THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. N EITHER THIS SHEET N OR THE INFORMATION I T CONTAINS
A
B
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
D
SizeDocument NumberRe v
Abacus/TangII LA-1452
Date:Sheet
Compal Electronics, Inc.
Cover Sheet
E
0.2
of
143Monday, August 26, 2002
A
Compal confidential
Model Name : ABACUS/TangII
File Name :
LA-1452
B
C
D
E
Block Diagram
DT & Mobile Northwood
11
22
Minipci CONN
WIRELESS
+3VALW
+3V
+3VS+3VALW
33
Fan Control
page 7
DT/BD-PE/ICH4/EXT VGA
DT/BD-GL/ICH4/INT VGA
(PIRQE#,G_GNT#,G_REQ#) FOR EXT.
AGP GRAPHIC/CHRONTEL
LVDS Connector
IDSEL:AD18
(PIRQC#D#,GNT#1,REQ#1)
LAN
BCM-4401L
page 26
+3VS
RJ45
EXT. CRT
+3VS 33MHz
IDSEL:AD17
(PIRQB#,GNT#0,REQ#0)
page 22
page 22
CPU Bypass
& CPUVID
page 7, 8
CRT Connector
AGP Conn
TV OUT
page 17
page 16
page 17
CardBus
& 1394
PCI4510/PCI1510
+3V
page 23,24,25
Card Bus
SLOTCONN
page 24
INT. CRT
AGP4X(1.5V)
PCI BUS
IDSEL:AD20
(PIRQA#,GNT#2,REQ#2)
1394
page 23
uFCBGA/uFCPGA CPU
+1.2VP
+CPU_CORE
System Bus
400/533 MHz
INTEL
BROOKDALE-GL/PE
+1.5VS
+2.5V
+1.25VS
+CPU_CORE
760 BGA
HUB LINK
+1.5VS
66MHz
+3VS
+3VALW
+1.5VS
+1.5VALW
+CPU_CORE
VCC5REF
VCC5REFSUS
INTEL
ICH4
421 BGA
LPC BUS
+3VS
33MHz
page 5,6
HD#(0..63)HA#(3..31)
page 9,10,11
page 18,19,20
Memory
BUS(DDR)
48MHz
24.576MHz
ATA100
IDE HDD
+5VALW
page 21
NS EC87591L
845PE / PCI4510
845GL / PCI1510
Touch Pad
LED Status
LID Switch
+5VS
+5VALW
44
Power Circuit
DC/DC
page
34,35,36,37,38,39,40
A
DC/DC Interface
Suspend
page 33
Power On/Off
Reset & RTC
page 32
B
+3VALW
EC I/O Buffer
+5VALW+3VALW
Embedded
Controller
+3VS
+3VALW
page 29
page 30
Int.KBD
+3VALW
BIOS
page 31
page 30
EC DEBUG
page 31
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
page 30
Thermal Sensor
ADM1032
+3VS+3VS
+2.5V 200/266MHz
AC-LINK
IDE
CD-ROM
+5VS
page 21
PIDE IRQ14SIDE IRQ15
page 6
AC97 Codec
+5VDDA
AMP & INT.
Speaker
+5VALW
page 28
DDR-DIMM X2
BANK 0, 1, 2, 3
+2.5V
+1.25VS
STAC9750
page 27
HeadPhone
& MIC Jack
+5VDDA
Dell-Compal Confidential
Title
Size Document NumberRev
Abacus/TangII LA-1452
D
Date:Sheet
Clock Generator
ICS950810
page 12,13,14
2 USB Ports
+3VALW
+5VALW
page 15
page 32
MDC
+3VALW
+3V
page 29
Cable
RJ11
page 28
Compal Electronics, Inc.
Block Diagram
E
0.2
of
243Monday, August 26, 2002
5
4
3
2
1
Revision List
Schematics Rev
SST-Build
DD
PT-Build
ST-Build
QT-Build
0.1
0.20.2
PCB RevCHIPS Rev
0.1
845PE Rev B0
845GL Rev B1
ICH4 Rev B0
Power Managment table
Signal
State
S0
S1
S3
S5 S4/AC
S5 S4/AC don't exist
+3VALW
+5VALW
+12VALW
ON
+3V
+5V
+2.5V
ONON
ONONON
ONON
ONOFF
OFFOFFOFF
+3VS
+5VS
+1.5VS
+1.2VP
+CPU_CORE
+1.25VS
OFF
OFF
Ceramic Capacitor Spec Guide:
CC
Temperature Characteristics:
Symbol
CODE
0
Z5U
8
NP0SH
H
UK
UJ
1
Z5V
9
C0GSJ
I
J
Z5P
A
BJ
SL
3
2
Y5UX7R
C
B
CH
Y5V
CJ
4
5
Y5P
D
E
CK
X5R
6
7
F
G
Tolerance:
Symbol
BB
CODE
+-10%
K
A
+-0.05PF
M
+-20%
B
+-0.1PF
N
+-30%
C
+-0.25PF
P
+100,-0%
D
+-0.5PF+-1PF
Q
+30,-10%
F
V
+20,-10%
G
+-2%
X
+40,-20%
H
+-3%
Z
+80,-20%
J
+-5%
SMBUS Control Table
SOURCE
SMB_EC_CK1
SMB_EC_DA1
SMB_EC_CK2
SMB_EC_DA2
AA
SMB_CLK
SMB_DATA
NS 87591
NS 87591
ICH4
5
INVERTER BATT
SERIALSENSOR
EEPROM
(1010)
THERMAL
(CPU)
(U57) (U25/U23)
4
THERMAL
SENSOR
SODIMMCLK CHIP
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. N EITHER THIS SHEET N OR THE INFORMATION I T CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
MINI PCI
3
NOTE1:
@XX : Depop component
1@XX : Pop for INT, Depop for EXT
2@XX : Pop for EXT, Depop for INT
Title
SizeDocument NumberRe v
2
Date:Sheet
Compal Electronics, Inc.
Note & Revision
Abacus/TangII LA-1452
Dell-Compal Confidential
of
343Monday, August 26, 2002
1
0.2
5
4
3
2
1
PQ26
+1.5VALW
DD
SUSP#
+5VALW
SHDN#
MAX1632
page 36
SIDEPWR
SUSP#
+3VALW
CC
page 34
AC
Battery
B+
VR_ON#
page 34
+12VALW
page 35
page 31
page 21
page 25
SYSON
SUSP#
+5VS
+5VSHDD
+5VDDA
+3V
page 31
+3VS
page 31
SUSP#
VR_ON#
+1.5VS
page 35
CM2843
page 38
+1.2V
+5VS
Mobile
BB
ISL6215
DT
page 38
+CPU_CORE
+3VS
+1.5VS
+2.5V
VGA Conn.
180 pin
+3V
ISL6219
+5VALW
(Either one by CPU)
SUSP#
+12VALW
B+
page 16
+1.25VS
AA
5
SYSON
4
ISL6225
page 36
+2.5V
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMP AL ELECTRONIC S, INC. NEITH ER THIS SHEET NO R THE INFORM ATION IT CONT AINS
A
B
C
D
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
2. Place decoupling cap 220PF near CPU.(Within
500mils)
R265
49.9_0603_1%
Trace width>=7mil
R261
100_0603_1%
1U_0603_10V4Z
E
P22
P25
N21
N24
C319
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMP AL ELECTRONIC S, INC. NEITH ER THIS SHEET NO R THE INFORM ATION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Mobile Northwood / P4 uFCPGA & Thermal sensor (2/2)
Size Document NumberRev
Abacus/TangII LA-1452
Custom
F
G
H
Date:Sheet
I
643Monday, August 26, 2002
0.2
of
J
A
Layout note :
Place close to CPU, Use 2~3 vias per PAD.
Place .22uF caps underneath balls on solder side.
Place 10uF caps on the peripheral near balls.
11
Use 2~3 vias per PAD.
Please place these cap in the socket cavity area
+CPU_CORE
12
22
33
C407
10U_1206_6.3V7K
+CPU_CORE
12
C412
10U_1206_6.3V7K
Please place these cap on the socket north side
+CPU_CORE
12
C388
10U_1206_6.3V7K
B
12
C391
10U_1206_6.3V7K
12
C376
10U_1206_6.3V7K
12
C408
10U_1206_6.3V7K
12
C63
10U_1206_6.3V7K
12
C290
10U_1206_6.3V7K
12
C400
10U_1206_6.3V7K
C
12
C65
10U_1206_6.3V7K
12
C282
10U_1206_6.3V7K
12
C258
10U_1206_6.3V7K
12
C294
10U_1206_6.3V7K
12
C406
10U_1206_6.3V7K
12
C293
10U_1206_6.3V7K
D
E
Layout note :
Place close to CPU power and
ground pin as possible
(<1inch)
For Desktop's CPU:
ESR total=0.75m ohm
C total=6350uF
For Mobile's CPU:
ESR total=1.875m ohm
C total=2590uF
F
+CPU_CORE
+CPU_CORE
+CPU_CORE
+CPU_CORE
.22U_0603_10V7K
+12VALW
G
12
C390
+
470U_D4_2.5V_10m
12
C352
+
470U_D4_2.5V_10m
12
C151
+
330U_D2_2.5V_15m
.22U_0603_10V7K
12
C104
+
+
+
12
C111
.22U_0603_10V7K
12
C371
470U_D4_2.5V_10m
12
C259
470U_D4_2.5V_10m
12
C152
330U_D2_2.5V_15m
.22U_0603_10V7K
12
C113
H
For DT
12
C261
+
470U_D4_2.5V_10m
12
C148
+
470U_D4_2.5V_10m
12
C265
+
330U_D2_2.5V_15m
12
C147
+
470U_D4_2.5V_10m
12
C149
+
470U_D4_2.5V_10m
12
C262
+
330U_D2_2.5V_15m
PLACE ON CPU SIDE
12
C119
.22U_0603_10V7K
.22U_0603_10V7K
12
C120
.22U_0603_10V7K
12
C117
I
12
C110
.22U_0603_10V7K
12
C112
12
C263
+
470U_D4_2.5V_10m
12
C150
+
470U_D4_2.5V_10m
12
C266
+
330U_D2_2.5V_15m
12
C116
.22U_0603_10V7K
J
.22U_0603_10V7K
12
C118
+CPU_CORE
44
55
12
10U_1206_6.3V7K
+CPU_CORE
12
10U_1206_6.3V7K
C411
C403
12
C410
10U_1206_6.3V7K
12
C405
10U_1206_6.3V7K
12
C257
10U_1206_6.3V7K
12
C291
10U_1206_6.3V7K
12
C402
10U_1206_6.3V7K
12
C99
10U_1206_6.3V7K
12
C401
10U_1206_6.3V7K
SUSP<17,33>
.1U_0402_16V4Z
EN_FAN1<30>
R385
13K_0603_1%
Please place these cap on the socket south side
+CPU_CORE
12
C122
10U_1206_6.3V7K
66
77
+CPU_CORE
12
10U_1206_6.3V7K
+CPU_CORE
12
10U_1206_6.3V7K
C351
C409
12
C121
10U_1206_6.3V7K
12
C292
10U_1206_6.3V7K
12
C64
10U_1206_6.3V7K
12
C356
10U_1206_6.3V7K
12
C368
10U_1206_6.3V7K
12
C68
10U_1206_6.3V7K
12
C62
10U_1206_6.3V7K
12
C100
10U_1206_6.3V7K
12
C66
10U_1206_6.3V7K
12
C404
10U_1206_6.3V7K
12
C296
10U_1206_6.3V7K
+12VS
EN_FAN2<30>
R10
13K_0603_1%
Q29
2
13
12
C574
U10LMV321_SOT23-5
12
U1LMV321_SOT23-5
12
SI2303DS
+12VS
+5VS
5
1
+
3
-
2
R381
7.32K_0603_1%
+5VS
5
1
+
3
-
2
R6
7.32K_0603_1%
Fan1 Control circuit
R376
3.48K_0603_1%
4
12
12
21
D22
1N4148
31
2
Q12
2SA1036K
Q10
FMMT619
C578
.1U_0402_16V4Z
12
D21
1N4148
2
Fan2 Control circuit
Q8
R11
3.48K_0603_1%
4
12
12
21
D20
1N4148
31
2
Q1
2SA1036K
2SC2411EK
C234
.1U_0402_16V4Z
12
D6
@1N4148
2
31
21
31
21
+5VS
D14
1SS355
21
+5VFAN_1
C566
@1000P_0402_50V7K
+5VS
D11
1SS355
21
+5VFAN_2
C235
@1000P_0402_50V7K
JP12
1
2
3
MOLEX_53398-0390_3P
12
R340 10K_0402_5%
FAN1_TACH <30>
JP19
1
2
3
MOLEX_53398-0390_3P
12
R200 10K_0402_5%
FAN2_TACH <30>
+3VS
+3VS
Dell-Compal Confidential
88
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMP AL ELECTRONIC S, INC. NEITH ER THIS SHEET NO R THE INFORM ATION IT CONT AINS
A
B
C
D
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
E
F
G
H
Compal Electronics, Inc.
Title
CPU Decoupling CAP. & Fan control
Size Document NumberRev
Abacus/TangII LA-1452
Custom
Date:Sheet
I
of
743Monday, August 26, 2002
J
0.2
10
9
8
7
6
5
4
3
2
1
Mobile CPUDesktop CPU
HH
CPU_VID0<6,40>
CPU_VID1<6,40>
CPU_VID2<6,40>
CPU_VID3<6,40>
GG
CPU_VID4<6,40>
CPU_VID0
CPU_VID1
CPU_VID2
CPU_VID3
CPU_VID4
R2601K_0402_5%
R2591K_0402_5%
R2581K_0402_5%
R2571K_0402_5%
R2561K_0402_5%
+3VS
12
12
12
12
12
MO/DT_CPU
VID
VCC
1.750V
1.700V
1.650V
1.600V
1.550V
1.500V
1.450V
1.400V
1.350V
1.300V
1.250V
+CPU_CORE
FF
EE
ITP_BPM0<6>
ITP_BPM1<6>
ITP_PRDY#<6>
ITP_PREQ#<6 >
H_RESET#<6,9>
ITP_TCK<6>
CLK_ITP<6>
CLK_ITP#<6>
C201
@2.2P_0402_16V8J
12
C200
@10U_1206_6.3V7K
12
12
C199
@.1U_0402_16V4Z
C198
12
@2.2P_0402_16V8J
12
C560
@.1U_0402_16V4Z
JP15
1
2
1
3
4
3
5
6
5
7
8
7
9
10
9
11
12
11
13
14
13
151516
171718
191920
212122
232324
2525K
@2MM SMT KEY26
R184@1.5K_0603_1%
12
R183@75_0603_1%
12
R372@39_0603_1%
12
R310@150_0603_1%
12
2
4
6
8
10
12
14
16
18
20
22
24
26
R373 @33_0402_5%
12
12
R304
@27.4_0603_1%
+CPU_CORE
AGP_BUSY # <16,19>
H_ITP_DBR# <6>
ITP_TDI <6>
ITP_TMS <6>
ITP_TRST# <6>
ITP_TCK <6>
ITP_TDO <6>
1.200V
1.150V
1.100V
1.050V
1.000V
0.975V
0.950V
0.925V
0.900V
0.875V
0.850V
0.825V
0.800V
0.775V
0.750V
0.725V
0.700V
DD
ITP Debug Connector
0.675V
0.650V
0.625V
0.600V
10
00000
0000
1
000
00 0
00
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0000
1
1
1
1
1
1
0000
1
00
1
0
1
1
0
1
1
1
1
0
1
1
1
1
1
1
1
1
000
0
000
1
00
1
1
00
1
0
1
1
0
1
1
1
0
00
1
00
1
1
0
1
1
1
1
0
1
1
1
1
1
00 01
00011
1
0000
1
1
000
1
1
0
1
00
1
0
1
0
0
0
11
0
1
11
0
0
0
1
0
0
1
0
1
1
0
1
1
0
1
1
0
1
1
1
1
1
1
1
1
XXXXX
1
1
X
000
XXX
1
000
XXXXX
1
0
1
XXXXX
00
1
XXXXX
1
00
XXXXX
1
0
XXXXX
11111
VRM output off 1 1 1 1
0412134023
0
0
0
0
11
0
0
0
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
0
1
XXXXX
X
XXXXXXX
X
XX
X
XXXX
XXXXX
XXXXX
XXXXX
XXXXX
XXXXX
XXXXX
XXXXX
1
CC
+5VS
12
C482
U25
SMB_EC_DA2<6,30>
BB
SMB_EC_CK2<6,30>
1
SDA
2
SCL
3
OS#
4
GND
LM75CIMMX-5
Address:1001_000XAddress:1001_000X
VCC
8
7
A0
6
A1
5
A2
.1U_0402_16V4Z
R351 1K_0402_5%
12
SMB_EC_DA2<6,30>
SMB_EC_CK2<6,30>
U23
1
SDA
2
SCL
3
OS#
4
GND
LM75CIMMX-5
VCC
8
7
A0
6
A1
5
A2
C394
.1U_0402_16V4Z
12
12
R308 10K_0402_5%
12
R306
1K_0402_5%
+5VS
Dell-Compal Confidential
AA
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMP AL ELECTRONIC S, INC. NEITH ER THIS SHEET NO R THE INFORM ATION IT CONT AINS
10
9
8
7
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
D
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
E
+2.5V
F
20mil
DDR_DQ0
DDR_DQ4
DDR_DM0
DDR_DQ7
DDR_DQ3
DDR_DQ12
DDR_DQ13DDR_DQ9
DDR_DM1
DDR_DQ10
DDR_DQ11
DDR_DM2
DDR_DQ19
DDR_DQ29
DDR_DQ25DDR_DQ28
DDR_DM3
DDR_DQ27
DDR_DQ31
DDR_SMAA11
DDR_SMAA8
DDR_SMAA6
DDR_SMAA4
DDR_SMAA2
DDR_SMAA0
DDR_BS1
DDR_RAS#
DDR_CAS#
DDR_DQ32DDR_DQ33
DDR_DQ37
DDR_DM4
DDR_DQ39
DDR_DQ35DDR_DQ38
DDR_DQ45
DDR_DQ41
DDR_DM5
DDR_DQ43
DDR_DQ47
DDR_DQ52
DDR_DQ53
DDR_DM6
DDR_DQ51
DDR_DQ50
DDR_DQ61
DDR_DQ57
DDR_DM7
DDR_DQ62
DDR_DQ59
F
SDREF_DIMM
R322
12
C413
.1U_0402_16V4Z
DDR_SCS#1 <9>DDR_SCS#0<9>
DDR_CLK2# <9>
DDR_CLK2 <9>
12
SDREF
0_0402_5%
DDR_DQ[0..63]
DDR_DQS[0..8]
DDR_DM[0..7]
DDR_SMAA[0..12]
Note:
Place Close to DIMM0
Layout note
Place these resistor
close by DIMM0,
all trace length
Max=1.4"
DDR_CKE0
DDR_CKE1
DDR_SCS#0
DDR_SCS#1
DDR_SBS0<9,13>
DDR_SBS1<9,13>
DDR_SRAS#<9,13>
DDR_SCAS#<9,13>
DDR_SWE#<9,13>
Title
Size Document NumberRev
Date:Sheet
G
DDR_DQ[0..63] <13>
DDR_DQS[0..8] <13>
DDR_DM[0..7] <13>
DDR_SMAA[0..12]
DDR_SMAA0DDR_SMA0
12
R167 10_0402_5%
R134 10_0402_5%
R132 10_0402_5%
R149 10_0402_5%
R135 10_0402_5%
R140 10_0402_5%
R152 10_0402_5%
R116 10_0402_5%
R137 10_0402_5%
R148 10_0402_5%
R146 10_0402_5%
R151 10_0402_5%
R136 10_0402_5%
DDR_SMAA1DDR_SMA1
12
DDR_SMAA2DDR_SMA2
12
DDR_SMAA3DDR_SMA3
12
DDR_SMAA4DDR_SMA4
12
DDR_SMAA5DDR_SMA5
12
DDR_SMAA6DDR_SMA6
12
DDR_SMAA7DDR_SMA7
12
DDR_SMAA8DDR_SMA8
12
DDR_SMAA9DDR_SMA9
12
DDR_SMAA10DDR_SMA10
12
DDR_SMAA11DDR_SMA11
12
DDR_SMAA12DDR_SMA12
12
+1.25VS
RP47 56_0402_4P2R_5%
14
23
RP49 56_0402_4P2R_5%
14
23
Note:
Place Close to DIMM0
R139 10_0402_5%
R133 10_0402_5%
R141 10_0402_5%
R131 10_0402_5%
R138 10_0402_5%
DDR_BS1
12
DDR_RAS#
12
DDR_CAS#
12
DDR_WE#
12
DDR_BS0
12
Dell-Compal Confidential
Compal Electronics, Inc.
DDR-SODIMM SLOT0
Abacus/TangII LA-1452
G
H
0.2
of
1243Monday, August 26, 2002
H
A
+1.25VS+1.25VS
RP89 56_0402_4P2R_5%
DDR_DQ4
14
DDR_DQ0
23
RP109 56_0402_4P2R_5%
DDR_DQ5
14
DDR_DQ1
23
DDR_DQS0
DDR_DQ6
DDR_DQ3
DDR_DQ2
DDR_DQ7
DDR_DQ8
DDR_DQ9
DDR_DQ12
DDR_DQS1
DDR_DQ13
DDR_DQ14
DDR_DQ10
DDR_DQ11
DDR_DQ15
DDR_DQ20
DDR_DQ16
DDR_DQ17
DDR_DQ21
DDR_DQ18
DDR_DQS2
DDR_DQ19
DDR_DQ22
DDR_DQ23
DDR_DQ24
DDR_DQ28
DDR_DQ25
DDR_DQ29
DDR_DQS3
RP88 56_0402_4P2R_5%
14
23
RP67 56_0402_4P2R_5%
14
23
RP108 56_0402_4P2R_5%
14
23
RP87 56_0402_4P2R_5%
14
23
RP92 56_0402_4P2R_5%
14
23
RP107 56_0402_4P2R_5%
14
23
RP86 56_0402_4P2R_5%
14
23
RP106 56_0402_4P2R_5%
14
23
RP85 56_0402_4P2R_5%
14
23
RP105 56_0402_4P2R_5%
14
23
RP84 56_0402_4P2R_5%
14
23
RP104 56_0402_4P2R_5%
14
23
RP91 56_0402_4P2R_5%
14
23
RP83 56_0402_4P2R_5%
14
23
11
22
33
RP103 56_0402_4P2R_5%
DDR_DQ26
14
DDR_DQ30
23
RP82 56_0402_4P2R_5%
DDR_DQ27
14
DDR_DQ31
23
RP69 56_0402_4P2R_5%
DDR_DQ56
14
DDR_DQ51
23
RP94 56_0402_4P2R_5%
DDR_DQ60
14
DDR_DQ57
23
RP68 56_0402_4P2R_5%
DDR_DQ61
14
DDR_DQS7
23
RP93 56_0402_4P2R_5%
DDR_DQ62
14
DDR_DQ58
23
RP66 56_0402_4P2R_5%
DDR_DQ63
14
DDR_DQ59
23
RP100 56_0402_4P2R_5%
DDR_DQ36
14
DDR_DQ32
23
RP75 56_0402_4P2R_5%
DDR_DQ33
14
DDR_DQ37
23
RP99 56_0402_4P2R_5%
DDR_DQS4
14
DDR_DQ38
23
RP74 56_0402_4P2R_5%
DDR_DQ34
14
DDR_DQ39
23
RP98 56_0402_4P2R_5%
DDR_DQ35
14
DDR_DQ44
23
RP73 56_0402_4P2R_5%
DDR_DQ40
14
DDR_DQ45
23
RP72 56_0402_4P2R_5%
DDR_DQ41
14
DDR_DQS5
23
RP97 56_0402_4P2R_5%
DDR_DQ43
14
DDR_DQ42
23
RP71 56_0402_4P2R_5%
DDR_DQ47
14
DDR_DQ46
23
Layout note
Place these resistor
closely DIMM1,
all trace
length<=800mil
Place these resistor
close by DIMM1,
all trace length
Max=0.8"
DDR_SMA12
DDR_SMA11
DDR_SMA9
DDR_SMA7
DDR_SMA8
DDR_SMA6
DDR_SMA3
DDR_SMA10
DDR_SMA0
DDR_SMA1
DDR_SMA2
DDR_SMAB1
DDR_SMAB2
DDR_SMA4
DDR_SMA5
DDR_SMAB4
DDR_SMAB5
DDR_SWE#
DDR_SBS0
DDR_SRAS#
DDR_SCAS#
DDR_SBS1
+1.25VS
RP79 56_0402_4P2R_5%
14
23
RP101 56_0402_4P2R_5%
14
23
DIMM1
Dell-Compal Confidential
1
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
D
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
DDR-SODIMM SLOT1
Abacus/TangII LA-1452
0.2
of
1343Monday, August 26, 2002
E
A
Layout note :
Distribute as close as possible
to DDR-SODIMM0.
+2.5V
B
C
D
E
Layout note :
Distribute as close as possible
to DDR-SODIMM1.
+2.5V
11
12
C135
+
150U_D_6.3VM
12
C164
.1U_0402_10V6K
12
C418
.1U_0402_10V6K
12
C167
.1U_0402_10V6K
12
C419
.1U_0402_10V6K
12
C166
.1U_0402_10V6K
12
C415
.1U_0402_10V6K
12
C162
.1U_0402_10V6K
12
C420
.1U_0402_10V6K
12
C160
.1U_0402_10V6K
12
C423
.1U_0402_10V6K
12
C157
.1U_0402_10V6K
12
C422
.1U_0402_10V6K
12
C158
.1U_0402_10V6K
12
C421
.1U_0402_10V6K
12
C168
.1U_0402_10V6K
12
C414
.1U_0402_10V6K
12
C169
.1U_0402_10V6K
12
C170
+
150U_D_6.3VM
12
C177
.1U_0402_10V6K
12
C194
.1U_0402_10V6K
12
C172
.1U_0402_10V6K
12
C185
.1U_0402_10V6K
12
C173
.1U_0402_10V6K
12
C183
.1U_0402_10V6K
12
C179
.1U_0402_10V6K
12
C189
.1U_0402_10V6K
12
C175
.1U_0402_10V6K
12
C184
.1U_0402_10V6K
12
C176
.1U_0402_10V6K
12
C182
.1U_0402_10V6K
12
C181
.1U_0402_10V6K
12
C186
.1U_0402_10V6K
12
C180
.1U_0402_10V6K
12
C190
.1U_0402_10V6K
12
C187
.1U_0402_10V6K
Layout note :
Place one cap close to every 2 pull up resistors termination to
22
+1.25VS
12
C527
.1U_0402_10V6K
+1.25VS
12
C535
.1U_0402_10V6K
+1.25VS
12
C520
33
.1U_0402_10V6K
+1.25VS
12
C528
.1U_0402_10V6K
12
C536
.1U_0402_10V6K
12
C514
.1U_0402_10V6K
12
C529
.1U_0402_10V6K
12
C512
.1U_0402_10V6K
12
C516
.1U_0402_10V6K
12
C530
.1U_0402_10V6K
12
C537
.1U_0402_10V6K
12
C517
.1U_0402_10V6K
12
C518
.1U_0402_10V6K
12
C538
.1U_0402_10V6K
12
C503
.1U_0402_10V6K
12
C531
.1U_0402_10V6K
12
C539
.1U_0402_10V6K
12
C519
.1U_0402_10V6K
12
C532
.1U_0402_10V6K
12
C522
.1U_0402_10V6K
12
C533
.1U_0402_10V6K
12
C511
.1U_0402_10V6K
12
C515
.1U_0402_10V6K
12
C521
.1U_0402_10V6K
12
C534
.1U_0402_10V6K
12
C513
.1U_0402_10V6K
+1.25VS
12
C509
.1U_0402_10V6K
+1.25VS
12
C494
.1U_0402_10V6K
+1.25VS
44
12
C137
.1U_0402_10V6K
12
C510
.1U_0402_10V6K
12
C540
.1U_0402_10V6K
12
C178
.1U_0402_10V6K
A
12
C508
.1U_0402_10V6K
12
C526
.1U_0402_10V6K
12
C191
.1U_0402_10V6K
12
C507
.1U_0402_10V6K
12
C525
.1U_0402_10V6K
12
C139
.1U_0402_10V6K
12
C504
.1U_0402_10V6K
12
C524
.1U_0402_10V6K
12
C138
.1U_0402_10V6K
12
C502
.1U_0402_10V6K
12
C543
.1U_0402_10V6K
12
C505
.1U_0402_10V6K
B
12
C501
.1U_0402_10V6K
12
C141
.1U_0402_10V6K
12
C497
.1U_0402_10V6K
12
C188
.1U_0402_10V6K
12
C495
.1U_0402_10V6K
12
C192
.1U_0402_10V6K
12
C496
.1U_0402_10V6K
12
C506
.1U_0402_10V6K
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENT IAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
D
Dell-Compal Confidential
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
DDR SODIMM Decoupling
Abacus/TangII LA-1452
of
1443Monday, August 26, 2002
E
0.2
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