO_GFX_PWR
5V_CAL_SIO#
AUDIO_AVDD_ON
FAN1_TACH 39
JFAN1
1
1
2
2
3
3
MOLEX_53398-0371~D
Discrete
VGA_THERMDP
1
C706
470P_0402_50V7K~D
3
2
U31
11
SMDATA
12
SMBCLK
38
DP1
37
DN1
41
DP2
40
DN2
35
3V_SUS
21
RTC_PWR3V
23
VSUS_PWRGD
16
3V_PWROK#
17
THERMTRIP1#
18
THERMTRIP2#
19
THERMTRIP3#
42
VSET
26
XEN
34
VSS
7
FAN_OUT
8
FAN_OUT
39
FAN_DAC1
10
GPIO1
13
GPIO2
14
GPIO3
15
GPIO4
22
GPIO5
36
GPIO6/FAN_DAC2
49
PAD_GND
VGA_THERMDN
Place Capacitor close to Guardian Chip
+FAN1_VOUT
SMBUS ADDRESS : 2F
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
VGA_THERMDP 53
VGA_THERMDN 53
VCP1
VCP2
ATF_INT#
POWER_SW#
ACAVAIL_CLR
THERMTRIP_SIO
SYS_SHDN#
LDO_SHDN#/ADDR
LDO_POK
LDO_SET
LDO_OUT
LDO_OUT
LDO_IN
LDO_IN
VDD_3V
VDD_5V
VDD_5V
EMC4001_QFN48~D
1
C645
2
10U_0805_10V4Z~D
DP3
DN3
DP4
DN4
DP5
DN5
43
46
45
44
48
47
2
1
20
3
4
25
24
27
33
28
32
31
30
29
9
5
6
1
C646
2
VCP2
VCP2
REM_DIODE3_P
REM_DIODE3_N
REM_DIODE4_P
REM_DIODE4_N
VGA_THERMDP
VGA_THERMDN
7.5K_0402_5%~D
LDO_SET
+3V_LDOIN
+5V_RUN
0.1U_0402_16V4Z~D
2
+5V_SUS
12
R771
2.21K_0603_1%~D
1
C750
2
2200P_0402_50V7K~D
PWR_MON 48
Place C649 close to the
Guardian pins as possible.
1
2
Diode circuit at DP 4/ DN 4 is used for skin temp
sensor (plac e d o p ti m a l l y between CPU, MCH and GPU).
1
2
ATF_INT#
ATF_INT# 38
POWER_SW# 39,40
ACAV_IN 39,49,50
R434
12
+3.3V_SUS
1
1
C640
2
2
1@
10U_0805_10V4Z~D
1
1
C643
2
2
1U_0603_10V4Z~D
1
1
C647
2
2
10U_0805_10V4Z~D
2
VSET=
R436+R438
VSET =
12
R772
10K_0603_1%_TSM1A103F34D3RZ~D
Q102
13
D
2N7002W-7-F_SOT323-3~D
2
G
S
C649
2200P_0402_50V7K~D
Q41 Place near the
bottom SODIMM
C418
2200P_0402_50V7K~D
C648
0.1U_0402_16V4Z~D
R96
10K_0402_5%~D
+2.5V_RUN
C641
0.1U_0402_16V4Z~D
@
R439
12
0_1210_5%~D
C644
0.1U_0402_16V4Z~D
+3.3V_RUN
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
1
R438
Tp-70
x 3.3V
=0.865V
=> Tp = 88.2 C
21
+3.3V_SUS
12
R773
10K_0402_5%~D
5V_CAL_SIO#
This thermistor circuit is located near
Top side DDR connector.
Populate R155 and de-pop R156
for discrete because it
doesn't support DPST
+15V_ALW
2
G
2
I
2
+15V_ALW
12
R23
100K_0402_5%~D
1
O
G
DDTC124EUA-7-F_SOT323-3~D
3
12
13
D
2
G
S
Q7
+LCDVDD
R24
100K_0402_5%~D
Q8
2N7002W-7-F_SOT323-3~D
SI3456BDV-T1-E3_TSOP6~D
45
1
C30
2
0.1U_0603_50V4Z~D
Q11
D
S
G
3
12
R25
@
100K_0402_5%~D
1
6
2
1
+3.3V_RUN
1
C42
2
0.1U_0402_16V4Z~D
+3.3V_RUN
2
BB
AA
1
2
+INV_PWR_SRC
C180
0.1U_0603_50V4Z~D
LCD_SMBCLK
LCD_SMBDAT
G
13
D
S
Q12
@
2N7002W-7-F_SOT323-3~D
+3.3V_RUN
2
G
13
D
S
Q13
@
2N7002W-7-F_SOT323-3~D
I2CH_SCL
I2CH_SDA
I2CH_SCL 52
I2CH_SDA 52
1
C427
2
1
2
0.1U_0603_50V4Z~D
40mil
1
C463
2
2200P_0402_50V7K~D
+PWR_SRC
12
C173
1000P_0402_50V7K~D
R154
200K_0402_5%~D
Q24
FDS4435BZ_SO8~D
1
2
3
R153
12
100K_0402_5%~D
RUN_ON37,39,41,42,51
4
D
13
2
8
7
6
5
S
G
40mil
Q25
2N7002W-7-F_SOT323-3~D
+INV_PWR_SRC
1
C174
0.1U_0603_50V4Z~D
2
FDS4435: P CHANNAL
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Internal LVDS
LA-3302P
1966Thursday, March 01, 2007
1
0.4
of
Page 20
5
DD
4
3
2
1
D8
SDM10U45-7_SOD523-2~D
F3
@
+5V_RUN
21
12
0.12A_48V_NANOSMDC012F~D
12
R792
0_1206_5%~D
RED
DAT_DDC2
GREEN
JVGA_HS
BLUE
JVGA_VS
M_ID2#
CLK_DDC2
CRT_VCC
1
C151
2
0.01U_0402_16V7K~D
JCRT
6
11
1
7
12
2
8
13
14
10
15
SUYIN_070915FR015S201CU~D
16
17
3
9
4
5
D11
DA204U_SOT323~D
1
@
+3.3V_RUN
2
3
L11
CRT_RED36,52
CRT_GRN36,52
CC
CRT_BLU36,52
CRT_RED
CRT_GRN
CRT_BLU
R141
22P_0402_50V8J~D
1
C161
2
@
22P_0402_50V8J~D
1
C165
2
@
12
12
R142
150_0402_1%~D
150_0402_1%~D
12
R143
150_0402_1%~D
1
C162
2
@
Evaluate Package
DAT_DDC236,52
CLK_DDC236,52
SDM10U45-7_SOD523-2~D
+5V_RUN
BB
CRT_HSYNC52
CRT_VSYNC52
21
R60
12
30_0402_1%~D
R59
12
30_0402_1%~D
+5V_RUN_SYNC
D6
5
A2Y
3
SN74AHCT1G125GW_SC70-5~D
5
A2Y
3
R144
1K_0402_5%~D
12
1
U15
P
4
4
12
R146
10_0402_5%~D
12
R138
10_0402_5%~D
OE#
G
1
P
OE#
G
U14
SN74AHCT1G125GW_SC70-5~D
BLM18BB750SN1D_0603~D
12
BLM18BB750SN1D_0603~D
12
BLM18BB750SN1D_0603~D
12
22P_0402_50V8J~D
L1
BLM18AG121SN1D_0603~D
12
HSYNC_R36
VSYNC_R 36
L2
BLM18AG121SN1D_0603~D
12
L10
L9
+5V_RUN_SYNC
12
R3
@
1K_0402_5%~D
1
C5
2
10P_0402_50V8J~D
1
C149
10P_0402_50V8J~D
2
@
12
@
R5
1K_0402_5%~D
1
C4
2
10P_0402_50V8J~D
R137
12
1
C719
2
@
10P_0402_50V8J~D
R2
2.2K_0402_5%~D
12
2.2K_0402_5%~D
1
C712
2
@
10P_0402_50V8J~D
0.1U_0402_16V4Z~D
2
1
C148
10P_0402_50V8J~D
2
@
T5 PAD~D
D10
DA204U_SOT323~D
1
@
3
1
C160
2
1
2
D9
DA204U_SOT323~D
1
@
2
3
C147
10P_0402_50V8J~D
@
AA
DA204U
K1
A2
DELL CONFIDENTIAL/PROPRIETARY
A1K2
5
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
CRT
LA-3302P
2066Thursday, March 01, 2007
1
0.4
of
Page 21
5
+3.3V_RUN
DD
CC
BB
12
R4428.2K_0402_5%~D
12
R4438.2K_0402_5%~D
12
R4448.2K_0402_5%~D
12
R4458.2K_0402_5%~D
12
R4468.2K_0402_5%~D
12
R4478.2K_0402_5%~D
12
R4488.2K_0402_5%~D
12
R4498.2K_0402_5%~D
+3.3V_RUN
12
R4508.2K_0402_5%~D
12
R4518.2K_0402_5%~D
12
R4528.2K_0402_5%~D
12
R4538.2K_0402_5%~D
12
R4548.2K_0402_5%~D
12
R4588.2K_0402_5%~D
12
R4598.2K_0402_5%~D
12
R46120K_0402_5%~D
12
R46020K_0402_5%~D
12
R60120K_0402_5%~D
12
R63120K_0402_5%~D
BIOS should not enable the internal
GPIO pull up resistor
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
ICH8(1/4)
LA-3302P
2166Thursday, March 01, 2007
1
0.4
of
Page 22
5
DD
+3.3V_RUN
32.768K_12.5P_1TJS125DJ4A420P~D
12
R4908.2K_0402_5%~D
CC
ICH_AZ_CODEC_SDOUT26
ICH_AZ_CO D EC_SYNC26
ICH_AZ_CODEC_RST#26
ICH_AZ_CODEC_BITCLK26
BB
IDE_IRQ
12
12
12
R496
12
33_0402_5%~D
+RTC_CELL
ICH_AZ_SDOUT
ICH_AZ_SYNC
ICH_AZ_RST#
ICH_AZ_BITCLK
Close to U19
R49333_0402_5%~D
R49433_0402_5%~D
R49533_0402_5%~D
1
C660
27P_0402_50V8J~D
2
12
R47020K_0402_5%~D
12
R4711M_0402_5%~D
1
1
CMOS_CLR @SHORT PADS~D
12
C655
1U_0603_10V4Z~D
ICH_AZ_MDC_BITCLK33
ICH_AZ_MDC_SYNC33
ICH_AZ_MDC_RST#33
ICH_AZ_CODEC_SDIN026
ICH_AZ_MDC_SDIN133
ICH_AZ_MDC_SDOUT33
PSATA_IRX_DTX_N0_C25
PSATA_IRX_DTX_P0_C25
PSATA_ITX_DRX_N025
PSATA_ITX_DRX_P025
XOR Chain Entrance Strap
AA
00
0
1
11
5
DescriptionICH RSVD HDA SDOUT
RSVD
1
Enter XOR Chain
0
Normal Operation (Default)
Set PCIE port config bit 1
Package
9.6X4.06 mm
15P_0402_50V8J~D
15P_0402_50V8J~D
2
2
SATA_ACT#_R43
CLK_PCIE_SATA#6
CLK_PCIE_SATA6
4
C653
12
Y4
C654
12
C656
27P_0402_50V8J~D
12
C658 3900P_0402_50V7K~D
12
C659 3900P_0402_50V7K~D
+3.3V_RUN
12
R385
1K_0402_5%~D
@
12
R386
1K_0402_5%~D
@
4
ICH_RTCX1
14
23
R469
12
0_0402_5%~D
+1.5V_RUN_PCIE_ICH
12
R481 33_0402_5%~D
12
12
R48333_0402_5%~D
12
R48433_0402_5%~D
12
R48733_0402_5%~D
12
R49124.9_0402_1%~D
Within 500 mils
ICH_AZ_SDOUT
12
R467
10M_0402_5%~D
ICH_RTCX2
ICH_RTCRST#
INTRUDER#
ICH_INTVRMEN
LAN100_SLP
24.9_0402_1%~D
12
ICH_AZ_BITCLK
ICH_AZ_SYNC
ICH_AZ_RST#
ICH_AZ_CODEC_SDIN0
ICH_AZ_MDC_SDIN1
ICH_AZ_SDOUT
SATA_ACT#_R
PSATA_IRX_DTX_N0_C
PSATA_IRX_DTX_P0_C
SATA_TX0-_N0
SATA_TX0+_P0
CLK_PCIE_SATA#
CLK_PCIE_SATA
ICH_RSVD 23
R480
3
+RTC_CELL+RTC_CELL
12
R472
332K_0402_1%~D
ICH_INTVRMEN
12
@
R478
0_0402_1%
ICH8M Internal VR Enable Strap
(Internal VR f or Vc cS us 1.05, VccSus1.5, VccCL1.5)
ICH_INTVRMEN
U32A
AG25
RTCX1
AF24
RTCX2
AF23
RTCRST#
AD22
INTRUDER#
AF25
INTVRMEN
AD21
LAN100_SLP
B24
GLAN_CLK
D22
LAN_RSTSYNC
C21
LAN_RXD0
B21
LAN_RXD1
C22
LAN_RXD2
D21
LAN_TXD_0
E20
LAN_TXD_1
C20
LAN_TXD_2
AH21
GLAN_DOCK#/GPIO13
D25
GLAN_COMPI
C25
GLAN_COMPO
AJ16
HDA_BIT_CLK
AJ15
HDA_SYNC
AE14
HDA_RST#
AJ17
HDA_SDIN0
AH17
HDA_SDIN1
AH15
HDA_SDIN2
AD13
HDA_SDIN3
AE13
HDA_SDOUT
AE10
HDA_DOCK_EN#/GPIO33
AG14
HDA_DOCK_RST#/GPIO34
AF10
SATALED#
AF6
SATA0RXN
AF5
SATA0RXP
AH5
SATA0TXN
AH6
SATA0TXP
AG3
SATA1RXN
AG4
SATA1RXP
AJ4
SATA1TXN
AJ3
SATA1TXP
AF2
SATA2RXN
AF1
SATA2RXP
AE4
SATA2TXN
AE3
SATA2TXP
AB7
SATA_CLKN
AC6
SATA_CLKP
AG1
SATARBIAS#
AG2
SATARBIAS
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
Low = Internal VR Disabled
High = Internal VR Enabled(Default)
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
DVD MODULE
LA-3302P
2566Thursday, March 01, 2007
1
0.4
of
Page 26
5
4
3
2
1
45
+VDDA
2
1
C710
DD
5
SPKR23
BEEP39
1
B
2
A
3
U34 place as close to CODEC as possible
CC
ICH_AZ_CODEC_BITCLK
12
R545
10_0402_5%~D
Close to Pin 6
1
C721
10P_0402_50V8J~D
BB
AA
2
ICH_AZ_CODEC_SDOUT
12
R479
47_0402_5%~D
@
Close to Pin 5
1
C782
0.1U_0402_16V4Z~D
2
@
0.1U_0402_16V4Z~D
2
U34
P
4
Y
G
74AHCT1G86GW_SOT353-5~D
20K_0402_5%~D
12
R540
10K_0402_5%~D
1
C714
2
0.1U_0402_16V4Z~D
ICH_AZ_CODEC_SDIN022
12
R541
C759
1000P_0402_50V7K~D
C711
0.1U_0402_10V6K~D
12
TRACE>15 mil
R821
100K_0402_5%~D
12
1
2
ICH_AZ_CODEC_BITCLK22
12
R544 33_0402_5%~D
ICH_AZ_CODEC_SDOUT22
ICH_AZ_CO D EC_SYNC22
ICH_AZ_CODEC_RST#22
AUD_EAPD27
AUD_SPDIF_OUT36
10K_0402_5%~D
AUD_PC_BEEPBEEP1BEEP2
C715
1U_0603_10V4Z~D
R823
W=30 mil
1
1
C716
C172
2
2
@
10U_0805_10V4Z~D
0.1U_0402_16V4Z~D
ICH_AZ_CODEC_BITCLK
ICH_AC_SDIN0_R
ICH_AZ_CODEC_SDOUT
AUD_EAPD
AUD_SPDIF_OUT
12
single gate TTL
AUD_SENSE_A
12
+3.3V_RUN+3.3V_RUN
+VDDA
1
2
U35
1
DVDD_CORE
9
DVDD_CORE
40
DVDD_CORE/VPP
3
DVDD_IO
6
HDA_BIT_CLK
8
HDA_SDI_CODEC
5
HDA_SDO
10
HDA_SYNC
11
HDA_RST#
STAC9205
43
NC1
44
NC2
45
NC3
46
DMIC_CLK
2
VOL_UP/DMIC0/GPIO1
4
VOL_DN/DMIC1/GPIO2
47
SPDIF_ IN//GPIO0/EAPD
48
SPDIF _OUT
7
DVSS
26
AVSS1
42
AVSS2
49
Thermal PAD GND
QFN 7x7 & LQFP 9x9 colay footprint.
STAC9205X5NBEB1XR_QFN48_COMON~D
AVDD1
AVDD2
SENSE_A
SENSE_B
PORT_A_L
PORT_A_R
VREFOUT_A
PORT_B_L
PORT_B_R
VREFOUT_B
PORT_C_L
PORT_C_R
VREFOUT_C
PORT_D_L
PORT_D_R
PORT_E_L
PORT_E_R
VREFOUT_E/GPIO4
PORT_F_L
PORT_F_R
VREFOUT_F/GPIO3
CD_L
CD_GND
CD_R
PC_BEEP
MONO_OUT
CAP2
VREFFILT
25
38
13
34
39
41
37
21
22
28
23
24
29
35
36
14
15
31
16
17
30
18
19
20
12
32
33
27
1
2
AUD_SENSE_A
AUD_SENSE_B
AUD_LINE_OUT_L
AUD_LINE_OUT_R
DOCK_HP_MUTE#
AUD_PC_BEEP
1
C724
2
C726
10U_0805_10V4Z~D
1U_0603_10V4Z~D
1
2
1
1
C718
C717
2
2
@
10U_0805_10V4Z~D
0.1U_0402_16V4Z~D
AUD_HP_OUT_L 27
AUD_HP_OUT_R 27
AUD_EXT_MIC_L 27
AUD_EXT_MIC_R 27
VREFOUT
AUD_INT_MIC_IN 27
AUD_LINE_OUT_L 27
AUD_LINE_OUT_R 27
DOCK_HP_MUTE# 38
AUD_SPDIF_SHDN 38
C725
10U_0805_10V4Z~D
AUD_HP_NB_ SENSE
2N7002W-7-F_SOT323~D
Q74
R710
39.2K_0402_1%~D
13
D
2
G
S
AUD_SENSE_B
DOCK_HP_MUTE#
AUD_SPDIF_SHDN
5.11K_0402_1%~D
20K_0402_1%~D
12
R711
13
D
2
G
Q75
S
2N7002W-7-F_SOT323~D
10K_0402_5%~D
R54610K_0402_5%~D
R54710K_0402_5%~D
31
+VDDA
R542
12
1
C713
2
1000P_0402_50V7K~D
AUD_MIC_SWITCH 27AUD_HP_NB_SENSE27,38
R543
+VDDA
12
12
12
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Azalia (HD) Codec
LA-3302P
2666Thursday, March 01, 2007
1
0.4
of
Page 27
5
+VDDA
+VDDA
DD
CC
LM358DR2G_SOIC8~D
AUD_MIC_BIAS
Speaker Connector
INT_SPK_R1
INT_SPK_R2
U36A
1
O
15 mils trace
1
C740
2
@
100P_0402_50V8J~D
+5V_SPK+AMP
R571
Q43
+5V_SPK+AMP
12
13
2
G
13
2
G
5
12
D
S
D
S
BB
AA
For TPA6040A,pop
R714,depop R713
AUDIO_AVDD_ONAUD_AMP_MUTE#
12
R714
@
0_0402_5%~D
100K_0402_5%~D
AUD_SPK_ENABLE#
AUD_EAPD26
2N7002W-7-F_SOT323-3~D
NB_MUTE#38
12
R556
100K_0402_5%~D
3
2
1
2
100P_0402_50V8J~D
12
R712
100K_0402_5%~D
12
R559
100K_0402_5%~D
8
P
IN+
IN-
G
4
C741
@
R713
100K_0402_5%~D
Q42
2N7002W-7-F_SOT323-3~D
1
C732
2.2U_0805_10V6K~D
2
JSPK
1
1
2
2
MOLEX_53398-0271~D
AUD_LINE_OUT_L26
AUD_LINE_OUT_R26
AUD_HP_OUT_L26
AUD_HP_OUT_R26
AUD_HP_NB_ SENSE
NB_MUTE#
C770.033U_1206_50V7K~D
C748 0.033U_1206_50V7K~D
C749 1U_1206_25V7K~D
12
C751 1U_1206_25V7K~D
12
+5V_SPK+AMP
5
2
P
A
1
B
G
3
AUD_EAPD
10P_0402_50V8J~D
4
C729
2.2U_0805_10V6K~D
AUD_INT_MIC+32
AUD_INT_MIC-32
C737
2.2U_0805_10V6K~D
12
12
1
C906
C905
2
@
@
U40
4
Y
74AHCT1G08GW_SOT353-5~D
@
10_0402_5%~D
C232
@
R790
47P_0402_50V8J~D
47P_0402_50V8J~D
12
1
2
4
+VDDA
12
12
12
12
12
12
1
1
C907
2
2
@
47P_0402_50V8J~D
+5V_SPK+AMP
R553
1K_0402_5%~D
R558
1K_0402_5%~D
C731
0.1U_0402_10V6K~D
12
12
C736
0.1U_0402_10V6K~D
R566
1K_0402_5%~D
R568
1K_0402_5%~D
1
C96
2
@
47P_0402_50V8J~D
1
C753
2
10U_0805_10V4Z~D
3
R554
0_0402_5%~D
R560
10K_0402_5%~D
12
12
R563
10K_0402_5%~D
5
6
100K_0402_5%~D
Place Close to Audio ChipPlace C lose to Audio Chip
1
C742
C743
2
1U_0603_10V4Z~D
SPKR_INL_CINT_SPK_R1
SPKR_INR_C
HP_INL_C
HP_INR_C
12
C7521U_0603_10V4Z~D
AUD_SPK_ENABLE#
AUD_AMP_MUTE#
C754
1
1U_0603_10V4Z~D
2
12
1
R822
C755
2
1M_0402_1%~D
AUD_MIC_BIAS
12
+VDDA
U36B
8
LM358DR2G_SOIC8~D
P
IN+
7
12
O
IN-
G
4
12
R565
1
C783
2
1U_0603_10V4Z~D
C1P
C1N
1U_0603_10V4Z~D
C733
0.1U_0805_25V7K~D
1
2
U37
0.1U_0402_16V4Z~D
3
SPKR_INL
2
SPKR_INR
27
HP_INL
26
HP_INR
24
BIAS
23
SPKR_EN#
22
HP_EN
25
MUTE#
17
HPVDD
9
CPVDD
10
C1P
12
C1N
11
CPGND
C758
12
1U_0603_10V4Z~D
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
AUD_EXT_MIC_L26
AUD_EXT_MIC_R26
AUD_INT_MIC_IN 26
BLM21PG600SN1D_0805~D
8
30
VDD
MAX9789A
CPVSS13PVSS
GND
EP
5
14
28
33
MAX9789A_TQFN32~D
L51
12
+5V_SPK+AMP
18
PVDD1
PVDD2
OUTL+
OUTL-
OUTR+
OUTR-
GAIN1
GAIN2
REGEN
VOUT
PGND221PGND1
HPL
HPR
SET
5.1_0402_1%~D
5.1_0402_1%~D
+5V_RUN
1
2
6
7
20
19
16
15
31
32
4
29
SET
1
12
R584
For
TPA6040A,
pop
C304,depop
R584
R555
R557
AUD_MIC_SWITCH26
HP_SPK_L1HP_SPK_L2
W=40mils
1
C745
C744
2
1U_0603_10V4Z~D
10U_0805_10V4Z~D
INT_SPK_R2
HP_SPK_L1
HP_SPK_R1
AUD_GAIN1
AUD_GAIN2
For TPA6040A, po p C301,depop R585
R585 0_0402_5%~D
12
12
C301
@
0.033U_1206_50V7K~D
1
C304
2
@
0_0402_5%~D
0.033U_1206_50V7K~D
2
VREFOUT
C728
1U_0603_10V6K~D
MIC_L1MIC_L2
12
12
MIC_R1
12
12
C730
1U_0603_10V6K~D
+3.3V_RUN
12
R564
BLM18BD121SN1D_0603~D
BLM18BD121SN1D_0603~D
+5V_SPK+AMP
1
1
C747
C746
2
2
1U_0603_10V4Z~D
10U_0805_10V4Z~D
1
1
C756
C757
2
2
1U_0603_10V4Z~D
1U_0603_10V4Z~D
2
12
R580
0_0402_5%~D
R7960_0402_5%~D
MIC_R2
R7970_0402_5%~D
100K_0402_5%~D
L49
12
12
L50
1
C738
2
100P_0402_50V8J~D
AUDIO_AVDD_ON 18
+VDDA
MINIMAM 150 mA
1
C735
2
100P_0402_50V8J~D
+3.3V_RUN
12
12
1
12
Gain Setting
R569
100K_0402_5%~D
R572
100K_0402_5%~D@
1
2
6
3
4
5
7
8
1
2
6
3
4
5
7
8
VREFOUT_R
R551
4.7K_0402_5%~D
12
12
R561
@
20K_0402_1%~D
C739
100P_0402_50V8J~D
12
12
1
2
C727
12
10U_0805_10V4Z~D
12
R552
4.7K_0402_5%~D
L47
BLM18BD601SN1D_0603~D
12
12
L48
BLM18BD601SN1D_0603~D
12
R562
@
20K_0402_1%~D
100K_0402_5%~D
HP_SPK_R2HP_SPK_R1
AUD_HP_NB_SENSE26,38
AUD_GAIN1
AUD_GAIN2
C734
1
2
100P_0402_50V8J~D
R567
+5V_SPK+AMP
GAIN1INPUTAV(inv)GAIN2
0
0
1
*
6dB
0
1
10dB
15.6dB
0
21.6dB
11
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
AMP and PHONE JACK
LA-3302P
1
JMIC
FOX_JA9033L-B1N6-7F~D
JAUDIO
FOX_JA9033L-B1N6-7F~D
12
R570
100K_0402_5%~D@
12
R573
100K_0402_5%~D
IMPEDANCE
82K ohm
66K ohm
45K ohm
26K ohm
2766Wednesday, March 07, 2007
of
0.4
Page 28
5
Layout Notice : Place as close
TPM_GPIO0
TPM_GPIO1
TPM_GPIO2
2
C862
1
C836
4.7U_0603_6.3V4Z~D
+3.3V_LAN
XTALO
XTALI
22P_0402_50V8J~D
2
1
chip as possible.
2
2
C838
C837
1
1
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
R415
4.7K_0402_5%~D
4.7K_0402_5%~D
12
12
R421
U38A
J8
LCLK
J7
LAD0
L10
LAD1
J5
LAD2
K9
LAD3
J9
LFRAME
M10
LRESET
H7
SERIRQ
G4
TPM_GPIO0
J3
TPM_GPIO1
H3
TPM_GPIO2/TPM_STATUS
J6
TPM_EN
H9
GPIO0
H11
GPIO1_SERIAL_DI
C5
GPIO2_SERIAL_DO
C4
EnergyDet
C8
SMB_CLK
C7
SMB_DATA
C9
SCLK
E10
SI
D9
SO
C10
CS
M2
NV_STRAP0
M1
NV_STRAP1
A9
LINKLED
B9
SPD100LED
A10
SPD1000LED
B8
TRAFFICLED
M9
XTALO
L9
XTALI
2
C839
C840
1
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
GPIO1_SERIAL_DI
LOM_LOW_PWR
BCM5755M
LPC/TPM
GPIO
SMBUS
SPI
LED
Clock
Layout Notice : No high
speed signal should be
routed near RDAC or on
adjacent layer to RDAC
2
1
+3.3V_ALW
Q44
SI3456BDV-T1-E3_TSOP6~D
2
2
C316
C309
1
1
DD
0.1U_0402_16V4Z~D
4.7U_0603_6.3V4Z~D
ENAB_3VLAN41
Place closely pin J8
33_0402_5%~D
22P_0402_50V8J~D
CLK_PCI_TPM6
LPC_LAD[0..3]22,38,39
CC
R64610K_0402_5%~D
@
R64810K_0402_5%~D
@
R64910K_0402_5%~D
@
LOM_TPM_EN#38
LOM_SMB_ALERT#23,39
LOM_CABLE_DETECT38
R646, R648, R649 Reserved for
BCM5752 as back-up solution
+3.3V_LAN
BB
AA
LOM_CABLE_DETECT goes to an input on a system microcontroller that can
poll this signal periodically and can de-assert the LOM_LOW_PWR when
LOM_CABLE_DETECT signal is high. Connect to an EC GPIOC defined by the
GPIO mapping.
Place R666 as
close to the ASIC
as possible. Pad
is needed to
measure 125MHz
clock for
debugging
R5820_0402_5%~D @
3
4.7U_0603_6.3V4Z~D
1
1
C826
C827
2
2
+2.5V_LAN
+1.2V_LAN
0.1U_0402_16V4Z~D
10U_0805_10V4Z~D
1
C846
2
Logic High Voltage must
be 0.7V to 2.75V
R647
20K_0402_5%~D
12
12
R276
39K_0402_5%~D
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
L63
BK2125LM182-T_0805~D
0.1U_0402_16V4Z~D
L64
BK1608LM182-T_0603~D
0.1U_0402_16V4Z~D
L65
BK2125LM182-T_0805~D
0.1U_0402_16V4Z~D
LOM_SUPER_IDDQ 38
+3.3V_LAN
LOM_SI
0.1U_0402_16V4Z~D
C865
2
1
12
C849
12
C850
12
C852
MBT35200MT1G_TSOP6~D
REGCTL_PNP25
+XTALVDD
1
2
+BIASVDD
1
2
+AVDD
1
2
+1.2V_LAN
L66
BK1608LM182-T_0603~D
C855
4.7U_0603_6.3V4Z~D
L67
BK1608LM182-T_0603~D
C857
4.7U_0603_6.3V4Z~D
L68
BK1608LM182-T_0603~D
C859
4.7U_0603_6.3V4Z~D
L88
BK1608LM182-T_0603~D
C863
@
4.7U_0603_6.3V4Z~D
U44
8
7
6
5
M45PE20-VMN6TP_SO8~D
8
7
6
5
AT45BCM021B-SU_SO8~D
Q
VSS
VCC
W#
SO
GND
VCC
WP#
RESET#
@
SCK
RESET#
CS#
D
C
S#
U45
SI
1
C771
2
@
12
1
2
12
1
2
12
1
2
12
1
2
1
2
3
4
1
2
3
4
Q70
3
0.047U_0402_16V4Z~D
+2.5V_LAN
C847
+3.3V_LAN
R665
@
4.7K_0402_5%~D
LOM_SO
LOM_SCLK
LOM_CS#
1
2
1
2
1
2
1
2
2
+3.3V_LAN
41
256
0.1U_0402_16V4Z~D
1
C848
2
+AVDDL
C856
0.1U_0402_16V4Z~D
+GPHY_PLLVDD
C858
0.1U_0402_16V4Z~D
+PCIE_PLLVDD
C860
0.1U_0402_16V4Z~D
+PCIE_SDS_VDD
C864
@
0.1U_0402_16V4Z~D
12
12
R664
@
4.7K_0402_5%~D
2
0.1U_0402_16V4Z~D
1
2
0.1U_0402_16V4Z~D
1
C842
2
0.1U_0402_16V4Z~D
1
2
12
R670
@
4.7K_0402_5%~D
4.7U_0603_6.3V4Z~D
1
C824
C825
2
+2.5V_LAN
10U_0805_10V4Z~D
1
C843
2
+3.3V_LAN
+2.5V_LAN
+XTALVDD
+PCIE_SDS_VDD
+BIASVDD
+AVDDL
+AVDD
+PCIE_PLLVDD
+GPHY_PLLVDD
(Default)
Atmel AT45BCM021B
ST M45PE20
1
Layout Notice : 1.2V filter. Place as close
chip as possible.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
USB 2.0 Port
LA-3302P
3266Thursday, March 01, 2007
1
0.4
of
Page 33
5
DD
CC
4
ICH_AZ_MDC_RST#22
+5V_SUS
MDC_RST_DIS#18
12
R239
10K_0402_5%~D
3
@
0_0402_5%~D
12
13
R235
D
S
Q31
BSS138W-7-F_SOT323~D
G
2
ICH_RST_MDC_R#
12
R233
100K_0402_5%~D
2
1
New MDC connector.
1
GND
3
IAC_SDATA0
5
GND
7
IAC_SYNC
9
IAC_SDATAIN
1112
IAC_RESET#
IAC_BITCLK
RES
RES
3.3V
GND
GND
2
4
6
8
10
BB
JMDC
1
ICH_AZ_MDC_SDOUT22
ICH_AZ_MDC_SYNC22
12
ICH_AZ_MDC_SDIN122
AA
R128
33_0402_5%~D
ICH_AZ_MDC_SDOUT
ICH_AZ_MDC_SYNC
MDC_SDIN
ICH_RST_MDC_R#
GND1
3
IAC_SDATA_OUT
5
GND2
7
IAC_SYNC
9
IAC_SDATA_IN
11
IAC_RESET#
GND13GND14GND15GND16GND17GND
2
RES0
4
RES1
6
3.3V
8
GND3
10
GND4
12
IAC_BITCLK
TYCO_1-1775149-2~D
18
Connector for MDC Rev1.5
W=20 mil
ICH_AZ_MDC_BITCLK
+3.3V_SUS
1
C126
2
4.7U_0603_6.3V4Z~D
ICH_AZ_MDC_BITCLK22
1
C125
2
0.1U_0402_16V4Z~D
ICH_AZ_MDC_SDOUT
ICH_AZ_MDC_BITCLK
C128
10P_0402_50V8J~D
R123
R124
12
10_0402_5%~D
12
10_0402_5%~D@
MDC_AC_BITCLK_TERM
ICH_AC_SDOUT_MDCTERM
1
1
C127
10P_0402_50V8J~D
2
2
@
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
INT KB
LA-3302P
4066Thursday, March 01, 2007
1
0.4
of
Page 41
5
DC/DC Interface
+3.3V_ALW2
12
R621
100K_0402_5%~D
DD
SUS_ON39,42
CC
SUS_ON
RUN_ON19,37,39,42,51
13
D
Q51
2
2N7002W-7-F_SOT323-3~D
G
S
+3.3V_ALW2
12
R623
100K_0402_5%~D
RUN_ON_5V#
2N7002W-7-F_SOT323-3~D
13
D
2
G
Q55
S
2N7002W-7-F_SOT323-3~D
SUS_ON_5V#
2
2
Q53
+15V_ALW
G
+15V_ALW
G
12
R617
100K_0402_5%~D
SUS_ENABLE
13
D
Q49
S
2N7002W-7-F_SOT323-3~D
12
R624
100K_0402_5%~D
13
D
S
C815
4700P_0402_25V7K~D
RUN_ENABLE
1
2
4
6
2
1
+5V_ALW
Q52
SI4810BDY-T1-E3_SO8~D
8
7
5
Q80
SI3456BDV-T1-E3_TSOP6~D
D
+5V_ALW
1
C142
2
@
4700P_0402_25V7K~D
S
45
G
3
4
+5VSUS Source
+5V_SUS
1
C143
2
10U_0805_10V4Z~D
+5VRUN Source
+5V_RUN
1
2
36
1
C814
2
10U_0805_10V4Z~D
12
R762
20K_0402_5%~D
12
R625
20K_0402_5%~D
3
3.3V_SUS_ON39
2
+3.3V_ALW2
G
12
R765
100K_0402_5%~D
13
D
S
2
SUS_ON_3.3V#
Q87
2N7002W-7-F_SOT323-3~D
+15V_ALW
2
G
12
R764
100K_0402_5%~D
13
D
S
Q88
2N7002W-7-F_SOT323-3~D
+3.3V_ALW
8
7
5
1
Q47
SI4810BDY-T1-E3_SO8~D
+3VSUS Source
1
2
36
4
1
C195
4700P_0402_25V7K~D
2
@
C811
10U_0805_10V4Z~D
1
2
+3.3V_SUS
12
R620
20K_0402_5%~D
+1.8V_RUN Source
+15V_ALW
+3.3V_ALW2
12
R637
100K_0402_5%~D
13
D
Q65
1.8V_RUN_ON39
2
G
S
2N7002W-7-F_SOT323-3~D
12
R632
13
D
2
G
S
Q60
2N7002W-7-F_SOT323-3~D
100K_0402_5%~D
D35
@
RB751V_SOD323~D
12
R305
0_0402_5%~D
Q54
SI4336DY-T1-E3_SO8~D
8
7
5
21
4
1
2
+1.8V_RUN+1.8V_SUS
1
2
36
1
C816
2
10U_0805_10V4Z~D
C194
0.047U_0402_16V4Z~D
12
R628
20K_0402_5%~D
+3.3V_ALW
+PWR_SRC+PWR_SRC
12
12
R699
100K_0402_5%~D
N21917830
13
D
AUX_ON39
2N7002W-7-F_SOT323-3~D
BB
AA
2
G
Q73
R701
S
200K_0402_5%~D
R698
100K_0402_5%~D
13
D
2
G
12
Q72
S
2N7002W-7-F_SOT323-3~D
12
1
2
C208
R700
4700P_0402_25V7K~D
ENAB_3VLAN 28
470K_0402_5%~D
3.3V_RUN_ON39
+3.3V_ALW2
2
G
12
R766
100K_0402_5%~D
13
D
S
Q90
2N7002W-7-F_SOT323-3~D
Discharg Circuit
75_0603_5%~D
Q91
2N7002W-7-F_SOT323-3~D
12
R118
@
13
D
2
G
S
@
1K_0402_5%~D
Q92
2N7002W-7-F_SOT323-3~D
12
R117
@
1K_0402_5%~D
13
D
2
Q93
G
S
@
2N7002W-7-F_SOT323-3~D
RUN_ON_5V#
2
G
SUS_ON_3.3V#
12
R151
@
13
D
2
G
S
@
+15V_ALW
12
R641
100K_0402_5%~D
13
D
2
G
S
Q89
2N7002W-7-F_SOT323-3~D
D36
@
RB751V_SOD323~D
12
R413
0_0402_5%~D
Discharg Circuit
1K_0402_5%~D
Q61
2N7002W-7-F_SOT323-3~D
12
R634
@
1K_0402_5%~D
13
D
2
G
2
G
Q62
S
@
2N7002W-7-F_SOT323-3~D
12
R633
@
13
D
S
@
21
+1.5V_RUN+0.9V_DDR_VTT+3.3V_RUN+5V_RUN
1K_0402_5%~D
Q63
2N7002W-7-F_SOT323-3~D
12
R636
@
13
D
2
G
S
@
12
R635
@
13
D
S
@
+3.3V_RUN Source
Q10
@
SI4810DY-T1-E3_SO8~D
8
7
5
Q58
SI4336DY-T1-E3_SO8~D
8
7
5
+1.8V_RUN
12
@
1K_0402_5%~D
13
D
2
G
Q64
S
2N7002W-7-F_SOT323-3~D
4
4
1
C144
470P_0402_50V7K~D
2
@
R729
1K_0402_5%~D
2
Q81
@
2N7002W-7-F_SOT323-3~D
1
2
36
+3.3V_RUN
1
2
36
+1.25V_RUN+1.8V_SUS+5V_SUS+3.3V_SUS
G
C819
10U_0805_10V4Z~D
12
13
D
S
12
1
R630
2
20K_0402_5%~D
R113
@
1K_0402_5%~D
Q30
@
2N7002W-7-F_SOT323-3~D
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
POWER CONTROL
LA-3302P
4166Thursday, March 01, 2007
1
0.4
of
Page 42
5
DD
+5V_RUN
1
2
+1.8V_RUN
1
2
+3.3V_RUN
CC
1
2
D25
21
RB751V_SOD323~D
C46
0.1U_0402_16V4Z~D
D26
21
RB751V_SOD323~D
C47
0.1U_0402_16V4Z~D
D27
21
RB751V_SOD323~D
C49
0.1U_0402_16V4Z~D
12
R68
12
R616
12
R82
1
2
200K_0402_5%~D
1
2
200K_0402_5%~D
1
2
200K_0402_5%~D
R334
10K_0402_5%~D
12
C17
2200P_0402_50V7K~D
R364
10K_0402_5%~D
12
C19
2200P_0402_50V7K~D
R367
10K_0402_5%~D
12
C27
2200P_0402_50V7K~D
+5V_ALW
E
3
Q77
B
MMBT3906WT1G_SC70-3~D
2
C
1
+1.8V_SUS
E
3
Q78
B
MMBT3906WT1G_SC70-3~D
2
C
1
+3.3V_ALW
E
3
Q79
B
MMBT3906WT1G_SC70-3~D
2
C
1
R133
4.7K_0402_5%~D
12
R134
4.7K_0402_5%~D
12
R164
4.7K_0402_5%~D
12
4
1.25V_RUN_PWRGD51
2.5V_RUN_PWRGD18
1.5V_RUN_PWRGD47
1.05V_RUN_PWRGD47
GFX_CORE_PWRGD51
C
Q84
2
B
MMST3904-7-F_SOT323-3~D
E
31
C
Q85
2
B
MMST3904-7-F_SOT323-3~D
E
31
C
Q86
2
B
MMST3904-7-F_SOT323-3~D
E
31
12
R4860_0402_5%~D
R2160_0402_5%~D@
R2070_0402_5%~D
R2080_0402_5%~D
R1850_0402_5%~D
12
12
12
12
5V_3V_1.8V_1.25V_RUN_PWRGD 38
3
+3.3V_SUS
12
R132
20K_0402_5%~D
3VRUNRC
1
C134
0.01U_0402_16V7K~D
2
+3.3V_ALW
C135
0.1U_0402_16V4Z~D
12
8
U12A
P
7
A1Y
G
74LVC3G14DC_VSSOP8~D
4
IMVP_PWRGD23,39,48
RESET_OUT#39
+3.3V_ALW
8
U12B
P
A6Y
G
74LVC3G14DC_VSSOP8~D
4
RUN_ON19,37,39,41,51
SUS_ON39,41
74VHC08MTCX_NL_TSSOP14~D
IMVP_PWRGD
RESET_OUT#
74VHC08MTCX_NL_TSSOP14~D
U27B
2
+3.3V_ALW
4
IN1
5
IN2
12
R418
0_0402_5%~D
14
P
OUT
G
7
2
6
U27C
+3.3V_ALW
14
1
IN1
2
IN2
7
+3.3V_ALW
14
10
IN1
9
IN2
7
ICH_PWRGD
C458
0.1U_0402_16V4Z~D
12
U27A
74VHC08MTCX_NL_TSSOP14~D
P
3
OUT
G
13
12
P
8
OUT
G
R79
100K_0402_5%~D
2
G
+3.3V_SUS
+3.3V_ALW
8
U12C
P
A3Y
G
74LVC3G14DC_VSSOP8~D
4
+3.3V_ALW
14
U27D
P
IN1
11
OUT
IN2
G
74VHC08MTCX_NL_TSSOP14~D
7
12
ICH_PWRGD#
13
D
Q17
2N7002W-7-F_SOT323-3~D
S
5
RUNPWROK
ICH_PWRGD# 18
ICH_PWRGD 10,23
1
RUNPWR OK 38,39,48,54
SUSPWROK 18
BB
AA
+3.3V_SUS
1
C457
0.1U_0402_16V4Z~D
2
+5V_SUS
1
C199
0.1U_0402_16V4Z~D
2
D23
RB751V_SOD323~D
21
D31
RB751V_SOD323~D
21
R159
10K_0402_5%~D
R139
R158
200K_0402_5%~D
200K_0402_5%~D
12
1
C422
2
2200P_0402_50V7K~D
10K_0402_5%~D
12
1
C404
2
2200P_0402_50V7K~D
R160
12
12
E
3
B
Q20
2
MMBT3906WT1G_SC70-3~D
C
1
12
R135
200K_0402_5%~D
+5V_ALW
E
3
B
Q26
2
MMBT3906WT1G_SC70-3~D
C
1
12
R157
200K_0402_5%~D
D32
21
RB751V_SOD323~D
D33
RB751V_SOD323~D
21
+3.3V_ALW+3.3V_ALW
A6Y
12
R136
200K_0402_5%~D
C186
0.1U_0402_16V4Z~D
12
8
U48B
P
2
G
74LVC3G14DC_VSSOP8~D
4
3.3V_5V_SUS_PWRGD
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Power Good
LA-3302P
4266Thursday, March 01, 2007
1
0.4
of
Page 43
5
H1
H_C146B217D91
1
H10
@H_C236B315D110
1
DD
H20
@H_C217B276D98
1
CC
BB
AA
H2
H_C146B217D91
1
H11
@H_C315B236D118
1
H26
@H_C472D376
1
This circuit is
only needed if the
platform has the
SNIFFER.
SATA_ACT#_R22
LED_MASK#38
+COINCELL
12
R21
1K_0402_5%~D
Z4012
3
2
D13
1
BAT54CW_SOT323~D
SNIFFER_YELLOW#39
SNIFFER_GREEN#39
1
2
H3
@H_C315D110
1
H12
@H_C315D118
1
H27
@H_C472D431X376
1
+3.3V_RUN
12
R78
10K_0402_5%~D
+3.3V_ALW
12
COIN RTC Battery
+COINCELL
+RTC_CELL
C370
1U_0603_10V4Z~D
+3.3V_SUS
2
13
+3.3V_SUS
2
13
5
H5
H4
@H_C236B315D110
H_C256B63D47
1
H13
@H_C315D118
1
H28
@H_O115X31D115X31N
1
R140
0_0402_5%~D @
12
S
G
R97
10K_0402_5%~D
@
COINCELL
Q32
PDTA114EU_SC70-3~D
Q33
PDTA114EU_SC70-3~D
1
H14
@H_C291B236D118
1
H29
@H_O115X31D115X31N
1
D
13
Q23
BSS138W-7-F_SOT323~D
2
JCOIN
1
1
2
2
MOLEX_53398-0271~D
12
R261220_0402_5%~D
12
R262220_0402_5%~D
H6
@H_C236B256D110
1
H15
@H_C295D118
1
SATA_ACT#
SNIFFER_Y
SNIFFER_G
@H_O115X31D115X31N
+3.3V_RUN
H7
@H_C236B315D110
1
H16
@H_C217B276D98
1
H30
1
12
R181
100K_0402_5%~D
@
12
R179
0_0402_5%~D
4
H8
@H_C217B276D98
1
H17
@H_C217B276D98
D14
Y
3
2
G
12-22AUYSYGC/530-A2/TR8_G/Y~D
4
H18
@H_C217D91
1
1
+3.3V_RUN
2
13
LED_WLAN_OUT#34
WIRELESS_ON/OFF#38
SNIFFER_PWR_SW#39
1
H9
@H_C236B315D110
1
H19
@H_C217D91
1
Q22
PDTA114EU_SC70-3~D
R145
330_0402_5%~D
12
47K_0402_5%~D
12
R639
10K_0402_5%~D
R180
3
EMI CLIP
CLIP4
EMI_CLIP
1
GND
CLIP6
EMI_CLIP
1
GND
CLIP1
EMI_CLIP
1
GND
HDD_LED 32
R_PIDEACT 36
+3.3V_WLAN
+3.3V_RUN
12
R638
E
3
B
Q5
2
MMBT3906WT1G_SC70-3~D
C
1
R15
12
150_0402_5%~D
+3.3V_RUN+RTC_CELL
12
12
R102
100K_0402_5%~D
100K_0402_5%~D
JSNIFF
6
4
4
3
3
2
2
1
1
5
1
1
BT_ACTIVE34,40
LED_MASK#38
R_MPCI_ACT
6
5
1BS008-13130-7F_4P~D
CLIP3
EMI_CLIP
GND
CLIP2
EMI_CLIP
GND
BT_ACTIVE
R_MPCI_ACT 32
R74
10K_0402_5%~D
12
E
3
B
2
1
BAT1_LED#39
BAT2_LED#39
2
FIDUCIAL MARK~D
FIDUCIAL MARK~D
FIDUCIAL MARK~D
FIDUCIAL MARK~D
CAP_LED#39
NUM_LED#39
SCRL_LED#39
13
D
2
G
Q29
BSS138W-7-F_SOT323~D
S
Q18
MMBT3906WT1G_SC70-3~D
C
BREATH_LED39
BAT1_LED#
BAT2_LED#
Fiducial Mark
FIDUCIAL MARK~D
FIDUCIAL MARK~D
FIDUCIAL MARK~D
FIDUCIAL MARK~D
R226
330_0402_5%~D
R224
330_0402_5%~D
R225
330_0402_5%~D
Q28
PDTA114EU_SC70-3~D
13
R212
1K_0402_5%~D
12
+3.3V_SUS+3.3V_RTC_LDO
+3.3V_ALW
2
+3.3V_ALW
2
FD2
1
FD11
1
FD9
1
FD18
1
12
12
12
5
1
U43
P
NC
A2Y
G
NC7SZ04P5X_NL_SC70-5~D
3
Q1
PDTA114EU_SC70-3~D
13
Q4
PDTA114EU_SC70-3~D
13
FD1
1
FD13
1
FD22
1
FD17
1
+5V_RUN
2
R_BT_ACT
4
FD5
1
FIDUCIAL MARK~D
FD14
1
FIDUCIAL MARK~D
FD24
1
FIDUCIAL MARK~D
FD3
1
FIDUCIAL MARK~D
R_CAP_LED#
R_NUM_LED#
R_SCRL_LED#
R_BT_ACT 32
R71
100_0402_5%~D
12
R6
12
220_0402_5%~D
R9
12
220_0402_5%~D
FIDUCIAL MARK~D
FIDUCIAL MARK~D
1
FIDUCIAL MARK~D
1
FIDUCIAL MARK~D
BATT_GREEN_LED
BATT_AMBER_LED
1
FD10
1
FD25
1
FD20
FD4
R_CAP_LED# 40
R_NUM_LED# 40
R_SCRL_LED# 40
BREATH_GREEN_LED 32
FD12
1
FIDUCIAL MARK~D
FD15
1
FIDUCIAL MARK~D
FD19
1
FIDUCIAL MARK~D
FD6
1
FIDUCIAL MARK~D
BATT_GREEN_LED 32
BATT_AMBER_LED 32
FD23
1
FIDUCIAL MARK~D
FD21
1
FIDUCIAL MARK~D
FD16
1
FIDUCIAL MARK~D
FD8
1
FIDUCIAL MARK~D
FD7
1
FIDUCIAL MARK~D
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
Size Do c um e n t N u mb erRe v
Date:Sheet
Compal Electronics, Inc.
PAD and Standoff
LA-3302P
1
4366Thursday, March 01, 2007
0.4
of
Page 44
5
4
3
2
1
+3.3V_ALW
ESD Diodes
3
2
3
DD
PC231
Secondary Battery Connector
PJP1
BATT1+
BATT2+
12
2200P_0402_50V7K~D
SMB_DAT
BATT_PRES#
SYSPRES#
BATT_VOLT
10
GND
11
GND
TYCO_1734077-1~D
SMB_CLK
BATT1ÂBATT2-
1
2
3
4
5
6
7
8
9
Z4301
Z4302
Z4303
PD42
DA204U_SOT323~D @
PR301
100_0402_5%~D
12
+3.3V_ALW
1
PR302
100_0402_5%~D
12
PD43
DA204U_SOT323~D @
1
PR303
100_0402_5%~D
12
PD44
DA204U_SOT323~D @
100_0402_5%~D
1
PR304
12
2
3
PD45
1
DA204U_SOT323~D @
SBAT_SMBCLK 39
SBAT_SMBDAT 3 9
SBAT_ALARM#
FBMA-L18-453215-900LMA90T_1812~D
PC230
0.1U_0603_25V7K~D
12
PL32
12
PJP60
12
PAD-OPEN 4x4m
SBATT+
+3.3V_ALW
12
PR300
10K_0402_5%~D
SBAT_PRES# 38,50
2
3
2
ESD Diodes
2
3
2
3
PD10
1
DA204U_SOT323~D @
PR21
100_0402_5%~D
12
1
100_0402_5%~D
12
CC
PC10
Primary Battery Connector
PBATT1
SMB_CLK
BATT_PRES#
SYSPRES#
BATT_VOLT
10
GND
11
GND
SUYIN_2 00277MR009G 506ZR ~D
SMB_DAT
12
2200P_0402_50V7K~D
BATT1+
BATT2+
BATT1ÂBATT2-
1
2
3
4
5
6
7
8
9
Z4304
Z4305
Z4306
PD9
DA204U_SOT323~D @
PR20
100_0402_5%~D
12
PR22
3
PD11
100_0402_5%~D
2
1
DA204U_SOT323~D @
PR23
12
2
3
PD12
1
DA204U_SOT323~D @
PBAT_SMBCLK 39
PBAT_SMBDAT 3 9
PBAT_ALARM#
PC9
PL6
FBMA-L18-453215-900LMA90T_1812~D
12
PJP61
12
12
PAD-OPEN 4x4m
0.1U_0603_25V7K~D
PBATT+
+3.3V_ALW
12
PR19
10K_0402_1%~D
PBAT_PRES# 38
+5V_ALW
2
PR184
12
3
PD2
DA204U_SOT323~D
1
+5V_ALW
BB
PR346
@
12
0_0402_5%~D
GPIO Input from EC
Z-series AC Adaptor
Connctor
PJPDC1
TYCO_1566065-2~D
9
GND_4
8
GND_3
7
GND_2
6
GND_1
AA
MH1
MH2
Low_PWR
DC+_1
DC+_2
DC-_1
DC-_2
1
2
3
4
5
1
@
2
5
PL1
BLM18BD102SN1D_0603~D
FBCA-K5 B -302340-L1-T_1812~D
12
+DCIN_JACK
-DCIN_JACK
12
FBCA-K5 B -302340-L1-T_1812~D
PD59
VZ0603M260APT_0603
12
PL2
1
PD58
@
2
VZ0603M260APT_0603
PC397
@
PL34
AC_OFF39
@
IMD2AT- 108_SC74-6~D
IMD2AT- 108_S C 74-6~D
12
12
@
0.1U_0603_25V7K~D
5
PQ100A
+DC_IN
1
2
1 2
0.47U_0805_25V7k
36
12
PR11
240K_0402_5%~D
4
+DC_IN
PQ100B
PC2
@
43
2
PR495
0_0402_5%~D
16
PQ3
FDS6679AZ_SO8~D
4
12
PR13
47K_0402_1%~D
DOCK_PSID36
DC_IN+ Source
8
7
5
12
PC4
PC3
0.1U_0603_25V7K~D
THESE CAPS MUST BE
NEXT TO JCHG
2
3
+DC_IN_SS
12
0.1U_0603_25V7K~D
12
12
PC5
PR12
0.1U_0603_25V7K~D
1
PC6
2
4.7K_0805_5%
10U_1206_25V6M~D
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE C OMPETENT DIVIS ION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INF ORMATION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WR ITT EN CO NSE NT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE C OMPETENT DIVIS ION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INF ORMATION IT CONT AINS
PR193, PD20 are only used with the second-source MAX8632.
21
PD20
RB751V-40_SOD323~D
@
PR73
12
1_0603_5%~D
ISL88550_FB
0_0402_5%~D @
12
GNDA_DDR
PR84
ISL88550_REF
PR200
12
100K_0402_1%~D
12
12
ISL88550_DH
ISL88550_LX
DDR2 Termination
+5V_ALW
ALW_PWRGD_3V_5V39,45
12
PC62
4.7U_0805_6.3V6K
PU6
20
BST
18
DH
19
LX
21
DL
23
PGND1
16
VOUT
15
FB
1
TON
3
REF
ISL88550_ILIM
PR202
100K_0402_1%~D
PR193
10_1206_5%~D
PR505
0_0402_5%~D
PR506
0_0402_5%~D
12
12
GNDA_DDR
2
22
VDD
OVP/ UVP
ISL88550A_TQFN28~D
SKIP
ILIM
4
25
PR518
0_0402_5%~D
12
GNDA_DDR
12
@
28
TP0
GND
24
12
GNDA_DDR
ISL88550_AVDD
26
17
VIN
AVDD
5
POK1
6
POK2
27
SHDN
7
STBY
13
VTTI
14
REFIN
11
PGND2
12
VTT
9
VTTS
10
VTTR
SS
GND
8
29
12
PC66
1000P_0402_50V7K~D
@
GNDA_DDR
PC63
1U_0603_10V6K~D
ISL88550_REFI N
12
12
+3.3V_ALW
PR194
20K_0402_5%~D
PR204
20_0603_1%~D
PC77
0.1U_0402_10V7K~D
GNDA_DDR
PC64
1U_0603_10V6K~D
12
12
PR195
12
100K_0402_1%~D
DDR_ON 39
+1.8V_SUSP
GNDA_DDR
1
PC146
10U_0805_6.3V6M~D
2
PJP59
PAD-OPEN1x1m
1.8V_SUS_PWRGD 39
PR212
0_0402_5%~D
12
+1.8V_SUSP
1
PC153
PC154
2
10U_0805_6.3V6M~D
10U_0805_6.3V6M~D
V_DDR_MCH_REF
12
1
PC157
2
10U_0805_6.3V6M~D
@
0.9V_DDR_VTT_ON 39
+0.9V_DDR_VTTP
1
Design current 0.7A for +0.9V_DDR_VTTP
Peak current 1A for +0.9V_DDR_VTTP
2
PJP9
PAD-OPE N 4x4m
12
PJP10
PAD-OPE N 4x4m
+1.8V_SUSP
AA
+0.9V_DDR_VTTP
12
PJP11
12
PAD-OPE N 4x4m
5
+1.8V_SUS
+0.9V_DDR_VTT
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
THIS SHEET OF EN GINEE RING D RAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
+1.5V_RUN / +1.05V_VCCP
LA-3302P
1
4766Thursday, March 01, 2007
0.0
of
Page 48
8
7
6
5
4
3
2
1
+CPU_PWR_SRC
HH
PQ42
PQ50
2
PQ57
2
8
D5D6D7D
G4S3S2S
1
IRF7821TRPBF_SO8~D
PHASE1
3
D
PQ56
G
S
FDS7088SN3_SO8~D
1
@
8
D5D6D7D
G4S3S2S
1
IRF7821TRPBF_SO8~D
3
D
2
IRF7821TRPBF_SO8~D
G
PQ60
G
S
FDS7088SN3_SO8~D
1
@
8
D5D6D7D
G4S3S2S
1
3
D
PQ61
S
FDS7088SN3_SO8~D
1
PC248
@
3
+CPU_PWR_SRC
PR228
10_0603_5%~D
12
PC180
0.01U_0402_25V7K~D
GNDA_VCORE
19
20
VSS
VDD
13K_0402_5%~D
4
VR_TT#
3
RBIAS
5
NTC
6
SOFT
VID0
VID1
VID2
VID3
VID4
VID5
VID6
DPRSTP#
DPRSLPVR
1
PSI#
2
PMON
CLK_EN#
VR_ON
VSEN
RTN
VDIFF
FB
9
COMP
8
VW
GND
DROOP
14
PR267
PC201
12
330P_0402_50V7K~D
PC411
4700P_0402_25V7K~D
12
+3.3V_RUN
12
39
40
18
VIN
3V3
PGOOD
PWM1
ISEN1
PU11
PWM2
ISEN2
ISL6260CCRZ_QFN40~D
FCCM
PWM3
ISEN3
OCSET
VSUM
DFB15VO
16
VO
PR268
1K_0402_1%~D
12
12
PC412
@
4700P_0402_25V7K~D
GNDA_VCORE
PR234
1.91K_0603_1%~D
27
23
26
22
24
25
21
7
17
12
PR263
4.53K_0402_1%~D
PC191
0.33U_0603_10V7K
12
2
PC260
1
@
VSUM
2
1
1
2
PC229
0.01U_0402_16V7K~D
0.1U_0402_16V7K~D
6
IMVP_PWRGD 23,39,42
PR508
@
226K_0402_1%~D
12
PR260
11.5K_0402_1%~D
12
12
PR261
PC215
1 2
2.43K_0402_1%~D
0.033U_0402_16V7K~D
12
PH2
S THERM_ 6.8K +-5% TSM1A682J4302RE 0603
12
PR480
@
0_0402_5%~D
PR266
15K_0402_1%~D
GNDA_VCORE
12
1
2
PC392
@
0.1U_0402_16V7K~D
GG
+5V_ALW
PR233
12
10_0603_5%~D
PC182
1U_0603_10V6K~D
GNDA_VCORE
IMVP6_PROCHOT#38
PH1
12
12
12
12
12
12
CLK_ENABLE#
PR509 0_0402_5%~D
12
12
12
12
PR287
0_0603_5%~D
12
PR487
0_0402_5%~D
12
PR259
PC197
12
12
PR264
12
12
12
12
PR516
PC413
GNDA_VCORE
7
PR290
0_0603_5%~D
12
1K_0402_1%~D
12
0.01U_0402_16V7K~D
12
PR485
@
28
29
30
31
32
33
34
37
36
38
35
12
13
11
10
41
GNDA_VCORE
10.5K_0402_1%
12
@
FF
EE
GNDA_VCORE
H_DPRSTP#8,10,22
DPRSLPVR10,23
H_PSI#8
DD
PWR_MON18
PC391
1U_0603_10V6K~D
GNDA_VCORE
RUNPWROK38,39,42,54
IMVP_VR_ON39
10KB_0603_1%_ERTJ1VG103FA~D
CC
BB
@
AA
GNDA_VCORE
0_0402_5%~D
2200P_0402_50V7K~D
0.015U_0402_16V7K~D
VID08
VID18
VID28
VID38
VID48
VID58
VID68
PR252
10K_0402_5%~D
1 2
PH3
@
PR486
4.99K_0402_1%@
VSSSENSE8
PR257
332_0402_1%~D
220P_0402_50V8J~D
12
PR481
0_0402_5%~D
8
PR238
147K_0402_1%~D
12
PR284
@
12
PC409
@
12
PC187
12
0_0402_5%~D
0_0402_5%~D
0_0402_5%~D
0_0402_5%~D
12
PR254 0_0402_5%~D@
12
12
GNDA_VCORE
12
680P_0402_50V7K~D
1 2
PC250
1500P_0402_50V7K~D
PC195
1 2
@
470KB_0402_5%_NCP15WM474J03RB~D
PR239
PR240
0_0402_5%~D
12
PR241
PR242
0_0402_5%~D
12
PR243
PR244
0_0402_5%~D
12
PR245
0_0402_5%~D
@
0_0402_5%~D
1 2
PC190
PR248
PR249
499_0402_1%~D
12
PR479
12
12
VCCSENSE8
PC213 1000P_0402_50V7K~D
PC214 1000P_0402_50V7K~D
PR512
0_0402_5%~D
PR258
1.69K_0402_1%~D
82.5K_0402_1%~D
1000P_0402_50V7K~D
6.34K_0402_1%~D
+5V_ALW
12
PC178
1U_0603_10V6K~D
12
PR482
@
5
12
12
PWR_MON 18
30K_0402_5%~D
PU10
5
VCC
6
FCCM
2
PWM
3
GND
ISL6208CRZ-T_QFN8~D
+5V_ALW
PC241
1U_0603_10V6K~D
5
VCC
6
FCCM
2
PWM
3
GND
ISL6208CRZ-T_QFN8~D
+5V_ALW
PC196
PU13
5
VCC
1U_0603_10V6K~D
6
FCCM
2
PWM
3
GND
ISL6208CRZ-T_QFN8~D
PU16
PR229
0_0603_5%~D
1
BOOT
UGATE
PHASE
LGATE
UGATE
BOOT
UGATE
PHASE
LGATE
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE C OMPETENT DIVIS ION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INF ORMATION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WR ITT EN CO NSE NT OF COMPAL ELECTRONICS, INC.
BOOT
PHASE
LGATE
8
7
4
PR328
0_0603_5%~D
1
8
7
4
PR262
0_0603_5%~D
1
8
7
4
UGATE1
UGATE3
0.22U_0603_10V7K~D
12
1 2
LGATE1
0.22U_0603_10V7K~D
12
1 2
UGATE2
LGATE2
PC198
0.22U_0603_10V7K~D
12
1 2
LGATE3
4
PC179
PC242
12
PC249
0.1U_0603_25V7K~D
12
PC246
1500P_0603_25V7K~D
PC247
1500P_0603_25V7K~D
12
1500P_0603_25V7K~D
12
VSUM
12
PC239
PC240
0.1U_0603_25V7K~D
PHASE2
12
0.45UH_ET QP4LR45XFC_25A_20%~D
PHASE3
12
VSUM
12
12
PC223
0.1U_0603_25V7K~D
10K_0402_1%~D
12
PR231
7.68K_0805_1%~D
12
2200P_0402_50V7K~D
+CPU_PWR_SRC
10K_0402_1%~D
12
PR270
7.68K_0805_1%~D
PC176
PC224
10U_1206_25V6M~D
2200P_0402_50V7K~D
PL29
0.45UH_ETQP4LR45XFC_25A_20%~D
4
3
PR230
0.22U_0603_10V7K~D
+CPU_PWR_SRC
12
12
PC177
PC271
10U_1206_25V6M~D
10U_1206_25V6M~D
0.45UH_ET QP4LR45XFC_25A_20%~D
4
3
PR330
10K_0402_1%~D
12
PR331
7.68K_0805_1%~D
12
VSUM
12
12
10U_1206_25V6M~D
PR269
1
2
PC227
PC193
0.1U_0603_25V7K~D
10U_1206_25V6M~D
PL31
4
3
0.22U_0603_10V7K~D
PC272
FBMA-L18-453215-900LMA90T_1812~D
1
12
12
PC380
PC270
2
100U_25V_M~D
10U_1206_25V6M~D
1
2
PC181
PL33
12
PC200
12
12
12
VO
1
2
PC243
0.22U_0603_10V7K~D
12
12
PC228
2200P_0402_50V7K~D
PR271
10_0402_1%~D
12
12
12
PR515
0_0402_5%~D
VO
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Do c um e n t N u mb erRe v
Date:Sheet
2
PL47
@
12
PJP30
12
+
PAD-OPEN 4x4m
PJP31
12
PAD-OPEN 4x4m
Iccmax=44A
I_TDC=35A
OCP=65A, Intel spec=50A
+VCC_CORE
PR232
10_0402_1%~D
PR513
0_0402_5%~D
+VCC_CORE
PR329
10_0402_1%~D
12
12
PR514
0_0402_5%~D
VO
+VCC_CORE
Compal Electronics, Inc.
+VCORE
LA-3302P
4866Thursday, March 01, 2007
1
+PWR_SRC
of
0.0
Page 49
5
4
3
2
1
+DC_IN discharge path
+SDC_IN
PR138
0.01_2512_1%~D
+DC_IN_SS
DD
1
PC99
2
10U_1206_25V6M~D
PR142
215K_0402_1%
12
1
2
4
3
PC383
12
0.22U_0402_6.3V6K
12
10_0402_1%~D
PR472
PJP62
12
PAD-OPEN 4x4m
12
12
PC128
PC127
@
@
0.1U_0603_25V7K~D
2200P_0402_50V7K~D
CHAGER_SRC
ISL88731_VDDP
12
12
0.01U_0402_25V7K~D
12
57.6K_0402_1%~D
12
13K_0402_1%
PC393
12
GNDA_CHG
105_0402_1%~D
4
1U_0805_25V4Z~D
GNDA_CHG
PC122
@
1U_0603_10V6K~D
12
0.01U_0402_25V7K~D
PR143
49.9K_0402_1%~D
12
0.01U_0402_25V7K~D
GNDA_CHG
Vin Detector
High 17.9 V
Low 17.24 V
PC110
12
0.1U_0402_10V7K~D
THRM_SMBCLK18,39
THRM_SMBDAT18,39
5
CC
BB
AA
ACAV_IN18,39,50
+5V_ALW
ADAPT_TRIP_SET38
PR149
10K_0402_1%~D
PR341
15.8K_0402_1%~D
PC221
GNDA_CHG
12
12
PR150
@
16.2K_0402_1%~D
ISL88731_ICM
12
@
PR148
12
PC118
PC121
0.1U_0402_10V7K~D
PR361
12
8.45K_0402_1%~D
@
33.2K_0402_1%~D
12
PR146
12
0_0402_5%~D
12
12
PC212
@
0.01U_0402_25V7K~D
ISL88731_VREF
12
PC254
0.1U_0402_16V7K~D
PC119
PR362
PR363
PR364
2.2K_0402_5%~D
12
0.01U_0402_25V7K~D
PR475
GNDA_CHG GNDA_CHG
GNDA_CHG
PC102
12
ISL88731_ICM
ISL88731_VREF
12
PC255
100P_0402_50V8K
GNDA_CHG GNDA_CHG GNDA_CHGGNDA_CHG
GNDA_CHG
12
12
PC120
@
0.1U_0402_10V7K~D
1M_0402_1%~D
12
2
IN-
3
IN+
12
PC256
100P_0402_50V8K
+5V_ALW
PU8
22
DCIN
2
ACIN
13
ACOK
11
VDDSMB
10
SCL
9
SDA
14
NC
8
ICM
6
VCOMP
5
NC
4
ICOMP
3
VREF
7
NC
12
GND
29
GND
PR365
GNDA_CHG
4
G
O
P
8
1
28
NC
CSSP
ISL88731_TQFN28~D
PU19A
LM393DR_SO8~D
1
12
PC258
PC257
100P_0402_50V8K
0.01U_0402_25V7K~D
THIS SHEET OF EN GINEE RING D RAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED B Y OR D ISCLOS ED T O ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
27
26
VCC
CSSN
BOOT
VDDP
UGATE
PHASE
LGATE
PGND
CSOP
CSON
VFB
NC
12
GNDA_CHGG N DA_CHGGNDA_CHG
PR275
0_0603_5%~D
25
12
PC203
ISL88731_VDDP
21
24
23
1
2
20
19
18
17
15
16
+5V_ALW+3.3V_ALW
12
PR366
100K_0402_1%~D
12
PC259
@
10P_0402_50V8J~D
3
0.1U_0603_25V7K~D
PR360
12
0_0603_1%~D
PC253
@
220P_0402_50V7K~D
12
PR368
0_0603_5%~D
PR367
100K_0402_5%~D
2
G
PQ81
RHU002N06_SOT323
12
12
13
D
S
1U_0603_10V6K~D
12
PD40
1U_0603_10V6K~D
@
21
RB751V_SOD323~D
+VCHGR
PC202
12
PR274
33_0603_1%~D
PC204
12
GNDA_CHG
12
PR474
@
GNDA_CHG GN DA_CHG
GNDA_CHG
@
12
PAD-OPEN1x1m
ADAPT_OC 38
1K_0402_5%~D
PC267
PJP65
5
6
12
3300PF_0402_50V7K~D
+5V_ALW
IN+
IN-
578
36
8
P
G
4
241
O
PQ75
SI4800BDY-T1_SO8~D
+VCHGR_B
578
36
241
7
PU19B
LM393DR_SO8~D
2
578
PQ79
SI4800BDY-T1_SO8~D
36
241
PL20
+VCHGR_L
5.6U_HMU1356-5R6_8.8A_20%~D
PQ76
SI4810BDY_SO8~D
12
Maximum charging current is 6.24A
1
10U_1206_25V6M~D
1
2
2
PC106
10U_1206_25V6M~D
+VCHGR
1
12
PC112
0.1U_0603_25V7K~D
1
2
2
PC113
PC114
10U_1206_25V6M~D
10U_1206_25V6M~D
PC379
10U_1206_25V6M~D
PD54
@
PR373
@
1K_0603_1%~D
1
2
12
PC103
2200P_0402_50V7K~D
0.01_2512_1%~D
12
10_0402_1%~D
PR473
0.22U_0402_6.3V6K
1
2
PC104
PR145
PC384
12
12
PC105
0.1U_0603_25V7K~D
4
3
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Charger
LA-3302P
4966Thursday, March 01, 2007
1
of
+5V_ALW
21
1SS355_SOD323~D
12
0.0
Page 50
5
4
3
2
1
+DC_IN discharge path
PQ62
SI4835BDY-T1-E3_SO8~D
8
DD
PQ65
8
7
+VCHGR
CHG_SBAT_N
13
D
PQ67
CHG_SBATT38
CC
CHG_PBATT38
2
G
2
G
+VCHGR
RHU002N06_SOT323
S
S
RHU002N06_SOT323
PQ68
D
13
CHG_PBAT_N
6
5
PR309
10K_0402_5%~D
PR312
10K_0402_5%~D
5
7
8
CHG_SBAT
1
D2
S2
CHG_SBATT_N
2
G2
D2
3
S1
D1
4
D1
G1
FDS4935BZ_SO8~D
100K_0402_5%~D
12
0.1U_0603_25V7K~D
CHG_SBATT_N
0.1U_0603_25V7K~D
12
100K_0402_5%~D
12
PQ71
4
SI4835BDY-T1-E3_SO8~D
PR310
PC234
12
PC235
PR313
36
2
1
12
CHG_PBATT_N
12
CHG_PBAT
ACAV_IN18,39,49
PQ72
4
SI4835BDY-T1-E3_SO8~D
36
2
1
PBATT+
5
7
8
SBATT+
@
100K_0402_5%~D
+SDC_IN
2
PR308
G
12
PQ69
SI4835BDY-T1-E3_SO8~D
1
2
36
4
13
D
PQ63
RHU002N06_SOT323
S
8
7
5
PR305
10K_0402_5%~D
2
G
2
3
12
13
D
S
PD48
RB715F_SOT323
7
5
PR306
10K_0402_5%~D
PQ64
RHU002N06_SOT323
21
SI4835BDY-T1-E3_SO8~D
8
7
5
SBAT_G
1
B540C~D
21
SI4835BDY-T1-E3_SO8~D
8
7
5
12
PD47
B540C~D
PQ66
PR311
PD49
PQ70
4
4
12
33K_0402_5%~D
4
1
2
36
PR307
100K_0402_5%~D
12
1
2
36
1
2
36
+PWR_SRC
12
PC233
PC232
2200P_0402_50V7K~D
+PWR_SRC
+
PC382
2
100U_25V_M~D
0.1U_0603_25V7K~D
1
12
1
+
PC381
2
100U_25V_M~D
PR316
12
47K_0402_1%~D
PR314
PR315
470K_0402_5%~D
BB
PR319
SBATT+
PR321
147K_0402_1%~D
12
PBATT+
PC236
12
+3.3V_ALW
PU15
5
TC7SH32FU_SSOP5~D
2
AA
PBAT_DSCHG38
SBAT_PRES#38,44
5
P
I0
O
1
I1
G
3
@
4
PQ74
RHU002N06_SOT323
0.1U_0603_25V7K~D
13
D
2
G
S
PR323
12
IN+
IN-
8
P
G
4
PC237
0.1U_0603_25V7K~D
7
O
LM393DR_SO8~D
PU14B
12
1
RB715F_SOT323
PD51
2
3
42.2K_0402_1%~D
PR324
10K_0402_5%~D
12
12
PR325
100K_0402_5%~D
PR326
12
32.4K_0402_1%~D
5
6
+3.3V_ALW
4
47K_0402_1%~D
12
PR322
100K_0402_5%~D
12
+3.3V_ALW
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
NVG86 Ground
LA-3302P
5566Thursday, March 01, 2007
1
0.4
of
Page 56
5
R829,R830 for G86
R402,R403 for G72MV.
R829,R402 and R830,R403 place overlap
R831,R832 for G86
R404,R405 for G72MV.
R831,R404 and R832,R405 place overlap
R831
2@
487_0402_1%~D
12
R404
1@
909_0402_1%~D
+1.8V_RUN
100P_0402_50V8J~D
0.01U_0402_16V7K~D
VREF_SW_A2
13
D
2
G
S
Q67
2N7002W-7-F_SOT323-3~D
1@
909_0402_1%~D
12
R832
2@
487_0402_1%~D
L83 BLM18PG181SN1_0603~D
12
12
L85 BLM18PG181SN1_0603~D
12
511_0402_1%~D
12
R745
R405
12
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Serial SST45VF=10, LPC=11
VBIOS on card (pull high)
VBIOS with system BIOS (pull down)
PEX_PLL_TERMMIOAD0
For GDDR1
MIOBD0
RAM_CFG[3:0]
MIOBD1
MIOBD8
MIOBD9
For GDDR3
+3.3V_RUN
12
R198
8
7
6
5
10K_0402_5%~D
R183
U21
1
2
3
12
XIN/CLKIN
XOUT
VSS
VDD
D_C
PD#
ModOUT4REFCLK
P1819GF-08SR_SO8~D
8Mx32 DDR monolithic (64bit)
300MHz, 1.8V
8Mx32 DDR monolithic (32bit)
300MHz, 1.8V
8Mx32 DDR (Samsung K4D55323QF-GC)
300MHz, 1.8V
4Mx32 DDR generic (64bit)
1.8V I/O
4Mx32 DDR generic (32bit)
1.8V I/O
Infineon 16Mx32
500MHz, 1.8V
Hynix 16Mx32
500MHz, 1.8V
Samsung 16Mx32
500MHz, 1.8V
+3VL
12
R199
10K_0402_5%~D
1
C297
2
10U_0805_10V4Z~D
1
C282
2
Value
01
0
0001
1001
0010
0100
1100
0001
0010
0011
L19
BLM18AG121SN1D_0603~D
12
0.1U_0402_10V7K~D
*
+3.3V_RUN
S0
-1.75% (DOWN)
AA
±0.875% (CENTER)01
S0 Internal pull up
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
NVG86 Spread Spectrum & Strapping
LA-3302P
5766Thursday, March 01, 2007
1
of
0.4
Page 58
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
3808/2/2006Pop R108, depop R106CompalBID change to X01X011
1808/10/2006 CompalChange SOT23 package to SOT323 packageChange Q102, Q59 to SOT323 packageX012
7308/21/2006 CompalBITS issue WI86517 (S5 state back driver issue)Change R324 pin1 connect from +3.3V_ALW to +3.3V_SUS
HW
HW
HW
Owner
44108/21/2006 CompalBits issue WI84312 (Derating issue)Change R151 from 30 ohm to 75 ohmHW
235
6
3908/21/2006 CompalBits issue WI86511HWAdd R401 (100K) for signal BC_DAT pull up to +3.3V_ALWX01
Bits issue WI86509Compal08/21/2006
Populate R761 and change value from 100k to 10k.
Change R761 pin1 connect from +3.3V_ALW to +3.3V_SUS
73708/21/2006 CompalBits issue WI86512
823HW08/21/2006 CompalBits issue WI86516
CC
10
08/21/20069
08/21/2006 CompalBits issue WI8653238,39HW
Bits issue WI86518CompalX01HW38,39
R509 PU for SIO_EXT_SMI# change from +3.3V_ALW to
+3.3V_SUS to prevent backdrive through the ICH in S4/S5
Swap PSID GPIO from ECE5018 pin 71 with MEC5025
ITP_DBRESET# pin 55
Swap BEEP (ECE5018 GPIOB[6]) with PLTRST_DELAY#
(MEC5025 SGPIO46)
Bits issue WI86752Compal08/21/2006
1221HWX01
08/30/2006 CompalBits issue WI86530
Bits issue WI86529Compal09/7/2006
1439HW
09/7/2006Compal
Bits issue WI86376. Due to increase in number of
payloads the BIOS is carrying
Move SB_NB_PCIE_RST# to GPIO4/PIRQG# pinF12 per M08
design
Move SB_WLAN_PCIE_RST# to GPIO3/PIRQF# U32 pin G11 per
M08 direction, add test point T1 on pin F18
Change U23 from ( ST M25P80 8M bit ) to ( MXIC
MX25L1605AM2C 16M bit )
1909/14/200643HWCompalBits issue WI90712Remove R73, R178, C192, and C193X01
2043HW09/14/2006 CompalBits issue WI90705
Add SMBus isolation circuit for WLAN,
R640,R645,R660,R662,Q45,Q46
X01
2134HW09/14/2006 CompalBits issue WI90696JMINI1 connect to +3.3V_RUN. Removed C427X01
2212HW09/14/2006 CompalShunt caps on LVDS for improving WWANAdd C181,C192,C193,C196,C207,C209 cross LVDS signalsX01
2327HW09/14/2006 CompalBits issue WI90516Remove C759 from mic amp bias circuit X01
2426HW09/14/2006 CompalBits issue WI90487Populate R541to cut BEEP level in halfX01
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Connect THERMTRIP_VGA# from U10 pinB13 to U10 pin A13.
Populate R186 for THERMTRIP_VGA# pull up
No stuff R516, add R690 (8.2K ohm) for pull up ICH8 pin
AF22 to +3.3V_SUS
Add Q68, Q69, R691, R692 for HDDC_EN and MODC_EN
circuits
Change connect R765 pin1, R623 pin1, R621 pin1, R766
pin1, R637 pin1, R300 pin1 from +5V_ALW to +5V_ALW2
Change R387,R389 from 1M to 2.7K. Add R778,R779 for
AUX_ON,AC_OFF
Change R730 from 100K to 4.7K ohm3139HW09/15/2006X01CompalBits issue WI92249
3257Remove R39HW09/15/2006 Compal
CC
3353,55HW
09/18/2006 CompalBits issue WI92289X01
Bits issue WI92188. The MIO_A_D0 signal has an internal
pull-down in the GPU
U10 (NV86) pin F11,F12 connect to test point T89,T90
for testing and debug
3423HW09/18/2006 CompalPLTRST_DELAY# move from ECE5018 GPOB[6] to ICH8 GPIO38 Bits issue WI92296X01
3534Bits issue WI92287,WI90716R660 and R662 connected to CLK_SCLK and CLK_SDATA. X01HW09/18/2006 Compal
36
57,37,
22,33,
28,19,
20
Compal09/18/2006
EMI solutions HW
Populate SSCG U21,R189,R198,R199,L19,C297,C282,R166.
depopR165. Populate RS232 C152,153,154,155,156,
157,158,159. Resume ICH_AZ_MDC_BITCLK C656,R123,C128.
Add R790,R791,C232, C267. Change L63,L65 from 0603size
to 0805size. Add C309,C316 for LOM. Add C427,C463 for
LVDS. Add fuse F3, R792 for CRT. Populate C660, R545 (10
ohm),C721 (10P)
3723,36HWBits issue WI92298
3823HW
BB
Bits issue WI92299
Move SIO_EXT_SCI# from to ICH8 GPIO11/SMBALERT# pin AG22
to GPO12 pin AC19. Remove D22 and R761 and net DOCK_DET#
ICH8 Pin AG22 tie to LOM_ICH_SMBALERT#. Add R793 (0 ohm)
series on LOM_ICH_SMBALERT# and LOM_SMB_ALERT#. Change
R730 pull up rail from +3.3V_ALW to +3.3V_LAN. Add R807
pull up to +3.3V_SUS for LOM_ICH_SMBALERT#
39
40
41
42
43
44
39HWBits issue WI9230109/18/2006 Compal
38,39
39,42HW09/18/2006
Compal09/18/2006HW39Add R795 (10K ohm) pull down for MEC5025 pin 14X01Bits issue WI92312
Compal29HW09/19/2006
27CompalHW09/19/2006Bits issue WI90510Add R796,R797 (0ohm) between L47/L48 and C728/C730X01
Move ALW_PWRGD_3V_5V from MEC5025 pin 18 to MEC5025
pin 29. Remove 3.3V_5V_SUS_PWRGD from MEC5025 pin 29
Swap DOCK_SMB_PME and DOCK_SMB_ALERT# from MEC5025 pin3
and ECE5028 pin76
Removed 3.3V_LAN_PWRGD from MEC5025 KSO15/GPIO5.
Remove U52,Q83,D29,R89,R98,R381,C784,C182,C183,C184
Populate R671~R678 and C866~C869. Change L69~L76 from
24NH to 36NH inductor
Solution DescriptionRev.Page#Title
X0127
X01
X01
X01
X0109/18/2006 Compal
X0109/18/2006 Compal
X01
X01HW09/18/2006 CompalBits issue WI92305
X01CompalBits issue WI92308
X01EMI issue
Request
45
AA
57HWCompal09/20/2006EMI requestAdd R798~R803 for strap dampingX01
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3302P
5966Monday, February 26, 2007
1
0.4
of
Page 60
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
483809/20/2006 Compal
4933X0109/21/2006 Compal
503409/21/2006 CompalX01
51Bits issue WI93403C484 change to 33pF, C861/C862 change to 22pF 609/25/2006 CompalX01
1809/20/2006 Compal46HWBits issue WI92860Depop Q39 and R427X01
2809/20/2006 Compal47
HWBits issue WI92858
HWBits issue WI92857Add no-stuff series 0-ohm for ITP_DBRESET# on ECE5028X01
HWBits issue WI93157Remove R586 and make JMDC pin2 NC
HWBits issue WI93158Depop Q45, Q46
HW
Owner
Change R669 to from 1.15K to 1.13K. Depop C771 & C772.
Change C861 and C862 to 22pF
No Populate C866-C869/R671-R67852HWBits issue DF86424
Add D37-D40 for stick point signalsEMI requestHW40X01Compal09/26/2006
Change R603 from 6.2k to 5.9k.
Change C805 from 820pF to 270pF
No stuff R227, R221, C89, C93, C97, c401, C92, r72, C90,
C94. No stuff C775-C781, C785. No stuff R514 (no iAMT).
Populate R515.
59
36HWDell10/14/2006Bits issue WI97539
Bits issue WI97837Dell10/17/2006HW960
BB
61X02
23HW10/18/2006 Dell
Bits issue WI98222 (Change for ASF2.0 due to ICH8M errata ) 1. No stuff R502, R503
Added signal DOCK_DET# to JDOCKBpin137, pin205 and
Q3pin2
Add 0.1 uf (0402) caps on +Vcc_Core to Gnd. Four
total, bottom of board. (C870 ~ C873)
2. Connect the pad of R503.2 to the pad of R498.2
3. Connect the pad of R502.1 to the pad of R499.2
Board ID Changed to X02Dell10/24/2006HWPopulated R106, R107. Depopulated R108, R109.3862
Solution DescriptionRev.Page#Title
X01
X012909/26/2006 Compal
X01
X02
X02
X02
Request
Dell10/24/2006HWThe DevID for G86 on Briscoe needs to be updated to 10113862X02
6323HW11/16/2006 DellBits issue WI104573X02
Bits issue WI98660
Add R816,C874 for USB_IDE#. R817,C875 for SIO_EXT_WAKE#.
R819,C876 for PCIE_MCARD1_DET#. R820,C878 for
USB_MCARD1_DET#. R818,C877 for USB_MCARD2_DET#. Remove
net RSVD_GPIO6 and R513
646,23,34
HW11/16/2006 DellBits issue WI103311
Change R309 from 8.2K to 2.2K. No stuff R820.
No stuff R550
X02
6539HW11/18/2006X02Change C379 from 22pF to 33pF per KDS X'tal reportDellBits issue WI103986
66HWBits issue WI105207X0325,4111/20/2006 Compal
AA
Change net name from +5V_ALW2 to +3.3V_ALW2 at R618.1,
R626.1, R623.1, R621.1, R766.1, R765.1, R637.1, R300.
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3302P
6066Monday, February 26, 2007
1
0.4
of
Page 61
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
Owner
Dell11/21/2006HW2867X02Bits issue WI105200
Change L64,L66,L67,L68 from BLM18AG601SN1D to
BK1608LM182. Change R668 to L88 BK1608LM182.Change L63,
L65 from BLM21AG601SN1D to BK2125LM182.
Depop R697,change R286 to 0 ohm.Pop L53,depop L16.Pop
L27,C314,C315.Depop L20,L21,pop L54,L55.Depop L17.
Change R794 pin1 from +5V_ALW to +3.3V_ALW.
Change R245 pin1 from +3.3V_ALW to +5V_ALW
Add 100kohm resistor R721 between U35 pin 40 and
+3.3V_RUN and 1000pF cap C759
Please populate R820 with a 4.7k-ohm resistor. Move
signal PCIE_MCARD2_DET# from ICH8m GPIO20 pinAE11 to
69
Dell11/21/2006HW6,54,57X02
38,39HW11/21/2006 Dell
Bits issue WI10571268
26HW11/21/2006 Dell
21,23,34HWX02
12/1/2006Dell71Bits issue WI106999
PIRQH#/GPIO5 pinB3. Delete R457 and net
ICH_GPIO5_PIRQH#. Populate R550
41HWPopulate C208 7212/1/2006DellBits issue WI107466. +2.5V_LAN in-rush current test fai.X02
736HW12/5/2006Change R286 from 0 ohm to 33 ohmsDellBits issue WI107881X02
CC
7427HW12/6/2006DellBits issue WI107896Change R554 from 10K to 0 ohmX02
7536,38HW12/6/2006DellBits issue WI108259. Per M08 GPIO map rev A15 Change list Change net DOCK_SMB_PME to DOCK_SMB_PME#X02
HW
Bits issue WI108223Dell12/6/2006976X02
Change C177,C179,C178,C366,C338,C365 to
EEFSX0D221E7 220uF
HWBits issue WI109622. Per NB8M PUN documentChange R35 from 60.4 ohm to 40.2 ohm775212/12/2006 DellX02
HW785512/13/2006Bits issue WI109627Change R174 from 40.2 ohm to 30 ohmDellX02
79HW3912/14/2006 DellBits issue WI110179
HW2780Bits issue WI110158Dell12/15/2006X02
8126X02
BB
HW12/18/2006 DellBits issue WI110749
82Bits issue WI111288Dell12/20/2006HW29X02
8312/25/2006 DellChange AC Coupling Cap SPEC for PCIE
12,23
28
HW
841/5/2007Dell54,55HWBits issue WI113179
Add EC_FLASH_PAD pin1 connect to +3.3V_ALW,pin2 connect
to R76 pin1 and R80 pin1
Add R822 (1M_0402) from Pin 10 (C1P) pin of MAX9789A
to ground
Add R823 (10K_0402) to ground on pin 47 of STAC9205
(U37)
Change R683 from 150ohms to 110 ohms, R684from
150ohms to 200ohms
Change C500~C531,C664,C666~C670,C851,C853 from 0.1uF Y5V
to 0.1uF X7R
Change R174 to 24.9 ohm for G86, Add R824 40.2 ohm for
G72. Change R35 to 45.3 ohm G86, add R825 60.4 ohm for
G72MV
8556HW1/5/2007DellBits issue WI113180Add R826,R827 243 ohm for G86X03
Solution DescriptionRev.Page#Title
X02Bits issue WI105754
X0270Bits issue WI105758. Updates for potential Back Drive
X02
X02
X03
Request
8653,56HW1/5/2007DellBits issue WI113227Add R828,R829,R830,R831,R832 487 ohm for G86X03
8738HW1/5/2007DellChagne Board ID to X03Populate R108, de-pop R106X03
Dell1/8/2007HW688X03Change U10 value to G86-620-A2. Add R833=147 ohm with
AA
Bits issue WI113588
R697 use 1@ for G72. R286=33 ohm use 2@ for G86.
Change R48 note to "Reserved for GFx debug".
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3302P
6166Monday, February 26, 2007
1
0.4
of
Page 62
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
891/26/2007DellBits issue WI115658. M08 GPIO map rev A16 changeX03Change ECE5028 GPIOF4 from BID2 to CHIPSET_ID.38HW
Owner
90X03232/12/2007DellBits issue WI121957Add R834 (1M_0402_1%) for ICH_LAN_RST#HW
Bits issue WI121438Dell2/12/20072791Change R565 from 10K to 100k ohmHW
Bits issue DF11681392412/12/2007DellHWDepop C194, changed C815 from 4700pF to 2200pF
93542/14/2007DellModify pop option symbol for G72M/G86M power beadHWL53,L27,L55,L54, with 2@, L16,L17,L21, L20, with 1@
94572/14/2007DellModify NV strap tableHWChange GDDR3 table from 500 MHz to 700 MHz
95182/26/2007HWDellBits issue WI124164populate C640 = 10uF for G72MV. Add 1@ for C640
9654 57HW2/26/2007DellBits issue WI124408
CC
Add note "Populate C251, C255 for G86 and G72 solution
per Nvidia". Add 2@ for C314, C315, R805 and R57. Add
1@ for R49.
9754HW2/27/2007DellBits issue WI123608Change C233 from X5R to X7R
9823HW2/27/2007DellBits issue WI125173. Per Intel's latest recommendationChange R834 from 1M to 10KX03
9954HW2/28/2007DellBits issue WI123608Change C233 back to X5RX03
10018 52HW2/28/2007Dell
Bits issue WI124613. Need to connect THERMTRIP_VGA to the
thermal sensor for G86
Add 2@ for R756, R187, Q76, C203X03
10118HW3/1/2007DellBits issue WI125873. Populate circuit for THERMTRIP_MCH#Populate R427 and Q39X03
10227HW3/7/2007DellBits issue WI127300Change U40 from 74AHC1G08 to 74AHCT1G08X03
Solution DescriptionRev.Page#Titl e
X03
X03
X03
X03
X03
X03
X03
Request
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3302P
6266Wednesday, March 07, 2007
1
0.4
of
Page 63
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
CC
10
BB
11
12
48/50
10.1
2PWR
3PWR
4PWR
5
6
7
8
9
45change to correct parts for 15ALW
48
44
44PWR
46
45
47
49
51
47
44
Title
PWR
PWR
PWR
PWR
PWR
PWR
PWR
PWR
9/14
9/14
9/14
9/14
9/14
9/14
9/14
9/14
9/14
9/14
9/14
9/14
Owner
Elick
DELL
DELL
DELL
DELL
DELL
DELL
DELL
DELL
DELL
DELL
DELL
change the AL CAP to 2000hr
change to PSL of DELL
change to PSL of DELL
change to PSL of DELL
BITS-WI89364
The 0.9V_DDR_VTT_PWRGD net is not used at
the MEC5025.
The 0.9V_DDR_VTT_PWRGD net should be no
connect at the MEC5025 pin 73.
BITS-WI91011
change to correct current limits
following DELL rule
BITS-WI91289
be compliant with the reference schematic.
BITS-WI91295
Implement changes to 1.25V_RUN and
GPU Core regulators
BITS-WI91372
following DELL rule
BITS-WI91682
DC IN schematic changes.
change PC380 from SF10004M08L to SF000000S8L.
change PC381 from SF10004M08L to SF000000S8L.
change PC382 from SF10004M08L to SF000000S8L.
change PD55 from SCSB717F08L to SCS00001U8L.
change PD56 from SCSB717F08L to SCS00001U8L.
change PH2 from SL20000030L to SL200000F8L
change PL1 from SM01001680L to SM010008U0L.
change PL2 from SM01001418L to SM010009C8L.
change PL34 from SM01001418L to SM010009C8L.
remove PR437, PR438, PR441, PQ93 and PQ94.
Change PR383 from 124K(SD03412438L) to 150K(SD03415038L).
Change PR382 from 187K(SD03418738L) to 226K(SD03422638L).
Depopulate PR415 and PR416 resistors.BITS-WI91278
Change PR274 from 4.7 ohm(SD000006T8L) to 33 ohm(SD014330A8L).
Populate PR373 and PD54.
Add PC410 10uF, 1206, 25V at the input rail (+PWR_SRC) of
the 1.25V_RUN regulator.
Change PR460 from 0 ohm(SD01300008L) to 1 ohm(SD013100B8L).
Change PR459 from 0 ohm (SD01300008L) to 1 ohm(SD013100B8L).
Change PR449 ground connection from AGND to PGND.
Change PR408 from 75K(SD03475028L) to 82.5K(SD00000278L).
Change PL1 from SM01001680L to SM010008U0L.
Change PQ100 from SI2301BDS(SB923010020) to
PQ100A depopulated IMD2A(SB000009N8L).
Change PQ101 from SI2301BDS(SB923010020) to
PQ100B depopulated IMD2A(SB000009N8L).
Change PR12 from 10K,0603(SD01310028L) to 4.7K,0805(SD00247018L).
Solution DescriptionRev.Page#
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
Request
13
14
AA
15
45PWR9/ 14DELLBITS-WI90985
45
51
PWRBITS-WI90988
PWR9/15DELL
9/14DELL
following DELL rule
Change PQ83 from FDS8880 to
BSC079N03SG PPAK
BITS-WI92173
correct the current limit on
GPU CORE regulator
Change PC285 pin 2 pad connection
from PGND to AGND.
Change PQ83 from SB000004U8L to SB000004D8L.
Change PR451 from 140K(SD03414038L) to 182K(SD03418238L)
0.1
0.1
0.1
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Changed-List History 1
Size Document NumberRev
Date:Sheet
LA-3302P
1
6366Monday, February 26, 2007
of
0.6
Page 64
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
16PWR
17
18
19
CC
20
21
22
BB
23
519/15DELLBITS-WI92161
46
46
48
51
51
44
48/50
PWR
PWR
PWR
PWR
PWR
PWR
PWR
9/15DELL
9/18DELL
9/18DELL
9/18DELL
9/20El ickchange GPU_CORE voltagechange PR446 from 10k to 13.7k(SD03413728L)0.1
9/21DELL
9/21DELL
Owner
correct the current limit on
1.25V_RUN regulator.
BITS-WI91932
correct the current limit on
1.8V output
BITS-WI92459
follow BITS of DELL
BITS-WI92462
improve transients at load dump.
and reduce jittering.
BITS-WI87245
PWRGD signals are reversed coming from the
wrong side of the IC.
BITS-WI91682
change PL1 from BK1608HM to BLM18BD102SN1D.
BITS-WI87563
change populate PC380 from 25CE100AX
to 25CE100LS
change PC381 from 25CE100AX to 25CE100LS
change PC382 from 25CE100AX to 25CE100LS
Change PR453 from 140K(SD03414038L) to 205K (SD03420538L)0.1
Change PR202 from 61.9K(SD03461928L) to 100K (SD03410038L)0.1
change PR193 to be populate.
change PR506 to be populate.
change PR505 to be depopulate.
Add depopulate PR516(SD03410018L) and depopulate PC413(SE076103K8L)
between pin 9 of PU11 and AGND.
Add depopulated PC411(SE075472K8L),4700pF between pin 14 of PU11 and AGND .
Add depopulated PC412(SE075472K8L),4700pF between pin 15 of PU11 and AGND
Change the node name at pin 13 of PU25 from GFX_CORE_PWRGD to
1.25V_RUN_PWRGD.
Change the node name at pin 28 of PU25 from 1.25V_RUN_PWRGD to
GFX_CORE_PWRGD .
Remove +3.3V_RUN node connected to pin 2 of PR462.
Remove +3.3V_ALW node connected to pin 1 of PR483.
Remove +3.3V_ALW node connected to pin 1 of PR450.
Remove totally PR462 pad, PR483, PR450.
change PL1 from SM010008U0L to SM010007C8L.0 . 1
change populate PC380 from SF000000S8L to SF000000T8L.
change PC381 from SF000000S8L to SF000000T8L.
change PC382 from SF000000S8L to SF000000T8L.
Solution DescriptionRev.Page#Titl e
0.1
0.1
0.1
0.1
Request
24
25
26
27
AA
2848PWR10 /27
49
49
49
49
PWR
PWR
PWR
PWR
9/29
9/29
9/29
9/29
DELL
DELL
DELL
DELL
DELL
match Maxim's response time of ICM input
to comparator.
ICM is voltage source and does not
need this component.
Increase BW from 20kHz to 25kHz while
maintaining 80degrees phase margin.
following DELL rule
Add bead to connect +PWR_SRC to
+CPU_PWR_SRC
change PR361 from 0 Ohm (SD02800008L) to 8.45K (SD00000068L).
change PC254 from 0.01uF 25V (SE068103K8L) to 0.1uF 16V (SE076104K8L).
depopulate PR150.
change PR148 from 4.7K (SD03447018L) to 10K (SD03410028L).
depopulate PD54 and PR373
Add PL47(SM01002078L) to parallel PJP30.
0.1
0.1
0.1
0.1
0.2
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Changed-List History 2
Size Document NumberRev
Date:Sheet
LA-3302P
6466Monday, February 26, 2007
1
of
0.6
Page 65
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
CC
34
45,46,
47,51
3049
3145
3249
3348
51
PWR
PWR
PWR
PWR
PWR
PWR
10/27DE LL
11/20DE LL
12/06DELL
12/06DELL
01/04ELICKEMI CLK issue
Owner
DELL10/2729
BITS-WI99895
This is to add an optional ultrasonic mode
in case the regulators experience an
audible noise.
BITS: WI102600
Change PR148 from 10K_0402_1% to 2.2K_0402
_5%
BITS-WI105406
Add node name +3.3V_ALW2 for the trace
connected to the pin 5 (VREF3) of PU20.
Populate PC285 with 0.1uF cap.
BITS-WI106278
make sure that PC113, PC114 and PC379 are
X5R/X7R caps, need to stuff PC379.
BITS-WI108229
Change PC187 from 10nF to 15nF.
Change PR258 from 2.21K to 1.69K.
Populate PR516 with 1K resistor.
Populate C413 with 0.01uF.
Add PR517 0 ohm 0402(SD02800008L) between pin 29 of PU20 and AGND .
Add PR519 0 ohm 0402(SD02800008L) between pin 29 of PU21 and AGND .
Add PR520 0 ohm 0402(SD02800008L) between pin 29 of PU25 and AGND .
Add PR518 0 ohm 0402(SD02800008L) between pin 26 of PU6 and AGND .
change PR148 from 10k 0402 1%(SD03410028L) to 2.2k 0402 5%(SD02822018L)0 .3
Add node name +3.3V_ALW2 between pin5 of PU20 and PC285.
Populate PC285.
change PC379 is populated.0.3
change PR187 from 10nF(SE076103K8L) to 15nF(SE076153K8L).
change PR258 from 2.21K(SD03422118L) to 1.69K(SD00000JB8L).
populate PC413.
populate PR516.
Add PL3 to parallel PJP54.
add PC414 to connect between GPU_CORE to GND.
add PC415 to connect between GPU_CORE to GND.
Solution DescriptionRev.Page#Titl e
0.2
0.3
0.3
0.3
Request
change PR138 from SD021100D8L to SD021100D3L(S RES 1W .01 +-1% 2512
BB
3549PWR01/25EL ICKchange to new part number for PSL
change bead to 9A 1812 in DC-IN.3644PWR01/26ELICK0.4
BITS-WI119950
3745/47/51PWR02/05DE LL
3849PWR02/06DELL
AA
394 9P WR02/12DELLdelete 1206 resistor on +VCHGR
Increase current limits for 3.3V, 1.5V
and GPU_CORE regulators.
additional 1206 resistor on +VCHGR for
Maxim solution.
not to implement for Maxim solution.
FOR M08 PROJECTS)
change PR145 from SD021100D8L to SD021100D3L(S RES 1W .01 +-1% 2512
FOR M08 PROJECTS)
change PL2 from SM010009C8L(TAIYO FBMJ4516HS720NT 1806)
to SM01000BI0L(KC FBCA-K5B-302340-L1-T 1812 ).
change PL32 from SM010009C8L(TAIYO FBMJ4516HS720NT 1806)
to SM01000BI0L(KC FBCA-K5B-302340-L1-T 1812 ).
change PR382 from 226K to 267k (SD02822018L).
Change PR408 from 82.5K to 100K(SD03410038L).
Change PR451 from 182K to 205K(SD03420538L) .
add an unpopulation PR522 (1.8K 1206 1%(SD00000JN8L))between
+VCHGR to PGND.
delete an unpopulate PR520 (1.8K 1206 1%(SD00000JN8L))between
+VCHGR to PGND.
0.4
0.4
0.4
0.4
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Changed-List History 2
Size Document NumberRev
Date:Sheet
LA-3302P
6566Monday, February 26, 2007
1
of
0.6
Page 66
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
4051PWR02 /26DELL
CC
Owner
BITS-WI123151
GPU Core Voltage for G86MV is staying at
1.15V all the time
Nostuff: PR447, PR457, PC370, PR452, PQ98, PR461, PC371, PR458, PQ99,
PR454, PR455.
Change 2@PR449 from 20.5K to 18.7K 0402 1%(SD03418728L )
Add 2@PR522 = 196K, 0402. <-- This would be a 2@ resistor added in
parallel to the existing PR451
Solution DescriptionRev.Page#Titl e
0.4
Request
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Changed-List History 2
Size Document NumberRev
Date:Sheet
LA-3302P
6666Thursday, March 01, 2007
1
of
0.6
Page 67
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.