Mobile Yonah uFCPGA with Intel
Calistoga_GM+ICH7-M core logic
33
44
A
B
2006-02-27
REV:0.5
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
2006/02/272007/02/27
Compal Secret Data
Deciphered Date
Feb 27, 2007
Title
Size Docume nt NumberRe v
D
Date :Sheeto f
Compal Electronics, Inc.
Cover Sheet
LA-3031P
149Tuesd ay, Febru ary 28, 2006
E
0.5
A
Compal confidential
File Name : LA-3031
B
C
Heavenly 2.0
D
E
11
22
DOCK/DVI
page 34
DVI controller
CH 7307C- DE
page 17
CRT/TV-OUT
pag e 16
LCD CONN
page 17page 29
Fan Control
SD VO
PCI-E BUS
page 4
Mobile Yonah & Merom
uF CPGA-478 CPU
page 4,5,6
H_ A# (3.. 31)
FSB
533/667MHz
Intel Calistoga GMCH
945GM
PCBG A 1466
page 7,8,9,10,11,12
DM I
H_ D#( 0..6 3)
Thermal Sensor
ADM1032AR
page 4
DDR2 -400/533/667
Dual Channel
USB2.0
Clock Generator
IC S9L P306
DDR- SO-DIMM X2
BAN K 0, 1, 2, 3
FingerPrinter
AES2501
page 13,14
page 29
USB conn x3
BT Conn
page 29
page 15
MDC1. 5
page 31
PCI BUS
Intel ICH7-M
Gigabit LAN
BC M 5 75 3M
page 24
33
RTC CKT.
page 19
RJ45 /11 CONN
page 25
Mini C ard
socket
page 26
CardBus Controller
TI PCI6 612
page 22,23
Slot 0
page 23
SD/SDIO Slot
page 22
mBGA-652
page 18,19,20,21
SPI ROM
25LF080A
AC-LINK/Azalia
SATA Master
SPI
page 31
LPC BUS
Power OK C KT.
page 36
SMSC Super I/O
Power On/Off CKT.
page 33
44
DC/DC Interface CKT.
page 35
COM1 on
Docking side
LPC47N217
page 30
page 30
Touch Pad CONN.Int.KBD
page 33
SMSC KBC 1021
page 32
page 33
page 31
Audio CKT
AD1981HD
page 27
SATA HDD
Co nnector
page 19
SST49LF008A
AMP & Audio Jack
page 28
Docking CONN.
*RJ-45(LED*2)
*RJ-11(Pass Through)
*CRT
*COMPOSITE Video Out
*TVOUT
*DVI
*LINE IN
*LINE OUT
*PCI-E x2
Flash ROMSecurity Module
page 31
*Serial Port
*Parallel Port
*PS/2 x2
*USB x2
*DC JACK
page 34
Power Circuit DC/DC
36,37,38,39,40,41,42,43
A
LPT on
Docking side
page 30
FIR
B
page 30
Digitizer
page 17
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
2006/02/272007/02/27
Compal Secret Data
Deciphered Date
D
Title
Size Docume nt NumberRe v
Date :Sheeto f
Compal Electronics, Inc.
Block Diagram
LA-3031P
249Tuesd ay, Febru ary 28, 2006
E
0.5
A
Voltage RailsSymbol note:
Power Plane
VIN
B+
+CPU_CORE
+VCCP
+0.9VS
+1.5VS
+1.8V
+2.5VS
+3VALW
+3V
+5VALW
+5V
+5VS
RTCVCC
Note : ON* means that this power plane is ON only with AC power available, otherwise it is OFF.
Description
Adapter power supply (19V)
AC or battery power rail for power circuit
Core voltage for CPU
1.05V power rail for Processor I/O and MCH core power
0.9V switched power rail for DDRII Vtt
1.5V switched power rail for PCI-E interface
1.8V power rail for DDRII
3.3V always on power rail
3V power rail
3.3V switched power rail+3VS
5V always on power rail
5V power rail
5V switched power rail
RTC power
S0-S1
N/A
ONOFF
ON
ON
ON
ON
ON
ON
ONOFF
ON
ON
ON
ON
S3
N/A
N/A
OFF
OFF
OFF
ON
ON2.5V always on power rail+2.5VALWON*ON
OFF
ON
ON
OFF
ON
ON
OFF
ON
S5
N/A
N/AN/A
OFF
OFF
OFF
OFF
OFF
OFF2.5V switched power rail for MCH video PLL
ON*
OFF
ON*
OFF
OFF
ONON
:means digital ground.
:means analog ground.
:means reserved.@
@ : means just reserve , no build
SPI@ : means just build when SPI I/F BIOS function enable.
FWH@ : means just build when FWH I/F BIOS function enable.
NOXDP@ : means just build when XDP function disable.
XDP@ : means just build when XDP function enable. When this time, docking PCI express will not work.
TPM@ : means just build when TPM1.2 function enable.
250@ : means just build when SMsC LPC47N250 chip selected.
1021@ : means just build when SMsC KBC1021 chip selected.
45@ : means need be mounted when 45 level assy or rework stage.
ACCEL@ : means just build when Accelerometer chip LIS3LV02DQ selected.
DVI_7307@ : means just build when DVI chip CH7307 selected.
DVI_1362@ : means just build when DVI chip SIL1362 selected.
11
Internal PCI Devices
DE VICE
L AN
Az ali aD27
USB1 .1/2 .0
PCI to PC I (D MI to PCI)
AC9 7 MO DEM
AC9 7 Au di o
PA TA /S ATA
LPC I/F
SM BU S
PCI Devi ce ID
D8
D28PCI- E
D29
D30
D30
D30
D31
D31
D31
IDS EL #
AD2 4
AD1 1
AD1 2
AD1 3
AD1 4
AD1 4
AD1 4
AD1 5
AD1 5
AD1 5
(D is ab le d by BI OS )
(D is ab le d by BI OS )
(P AT A is D is abled b y B IOS)
External PCI Devices
DE VICE
CA RD BU S
PCI Devi ce ID
D6
I2C / SMBUS ADDRESSING
DE VICE
DDR S O-DIMM 0
DDR S O-DIMM 1
CL OC K G EN ER ATOR (E XT.)
HEX
A0
A4
D2
IDS EL #
AD2 2
AD DRESS
1 0 1 0 0 0 0 0
1 0 1 0 0 1 0 0
1 1 0 1 0 0 1 0
REQ /G NT #
2
PIR Q
C D E G
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
A
2006/02/272007/02/27
Compal Secret Data
Deciphered Date
Title
Size Docume nt NumberRe v
Date :Sheeto f
Compal Electronics, Inc.
Notes List
LA-3031P
349Tuesd ay, Febru ary 28, 2006
0.5
5
4
3
2
1
H_A#[3 ..31]7
H_A#3
H_A#4
H_A#5
H_A#6
H_A#7
H_A#8
DD
H_REQ# [0..4]7
H_ADSTB#07
CC
R560
56_0402_5%
12
+VCCP
BB
H_PROCHOT #43
12
+VCCP
68_0402_5%
H_ADSTB#17
CLK_CPU _BCLK15
CLK_CPU_ BCLK#15
H_BPRI#7
H_DEF ER#7
H_D RDY#7
H_HITM#7
H_LOCK#7
H_RESET#7
H_RS# [0..2]7
H_TR DY#7
XDP_DBRESET#20
H_DB SY#7
H_DPSLP#19
H_DPRSTP#19,43
H_DPW R#7
R561
H_PWR GOOD19
H_CPUSLP #7
R5621K_0402_5%@
12
R56351_0402_5%
12
H_ADS#7
H_BNR #7
H_BR0#7
H_HIT#7
7/14
H_THERMDA, H _THERMDC routing together.
Trace width / Spacing = 10 / 10 mil
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2006/02/272007/02/27
Compal Secret Data
Deciphered Date
Title
Size Docume nt NumberRe v
2
Date :Sheet
Compal Electronics, Inc.
Yonah CPU in mFCPGA479
LA-3031P
1
o f
549Tuesd ay, Febru ary 28, 2006
0.5
5
4
3
2
1
DD
Place these capacitors on L8
(North side ,Secondary Layer)
Place these capacitors on L8
(North side ,Secondary Layer)
Place these capacitors on L8
(Sorth side ,Secondary Layer)
CC
Place these capacitors on L8
(Sorth side ,Secondary Layer)
South Side S econdary
BB
330U_D2E_2. 5VM_R9@
+VCC_C ORE
1
C593
10U_0805_6.3V6M
2
+VCC_C ORE
1
C601
10U_0805_6.3V6M
2
+VCC_C ORE
1
C609
10U_0805_6.3V6M
2
+VCC_C ORE
1
C617
10U_0805_6.3V6M
2
+VCC_C ORE
1
+
C626
C625
2
330U_D2E_2. 5VM_R9
1/41/4
330U_D2E_2. 5VM_R9
1
+
C627
2
1
C594
10U_0805_6.3V6M
2
1
C602
10U_0805_6.3V6M
2
1
C610
10U_0805_6.3V6M
2
1
C618
10U_0805_6.3V6M
2
1
+
C628
2
330U_D2E_2. 5VM_R9
@
1
+
2
1
2
1
2
1
2
1
2
330U_D2E_2. 5VM_R9
C629
C595
10U_0805_6.3V6M
C603
10U_0805_6.3V6M
C611
10U_0805_6.3V6M
C619
10U_0805_6.3V6M
1
+
C630
2
1
C596
10U_0805_6.3V6M
2
1
C604
10U_0805_6.3V6M
2
1
C612
10U_0805_6.3V6M
2
1
C620
10U_0805_6.3V6M
2
North Side S econdary
1
+
2
330U_D2E_2. 5VM_R9
1
C597
10U_0805_6.3V6M
2
1
C605
10U_0805_6.3V6M
2
1
C613
10U_0805_6.3V6M
2
1
C621
10U_0805_6.3V6M
2
1
C598
10U_0805_6.3V6M
2
1
C606
10U_0805_6.3V6M
2
1
C614
10U_0805_6.3V6M
2
1
C622
10U_0805_6.3V6M
2
1
C599
10U_0805_6.3V6M
2
1
C607
10U_0805_6.3V6M
2
1
C615
10U_0805_6.3V6M
2
1
C623
10U_0805_6.3V6M
2
ESR = 1.5m ohm
Capacitor = 1980uF
1
C600
10U_0805_6.3V6M
2
1
C608
10U_0805_6.3V6M
2
1
C616
10U_0805_6.3V6M
2
1
C624
10U_0805_6.3V6M
2
Mid Frequence Decoupling
+VCCP
220U_D2_2VK_R9
1
+
C634
2
AA
1
C635
0.1U_0402_16 V4Z
2
1
C636
0.1U_0402_ 16V4Z
2
1
C637
0.1U_0402_16 V4Z
2
1
C638
0.1U_0402_16 V4Z
2
1
C639
0.1U_0402_16 V4Z
2
1
C640
0.1U_0402_16 V4Z
2
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
Place these inside
socket cavi ty on L8
(North side
Secondary)
2006/02/272007/02/27
Compal Secret Data
Deciphered Date
2
Title
Size Docume nt NumberRe v
Date :Sheetof
Compal Electronics, Inc.
CPU Bypass capacitors
LA-3031P
649Tuesd ay, Febru ary 28, 2006
1
0.5
5
4
3
2
1
H_D# [0..63]4
DD
CC
+VCCP
12
12
R577
R578
54.9_0402_1%
L
H_XS COMP /H_Y SCOM P tr ace
width a nd spacin g is 5/20.
Layout Note :
V_DDR_MCH_R EF
trace width and
spacing is 20/20.
8/29
V_DDR_ MCH_REF
1
C641
2
0.1U_0402_16 V4Z
Stuff R590 & R591 for A1 Calistoga
C643
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2006/02/272007/02/27
Compal Secret Data
Deciphered Date
2
Title
Size Docume nt NumberRe v
Date :Sheetof
Compal Electronics, Inc.
Calistoga (2/6)
LA-3031P
849Tuesd ay, Febru ary 28, 2006
1
0.5
5
4
3
2
1
DD
U15C
LIBG
12
12
255_0402_1%
L64
L66
L68
H27
SDVOCTRL_DATA
H28
SDVOCTRL_CLK
B37
LA_DATA0
B34
LA_DATA1
A36
LA_DATA2
C37
LA_DATA#0
B35
LA_DATA#1
A37
LA_DATA#2
F30
LB_DATA0
D29
LB_DATA1
F28
LB_DATA2
G30
LB_DATA#0
D30
LB_DATA#1
F29
LB_DATA#2
A32
LA_CLK
A33
LA_CLK#
E26
LB_CLK
E27
LB_CLK#
D32
LBKLT_CTL
J30
LBKLT_EN
H30
LCTLA_CLK
H29
LCTLB_DATA
G26
LDDC_CLK
G25
LDDC_DATA
F32
LVDD_EN
B38
LIBG
C35
LVBG
C33
LVREFH
C32
LVREFL
A16
TVDAC_A
C18
TVDAC_B
A19
TVDAC_C
J20
TV_IREF
B16
TV_IRTNA
B18
TV_IRTNB
B19
TV_IRTNC
J29
TV_DCONSEL1
K30
TV_DCONSEL0
C26
DDCCLK
C25
DDCDATA
H23
VSYNC
G23
HSYNC
E23
BLUE
D23
BLUE#
C22
GREEN
B22
GREEN#
A21
RED
B21
RED#
J22
CRT_IREF
QG82945GM QK56 A3 FCBGA 1466
TVCRT
D_RE D 16,34
D_GREE N 16,34
D_BLUE 16,34
LVDS
PCI-EXPRESS GRAPHICS
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
SDVO_SDAT17
SDVO_SCLK17
TXA0+17
TXA1+17
TXA2+17
TXA0-17
TXA1-17
TXA2-17
TXB0+17
TXB1+17
TXB2+17
+3VS
12
12
R603
CC
LCD_CL K17
LCD_DAT17
TV-Out Termination
COMPS
LUMA
CRMA
BB
10K_0402_5%
LCD_CL K
LCD_DAT
Place close t o U15
R608
12
R609
75_0402_1%
12
75_0402_1%
CRT Termination/EMI Filter
C_RE D
C_BLU
R611
12
75_0402_1%
5
AA
12
75_0402_1%
R612
HLC0603CSCC 39NJT_0603
HLC0603CSCC 39NJT_0603
HLC0603CSCC 39NJT_0603
12
R613
75_0402_1%
12
R610
75_0402_1%
L63
12
L65
12
L67
12
R604
10K_0402_5%
1
2
18P_0402_50V8J
C655
TXB0-17
TXB1-17
TXB2-17
TXACLK+17
TXACLK-17
TXBCLK+17
TXBCLK-17
ENAVD D17
DDCC LK16
DDCDAT A16
VSYNC16
HSYNC16
Place close t o U15
C_RED_ L
C_GRN _LC_G RN
C_BLU_L
1
C656
2
18P_0402_50V8J
TXB0+
TXB1+
TXB2+
TXB0ÂTXB1ÂTXB2-
TXBCLK+
TXBCLK-
BKLT_CTL
ENABLT
ENAV DD
R6051.5K_0402_1%
COMPS
LUMA
CRMA
12
R606
4.99K_0603_1%
C_BLU
C_G RN
C_RE D
R607
12
HLC0603CSCC R11JT_0603
12
HLC0603CSCC R11JT_0603
12
HLC0603CSCC R11JT_0603
1
C657
18P_0402_50V8J
2
4
PEG COM P t race wid th
and s paci ng i s 18/ 25 mi ls.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
0 = Only PCIE or SDVO is
operational.
1 = PCIE/SDV O are operating
simu.
CFG57
CFG77
CFG97
CFG117
CFG127
CFG137
CFG167
CFG187
CFG197
CFG207
R6232.2K_0402_5%@
R6242.2K_0402_5%@
R6252.2K_0402_5%@
R6262.2K_0402_5%@
R6272.2K_0402_5%@
R6282.2K_0402_5%@
R6292.2K_0402_5%@
R6301K_0402_5%@
R6311K_0402_5%@
R6321K_0402_5%@
*
12
12
12
8/1
12
12
12
12
12
12
12
(Default)
*
(Default)
*
(Default)
*
+3VS
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2006/02/272007/02/27
Compal Secret Data
Deciphered Date
Title
Size Docume nt NumberRe v
2
Date :Sheetof
Compal Electronics, Inc.
Calistoga (6/6)
LA-3031P
1249Tuesd ay, Febru ary 28, 2006
1
0.5
5
4
3
2
1
DDR_A_ DQS#[0..7 ]8
DDR_ A_D[0..63 ]8
DDR_A_ DM[0..7]8
DDR_A _DQS[0..7 ]8
DDR_A_ MA[0..13]8
DD
+1.8V
2.2U_0805_16 V4Z
C458
1
2
0.1U_0402_16 V4Z
1
2
CC
Layout Note:
Place one cap clo se to every 2 pullup
resistors terminated to +0.9V_DDR_VTT
+0.9VS
0.1U_0402_16 V4Z
0.1U_0402_16 V4Z
0.1U_0402_16 V4Z
1
1
2
2
C239
BB
AA
C229
DDR_A_MA5
DDR_A_MA8
DDR_A_MA1
DDR_A_MA3
DDR_A_ RAS#
DDR_CS0_D IMMA#
DDR_A_BS #0
DDR_A_MA10
DDR_A_ CAS#
DDR_A_W E#
DDR_CS1_D IMMA#
M_ODT1
1
2
C250
RP27
RP29
RP32
RP31
RP33
5
0.1U_0402_16 V4Z
0.1U_0402_16 V4Z
1
2
C257
14
23
56_0404_4P2R_5%
14
23
56_0404_4P2R_5%
14
23
56_0404_4P2R_5%
14
23
56_0404_4P2R_5%
14
23
56_0404_4P2R_5%
RP35
23
14
56_0404_4P2R_5%
1
2
C272
+0.9VS
0.1U_0402_16 V4Z
1
2
0.1U_0402_16 V4Z
C279
RP22 56_0404_ 4P2R_5%
RP26 56_0404_ 4P2R_5%
RP25 56_0404_ 4P2R_5%
RP28 56_0404_ 4P2R_5%
RP30 56_0404_ 4P2R_5%
RP34 56_0404_ 4P2R_5%
RP24 56_0404_ 4P2R_5%
0.1U_0402_16 V4Z
1
1
2
2
C274
C281
DDR_A_BS #2
14
DDR_CKE0 _DIMMA
23
DDR_A_MA7
14
DDR_A_MA6
23
DDR_A_MA9
14
DDR_A_MA12
23
DDR_A_MA4
14
DDR_A_MA2
23
DDR_A_MA0
14
DDR_A_BS #1
23
M_ODT0
14
DDR_A_MA13
23
DDR_CKE1 _DIMMA
14
DDR_A_MA11
23
0.1U_0402_16 V4Z
2.2U_0805_16 V4Z
1
2
C255
1
2
C268
Layou t No te:
Pla ce ne ar JP3 4
2.2U_0805_16 V4Z
C498
1
2
0.1U_0402_16 V4Z
C242
1
2
0.1U_0402_16 V4Z
0.1U_0402_16 V4Z
1
2
C252
2.2U_0805_16 V4Z
C473
C491
1
2
0.1U_0402_16 V4Z
0.1U_0402_16 V4Z
C280
1
2
0.1U_0402_16 V4Z
1
1
2
2
C234
C241
Layout Note:
Pla ce thes e res istor
closely JP34,all
trace length <750 mil
Lay out No te:
Pl ace th es e re sist or
clo sely JP 34,all
tra ce l ength Max=1 .3"
4
DDR_A _D0
DDR_A _D1
DDR_A_ DQS#0
DDR_A_ DQS0
DDR_A _D2
DDR_A _D3
DDR_A _D8
2.2U_0805_16 V4Z
C465
1
2
C235
1
2
DDR_CKE0_D IMMA7
DDR_A_BS# 28
DDR_A_BS# 08
DDR_A_W E#8
DDR_A_ CAS#8
DDR_CS1_DI MMA#7
0.1U_0402_16 V4Z
1
2
C227
M_ODT17
ICH_SMBDATA4, 14,15,20,24,26
ICH_SMBCL K4,14,15,2 0,24,26
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Layout Note:
Place one cap clo se to every 2 pullup
resistors terminated to +0.9V_DDR_VTT
+0.9VS
0.1U_0402_16 V4Z
0.1U_0402_16 V4Z
0.1U_0402_16 V4Z
0.1U_0402_16 V4Z
1
1
1
2
2
C179
RP14
14
23
56_0404_4P2R_5%
RP17
14
23
RP16
56_0404_4P2R_5%
14
23
56_0404_4P2R_5%
RP18
14
23
RP19
56_0404_4P2R_5%
14
23
56_0404_4P2R_5%
RP23
23
14
56_0404_4P2R_5%
2
C186
+0.9VS
5
C176
BB
AA
DDR_B_MA1
DDR_B_MA3
DDR_B_BS #0
DDR_B_MA10
DDR_B_MA0
DDR_B_BS #1
DDR_B_ RAS#
DDR_CS2_D IMMB#
DDR_B_ CAS#
DDR_B_W E#
DDR_CS3_D IMMB#
M_ODT3
0.1U_0402_16 V4Z
1
1
2
2
C197
C213
RP10 56_0404_ 4P2R_5%
RP11 56_0404_ 4P2R_5%
RP12 56_0404_ 4P2R_5%
RP13 56_0404_ 4P2R_5%
RP15 56_0404_ 4P2R_5%
RP21 56_0404_ 4P2R_5%
RP9
56_0404_4P2R_5%
0.1U_0402_16 V4Z
1
2
14
23
14
23
14
23
14
23
14
23
14
23
14
23
4
Layou t No te:
Pla ce ne ar JP1 0
2.2U_0805_16 V4Z
2.2U_0805_16 V4Z
C265
1
1
2
2
0.1U_0402_16 V4Z
C219
C166
1
1
2
2
0.1U_0402_16 V4Z
0.1U_0402_16 V4Z
1
1
2
C173
Layout Note:
Pla ce thes e res istor
closely JP10,all
trace length <750 mil
Lay out No te:
Pl ace th es e re sist or
clo sely JP 10,all
tra ce l ength Max=1 .3"
1
2
2
C218
C163
4
3
+1.8V
JP10
1
VREF
3
DDR_B _D0
DDR_B _D1
DDR_B_ DQS#0
DDR_B_ DQS0
DDR_B _D2
DDR_B _D3
DDR_B _D8
2.2U_0805_16 V4Z
2.2U_0805_16 V4Z
C159
C247
0.1U_0402_16 V4Z
C188
1
2
0.1U_0402_16 V4Z
1
2
C177
C164
1
1
2
2
0.1U_0402_16 V4Z
C161
1
2
DDR_CKE2_ DIMMB7
DDR_B_BS# 28
DDR_B_BS# 08
DDR_B_W E#8
DDR_B_ CAS#8
DDR_CS3_DI MMB#7
M_ODT37
ICH_SMBDATA4, 13,15,20,24,26
ICH_SMBCL K4,13,15,2 0,24,26
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
1
C722
0.1U_0402_16 V4Z
2
R635
12
1_0805_1%
12
R636
2.2_0805_1%
1
C729
0.1U_0402_16 V4Z
2
LCDCLK_SST/SRCCLKT0
LCDCLK_SSC/SRCCLKC0
SATA1/SRCCLKT4
SATA1/SRCCLKC4
SATA2/SRCCLKT5
SATA2/SRCCLKC5
*CPUCLKT2_ITP/CLKREQC#
*CPUCLKC2_ITP/CLKREQD#
2006/02/272007/02/27
3
CK_V DD_REF
CK_VDD_ 48
SATACLKT
SATACLKC
CPUCLKT0
CPUCLKC0
CPUCLKT1
CPUCLKC1
*CLKREQA#
SRCCLKT2
SRCCLKC2
*CLKREQB#
SRCCLKT1
SRCCLKC1
SRCCLKT3
SRCCLKC3
SRCCLKT6
SRCCLKC6
SRCCLKT8
SRCCLKC8
SRCCLKT7
SRCCLKC7
Pla ce c ryst al wit hin
500 mils of CK4 10
C73033P_0402_50V8J
12
CLK_XTAL_IN
57
X1
CLK_XTAL_OUT
56
X2
28
29
CPU_BC LK
52
CPU_BCL K#
51
MCH_BCLK
49
MCH_BCLK#
48
64
SSCD REFCLK
18
SSCDREF CLK#
19
PCIE_LOM
22
PCIE_LOM#
23
PCIE_SATA
30
PCIE_SATA#CLK_PCIE_SATA#
31
63
20
21
PCIE_D OCKC LK_PCIE_DOC K
26
27
PCIE _ICH
35
PCIE _ICH#
34
CPU_XDP
45
MCH_3GPLL
37
MCH_3GPLL#
36
43
42
CPU_XDP#
44
PCIE_M CARD
39
PCIE_M CARD#
38
Y3
14.31818MHZ_20P_6X1430004201
C73133P_0402_50V8J
Routing th e t race at leas t 10mil
R639
12
R6410_0402_5%
12
Routing th e t race at leas t 10mil
12
R64224_0402_5%
12
R64424_0402_5%
12
R64724_0402_5%
12
R65324_0402_5%
9/16
12
R94324_0402_5%
12
R94424_0402_5%
9/16
12
R67824_0402_5%
12
R68224_0402_5%
12
R66624_0402_5%
12
R66924_0402_5%
9/16
R67510K_0402_5%
9/16
12
R68524_0402_5%
12
R68724_0402_5%
12
R68924_0402_5%
12
R69124_0402_5%
R69410K_0402_5%NOXDP@
R6960_0402_5%NOXDP@
12
R69924_0402_5%XDP@
12
R70224_0402_5%
12
R70524_0402_5%
9/16
R7110_0402_5%NOXDP@
12
R71224_0402_5%XDP@
12
R71324_0402_5%
12
R71424_0402_5%
9/16
+3VS
R69510K_0402_5%@
Compal Secret Data
Deciphered Date
2
12
12
0_0402_5%
CLK_CP U_BCLK
CLK_CPU _BCLK#
CLK_MCH_B CLK
CLK_MCH_BCL K#
CLKREQA#
MCH_SS CDREFCLK
MCH_SS CDREFCLK#
12
12
R71010K_0402_5%NOXDP@
12
10/04
CLK_PCIE_LOM
CLK_PCIE_LOM#
CLK_PCIE_SATA
CPPE#CLKREQ B#
CLK_PC IE_DOCK#PCIE_D OCK#
CLK_ PCIE_ICH
CLK_PC IE_ICH#
12
CLKREQ C#
CLK_CPU_XDP
CLK_MCH_3GPLL
CLK_MCH_3GPLL#
12
CLKREQ D#
CLK_CPU_XDP#
CLK_PC IE_MCARD
CLK_PC IE_MCARD#
5/23
12
2
CLKREQA# 24
10/04
PCI_ EC
1
CLKREQA#
CLKREQB#
CLKREQ C#
CLKREQ D#
1/12
Place near U25
12
C1050
@
1000P_0402_50V7K
12
C1051
1000P_0402_50V7K@
12
C1052
1000P_0402_50V7K@
12
C1049
1000P_0402_50V7K
Place near U25
Place these components
near each pin within 40
mils.
CLK_CPU _BCLK 4
CLK_CPU_ BCLK# 4
CLK_MCH_BCL K 7
CLK_MCH_BCL K# 7
MCH_SS CDREFCLK 7
MCH_SS CDREFCLK# 7
CLK_PCIE_LOM 24
CLK_PCIE_LOM# 24
CLK_PCIE_SATA 19
CLK_PCIE_SATA# 19
CPPE# 18,34
CLK_PC IE_DOCK 34
CLK_PC IE_DOCK# 34
CLK_P CIE_ICH 20
CLK_PC IE_ICH# 20
+3VS
CLKREQC # 7
CLK_CPU_XDP 4
CLK_MCH_3GPLL 7
CLK_MCH_3GPLL# 7
+3VS
CLKREQD # 26
CLK_CPU_XDP# 4
CLK_PC IE_MCARD 26
CLK_PC IE_MCARD# 26
Title
Size Docume nt NumberRe v
Date :Sheetof
CLK_CP U_BCLK
CLK_CPU _BCLK#
CLK_MCH_B CLK
CLK_MCH_BCL K#
MCH_SS CDREFCLK
MCH_SS CDREFCLK#
CLK_PCIE_LOM
CLK_PCIE_LOM#
CLK_PCIE_SATA
CLK_PCIE_SATA#
CLK_MCH_3GPLL
CLK_MCH_3GPLL#
CLK_PC IE_MCARD
CLK_PC IE_MCARD#
CLK_ PCIE_ICH
CLK_PC IE_ICH#
CLK_CPU_XDP
CLK_CPU_XDP#
CLK_PC IE_DOCK
CLK_PC IE_DOCK#
CLK_MC H_DREFCLK
CLK_MC H_DREFCLK#
R64349.9_0402_1%@
R64549.9_0402_1%@
R64849.9_0402_1%@
R65449.9_0402_1%@
12
R65949.9_0402_1%@
12
R66149.9_0402_1%@
12
R66249.9_0402_1%@
12
R66349.9_0402_1%@
12
R66749.9_0402_1%@
12
R67049.9_0402_1%@
12
R67949.9_0402_1%@
12
R68349.9_0402_1% @
12
R68649.9_0402_1%@
12
R68849.9_0402_1%@
12
R69049.9_0402_1%@
12
R69249.9_0402_1%@
R70349.9_0402_1%@
R70649.9_0402_1%@
R70849.9_0402_1%@
R70949.9_0402_1%@
R98149.9_0402_1%@
R98249.9_0402_1%@
9/16
If LP Chip st uff, al l 49.9_0402
cou ld be remov ed .
Compal Electronics, Inc.
Clock generator
LA-3031P
1
12
12
12
12
12
12
12
12
12
12
0.5
1549Tuesd ay, Febru ary 28, 2006
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