PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
JUSB1 (Ext Back Right Side)
JUSB1 (Ext Back Right Side)
Blue Tooth
EXPRESS CARD
CCD Camera
5WWAN
6
7
0
1
2
3
4
JUSB2 (Ext Back Left Side)
JUSB2 (Ext Back Left Side)
None
None
None
None
None
DESTINATION
PCI TABLE
PCI DEVICEIDSEL
REQ#/GNT#
PIRQ
BB
LAN
R5C832
AD17REQ#2/GNT#2
REQ#3/GNT#3AD16IRQB
IRQC
IRQD
Lane 1
Lane 2
Lane 3
Lane 4
AA
PCI EXPRESS
DESTINATION
MINI CARD-1 WWAN
MINI CARD-2 WLAN
None
EXPRESS CARD
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Index and Config.
LA-3001P
373Monday, April 17, 2006
1
0.4
of
5
4
3
2
1
ALWON
+5V_ALW
DD
ADAPTER
ALWON
+3.3V_ALW
ENAB_3VLAN
BATTERY
CC
+PWR_SRC
AUX_EN
+3.3V_SRC
SUS_ON
RUN_ON
Charger
SUS_ON
ADP3207
(PU7)
+5V_SUS
RUNPWROK
+VCC_CORE
+3.3V_LAN
+3.3V_SUS
+3.3V_RUN
ISL6227
(PU4)
RUN_ON
+1.5V_RUN
GUARDIAN II
+1.05V_VCCP
+2.5V_RUN
RUN_ON
GFX_RUN_ON
MAX8632
(PU5)
SUSPWROK_5V
+1.8V_SUS
MAX8632/
ISL88550
(PU13)
RUN_ON
+0.9V_DDR_VTT
+VCC_GFX_CORE
+1.22V_GFX_PCIE
BB
SI3456
(IO/B)
HDDC_EN#
SI3456
(IO/B)
MODC_EN#
SI4810
(Q28)
RUN_ON
793475
(IO/B)
AUDIO_AVDD_ON
PL8 & PD8
SI4800
(Q35)
RUN_ON
+1.8V_RUN
+5V_HDD+5V_MOD+5V_RUN+VDDA
AA
L57
(Option)
+15V_SUS
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Power Rail
LA-3001P
473Monday, April 17, 2006
1
0.4
of
5
4
3
2
1
+3.3V_SUS
+3.3V_RUN
2.2K2.2K2.2K2.2K
ICH_SMBCLK
DD
ICH7-M
C22
ICH_SMBDATA
B22
+3.3V_SUS
87
3230
2N7002
2N7002
3032
CLK_SCLK
CLK_SDATA
16
CLK GEN.
17
SMBUS Address [D2]
+3.3V_ALW
Express Card
10K10K
CLK_SMB
10
DAT_SMB+3.3V_ALW
9
CC
SMBUS Address [TBD]
MINI WLAN Card
SMBUS Address [TBD]
MINI WWAN Card
SMBUS Address [TBD]
8
GUARDIAN II
7
SMBUS Address [2F]
197
DIMMA
195
SMBUS Address [A0]
197
DIMMB
195
SMBUS Address [A2]
+3.3V_ALW
8.2K8.2K
SIO
112
111
SBAT_SMBCLK
SBAT_SMBDAT
+3.3V_ALW
6
LVDS connector
5
Inverter
SMBUS Address [58]
+3.3V_ALW
8.2K8.2K
BB
Macallan IV
8
7
PBAT_SMBCLK
PBAT_SMBDAT+3.3V_ALW
100
3
BATTERY
4
CONN
SMBUS Address [16]
100
9
CHARGER
10
AA
SMBUS Address [12]
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
SMBUS TOPOLOGY
LA-3001P
573Monday, April 17, 2006
1
0.4
of
5
D
1
GS
2
DD
FSCFSBFSA CPU
CLKSEL2CLKSEL0CLKSEL1
2N7002
3
ICH_SMBDATA<23,29,36>CLK_SDATA <17,18>
+3.3V_RUN
ICH_SMBCLK<23,29,36>
000
00
*
0
0
CC
1
1
1
11
1
0
1
11
00
1
0
1
0
1
+3.3V_RUN
ICH_SMBDATA
ICH_SMBCLK
MHz
266
133
200
166
333
100
400
Reserve
D
13
13
D
SRC
MHz
100
100
100
100
100
100
100
2.2K_0402_5%~D
S
Q51
2N7002_SOT23~D
G
2
2
G
S
Q50
2N7002_SOT23~D
PCI
MHz
33.3
33.3
33.3
33.3
33.3
33.3
33.3
R589
2.2K_0402_5%~D
12
12
R575
CLK_SDATA
CLK_SCLK
+CK_VDD_A
C573
4.7U_0603_6.3V6M~D
1
2
Place crystal within
500 mils of CK410M
CLK_ICH_48M<23>
CPU_MCH_BSEL0<8,10>
Table : ICS954305AK
CLK_PCI_LOM<26>
CPU_BSEL
BB
91_0402_5%~D
AA
CPU_BSEL2(FSC) CPU_BSEL1(FSB)
133
166
R457
2@
+3.3V_RUN
R453
10K_0402_5%~D
12
12
R444
FSA
10K_0402_5%~D@
00
0
XTALIN_CLK_GEN
12
Rd
Pop R451 for 27MHz
output for G72
+3.3V_RUN
5
Rc
R451
10K_0402_5%~D
12
PCI_LOM
12
R452
10K_0402_5%~D1@
CLK_PCI_PCCARD<28>
CLK_PCI_5004<30>
1
2@
CLK_ICH_14M<23>
MCH_DREFCLK<10>
MCH_DREFCLK#<10>
CLK_PCI_ICH<21>
XTALIN_CLK_GEN<44>
XTALSSIN_CLK_GEN<44>
Pop Ra,Rb,Rc, Rd for 27MHz output for G72
spectrum input
Routing trace length DOT96/DOT96# <50mil
FCTSEL1
(PIN34)
UMA
Discrete
4
Change to ECJCV50J106M 6.3V10UF 0805 X5R M H:0.85mm, wait CIS symbol.
+3.3V_RUN
BLM21PG600SN1D_0805~D
1
C530
0.1U_0402_16V4Z~D
CLK_SCLK <17,18>
Placec these caps closed to CK410M
+CK_VDD_48
C569
0.047U_0402_16V4Z~D
C552
4.7U_0603_6.3V6M~D
1
2
C166
12
27P_0402_50V8J~D
C174
27P_0402_50V8J~D
12
CLK_ICH_48M
CPU_MCH_BSEL0
CLK_PCI_LOMPCI_LOM
CLK_PCI_PCCARDPCI_PCCARD
CLK_ICH_14M
MCH_DREFCLK
MCH_DREFCLK#
CLK_PCI_ICH
+3.3V_RUN
XTALIN_CLK_GEN
PIN43
0
DOT96TDOT96C 96/100M_T 96/100M_C
1
27M_out
4
2
BLM21PG600SN1D_0805~D
+CK_VDD_REF
C549
0.047U_0402_16V4Z~D
1
1
2
2
12
X2
14.31818MHz_20P_1BX14318CC1A~D
12
390_0402_5%~D
R14233_0402_5%~D
R1418.2K_0402_5%~D
12
CPU_MCH_BSEL1<8,10>
CPU_MCH_BSEL2<8,10>
R12233_0402_5%~D
R12333_0402_5%~D
R12533_0402_5%~D
R12833_0402_5%~D
R14433_0402_5%~D1@
12
R15233_0402_5%~D1@
12
R12133_0402_5%~D
12
R12010K_0402_5%~D
12
CLK_ENABLE#<42>
R456
2@
Ra
Rb
R459
2@
12
33_0402_5%~D
12
150_0402_5%~D
PIN44
27M SSout
L48
12
+CK_VDD_MAIN2
L44
12
C543
0.047U_0402_16V4Z~D
1
2
CLK_XTAL_IN
CLK_XTAL_OUT
R119
12
R1278.2K_0402_5%~D
12
12
12
12
12
R464475_0603_1%~D
DOT96
DOT96#
PIN47PIN48
SRCT0
3
+CK_VDD_MAIN
1
C579
10U_0805_10V4Z~D
2
1
C542
10U_0805_10V4Z~D
2
R455
1_0603_5%~D
+CK_VDD_REF
12
+CK_VDD_48
12
R132
2.2_0603_5%~D
FSA
CPU_MCH_BSEL1
FSC
12
PCI_SIOCLK_PCI_5004
CLKREF
DOT96
DOT96#PCIE_MINI1
PCI_ICH
CLK_ENABLE#
CLKIREF
CLK_SCLK
CLK_SDATA
SRCC0
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
place Decoupling as closed physically possible to each VDD oins
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Yonah Processor(2/2)
LA-3001P
873Monday, April 17, 2006
1
of
0.4
5
4
3
2
1
Intel CRB schematic suggest to use X5R or better
+VCC_CORE
DD
CC
Place these inside
socket cavity on L8
(North side
Secondary)
Place these inside
socket cavity on L8
(North side
Secondary)
Place these inside
socket cavity on L8
(North side
Secondary)
Place these inside
socket cavity on L8
(North side
Secondary)
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
C110
10U_0805_4VAM~D
C81
10U_0805_4VAM~D
C475
10U_0805_4VAM~D
C320
10U_0805_4VAM~D
1
C101
10U_0805_4VAM~D
2
1
C444
10U_0805_4VAM~D
2
1
C394
10U_0805_4VAM~D
2
1
C93
10U_0805_4VAM~D
2
1
C103
10U_0805_4VAM~D
2
1
C476
10U_0805_4VAM~D
2
1
C422
10U_0805_4VAM~D
2
1
C446
10U_0805_4VAM~D
2
1
C92
10U_0805_4VAM~D
2
1
C395
10U_0805_4VAM~D
2
1
C443
10U_0805_4VAM~D
2
1
C329
10U_0805_4VAM~D
2
1
C82
10U_0805_4VAM~D
2
1
C423
10U_0805_4VAM~D
2
1
C333
10U_0805_4VAM~D
2
1
C481
10U_0805_4VAM~D
2
1
C126
10U_0805_4VAM~D
2
1
C375
10U_0805_4VAM~D
2
1
C353
10U_0805_4VAM~D
2
1
C316
10U_0805_4VAM~D
2
1
C117
10U_0805_4VAM~D
2
1
C354
10U_0805_4VAM~D
2
1
C119
10U_0805_4VAM~D
2
1
C334
10U_0805_4VAM~D
2
1
C111
10U_0805_4VAM~D
2
1
C321
10U_0805_4VAM~D
2
1
C127
10U_0805_4VAM~D
2
1
C374
10U_0805_4VAM~D
2
10uF 0805 X6S -> 105 degree C
High Frequence Decoupling
Near VCORE regulator
+VCC_CORE
South Side Secondary
BB
+1.05V_VCCP
1
+
330U_D2E_2.5VM_R9~D@
AA
C432
2
1
C484
0.1U_0402_10V7K~D
2
1
+
C125
C324
2
330U_D_2VM_R6~D
330U_D_2VM_R6~D
6mOhm
6mOhm
PS CAP
PS CAP
1
C485
0.1U_0402_10V7K~D
2
1
1
+
+
C88
2
2
330U_D_2VM_R6~D
6mOhm
PS CAP
1
C130
2
330U_D_2VM_R6~D
6mOhm
PS CAP
1
C486
0.1U_0402_10V7K~D
2
+
C108
330U_D_2VM_R6~D
6mOhm
PS CAP
@
@
1
1
+
C98
2
2
330U_D_2VM_R6~D
6mOhm
PS CAP
1
C312
0.1U_0402_10V7K~D
2
North Side Secondary
+
1
C309
0.1U_0402_10V7K~D
2
ESR <= 1.5m ohm
Capacitor > 1980uF
1
C310
0.1U_0402_10V7K~D
2
Place these inside
socket cavity on L8
(North side
Secondary)
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
CPU Bypass
LA-3001P
973Monday, April 17, 2006
1
0.4
of
5
H_D#[0..63]<7>
DD
CC
+1.05V_VCCP
54.9_0402_1%~D
12
12
R383
R79
54.9_0402_1%~D
BB
Layout Note:
H_XRCOMP & H_YRCOMP / H_SWNG0 &
H_SWNG1 trace width and spacing is 10/20
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
1
Description at page12
Note :
CFG3:17 has
internal pullup,
CFG18:19 has
internal pulldown
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
CFG6
CFG7
CFG9
CFG10
CFG11
CFG[13:12]
CFG16
(FSB Dynamic ODT)
CFG18
(VCC Select)
CFG19
(DMI Lane Reversal)
SDVO_CTRLDATA
CFG20
(PCIE/SDVO s e l ect)
C580.1U_0402_16V4Z~D 2@
12
C610.1U_0402_16V4Z~D 2@
C630.1U_0402_16V4Z~D 2@
12
C680.1U_0402_16V4Z~D 2@
12
C740.1U_0402_16V4Z~D 2@
12
C800.1U_0402_16V4Z~D 2@
12
C870.1U_0402_16V4Z~D 2@
12
C910.1U_0402_16V4Z~D 2@
12
C960.1U_0402_16V4Z~D 2@
12
C1060.1U_0402_16V4Z~D 2@
12
C1090.1U_0402_16V4Z~D 2@
12
C1120.1U_0402_16V4Z~D 2@
12
C1200.1U_0402_16V4Z~D 2@
12
C1230.1U_0402_16V4Z~D 2@
12
C1340.1U_0402_16V4Z~D 2@
12
C1360.1U_0402_16V4Z~D 2@
12
C1420.1U_0402_16V4Z~D 2@
12
12
C650.1U_0402_16V4Z~D 2@
12
C710.1U_0402_16V4Z~D 2@
12
C790.1U_0402_16V4Z~D 2@
12
C840.1U_0402_16V4Z~D 2@
12
C900.1U_0402_16V4Z~D 2@
12
C940.1U_0402_16V4Z~D 2@
12
C1050.1U_0402_16V4Z~D 2@
12
C1070.1U_0402_16V4Z~D 2@
12
C1130.1U_0402_16V4Z~D 2@
12
C1160.1U_0402_16V4Z~D 2@
12
C1240.1U_0402_16V4Z~D 2@
12
C1290.1U_0402_16V4Z~D 2@
12
C1370.1U_0402_16V4Z~D 2@
12
C1400.1U_0402_16V4Z~D 2@
12
C1470.1U_0402_16V4Z~D 2@
12
Low = DMI x 2
High = DMI x 4
*
Low = Moby Dick
High = Calistoga
*
Low = DT/Transportable CPU
High = Mobile CPU
*
Low = Reverse Lane
High = Normal Operation
*
Low = Reserved
High = Mobility
Low = Calistoga
High = Reserved
00 = Reserved
01 = XOR Mode Enabled
10 = All Z Mode Enabled
11 = Normal Operation
*
*
(Default)
Low = Disabled
High = Enabled
Low = 1.05V (Default)
High = 1.5V
Low = Normal
Operation (De f ault):
Lane number in Order
*
*
*
High = Reverse Lane
Low = No SDVO Devi c e Present
(Default)
High = SDVO Dev i c e Present
Low = Only PCIE or SDVO is
Route VSSACRTDAC gnd from GMCH to
decoupling cap ground lead and then
connect to the gnd plane.
Connect the GND plane of pin G20
with decoupling cap of C296 pin2
GND via.
C33
10U_0805_4VAM~D1@
1
2
10U_0805_4VAM~D
Cc Cd
C30
Note : Ca~Cd No stuff for Ext. VGA.
Stuff for Int. VGA.
VCCTX_LVDS
4.7U_0603_6.3V6M~D1@
+2.5V_RUN
12
1
C304
12
C131
1@
C59
C274
0.1U_0402_16V4Z~D1@
2
L13
+1.5VRUN_PCIE
12
BLM21PG600SN1D_0805~D
Route +2.5V_RUN from GMCH pinG41 to
decoupling cap (C314)<200mil to the edge.
12
L10BLM18PG181SN1_0603~D1@
CRTDAC: Route caps within
250mil of Alviso. Route FB
within 3" o f Calistoga
+1.5V_RUN
C43
0.01U_0402_16V7K~D1@
1
2
+1.5V_RUN_QTVDAC
C290
0.1U_0402_16V4Z~D1@
1
1
2
2
close pin B30/C30/A30
+1.5V_RUN_3GPLL+1.5V_RUN
0.1U_0402_16V4Z~D
C447
1
2
Should be placed in cavity
10U_0805_4VAM~D
C448
1
2
R409
12
0.5_0805_1%~D
+3GPLL_R
3
For Power measurement.
No need for RTS board
R99
0.1U_0402_16V4Z~D
22n_0805_25V
C273
1
1@
2
12
0_0805_5%~D
C271
1@
VCCD_TV_DAC
12
Cl
3
VCCA_LVDS
C41
0.1U_0402_16V4Z~D1@
+1.5V_RUN
+2.5V_RUN
close pin D21
0_0402_5%~D
0.022U_0402_16V7K~D
C270
1
1@
2
R540_0402_5%~D2@
C40
0.01U_0402_16V7K~D1@
1
1
2
2
1@
close pin A38
For Power measurement.
No need for RTS board
L39
+3V_GPLL
12
BLM21PG600SN1D_0805~D
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
12
0_0805_5%~D
3
+2.5V_RUN
1
2
+3VRUN_ATVBG
+3VRUN_TVDACA
+3VRUN_TVDACB
+3VRUN_TVDACC
R323
12
R421
2
+2.5V_RUN
R520_0402_5%~D1@
C314
0.1U_0402_16V4Z~D
+1.5V_RUN
+1.5V_RUN
+1.5V_RUN
+1.5V_RUN
VCCD_TVDAC
12
R510_0402_5%~D2@
+1.05V_VCCP
R600_0402_5%~D2@
+2.5V_RUN
R470_0402_5%~D1@
R480_0402_5%~D2@
R290_0402_5%~D1@
R240_0402_5%~D2@
R250_0402_5%~D1@
R300_0402_5%~D2@
R410_0402_5%~D1@
R460_0402_5%~D2@
R200_0402_5%~D1@
R230_0402_5%~D2@
45mA Max.45mA Max.
0.1U_0402_16V4Z~D
40mA Max.
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
C514
1
2
VCCTX_LVDS
12
12
+2.5V_CRTDAC
12
VCCA_LVDS
12
12
VCCA_TVBG
12
12
VCCA_TVDACA
12
12
VCCA_TVDACB
12
12
VCCA_TVDACC
12
12
+1.5V_RUN_QTVDAC
0.022U_0402_16V7K~D
C307
1
2
+1.5V_RUN_HPLL
1
C460
2
+1.5V_RUN_DPLLA
1
C279
2
+3VRUN_TVDACA
12
0.022U_0402_16V7K~D
1@
3
22n_0805_25V1@
C14
Ce
1
2
+3VRUN_TVDACB
12
0.022U_0402_16V7K~D
1@
3
22n_0805_25V1@
C25
Cf
1
2
+3VRUN_TVDACC
12
0.022U_0402_16V7K~D
1@
3
22n_0805_25V1@
C39
CgCh
1
2
Ck
+1.5VRUN_QTVDAC
12
22n_0805_25V
C31
3
+1.5V_RUN
L38
12
BLM11A121S_0603~D
1
C450
22U_0805_6.3VAM~D
2
L6
12
10U_CK2125 100M-T_20%_0805~D
LaLb
1
+
C15
470U_D2_2.5VM_R15~D1@
2
Note : C15,C311 stuff for UMA
No Stuff for Ext. VGA.
2
BLM18PG181SN1_0603~D
1
2
La, Lb use 0_0805_5% resistor
for Int. VGA as Travis.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Place C255 as close to the
Guardian pins as possible
1
C253
@
2200P_0402_50V7K~D
2
Place near the bottom SODIMM For UMA design
1
22U_1206_10V4Z~D
2
21
+3.3V_SUS
0.1U_0402_16V4Z~D
Vset=(Tp-70/21)
+3.3V_SUS
C247
0.1U_0402_16V4Z~D
Q13
1@
E
31
PMBT3904_SOT23~D
B
2
C
+FAN1_VOUT
1000P_0402_50V7K~D@
1
C234
2
Place C252 as close to the
Guardian pins as possible
2200P_0402_50V7K~D
C252
R320
49.9_0603_1%~D
12
1
C268
2
+RTC_CELL
0.1U_0402_16V4Z~D
1
2
332K_0402_1%~D
118K_0402_1%~D
To cut the stub trace
for discrete M/B
R608 0_0402_5%~D1@
R609 0_0402_5%~D1@
For Discrete: Stuff R259,R249 and no stuff Q13,C253
For UMA: Stuff Q13 and no stuff R259,R249
5
FAN1_TACH <30>
1000P_0402_50V7K~D
DAT_SMB
CLK_SMB
12
R2847.5K_0402_5%~D
+3VSUS_THRM
12
R3151K_0402_5%~D
12
R3161K_0402_5%~D
THERMATRIP1#
THERMATRIP2#
THERMTRIP_VGA#
C255
2200P_0402_50V7K~D
4
+FAN1_VOUT
SMBUS ADDRESS : 2F
R259
2@
2@
0_0402_5%~D
R249
0_0402_5%~D
U16
7
SMDATA
8
SMBCLK
23
LDO_SHDN#_ADDR
35
DP2
34
DN2
12
+3V_SUS
21
VSUS_PWRGD
18
+RTC_PWR3V
13
+3V_PWROK#
38
POWER_SW#
14
THERMTRIP1#
15
THERMTRIP2#
16
THERMTRIP3#
39
VSET
29
HW_LOCK#
9
VSS
1
DP3
2
DN3
6
FAN_OUT
33
FAN_DAC
10
GPIO1
11
GPIO2
19
GPIO3
20
GPIO4
32
GPIO5
41
Thermal
EMC4000_C_QFN40~D
VGA_THERMDN_R
12
VGA_THERMDP_R
12
+1.05V_VCCP
THERMTRIP_MCH#<10>
THERMTRIP_SIO
2.2K_0402_5%~D
12
H_THERMTRIP#<7>
2.2K_0402_5%~D
12
ATF_INT#
LDO_POK
THERM_STP#
INTRUDER#
LDO_SET
LDO_OUT
LDO_OUT
LDO_IN
LDO_IN
VDD_5V
+5V_RUN
10U_0805_10V4Z~D
R255
PMBT3904_SOT23~D
R278
PMBT3904_SOT23~D
VCP
VCP
DN1
DP1
C257
1
2
+3.3V_SUS
12
R260
8.2K_0402_5%~D
THERMATRIP1#
C
1
31
12
8.2K_0402_5%~D
R317
THERMATRIP2#
C
31
1K_0603_5%~D
12
R279
C262
0.1U_0402_16V4Z~D
2
1
C267
0.1U_0402_16V4Z~D
2
ATF_INT# <30>
+3.3V_ALW
R28510K_0402_5%~D@
1
C11
10U_0805_10V4Z~D
2
1
C259
1U_0603_10V4Z~D
2
May need to place thermal resistor underneath WWAN Mini Card stuff
this thermistor circuit for additional sensor in Discrete Down Designs
+5V_SUS
10KB_0603_1%_TSM1A103F34D3R~D
R21
2.21K_0603_1%~D
1
C16
2200P_0402_50V7K~D
2
2.5V_RUN_PWRGD <33>
1
C251
12
R250
10K_0402_5%~D
2200P_0402_50V7K~D
2
THERMTRIP_SIO <31>
ACAV_IN <30,43>
THERM_STP# <39>
12
1
C17
2
1
C260
2
+RTC_CELL
+2.5V_RUN
@
0.1U_0402_16V4Z~D
12
0.27_1210_5%~D
@
0.1U_0402_16V4Z~D
2
B
E
Q14
+3.3V_SUS
2
B
E
Q20
ATF_INT#
17
VCP1
3
VCP2
40
31
REM_DIODE1_ N , R E M _ D I O D E 1_P routing together.
Trace width / Spacing = 10 / 10 mil
REM_DIODE1_N
36
REM_DIODE1_P
37
30
4
22
LDO_SET
24
25
27
26
28
+3V_LDOIN
5
1
C261
0.1U_0402_16V4Z~D
2
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
Place thermal resistor near the SODIMM For discrete design
+5V_SUS
VCP1
R440
12
2N7002_SOT23~D
Q24
Place under CPU
E
31
B
Q3
2
PMBT3904_SOT23~D
C
Place C251 as close to the
Guardian pins as possible
R251
+3.3V_RUN
2
13
D
S
LDO_SET
+5V_SUS
2
G
2N7002_SOT23~D
2@
Q7
+2.5V_RUN
12
R18
2@
10K_0402_5%~D
5V_CAL_SIO# <31>
R280
@
31.6K_0402_1%~D
R133
10KB_0603_1%_TSM1A103F34D3R~D
R19
2@
2.21K_0603_1%~D
1
C12
2@
2200P_0402_50V7K~D
2
+5V_SUS
R22
10K_0402_5%~D
13
D
2
G
S
1
C100
2
Voltage marg i n i n g c i r c uit for LDO output.For
Vmargin, stu f f R 2 80 = 3 1 . 6K and R279=1K for production
2@
12
Dell COE schematic suggest populate
for discrete down design
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
V_DDR_MCH_REF
DDR_B_D3
DDR_B_D2DDR_B_D5
DDR_B_DM0
DDR_B_D7DDR_B_DQS0
DDR_B_D6
DDR_B_D12
DDR_B_D13
DDR_B_DM1
M_CLK_DDR3
M_CLK_DDR#3
DDR_B_D14
DDR_B_D15
DDR_B_D20
DDR_B_D21
DDR_B_DM2
DDR_B_D22
DDR_B_D23
DDR_B_D28
DDR_B_D29
DDR_B_DQS#3
DDR_B_DQS3
DDR_B_D30
DDR_B_D31
DDR_CKE3_DIMMB
DDR_B_MA11
DDR_B_MA7
DDR_B_MA6
DDR_B_MA4
DDR_B_MA2
DDR_B_MA0
DDR_B_BS1
DDR_B_RAS#
DDR_CS2_DIMMB#
M_ODT2
DDR_B_MA13
DDR_B_D36
DDR_B_D37
DDR_B_DM4
DDR_B_D38
DDR_B_D39
DDR_B_D44
DDR_B_D45
DDR_B_DQS#5
DDR_B_DQS5
DDR_B_D46
DDR_B_D47
DDR_B_D52
DDR_B_D53
M_CLK_DDR2
M_CLK_DDR#2
DDR_B_DM6
DDR_B_D54
DDR_B_D55
DDR_B_D60
DDR_B_D61
DDR_B_DQS#7
DDR_B_DQS7
DDR_B_D62
DDR_B_D63
12
R506
10K_0402_5%~D
12
1
2.2U_0603_6.3V6K~D
M_CLK_DDR3 <10>
M_CLK_DDR#3 <10>
PM_EXTTS#0_R <17>
DDR_CKE3_DIMMB <10>
DDR_B_BS1 <11>
DDR_B_RAS# <11>
DDR_CS2_DIMMB# <10>
M_ODT2 <10>
M_CLK_DDR2 <10>
M_CLK_DDR#2 <10>
+3.3V_RUN
R510
10K_0402_5%~D
C628
1
2
V_DDR_MCH_REF <10,17,41>
0.1U_0402_16V4Z~D
C622
1
2
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
DDRII-SODIMM SLOT-B
LA-3001P
1873Monday, April 17, 2006
1
of
0.4
Loading...
+ 39 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.