1@ : Use PCMCIA card only
2@ : Use Express card only
3@ : Use ATG only
4@ : Use China TPM only
5@ : Use BROADCOM TPM only
6@ : All TPM Disabled for CCC - Depop D70, Pop R483
44
MB PCB
Part NumberDescription
DA800009P0L
A
PCB 03I LA-3801P REV0 M/B UMA
B
7@ : Non- ATG only
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
USB2 : Left side pair top
USB3 Rear Right pair bottom
USB1 : Right side pair bottom
On IO/B
Intel Boaz
82567LM
+3.3V_ALW
+1.8V_LAN_M
page 27
AMP & INT.
Speaker
+5V_RUN
page 28
HeadPhone &
MIC Jack
+3.3V_RUN
page 26
+1V_LAN_M
page 29
LAN SWITCH
PI3L500-AZFEX
+3.3V_ALW
RJ45
page 26
SNIFFER
DAI
SSM2602
+3.3V_RUN
page 27
DOCK
Dig. MIC
page 19
Trough LVDS Cable
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Block Diagram
LA-3801P
266Thursday, June 12, 2008
E
pg 30
On IO/B
0.8
of
Page 3
5
4
3
2
1
POWER STATES
State
DD
S0 (Full ON) / M0
S3 (Suspend to RAM) / M1
S4 (Suspend to DISK) / M1ONONONONOFF
S5 (SOFT OFF) / M1ONONONONOFFLOW HIGHLOWHIGHLOW
S3 (Suspend to RAM) / M-OFF
S4 (Suspend to DISK) / M-OFF
S5 (SOFT OFF) / M-OFF
Signal
SLP
SLP
S3#
S4#
HIGH HIGHHIGH
HIGH
LOW HIGH HIGHHIGHONONONONOFF
LOW HIGH HIGHHIGHLOW
LOW HIGH HIGHHIGHLOWONONOFFOFFOFF
LOW LOWLOWLOWONOFFOFFOFFOFF
LOW LOW LOWLOWLOWONOFFOFFOFFOFF
SLP
S5#
HIGH
S4
STATE#
SLP
M#
HIGH
HIGH
ALWAYS
PLANE
ON
M
PLANE
ON
SUS
RUN
PLANE
PLANE
ONONON
CLOCKS
ICH9-M
USB PORT#
0
1
2
3
4
5
6
7
DESTINATION
JUSB1 (Ext Right Side Top)
JUSB1 (Ext Right Side Bottom)
JESA1 (Ext Left Side Top)
JESA1 (Ext Left Side Bottom)
WLAN
WWAN
WPAN
Card Bus/Express card
DOCKING8
DESTINATION
MINI CARD-1 WWAN
MINI CARD-2 WLAN
MINI CARD-3 BT/UWB
EXPRESS CARD
None
DOCKING
USH->BIO10
Camera
Lane 6
10/100/1G LAN
PCI TABLE
REQ#/GNT#
R5C847REQ#1 / GNT#1AD17
AA
PIRQPCI DEVICEIDSEL
PIRQ[B..D]
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Index and Config.
LA-3801P
366Thursday, June 12, 2008
1
0.8
of
Page 4
5
4
3
2
1
RUN_ON
FDS4435
Q16
+INV_PWR_SRC
ADAPTER
DD
GFX_CORE_ON
ADP3209
(PU15)
+VGFX_COREP
+PWR_SRC
BATTERY
CHARGER
CC
ALW_ON
3.3V_SUS_ON
ISL6236
(PU2)
STS11NF30L
(Q60)
ISL6260
(PU7)
IMVP_VR_ON
+VCC_CORE
ISL88550
(PU16)
DDR_ON
0.9V_DDR_VTT_ON
+1.8V_MEM +0.9V_DDR_VTT
ISL6236
(PU3)
M_ON
1.5V_RUN_ON
+1.05V_M+1.5V_RUN
ISL6236
(PU2)
ALWON
ALWON
+5V_ALW
+3.3V_ALW
ENAB_3VLAN
STS11NF30L
RUN_ON
3.3V_RUN_ON
(Q44)
+15V_ALW
+5V_RUNSTS11NF30L
(Q55)
SI4336DY
(Q61)
+5V_ALW
BB
+3.3V_SUS
+3.3V_LAN
+3.3V_RUN
EMC4002
LDO Out
HDDC_EN
MODC_EN
RUN_ON
REGCTL_PNP1
REGCTL_PNP18
(U3)
BCP69BCP69
SI3456BDVSI3456BDV
(Q29)(Q32)
MAX9789A
(U22)
(Q46)
(Q45)
+1.8V_RUN
AA
+5V_HDD
+5V_MOD
+VDDA
+1V_LAN_M+1.8V_LAN_M
DELL CONFIDENTIAL/PROPRIETARY
On IO/B
5
4
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
For the purpose of testability, route these signals
through a ground referenced Z0 = 55ohm trace that
ends in a via that is near a GND via and is
accessible through an oscilloscope connection.
Resistor placed within 0.5" of
CPU pin.Trace should be at least
25 mils away from any other
toggling signal. COMP0, COMP2
trace should be 27.4 ohm.
COMP1, COMP3 should be 55
ohm.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Penryn Processor(2/2)
LA-3801P
866Thursday, June 12, 2008
1
0.8
of
Page 9
5
+VCC_CORE
Place these inside
socket cavity on L8
(North side
DD
CC
Secondary)
Place these inside
socket cavity on L8
(Sorth side
Secondary)
Place these inside
socket cavity on L8
(North side
Primary)
Place these inside
socket cavity on L8
(Sorth side
Primary)
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
+VCC_CORE
1
2
C24
10U_0805_4VAM~D
C34
10U_0805_4VAM~D
C44
10U_0805_4VAM~D
C50
10U_0805_4VAM~D
1
C25
10U_0805_4VAM~D
2
1
C35
10U_0805_4VAM~D
2
1
C45
10U_0805_4VAM~D
2
1
C51
10U_0805_4VAM~D
2
4
1
C26
10U_0805_4VAM~D
2
1
C36
10U_0805_4VAM~D
2
1
C46
10U_0805_4VAM~D
2
1
C52
10U_0805_4VAM~D
2
1
C27
10U_0805_4VAM~D
2
1
C37
10U_0805_4VAM~D
2
1
C47
10U_0805_4VAM~D
2
1
C53
10U_0805_4VAM~D
2
1
C28
10U_0805_4VAM~D
2
1
C38
10U_0805_4VAM~D
2
1
C48
10U_0805_4VAM~D
2
1
C54
10U_0805_4VAM~D
2
1
C29
10U_0805_4VAM~D
2
1
C39
10U_0805_4VAM~D
2
1
C49
10U_0805_4VAM~D
2
1
C55
10U_0805_4VAM~D
2
3
1
C30
10U_0805_4VAM~D
2
1
C40
10U_0805_4VAM~D
2
1
C31
10U_0805_4VAM~D
2
1
C41
10U_0805_4VAM~D
2
1
2
1
2
2
C32
10U_0805_4VAM~D
C42
10U_0805_4VAM~D
1
C33
10U_0805_4VAM~D
2
1
C43
10U_0805_4VAM~D
2
1
10uF 0805 X6S -> 85 degree C
High Frequence Decoupling
Near VCORE regulator.
+VCC_CORE
270U_X_2VM_R4.5M~D
270U_X_2VM_R4.5M~D
1
+
@
C59
2
270U_X_2VM_R4.5M~D
1
North Side Secondary
+
@
@
C60
C61
2
ESR <= 1.5m ohm
South Side Secondary
270U_X_2VM_R4.5M~D
1
1
+
+
2
C57
C56
2
1
1
+
+
C58
2
2
270U_X_2VM_R4.5M~D
270U_X_2VM_R4.5M~D
Capacitor > 1320uF
BB
+1.05V_VCCP
1
C62
0.1U_0402_10V7K~D
2
AA
1
C63
0.1U_0402_10V7K~D
2
1
C64
0.1U_0402_10V7K~D
2
1
C65
0.1U_0402_10V7K~D
2
1
C66
0.1U_0402_10V7K~D
2
1
C67
0.1U_0402_10V7K~D
2
Place these inside
socket cavity on L8
(North side
Secondary)
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
When pop R314, then R42,
R44, R685, R686, R687
should be no stuff
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Low = DMI x 2
High = DMI x 4 (Default)
Low = iTPM enable
High = iTPM disable(Defult)
Low = TLS cipher s u i t e wit h n o c onfidentiality
High = TLS cip h e r s u i t e with
confidentiality(Default)
Low = Reverse Lane
High = Normal O p e r a t i o n(Default)
Low=Dynamic O D T Disable
High=Dynamic ODT Enable(default)
Low=Normal (default)
High=Lane Reversed
Low=Only SDVO or PCIEx1 is
operational (default)
High=SDVO and P C I E x 1 a r e o p e rating
simultaneously via PEG port
Low=No SDVO Device Present
(default)
High=SDVO Dev i ce Present
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
L43
0.1U_0402_16V4Z~D
BLM18PG181SN1_0603~D
C733
+VCC_TX_LVDS
1000P_0402_50V7K~D
1
C736
2
12
@
L6
1
LBC2518T91NM_1210~D
+
2
3
2
+3.3V_RUN+3.3V_CRT_DAC
12
12
PJP1
@
PAD-OPEN1x1m
12
+VCC_PEG
220U_D2_4VY_R15M~D
4.7U_0603_6.3V6M~D
1
+
2
+1.05V_M
10U_0805_4VAM~D
+1.05V_M_HPLL
+1.05V_M_DPLLA+1.05V_M_DPLLB
64.8mA Max.64.8mA Max.
+VCC_PEG
+1.05V_M
1
1
C111
C112
2
2
L3
BLM21PG221SN1D_0805~D
12
C118
12
R117
0.1U_0402_16V4Z~D
4.7U_0603_6.3V6M~D
1
1
C130
2
2
220U_D2_4VY_R15M~D
0.1U_0402_16V4Z~D
1
1
+
C741
2
2
12
R114
22U_0805_6.3V6M~D
0_1210_5%~D
12
@
R115
C113
0_1210_5%~D
+1.05V_M_PEGPLL
1_0402_5%~D
+1.05V_M+1.05V_M
L4
12
BLM18AG121SN1D_0603~D
C131
L45
12
10UH_LB2012T100MR_20%_0805~D
C739
2
+1.05V_M
+1.05V_VCCP
Follow ERB,CRB option
to select +1.05V_M or
+1.05V_VCCP
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Layout Note:
Place one cap close to every 2 pullup
resistors terminated to +0.9V_DDR_VTT
0.1U_0402_16V4Z~D
1
2
C178
RN1
14
23
RN3
14
23
RN5
14
23
RN7
14
23
RN9
14
23
R130
56_0402_5%~D
RN12
23
14
C168
1
2
0.1U_0402_16V4Z~D
C172
1
2
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
2
C179
+0.9V_DDR_VTT
12
2.2U_0603_6.3V6K~D
1
2
C173
1
2
0.1U_0402_16V4Z~D
1
2
C180
RN2
RN4
RN6
RN8
RN10
RN11
RN13
2.2U_0603_6.3V6K~D
C169
0.1U_0402_16V4Z~D
1
2
1
2
C181
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
14
23
56_0404_4P2R_5%~D
Layout Note:
Place near JDIMMA
C170
1
2
C174
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C182
DDR_A_MA12
DDR_A_MA8
DDR_A_MA6
DDR_A_MA7
DDR_A_MA5
DDR_A_MA9
DDR_A_MA2
DDR_A_MA4
DDR_A_BS1
DDR_A_MA0
DDR_A_MA13
M_ODT0
DDR_A_MA11
DDR_A_MA14
0.1U_0402_16V4Z~D
1
2
C184
C183
4
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C186
C185
Layout Note:
Place these resistor
closely DIMMA,all
trace length<750 mil
Layout Note:
Place these resistor
closely DIMMA,all
trace length
Max=1.3"
4
3
+1.8V_MEM+1.8V_MEM+V_DDR_MCH_REF
JDIMMA
1
VREF
3
DDR_A_D0
DDR_A_D1
DDR_A_DQS#0
DDR_A_DQS0
DDR_A_D2
DDR_A_D3
DDR_A_D8
DDR_A_D9
DDR_A_DQS#1
DDR_A_DQS1
DDR_A_D11
DDR_A_D16
DDR_A_DQS#2
DDR_A_DQS2
DDR_A_D18
DDR_A_D24
DDR_A_D25
DDR_A_DM3
DDR_A_D26DDR_A_D30
DDR_A_D27
DDR_CKE0_DIMMA<10>
DDR_A_BS2<11>
DDR_A_BS0<11>
DDR_A_WE#<11>
DDR_A_CAS#<11>
DDR_CS1_DIMMA#<10>
M_ODT1<10>
0.1U_0402_16V4Z~D
0.1U_0402_16V4Z~D
1
1
2
2
C188
C187
MEM_SDATA<17,24>
MEM_SCLK<17,24>
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
DDRII-SODIMM SLOT2
LA-3801P
1766T h u r s da y, June 12, 2008
1
0.8
of
Page 18
5
+3.3V_M
12
R134
8.2K_0402_5%~D
+1.05V_VCCP
R135
DD
H_THERMTRIP#<7>
THERMTRIP_MCH#<10>
2.2K_0402_5%~D
12
MMST3904-7-F_SOT323-3~D
+1.05V_VCCP
R138
2.2K_0402_5%~D
12
MMST3904-7-F_SOT323-3~D
Q5
Q6
2
B
2
B
C
E
31
+3.3V_M
12
C
E
31
THERMATRIP1#
1
C218
0.1U_0402_16V4Z~D
2
R137
8.2K_0402_5%~D
THERMATRIP2#
1
C220
0.1U_0402_16V4Z~D
2
RB751S40T1_SOD523-2~D
Place under CPU
C231
C
31
1
C225
2
C
31
1
+RTC_CELL
C229
0.1U_0402_16V4Z~D
2
1
2
E
E
100P_0402_50V8K~D
CC
H_THERMDA<7>
H_THERMDC<7>
Q9 Place near DIMM
Place C227 close
to Q9
BB
+3.3V_M
1
Place C223 close to the Q8 as possible
Place C224, C225 close to the Guardian pins as possible
470P_0402_50V7K~D
Place C228 close to the Guardian pins as possible
1
C227
@
100P_0402_50V8K~D
2
12
R142
0_0603_5%~D
0.1U_0402_16V4Z~D
2
C223
@
Rset=953,Tp=88degree
+3.3V_M
12
R155
8.2K_0402_5%~D
AA
THERMATRIP3#
1
C240
0.1U_0402_16V4Z~D
2
5
4
D2
21
19.2
2
B
Q8
MMBT3904WT1G_SC70-3~D
2
B
Q9
MMBT3904WT1G_SC70-3~D
12
R151
953_0402_1%~D
2200P_0402_50V7K~D
R8870_0603_5%~D
12
+5V_RUN
*
4
+3.3V_M
FAN1_DET#<22>
1
C219
2
22U_0805_6.3VAM~D
BC_DAT_EMC4002<38>
BC_CLK_EMC4002<38>
2
C224
2200P_0402_50V7K~D
1
REM_DIODE1_P
REM_DIODE1_N
1
C228
2
1U_0603_10V4Z~D
1
C230
3.3V_M_PWRGD<38,41>
2
ICH_PWRGD#<41>
+3VSUS_THRM
10U_0805_10V4Z~D
0.1U_0402_16V4Z~D
+3.3V_RUN
C235
1
1
C234
2
2
Pull-up Resistor
on ADDR_MODE/XEN
10U_0805_10V4Z~D
0.1U_0402_16V4Z~D
1
1
C236
2
2
EC_32KHZ_OUT<38>
<= 4.7K +/- 5%2F(r/w)
10K
18K
>= 33K
REM_DIODE3_P
REM_DIODE3_N
+3VSUS_THRM
+RTC_CELL_R
12
R1461K_0402_5%~D
12
R1481K_0402_5%~D
THERMATRIP1#
THERMATRIP2#
THERMATRIP3#
VSET
R1504.7K_0402_5%~D
+FAN1_VOUT
C237
FAN1_TACH_FB
EC_32KHZ_OUT
For Remote1
mode
2N3904
2N3904
Thermistor
Thermistor
3
12
R136
10K_0402_5%~D
+FAN1_VOUT
FAN1_TACH_FB
12
SMBUS
Address
2E(r/w)
2F(r/w)
2E(r/w)
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
U3
EMC4002
10
11
36
35
38
37
41
40
4
21
18
17
22
23
24
42
3
6
5
9
7
8
15
14
3
JFAN1
1
1
2
2
3
5
3
G1
4
6
4
G2
MOLEX_53398-0471~D
200K_0402_1%~D
SMDATA/BC-LINK_DATA
SMBCLK/BC-LINK_CLK
DP1/VREF_T
DN1/THERM
DP2
DN2
DP3/DN7
DN3/DP7
VCC
ATF_INT#/BC-LINK_IRQ#
RTC_PWR3V
THERMTRIP_SIO/PWM1/GPIO5
VCC_PWRGD
3V_PWROK#
THERMTRIP1#
THERMTRIP2#
THERMTRIP3#
VSET
ADDR_MODE/XEN
VDD_5V
VDD_5V
VDD_3V
FAN_OUT
FAN_OUT
TACH1/GPIO3
CLK_IN/GPIO2
LDO_OUT/FAN_OUT2
LDO_OUT/FAN_OUT2
VSS
49
R930
0_0402_5%~D
12
R997
39
VIN1
48
VCP1
45
VCP2
44
DP4/DN8
43
DN4/DP8
47
DP5/DN9
46
DN5/DP9
DN6/VIN2
LDO_POK
LDO_SET
1
2
12
26
27
20
25
19
34
33
32
31
28
29
30
16
13
4
R10140_0402_5%~D@
R10150_0402_5%~D@
DP6/VREF_T2
POWER_SW#
ACAVAIL_CLR
SYS_SHDN#
LDO_SHDN#
VDDH/VDD_5V2
VDDH/VDD_5V2
VDDL/VDD_3V2
TACH2/GPIO4
PWM2/GPIO1
74AHC1G08GW_SOT353-5~D
POWER_SW#
R998
12
12
4.7K_0402_5%~D
Place C221 close to the
Guardian pins as possible.
REM_DIODE4_P
REM_DIODE4_N
12
R14110K_0402_5%~D
POWER_SW#
12
R14910K_0402_5%~D
12
R21110K_0402_5%~D@
LDO_SET
+3V_LDOIN
R926
0_0402_5%~D
+RTC_CELL
0.1U_0402_16V4Z~D
5
P
IN1
O
IN2
G
3
12
12
12
1
2
U68
2
PWR_MON_GFX <49>
PWR_MON <47>
ISL88731_ICM <48>
1
C221
2
2200P_0402_50V7K~D
THERMISTOR OPTION:
Single-ended ro ut in g t o thermistor is permissible
(ground retu r n ) . Pl a c e R139 and C226 near EMC4002
+3.3V_M
BC_INT#_EMC4002 <38>
ACAV_IN <38,48>
2.5V_RUN_PWRGD <37,41>
+1.8V_RUN
10U_0805_10V6K~D
0.1U_0402_16V4Z~D
1
1
C238
2
2
12
C1050
PM_EXTTS# <10>
R143
0_0402_5%~D
R144
0_0402_5%~D
2
12
R139
1.2K_0402_1%~D
+3.3V_SUS
10U_0805_10V4Z~D
1
2
C239
12
12
1
Diode circui t a t DP 4 /DN4 is used for skin
temp sensor (p la ce d o ptimally between CPU,
MCH and MEM).
C
Q7
2
B
MMBT3904WT1G_SC70-3~D
E
31
12
R140
10KB_0603_1%_TSM1A103F34D3R~D
C226
0.1U_0402_16V4Z~D
12
12
R14510K_0402_5%~D
12
R14747K_0402_1%~D@
At maximum loa d c ur rent of 600mA,the the
voltage drop a c r o ss the should be keep
in the range of 0.5V to 1V
0.1U_0402_16V4Z~D
R152
0.82_1210_1%~D
1
C232
C233
2
DOCK_PWR_SW# <38>
POWER_SW_IN# <38>
+3.3V_M
THERM_STP# <44>
+RTC_CELL
+3.3V_RUN
12
1
C222
@
100P_0402_50V8K~D
2
Place C222 close to Q7 as
possible.
+1.8V_RUN
LDO_SET
Voltage margi ning circuit
for LDO output. Adjustable
from 1.2 to 2.5V.
Ra=((LDO_OUT / 1.12)-1)*Rb.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
2
1
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
CRT/Video switch
LA-3801P
2066T h u r s da y, June 12, 2008
0.8
of
Page 21
2
SW for MB sideSW for E-Docking side
C271
DPB_AUX<12>
DPB_AUX#<12>
0.1U_0402_10V7K~D
0.1U_0402_10V7K~D
C273
12
12
DPB_AUX_C
U75
2
1A
VCC
2A51B
1
1OE#
7
GND
2OE#
SN74CBTD3306CPWR_TSSOP8~D
+5V_RUN
8
3
6
2B
4
C314
0.1U_0402_16V4Z~D
12
DPB_AUX_SWDPB_AUX#_C
DPB_AUX#_SW
C272
DPC_DOCK_AUX<12>
DPC_DOCK_AUX#<12>
0.1U_0402_10V7K~D
0.1U_0402_10V7K~D
C274
12
12
DPC_AUX_C
DPC_AUX#_C
SN74CBTD3306CPWR_TSSOP8~D
2
1A
2A51B
1
1OE#
7
2OE#
1
Display port Connector
U77
VCC
GND
+5V_RUN
8
3
6
2B
4
C329
0.1U_0402_16V4Z~D
12
DPC_AUX_DOCK
DPC_AUX#_DOCK
DPC_AUX_DOCK <35>
DPC_AUX#_DOCK <35>
+3.3V_RUN
0_1206_5%~D
21
R210
12
D10
@
B0540WS-7_SOD323-2~D
U76
SDVO_CTRLCLK<10>
SDVO_CTRLDATA<10>
BB
+5V_RUN+3.3V_RUN
1U_0603_10V4Z~D
1
1
C1025
2
2
DPB_LANE_P0_C<12>
DPB_LANE_N0_C<12>
DPB_LANE_P1_C<12>
DPB_LANE_N1_C<12>
DPB_LANE_P2_C<12>
DPB_LANE_N2_C<12>
DPB_LANE_P3_C<12>
DPB_LANE_N3_C<12>
+3.3V_RUN
100K_0402_5%~D
R189
DPB_DOCK_HPD<35>
12
DPB_DOCK_CA_DET<35>
DP_PRIORITY<37>
AA
12
Pin30
LP
Hi
Low
State
Normal Mode
Low power Mode
2
1A
2A51B
1
1OE#
7
2OE#
SN74CBTD3306CPWR_TSSOP8~D
DPB_CA_DET#
0.1U_0402_10V7K~D
1
1
C1027
2
2
DPB_AUX_SW
DPB_AUX#_SW
DP_MB_HPD_EN
DPB_DOCK_HPD
DPB_MB_CA_DET
DPB_DOCK_CA_DET
DP_PRIORITY
100K_0402_5%~D
R190
12
R193
+3.3V_RUN
+5V_RUN
0.01U_0402_16V7K~D
0.1U_0402_10V7K~D
C1026
5.11K_0402_1%~D
VCC
GND
0.001U_0402_25V7K~D
1
C1028
2
Standard operational mode for device
Device is forced into a low power mode
causing the output s to go to a high-Z
state, all other inputs are ignore
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
ICH9M LAN100 SLP Strap
(Internal VR f or Vc cL AN1.05 and VccCL1.05)
High = Interna l V R Enabled(Default)
+1.05V_VCCP
56_0402_1%~D
12
@
R227
+1.05V_VCCP
12
SIO_A20GATE
SIO_RCIN#
56_0402_1%~D
@
R228
H_FERR#
H_DPRSTP# <8,10,47>
H_DPSLP# <8>
12
R237
56_0402_5%~D
12
C301
0.1U_0402_16V4Z~D
ESATA_IRX_DTX_N4_C <33>
ESATA_IRX_DTX_P4_C <33>
ESATA_ITX_DRX_N4 <33>
ESATA_ITX_DRX_P4 <33>
SATA_SBRX_DTX_N3_C <35>
SATA_SBRX_DTX_P3_C <35>
SATA_SBTX_C_DRX_N3 <35>
SATA_SBTX_C_DRX_P3 <35>
R23010K_0402_5%~D
R23110K_0402_5%~D
R23356_0402_5%~D
+3.3V_RUN
12
12
+1.05V_VCCP
12
+3.3V_RUN
12
R905
+3.3V_RUN
12
R248
XOR Chain Entrance Strap
DescriptionICH_RSVD_TP3HDA SDOUT
AA
00
0
1
11
5
RSVD
1
Enter XOR Chain
0
Normal Operation (Default)
Set PCIE port config bit 1
@
1K_0402_5%~D
10K_0402_5%~D
12
@
R1124
4
ICH_AZ_SDOUT
ICH_AZ_SYNC
10K_0402_5%~D
12
@
R1125
12
R249
@
1K_0402_5%~D
ICH_RSVD_TP3 <24>
RTC_BAT_DET_R#<43>
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
5
4
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
ODD/HDD CONNECTOR
LA-3801P
2666Thursday, June 12, 2008
1
0.8
of
Page 27
2
1
+3.3V_RUN
12
R786100_0402_5%~D
SPKR<24>
BEEP<38>
+3.3V_RUN
1000P_0402_50V7K~D
10U_0805_10V6K~D
1
1
BB
2
@
C403
C402
2
1 2
C389 0.1U_0402_16V4Z~D
1 2
C394 0.1U_0402_16V4Z~D
1U_0603_10V6K~D
0.1U_0402_10V7K~D
1
1
C404
C405
2
2
Close to U16 pin1 & pin9
ICH_AZ_CODEC_SDIN0<23>
+3.3V_RUN
0.1U_0402_10V7K~D
1
C407
2
Close to U16 pin3
DMIC_CLK<19>
Close to U16 pin6
ICH_AZ_CODEC_BITCLK
12
R343
@
10_0402_5%~D
1
C412
@
10P_0402_50V8J~D
2
Close to U16 pin5
ICH_AZ_ CODE C_S DOUT
12
R344
@
47_0402_5%~D
1
C416
@
0.1U_0402_10V7K~D
2
AA
Place closely to Pin 13.
AUD_SENSE_A
+3.3V_RUN
12
R350
100K_0402_5%~D
2N7002DW-T/R7_SOT363-6~D
Q38A
ICH_AZ_CODEC_BITCLK<23>
ICH_AZ_CODEC_SDOUT<23>
ICH_AZ_CODEC_SYNC<23>
ICH_AZ_CODEC_RST#<23>
39.2K_0402_1%~D
12
61
2
12
R327499K_0402_1%~D
12
R828499K_0402_1%~D
ICH_AZ_CODEC_BITCLK
12
R33233_0402_5%~D
BLM18BB221SN1D_0603~D
1
2
12
R348
3
4
ICH_AC_SDIN0_R
ICH_AZ_ CODE C_S DOUT
L78
12
150P_0402_50V8J~D
DMIC0<19>
C676
AUD_EAPD<28>
20K_0402_1%~D
R349
5
Q38B
2N7002DW-T/R7_SOT363-6~D
12
+3.3V_RUN
DMIC_CLK_R
R346
5.11K_0402_1%~D
1000P_0402_50V7K~D
1
C417
2
2
AUD_PC_BEEP
TRACE>15 mil
R328
@
10K_0402_5%~D
U16
1
DVDD_CORE
9
DVDD_CORE
40
NC/OTP
3
DVDD_IO
6
HDA_BITCLK
8
HDA_SDI_CODEC
5
HDA_SDO
10
HDA_SYNC
11
HDA_RST#
46
DMIC_CLK
2
DMIC0/VOL_UP/GPIO1
4
DMIC1/VOL_DN/GPIO2
47
SPDIF_OUT_0_1/EAPD/GPIO0
48
SPDIF_OUT_0
43
GPIO5
44
GPIO6
45
SPDIF_OUT_1/GPIO7
7
DVSS
49
Thermal PAD GND
92HD71B7X5NLGXB3X8_QFN48_7x7~D
+VDDA_AVDD
12
+3.3V_RUN
12
R355
100K_0402_5%~D
AUD_MIC_SWITCH <33>AUD_HP_NB_SENSE<28,33,37>
92HD71B
27P_0402_50V8J~D
2
C994
1
VREFOUT_B
VREFOUT_C
GPIO4/VREFOUT_E
MONO_OUT
Place closely to Pin 34
Y5
12
12MHZ_18PF_1Y712000CE1J~D
25
AVDD
38
AVDD
AUD_SENSE_A
13
SENSE_A
SENSE_B
PORT_A_L
PORT_A_R
PORT_B_L
PORT_B_R
PORT_C_L
PORT_C_R
PORT_D_L
PORT_D_R
PORT_E_L
PORT_E_R
PORT_F_L
PORT_F_R
PC_BEEP
VREFFILT
AUD_SENSE_B
34
39
41
37
NC
21
22
28
23
24
29
35
36
AUD_DOCK_MIC_IN_L
14
AUD_DOCK_MIC_IN_R
15
31
AUD_DOCK_HP_OUT_L
16
17
30
GPIO3
18
NC
19
NC
20
NC
AUD_PC_BEEP
12
32
CAP2
33
CAP2
VREFFILT
27
26
AVSS
42
AVSS
12
2N7002DW-T/R7_SOT363-6~D
XTALO_12MHZ
XTALI_12MHZ
+VDDA_AVDD
0.1U_0402_10V7K~D
1
C399
2
C1068
1000P_0402_50V7K~D
1 2
1 2
C1069
1000P_0402_50V7K~D
1
C414
2
10U_0805_10V6K~D
AUD_SENSE_B
100K_0402_5%~D
R353
2
Q40A
27P_0402_50V8J~D
2
C995
1
L77
BLM18EG601SN1D_2P~D
12
0.1U_0402_10V7K~D
10U_0805_10V6K~D
1
1
@
C401
C400
2
2
AUD_HP_OUT_L <28>
AUD_HP_OUT_R <28>
AUD_EXT_MIC_L <33>
AUD_EXT_MIC_R <33>
+VREFOUT
AUD_LINE_OUT_L <28>
AUD_LINE_OUT_R <28>
C408 1U_0805_16V7K~D
DOCK_MIC_IN_L_C
12
12
C409 1U_0805_16V7K~D
C410 0.22U_0805_16V7K~D
AUD_DOCK_HP_L_C
1 2
AUD_DOCK_HP_R_C
1 2
C411 0.22U_0805_16V7K~D
1
C415
2
1U_0603_10V6K~D
5.11K_0402_1%~D
1000P_0402_50V7K~D
39.2K_0402_1%~D
20K_0402_1%~D
12
R351
61
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Place Close to Audio ChipP la ce Cl ose to Audio Chip
1U_0603_10V6K~D
47P_0402_50V8J~D
12
@
C4381U_0603_10V6K~D
C442
1U_0603_10V6K~D
10U_0805_10V6K~D
2
1
C444
1
2
12
@
R367
100K_0402_5%~D
AUD_AMP_MUTE#
2
1
SPKR_INL_C
SPKR_INR_C
HP_INL_C
HP_INR_C
AUD_SPK_ENABLE#
AUD_HP_EN
AUD_AMP_MUTE#
C445
12
R363
1M_0402_1%~D
1U_0603_10V6K~D
C427
1U_0603_10V6K~D
2
1
2
1
C428
1
2
C1P
C1N
C446
12
C450
1U_0603_10V6K~D
0.1U_0402_10V7K~D
C429
3
2
27
26
24
23
22
25
17
9
10
12
11
+CPVSS
U22
SPKR_LIN+
SPKR_RIN+
HP_INL
HP_INR
BYPASS
/SPKR_EN
HP_EN
REG_EN
HPVDD
CPVDD
C1P
C1N
CPGND
14
8mil
SPEAKER_DET#<24>
+5V_RUN
W=40mils
1U_0603_10V6K~D
2
C430
1
INT_SPK_L1
INT_SPK_L2
INT_SPK_R1
INT_SPK_R2
HP_SPK_L1
HP_SPK_R1
AUD_GAIN1
AUD_GAIN2
@
C443
0.033U_0402_16V7K~D
SET
0_0402_5%~D
12
@
R366
For
MAX9789A
depop
C449,pop
R366
+5V_SPK_AMP
1U_0603_10V6K~D
2
1
C449
10U_0805_10V6K~D
1
C432
C433
2
HP_SPK_L1 <33>
HP_SPK_R1 <33>
1U_0603_10V6K~D
2
2
C447
1
1
RUN_ON <19,37,40,41>
1U_0603_10V6K~D
+VDDA
C448
Minimum 150 mA
10U_0805_10V6K~D
1
C431
2
For MAX9789A, depop C443,pop R362
R362 0_0402_5%~D
12
12
0.033U_0402_16V7K~D
2
1
15 mils trace
INT_SPK_R1
INT_SPK_R2
INT_SPK_L1
INT_SPK_L2
1
2
100P_0402_50V8J~D
@
C423
100P_0402_50V8J~D
@
1
1
C424
2
2
*
100P_0402_50V8J~D
100P_0402_50V8J~D
@
@
1
C426
C425
2
Gain Setting
AUD_GAIN1
AUD_GAIN2
GAIN1INPUTAV(inv)GAIN2
0
0
1
0
1
0
11
+5V_SPK_AMP
100K_0402_5%~D
12
100K_0402_5%~D
12
10dB
15.6dB
21.6dB
Speaker Connector
100K_0402_5%~D
@
12
R359
R358
100K_0402_5%~D
@
12
R360
R361
IMPEDANCE
6dB
JSPK1
1
1
2
2
3
3
4
4
5
5
6
6
7
GND
8
GND
MOLEX_53780-0670~D
82K ohm
66K ohm
45K ohm
26K ohm
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
AMP and PHONE JACK
LA-3801P
2866T h u r s da y, June 12, 2008
1
0.8
of
Page 29
5
PCIE_IRX_GLANTX_P6_C
PCIE_IRX_GLANTX_P6<24>
PCIE_IRX_GLANTX_N6<24>
PCIE_ITX_GLANRX_P6_C<24>
PCIE_ITX_GLANRX_N6_C<24>
LAN_CLK<23>
+3.3V_LAN
12
R10084.3K_0402_5%~D@
21
D38RB751S40T1_SOD523-2~D@
C6771U_0402_6.3V6K~D@
12
12
Y2
LAN_RSTSYNC<23>
LAN_TX0<23>
LAN_TX1<23>
LAN_TX2<23>
LAN_RX0<23>
LAN_RX1<23>
LAN_RX2<23>
LOM_ACTLED_YEL#<30>
LOM_SPD100LED_ORG#<30>
LOM_SPD10LED_GRN#<30>
R3730_0402_5%~D@
R3751K_0402_5%~D@
R3761K_0402_5%~D
12
2
1
DD
For internal 1.0V
regulator strap
R376 and unstuff
R375,R377 and Q46
Pull-up on LPC_EN_R
Pull-down on LPC_EN_R
Series from EC to LPC_EN_R
Series from EC to LPD#
Pull-up on LPD#
Pull-up on EC
Pull-down on China TPM
Series from EC to China PD#
Broadcom USH
China TPM
LPCBus Series Resistors
2
1
Trace=12mil
REGCTL_PNP18
1
VIN
2
GND
3
EN
E
3
B
2
MMBT3906WT1G_SC70-3~D
1
12
R1020
10K_0402_5%~D
4.7U_0603_6.3V4Z~D
C453
VOUT
TPS73601
Q146
C
+3.3V_ALW
0.1U_0402_16V4Z~D
2
C454
1
ENAB_3VLAN<40>
R374
5.1K_0402_5%~D
Q50
5
4
ADJ
PART/PINDESCRIPTIONB0 USHA0 USHRef Des
USH pin R6 LPCEN
USH pin R6 LPCEN
EC to USH Pin R6 LPCEN
EC to USH Pin P7 LPCPD_N
USH pin P7 LPCPD_N
SIO pin 105 OUT65
To China TPM U24 pin 28
SIO to China Pin 28 LPCPD#
U32 USH
U24 China TPM
R705,R723,R7 24,R732,R733
2
Q44
STS11NF30L_SO8~D
8
7
5
+3.3V_LAN
12
12
R370
2_1210_5%~D
12
Trace=12mil
3
1
2
12
R1017
4.64K_0402_1%
12
R1018
39.2K_0402_1%~D
12
R1019
36.5K_0402_1%~D
ROUSH USH and China TPM B OM Option
TPM_ID(Strap Low)ICH9M GPIO6 Pin AH21POP
4@ is for China TPM only
5@ is for Broadcom TPM only
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
1
2
36
4
R371
2_1210_5%~D
+3.3V_LAN_R
1
2
C_0402
Q45
BCP69_SOT223~D
4
+LOM_VCT
1
2
0.1U_0402_16V4Z~D
C465
+1.8V_LAN_M
4.7U_0603_6.3V4Z~D
C483
10U_0805_10V4Z~D
1
2
C_0805
10U_0805_10V4Z~D
1
2
C_0805
1
2
C_0402
1
Layout Notice : Place as close
chip as possible.
+3.3V_LAN
4.7U_0603_6.3V4Z~D
4.7U_0603_6.3V4Z~D
2
2
C457
C456
1
1
0.1U_0402_16V4Z~D
10U_0805_10V4Z~D
2
1
C468
C467
1
2
C_0805
4.7U_0805_10V4Z~D
4.7U_0805_10V4Z~D
1
1
C477
2
2
C_0805
C_0805
Follow 82567 schematic
chiplist that VCC_1.0 for
external use 1 0uF XR5 *2 and
0.1uF *2
for internal u se 4.7uF X5R *2
and 0.1uF *1
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
0.01U_0402_16V7K~D
1
C492
2
CARD_PWR
1
2
11
13
15
3
4
2
1
5
16
1
0.33U_0603_10V7K~D
C493
J1394
1
1
2
2
3
3
4
4
5
5
GND
OUT
OC#
9
14
12
8
7
6
10
6
6
7
GND
8
GND
MOLEX_53780-0670~D
+CBS_VPP
1
2
1
2
3
0.1U_0402_16V4Z~D
1@
1
2
0.01U_0402_16V7K~D
0.1U_0402_16V4Z~D
@
1@
2
C500
C499
1
+3.3V_RUN_CARD+3.3V_RUN
1U_0603_10V4Z~D
0.01U_0402_16V7K~D
1
2
C505
2
1
1394_DET#<24>
U27
1@
VCC3IN
VCCOUT
VCCOUT
VCCOUT
VCC5IN
VCC5IN
EN0
VPPOUT
EN1
VCC3_EN
VCC5_EN
FLG
GND
R5531V002-E2-FA_SSOP16~D
0.1U_0402_16V4Z~D
1
2
NC
NC
NC
U28
5
IN
4
EN#
TPS2051BDBVR_SOT23-5~D
C509
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
CardBus Controller(R5C847)
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
+1.5V_CARD: Max. 650mA, A verage 500m A
+3.3V_CA R D: Max. 1300mA, Average 1000mA
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
JUSB1 (Ext Right Side Top)
JUSB1 (Ext Right Side Bottom)
JESA1 (Ext Left Side Top)
JESA1 (Ext Left Side Bottom)
WLAN
WWAN
WPAN
Card Bus/Express card
DOCKING
DOCKING
USH->BIO
Camera
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
EMC5035
LA-3801P
1
3866Thursday, June 12, 2008
0.8
of
Page 39
5
4
3
2
+5V_ALW
1
+5V_RUN
4.7K_0402_5%~D
12
12
R1093
DD
CC
JTP1
1
1
BC_DAT_ECE1077<38>
BC_CLK_ECE1077<38>
BC_INT#_ECE1077<38>
+3.3V_ALW
+3.3V_ALW
0.1U_0402_16V4Z~D
1
C771
BB
AA
2
Place close to
JTP1.5,6
TP_CLK
TP_DATA
SD05.TCT_SOD323-2~D
@
21
+5V_RUN
+5V_ALW
+3.3V_RUN
KYBRD_BKLT_PWM<38>
TP_DET#<37>
SD05.TCT_SOD323-2~D
@
D53
D54
21
TP_CLK
TP_DATA
KYBRD_BKLT_PWM
TP_DET#
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
10
11
11
12
12
13
13
14
14
15
15
16
16
17
G1
18
G2
TYCO_1-1775737-6
Place close to JTP1 connector
5
4
+5V_RUN+3.3V_ALW
0.1U_0402_16V4Z~D
1
C678
2
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
0.1U_0402_16V4Z~D
1
C679
2
TP_DATA
TP_CLK
3
10P_0402_50V8J~D
1
2
POWER_SW#_MB<38,42>
L41
12
BLM18AG601SN1D_0603~D
12
L42
10P_0402_50V8J~D
BLM18AG601SN1D_0603~D
1
C680
C681
2
Power Switch for debug
POWER_SW#_MB
C684
@
100P_0402_50V8J~D
1
2
1
1
PWRSW1
@SHORT PADS~D
Place on Top
@
1
1
PWRSW2
@SHORT PADS~D
Place on Bottom
@
2
4.7K_0402_5%~D
4.7K_0402_5%~D
12
R1094
10P_0402_50V8J~D
1
2
2
2
2
2
4.7K_0402_5%~D
12
10P_0402_50V8J~D
1
2
@
R595
DAT_TP_SIO
CLK_TP_SIO
C683
FAN@
Part NumberDescription
DC28A000800
Speak@
Part NumberDescription
PK230003Q0L
SM CARD BODY
Part NumberDescription
SP070007V0L
PCMCIA BODY
Part NumberDescription
DC000001Q0L
MDC wire set cable@
Part NumberDescription
DC02000CS0L
T/P wire set cable@
Part NumberDescription
DC02000840L
LVDS cable@
Part NumberDescription
DC020003Y0L
LVDS cable@
Part NumberDescription
DC02000870L
RTC BATT@
Part NumberDescription
GC20323MX00
DAT_TP_SIO <38>
CLK_TP_SIO <38>
FAN SET DAQ20 DC5V AB7405HB-HB3 ADDA
SPK PACK ZJX 2.0W 4 OHM FG
S SOCKET TYCO 1770551-1
10P H5.9 SMART
PCMCIA TYCO
1759096-1
H-CONN SET ZGX
MB-MDC
H-CONN SET ZJX
MB-B/T-TP-FP
H-CONN SET ZJX MB-LCD
14 WXGA+(-1ch)
H-CONN SET ZJX
MB-LCD 14 WXGA+(-2ch)
BATT CR2032 3V
220MAH MAXELL
@
R594
C682
DELL CONFIDENTIAL/PROPRIETARY
Title
SizeDocument NumberRev
Date:Sheet
Compal Electronics, Inc.
Touch PAD/Int KB/LID
LA-3801P
3966Thursday, June 12, 2008
1
of
0.8
Page 40
5
4
3
2
1
DC/DC Interface
+15V_ALW
+3.3V_ALW2
12
R602
61
2
+3.3V_ALW2
12
R604
100K_0402_5%~D
SUS_ON_3.3V#
61
Q62A
2N7002DW-T/R7_SOT363-6~D
2
+3.3V_ALW2
12
R611
100K_0402_5%~D
M_ON_3.3V#
61
Q68A
2N7002DW-T/R7_SOT363-6~D
2
+3.3V_ALW2
AUX_ON
2
100K_0402_5%~D
ALW_ON_3.3V#
Q57A
2N7002DW-T/R7_SOT363-6~D
+15V_ALW
12
3
5
4
12
R620
100K_0402_5%~D
N21917830
12
2N7002DW-T/R7_SOT363-6~D
61
Q74A
DD
ICH_ALW<38>
CC
SUS_ON<38,41>
M_ON<38,45>
BB
AUX_ON<38>
12
R598
100K_0402_5%~D
ALW_ENABLE
3
Q57B
2N7002DW-T/R7_SOT363-6~D
5
4
+15V_ALW
12
R603
100K_0402_5%~D
SUS_ENABLE
3
Q62B
2N7002DW-T/R7_SOT363-6~D
5
4
100K_0402_5%~D
R610
M_ENABLE
Q68B
2N7002DW-T/R7_SOT363-6~D
+15V_ALW
5
200K_0402_5%~D
@
R629
+3.3V_ALW
12
R619
100K_0402_5%~D
2N7002DW-T/R7_SOT363-6~D
3
Q74B
4
+3.3V_ALW_ICH Source
+3.3V_ALW+3.3V_ALW_ICH
Q54
SI3456BDV-T1-E3_TSOP6~D
D
6
S
45
2
+3.3V_ALW
8
7
5
+3.3VM Source
Q66
SI3456BDV-T1-E3_TSOP6~D
6
2
1
12
1
C698
470K_0402_5%~D
2
4700P_0402_25V7K~D
1
G
3
1
2
+3.3V_SUS Source
Q60
STS11NF30L_SO8~D
4
1
C692
4700P_0402_25V7K~D
2
D
S
45
G
3
1
C696
4700P_0402_25V7K~D
2
ENAB_3VLAN <29>
@
R621
1
C687
2
10U_0805_10V4Z~D
C688
3300P_0402_50V7K~D
1
2
36
10U_0805_10V4Z~D
1
C690
2
+3.3V_M
10U_0805_10V4Z~D
12
1
C694
2
12
+3.3V_SUS
12
20K_0402_5%~D
R612
R601
20K_0402_5%~D
20K_0402_5%~D
R605
Discharg Circuit
+3.3V_M+1.05V_M
75_0603_5%~D
12
@
R615
2N7002W-7-F_SOT323-3~D
13
M_ON_3.3V#
SUS_ON_3.3V#ALW_ON_3.3V#
2
G
+3.3V_SUS
2
G
D
S
1K_0402_5%~D
12
@
R627
2N7002W-7-F_SOT323-3~D
13
D
S
12
13
@
2
Q71
G
@
Q81
1K_0402_5%~D
@
R616
2N7002W-7-F_SOT323-3~D
D
@
Q72
S
+3.3V_ALW_ICH
2
G
+5VRUN Source
+15V_ALW+3.3V_ALW2+5V_ALW
12
12
R599
100K_0402_5%~D
RUN_ON_5V#
61
Q56A
2N7002DW-T/R7_SOT363-6~D
RUN_ON<19,28,37,41>
3.3V_RUN_ON<37>
1.05V_RUN_ON<37>
2
12
R608
100K_0402_5%~D
RUN_ON_3V#
61
Q64A
2N7002DW-T/R7_SOT363-6~D
2
12
R617
100K_0402_5%~D
RUN_ON_1.05V#
61
Q70A
2N7002DW-T/R7_SOT363-6~D
2
R597
100K_0402_5%~D
RUN_ENABLE
3
Q56B
2N7002DW-T/R7_SOT363-6~D
5
4
12
R606
100K_0402_5%~D
3
5
Q64B
2N7002DW-T/R7_SOT363-6~D
4
12
R613
100K_0402_5%~D
3
5
Q70B
2N7002DW-T/R7_SOT363-6~D
4
Q55
STS11NF30L_SO8~D
8
7
5
+3.3V_RUN Source
Q61
NTMS4107NR2G_SO8~D
+3.3V_ALW+3.3V_ALW2+15V_ALW
8
7
5
21
@
D30
RB751V_SOD323-2~D
12
R609
0_0402_5%~D
+1.05V_VCCP Source
Q67
12
NTMS4107NR2G_SO8~D
8
7
5
21
+1.05V_M+3.3V_ALW2+15V_ALW
@
D31
RB751V_SOD323-2~D
R618
0_0402_5%~D
1
2
36
4
2200P_0402_50V7K~D
1
C689
2
4
1
C693
470P_0402_50V7K~D
2
4
1
C697
470P_0402_50V7K~D
2
+5V_RUN
10U_0805_10V4Z~D
12
1
R600
C686
20K_0402_5%~D
2
+3.3V_RUN
1
2
36
1
2
36
C691
10U_0805_10V4Z~D
C695
10U_0805_10V4Z~D
1
2
+1.05V_VCCP
1
2
12
R607
20K_0402_5%~D
12
R614
20K_0402_5%~D
Discharg Circuit
+1.5V_RUN+0.9V_DDR_VTT+3.3V_RUN+5V_RUN
1K_0402_5%~D
12
@
R628
2N7002W-7-F_SOT323-3~D
@
13
D
S
Q82
RUN_ON_5V#
1K_0402_5%~D
12
@
R622
2N7002W-7-F_SOT323-3~D
13
D
@
2
Q76
G
S
1K_0402_5%~D
12
@
R623
2N7002W-7-F_SOT323-3~D
13
D
@
2
Q77
G
S
1K_0402_5%~D
12
@
R624
2N7002W-7-F_SOT323-3~D
13
D
@
2
G
RUN_ON_3V#RUN_ON_1.05V#
Q78
S
39_0402_5%~D
12
R625
2N7002W-7-F_SOT323-3~D
13
D
2
Q79
G
S
+1.05V_VCCP
12
13
2
G
1K_0402_5%~D
@
R626
2N7002W-7-F_SOT323-3~D
D
@
Q80
S
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
POWER CONTROL
LA-3801P
4066T h u r s da y, June 12, 2008
1
0.8
of
Page 41
5
4
3
2
1
+3.3V_SUS
2.5V_RUN_PWRGD<18,37>
1.5V_RUN_PWRGD<45>
+5V_RUN
DD
CC
1
2
+3.3V_RUN
1
2
+3.3V_SUS
21
D32
RB751V_SOD323-2~D
C702
0.1U_0402_16V4Z~D
21
D33
RB751V_SOD323-2~D
C704
0.1U_0402_16V4Z~D
D34
RB751V_SOD323-2~D
21
1
C707
0.1U_0402_16V4Z~D
2
12
12
200K_0402_5%~D
12
R642
200K_0402_5%~D
R634
200K_0402_5%~D
R638
10K_0402_5%~D
2200P_0402_50V7K~D
1
2
R633
10K_0402_5%~D
12
1
C703
2200P_0402_50V7K~D
2
12
R637
10K_0402_5%~D
1
C705
2200P_0402_50V7K~D
2
R641
12
C708
+5V_ALW
B
2
+3.3V_ALW
B
2
+3.3V_ALW
E
3
B
Q88
2
MMBT3906WT1G_SC70-3~D
C
1
200K_0402_5%~D
12
R643
E
3
Q83
MMBT3906WT1G_SC70-3~D
C
1
R635
4.7K_0402_5%~D
12
E
3
Q85
MMBT3906WT1G_SC70-3~D
C
1
R639
4.7K_0402_5%~D
12
D35
RB751V_SOD323-2~D
21
C
Q84
2
B
MMST3904-7-F_SOT323-3~D
E
31
C
Q86
2
B
MMST3904-7-F_SOT323-3~D
E
31
+3.3V_ALW
8
P
A3Y
G
U39C
74LVC3G14DC_VSSOP8~D
4
5
R6300_0402_5%~D@
R6310_0402_5%~D
12
12
12
1
2
+3.3V_ALW
C699
100K_0402_5%~D
R632
0.1U_0402_16V4Z~D
C701
0.1U_0402_16V4Z~D
12
8
P
7
A1Y
G
U39A
74LVC3G14DC_VSSOP8~D
4
IMVP_PWRGD<24,37,47,49>
RESET_OUT#<38>
RUN_ON<19,28,37,40>
SUS_ON<38,40>
IMVP_PWRGD
RESET_OUT#
+3.3V_ALW
8
P
2
A6Y
G
U39B
74LVC3G14DC_VSSOP8~D
4
3.3V_5V_SUS_PWRGD
+3.3V_ALW
13
IN1
12
IN2
12
R636
0_0402_5%~D
14
P
11
OUT
G
U40D
74VHC08MTCX_NL_TSSOP14~D
7
+3.3V_ALW
14
1
IN1
2
IN2
7
+3.3V_ALW
14
10
IN1
9
IN2
7
ICH_PWRGD
C700
0.1U_0402_16V4Z~D
12
U40A
74VHC08MTCX_NL_TSSOP14~D
P
3
OUT
G
P
8
OUT
G
U40C
74VHC08MTCX_NL_TSSOP14~D
R640
100K_0402_5%~D
2
G
+3.3V_ALW
14
4
P
IN1
OUT
5
IN2
G
7
+3.3V_M
12
ICH_PWRGD#
13
D
Q87
2N7002W-7-F_SOT323-3~D
S
U40B
74VHC08MTCX_NL_TSSOP14~D
RUNPWROK
6
ICH_PWRGD# <18>
RUNPWROK <37,38,47>
SUSPWROK <38>
ICH_PWRGD <10,24>
BB
AA
+3.3V_M
1
C709
0.1U_0402_16V4Z~D
2
+3.3V_LAN
1
C714
0.1U_0402_16V4Z~D
2
D36
RB751V_SOD323-2~D
21
D40
RB751V_SOD323-2~D
21
R644
10K_0402_5%~D
12
200K_0402_5%~D
2200P_0402_50V7K~D
12
1
R645
C710
2
R651
10K_0402_5%~D
12
2200P_0402_50V7K~D
200K_0402_5%~D
12
1
C715
R652
2
E
3
B
Q89
2
MMBT3906WT1G_SC70-3~D
C
1
200K_0402_5%~D
12
R646
E
3
B
Q91
2
MMBT3906WT1G_SC70-3~D
C
1
200K_0402_5%~D
12
R653
21
D37
RB751V_SOD323-2~D
21
D41
RB751V_SOD323-2~D
+3.3V_ALW+3.3V_ALW
8
P
7
A1Y
G
U41A
74LVC3G14DC_VSSOP8~D
4
+3.3V_ALW+3.3V_ALW
C713
0.1U_0402_16V4Z~D
12
8
P
2
A6Y
G
U41B
74LVC3G14DC_VSSOP8~D
4
3.3V_M_PWRGD <18,38>
3.3V_LAN_PWRGD <38>
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Power Good
LA-3801P
4166T h u r s da y, June 12, 2008
1
0.8
of
Page 42
5
+3.3V_RUN
12
R654
10K_0402_5%~D
D
S
SATA_ACT#
SATA_ACT#_R<23>
DD
2N7002W-7-F_SOT323-3~D
MASK_BASE_LEDS#
13
Q93
G
2
+5V_RUN
2
13
12
R6591K_0402_5%~D
Q92
DDTA114EUA-7-F_SOT323-3~D
SATA_LED
HDD LED solution for Blue LED
LED_WLAN_OUT#<34>
+3.3V_WLAN
12
R662
100K_0402_5%~D
2N7002W-7-F_SOT323-3~D
Q98
MASK_BASE_LEDS#
D
S
13
G
2
D67
SDM10U45-7_SOD523-2~D
21
2
+5V_RUN
Q97
PDTA114EU_SC70-3~D
13
12
R6631K_0402_5%~D
WLAN_LED
WLAN LED solution for Blue LED
CC
+3.3V_RUN
12
R206
100K_0402_5%~D
LED_WWAN_OUT#<34>
2N7002W-7-F_SOT323-3~D
MASK_BASE_LEDS#
Q116
S
G
+5V_RUN
D
13
2
2
Q115
PDTA114EU_SC70-3~D
13
R1251K_0402_5%~D
12
WWAN_LED
WWAN LED solution for Blue LED
+3.3V_RUN
R660
10K_0402_5%~D
12
BB
LED_WPAN_OUT#<34>
2N7002W-7-F_SOT323-3~D
MASK_BASE_LEDS#
S
Q95
G
2
D
13
2
+5V_RUN
Q94
DDTA114EUA-7-F_SOT323-3~D
13
WPAN_LED
12
R6611K_0402_5%~D
WPAN LED solution for Blue LED
LED Circuit Control Table
+3.3V_ALW
SNIFFER_YELLOW#<37>
AA
SNIFFER_BLUE#<37>
2
+5V_ALW
2
5
Mask All LEDs (Sn iffer Function)
Mask Base MB LEDs (Lid Closed)
Do not Mask LEDs (Lid Opened)11
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONT AINS CONFIDE NTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE C OMPETENT DIVIS ION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INF ORMATION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WR ITT EN CO NSE NT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE C OMPETENT DIVIS ION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INF ORMATION IT CONT AINS
THIS SHEET OF EN GINEE RING D RAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
Component select
Input CAP 10uF_1206_25V
Output Cap 220U_D2_4VM_R15(NEC_PSLV0G227M)
H_MOSFET SI4800BDY
L_MOSFET SI4810BDY(16/20mOhm@4.5V, 6A)
Inductor 3.3U_MPL73-3R3_6A(DELTA)
+1.5V_RUN_P+1.5V_RUN
AA
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Component select
Input CAP 10uF_1206_25V*2
Output Cap 330U_D2E_2.5VM_R15*2(Sanyo_2R5TPE330MF)
H_MOSFET FDS8880
L_MOSFET FDS6676AS(4.2/5.5mOhm@4.5V, 15A)
Inductor 1.4U_HMU1350-1R4PF_15A(DELTA)
+1.8VSUSP/ +0.9V_DDR_VTT
DDR2 Termination
+5V_ALW
PR245
@
12
10_1206_5%~D
ALW_PWRGD_3V_5V<38,44>
12
21
PD26
RB751V-40_SOD323~D
@
1_0603_5%~D
ISL88550_DH
ISL88550_LX
ISL88550_FB
0_0402_5%~D@
12
GNDA_DDR
PJP43
PAD-OPE N 4x4m
12
@
PJP44
PAD-OPE N 4x4m
12
@
PR250
PR254
PR255
12
12
ISL88550_REF
12
ISL88550_ILIM
100K_0402_1%~D
PR259
59K_0402_1%~D
12
PC226
4.7U_0805_6.3V6K
PU16
20
18
19
21
23
16
15
1
3
+1.8V_MEM
BST
DH
LX
DL
PGND1
VOUT
FB
TON
REF
PR246
0_0402_5%~D
PR249
0_0402_5%~D
12
12
GNDA_DDR
2
22
VDD
OVP/ UVP
ISL88550A_TQFN28~D
SKIP
ILIM
4
25
PR258
0_0402_5%~D
12
GNDA_DDR
@
28
TP0
24
12
GNDA_DDR
ISL88550_AVDD
26
17
VIN
AVDD
5
POK1
6
POK2
27
SHDN
7
STBY
13
VTTI
14
REFIN
11
PGND2
12
VTT
9
VTTS
10
VTTR
SS8GND
GND
29
12
PC239
1000P_0402_50V7K~D
@
GNDA_DDR
PC227
1U_0603_10V6K~D
ISL88550_REFI N
12
12
+3.3V_ALW
PR247
20K_0402_5%~D
PR253
20_0603_1%~D
12
PC234
0.1U_0402_10V7K~D
GNDA_DDR
PC240
1U_0603_10V6K~D
12
PR248
12
100K_0402_1%~D
DDR_ON <38>
+1.8V_SUSP
GNDA_DDR
1
PC232
10U_0805_6.3V6M~D
2
PJP42
PAD-OPEN1x1m
@
1.8V_SUS_PWRGD <38>
PR251
0_0402_5%~D
12
+1.8V_SUSP
1
1
PC235
PC236
2
2
10U_0805_6.3V6M~D
10U_0805_6.3V6M~D
+V_DDR_MCH_REF
12
0.9V_DDR_VTT _ON <37>
+0.9V_DDR_VTTP
1
Design current 0.7A for +0.9V_DDR_VTTP
PC237
Peak current 1A for +0.9V_DDR_VTTP
2
10U_0805_6.3V6M~D
@
+0.9V_DDR_VTTP
5
4
PJP45
21
PAD-OPEN 2x2m ~D
+0.9V_DDR_VTT
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE C OMPETENT DIVIS ION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INF ORMATION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WR ITT EN CO NSE NT OF COMPAL ELECTRONICS, INC.
12
PC90
8
D6D5D7D
0.1U_0603_25V7K~D
@
S
S
S
3
2
1
3
D
S
1
8
D6D5D7D
G
S
S
S
3
2
1
3
D
G
S
1
8
D6D5D7D
S
S
S
3
2
1
3
D
S
1
12
12
PC176
@
1000P_0603_25V7K~D
PHASE1
PQ18
@
12
FDMS8670AS_MLP-8~D
12
PC99
@
1500P_0603_25V7K~D
12
12
PC177
@
1000P_0603_25V7K~D
PQ20
12
FDMS8670AS_MLP-8~D
12
PC110
@
1500P_0603_25V7K~D
PR273
@
12
12
PC178
@
PHASE3
1000P_0603_25V7K~D
PQ22
@
12
12
FDMS8670AS_MLP-8~D
PC126
@
1500P_0603_25V7K~D
3
12
12
PC91
PC92
0.1U_0603_25V7K~D
2200P_0402_50V7K~D
PR271
2.4_0805_1%~D
PR269
2.4_0805_1%~D
10K_0402_1%~D
12
PR91
7.68K_0805_1%~D
12
VSUM
12
PR272
@
PC102
2.4_0805_1%~D
PC103
0.1U_0603_25V7K~D
2200P_0402_50V7K~D
PHASE2
PR268
@
2.4_0805_1%~D
+CPU_PWR_SRC
2.4_0805_1%~D
0.45UH_ET QP4LR45XFC_25A_20%~D
PR270
2.4_0805_1%~D
10K_0402_1%~D
12
PR134
7.68K_0805_1%~D
12
VSUM
12
12
PC93
PC94
10U_1206_25V6M~D
10U_1206_25V6M~D
PL13
0.45UH_ETQP4LR45XFC_25A_20%~D
4
3
PR90
0.22U_0603_10V7K~D
+CPU_PWR_SRC
12
12
PC105
PC104
10U_1206_25V6M~D
0.45UH_ET QP4LR45XFC_25A_20%~D
4
3
PR109
10K_0402_1%~D
12
PR111
7.68K_0805_1%~D
12
VSUM
12
12
PC115
PC114
PC113
10U_1206_25V6M~D
10U_1206_25V6M~D
PL15
1
2
PR133
0.22U_0603_10V7K~D
1
1
+
+
PC88
PC89
2
2
100U_25V_M~D
100U_25V_M~D
1
2
PC98
12
12
10U_1206_25V6M~D
PL14
1
2
PC109
0.22U_0603_10V7K~D
12
12
12
PC116
0.1U_0603_25V7K~D
2200P_0402_50V7K~D
4
3
PC125
12
12
12
VO
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Doc um e n t N u mb erRe v
Date:Sheet
2
PL12
FBMJ4516HS720NT_1806~D
12
PJP32
12
1
+
PAD-OPE N 4x4m
PC87
2
@
100U_25V_M~D
Iccmax=44A
I_TDC=35A
OCP=65A, Intel spec=50A
PR88
10_0402_1%~D
12
12
PR92
0_0402_5%~D
VO
PR106
10_0402_1%~D
12
12
PR112
0_0402_5%~D
VO
+VCC_CORE
PR128
10_0402_1%~D
PR135
0_0402_5%~D
12
PC264
680P_0402_50V7-K~D
+VCC_CORE
+VCC_CORE
Compal Electronics, Inc.
+VCORE
LA-3801P
+PWR_SRC
12
PC265
470P_0402_50V7K~D
4766T hur s da y, June 12, 2008
1
0.8
of
Page 48
5
+DC_IN_SS
2
G
0.01U_0402_25V7K~D
GNDA_CHG
CKG_SMBCLK<6,27,38>
CKG_SMBDAT<6,27,38>
PC256
100P_0402_50V8J
GNDA_CHG
NB_AC_OFF <37,43,50>
NB_AC_OFF#
13
D
PQ44
RHU002N06_SOT323
S
+SDC_IN
PR154
49.9K_0402_1%~D
12
PC146
12
+3.3V_ALW
PC153
0.1U_0402_10V7K~D
GNDA_CHG
ISL88731_ICM<18>
+DC_IN
ISL88731_VREF
12
PR331
PR333
232K_0402_1%~D
47K_0402_1%~D
12
12
PR336
21.5K_0402_1%
PC255
GNDA_CHG
100P_0402_50V8J
GNDA_CHG
2
G
PR284
200K_0402_1%~D
ISL88731_VDDP
PR145
12
ACAV_IN<18,38>
12
12
12
PR332
42.2K_0402_1%~D
GNDA_CHG
5
DD
CC
BB
AA
SI4835BDY-T1-E3_SO8~D
10K_0402_5%~D
13
D
+DOCK_PWR_BAR
PQ35
RHU002N06_SOT323
S
12
PR152
10K_0402_1%~D
215K_0402_1%
1M_0402_5%~D
12
+5V_ALW
5
IN+
6
IN-
12
GNDA_CHG
PD30 B540C~D
21
8
7
5
PR174
12
+DC_IN_SS
ACAV_DOCK_SRC<50>
12
PR157
@
PR334
8
P
O
G
4
PQ34
4
24K_0402_1%~D
2
3
ISL88731_VREF
12
PR173
0_0402_5%~D
@
12
15.8K_0402_1%~D
12
PR162
PC164
@
16.2K_0402_1%~D
+3.3V_ALW
12
7
PU11B
LM393DR_SO8~D
NB_AC_OFF#
1
2
36
PR175
PR159
12
PC165
0.1U_0402_10V7K~D
ISL88731_VREF
PR341
@
100K_0402_5%~D
PR335
12
0_0402_5%~D
12
@
12
0_0402_5%~D
PD33
BAT54CW_SOT323~D
1
2
G
PR156
12
0_0402_5%~D
12
PR176
@
200K_0402_5%~D
12
PC241
@
2.2K_0402_5%~D
130P_0402_10V7K~D
12
12
0.01U_0402_25V7K~D
12
PR362
100K_0402_5%~D
PD35
21
RB751S40T1_SOD523-2~D
PR356
13
D
S
PC156
@
+DC_IN
12
PR143
PQ56
RHU002N06_SOT323
12
PR150
2000P_0402_10V7K~D
PC242
12
@
130P_0402_10V7K~D
12
12
PC157
0.01U_0402_25V7K~D
0.01U_0402_25V7K~D
ISL88731_ICM
PAD~D@
T174
ACAV_IN_NB <37,38>
4
160K_0402_1%~D
2
12
PC142
33K_0402_5%~D
0.047U_0603_25V7K~D
GNDA_CHG
12
PC243
@
12
PC158
@
1U_0603_10V6K~D
PR167
@
12
8.45K_0402_5%~D
PR169
@
33.2K_0402_1%~D
12
GNDA_CHG GNDA_CHG
4
+SDC_IN
12
PR141
33K_0402_5%~D
12
PR146
10K_0402_5%~D
13
D
G
PQ27
S
0.1U_0603_25V7K~D
PC145
1U_0805_25V6K~D
12
ISL88731_ICM
12
PR262
@
7.5K_0402_5%~D
ISL88731_VREF
PR263
@
12
0_0402_5%~D
@
GNDA_CHG
ISL88731_VREF
12
PC168
@
0.1U_0402_25V7K~D
PR140
0.01_1206_1%~D
2
2
PU10
22
DCIN
2
ACIN
13
ACOK
11
VDDSMB
10
SCL
9
SDA
14
NC
8
ICM
6
VCOMP
5
NC
4
ICOMP
3
VREF
7
NC
12
GND
29
GND
PC170
@
1
2
13
1
3
12
10K_0402_5%~D
0.1U_0402_10V7K~D
PR354
10_0402_1%~D
1
ISL88731_TQFN28~D
12
100P_0402_50V8J
@
12
PC135
TBD_0603_25V7K~D
RHU002N06_SOT323
PC138
@
12
GNDA_CHG
12
PC163
0.1U_0402_10V7K~D
12
PR166
@
51.1K_0402_1%~D
12
PR171
12
@
17.8K_0402_1%
PC169
@
12
0.01U_0402_25V7K~D
GNDA_CHG GNDA_CHGGNDA_CHGGNDA_CHG
PR172
GNDA_CHG
@
348_0402_1%~D
4
3
13
2
2
PQ26
NTR4502PT1G_SOT23-3~D
12
12
PR177
PC143
12
@
0.1U_0603_25V7K~D
27
28
NC
VCC
CSSP
CSSN
BOOT
VDDP
UGATE
PHASE
LGATE
PGND
CSOP
CSON
VFB
NC
GNDA_CHG
1M_0402_1%~D
12
2
IN-
3
IN+
12
PC171
@
100P_0402_50V8J
+5V_ALW
THIS SHEET OF EN GINEE RING D RAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED B Y OR D ISCLOS ED T O ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
Component select
Input CAP 10uF_1206_25V*2
Output Cap 330U_D2E_2.5VM_R15*2
H_MOSFET SI4682DY
L_MOSFET SI4362DY(4.2/5.5mOhm@4.5V, 15A)
Inductor 0.56U_MPC1040LR56_23A(NEC_TOKIN)
1
PC214
12
@
0.1U_0402_16V7K
<BOM Structure>
PC258
1
2
10U_0805_6.3V6M~D
+VGFX_COREP
1
PC259
2
@
10U_0805_6.3V6M~D
GNDA_VGA
PJP39
PAD-OPEN1x1m
@
12
12
PC220
1000P_0402_50V7K~D
GNDA_VGAGNDA_VGA
PR242
340K_0402_1%~D
12
1K_0402_1%~D
12
PC221
100P_0402_50V8J
PR243
+VGFX_SRC
12
PJP40
+VGFX_COREP
12
PAD-OPE N 4x4m
+VCC_GFXCORE
A
Title
ADP3209 Power Up both Intel GMCH and ATI M54
Size Doc um e n t N u mb erRe v
C
Date:Sheet
4966Thursday, June 12, 2008
0.8
of
Page 50
5
DD
+3.3V_ALW2
12
PR274
100K_0402_5%~D
RHU002N06_SOT323
ACAV_DOCK_SRC#<35>
CC
PQ65
SI4835BDY-T1-E3_SO8~D
8
+VCHGR
BB
PBATT_OFF<37>
AA
7
5
+3.3V_ALW
12
3
5
4
PBATT_OFF<37>
DOCK_AC_OFF<35,37>
PR353
100K_0402_5%~D
2
PQ64B
2N7002DW-T/R7_SOT363-6~D
1
2
36
4
12
PR352
PQ64A
61
2N7002DW-T/R7_SOT363-6~D
12
47K_0402_1%~D
21
RB751S40T1_SOD523-2~D
PD34
PR351
240K_0402_5%~D
PBATT_OFF<37>
PBATT+
PR364
390K_0402_5%~D
PR365
390K_0402_5%~D
+3.3V_ALW2
2
G
12
12
4
+DOCK_PWR_BAR
PQ29
12
PR275
100K_0402_5%~D
ACAV_DOCK_SRC <48>
13
D
PQ57
RHU002N06_SOT323
S
3
PQ55B
2N7002DW-T/R7_SOT363-6~D
5
4
13
D
2
G
S
PR260
620K_0402_5%~D
12
61
2N7002DW-T/R7_SOT363-6~D
2
PQ55A
PD36
21
RB751S40T1_SOD523-2~D
12
PR147
100K_0402_5%~D
12
PR179
22K_0402_5%~D
5
2N7002DW-T/R7_SOT363-6~D
PR261
33_0402_5%~D
PQ63B
FDS6679AZ_SO8~D
1
2
36
4
12
12
SLICE_BAT_PRES#<35,37,43>
3
+3.3V_ALW+3.3V_ALW
12
PR178
13
D
PQ37
2
RHU002N06_SOT323
G
S
3
61
PQ63A
4
2N7002DW-T/R7_SOT363-6~D
PQ41
8
7
5
+DC_IN_SS
PC263
1U_0603_25V6-K~D
100K_0402_5%~D
SW_GND<48>
PR360
0_0402_5%~D
2
PD19
RB751V-40_SOD323~D
5
12
PR357
330K_0402_5%~D
12
SLICE_BAT_PRES
+3.3V_ALW2
12
PR329
100K_0402_5%~D
SLICE_BAT_PRES
3
PQ40B
2N7002DW-T/R7_SOT363-6~D
4
2
G
2
G
12
12
PR180
100K_0402_5%~D
NB_AC_OFF <37,43,48>
13
D
PQ38
RHU002N06_SOT323
S
+5V_ALW
12
PR181
22K_0402_5%~D
NB_AC_OFF_BJT <43>
13
D
PQ39
RHU002N06_SOT323
S
PQ59B
NTGD4161PT1G_TSOP6~D
S
G
3
PR325
12
240K_0402_5%~D
12
61
2
PD27
B540C~D
21
FDS6679AZ_SO8~D
PQ23
8
7
5
4
12
330K_0402_5%~D
12
+NBDOCK_DC_IN_SS
D
42
12
PR363
1K_1206_5%
12
PC262
PR327
1U_0603_25V6-K~D
47K_0402_5%~D
PQ40A
2N7002DW-T/R7_SOT363-6~D
1
2
36
PR148
47K_0402_1%~D
PR361
+DOCK_PWR_BAR
2
12
12
PC141
PR142
0.47U_0805_25V7K~D
IMD2AT-108_SC74-6~D
+DC_IN_SS
NTGD4161PT1G_TSOP6~D
S
G
PR326
12
240K_0402_5%~D
2
G
PQ24B
IMD2AT-108_SC74-6~D
2
16
240K_0402_5%~D
43
PQ24A
PD18
2
3
RB715F_SC70-3~D
PQ59A
D
65
1
PR328
12
47K_0402_5%~D
13
D
PQ43
RHU002N06_SOT323
S
12
PR144
22K_0402_5%~D
EN_DOCK_PWR_BAR#
5
PQ28
RHU002N06_SOT323
13
D
2
G
S
12
PR151
22K_0402_5%~D
PD31
PDS5100H-13_POWERDI5-3
2
3
FDS6679AZ_SO8~D
PQ42
8
7
5
4
1
PD20
12
RB751V-40_SOD323~D
PR186
12
33K_0402_5%~D
13
D
S
1
1
2
36
PQ66
RHU002N06_SOT323
2
G
PR358
0_0402_5%~D
PR359
@
0_0402_5%~D
1
EN_DOCK_PWR_BAR <37>
12
PC174
2200P_0402_50V7K~D
EN_DOCK_PWR_BAR#
12
ACAV_DOCK_SRC
12
+PWR_SRC
12
PC175
0.1U_0603_25V7K~D
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
5166T h u r s da y, June 12, 2008
1
0.8
of
Page 52
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
25HW
26CompalSBOOT add @R898 pull down to GNDHW
38CompalFor Dock detect function
3608/30/2007
2738HWCompal
2938HWCompal
30
10HW08/30/2007DELLFor customer requestAdd test point in U2 RSVD1-RSVD25
For customer request09/01/20073638Remove L77
Follow Debug port design guide for Santa Rosa and
Montevina Platforms_Rev0.95 for ITP700Flex debug port
DELLFor customer request09/03/2007HW
For customer requestDELL09/03/2007HW45
VCC3EN# need connect to U27 pin2, VCC5EN# need connect
to U27 pin 1
Remove U58 and connect ACAV_IN_DOCK to U59 pin 1
SNIFFER/INSTANT_SW# add R900 100K ohm pull up
to +RTC_CELL
U24 pin 28 C_TPM_LPC_EN add 4@R892 pull down 4.7K ohm to
GND, and add 4@R893 to EC & USH
JTAG_RST# add C1040 0.1uF to GND, and R585 change
from 1K ohm to 100 ohm and no-stuff
Change R817, R212 from 8.2K ohm to 100K ohm,
R823 from 10K ohm to 100K ohm
Change ITP_TDO,ITP_TMS,ITP_TDI,ITP_TRST#,ITP_TCK of
R62,R64,R65,R66,R67 pull-up from 56 to 51ohm and add
ITP_BPM#5 of R912 pull-up 51ohm to +1.05V_VCCP. Change
H_RESET# serial resistor to 1K ohm
Remove SLICE_CONN_LOOP# on ECE5028 pin28
and short JDOCK1 pin141,143 and use SLICE_BAT_PRES#
Contact CONTACTLESS_DET# to JCS1 pin6 and
add pull-up 100K to +3.3V_ALW
R180 and R181 need to change back to 100K ohmFor customer requestDELL09/03/2007HW42
POP C271, C272, C273, C274 with 0.1 uF
Change C1036, C1037, C1038, and C1039 to R901-R904
Updated RTC PAID ciruit, add R905 100K ohm,
R906 1M ohm, Q96, R908 100K ohm and @R907 remove R757
U60 pin 5 pull up to +3.3V_RUN37
Solution DescriptionRev.Page#Title
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
X02
Request
4609/03/2007HW
AA
HW2647X02
09/03/2007
Compal
CompalFor ATG touch screen function BOM controlChange R477, Q117, C388, C387, C386, C79 to 3@
For vender request28
Pop R368, de-pop R367
X02
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
5266T h u r s da y, June 12, 2008
1
0.8
of
Page 53
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
49
50
35C1033 & C1034 change to 0603 25VCompal
HW
09/03/2007Smart card function can not work36
Owner
CompalFor vender requestHW09/03/2007Change net name from AUD_EAPD# to AUD_EAPD 27,28
CompalHW
For vender request09/03/2007
JSC1 pin 1 connect change from GND to add
R913 4.7K ohm pull up to +3.3V_RUN
Change net name from SC_DET# to SC_DET
52
HWCompal
37,4209/03/2007Change net nameChange net name from SNIFFER_GREEN# to SNIFFER_BLUE#X0253
HWCompal
09/03/200738For vender requestHOST_DEBUG_TX need to pull up R911 10k ohm to +3.3V_ALW51
CompalHW
For vender requestChange D43 pin2 net name from R_WPAN_LED to WPAN_LED09/03/200742
Add test pointCompal09/04/2007HWGNT2#/GPIO53, SUS_STAT#/LPCPD#, 22,24
BOM control add 4@ for China TPM09/04/2007 CompalHW2956X02Change C484-C486, R381, R383, R893, U24 to 4@
57Add test pointCompal09/04/2007HW31,36X02UDIO1, UDIO2, UDIO5, RI_OUT#/PME#, FIL0, MDIO1,MDIO2,
MDIO5,MDIO6, MDIO18, MDIO19, SC_FCB_ENB
58Change net nameCompal09/04/2007HWX02
60
6118
37
37DELLFor customer request
18
HW
HW
09/04/2007HWChange @R788 pull up from +3.3V_ALW to +3.3V_RUNX0259
09/04/2007
09/04/2007
Compal
Compal
For vender requestAdd @R914 pull up to +3.3V_ALWX02
Add net nameAdd net name for +RTC_CELL_R U3 pin 21 X02
Change TS_TXD_BUF to TSRX_ECTX_BUF, TS_RXD to TSTX_ECRX,
TS_TXD to TSRX_ECTX, TS_RXD_BUF to TSTX_ECRX_BUF
Solution DescriptionRev.Page#Tit le
X0248
X02
X02
X02
X02
X02
X02
Request
Change 1394 connector from 5 pin to 6 pinX02Add pin 1 to GNDCompal09/05/2007HW6231
BB
2763
Change U17 net name adn update U17 symbol for output pinCompal09/05/2007HWX02
Change DAI_BCLK to DAI_BCLK#, DAI_LRCK to DAI_LRCK#
DAI_DO to DAI_DO#, DAI 12MHZ to DAI_12MHZ#, I2S_DI to
I2S_DI# and update U17 symbol
For vender requestIntel09/05/2007HW2964X02
JTAG_TDO_LAN add @R889 pull down to GND, JTAG_TDI_LAN
add @R890, JTAG_TMS_LAN add @R915, JTAG_TCK_LAN add
@R916 pull up to +3.3V_LAN, JTAG_TRST_+LAN add @R891
pull down to GND
For vender request09/06/2007 IntelHWChange R57 from 22.6 ohm to 1K ohmX026507
66Follow DELL issue item SCH161967 System DP off circuit.09/06/2007HWCompal21X02
Add U62, @R917, @R918,R919,C0141, and change R189 from
pull down to pull up +3.3V_RUN, connect DP_MUX_PD# from
U9 pin30 to U62 pin 1 and change DP_MUX_PD# net name to
DP_MB_EN, connect DP_MB_HPD from U9 pin 40 to U62 pin2,
connect U62 pin 4 to U9 pin 40
Schematic issueChange C380 & C381 from 3900PF to 0.1uFX02Compal09/06/2007HW6726
AA
6836,37HW09/06/2007 CompalX02
Disable USH TPM & enable China TPM
Stuff R841,R474,R892,R893 and no-stuff
R483,R464,R466,R788,@R750,@R723,@R724,@R732,@R733
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
5366Th u r s d ay, June 12, 2008
1
0.8
of
Page 54
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
69
37,38
39,40
41
7027,37HW1. Rename DOCK_MIC_DET# to DOCK_MIC_DET
CC
HW24,33
09/08/2007CompalRename net nameX02
Owner
Follow M09 GPIO Map_0907DELL09/08/2007X02
1. Change MEC5035 pin43(GPIO52) from SIO_EC_SCI2# to SIO_EXT_SCI#
and contact to ICH9M pinC12(GPIO12) and pinAG19(GPIO1)
2. Remove MEC5035 pin66(GPIO100/nEC_SCI) off-page
3. Change ICH9M pinAH21(GPIO6) form SIO_EC_SCI2# to TPM_ID and
add pull-down of R922 for China TPM(4@), stuff R273 for USH
TPM(5@) and change to 100K
4. Change ICH9M pinC21(GPIO13) from ENERGY_DET# to
CONTACTLESS_DET# and change R822 from 20K to 100K.Remove ECE1088
pin10 and R910.
5. Change CELL_CHARGER_DET# from MEC5035 pin126(VCI_IN1#) to
ECE5028 pin78(GPIOB6)
6. Rename MEC5036 pin126(VCI_IN1#) from CELL_CHARGER_DET# to
EN_CELL_CHARGER_DET# and contact to U53 pin3,4
7. Rename USB_CHARGER_PWR_EN# to ESATA_USB_PWR_EN# and contact to
U29 pin3,4 and add pull-up 100K of R923 to +3.3V_ALW
8. Remove ECE5028 pin82 off-page for DELL_ESATA_PWR_EN#
9. Change MEC5035 pin42(GPIO051) from 3.3V_SUS_ON to SUS_ON and
remove pin34(GPIO041) from SUS_ON to NC
10. Remove MEC5035 pin118(BGPO0) to NC
2. Rename DOCK_HP_DET# to DOCK_HP_DET
7114HW09/10/2007DELLFor DELL EE work item: SCH162351No stuff C746,C747X02
7224HW09/10/2007CompalChange SPI ROM P/NChange U12,U13 to SA00001OZ0LX02
7309/11/200733,37,38HWDELLESATA USB charger control signal issue
24HWDELLFollow DELL requestRemove SIO_EXT_SCI# on ICH9M pinC12(GPIO12) and U36
09/11/2007
1. Add serial resitor of R928 for CELL_CHARGER_DET# and R927,C1042
for EN_CELL_CHARGER_DET# and wire-and contact to JESA1 pin16.
2. Change U29 pin3,4 from ESATA_USB_PWR_EN# to DELL_ESATA_PWR_EN#
3. Change U53 pin3,4 from N_CELL_CHARGER_DET# to ESATA_USB_PWR_EN#
pin43(GPIO052) and contact from ICH9M pinAG19(GPIO1) to U36
pin66(GPIO100)
7510,16
17,18
HWDELL
09/11/2007Follow DELL request for PM_EXTTS#
Add serial resistor of R926 from U3 pin13 contact to U2
pinN33,P32 and remove trace of PM_EXTTS#[0,1] contact to DIMM
7623,24HW09/11/2007CompalAviod leakage issue1. Change SIO_EXT_SCI# pull-up from +3.3V_ALW_ICH to +3.3V_RUN
BB
2. Change TPM_ID pull-up from +3.3V_ALW_ICH to +3.3V_RUN
3. Change SNIFFER_DET# pull-up from +3.3V_ALW_ICH to +3.3V_RUN
4. Change IO_LOOP from +3.3V_RUN to +3.3V_ALW_ICH
5. Change RTC_BAT_DET# from +3.3V_ALW_ICH to +3.3V_RUN
6. Change ROUSH_PAID_TS_DET# from +3.3V_RUN to +3.3V_ALW_ICH
7737HW09/11/2007Compal
7836HW09/11/2007BroadcomFollow vendor request for use smard card
Add pull-up resistor for DELL_ESATA_PWR_EN#
initial
controller of 73S8009CN
Add pull-up resistor of R929 to pull-up +3.3V_ALW
1. Contact of GPIO14_TER_ON/OFF from U33 pin24 to U32 pinC4
2. Contact AUX1UC from U33 pin2 to U32 pinJ14
3. Contact AUX2UC from U33 pin3 to U32 pinJ15
4. Stuff R768,R769,R490
5. Change netname from GPIO1_TER_ON/OFF to UART_TX/GPIO1
Change EMC4002 part numberFrom SA00001PYL for rev.B to SA00001PY1L for rev.CHW09/11/2007Compal1880X02
AA
09/11/2007HW10,2781
change @R685 from 33 ohm to 0 ohm, R85 de-pop, @R330
from 0 ohm to 10K ohm
X02CompalFor vender request
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
5466T h u r s da y, June 12, 2008
1
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of
Page 55
5
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Version Change List ( P. I. R. List )
3
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ItemIssue DescriptionDate
DD
82Change R574, C242 part number, and C604 de-pop
Owner
Compal38,19,2709/13/2007HW
Change from 1M ohm to 100K ohm, C242 from .1u 16V to .1u 25V,
C604 to @C604
For vender requestCompal09/13/2007HW8307X03
Change R62, R64, R67, R65, R66 from 51 ohm to 56 ohm
R912 to @R912
SCH162577: Populate pull-down on ICH_LAN_RST#Dell09/14/2007ICH9M2484Populate R276, No Pop R271X03
85ICH9M09/14/2007DellSCH161941: USH and China TPM Pop Options29
Dell09/14/2007ICH9M2986
SCH162277: GPIO for China TPM vs. USH TPMFollow the new GPIO map to implement China TPM ID strapX03
Chane the text in the table to show that it
R892 is connect to pin China TPM pin 28
Depop R466Follow TPM Option Table on page 29.Dell09/14/2007USH3687X03
EC09/19/2007DellSCH162762: No Stuff U37 - Flash ROM on the ECDepop U37, C672, R589, R590, R591, R592, R5938838
Changed the value of R908 to 1 k ohm SCH162766: Need to change the value of R908Dell09/19/2007ICH2389X03
CC
10/09/2007
Updated
09/19/2007No pop R740, R741, and R742
9310MCHX03
09/19/2007Dell
Dell
Dell3492MiniCardX03
SCH162826: Connect the ICH9 GPIO12 to the
Intel LOM LAN_DISABLE_N
SCH162827: No pop the 0 Ohm resistors that
connect the USB and PCIE mini-card detects
SCH162822: Remove one of the two pull-ups on
PM_EXTTS#
9419, 37 LVDS/5028 09/27/2007DellSCH162824: Add load switch for the camera powerX03
Dell09/27/2007X03
97
BB
DellChanged C434, C435 size to 080528Amplifier 09/29/2007SCH162939: C434 and C435 can be reduced to 080598X03
SCH162926: Need to add 100k pull down to
DPC_CA_DE
SCH163185: Add ESD discharge parts for the Dock
Power pins
SOT353 and SC70 footprint are the same package9021, 38ICH09/19/2007DellSCH162800: Check U57 and U62 for packagesX03
Removed U58. Added R1008.9124,29,37 ICH/LOM
Removed R85 and changed netname from PM_EXTTS#0/#1 to
PM_EXTTS#
Removed D4 and Added C1043, C1044, Q132, Q133, R995.
Use GPIOB4 on the 5028 for CCD_OFF .
SCH163465: Change Netname following 1003 GPIO MapDell10/05/2007ECX0333, 37106
Rename GPIOB2 pin 82 from DELL_ESATA_PWR_EN# to
USB_CHARGER_PWR_EN# for clarification
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
5566Th u r s d ay, June 12, 2008
1
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Page 56
5
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Version Change List ( P. I. R. List )
3
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1
ItemIssue DescriptionDate
DD
107SCH163524: Need to change SNIFFER_DET# connectionDell
10/09/2007ICH,SIO24,37
108
10933USB10/26/2007
Updated
Owner
Disconnect SNIFFER_DET# from ICH pin AE18 and connect it to
Compal10/11/2007USH36
SCH163437: Teridian Feedback: Make sure Inductor
has max rated current 400mA on pin 27
CompalSCH163706: Charge USB Circuit Update1. JESA1 pin1 change to +5V_ESATA and pin5 change to +5V_CHGUSB
EC5028 pin 33. Rename, SNIFFER_DET# to PWR_BTN_BD_DET#
L69 change to 1210 size to support max 400mA
2. JESA1 pin2,3 change to USBP3_D-,USBP3_D+ and pin6,7 change
to USBP2_D-_SW, USBP2_D+_SW
110
38EC10/17/2007CompalSCH163795: Follow M09 GPIO_100307 MAP to modify
scheamtic
1.Add R85,C918 for RC_ID
2.Remove DEBUG_ENABLE# and connect HOST_DEBUG_RX from U36
pin71 to R577 pin2
3.Remove ADAPT_TRIP_SET on U35 pin70 and PR169 Pin1
1. Added MDC_RST_DIS# to GPIOE5/DTR# (Del R489, R830)
2. Changed pin 82 from USB_CHARGER_PWR_EN# to ESATA_USB_PWR_EN#
3. Change pin 104 from ESATA_USB_PWR_EN# to USB_POWERSHARE_PWR_EN#
11428Amplifier
11/01/2007DellSCH164416: Line out and Line In THD+N Failures
reqire cap changes
SCH163782: Remove options for TV on UMADell11/01/2007GMCH,CRT12,20115
Changes need to be made to the Line Out series
Capacitors C436 & C437 from 1uF 1206 to 2.2uF 1206
Disconnect TV_CVBS, TV_Y and TV_C from U4, and connect each to a
75 ohm resistor to ground. Removed R669, R762, R763. Make pins
7B1, 8B1, 9B1, 7B2, 8B2, and 9B2 NC at U4
Dell11/01/2007Thremal18,41116
Follow Maybach circuit. SCH162207: Issue to track the power rail for the
Dell11/08/2007Docking35121X03Assign Pin 41 of the docking connector for NBDOCK_DC_IN_SS
SCH164795: Docking Pin Out Change to Support
Battery Slice
SCH164770: Change CAP/NUM/SCRL LEDs to +5V_ALWDell11/08/2007X03Change the 3x LED power rail to +5V_ALW instead of +5V_RUNLED42122
38126X03SCH164893: Remove U37 (SPI ROM on EC)Dell11/12/2007ECRemoved U37, R558, R589~R593, C672
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
Solution DescriptionRev.Page#T it le
X03
X03
X03
X03
X03
X03
X03
X03
X03
X03
X03
X03
X03
X03
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
2
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
5666Th u r s d ay, June 12, 2008
1
0.8
of
Request
Page 57
5
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Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
Owner
Dell11/12/2007CLOCK,USH6,36127X03Change R29 from 22 Ohm to 33 Ohm 5@ (ROW TPM PCI Clock)
SCH164896: PCI Clock BOM Options for ROW vs.
China TPM
Change R854 from 22 Ohm to 33 Ohm 4@ (China TPM PCI Clock)
Add R1016 (100k) pull-down 4@ on U32 pin M7
128
29,33,351. Add Q50, Q146, R1017~R1020
SCH164888: Add Intel LOM LDO for 2.65V/2.5VDell11/12/2007LOM,DockingX03
2. Remove R377, R380, Q46, C482,R377
129
SCH164889: Change L20-L27 from 36nH to 22nHDell11/12/2007LAN SW30X03Change MDI bus value at L20~ L27 from 36nH to 22nH.
These changes will help improving the IEEE Return Loss margins
130
Compal11/12/2007USB33X03
LAY164667: USB Switch Layout Changes following
Vendor's recommendation
Change Common mode choke connection to between switch and
connector.
13121DP11/13/2007 CompalTASK163764: Input derating data before PT gerber1. Applying voltage on ceramic capacitors: C772~ C775, C794, C1044
2. Applying current on inductor: L45, L46
3. Applying current on diode: D10
13238EC11/13/2007 DellSCH164928: Change Netnames Following Power
Circuit Changes
From "ACAV_IN_DOCK" to "ACAV_DOCK_SRC"
From "ACAV_IN_DOCK#" to "ACAV_DOCK_SRC#"
From "ACAV_IN_MB/DOCK" to"ACAV_IN"
Remove U59, C1012. Add U69, C1051.
CC
13337SIODell11/13/2007DF174483: [SSI2]The LCD/LED will keep had
power with USB device when unplug AC & Battery
1) Add 100k no pop pull-ups to +3.3V_ALW2 on:
- USB_SIDE_EN#
- ESATA_USB_PWR_EN#
- USB_POWERSHARE_PWR_EN#
2) No stuff R502, R923, R929.
13418400211/14/2007 DellSCH162823: Connect PWR_MON_GFX to VIN1 on the
EMC4002 - Depop the UL circuit
-Connect EMC4002 VCP2 to ISL88731 with a 4.7k series resistor
-Identify the values of R930 and R997
DellSIO37X03change R658 from a no stuff pull-up to a populated pull-downSCH165017: Change PU to PD on SYS_LED_MASK#11/14/2007135
13621DP11/14/2007 DellSCH165016: Add UMA DP contingency pop optionsAdd R1024, R1025, R1028~ R1033X03
34JSIM1 footprint changeMini-Card 11/20/2007 DellSIM card Footprint change per ME requestX04
146SPI11/22/2007 DellUnstuff 2nd SPI ROM for ICHDepop U13,R304,R305,R306,R308,R309,R295,C329X0424
147
35Docking11/26/2007 CompalSCH165307: Docking Conn ESD Concern - Dock
Remove D65 & change D64 fooptint from SOD323-2 to SOT23-3X04
Power pins
148SPI11/28/2007 DellSCH165504: Remove 2nd SPI ROM for ICHX0424
149Mini-Card3411/28/2007 CompalSCH165319: PCIE_MCARD1_DET# pull-up to wrong
AA
11/29/2007ECSCH165505: X04: Add pop options to change
Compal38150X04
power rail
INSTANT_ON_SW# from RTC to +3.3V_ALW Rail
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
Remove U13,R304,R305,R306,R307,R308,R309,R295,C329
No-stuff R439 and add 100K of R443 to pull-up +3.3V_ALW_ICHX04
Add 0ohm of R445,100K of R589. No-stuff R560,C1011,U57,D66, Pop
R1036
Solution DescriptionRev.Page#T it le
X03
X03
X03
X03-Disconnect PWR_MON_GFX from EMC4002 VCP2
X03SCH165024: Remove nostuff parts from Roush
X03
X03
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
2
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
5766Th u r s d ay, June 12, 2008
1
0.8
of
Request
Page 58
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
Owner
10DPDELLSCH165547: UMA DP reworkChange R181 to 4.02K,R672 to 976ohm151X0412/10/2007
15313SCH165564: Remove D1,R122 from Intel requestNo-stuff D1,R122 from Intel request11/29/2007 CompalMCHX04
CPU154No-stuff R63X04
Compal11/30/20077
SCH165378: No-stuff H_RESET# pull-up resistor
of R63
2111/30/2007
DPSCH165621: X04: Populate D10 with a 0 Ohm resistor155CompalD10 PCB Footprint can't stuff 0805 or 1210 resistor
directly, so add 1210 0ohm of R210 and no-stuff D10.
156DPIntelSCH165292: Follow Intel Proposal for DP
2112/2/2007
interoperability
1. Add Q147 pin1,4 contact to SDVO_CTRLCLK,SDVO_CTRLDATA and
pin6,3 to DPB_AUX_SW,DPB_AUX#_SW contact to DP SW,pin2,5 contact
to U70.4
2. Add U70,C314. U70 pin5 conatct to +3.3V_RUN and C314. pin2
contact to U8 pin4
3. Conatct DPB_AUX#_C to pull-up,DPB_AUX_C to pull-down
4. Add Q148 pin1,4 contact to DDPC_CTRLCLK,DDPC_CTRLDATA and
pin6,3 to DPC_AUX_DOCK,DPC_AUX#_DOCK contact to Docking,pin2,5
contact to U71.4
CC
5. Add U71,C329. U71 pin5 conatct to +3.3V_RUN and C329. pin2
contact to U8 pin4
6. Conatct DPC_AUX#_C to pull-up,DPC_AUX_C to pull-down
15736USH12/3/2007Broadcom SCH165660: SC_DET issue from Broadcom highlight
SCH165765: Audio Feedback: Change 2 resistor
Change R818,R827 to 1K_0402_1%15828Amplifier12/5/2007DELL
values, Add two resistors on IO board
15937,42Change net name from WIRELESS_ON/OFF# to WIRELESS_ON#/OFF
Wireless12/5/2007DELLSCH165763: Change Wireless net name (on is
toward the user)
16036USH12/6/20071.Depop R490,C591
Broadcom SCH165731: Follow Broadcom request to modify
Maybach schematic for USH
2.Pop R829 and depop R467
3.Depop R849
4.Change R476 to 5.1M ohm and R488 to 3.3M ohm
5.No-stuff C594
6.Change R473,R771 to 1K
7.Change C621,C706,C646 to X5R
BB
16112MCH12/6/2007Change R688 to 2.4K_0402_1%
IntelX04
SCH165516: Modify CRT_TVO_IREF(U2.pinE29),
LVDS_IBG(U2.pinC44) pull-down resistor value
SCH165882: Disable EMC4002 LDOSMSCEMC400218162
Add R211 and no-stuff R14912/7/2007X04
Pop R102412/7/2007X0418DPDELLSCH165881: Populate R1024 for UMA DP163
164
1812/7/2007X04CodecIntelSCH165764: Change HDA buffers to Cantiga to be
bi-directional
Change U67 to FXL2SD106BQX of uni-direction to bi-direction and
delete U66,C1048,C1049. Add R89
Add D67 between Q97 and Q9812/7/2007X04SCH165913: +5V_RUN backdrive issue on S3 modeCompal165LED42
166ECE5028CompalINSTANT_ON_SW double pull-upX0437
12/8/2007No-stuff R1035
12/8/2007Add pull-up resistor of R295 to +3.3V_ALW_ICH and no-stuff167LANIntel29SCH165970: Disable ICH GPIO12 of LAN_DISABLE to
control LAN PHY
10DP168Intel12/8/2007X04
SCH165950: Intel request for DP functionChange R180,R182,R183 to 4.02K
SCH165838: De-pop R1008 for control LAN PHY
De-pop R100816929DPCompal12/8/2007X04
enable form BIOS setting
Auido Codec27170X04Change C408~C411 to 2.2U_10V_0805 X5R12/10/2007 IDT
CardbusSCH165973: Follow Ricoh request to modify schematic
TTL12/13/2007 CompalSCH166138: About 74AHCT1G08GW AND Gate issue172
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
No-stuff R684,R790,R657
Change U68, U62, U69, U57, and U65 from 74AHCT1G08GW to
74AHC1G08GW
Solution DescriptionRev.Page#Titl e
X04
X04
X04
X04Add R914 pull-down contact to SC_DET on JSC1 pin2 and no-stuff
X04
X04
X04
X04
X04
DELL CONFIDENTIAL/PROPRIETARY
Title
Size Document NumberRev
2
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
1
5866T h u r s da y, June 12, 2008
0.8
of
Request
Page 59
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4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
173SCH165972: Follow IDT request to change C408~C411
DD
174385035
27Auido Codec 12/10/2007Change C408~C411 to 2.2U_10V_0805 X5RIDTX04
12/14/2007 DellTASK166116: Updated GPIO MapThe signal ACAV_DOCK_SRC# can be removed from the 5035 X04
Owner
to 2.2uF
17535Docking12/14/2007 DellSCH166112: Add a pull-up on DOCK_DET# to +3.3V_ALW Add R1038. R124 nostuff.X04
LED42X04Add Q150. R1039 nostuff.SCH166225: Add mask signal on NUM/SCRL/CAPS LEDsDell12/17/2007176
177
178
33, 38
USB,5035X04
12/18/2007
Updated
Dell12/17/2007PHY29
Add D68, D69, R1040. Del R927. C1042 change value to 1uF.SCH166229: Update Cell charger detect circuitDell
PHY enable form BIOS setting
179X04
6,8,10,24 CLOCK,CPU,
12/17/2007 DellSCH166180: Intel NOA test point complianceAdd R1041~R1045.
MCH, ICH
18033USB12/17/2007SCH166140: Add SATA repeater for ICH to ESATA
DellAdd U72, C488~C490, C1052, R305~R307.
trace over 5inch issue
18131RICOH1.Connect totally 10uF bulk capacitor(s) to 1.5VOUT pins.
SCH165973: Follow Ricoh request to modify schematicDell12/18/2007X04
2. Connect totally 10uF bulk capacitor(s) to AUXOUT pins.
3. Remove pull-up resistor from CPPE# signal.
4. Remove pull-up resistor from CPUSB# signal.
CC
5. SHDN#, apply NC/open
6. Remove pull-up resistor from SHDN#
7. Apply pull-down resistor to SPKROUT pin.
8. Add capacitors for CCD[2:1]#
9. Connect CADR22 to CPUSB# pin of ExpressCard Connector
10. Connect CDATA2 to PERST# pin of ExpressCard Connector
11. Add capacitor for FIL0, 0.01uF
35,385035,
Docking
18318,334002,eSATADell12/19/2007
12/18/2007 DellSCH166292: Add Dock changes for GPIO50 pin 41 of
the 5035
TASK166288: ESATA Redriver QuestionsX041. Using the Guardian LDO set to +1.8V for the VDD
Updated
Add R1046, C1053. 5035 GPIO50 connected to Docking pin 140.X04182
2. Changed power rail to +1.8V_RUN
3. Connected the enable to a pull-up to the same rail as VDD
4. Use PI2EQX3201B
5. No any 2nd source for this part
DellUSH36X04Add R104812/19/2007184
SCH166328: Add a series resistor on PLTRST3# for
the USH RESET_N
BB
18536SCH166327:Add a no stuff diode in parallel w/ R464DellUSHAdd D7012/19/2007X04
LED42X04Add C1058~C1061SCH166355: Add Bypass Capacitor for TTL gateCompal12/20/2007186
36USHSCH166388:Change USH Circuit per Broadcom Feedback 1.Change R476 to 5.1M ohms and R488 to 3.3M ohms to lower
35Add D71, R1068.SCH166399:Roush + Docking AC protect issue(crowbar)Dell12/20/2007DockingX04
SCH166397: DP Pop Options for UMA
19013MCH12/21/2007 CompalDebug +3.3V_RUN backdrive issue on S3 modeAdd R1076X04
19137SIO12/27/2007 DELLFor Power change Media Slice issue Add D65,R1078 and reserve R1081X04
19221DP12/27/2007 CompalFor DP & DVI can't work issueChange C271,C272,C273,C274 placement.Add R1060,R1061,R1064,R1065.
Reserve R1062,R1063,R1072,R1073,R1074,R1075
19321DP12/27/2007 CompalFor DP & DVI can't work issueChange C271,C272,C273,C274 placement.Add R1060,R1061,R1064,R1065.
Reserve R1062,R1063,R1072,R1073,R1074,R1075
19433ESATA12/27/2007 DELLSCH166445: ESATA feedback on 3201 pin 11 and pin 12 Reserve R1056,R1057,R1066,R1067,R1069,R1070X04
19536Broadcom12/27/2007 DELL
SCH166428: Add a No Stuff series resistor between
Reserve R1071X04
PLTRST3# and RST_N
Solution DescriptionRev.Page#Titl e
X04Pop R1008 because new BIOS fixed this softstrap issueSCH165838: De-pop R1008 for control LAN
X04
X04
X04
Request
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
1
5966T h u r s da y, June 12, 2008
0.8
of
Page 60
5
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Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
Owner
196AllAll01/23/2008CompalX05Update changes following PT2 MEMOUpdate changes following PT2 latest MEMO Rev.0.6
DD
19737SIODell01/23/2008SCH166607: UMA X04 - No Stuff R1081 No Stuff R1081
7CPU
R67->27 ohm,R64->39 ohm,R66->649 ohm,R65->150 ohm, R57->124 ohm 19801/23/2008DellSCH166740: X05 - Change ITP resistor valuesX05
19936SCH166962: Roush X05 - EA issue with USB to 5880 Dell01/23/2008USHChange R468 and R469 to 0 OhmsX05
20033USBSCH167262: X05 - Add 0 Ohm bypass resistors
Dell01/23/2008
Add R1082, R1083X05
on U54 for USB port 2
DF192207: Power LED current over specLED42201X05Change R1001 to 82 ohmCompal01/28/2008
DellUSH36202X0501/28/2008
SCH167383: ROW TPM Disable Pop OptionsMake D70, and R841 = 5@ (pop for USH TPM)
Make R483 = 4@ (for China config)
DellEMC4002X0501/29/200818203
Change R152 from 0 Ohm to 0.82 OhmSCH167478: Change R152 from 0 Ohm to 0.82 Ohm for
EMC4002 LDO Input
6204
Change L1 to BK2125HS601-TSCH167489: L1 Part Derating ProblemDellClockX0502/12/2008
Update
205
R849 must be pop-ed to support USH low power SCH167486: Smartcard Circuit UpdateCompal01/30/2008USHX0536
No stuff R1068.SCH167590: Docking Detection Circuit Update Compal01/31/2008Docking35206
Stuff R1058SCH167851: X05 - Pop R1058 for ESATA EADell02/12/2008eSATA33
CC
208Add R1088 (no stuff)SCH167660: BOM option for Intel debugDell02/12/2008MCH10
209
210
212X05Add R1089, R1090 resistors around C410 and C411.
CODEC02/13/2008CompalSCH168055: PC BEEP Circuit UpdateNostuff R328. Change R327 and R828 to 499K27
No pop R1033, R1031, R1072, R1074. Populate R278, R1024SCH168270: More DP changes for UMADell02/19/2008DP21
No stuff C255,C256 C257,C390,C518,C996.
222X0503/04/2008DP21DellSCH168809: Add pull down to prevent floating input Add R1098. No stuff R185, R187
223X05X0534Mini-Card 03/07/2008DellSCH169083: Pop R840 for WIMAX LED support post RTS Populate R840.
Change R849=1.5k, and R913=300 OhmSCH169129: Smart Card InsertionDell03/10/2008X05USH36
2. Change C390, C518 and C996 from 22pF to 10pF
3. Short L8, L9 and L10 (Replaced by R1095~R1097).
Solution DescriptionRev.Page#Titl e
X05
X05
X05207
X05
X05
X05
X05211DP02/19/200821DellSCH168269: Correction to meet DP specChange R996 to 1 M ohm
X05
X05CODEC
X05
X05217Add:L70, C1066, C1067, C1068, C1069
X05
X05219SCH168546: SMSC ST Feedback for 4002/5028/5035SMSC03/04/20084002,5028,
X05
X0522403/07/200833USBDellSCH169019: Pop R1082 & R1083 to bypass USB buffer Populate R1082 & R1083. No stuff U54.
X05
X05
Request
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
1
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3
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ItemIssue DescriptionDate
DD
Owner
2. Add SN74CBTD3306CPWR switches (U75~U78) to DDC lines.
3. Change R996 to 1 M ohm
4. Add a 1 M (R1098) pull down on U9 pin 39. Depop R185 and R187
5. Replace F1 with GEC 1206L150-C PTC.
6. Add a 10 uF cap (C1075) from +VDISPLAY_VCC to ground.
Dell03/10/2008Add R1103~R1113ITP7228
229Add 75 Ohm termination resistors on TV DACDell03/11/2008TV12Add R1104~R1116
230X056,23,24,
SD card03/12/2008RicohSCH169273: Resolve SD_CLK under shoot issue
below from Ricoh request
RFID03/12/2008Broadcom SCH169256: Need to make changes to RFID schematic
Change JSATA1 Footprint to TYCO_2-1759838-8_13P_RV-T, JCBUS1
to MOLEX_48315-0012_68P_RT-T.Delete H8,JLAT2,JLAT3
Add C491 close to JSD1 pin831
connections
238
36DAI03/13/2008ADI1. U15 pin12 to GND and remove C396
2. Change C1066, C1067, C1068 and C1069 to 1nF
3. Change C408 and C409 to 1uf.
4. Change C410 and C411 to 0.22uF
5. Change R340 and R342, R1091 and R1092 to 200 Ohm
6. Change R1089 and R1090 to 10M.
23935Docking03/13/2008CompalDF193241: <ESD> Enhance ESD: Air discharge to
Add C672,C1076 close to JDOCK1 pin39,40
jack screw cause system hang-up
24027Auido03/13/2008CompalEMI team find had noise at 2MHzReserve C676 on DMIC_CLK signal
24124,37SPI ROM03/14/2008DELLSCH169380: GPIO for Write Protect (WP#) for
SPI Flash
BB
24236SPI ROM03/14/2008CompalU34 component z-high interfere ME defineChange package from SO8 to VFQFPN8
2446Clock03/18/2008DellCLK_PCI_DOCK is shared with CLK_PCI_PCM. It
1.Add 2nd SPI ROM schematic
2.Add serial resistor and contact SPI_WP#_SEL signal from
U35.23 to U12.3,U13.3
Add R1117 no stuffSCH169447: 24.576MHz (X3) Crystal Circuit Update Compal03/17/2008CARDBUS31243
CLK_PCI_PCM change net from pin32 to pin33 of U1
does not follow the Roush PIG, and causes risk
for docking scenarios. (Roush gating list)
12,35DP03/20/2008Dell245Improve DP trace routingRemove D22,D23,D24,D25. Add C77 close to R105X05
SCH169971: Add 0ohm between double inverter for
DAI function
36Change ESD Diode package247RFID04/01/2008CompalX06Change from BAS40-04_SOT23-3 to DA204U_SOT323-3
24837SCH170088: ICH LOM errata updateSIO04/03/2008DELLX061.PBAT_PRES# contact to U35 pin 97
2.LAN_DISABLE#_R contact to U35 pin88.
3.Add D38,C677 and no-stuff.R1008 change to 4.3K and no-stuff.
249SCH170091: Add series 0603 zero ohm on
DPB_DOCK_HPD and DPC_DOCK_HPD_R.
Solution DescriptionRev.Page#Titl e
X05227SCH168711:Modify circuit to comply to DP 1.1a specDell03/10/2008DP211. Depop R1033, R1031, R1032, R1030. Pop R278.
X05SCH168709: Issue to track ITP
X05
X05
X05
X0523223Crystal03/12/2008CompalME add new z-high limit cause 32.768Khz material
X0526,32
X05
X05Follow DELL request to modify
X05
X05
X05
X05
X05
X05
X05
X0635Docking04/03/2008DELLAdd R387
X0725036USH04/23/2008CompalAdd 3.3V_RUN discharge circuit for backdriveStuff R625, Q79.
Request
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
1
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Page 62
5
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Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
252
04/23/2008ICH24X07
Owner
SCH170773: No Stuff 2nd SPI ROM (U13)DellDepop U13, R304, R380, C395, R308, R309, R384, R1060,
Update
26040SCH171795: Power Step on +3.3V_ALW_ICH railCompal05/23/2008Power C688 change value to 3300pFX07
261
262X07
CC
USH36C639 and C643 have to use X5R. L71,L72 change to 2%.SCH172075: RFID ImplementationCompal
06/04/2008
Update
SCH172103: No Stuff ITP clock resistors for X07 Dell05/29/20086X07No stuff R18, R21.Clock
SCH170341: Sawtooth waveform on SERIRQ IssueCompal06/02/2008ICH24X07
Add R1126263
SCH172191: Breath Power LED Resistor ChangeCompal06/02/2008LED42Change value from 82 to 100 ohm (R1001)264X07
265
Dell06/03/2008SIO37X07266
Connect ODD_DET# to GPIO41 5035.34, ICH9.AE19, JSATA1.8SCH172185: Connect ODD_DET# to GPIO41 5035.34Dell06/03/2008EC38X07
R504 change to 4.7K. Add PC266 (1500pF)SCH170391 (SLICE_BAT_PRES#)
L70 change value to 47UH_LBMF1608T470M_20%27AUDIO06/03/2008CompalTASK169849: Regress Audio HP and Microphone test
Solution DescriptionRev.Page#Titl e
X07251BID change to X07Compal04/23/2008SIO37Depop R535, Populate R530
X07
X07258
X07267
Request
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
1
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Page 63
5
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Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
1X02
48Charger08/31SahaACAV_IN_NB will pull high
Title
Owner
Change PR145, PIN2 connection from +SDC_IN to +DC_IN
when DOCK adapter insert.
48/50Charger
2
Selector
08/31SahaACAV_IN_DOCK# won't pull high
when battery only mode.
Change ACAV_IN_DOCK# pull high to +3.3V_ALW2
Add inverter for ACAV_IN_DOCK
PQ27 enable change to ACAV_IN_DOCK
Confirm HW delete U58 and R124 pull up to +RTC_CELL
343+DC_INDFX team suggest change
09/28Saha
GND to PIN1 and PIN2
4PWRSnubber10/22DELL request add a snubber circuit
Guangyong
DELL
on every regulator
PJPDC1 PIN1/PIN2 is -DCIN_JACK, PIN3 is DCIN_CBL_DET#
PIN4 NB_PSID, PIN5/PIN6 is +DCIN_JACK
543+DC_INAdd PR251 0_0402_5% before NB_AC_OFF for delay switch10/22Guangyong
CC
DELL
649ADP320910/22Guangyong
DELL
Add a resistor around AC power
soft-start fet
Follow Maybach setting
PL19 change from 0.56uH_MPC1040LR56 to 0.88uH_MPC1040LR88C
PR239 change from 27K_0603_1% to 56K_0603_1%
PR231 change from 80.6K_0402_1% to 100K_0402_1%
743+DC_IN11/2CompalDCIN_CBL_DET# damage ECE5028Add ESD diedo PD13 DA204U_SOT323 at DCIN_CBL_DET#
Series PR67 1K_0402_5% between PJPDC1, PIN1 and DCIN_CBL_DET#
Parallel 0.47uF_0402_6.3V on DCIN_CBL_DET#
848Charger11/2CompalNB DC blocking MOSFET won't turn off
when Dock AC insert.
Add PQ44 RHU002N06 control NB DC blocking MOSFET.
Control singal is NB_AC_OFF
Series PR284 200K_0402_1% between PQ44, PIN1 and NB_AC_OFF
Add PD30 B540C parallel PQ34
Solution DescriptionRev.Page#
X02
X03
X03
X03
X03
X03
X03
Request
BB
509
Compal11/2Selector
PBATT DC blocking MOSFET won't turn off
when Docking AC insert.
It will cause Battery or adapter protect.
Add PD18 RB715F_SOT323, PD20 and PD19 RB751V_SOD323, PR329 100K_0402_5%
PR328 and PR327 47K_0402_5%, PR326 and PR325 240K_0402_5%
PQ40 2N7002DW-7-F_SOT363-6, PQ59 NTG6161PT1G_TSOP6
X03
Extra net name add +NBDOCK_DC_IN_SS from Docking connector
1043+DC_IN11/2Merle
DELL
Roush component and rework changes
for Dcoking test
PC5 change form 0.47uF_0805_25V to 0.1uF_0805_25V
PR16 change form 240K_0402_5% to 1M_0402_5%
PR21 change form 47K_0402_1% to 220K_0402_5%
X03
PR22 change form 47K_0402_1% to 22K_0402_5%
PR283 change form 0_0402_1% to 100K_0402_5%
1143+DC_IN11/8CompalBattery slice need detect
NB battery is insert or not.
1249SelectorNB_AC_OFF_BJT can't turn off
11/8Compal
when Dock adapter exist
AA
1348Charger11/8Charger of ISL88731 will turn off
Add PQ61 NTR4502PT1G, and PD32 RB751_SOD323
Connect to DOCK_SMB_ALERT# and SLICE_BAT_PRES#
NB_AC_OFF_BJT control by NB_AC_OFF
Add LM393 to replace ISL88731 ACOK function(PU11B)X03Compal
X03
X03Change PQ39 to PQ61A/B (2N7002DW-7-F),
When ACIN is no power
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Changed-List History 1
Size Document NumberRev
Custom
Date:Sheet
LA-3801P
6366T h u r s da y, June 12, 2008
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3
2
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ItemIssue DescriptionDate
DD
14X03
16Charger
48Charger11/09Merle
43No pop PD13, PR67 and PC254.
48
50
48X03Merle
Title
Selector
Owner
Dell
11/09+DC_INX0315
Kyle
DELL
11/12X03Merle
DELL
11/12Charger17Remove PR337, Change PR145 from +DC_IN to +SDC_IN.
DELL
through the DOCK_DCIN_IS+ and -
No pop PD13, PR67 and PC254.
Reduce mass build risk
A global signal name change
for all notebooks
Add pull up resistor at PU11.7.to +3.3V_ALW
Change signal name at Node PR157.1
from "ACAV_IN_NB" to "ACAV_IN"
+PWR_SRC exist on Docking connector
Add PQ62 NTGD4161PT1G series DOCK_DCIN_IS+ and Add PQ63 RHU002N06 to control PQ62 on/off
From "ACAV_IN_DOCK" to "ACAV_DOCK_SRC"
From "ACAV_IN_DOCK#" to "ACAV_DOCK_SRC#"
Pop PR145 and PR156, change PR157 net name from ACAV_IN_NB to ACAV_IN.
Add PR341 100K_0402 pull up +3.3V_ALW at PU11B output.
Show PR156 as a stuff.
184811/15ChargerEE
DELL
CC
1943X03NB and Dock adapter swap issue+DC_IN11/22Merle
DELL
2048Charger11/30Greg
SCH165050: Validate EMC4002 VIN1/VCP1/VCP2
Depop UL circuit.X03
for UMA & Discrete for PT1 SMT
PR21 change to 1M_0402_5%
PC5 change to 0.022uF_0805_50V
Comparator Circuit for E-DockX04PC256 change from 100pF to 0.1uF
DELL
2150Selector11/30Merle
DELL
2249ADP3209
NB_CORE
12/05Guangyong
DELL
PBATT back drive to Battery Slice
vias charger high side MOSFET
Modify ADP3209 schematic
Follow ADI suggestion
Use PBATT_OFF control PQ64 to switch PQ65
Remove PR222
Reserve PC258 and PC259 10uF_0805_6.3V
Populate PR224
Change PR239 form 56K_0603_1% to 75K_0603_1%
Change PR238 form 140K_0402_1% to 165K_0402_1%
Change PC219 form 2200p_0402_50V to 1800p_0402_50V
BB
2312/05Doug
DELL
PJPDC1 change to 7pin connectorX0443+DC_INPJPDC1 change to MOLEX_87437-0763_7P-T
Change PC67 to 0_0402_5% and populate
Solution DescriptionRev.Page#
X04Add PQ65 between PBATT+ and +VCHGR
X04
Request
244312/07AJ
P-MOS Vgs too highX04+DC_INPQ61 change to FDN338P_NL
Add PD33 BAT54CW_SOT323, +DOCK_PWR_BAR/+DC_IN_SS
Reserve PR356 0_0402_5% form +SDC_IN to PU10 PIN22
X04
Add PR354 10_0402_1% to CSSP, PR355 10_0402_1% to CSON
Add PC260 0.1U_0603_25V to CSSN, PC261 0.1U_0603_25V to CSOP
PC143 and PC166 change to 0.1U_0402_10V
PR161 change to 100_040_5%
265012/10AJ
PBATT_OFF connect to DOCK_AC_OFFX04SelectorAdd PD34 RB751V-40
Compal
AA
274712/19Saha
INTEL CPA line need adjust+VCOREPR131 change to 9.76K_0402_1%X04
Compal
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Changed-List History 1
Size Document NumberRev
Custom
Date:Sheet
LA-3801P
6466T h u r s da y, June 12, 2008
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Page 65
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Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
2850Selector12/20Merle
2948Charger12/21Merle
Owner
DELL
Hot dock issue, adapter crowberAdd PR357 330K_0402 form +DOCK_PWR_BAR to GND.
Add PQ66 RHU002N06 parallel PQ43, series PR358 0_0402 to EN_DOCK_PWR_BAR#
Charger Isense MOSFET timing changePC142 change to 0.047u_0603_25VX04
DELL
3050Selector12/26AJ
Compal
3148Charger1/25Guangyong
DELL
3247+VCORE1/25Guangyong
Charger for Battery Slice
Change PQ63 to 2N7002DW
Add PR360 0_0402_5% between PQ63 and SLICE_BAT_PRES
Change ACAV_IN_NB pull high voltage Add PR362 100K_0402_5% form PU11B out pull high to ISL88731_VREF
De-pop PR341
Change VCORE OCSETChange PR117 form 11.5K to 12.7K_0402_1%X05
DELL
3350Selector2/12Merle
CC
DELL
3448Charger2/25Power
Compal
3547/48CPU_CORE
Charger
3/6EMI
Compal
36All power3/6WWAN
Compal
3750Seletor
3/6Power
Fix BITS CR196131 and CR196130
Change Charger sunbber resistor size
form 0805 to 1206.
To solve CPU_CORE and Charger BB noiseAdd Bead PL21 on PJP33, Pop PL12X05
Change all power rail snubber resistor
form 0805 to 1206 size.
Fix Battery slice discharge issueChange PR260 from 240K to 620K, PR261 from 47K to 33
Compal
Add PR363 1K_1206 and PC262 1U_0603_25V from +NBDOCK_DC_IN_SS to ground
Add PD35 RB751S40T1_SOD523-2 from NB_AC_OFF# to ACAV_IN_NB
Change PR281 from 4.7_0805 to 4.7_1206X05
Change all power rail snubber resistor
form 0805 to 1206 size.
PQ55 from IMD2AT to 2N7002DW
Add PR364 390K, PR365 390K, PD36 RB751S40T1, PC263 1U_0603.
Solution DescriptionRev.Page#Titl e
X04
X04
X05
X05
X05
X05
Request
3847CPU_CORE3/7EMI
BB
PWR
3/17All PWR39
Compal
Compal
To solve CPU_CORE and Charger BB noiseAdd PC264 680p_0402 and PC265 470p_0402 at PL12 +PWR_SRCX05
Pop +3.3V, +5V, +1.05V, +1.5V, +1.8V, VGFX_CORE snubber
X05Plastic palmrest logic up BB noise solutionEMI
R=2.2_1206 C=1000pF_0603
Pop VGH snubber
R=4.7_1206 C=1000pF_0603
Change +3.3V, +1.05V, VGH and VCORE boot resistor
PR37=2.2_0603 PR62=2.2_0603 PR155=2.2_0603
PR87, PR98, PR121 change to 2.2_0603
Pop PC155=3300pF and PC154=220pF
49Change PR239 from 75K_0603 to 68.1K_060340ADP32093/17Intel
VGFX DC load line slope change to -7.5mOhm X05
Compal
AA
4148Charger
5/9
Elick
Compal
populate ADAPT_OC function(90W setting)
Pop PR167,PR166,PR171,PR172,PC168,PC169,PC170,PC171,PC172,PR164,PR168
,PC167,PR165,PQ33
un-pop PR170
X07
DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Changed-List History 1
Size Document NumberRev
Custom
Date:Sheet
LA-3801P
6566T h u r s da y, June 12, 2008
1
of
0.8
Page 66
5
4
Version Change List ( P. I. R. List )
3
2
1
ItemIssue DescriptionDate
DD
CC
4248Charger5/21
4347V-CORE5/21
44DC-IN436/3
4550Selector6/5
4648Charger6/5
4748Charger6/5
Owner
Merle
DELL
Elick
Compal
Elick
Compal
Elick
Compal
Elick
Compal
Elick
Compal
Reduce delay time between NB adapter removal
and ACAV_IN_NB de-assert from 1.6mS to~400uS.
Add 33K as a reservation on pin2 of 8791 (CPU
driver all 3 phases) for Maxim V_CORE solution.
Glitch issue on SLICE_BAT_PRES#
Reserve a pull high resistor between +3.3V_ALW2
and SLICE_BAT_PRES#
Un-pop ADAPT_OC function.
Reserve a 0402 size capcitor between NB_AC_OFF#
to GND
change PC256 from .1uF to 100pF.
change PR175 from 100K to 24K.
Add un-pop PR366(33K 0402) between pin2 of PU6 and GND.
Add un-pop PR367(33K 0402) between pin2 of PU8 and GND.
Add un-pop PR368(33K 0402) between pin2 of PU9 and GND.
Add PC266:SE074152K8L(S CER CAP 1500P 50V +-10% X7R 0402)
between pin2 of PQ61 and GND.
Add un-pop PR369:SD02847018L(S RES 1/16W 4.7K +-5% 0402)
between +3.3V_ALW2 and PQ40B.5.
un-Pop PR167,PR166,PR171,PR172,PC168,PC169,PC170,PC171,
PC172,PR164,PR168,PC167,PR165,PQ33
populate PR170:SD02810018L(S RES 1/16W 1K +-5% 0402)
Add un-pop PC267 0402 size between PQ35.2 to GND.
Solution DescriptionRev.Page#Titl e
X07
X07
X07
X07
X07
X07
Request
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DELL CONFIDENTIAL/PROPRIETARY
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
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Title
Size Document NumberRev
Date:Sheet
Compal Electronics, Inc.
Changed-List History
LA-3801P
1
6666T h u r s da y, June 12, 2008
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