PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Index and Config.
LA-3301P
358Wednesday, February 14, 2007
1
1.0
of
5
4
3
2
1
RUN_ON
FDS4435
(Q24)
+INV_PWR_SRC
ADAPTER
DD
+15V_ALW
SI4810DY
RUN_ON
SI4810DY
(Q58)
+3.3V_RUN
(Q52)
+5V_RUN
BATTERY
CHARGER
+PWR_SRC
ISL6260
(PU11)(PU22)
RUNPWROK
+VCC_CORE
DDR_ON
+1.8V_SUS
ISL6236
+1.25V_RUN
M_ON
ISL6236
(PU21)
1.05V_RUN_ON
+1.05V_VCCP
1.5V_RUN_ON
+1.5V_RUN
ISL6236
(PU20)
ALWON
ALWON
ENAB_3VLAN
+5V_ALW
+3.3V_ALW
RUN_ON
SI3456BDV
CC
SUS_ON
0.9V_DDR_VTT_ON
RUN_ON
(Q69)
+3.3V_LAN
+5V_SUS
+3.3V_SUS
TPS51100
(PU24)
SI3456BDV
(Q54)
REGCTL_PNP25
BB
BCP69MMJT9435T1G
(Q70)
SI3456SI3456BDV
HDDC_EN#
+5V_HDD
AA
(Q48)(Q56)
MODC_EN#
+5V_MOD
MAX9789A
(U37)
AUDIO_AVDD_ON
+VDDA
+0.9V_DDR_VTT
+1.8VRUN
+2.5V_LAN+1.2V_LAN
REGCTL_PNP12
(Q71)
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
For the purpose of testability, route these signals
through a ground referenced Z0 = 55ohm trace that
ends in a via that is near a GND via and is
accessible through an oscilloscope connection.
Resistor placed within 0.5" of
CPU pin.Trace should be at least
25 mils away from any other
toggling signal. COMP0, COMP2
trace should be 27.4 ohm.
COMP1, COMP3 should be 55
ohm.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Place these inside
socket cavity on L8
(North side
Secondary)
DD
Place these inside
socket cavity on L8
(Sorth side
Secondary)
Place these inside
socket cavity on L8
(North side
Primary)
Place these inside
socket cavity on L8
(Sorth side
Primary)
CC
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
C329
10U_0805_4VAM~D
C222
10U_0805_4VAM~D
C363
10U_0805_4VAM~D
C364
10U_0805_4VAM~D
1
C330
10U_0805_4VAM~D
2
1
C223
10U_0805_4VAM~D
2
1
C64
10U_0805_4VAM~D
2
1
C50
10U_0805_4VAM~D
2
1
C331
10U_0805_4VAM~D
2
1
C224
10U_0805_4VAM~D
2
1
C65
10U_0805_4VAM~D
2
1
C51
10U_0805_4VAM~D
2
1
C332
10U_0805_4VAM~D
2
1
C225
10U_0805_4VAM~D
2
1
C66
10U_0805_4VAM~D
2
1
C52
10U_0805_4VAM~D
2
4
1
2
1
2
1
2
1
2
C333
10U_0805_4VAM~D
C227
10U_0805_4VAM~D
C67
10U_0805_4VAM~D
C53
10U_0805_4VAM~D
1
C334
10U_0805_4VAM~D
2
1
C226
10U_0805_4VAM~D
2
1
C68
10U_0805_4VAM~D
2
1
C54
10U_0805_4VAM~D
2
1
C335
10U_0805_4VAM~D
2
1
C228
10U_0805_4VAM~D
2
10uF 0805 X6S -> 85 degree C
3
1
C336
10U_0805_4VAM~D
2
1
C229
10U_0805_4VAM~D
2
1
C55
10U_0805_4VAM~D
2
1
C69
10U_0805_4VAM~D
2
1
C190
10U_0805_4VAM~D
2
1
C185
10U_0805_4VAM~D
2
2
1
High Frequence Decoupling
Near VCORE regulator.
+VCC_CORE
+VCC_CORE
1
C870
0.1U_0402_10V7K~D
2
@
BITs WI97840
1
+
C365
2
1
C293
0.1U_0402_10V7K~D
2
North Side Secondary
1
+
2
220U_X_2VM_R7M~D
1
2
C250
0.1U_0402_10V7K~D
ESR <= 1.5m ohm
Capacitor > 1980uF
1
C310
0.1U_0402_10V7K~D
2
1
C264
0.1U_0402_10V7K~D
2
Place these inside
socket cavity on L8
(North side
Secondary)
South Side Secondary
C177
BB
AA
220U_X_2VM_R7M~D
1
+
2
+1.05V_VCCP
1
2
1
+
C178
C179
2
@
220U_X_2VM_R7M~D
C312
0.1U_0402_10V7K~D
220U_X_2VM_R7M~D
1
+
2
1
2
1
+
C338
C366
2
@
220U_X_2VM_R7M~D
C256
0.1U_0402_10V7K~D
220U_X_2VM_R7M~D
1
C871
0.1U_0402_10V7K~D
2
@
1
C872
0.1U_0402_10V7K~D
2
@
1
C873
0.1U_0402_10V7K~D
2
@
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Crestline(2 of 6)
LA-3301P
1158Monday, February 26, 2007
1
1.0
of
5
4
3
2
1
Strap Pin Table
DMI X2 Select
PCI Express
Graphic Lane
FSB Dynamic
ODT
DMI Lane
Reversal
SDVO/PCIE
Concurrent
Operation
Low = DMI x 2
High = DMI x 4 (Default)
Low = Reverse LaneCFG9
High = Normal O p e r a t i o n ( Default)
Low=Dynamic O D T Disable
High=Dynamic ODT Enable(default)
Low=Normal (default)
High=Lane Reversed
Low=Only SDVO or PCIEx1 is
operational (defaults)
High=SDVO and P C I E x 1 a r e o p e rating
simultaneously via PEG port
Low=No SDVO Device Present
High=SDVO Device Present (default)
R383
2.2K_0402_5%~D
G_CLK_DDC2
G_DAT_DDC2
+3.3V_RUN
2
NO CONNECT FOR DISCRETE
12
12
R384
2.2K_0402_5%~D
Q36
D
S
13
G
+3.3V_RUN
2
G
2
Q37
13
D
S
CLK_DDC2
DAT_DDC2
R3654.02K_0402_1%~D@
CFG510
CFG910
CFG1610
12
R3684.02K_0402_1%~D@
12
R3724.02K_0402_1%~D@
12
CFG[3:17] have internal pullup
R3734.02K_0402_1%~D@
CFG1910
CFG2010
12
R3744.02K_0402_1%~D @
12
CFG[18:19] have internal pulldown
BSS138_SOT23~D
BSS138_SOT23~D
CLK_DDC2 20,36
DAT_DDC2 20,36
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Crestline(3 of 6)
LA-3301P
1258Monday, February 26, 2007
1
+3.3V_RUN
1.0
of
BIA_PWM19
DD
R369 = 2.4k ohm value is
recommended per Intel
CC
TV_CVBS36
TV_Y36
TV_C36
CRT_BLU20,36
CRT_GRN20,36
CRT_RED20,36
BB
R378
R379
12
12
150_0402_1%~D
150_0402_1%~D
+3.3V_RUN
AA
12
R412.2K_0402_5%~D
12
R1102.2K_0402_5%~D
PANEL_BKEN38
LCD_DDCCLK19
LCD_DDCDATA19
ENVDD19
12
R369
3.3K_0402_1%~D
LCD_A0-19
LCD_A1-19
LCD_A2-19
LCD_A0+19
LCD_A1+19
LCD_A2+19
LCD_B0-19
LCD_B1-19
LCD_B2-19
LCD_B0+19
LCD_B1+19
LCD_B2+19
12
12
R377
R376
150_0402_1%~D
CRT_HSYNC20
CRT_VSYNC20
R3821.3K_0402_1%~D
Trace CRT_IREF should be at
least 20 miles away from any
other toggling signal.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
C533,C534,C536,C545,C553,C579 are being
replaced by 0-ohm 0805 resistor
+VCC_PEG
220U_D2_4VY_R15M~D
C548
1000P_0402_50V7K~D
C556
+1.25V_RUN
100U_D2E_6.3VM_R18M~D
R408
C569
1U_0603_10V4Z~D
1
2
C567
10U_0805_4VAM~D
R815
100_0603_5%~D
12
1
C570
2
0.1U_0402_16V4Z~D
1
C720
2
@
0.022U_0402_16V7K~D
C593
22U_0805_6.3VAM~D
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Layout Note:
Place one cap close to every 2 pullup
resistors terminated to +0.9V_DDR_VTT
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C139
C140
+0.9V_DDR_VTT
RN4
14
23
RN3
14
23
RN9
14
23
RN2
14
23
RN1
14
23
12
R223
56_0402_5%~D
RN7
23
14
2.2U_0603_6.3V6K~D
1
2
1
2
C141
C119
RN6
RN12
RN5
RN11
RN10
RN8
RN13
C117
1
2
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
2
C104
2.2U_0603_6.3V6K~D
1
2
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
C116
1
2
C118
0.1U_0402_16V4Z~D
1
2
C105
DDR_A_MA9
DDR_A_MA12
DDR_A_MA7
DDR_A_MA6
DDR_A_MA5
DDR_A_MA8
DDR_A_MA4
DDR_A_MA2
DDR_A_MA0
DDR_A_BS1
M_ODT0
DDR_A_MA13
DDR_A_MA14
DDR_A_MA11
0.1U_0402_16V4Z~D
Layout Note:
Place near JDIM1
0.1U_0402_16V4Z~D
1
1
2
2
C107
C106
4
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C109
C108
Layout Note:
Place these resistor
closely DIMM0,all
trace length<750 mil
Layout Note:
Place these resistor
closely DIMM0,all
trace length
Max=1.3"
4
3
+1.8V_SUS+1.8V_SUS
ON TOP SIDE
JDIM2
1
VREF
3
2.2U_0603_6.3V6K~D
C115
VSS
5
DQ0
7
DQ1
9
VSS
11
DQS0#
13
DQS0
15
VSS
17
DQ2
19
DQ3
21
VSS
23
DQ8
25
DQ9
27
VSS
29
DQS1#
31
DQS1
33
VSS
35
DQ10
37
DQ11
39
VSS
41
VSS
43
DQ16
45
DQ17
47
VSS
49
DQS2#
51
DQS2
53
VSS
55
DQ18
57
DQ19
59
VSS
61
DQ24
63
DQ25
65
VSS
67
DM3
69
NC
71
VSS
73
DQ26
75
DQ27
77
VSS
79
CKE0
81
VDD
83
NC
85
BA2
87
VDD
89
A12
91
A9
93
A8
95
VDD
97
A5
99
A3
101
A1
103
VDD
105
A10/AP
107
BA0
109
WE#
111
VDD
113
CAS#
115
NC/S1#
117
VDD
119
NC/ODT1
121
VSS
123
DQ32
125
DQ33
127
VSS
129
DQS4#
131
DQS4
133
VSS
135
DQ34
137
DQ35
139
VSS
141
DQ40
143
DQ41
145
VSS
147
DM5
149
VSS
151
DQ42
153
DQ43
155
VSS
157
DQ48
159
DQ49
161
VSS
163
NC,TEST
165
VSS
167
DQS6#
169
DQS6
171
VSS
173
DQ50
175
DQ51
177
VSS
179
DQ56
181
DQ57
183
VSS
185
DM7
187
VSS
189
DQ58
191
DQ59
193
VSS
195
SDA
197
SCL
199
VDDSPD
201
GND
TYCO_1470815-2~D
RESERVE
DDR_A_D0
DDR_A_D5
DDR_A_DQS#0
DDR_A_DQS0
DDR_A_D3
DDR_A_D7
DDR_A_D13
DDR_A_D12
DDR_A_DQS#1
DDR_A_DQS1
DDR_A_D10
DDR_A_D17
DDR_A_D21
DDR_A_DQS#2
DDR_A_DQS2
DDR_A_D22
DDR_A_D23
DDR_A_D29
DDR_A_DM3
DDR_A_D27
DDR_A_D30
DDR_CKE0_DIMMA10
DDR_A_BS211
DDR_A_BS011
DDR_A_WE#11
DDR_A_CAS#11
DDR_CS1_DIMMA#10
M_ODT110
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C707
C110
MEM_SDATA17,23
MEM_SCLK17,23
Non-iAMT
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Layout Note:
Place one cap close to every 2 pullup
resistors terminated to +0.9V_DDR_VTT
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C454
C455
+0.9V_DDR_VTT
RN23
14
23
RN24
14
23
RN17
14
23
RN18
14
23
RN25
14
23
12
R312
56_0402_5%~D
RN26
23
14
5
C412
C440
1
2
0.1U_0402_16V4Z~D
1
2
0.1U_0402_16V4Z~D
1
2
C453
C433
RN21
RN14
RN22
RN15
RN16
RN19
RN20
1
2
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
2
C452
1
2
C413
1
2
1
2
C451
DDR_B_MA9
14
DDR_B_MA12
23
56_0404_4P2R_5%~D
DDR_B_MA14
14
DDR_B_MA11
23
56_0404_4P2R_5%~D
DDR_B_MA5
14
DDR_B_MA8
23
56_0404_4P2R_5%~D
DDR_B_MA7
14
DDR_B_MA6
23
56_0404_4P2R_5%~D
DDR_B_MA4
14
DDR_B_MA2
23
56_0404_4P2R_5%~D
M_ODT2
14
DDR_B_MA13
23
56_0404_4P2R_5%~D
DDR_B_BS2
14
DDR_CKE2_DIMMB
23
56_0404_4P2R_5%~D
2.2U_0603_6.3V6K~D
2.2U_0603_6.3V6K~D
2.2U_0603_6.3V6K~D
2.2U_0603_6.3V6K~D
C438
1
2
0.1U_0402_16V4Z~D
C414
1
2
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
2
C450
Layout Note:
Place near JDIM2
C411
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C410
C409
4
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
2
C408
Layout Note:
Place these resistor
closely DIMM0,all
trace length<750 mil
Layout Note:
Place these resistor
closely DIMM0,all
trace length
Max=1.3"
0.1U_0402_16V4Z~D
1
1
2
2
C406
C407
4
3
ON BOTTOM SIDE
DDR_B_D0
DDR_B_DQS#0
DDR_B_DQS0
DDR_B_D6
DDR_B_D7
DDR_B_D8
DDR_B_D9
DDR_B_DQS#1
DDR_B_DQS1
DDR_B_D14
DDR_B_D15
DDR_B_D16
DDR_B_D21
DDR_B_DQS#2
DDR_B_DQS2
DDR_B_D19
DDR_B_D18
DDR_B_D24DDR_B_D28
DDR_B_D25
DDR_B_DM3
DDR_B_D26
DDR_B_D27
DDR_CKE2_DIMMB10
DDR_B_BS211
DDR_B_BS011
DDR_B_WE#11
DDR_B_CAS#11
DDR_CS3_DIMMB#10
1
2
C405
M_ODT310
MEM_SDATA16,23
MEM_SCLK16,23
Non-iAMT
DDR_CKE2_DIMMB
DDR_B_BS2
DDR_B_MA12
DDR_B_MA9
DDR_B_MA8
DDR_B_MA5
DDR_B_MA3
DDR_B_MA1
DDR_B_MA10
DDR_B_BS0
DDR_B_WE#
DDR_B_CAS#
DDR_CS3_DIMMB#
M_ODT3
DDR_B_D36
DDR_B_DQS#4
DDR_B_DQS4
DDR_B_D34
DDR_B_D40
DDR_B_D41
DDR_B_DM5
DDR_B_D42
DDR_B_D53
DDR_B_D49DDR_B_D48
DDR_B_DQS#6
DDR_B_DQS6
DDR_B_D55
DDR_B_D50
DDR_B_D56
DDR_B_D60
DDR_B_DM7
DDR_B_D58
DDR_B_D59
MEM_SDATA
MEM_SCLK
+3.3V_RUN
2.2U_0603_6.3V6K~D
0.1U_0402_16V4Z~D
C431
1
1
2
2
C429
JDIM1
1
VREF
3
VSS
5
DQ0
7
DQ1
9
VSS
11
DQS0#
13
DQS0
15
VSS
17
DQ2
19
DQ3
21
VSS
23
DQ8
25
DQ9
27
VSS
29
DQS1#
31
DQS1
33
VSS
35
DQ10
37
DQ11
39
VSS
41
VSS
43
DQ16
45
DQ17
47
VSS
49
DQS2#
51
DQS2
53
VSS
55
DQ18
57
DQ19
59
VSS
61
DQ24
63
DQ25
65
VSS
67
DM3
69
NC
71
VSS
73
DQ26
75
DQ27
77
VSS
79
CKE0
81
VDD
83
NC
85
BA2
87
VDD
89
A12
91
A9
93
A8
95
VDD
97
A5
99
A3
101
A1
103
VDD
105
A10/AP
107
BA0
109
WE#
111
VDD
113
CAS#
115
NC/S1#
117
VDD
119
NC/ODT1
121
VSS
123
DQ32
125
DQ33
127
VSS
129
DQS4#
131
DQS4
133
VSS
135
DQ34
137
DQ35
139
VSS
141
DQ40
143
DQ41
145
VSS
147
DM5
149
VSS
151
DQ42
153
DQ43
155
VSS
157
DQ48
159
DQ49
161
VSS
163
NC,TEST
165
VSS
167
DQS6#
169
DQS6
171
VSS
173
DQ50
175
DQ51
177
VSS
179
DQ56
181
DQ57
183
VSS
185
DM7
187
VSS
189
DQ58
191
DQ59
193
VSS
195
SDA
197
SCL
199
VDDSPD
201
GND
TYCO_1565917-4~D
DIMMB
STANDARD
DQ4
DQ5
DM0
DQ6
DQ7
DQ12
DQ13
DM1
CK0#
DQ14
DQ15
DQ20
DQ21
DM2
DQ22
DQ23
DQ28
DQ29
DQS3#
DQS3
DQ30
DQ31
NC/CKE1
VDD
NC/A15
NC/A14
VDD
VDD
VDD
RAS#
VDD
ODT0
NC/A13
VDD
DQ36
DQ37
DM4
DQ38
DQ39
DQ44
DQ45
DQS5#
DQS5
DQ46
DQ47
DQ52
DQ53
CK1#
DM6
DQ54
DQ55
DQ60
DQ61
DQS7#
DQS7
DQ62
DQ63
SAO
GND
VSS
VSS
VSS
VSS
VSS
VSS
CK0
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
BA1
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
CK1
VSS
VSS
VSS
VSS
VSS
VSS
SA1
NC
A11
A7
A6
A4
A2
A0
S0#
NC
2
+1.8V_SUS+1.8V_SUSV_DDR_MCH_REF
2
DDR_B_D5
4
DDR_B_D4DDR_B_D1
6
8
DDR_B_DM0
10
12
DDR_B_D2
14
DDR_B_D3
16
18
DDR_B_D13
20
DDR_B_D12
22
24
DDR_B_DM1
26
28
M_CLK_DDR2
30
M_CLK_DDR#2
32
34
DDR_B_D10
36
DDR_B_D11
38
40
42
DDR_B_D20
44
DDR_B_D17
46
48
PM_EXTTS#1
50
DDR_B_DM2
52
54
DDR_B_D22
56
DDR_B_D23
58
60
62
DDR_B_D29
64
66
DDR_B_DQS#3
68
DDR_B_DQS3
70
72
DDR_B_D30
74
DDR_B_D31
76
78
DDR_CKE3_DIMMB
80
82
84
DDR_B_MA14
86
88
DDR_B_MA11
90
DDR_B_MA7
92
DDR_B_MA6
94
96
DDR_B_MA4
98
DDR_B_MA2
100
DDR_B_MA0
102
104
DDR_B_BS1
106
DDR_B_RAS#
108
DDR_CS2_DIMMB#
110
112
M_ODT2
114
DDR_B_MA13
116
118
120
122
DDR_B_D33DDR_B_D32
124
DDR_B_D37
126
128
DDR_B_DM4
130
132
DDR_B_D38
134
DDR_B_D39DDR_B_D35
136
138
DDR_B_D44
140
DDR_B_D45
142
144
DDR_B_DQS#5
146
DDR_B_DQS5
148
150
DDR_B_D43DDR_B_D46
152
DDR_B_D47
154
156
DDR_B_D52
158
160
162
M_CLK_DDR3
164
M_CLK_DDR#3
166
168
DDR_B_DM6
170
172
DDR_B_D54
174
DDR_B_D51
176
178
DDR_B_D57
180
DDR_B_D61
182
184
DDR_B_DQS#7
186
DDR_B_DQS7
188
190
DDR_B_D62
192
DDR_B_D63
194
196
198
200
202
10K_0402_5%~D
12
M_CLK_DDR2 10
M_CLK_DDR#2 10
DDR_CKE3_DIMMB 10
DDR_B_BS1 11
DDR_B_RAS# 11
DDR_CS2_DIMMB# 10
M_ODT210
M_CLK_DDR3 10
M_CLK_DDR#3 10
R243
10K_0402_5%~D
R241
V_DDR_MCH_REF
2.2U_0603_6.3V6K~D
1
C447
2
PM_EXTTS#1 10
+3.3V_RUN
12
1
0.1U_0402_16V4Z~D
1
C436
2
Non-iAMT
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
DDRII-SODIMM SLOT2
LA-3301P
1758Monday, February 26, 2007
1
1.0
of
5
+3.3V_SUS
12
R423
8.2K_0402_5%~D
2
Q38
2
Q39
B
+3.3V_SUS
B
C
E
31
12
C
E
31
THERMATRIP1#
1
C628
0.1U_0402_16V4Z~D
2
R426
8.2K_0402_5%~D
THERMATRIP2#
1
C632
0.1U_0402_16V4Z~D
2
+1.05V_VCCP
R425
DD
H_THERMTRIP#7
THERMTRIP_MCH#10
2.2K_0402_5%~D
12
MMST3904-7-F_SOT323-3~D
+1.05V_VCCP
R427
2.2K_0402_5%~D
12
MMST3904-7-F_SOT323-3~D
Place under CPU
CC
C633
@
2200P_0402_50V7K~D
Place C633 close to the Q40 as possible
Place C636 close to the Guardian pins as possible
H_THERMDA7
470P_0402_50V7K~D
H_THERMDC7
+3.3V_SUS
BB
+3.3V_SUS
R196
@
12
10K_0402_5%~D
@
12
10K_0402_5%~D
AA
R194
MDC_RST_DIS#
SIO_GFX_PWR
5
+3.3V_SUS
0.1U_0402_16V4Z~D
R428
12
49.9_0603_1%~D
1
C639
2
C100
2200P_0402_50V7K~D
2
1
C636
1
C637
0.1U_0402_16V4Z~D
2
2
1
+3.3V_SUS
12
C
R433
8.2K_0402_5%~D
THERMATRIP3#
4
RB751S40T1_SOD523-2~D
2
B
E
Q40
31
MMST3904-7-F_SOT323-3~D
1
2
+RTC_CELL
12
R436
332K_0402_1%~D
12
R438
118K_0402_1%~D
4
D19
@
+3VSUS_THRM
1
C638
2
0.1U_0402_16V4Z~D
1
C203
0.1U_0402_16V4Z~D
2
@
1
C630
2
21
2200P_0402_50V7K~D
2
C634
1
SUSPWROK42
ICH_PWRGD#42
R437
12
1K_0402_5%~D
MDC_RST_DIS#33
AUDIO_AVDD_ON27
3
FAN1 Control and Tachometer
+3.3V_RUN
12
R424
10K_0402_5%~D
12
R414
0_0402_5%~D
+FAN1_VOUT
22U_0805_6.3VAM~D
Place C634 close to the
Guardian pins as possible
FAN1_TACH_FB
THRM_SMBDAT39,49
THRM_SMBCLK39,49
REM_DIODE1_N
12
R4291K_0402_5%~D
12
R4321K_0402_5%~D
THERMATRIP1#
THERMATRIP2#
THERMATRIP3#
+FAN1_VOUT
MDC_RST_DIS#
SIO_GFX_PWR
5V_CAL_SIO#
AUDIO_AVDD_ON
FAN1_TACH 39
11
12
38
37
41
40
35
21
23
16
17
18
19
42
26
34
7
8
39
10
13
14
15
22
36
49
SMBUS ADDRESS : 2F
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.