Mobile Yonah uFCPGA with Intel
Calistoga_P/GM+ ICH7-M core logic
33
2005-10-26
REV:0.3
44
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
A
B
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
2005/05/262006/07/26
Compal Secret Data
Deciphered Date
Title
Size Document NumberRev
Custom
D
Date:Sheet
Compal Electronics, Inc.
Cover Sheet
LA-2952P
E
0.3
of
146Wednesday, October 26, 2005
A
Compal confidential
File Name : LA-2952P
B
C
D
E
Caymus
11
CRT / TV-OUT
LCD CONN
22
daughter board
Mini-Card
10/100/1000 LAN
LED
33
page 29
RTC CKT.
page 19
BCM5753M
page 22/23
RJ45/11 CONN
page 23
WLAN
page 24
Slot 0/Smart Card
Fan Control
page 4
page 16
page 17
DVI
CH7307C
page 16
CardBus Controller
TI PCI6612
H_A#(3..31)
Intel Calistoga MCH
PCI-E BUS
PCI BUS
SD/MMC Slot
Mobile Yonah/Merom
uFCPGA-478 CPU
FSB
533/667MHz
945GM
PCBGA 1466
page 7,8,9,10,11,12
DMI
Intel ICH7-M
mBGA-652
page 18,19,20,21
SPI ROM
25LF080A
H_D#(0..63)
AC-LINK/Azalia
SPI
page 29
Thermal Sensor
ADM1032AR
page 4page 4,5,6
DDR2 -400/533/667
Dual Channel
USB2.0
SATA
PATA Slave
Clock Generator
ICS9LP306BGLFT
page 15
DDR2-SO-DIMM X2
BANK 0, 1, 2, 3
page 13,14
USB conn x2
(Docking)
page 32
FingerPrinter AES2501
USBx1
USB conn x3
BT Conn
page 29
page 27
page 27
Mini-Card WWAN
page 24
Audio CKT
AD1981HD
page 25
SATA HDD Connector
page 19
Multi-bay II Connector
page 19
LPC BUS
Power OK CKT.
page 34
Accelerometer
LIS3LV02DQ
page 24
daughter board
MDC
page 31
AMP & Audio Jack
MAX9710
Docking CONN.
*RJ-45(LED*2)
*RJ-11(Pass Through)
*CRT
*COMPOSITE Video Out
*TVOUT
*DVI
*LINE IN
*LINE OUT
page 26
*PCI-E x2
*Serial Port
*Parallel Port
*PS/2 x2
*USB x2
Power On/Off CKT.
page 31
TPM 1.2
page 29
SMSC KBC 1021
page 30
SMSC Super I/O
LPC47N217
page 34
*DC JACK
44
DC/DC Interface CKT.
page 33
Touch Pad CONN.
Int.KBD
page 37page 31
COM1LPT
( Docking )( Docking )
page 32page 32
page 34
Power Circuit DC/DC
Page 35,36,37,38,39,40,41,42,43
A
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
B
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
2005/05/262006/07/26
Compal Secret Data
Deciphered Date
Title
Size Document NumberRev
Custom
D
Date:Sheet
Compal Electronics, Inc.
Block Diagram
LA-2952P
E
0.3
of
246Wednesday, October 26, 2005
5
4
3
2
1
Voltage Rails
Power Plane
VIN
DD
CC
B+
+CPU_CORE
+VCCP
+0.9VS
+1.5VS
+1.8V
+2.5VS
+3VALW
+5VALW
+5VS
+RTC_VCC
Note : ON* means that this power plane is ON only with AC power available, otherwise it is OFF.
Description
Adapter power supply (18.5V)
AC or battery power rail for power circuit
Core voltage for CPU
1.05V power rail for Processor I/O and MCH/ICH core power
0.9V switched power rail for DDRII Vtt
1.5V switched power rail for PCI-E interface
1.8V power rail for DDRII
3.3V always on power rail
3.3V switched power rail+3VS
5V always on power rail
5V switched power rail
RTC powerONON
S0-S1
S3
N/A
N/A
N/A
ONOFF
ON
OFF
OFF
ON
ON
OFF
ON
ON
ON+1.8VSOFFOFF1.8V switched power rail
ONOFF
ON
ON
ONOFFOFF
ON
ON
ON
OFF
ON
S5
N/A
N/AN/A
OFF
OFF
OFF
OFF
OFF
OFF2.5V switched power rail for MCH video PLL
ON*
ON*
OFF
Symbol Note :
: means Digital Ground
: means Analog Ground
@ : means just reserve , no build
M52@ : means build discrete sku with ATI VGA M52 .
UMA@ : means build UMA sku with Intel 945GM .
SPI@ : means just build when SPI I/F BIOS function reserve.
FWH@ : means just build when FWH I/F BIOS function reserve.
NOXDP@ : means just build when XDP function disable.
XDP@ : means just build when XDP function enable. When this time, docking PCI express will not work.
1021@ : means just build when SMsC KBC1021 chip selected.
LP@ : means just build when Low power clock gen. install
NOLP@ : means just build when Low power clock gen. NO install
45@ : means need be mounted when 45 level assy or rework stage.
Internal PCI Devices
DEVICE
LAN
AzaliaD27
USB1.1/2.0
PCI to PCI (DMI to PCI)
AC97 MODEM
AC97 Audio
PATA/SATA
LPC I/F
SMBUS
CPU I/F
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
2005/05/262006/07/26
Compal Secret Data
Deciphered Date
Title
Size Document NumberRev
2
Date:Sheet
Compal Electronics, Inc.
Yonah CPU in mFCPGA479
LA-2952P
1
of
546Wednesday, October 26, 2005
0.3
5
4
3
2
1
DD
Place these capacitors on L8
(North side,Secondary Layer)
Place these capacitors on L8
(North side,Secondary Layer)
Place these capacitors on L8
(Sorth side,Secondary Layer)
CC
Place these capacitors on L8
(Sorth side,Secondary Layer)
+VCC_CORE
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
C899
10U_0805_6.3V6M
C907
10U_0805_6.3V6M
C915
10U_0805_6.3V6M
C923
10U_0805_6.3V6M
1
C900
10U_0805_6.3V6M
2
1
C908
10U_0805_6.3V6M
2
1
C916
10U_0805_6.3V6M
2
1
C924
10U_0805_6.3V6M
2
1
C901
10U_0805_6.3V6M
2
1
C909
10U_0805_6.3V6M
2
1
C917
10U_0805_6.3V6M
2
1
C925
10U_0805_6.3V6M
2
1
C902
10U_0805_6.3V6M
2
1
C910
10U_0805_6.3V6M
2
1
C918
10U_0805_6.3V6M
2
1
C926
10U_0805_6.3V6M
2
1
C903
10U_0805_6.3V6M
2
1
C911
10U_0805_6.3V6M
2
1
C919
10U_0805_6.3V6M
2
1
C927
10U_0805_6.3V6M
2
1
C904
10U_0805_6.3V6M
2
1
C912
10U_0805_6.3V6M
2
1
C920
10U_0805_6.3V6M
2
1
C928
10U_0805_6.3V6M
2
1
C905
10U_0805_6.3V6M
2
1
C913
10U_0805_6.3V6M
2
1
C921
10U_0805_6.3V6M
2
1
C929
10U_0805_6.3V6M
2
1
C906
10U_0805_6.3V6M
2
1
C914
10U_0805_6.3V6M
2
1
C922
10U_0805_6.3V6M
2
1
C930
10U_0805_6.3V6M
2
Mid Frequence Decoupling
+VCC_CORE
330U_D2E_2.5VM_R9
1
+
C931
330U_D2E_2.5VM_R9
BB
@
C932
2
330U_D2E_2.5VM_R9@
1
1
+
+
C935
C933
2
2
330U_D2E_2.5VM_R9
1
+
2
330U_D2E_2.5VM_R9
1
+
C937
C936
2
330U_D2E_2.5VM_R9
820U_E9_2_5V_M_R745@
1
1
+
C934
2
1
+
+
C938
2
820U_E9_2_5V_M_R7
2
@
ESR <= 1.5m ohm
Capacitor > 1980uF
+VCCP
1
+
C983
330U_D2E_2.5VM_R9
AA
2
5
1
C940
0.1U_0402_10V6K
2
1
C941
0.1U_0402_10V6K
2
1
2
4
C942
0.1U_0402_10V6K
1
C943
0.1U_0402_10V6K
2
1
C944
0.1U_0402_10V6K
2
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
1
C945
0.1U_0402_10V6K
2
3
2005/05/262006/07/26
Compal Secret Data
Deciphered Date
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
CPU Bypass capacitors
LA-2952P
646Wednesday, October 26, 2005
1
of
0.3
5
4
3
2
1
H_D#[0..63]<4>
DD
CC
L
H_XSCOMP/H_YSCOMP trace
width and spacing is 5/20.
Layout Note:
V_DDR_MCH_REF
trace width and
spacing is 20/20.
V_DDR_MCH_REF
1
C895
2
0.1U_0402_16V4Z
Stuff R1202 & R1203 for A1 Calistoga
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Layout Note:
Place one cap close to every 2 pullup
resistors terminated to +0.9V
+0.9V
0.1U_0402_16V4Z
1
2
C176
DDR_B_MA1
DDR_B_MA3
DDR_B_BS#0
DDR_B_MA10
DDR_B_MA0
DDR_B_BS#1
DDR_B_RAS#
DDR_CS2_DIMMB#
DDR_B_CAS#
DDR_B_WE#
DDR_CS3_DIMMB#M_ODT2
M_ODT3
0.1U_0402_16V4Z
1
2
1
2
C179
RP14
RP17
RP16
RP18
RP19
RP23
C265
0.1U_0402_16V4Z
14
23
14
23
14
23
14
23
14
23
23
14
5
2.2U_0805_16V4Z
C247
1
2
0.1U_0402_16V4Z
1
2
C186
56_0404_4P2R_5%
56_0404_4P2R_5%
56_0404_4P2R_5%
56_0404_4P2R_5%
56_0404_4P2R_5%
56_0404_4P2R_5%
1
2
C197
2.2U_0805_16V4Z
+0.9V
C159
1
2
0.1U_0402_16V4Z
1
2
C213
2.2U_0805_16V4Z
C164
1
2
0.1U_0402_16V4Z
0.1U_0402_16V4Z
1
2
C220
RP10 56_0404_4P2R_5%
14
23
RP11 56_0404_4P2R_5%
14
23
RP12 56_0404_4P2R_5%
14
23
RP13 56_0404_4P2R_5%
14
23
RP15 56_0404_4P2R_5%
14
23
RP21 56_0404_4P2R_5%
14
23
RP9
14
23
56_0404_4P2R_5%
0.1U_0402_16V4Z
0.1U_0402_16V4Z
C166
1
2
0.1U_0402_16V4Z
1
1
2
2
C183
C210
DDR_B_MA9
DDR_B_MA12
DDR_CKE3_DIMMB
DDR_B_MA11
DDR_B_MA5
DDR_B_MA8
DDR_B_MA7
DDR_B_MA6
DDR_B_MA4
DDR_B_MA2
DDR_B_MA13
DDR_B_BS#2
DDR_CKE2_DIMMB
0.1U_0402_16V4Z
C219
1
2
0.1U_0402_16V4Z
1
2
C199
0.1U_0402_16V4Z
C188
1
1
2
2
0.1U_0402_16V4Z
0.1U_0402_16V4Z
1
1
2
2
C173
Layout Note:
Place these resistor
closely JP10,all
trace length Max=1.5"
4
C218
4
C161
3
+1.8V
JP10
1
VREF
3
DDR_B_D0
DDR_B_D5
DDR_B_DQS#0
DDR_B_DQS0
DDR_B_D7
DDR_B_D3
DDR_B_D8
DDR_B_D9
DDR_B_DQS#1
DDR_B_DQS1
DDR_B_D10
DDR_B_D11
DDR_B_D20
DDR_B_DQS#2
DDR_B_DQS2
DDR_B_D22
DDR_B_D23
DDR_B_D24
DDR_B_D25
DDR_B_DM3
DDR_B_D30
DDR_B_D31
DDR_CKE2_DIMMB<7>
DDR_B_BS#2<8>
DDR_B_BS#0<8>
0.1U_0402_16V4Z
0.1U_0402_16V4Z
1
1
2
2
C177
C163
DDR_B_WE#<8>
DDR_B_CAS#<8>
DDR_CS3_DIMMB#<7>
M_ODT3<7>
ICH_SMBDATA<4,13,15,20,22,24>
ICH_SMBCLK<4,13,15,20,22,24>
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
DDR_CKE2_DIMMB
DDR_B_BS#2
DDR_B_MA12
DDR_B_MA9
DDR_B_MA8
DDR_B_MA5
DDR_B_MA3
DDR_B_MA1
DDR_B_MA10
DDR_B_BS#0
DDR_B_WE#
DDR_B_CAS#
DDR_CS3_DIMMB#
M_ODT3
DDR_B_D37
DDR_B_D36
DDR_B_DQS#4
DDR_B_DQS4
DDR_B_D35
DDR_B_D34
DDR_B_D40
DDR_B_D41
DDR_B_DM5
DDR_B_D42
DDR_B_D47
DDR_B_D48
DDR_B_D53
DDR_B_DQS#6
DDR_B_DQS6
DDR_B_D51
DDR_B_D50
DDR_B_D60
DDR_B_D61
DDR_B_DM7
DDR_B_D58
DDR_B_D59
ICH_SMBDATA
ICH_SMBCLK
+3VS
1
C301
0.1U_0402_16V4Z
2005/05/262006/07/26
2
Compal Secret Data
VSS
5
DQ0
7
DQ1
9
VSS
11
DQS0#
13
DQS0
15
VSS
17
DQ2
19
DQ3
21
VSS
23
DQ8
25
DQ9
27
VSS
29
DQS1#
31
DQS1
33
VSS
35
DQ10
37
DQ11
39
VSS
41
VSS
43
DQ16
45
DQ17
47
VSS
49
DQS2#
51
DQS2
53
VSS
55
DQ18
57
DQ19
59
VSS
61
DQ24
63
DQ25
65
VSS
67
DM3
69
NC
71
VSS
73
DQ26
75
DQ27
77
VSS
79
CKE0
81
VDD
83
NC
85
BA2
87
VDD
89
A12
91
A9
93
A8
95
VDD
97
A5
99
A3
101
A1
103
VDD
105
A10/AP
107
BA0
109
WE#
111
VDD
113
CAS#
115
NC/S1#
117
VDD
119
NC/ODT1
121
VSS
123
DQ32
125
DQ33
127
VSS
129
DQS4#
131
DQS4
133
VSS
135
DQ34
137
DQ35
139
VSS
141
DQ40
143
DQ41
145
VSS
147
DM5
149
VSS
151
DQ42
153
DQ43
155
VSS
157
DQ48
159
DQ49
161
VSS
163
NC,TEST
165
VSS
167
DQS6#
169
DQS6
171
VSS
173
DQ50
175
DQ51
177
VSS
179
DQ56
181
DQ57
183
VSS
185
DM7
187
VSS
189
DQ58
191
DQ59
193
VSS
195
SDA
197
SCL
199
VDDSPD
203
GND
FOX_ASOA426-M2RN-7F
SO-DIMM B
STANDARD
Bottom side
Deciphered Date
DQ12
DQ13
CK0#
DQ14
DQ15
DQ20
DQ21
DQ22
DQ23
DQ28
DQ29
DQS3#
DQS3
DQ30
DQ31
NC/CKE1
NC/A15
NC/A14
RAS#
ODT0
NC/A13
DQ36
DQ37
DQ38
DQ39
DQ44
DQ45
DQS5#
DQS5
DQ46
DQ47
DQ52
DQ53
CK1#
DQ54
DQ55
DQ60
DQ61
DQS7#
DQS7
DQ62
DQ63
GND
VSS
DQ4
DQ5
VSS
DM0
VSS
DQ6
DQ7
VSS
VSS
DM1
VSS
CK0
VSS
VSS
VSS
VSS
DM2
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VDD
VSS
VSS
DM4
VSS
VSS
VSS
VSS
VSS
VSS
CK1
VSS
DM6
VSS
VSS
VSS
VSS
VSS
2
+1.8V
V_DDR_MCH_REF
2
DDR_B_D4
4
DDR_B_D1
6
8
DDR_B_DM0
10
12
DDR_B_D6
14
DDR_B_D2
16
18
DDR_B_D12
20
DDR_B_D13
22
24
DDR_B_DM1
26
28
M_CLK_DDR3
30
M_CLK_DDR#3
32
34
DDR_B_D14
36
DDR_B_D15
38
40
42
DDR_B_D16DDR_B_D21
44
DDR_B_D18
46
48
50
NC
A11
A7
A6
A4
A2
A0
BA1
S0#
NC
SA0
SA1
2
DDR_B_DM2
52
54
DDR_B_D17
56
DDR_B_D19
58
60
DDR_B_D26
62
DDR_B_D28
64
66
DDR_B_DQS#3
68
DDR_B_DQS3
70
72
DDR_B_D29
74
DDR_B_D27
76
78
DDR_CKE3_DIMMB
80
82
84
86
88
DDR_B_MA11
90
DDR_B_MA7
92
DDR_B_MA6
94
96
DDR_B_MA4
98
DDR_B_MA2
100
DDR_B_MA0
102
104
DDR_B_BS#1
106
DDR_B_RAS#
108
DDR_CS2_DIMMB#
110
112
M_ODT2
114
DDR_B_MA13
116
118
120
122
DDR_B_D33
124
DDR_B_D32
126
128
DDR_B_DM4
130
132
DDR_B_D38
134
DDR_B_D39
136
138
DDR_B_D44
140
DDR_B_D45
142
144
DDR_B_DQS#5
146
DDR_B_DQS5
148
150
DDR_B_D43
152
DDR_B_D46
154
156
DDR_B_D49
158
DDR_B_D52
160
162
M_CLK_DDR2
164
M_CLK_DDR#2
166
168
DDR_B_DM6
170
172
DDR_B_D54
174
DDR_B_D55
176
178
DDR_B_D56
180
DDR_B_D57
182
184
DDR_B_DQS#7
186
DDR_B_DQS7
188
190
DDR_B_D62
192
DDR_B_D63
194
196
198
200
204
R257
12
10K_0402_5%
12
10K_0402_5%
R254
Title
Size Document NumberRev
Date:Sheet
0.1U_0402_16V4Z
2.2U_0805_16V4Z
1
1
C89
2
2
M_CLK_DDR3 <7>
M_CLK_DDR#3 <7>
DDR_THERM# <7,13>
DDR_CKE3_DIMMB <7>
DDR_B_BS#1 <8>
DDR_B_RAS# <8>
DDR_CS2_DIMMB# <7>
M_ODT2 <7>
M_CLK_DDR2 <7>
M_CLK_DDR#2 <7>
+3VS
Compal Electronics, Inc.
DDRII-SODIMM SLOT2
LA-2952P
1
V_DDR_MCH_REF <7,13,41>
C90
1
0.3
of
1446Wednesday, October 26, 2005
5
PCI
SRC
CPU
CLKSEL1
0
1
8.2K_0402_5%
FSA
0_0402_5%
CLK_Ra
0_0402_5%
CLK_Rb
8.2K_0402_5%
0_0402_5%
CLK_Rc
FSLA
CLKSEL0
Stuff
No Stuff
Stuff
No Stuff
Stuff
No Stuff
R1078
12
R1083
FSB
12
R1107
R1130
12
R1135
12
12
+VCCP
+VCCP
+VCCP
MHz
133
166
CLK_Ra
CLK_Rd
CLK_Rd
CLK_Ra
CLK_Rd
CLK_Ra
CLK_Re
R1074
@
56_0402_5%
CLK_Rd
12
12
R1079
1K_0402_5%
12
R1086
1K_0402_5%
R1098
1K_0402_5%
12
12
R1105
1K_0402_5%
12
R1113
@
0_0402_5%
CLK_Re
R1128
1K_0402_5%
12
12
R1131
1K_0402_5%
12
R1139
@
0_0402_5%
CLK_Rf
MHz
MHz
33.31
1000
100
33.3
CLK_Rc
CLK_Rb
CLK_Re
CLK_Rf
CLK_Rf
CLK_Re
CLK_Rc
CLK_Rb
CLK_Rf
CLK_Rc
CLK_Rb
MCH_CLKSEL0 <7>CLK_48M_CB<24>
MCH_CLKSEL1 <7>
+3VS
R139410K_0402_5%@
MCH_CLKSEL2 <7>
NOXDP@ : means just build when XDP function disable.
XDP@ : means just build when XDP function enable.
+3VS
+3VS
+3VS
+VCCP
+CK_VDD_DP
1
C1061
0.1U_0402_16V4Z@
2
CLK_14M_ICH<20>
CLK_DEBUG_PORT<24>
12
CLK_MCH_REF<7>
CLK_MCH_REF#<7>
CLK_PCI_SIO<28>
FSLC1FSLB
CLKSEL2
0
Table : ICS954306
DD
FSB Frequency Selet:
CPU Driven
(Default)
*
533MHz
667MHz
CC
CPU_BSEL0<5>
CPU_BSEL1<5>
BB
CLKREF1
CPU_BSEL2<5>
When this time, docking PCI express will not work.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.